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AGS-TECH Inc Past Present Mission - We specialize in Manufacturing, Fabrication, Assembly of Products, Custom Manufacturing of Components, Parts, Subassemblies. Misi Manufaktur Kita Dulu & Saiki Kita diadegake kanthi jeneng AGS-Group ing taun 1979 minangka perusahaan manufaktur produk industri lan pasokan konstruksi. Ing taun 2002, klompok teknologi maju dadi AGS-TECH Inc. nggambarake misi ing bidang teknologi lan fokus ing proses manufaktur lan fabrikasi sing luwih akeh. We tetep dhéwé ing ngarep teknologi ing wilayah Manufaktur adat saka cetakan lan mati, plastik lan karet bagean ngecor, CNC mesin saka logam lan alloy bagean, mesin saka plastik, metal forging lan casting, Keramik technical & kaca mbentuk lan mbentuk, stamping lan fabrikasi lembaran logam, produksi unsur mesin, komponen elektronik lan rakitan, fabrikasi lan perakitan komponen optik, nanomanufacturing, micromanufacturing, mesomanufacturing, manufaktur nonkonvensional, industri komputer & peralatan otomatisasi, alat lan peralatan tes industri lan metrologi, teknik lan layanan teknis sing canggih. Bentenane saka perusahaan teknik lan manufaktur liyane yaiku kita bisa nyedhiyakake macem-macem komponen, subassemblies, rakitan lan produk rampung kabeh saka siji sumber, yaiku AGS-TECH Inc. Ora ana perusahaan liyane sing bisa nyedhiyakake sampeyan. macem-macem spektrum layanan teknik lan kapabilitas manufaktur. Perusahaan kita tergabung ing negara bagian New Mexico-USA. Klompok perusahaan AGS duwe turnover taunan ing sawetara yuta dolar. Klompok teknologi canggih AGS-TECH minangka bagean saka klompok sing luwih gedhe iki lan isih terus berkembang saben taun. Anggota tim teknis kita duwe pirang-pirang paten ing bidang keahliane, akeh sing duwe puluhan publikasi ing jurnal sing diakoni sacara internasional lan dadi penemu kanthi gelar lulusan saka universitas paling dhuwur ing Donya. Saben dina tim kita mriksa cetak biru sing diwenehake pelanggan, lembar spesifikasi lan Bill of Materials, ijol-ijolan informasi karo pelanggan, nganakake rapat-rapat teknik lan konsultasi, menehi pendapat ahli marang klien, ngowahi lan nambah cetak biru lan desain pelanggan, lan kadhangkala nggawe sing anyar. desain saka ngeruk. Sawise nemtokake proses paling ekonomi, paling cocok lan paling cepet kanggo proyek tartamtu, penawaran resmi utawa proposal diwenehi kanggo saben pelanggan. Sawise persetujuan bebarengan saka loro-lorone, lan yen proyek wis siyap kanggo dijupuk menyang tingkat sabanjuré ing siklus Manufaktur, salah siji utawa sawetara saka tanduran kita diutus kanggo Manufaktur produk. Kabeh pabrik iku salah siji saka ISO9001: 2000, QS9000, TS16949, ISO13485 utawa AS9100 sistem manajemen kualitas certified lan Pabrik produk tundhuk karo standar industri Eropah lan Amerika kayata ASTM, ISO, DIN, IEEE, MIL. Yen perlu utawa dibutuhake, produk kasebut disertifikasi lan ditempelake tandha UL lan/utawa CE, utawa yen kanggo aplikasi medis, padha diiringi sertifikasi FDA. Kita duwe sawetara pabrik manufaktur iki lan duwe sebagian kepemilikan ing sawetara liyane. Kanthi sawetara pabrik lan perusahaan manufaktur khusus, kita duwe kemitraan utawa usaha patungan. Kita uga terus-terusan ngawasi global kanggo tuku saham utawa partner karo pabrik manufaktur anyar yen padha ketemu pangarepan kita. Iki minangka siklus sing ora ana pungkasan sing ndadekake kita nambah lan tuwuh saben dina. Sadawane taun, kita wis nglayani akeh pelanggan. Kanggo ndeleng apa sawetara wong mikir babagan AGS-TECH, monggo klik ing link iki. PAGE sadurunge

Micromanufacturing, Nanomanufacturing, Mesomanufacturing - Electronic & Magnetic Optical & Coatings, Thin Film, Nanotubes, MEMS, Microscale Fabrication Manufaktur Nanoscale & Microscale & Mesoscale Waca liyane Our NANOMANUFACTURING, MICROMANUFACTURING and MESOMANUFACTURING processes can be categorized as: Surface Treatments and Modification Functional Coatings / Decorative Coatings / Thin Film / Thick Film Nanoscale Manufacturing / Nanomanufacturing Microscale Manufacturing / Micromanufacturing / Micromachining Mesoscale Manufacturing / Mesomanufacturing Microelectronics & Semiconductor Manufacturing and Fabrication Microfluidic Devices Manufacturing Micro-Optics Manufacturing Micro Assembly and Packaging Soft Lithography In every smart product designed today, one can consider an element that will increase efficiency, versatility, reduce power consumption, reduce waste, increase lifetime of the product and thus be environmentally friendly. For this purpose, AGS-TECH is focusing on a number of processes and products that can be incorporated into devices and equipment to achieve these goals. For example low-friction FUNCTIONAL COATINGS can reduce power consumption. Some other functional coating examples are scratch resistant coatings, anti-wetting SURFACE TREATMENTS and coatings (hydrophobic), wetness promoting (hydrophilic) surface treatment and coatings, anti-fungal coatings, diamond like carbon coatings for cutting and scribing tools, THIN FILMelectronic coatings, thin film magnetic coatings, multilayer optical coatings. In NANOMANUFACTURING or NANOSCALE MANUFACTURING, we produce parts at nanometer length scales. In practice it refers to manufacturing operations below micrometer scale. Nanomanufacturing is still in its infancy when compared to micromanufacturing, however the trend is in that direction and nanomanufacturing is definitely very important for the near future. Some applications of nanomanufacturing today are carbon nanotubes as reinforcing fibers for composite materials in bicycle frames, baseball bats and tennis racquets. Carbon nanotubes, depending on the orientation of the graphite in the nanotube, can act as semiconductors or conductors. Carbon nanotubes have very high current-carrying capability, 1000 times higher than silver or copper. Another application of nanomanufacturing is nanophase ceramics. By using nanoparticles in producing ceramic materials, we can simultaneously increase both the strength and ductility of the ceramic. Please click on the submenu for more information. MICROSCALE MANUFACTURING or MICROMANUFACTURING refers to our manufacturing and fabrication processes on a microscopic scale not visible to the naked eye. The terms micromanufacturing, microelectronics, microelectromechanical systems are not limited to such small length scales, but instead, suggest a material and manufacturing strategy. In our micromanufacturing operations some popular techniques we use are lithography, wet and dry etching, thin film coating. A wide variety of sensors & actuators, probes, magnetic hard-drive heads, microelectronic chips, MEMS devices such as accelerometers and pressure sensors among others are manufactured using such micromanufacturing methods. You will find more detailed information on these in the submenus. MESOSCALE MANUFACTURING or MESOMANUFACTURING refers to our processes for fabrication of miniature devices such as hearing aids, medical stents, medical valves, mechanical watches and extremely small motors. Mesoscale manufacturing overlaps both macro and micromanufacturing. Miniature lathes, with 1.5 Watt motor and dimensions of 32 x 25 x 30.5 mm and weights of 100 grams have been fabricated using mesoscale manufacturing methods. Using such lathes, brass has been machined to a diameter as small as 60 microns and surface roughnesses in the order of a micron or two. Other such miniature machine tools such as milling machines and presses have also been manufactured using mesomanufacturing. In MICROELECTRONICS MANUFACTURING we use the same techniques as in micromanufacturing. Our most popular substrates are silicon, and others like gallium arsenide, Indium Phosphide and Germanium are also used. Films/coatings of many types and especially conducting and insulating thin film coatings are used in the fabrication of microelectronic devices and circuits. These devices are usually obtained from multilayers. Insulating layers are generally obtained by oxidation such as SiO2. Dopants (both p and n) type are common and parts of the devices are doped in order to alter their electronic properties and obtain p and n type regions. Using lithography such as ultraviolet, deep or extreme ultraviolet photolithography, or X-ray, electron beam lithography we transfer geometric patterns defining the devices from a photomask/mask to the substrate surfaces. These lithography processes are applied several times in the