Device Characterization MATERIALS and DEVICE CHARACTERIZATION: • Reverse engineering at fully equipped US research laboratories. Advanced techniques such as laser scanning, X-ray examination of complex assemblies…etc. are at your service. • Material and product analysis, failure analysis and characterization at fully equipped USA research laboratories. • Technical consulting MAJOR TECHNIQUES: ATOMIC FORCE MICROSCOPY (AFM): It is one of the most advanced techniques. As the name implies it can detect atomic scale features on a surface. CONVENTIONAL PROFILOMETER: This technique is more suitable, faster and easier for scanning surfaces at lower resolution compared to atomic force microscope. Surface quality and profile can be analyzed in detail. Most analysis does require only reasonable resolution, not atomic. Using this technique we can detect fine scratches, damage on surfaces that you cannot determine with bare eye or microscope. Furthermore, one can get quantitative information such as scratch debth and width....etc. SCANNING ELECTRON MICROSCOPY (SEM), TRANSMISSION ELECTRON MICROSCOPY (TEM): Transmission electron microscopy (TEM),Using Transmission Electron Microscopy (TEM) we can analyze complex structures such as multilayer thin films in detail. We can detect root causes of device failures and can do many more useful things for you. Multilayer thin films are used in many advanced microchips and chip level devices. Transmission Electron Microscopy images and other advanced techniques reveal the details of these devices. OPTICAL INTERFEROMETRY: For analyzing surface quality wedge & curvature…etc. It is mainly used to analyze optical components. POLARIMETER: Used mainly for determining accurate substrate thickness AUTOCOLLIMATOR: For determining optical beam deviation. SPECTROPHOTOMETER: For accurate determination of refractive index, transmission…etc. STRESS ANALYZER: For analyzing stresses in thin films, coatings. Since stress can alter device performance and lead to premature failure of devices, coatings, it is important to analyze it quantitatively to determine what temperature levels the coatings can withstand. MICROSCRATCH TESTER: Used primarily to determine quantitatively how coatings perform under gradually increased load conditions. A specially designed electronically controlled tip scratches the surface with gradually increasing force. Delaminations from the surface are detected acoustically and microscopically. At the end, one can determine at what force the coating starts to delaminate. Using different coatings and running the test under the same conditions can make it possible to compare different coatings side by side for their scratch resistance. FOURIER TRANSFORM INFRARED SPECTROSCOPY (FTIR): This technique is used widely in criminal laboratories as well as in the industry to detect small amounts of conatmination and chemical species on surfaces. Surface quality and structure is critical for coating performance as well as for other performance. THERMOGRAVIMETRIC ANALYSIS (TGA): THERMOMECHANICAL ANALYSIS (TMA) LEAK TESTING: Leak testing and others are at your service.We can sputter layers from your multilayer structure layer by layer and analyze the chemical composition in detail using TOF-SIMS technique. We can perform failure analysis, reverse engineering and much more. • ACCELERATED TESTING and ENVIRONMENTAL TESTING for compliance to standards (such as Telcordia standards for telecom devices). Accelerated testing is like creating an atmosphere and environmental conditions with the degradation effects similar to 10-30 years. Instead of waiting 30 years to see how your devices or materials are effected by temperature and humidity changes, we can simulate the effects within days or weeks by placing a number of samples into an environmental chamber. These chambers can be programmed for desired heat and humidity cycles. Simply put, temperature and humidity levels can go up and down as desired, many many times until the test is complete. Once the test is finalized, one takes the devices and materials out and analyzes them to see how they perform and what changes occured. There are numerous other highly technical services we can offer you. Having a world class technical team with members from industry and academia, we have an enormously wide knowledge pool and experience. We can hook you up either by phone,teleconferencing or MSN messenger to our right expert team members, so you can communicate directly to an expert, ask questions and discuss your project. If needed we will also come and visit you. If you are mostly interested in our engineering and research & development capabilities, then we invite you to visit our website http://www.ags-engineering.com |