micromanufacturing of microelectronic chips in order to achieve the required structures in the design. Also etching processes are carried out by which entire films or particular sections of films or substrate are removed. Briefly, by using various deposition, etching and multiple lithographic steps we obtain the multilayer structures on the supporting semiconductor substrates. After the wafers are processed and many circuits are microfabricated on them, the repetitive parts are cut and individual dies are obtained. Each die is thereafter wire bonded, packaged and tested and becomes a commercial microelectronic product. Some more details of microelectronics manufacturing can be found in our submenu, however the subject is very extensive and therefore we encourgae you to contact us in case you need product specific information or more details. Our MICROFLUIDICS MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In microfluidics we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. We have the capability to design microfluidic devices for you and offer microfluidics prototyping & micromanufacturing custom tailored for your applications. Another promising field in microfabrication is MICRO-OPTICS MANUFACTURING. Micro-optics allows the manipulation of light and the management of photons with micron and sub-micron scale structures and components. Micro-optics allows us to interface the macroscopic world we live in with the microscopic world of opto- and nano-electronic data processing. Micro-optical components and subsystems find widespread applications in the following fields: Information technology: In micro-displays, micro-projectors, optical data storage, micro-cameras, scanners, printers, copiers…etc. Biomedicine: Minimally-invasive/point of care diagnostics, treatment monitoring, micro-imaging sensors, retinal implants. Lighting: Systems based on LEDs and other efficient light sources Safety and Security Systems: Infrared night vision systems for automotive applications, optical fingerprint sensors, retinal scanners. Optical Communication & Telecommunication: In photonic switches, passive fiber optic components, optical amplifiers, mainframe and personal computer interconnect systems Smart structures: In optical fiber-based sensing systems and much more As the most diverse engineering integration provider we pride ourselves with our capability to provide a solution for almost any consulting, engineering, reverse engineering, rapid prototyping, product development, manufacturing, fabrication and assembly needs. After micromanufacturing our components, very often we need to continue with MICRO ASSEMBLY & PACKAGING. This involves processes such as die attachment, wire bonding, connectorization, hermetic sealing of packages, probing, testing of packaged products for environmental reliability…etc. After micromanufacturing devices on a die, we attach the die to a more rugged foundation to ensure reliability. Frequently we use special epoxy cements or eutectic alloys to bond the die to its package. After the chip or die is bonded to its substrate, we connect it electrically to the package leads using wire bonding. One method is to use very thin gold wires from the package leads to bonding pads located around the perimeter of the die. Lastly we need to do the final packaging of the connected circuit. Depending on the application and operating environment, a variety of standard and custom manufactured packages are available for micromanufactured electronic, electro-optic, and microelectromechanical devices. Another micromanufacturing technique we use is SOFT LITHOGRAPHY, a term used for a number of processes for pattern transfer. A master mold is needed in all cases and is microfabricated using standard lithography methods. Using the master mold, we produce an elastomeric pattern / stamp. One variation of soft lithography is “microcontact printing”. The elastomer stamp is coated with an ink and pressed against a surface. The pattern peaks contact the surface and a thin layer of about 1 monolayer of the ink is transfered. This thin film monolayer acts as the mask for selective wet etching. A second variation is “microtransfer molding”, in which the recesses of the elastomer mold are filled with liquid polymer precursor and pushed against a surface. Once the polymer cures, we peel off the mold, leaving behind the desired pattern. Lastly a third variation is “micromolding in capillaries”, where the elastomer stamp pattern consists of channels that use capillary forces to wick a liquid polymer into the stamp from its side. Basically, a small amount of the liquid polymer is placed adjacent to the capillary channels and the capillary forces pull the liquid into the channels. Excess liquid polymer is removed and polymer inside the channels is allowed to cure. The stamp mold is peeled off and the product is ready. You can find more details about our soft lithography micromanufacturing techniques by clicking on the related submenu on the side of this page. If you are mostly interested in our engineering and research & development capabilities instead of manufacturing capabilities, then we invite you to also visit our engineering website http://www.ags-engineering.com Waca liyane Waca liyane Waca liyane Waca liyane Read More Waca liyane Waca liyane Waca liyane Waca liyane KLIK Product Finder-Locator Service PAGE sadurunge

Electrochemical Machining and Grinding - ECM - Reverse Electroplating - Custom Machining - AGS-TECH Inc. - NM - USA ECM Machining, Electrochemical Machining, Grinding Some of the valuable NON-CONVENTIONAL MANUFACTURING processes AGS-TECH Inc offers are ELECTROCHEMICAL MACHINING (ECM), SHAPED-TUBE ELECTROLYTIC MACHINING (STEM), PULSED ELECTROCHEMICAL MACHINING (PECM), ELECTROCHEMICAL GRINDING (ECG), HYBRID MACHINING PROCESSES. ELECTROCHEMICAL MACHINING (ECM) is a non-conventional manufacturing technique where metal is removed by an electrochemical process. ECM is typically a mass production technique, used for machining extremely hard materials and materials that are difficult to machine using the conventional manufacturing methods. Electrochemical-machining systems we use for production are numerically controlled machining centers with high production rates, flexibility, perfect control of dimensional tolerances. Electrochemical machining is capable of cutting small and odd-shaped angles, intricate contours or cavities in hard and exotic metals like titanium aluminides, Inconel, Waspaloy, and high nickel, cobalt, and rhenium alloys. Both external and internal geometries can be machined. Modifications of the electrochemical machining process are used for operations like turning, facing, slotting, trepanning, profiling where the electrode becomes the cutting tool. The metal removal rate is only a function of ion exchange rate and is not affected by the strength, hardness or toughness of the workpiece. Unfortunately the method of electrochemical machining (ECM) is limited to electrically conductive materials. Another important point to consider deploying the ECM technique is to compare the mechanical properties of the produced parts with those produced by other machining methods. ECM removes material instead of adding it and therefore is sometimes referred to as ''reverse electroplating''. It resembles in some ways to electrical discharge machining (EDM) in that a high current is passed between an electrode and the part, through an electrolytic material removal process having a negatively charged electrode (cathode), a conductive fluid (electrolyte), and a conductive workpiece (anode). The electrolyte acts as the current carrier and is a highly conductive inorganic salt solution like sodium chloride mixed and dissolved in water or sodium nitrate. The advantage of ECM is that there is no tool wear. The ECM cutting tool is guided along the desired path close to the work but without touching the piece. Unlike EDM, however, no sparks are created. High metal removal rates and mirror surface finishes are possible with ECM, with no thermal or mechanical stresses being transferred to the part. ECM does not cause any thermal damage to the part and since there are no tool forces there is no distortion to the part and no tool wear, as would be the case with typical machining operations. In electrochemical machining cavity produced is the female mating image of the tool. In the ECM process, a cathode tool is moved into an anode workpiece. The shaped tool is generally made of copper, brass, bronze or stainless steel. The pressurized electrolyte is pumped at a high rate at a set temperature through the passages in the tool to the area being cut. The feed rate is the same as the rate of ''liquification'' of the material, and the electrolyte movement in the tool-workpiece gap washes metal ions away from the workpiece anode before they have a chance to plate onto the cathode tool. The gap between the tool and the workpiece varies between 80-800 micrometers and the DC power supply in the range 5 – 25 V maintains current densities between 1.5 – 8 A/mm2 of active machined surface. As electrons cross the gap, material from the workpiece is dissolved, as the tool forms the desired shape in the workpiece. The electrolytic fluid carries away the metal hydroxide formed during this process. Commercial electrochemical machines with current capacities between 5A and 40,000A are available. The material removal rate in electrochemical machining can be expressed as: MRR = C x I x n Here MRR=mm3/min, I=current in amperes, n=current efficiency, C=a material constant in mm3/A-min. The constant C depends on valence for pure materials. The higher the valence, the lower is its value. For most metals it is in between 1 and 2. If Ao denotes the uniform cross-sectional area being electrochemically machined in mm2, the feed rate f in mm/min can be expressed as: F = MRR / Ao Feed rate f is the speed the electrode is penetrating the workpiece. In the past there were problems of poor dimensional accuracy and environmentally polluting waste from electrochemical machining operations. These have largely been overcome. Some of the applications of electrochemical machining of high-strength materials are: - Die-Sinking operations. Die-sinking is machining forging – die cavities. - Drilling a jet engine turbine blades, jet-engine parts and nozzles. - Multiple small holes drilling. The electrochemical machining process leaves a burr-free surface. - Steam turbine blades can be machined within close limits. - For deburring of surfaces. In deburring, ECM removes metal projections left from the machining processes and so dulls sharp edges. Electrochemical machining process is fast and often more convenient than the conventional methods of deburring by hand or non-traditional machining processes. SHAPED-TUBE ELECTROLYTIC MACHINING (STEM) is a version of electrochemical machining process we use for drilling small diameter deep holes. A titanium tube is used as the tool which is coated with an electrically insulating resin to prevent the removal of material from other regions like the lateral faces of the hole and tube. We can drill hole sizes of 0.5 mm with depth-to-diameter ratios of 300:1 PULSED ELECTROCHEMICAL MACHINING (PECM): We use very high pulsed current densities in the order of 100 A/cm2. By using pulsed currents we eliminate the need for high electrolyte flow rates which poses limitations for the ECM method in mold and die fabrication. Pulsed electrochemical machining improves fatigue life and eliminates the recast layer left by the electrical discharge machining (EDM) technique on mold and die surfaces. In ELECTROCHEMICAL GRINDING (ECG) we combine the conventional grinding operation with electrochemical machining. The grinding wheel is a rotating cathode with abrasive particles of diamond or aluminum oxide that are metal bonded. The current densities range between 1 and 3 A/mm2. Similar to ECM, an electrolyte such as sodium nitrate flows and the metal removal in electrochemical grinding is dominated by the electrolytic action. Less than 5% of metal removal is by abrasive action of the wheel. The ECG technique is well suited for carbides and high-strength alloys, but not so much of a fit for die-sinking or mould making because the grinder may not easily access deep cavities. The material removal rate in electrochemical grinding can be expressed as: MRR = G I / d F Here MRR is in mm3/min, G is mass in grams, I is current in amperes, d is density in g/mm3 and F is Faraday’s constant (96,485 Coulombs/mole). The speed of penetration of the grinding wheel into workpiece can be expressed as: Vs = (G / d F) x (E / g Kp) x K Here Vs is in mm3/min, E is cell voltage in volts, g is wheel to workpiece gap in mm, Kp is coefficient of loss and K is electrolyte conductivity. The advantage of the electrochemical grinding method over conventional grinding is less wheel wear because less than 5% of the metal removal is by abrasive action of the wheel. There are similarities between EDM and ECM: 1. The tool and workpiece are separated by a very small gap without a contact in between them. 2. Both tool and material must be conductors of electricity. 3. Both techniques need high capital investment. Modern CNC machines are used 4. Both methods consume lots of electric power. 5. A conductive fluid is used as a medium between the tool and the work piece for ECM and a dielectric fluid for EDM. 6. The tool is fed continuously towards the workpiece to maintain a constant gap between them (EDM may incorporate intermittent or cyclic, typically partial, tool withdrawal). HYBRID MACHINING PROCESSES: We frequently take advantage of the benefits of hybrid machining processes where two or more different processes such as ECM, EDM….etc. are used in combination. This gives us the opportunity to overcome the shortcomings of one process by the other, and benefit from the advantages of each process. KLIK Product Finder-Locator Service PREVIOUS PAGE

Computer Chassis - Racks - Shelves - 19 inch Rack - 23 inch Rack - Computer and Instrument Case Manufacturing - AGS-TECH Inc. - New Mexico - USA Sasis, Rak, Gunung kanggo Komputer Industri We offer you the most durable and reliable INDUSTRIAL COMPUTER CHASSIS, RACKS, MOUNTS, RACK MOUNT INSTRUMENTS and RACK MOUNTED SYSTEMS, SUBRACK, SHELF, 19 INCH & 23 INCH RACKS, FULL SİZE and HALF RACKS, OPEN and CLOSED RACK, MOUNTING HARDWARE, STRUCTURAL AND SUPPORT COMPONENTS, RAILS and SLIDES, TWO andFOUR POST RACKS that meet international and industry standards. Besides our off-the-shelf products, we are capable to build you any specially tailored chassis, racks and mounts. Some of the brand names we have in stock are BELKIN, HEWLETT PACKARD, KENDALL HOWARD, GREAT LAKES, APC, RITTAL, LIEBERT, RALOY, SHARK RACK, UPSITE TECHNOLOGIES. Here are brochures and catalogs of some industrial computer chassis, racks. Simply click on the respective blue text to download them: - Catalog for Vandal-Proof IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals - DFI-ITOX brand Industrial Chassis - 01 Series Instrument Case System-I from AGS-Electronics - 05 Series Instrument Case System-V from AGS-Electronics - 06 Series Plug-in Chassis from AGS-Electronics To choose a suitable Industrial Grade Chassis, Rack or Mount please go to our industrial computer store by CLICKING HERE. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Here is some key terminology that should be useful for reference purposes: A RACK UNIT or U (less commonly referred to as RU) is a unit of measure used to describe the height of equipment intended for mounting into a 19-inch rack or a 23-inch rack (The 19-inch or 23-inch dimension refers to the width of the equipment mounting frame in the rack i.e. the width of the equipment that can be mounted inside the rack). One rack unit is 1.75 inches (44.45 mm) high. The size of a piece of rack-mounted equipment is frequently described as a number in ''U''. For example, one rack unit is often referred to as ''1U'', 2 rack units as ''2U'' and so on. A typical full size rack is 44U, which means it holds just over 6 feet of equipment. In computing and information technology, however, half-rack typically describes a unit that is 1U high and half the depth of a 4-post rack (such as a network switch, router, KVM switch, or server), such that two units can be mounted in 1U of space (one mounted at the front of the rack and one at the rear). When used to describe the rack enclosure itself, the term half-rack typically means a rack enclosure that is 24U tall. A front panel or filler panel in a rack is not an exact multiple of 1.75 inches (44.45 mm). To allow space between adjacent rack-mounted components, a panel is 1⁄32 inch (0.031 inch or 0.79 mm) less in height than the full number of rack units would imply. Thus, a 1U front panel would be 1.719 inches (43.66 mm) high. A 19-inch rack is a standardized frame or enclosure for mounting multiple equipment modules. Each module has a front panel that is 19 inches (482.6 mm) wide, including edges or ears that protrude on each side which allow the module to be fastened to the rack frame with screws. Equipment designed to be placed in a rack is typically described as rack-mount, rack-mount instrument, a rack mounted system, a rack mount chassis, subrack, rack mountable, or occasionally simply shelf. A 23-inch rack is used for housing telephone (primarily), computer, audio and other equipment though is less common than the 19-inch rack. The size notes the width of the faceplate for the installed equipment. The rack unit is a measure of vertical spacing and is common to both the 19 and 23-inch (580 mm) racks. Hole spacing is either on 1-inch (25 mm) centres (Western Electric standard), or the same as for 19-inch (480 mm) racks (0.625 inches / 15.9 millimetres spacing). KLIK Product Finder-Locator Service PAGE sadurunge

Electronic Testers - Electrical Test Equipment - Electrical Properties Testing - Oscilloscope - Signal Generator - Function Generator - Pulse Generator - Frequency Synthesizer - Multimeter Alat Uji Listrik & Elektronik With the term ELECTRONIC TESTER we refer to test equipment that is used primarily for testing, inspection and analysis of electrical and electronic components and systems. We offer the most popular ones in the industry: POWER SUPPLIES & SIGNAL GENERATING DEVICES: POWER SUPPLY, SIGNAL GENERATOR, FREQUENCY SYNTHESIZER, FUNCTION GENERATOR, DIGITAL PATTERN GENERATOR, PULSE GENERATOR, SIGNAL INJECTOR METERS: DIGITAL MULTIMETERS, LCR METER, EMF METER, CAPACITANCE METER, BRIDGE INSTRUMENT, CLAMP METER, GAUSSMETER / TESLAMETER/ MAGNETOMETER, GROUND RESISTANCE METER ANALYZERS: OSCILLOSCOPES, LOGIC ANALYZER, SPECTRUM ANALYZER, PROTOCOL ANALYZER, VECTOR SIGNAL ANALYZER, TIME-DOMAIN REFLECTOMETER, SEMICONDUCTOR CURVE TRACER, NETWORK ANALYZER, PHASE ROTATION TESTER, FREQUENCY COUNTER You can purchase brand new, refurbished or used test equipment from us at the most competitive discounted prices. Simply choose the product from the downloadable catalogs and let us know the product name, product code and relevant information and we will send you our quote. Download by clicking on highlighted text: ANRITSU Electronic Measuring Instruments FLUKE Test Tools Catalog KEYSIGHT Basic Automotive Test Products KEYSIGHT Basic Instruments KEYSIGHT Bench and Power Products KEYSIGHT Network Analyzer Products KEYSIGHT Signal Generation Solutions KEYSIGHT Smart Bench Essentials Series Products KEYSIGHT High-Volume Traffic Generator Products KEYSIGHT Layer 4-7 Network Test Products KEYSIGHT Layer 2-3 Network Test Products KEYSIGHT Distribution Products Catalog MEGGER Low Voltage Test Tools Catalog MICROWAVE Flexible Cable Assembly MICROWAVE and MILIMETER WAVE Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Private Label Hand Tools for Every Industry (This catalog contains a few electrical & electronic test instruments. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers.) ROHDE SCHWARZ Benchtop Power Supplies Ideal for labs and system racks, galvanic isolation, floating channels, constant voltage or current modes, protection functions, parallel and serial operation, low ripple/noise, remote sensing option ROHDE SCHWARZ Test Equipment Catalog (Oscilloscopes, Power Supplies, Signal Generators, Handheld Analyzers, Spectrum Analyzers, Vector Network Analyzers, Meters & Counters) TEKTRONIX Product Catalog for Test and Measurement Solutions VANDAL-PROOF IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com Let us briefly go over some of these equipment in everyday use throughout the industry: The electrical power supplies we supply for metrology purposes are discrete, benchtop and stand-alone devices. The ADJUSTABLE REGULATED ELECTRICAL POWER SUPPLIES are some of the most popular ones, because their output values can be adjusted and their output voltage or current is maintained constant even if there are variations in input voltage or load current. ISOLATED POWER SUPPLIES have power outputs that are electrically independent of their power inputs. Depending on their power conversion method, there are LINEAR and SWITCHING POWER SUPPLIES. The linear power supplies process the input power directly with all their active power conversion components working in the linear regions, whereas the switching power supplies have components working predominantly in non-linear modes (such as transistors) and convert power to AC or DC pulses before processing. Switching power supplies are generally more efficient than linear supplies because they lose less power due to shorter times their components spend in the linear operating regions. Depending on application, a DC or AC power is used. Other popular devices are PROGRAMMABLE POWER SUPPLIES, where voltage, current or frequency can be remotely controlled through an analog input or digital interface such as an RS232 or GPIB. Many of them have an integral microcomputer to monitor and control the operations. Such instruments are essential for automated testing purposes. Some electronic power supplies use current limiting instead of cutting off power when overloaded. Electronic limiting is commonly used on lab bench type instruments. SIGNAL GENERATORS are another widely used instruments in lab and industry, generating repeating or non-repeating analog or digital signals. Alternatively they are also called FUNCTION GENERATORS, DIGITAL PATTERN GENERATORS or FREQUENCY GENERATORS. Function generators generate simple repetitive waveforms such as sine waves, step pulses, square & triangular and arbitrary waveforms. With Arbitrary waveform generators the user can generate arbitrary waveforms, within published limits of frequency range, accuracy, and output level. Unlike function generators, which are limited to a simple set of waveforms, an arbitrary waveform generator allows the user to specify a source waveform in a variety of different ways. RF and MICROWAVE SIGNAL GENERATORS are used for testing components, receivers and systems in applications such as cellular communications, WiFi, GPS, broadcasting, satellite communications and radars. RF signal generators generally work between a few kHz to 6 GHz, while microwave signal generators operate within a much wider frequency range, from less than 1 MHz to at least 20 GHz and even up to hundreds of GHz ranges using special hardware. RF and microwave signal generators can be classified further as analog or vector signal generators. AUDIO-FREQUENCY SIGNAL GENERATORS generate signals in the audio-frequency range and above. They have electronic lab applications checking of the frequency response of audio equipment. VECTOR SIGNAL GENERATORS, sometimes also referred to as DIGITAL SIGNAL GENERATORS are capable of generating digitally-modulated radio signals. Vector signal generators can generate signals based on industry standards such as GSM, W-CDMA (UMTS) and Wi-Fi (IEEE 802.11). LOGIC SIGNAL GENERATORS are also called DIGITAL PATTERN GENERATOR. These generators produce logic types of signals, that is logic 1s and 0s in the form of conventional voltage levels. Logic signal generators are used as stimulus sources for functional validation & testing of digital integrated circuits and embedded systems. The devices mentioned above are for general-purpose use. There are however many other signal generators designed for custom specific applications. A SIGNAL INJECTOR is a very useful and quick troubleshooting tool for signal tracing in a circuit. Technicians can determine the faulty stage of a device such as a radio receiver very quickly. The signal injector can be applied to the speaker output, and if the signal is audible one can move to the preceding stage of the circuit. In this case an audio amplifier, and if the injected signal is heard again one can move the signal injection up the stages of the circuit until the signal is no longer audible. This will serve the purpose of locating the location of the problem. A MULTIMETER is an electronic measuring instrument combining several measurement functions in one unit. Generally, multimeters measure voltage, current, and resistance. Both digital and analog version are available. We offer portable hand-held multimeter units as well as laboratory-grade models with certified calibration. Modern multimeters can measure many parameters such as: Voltage (both AC / DC), in volts, Current (both AC / DC), in amperes, Resistance in ohms. Additionally, some multimeters measure: Capacitance in farads, Conductance in siemens, Decibels, Duty cycle as a percentage, Frequency in hertz, Inductance in henries, Temperature in degrees Celsius or Fahrenheit, using a temperature test probe. Some multimeters also include: Continuity tester; sounds when a circuit conducts, Diodes (measuring forward drop of diode junctions), Transistors (measuring current gain and other parameters), battery checking function, light level measuring function, acidity & Alkalinity (pH) measuring function and relative humidity measuring function. Modern multimeters are often digital. Modern digital multimeters often have an embedded computer to make them very powerful tools in metrology and testing. They include features such as:: •Auto-ranging, which selects the correct range for the quantity under test so that the most significant digits are shown. •Auto-polarity for direct-current readings, shows if the applied voltage is positive or negative. •Sample and hold, which will latch the most recent reading for examination after the instrument is removed from the circuit under test. •Current-limited tests for voltage drop across semiconductor junctions. Even though not a replacement for a transistor tester, this feature of digital multimeters facilitates testing diodes and transistors. •A bar graph representation of the quantity under test for better visualization of fast changes in measured values. •A low-bandwidth oscilloscope. •Automotive circuit testers with tests for automotive timing and dwell signals. •Data acquisition feature to record maximum and minimum readings over a given period, and to take a number of samples at fixed intervals. •A combined LCR meter. Some multimeters can be interfaced with computers, while some can store measurements and upload them to a computer. Yet another very useful tool, an LCR METER is a metrology instrument for measuring the inductance (L), capacitance (C), and resistance (R) of a component. The impedance is measured internally and converted for display to the corresponding capacitance or inductance value. Readings will be reasonably accurate if the capacitor or inductor under test does not have a significant resistive component of impedance. Advanced LCR meters measure true inductance and capacitance, and also the equivalent series resistance of capacitors and the Q factor of inductive components. The device under test is subjected to an AC voltage source and the meter measures the voltage across and the current through the tested device. From the ratio of voltage to current the meter can determine the impedance. The phase angle between the voltage and current is also measured in some instruments. In combination with the impedance, the equivalent capacitance or inductance, and resistance, of the device tested can be calculated and displayed. LCR meters have selectable test frequencies of 100 Hz, 120 Hz, 1 kHz, 10 kHz, and 100 kHz. Benchtop LCR meters typically have selectable test frequencies of more than 100 kHz. They often include possibilities to superimpose a DC voltage or current on the AC measuring signal. While some meters offer the possibility to externally supply these DC voltages or currents other devices supply them internally. An EMF METER is a test & metrology instrument for measuring electromagnetic fields (EMF). Majority of them measure the electromagnetic radiation flux density (DC fields) or the change in an electromagnetic field over time (AC fields). There are single axis and tri-axis instrument versions. Single axis meters cost less than tri-axis meters, but take longer to complete a test because the meter only measures one dimension of the field. Single axis EMF meters have to be tilted and turned on all three axes to complete a measurement. On the other hand, tri-axis meters measure all three axes simultaneously, but are more expensive. An EMF meter can measure AC electromagnetic fields, which emanate from sources such as electrical wiring, while GAUSSMETERS / TESLAMETERS or MAGNETOMETERS measure DC fields emitted from sources where direct current is present. The majority of EMF meters are calibrated to measure 50 and 60 Hz alternating fields corresponding to the frequency of US and European mains electricity. There are other meters which can measure fields alternating at as low as 20 Hz. EMF measurements can be broadband across a wide range of frequencies or frequency selective monitoring only the frequency range of interest. A CAPACITANCE METER is a test equipment used to measure capacitance of mostly discrete capacitors. Some meters display the capacitance only, whereas others also display leakage, equivalent series resistance, and inductance. Higher end test instruments use techniques such as inserting the capacitor-under-test into a bridge circuit. By varying the values of the other legs in the bridge so as to bring the bridge into balance, the value of the unknown capacitor is determined. This method ensures greater precision. The bridge may also be capable to measure series resistance and inductance. Capacitors over a range from picofarads to farads may be measured. Bridge circuits do not measure leakage current, but a DC bias voltage can be applied and the leakage measured directly. Many BRIDGE INSTRUMENTS can be connected to computers and data exchange be made to download readings or to control the bridge externally. Such bridge instruments aso offer go / no go testing for automation of tests in a fast paced production & quality control environment. Yet, another test instrument, a CLAMP METER is an electrical tester combining a voltmeter with a clamp type current meter. Most modern versions of clamp meters are digital. Modern clamp meters have most of the basic functions of a Digital Multimeter, but with the added feature of a current transformer built into the product. When you clamp the instrument’s “jaws” around a conductor carrying a large ac current, that current is coupled through the jaws, similar to the iron core of a power transformer, and into a secondary winding which is connected across the shunt of the meter’s input, the principle of operation resembling much that of a transformer. A much smaller current is delivered to the meter’s input due to the ratio of the number of secondary windings to the number of primary windings wrapped around the core. The primary is represented by the one conductor around which the jaws are clamped. If the secondary has 1000 windings, then the secondary current is 1/1000 the current flowing in the primary, or in this case the conductor being measured. Thus, 1 amp of current in the conductor being measured would produce 0.001 amps of current at the input of the meter. With clamp meters much larger currents can be easily measured by increasing the number of turns in the secondary winding. As with most of our test equipment, advanced clamp meters offer logging capability. GROUND RESISTANCE TESTERS are used for testing the earth electrodes and the soil resistivity. The instrument requirements depend on the range of applications. Modern clamp-on ground testing instruments simplify ground loop testing and enable non-intrusive leakage current measurements. Among the ANALYZERS we sell are OSCILLOSCOPES without doubt one of the most widely used equipment. An oscilloscope, also called an OSCILLOGRAPH, is a type of electronic test instrument that allows observation of constantly varying signal voltages as a two-dimensional plot of one or more signals as a function of time. Non-electrical signals like sound and vibration can also be converted to voltages and displayed on oscilloscopes. Oscilloscopes are used to observe the change of an electrical signal over time, the voltage and time describe a shape which is continuously graphed against a calibrated scale. Observation and analysis of the waveform reveals us properties such as amplitude, frequency, time interval, rise time, and distortion. Oscilloscopes can be adjusted so that repetitive signals can be observed as a continuous shape on the screen. Many oscilloscopes have storage function that allows single events to be captured by the instrument and displayed for a relatively long time. This allows us to observe events too fast to be directly perceptible. Modern oscilloscopes are lightweight, compact and portable instruments. There are also miniature battery-powered instruments for field service applications. Laboratory grade oscilloscopes are generally bench-top devices. There is a vast variety of probes and input cables for use with oscilloscopes. Please contact us in case you need advice about which one to use in your application. Oscilloscopes with two vertical inputs are called dual-trace oscilloscopes. Using a single-beam CRT, they multiplex the inputs, usually switching between them fast enough to display two traces apparently at once. There are also oscilloscopes with more traces; four inputs are common among these. Some multi-trace oscilloscopes use the external trigger input as an optional vertical input, and some have third and fourth channels with only minimal controls. Modern oscilloscopes have several inputs for voltages, and thus can be used to plot one varying voltage versus another. This is used for example for graphing I-V curves (current versus voltage characteristics) for components such as diodes. For high frequencies and with fast digital signals the bandwidth of the vertical amplifiers and sampling rate must be high enough. For-general purpose use a bandwidth of at least 100 MHz is usually sufficient. A much lower bandwidth is sufficient for audio-frequency applications only. Useful range of sweeping is from one second to 100 nanoseconds, with appropriate triggering and sweep delay. A well-designed, stable, trigger circuit is required for a steady display. The quality of the trigger circuit is key for good oscilloscopes. Another key selection criteria is the sample memory depth and sample rate. Basic level modern DSOs now have 1MB or more of sample memory per channel. Often this sample memory is shared between channels, and can sometimes only be fully available at lower sample rates. At the highest sample rates the memory may be limited to a few 10's of KB. Any modern ''real-time'' sample rate DSO will have typically 5-10 times the input bandwidth in sample rate. So a 100 MHz bandwidth DSO would have 500 Ms/s - 1 Gs/s sample rate. Greatly increased sample rates have largely eliminated the display of incorrect signals that was sometimes present in the first generation of digital scopes. Most modern oscilloscopes provide one or more external interfaces or buses such as GPIB, Ethernet, serial port, and USB to allow remote instrument control by external software. Here is a list of different oscilloscope types: CATHODE RAY OSCILLOSCOPE DUAL-BEAM OSCILLOSCOPE ANALOG STORAGE OSCILLOSCOPE DIGITAL OSCILLOSCOPES MIXED-SIGNAL OSCILLOSCOPES HANDHELD OSCILLOSCOPES PC-BASED OSCILLOSCOPES A LOGIC ANALYZER is an instrument that captures and displays multiple signals from a digital system or digital circuit. A logic analyzer may convert the captured data into timing diagrams, protocol decodes, state machine traces, assembly language. Logic Analyzers have advanced triggering capabilities, and are useful when the user needs to see the timing relationships between many signals in a digital system. MODULAR LOGIC ANALYZERS consist of both a chassis or mainframe and logic analyzer modules. The chassis or mainframe contains the display, controls, control computer, and multiple slots into which the data-capturing hardware is installed. Each module has a specific number of channels, and multiple modules can be combined to obtain a very high channel count. The ability to combine multiple modules to obtain a high channel count and the generally higher performance of modular logic analyzers makes them more expensive. For the very high end modular logic analyzers, the users may need to provide their own host PC or purchase an embedded controller compatible with the system. PORTABLE LOGIC ANALYZERS integrate everything into a single package, with options installed at the factory. They generally have lower performance than modular ones, but are economical metrology tools for general purpose debugging. In PC-BASED LOGIC ANALYZERS, the hardware connects to a computer through a USB or Ethernet connection and relays the captured signals to the software on the computer. These devices are generally much smaller and less expensive because they make use of a personal computer’s existing keyboard, display and CPU. Logic analyzers can be triggered on a complicated sequence of digital events, then capture large amounts of digital data from the systems under test. Today specialized connectors are in use. The evolution of logic analyzer probes has led to a common footprint that multiple vendors support, which provides added freedom to end users: Connectorless technology offered as several vendor-specific trade names such as Compression Probing; Soft Touch; D-Max is being used. These probes provide a durable, reliable mechanical and electrical connection between the probe and the circuit board. A SPECTRUM ANALYZER measures the magnitude of an input signal versus frequency within the full frequency range of the instrument. The primary use is to measure the power of the spectrum of signals. There are optical and acoustical spectrum analyzers as well, but here we will discuss only electronic analyzers that measure and analyze electrical input signals. The spectra obtained from electrical signals provides us information about frequency, power, harmonics, bandwidth…etc. The frequency is displayed on the horizonal axis and the signal amplitude on the vertical. Spectrum analyzers are widely used in the electronics industry for the analyses of the frequency spectrum of radio frequency, RF and audio signals. Looking at the spectrum of a signal we are able to reveal elements of the signal, and the performance of the circuit producing them. Spectrum analyzers are able to make a large variety of measurements. Looking at the methods used to obtain the spectrum of a signal we can categorize the spectrum analyzer types. - A SWEPT-TUNED SPECTRUM ANALYZER uses a superheterodyne receiver to down-convert a portion of the input signal spectrum (using a voltage-controlled oscillator and a mixer) to the center frequency of a band-pass filter. With a superheterodyne architecture, the voltage-controlled oscillator is swept through a range of frequencies, taking advantage of the full frequency range of the instrument. Swept-tuned spectrum analyzers are descended from radio receivers. Therefore swept-tuned analyzers are either tuned-filter analyzers (analogous to a TRF radio) or superheterodyne analyzers. In fact, in their simplest form, you could think of a swept-tuned spectrum analyzer as a frequency-selective voltmeter with a frequency range that is tuned (swept) automatically. It is essentially a frequency-selective, peak-responding voltmeter calibrated to display the rms value of a sine wave. The spectrum analyzer can show the individual frequency components that make up a complex signal. However it does not provide phase information, only magnitude information. Modern swept-tuned analyzers (superheterodyne analyzers, in particular) are precision devices that can make a wide variety of measurements. However, they are primarily used to measure steady-state, or repetitive, signals because they can't evaluate all frequencies in a given span simultaneously. The ability to evaluate all frequencies simultaneously is possible with only the real-time analyzers. - REAL-TIME SPECTRUM ANALYZERS: A FFT SPECTRUM ANALYZER computes the discrete Fourier transform (DFT), a mathematical process that transforms a waveform into the components of its frequency spectrum, of the input signal. The Fourier or FFT spectrum analyzer is another real-time spectrum analyzer implementation. The Fourier analyzer uses digital signal processing to sample the input signal and convert it to the frequency domain. This conversion is done using the Fast Fourier Transform (FFT). The FFT is an implementation of the Discrete Fourier Transform, the math algorithm used for transforming data from the time domain to the frequency domain. Another type of real-time spectrum analyzers, namely the PARALLEL FILTER ANALYZERS combine several bandpass filters, each with a different bandpass frequency. Each filter remains connected to the input at all times. After an initial settling time, the parallel-filter analyzer can instantaneously detect and display all signals within the analyzer's measurement range. Therefore, the parallel-filter analyzer provides real-time signal analysis. Parallel-filter analyzer is fast, it measures transient and time-variant signals. However, the frequency resolution of a parallel-filter analyzer is much lower than most swept-tuned analyzers, because the resolution is determined by the width of the bandpass filters. To get fine resolution over a large frequency range, you would need many many individual filters, making it costly and complex. This is why most parallel-filter analyzers, except the simplest ones in the market are expensive. - VECTOR SIGNAL ANALYSIS (VSA) : In the past, swept-tuned and superheterodyne spectrum analyzers covered wide frequency ranges from audio, thru microwave, to millimeter frequencies. In addition, digital signal processing (DSP) intensive fast Fourier transform (FFT) analyzers provided high-resolution spectrum and network analysis, but were limited to low frequencies due to the limits of analog-to-digital conversion and signal processing technologies. Today's wide-bandwidth, vector-modulated, time-varying signals benefit greatly from the capabilities of FFT analysis and other DSP techniques. Vector signal analyzers combine superheterodyne technology with high speed ADC's and other DSP technologies to offer fast high-resolution spectrum measurements, demodulation, and advanced time-domain analysis. The VSA is especially useful for characterizing complex signals such as burst, transient, or modulated signals used in communications, video, broadcast, sonar and ultrasound imaging applications. According to form factors, spectrum analyzers are grouped as benchtop, portable, handheld and networked. Benchtop models are useful for applications where the spectrum analyzer can be plugged into AC power,such as in a lab environment or manufacturing area. Bench top spectrum analyzers generally offer better performance and specifications than the portable or handheld versions. However they are generally heavier and have several fans for cooling. Some BENCHTOP SPECTRUM ANALYZERS offer optional battery packs, allowing them to be used away from a mains outlet. Those are referred to as a PORTABLE SPECTRUM ANALYZERS. Portable models are useful for applications where the spectrum analyzer needs to be taken outside to make measurements or carried while in use. A good portable spectrum analyzer is expected to offer optional battery-powered operation to allow the user to work in places without power outlets, a clearly viewable display to allow the screen to be read in bright sunlight, darkness or dusty conditions, light weight. HANDHELD SPECTRUM ANALYZERS are useful for applications where the spectrum analyzer needs to be very light and small. Handheld analyzers offer a limited capability as compared to larger systems. Advantages of handheld spectrum analyzers are however their very low power consumption, battery-powered operation while in the field to allow the user to move freely outside, very small size & light weight. Finally, NETWORKED SPECTRUM ANALYZERS do not include a display and they are designed to enable a new class of geographically-distributed spectrum monitoring and analysis applications. The key attribute is the ability to connect the analyzer to a network and monitor such devices across a network. While many spectrum analyzers have an Ethernet port for control, they typically lack efficient data transfer mechanisms and are too bulky and/or expensive to be deployed in such a distributed manner. The distributed nature of such devices enable geo-location of transmitters, spectrum monitoring for dynamic spectrum access and many other such applications. These devices are able to synchronize data captures across a network of analyzers and enable Network-efficient data transfer for a low cost. A PROTOCOL ANALYZER is a tool incorporating hardware and/or software used to capture and analyze signals and data traffic over a communication channel. Protocol analyzers are mostly used for measuring performance and troubleshooting. They connect to the network to calculate key performance indicators to monitor the network and speed-up troubleshooting activities. A NETWORK PROTOCOL ANALYZER is a vital part of a network administrator's toolkit. Network protocol analysis is used to monitor the health of network communications. To find out why a network device is functioning in a certain way, administrators use a protocol analyzer to sniff the traffic and expose the data and protocols that pass along the wire. Network protocol analyzers are used to - Troubleshoot hard-to-solve problems - Detect and identify malicious software / malware. Work with an Intrusion Detection System or a honeypot. - Gather information, such as baseline traffic patterns and network-utilization metrics - Identify unused protocols so that you can remove them from the network - Generate traffic for penetration testing - Eavesdrop on traffic (e.g., locate unauthorized Instant Messaging traffic or wireless Access Points) A TIME-DOMAIN REFLECTOMETER (TDR) is an instrument that uses time-domain reflectometry to characterize and locate faults in metallic cables such as twisted pair wires and coaxial cables, connectors, printed circuit boards,….etc. Time-Domain Reflectometers measure reflections along a conductor. In order to measure them, the TDR transmits an incident signal onto the conductor and looks at its reflections. If the conductor is of a uniform impedance and is properly terminated, then there will be no reflections and the remaining incident signal will be absorbed at the far end by the termination. However, if there is an impedance variation somewhere, then some of the incident signal will be reflected back to the source. The reflections will have the same shape as the incident signal, but their sign and magnitude depend on the change in impedance level. If there is a step increase in the impedance, then the reflection will have the same sign as the incident signal and if there is a step decrease in impedance, the reflection will have the opposite sign. The reflections are measured at the output/input of the Time-Domain Reflectometer and displayed as a function of time. Alternatively, the display can show the transmission and reflections as a function of cable length because the speed of signal propagation is almost constant for a given transmission medium. TDRs can be used to analyze cable impedances and lengths, connector and splice losses and locations. TDR impedance measurements provide designers the opportunity to perform signal integrity analysis of system interconnects and accurately predict the digital system performance. TDR measurements are widely used in board characterization work. A circuit board designer can determine the characteristic impedances of board traces, compute accurate models for board components, and predict board performance more accurately. There are many other areas of application for time-domain reflectometers. A SEMICONDUCTOR CURVE TRACER is a test equipment used to analyze the characteristics of discrete semiconductor devices such as diodes, transistors, and thyristors. The instrument is based on oscilloscope, but contains also voltage and current sources that can be used to stimulate the device under test. A swept voltage is applied to two terminals of the device under test, and the amount of current that the device permits to flow at each voltage is measured. A graph called V-I (voltage versus current) is displayed on the oscilloscope screen. Configuration includes the maximum voltage applied, the polarity of the voltage applied (including the automatic application of both positive and negative polarities), and the resistance inserted in series with the device. For two terminal devices like diodes, this is sufficient to fully characterize the device. The curve tracer can display all of the interesting parameters such as the diode's forward voltage, reverse leakage current, reverse breakdown voltage,…etc. Three-terminal devices such as transistors and FETs also use a connection to the control terminal of the device being tested such as the Base or Gate terminal. For transistors and other current based devices, the base or other control terminal current is stepped. For field effect transistors (FETs), a stepped voltage is used instead of a stepped current. By sweeping the voltage through the configured range of main terminal voltages, for each voltage step of the control signal, a group of V-I curves is generated automatically. This group of curves makes it very easy to determine the gain of a transistor, or the trigger voltage of a thyristor or TRIAC. Modern semiconductor curve tracers offer many attractive features such as intuitive Windows based user interfaces, I-V, C-V and pulse generation, and pulse I-V, application libraries included for every technology…etc. PHASE ROTATION TESTER / INDICATOR: These are compact and rugged test instruments to identify phase sequence on three-phase systems and open/de-energized phases. They are ideal for installing rotating machinery, motors and for checking generator output. Among the applications are the identification of proper phase sequences, detection of missing wire phases, determination of proper connections for rotating machinery, detection of live circuits. A FREQUENCY COUNTER is a test instrument that is used for measuring frequency. Frequency counters generally use a counter which accumulates the number of events occurring within a specific period of time. If the event to be counted is in electronic form, simple interfacing to the instrument is all that is needed. Signals of higher complexity may need some conditioning to make them suitable for counting. Most frequency counters have some form of amplifier, filtering and shaping circuitry at the input. Digital signal processing, sensitivity control and hysteresis are other techniques to improve performance. Other types of periodic events that are not inherently electronic in nature will need to be converted using transducers. RF frequency counters operate on the same principles as lower frequency counters. They have more range before overflow. For very high microwave frequencies, many designs use a high-speed prescaler to bring the signal frequency down to a point where normal digital circuitry can operate. Microwave frequency counters can measure frequencies up to almost 100 GHz. Above these high frequencies the signal to be measured is combined in a mixer with the signal from a local oscillator, producing a signal at the difference frequency, which is low enough for direct measurement. Popular interfaces on frequency counters are RS232, USB, GPIB and Ethernet similar to other modern instruments. In addition to sending measurement results, a counter can notify the user when user-defined measurement limits are exceeded. For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PAGE sadurunge

Compressors, Pumps, Motors for Pneumatic & Hydraulic & Vacuum Applications, Compressor, Pump, Positive Type Displacement Compressors - AGS-TECH Inc. Kompresor & Pompa & Motor We offer off-the-shelf and custom manufactured COMPRESSORS, PUMPS and MOTORS for PNEUMATIC, HYDRAULIC and VACUUM APPLICATIONS. You can choose the products you need in our downloadable brochures or if you are unsure, you may describe us your needs and applications and we can offer you the suitable compressors, pumps and pneumatic & hydraulic motors. For some of our compressors, pumps and motors we are capable of making modifications and custom manufacture them to your applications. PNEUMATIC COMPRESSORS: Also called gas compressors, these are mechanical devices that increase the pressure of a gas by reducing its volume. Compressors supply air to a pneumatic system. An air compressor is a specific type of gas compressor. Compressors are similar to pumps, they both increase the pressure on a fluid and can transport the fluid through a pipe. Since gases are compressible, the compressor also reduces the volume of a gas. Liquids are relatively incompressible; while some can be compressed. The main action of a pump is to pressurize and transport liquids. Both piston and rotary screw version pneumatic compressors are available in many versions and suitable for any production activity. Mobile compressors, low- or high-pressure compressors, on-frame / vessel-mounted compressors: They are designed to meet intermittent compressed air demands. Our belt driven compressors are designed to deliver more air and higher pressures to increase the number of possible applications. Some of our belt driven two stage piston compressors have pre-installed and tank-mounted dryers. The silent range of pneumatic compressors are especially attractive for applications in closed areas or when many units need to be used. The small and compact yet powerful screw compressors are also among our popular products. The rotors of our pneumatic compressors are mounted on high quality low wear bearings. Pneumatic Variable Speed (CPVS) compressors allow users to save operating costs when the application does not require the compressors full capacity. Air-cooled compressors are designed for heavy duty installations and harsh conditions. Compressors can be categorized as: - Positive Type Displacement Compressors: These compressors operate by opening up a cavity to draw in air, and then make the cavity smaller to expel compressed air. Three designs of positive displacement compressors are common in industry: First one are the Reciprocating Compressors (single stage and two stage). As the crankshaft rotates, it causes the piston to reciprocate, alternately drawing in atmospheric air and pushing out compressed air. Piston compressors are popular in small and medium commercial applications. A single-stage compressor has only one piston connected to a crankshaft and can pressures up to 150 psi. On the other hand, two-stage compressors have two pistons of different sizes. The larger piston is called the first stage and the smaller one the second stage. Two-stage compressors can generate pressures higher than 150 psi. The second type are the Rotary Vane Compressors which have a rotor mounted off center to the housing. As the rotor spins, the vanes extend and retract to keep contact with the housing. At the inlet, the chambers between vanes increase in volume and create a vacuum to pull in the atmospheric air. When the chambers reach the outlet, their volume decreases. The air is compressed before being exhausted into the receiver tank. Rotary vane compressors produce up to 150 psi pressure. Lastly Rotary Screw Compressors have two shafts with the air seal-off contours that look similar to a screw. Air entering from the top on one end of the rotary screw compressors is exhausted out at the other end. At the location where the air enters the compressors, the volume of the chambers between the contours is large. As the screws turn and mesh, the volume of the chambers decreases and causes the air to be compressed before being exhausted into the receiver tank. - Non-Positive Type Displacement Compressors: These compressors operate by using an impeller to increase the velocity of the air. As the air enters into a diffuser, its pressure increases before the air goes into a receiver tank. Centrifugal compressors are an example. Multistage centrifugal compressor designs can generate high pressures by feeding the outlet air of a preceding stage to the inlet of the next stage. HYDRAULIC COMPRESSORS: Similar to pneumatic compressors, these are mechanical devices that increase the pressure of a liquid by reducing its volume. Hydraulic compressors are usually divided into four major groups: Piston Compressors, Rotary Vane Compressors, Rotary Screw Compressors and Gear Compressors. Rotary vane-models include also a cooled lubrication system, oil separator, relief valve on the air intake and automatic rotation speed valve. Rotary vane-models are the most suitable for installation on different excavators, mining and other machines. PNEUMATIC PUMPS: AGS-TECH Inc. offers a wide variety of Diaphragm Pumps and Piston Pumps for pneumatic applications. Piston pumps and Plunger Pumps are reciprocating pumps that use a plunger or piston to move media through a cylindrical chamber. The plunger or piston is actuated by a steam powered, pneumatic, hydraulic, or electric drive. Piston and plunger pumps are also called high viscosity pumps. Diaphragm pumps are positive displacement pumps in which the reciprocating piston is separated from the solution by a flexible diaphragm. This flexible membrane allows fluid movement. These pumps can handle many different types of fluids, even those with some solid material. Compressed air driven piston pumps use large area air-driven piston connected to small-area hydraulic piston, to convert compressed air into hydraulic power. Our pumps are designed to provide an economical, compact and portable source of hydraulic pressure. To size the right pump for your application contact us. HYDRAULIC PUMPS: A hydraulic pump is a mechanical source of power that converts mechanical power into hydraulic energy (i.e. flow, pressure). Hydraulic pumps are used in hydraulic drive systems. They can be hydrostatic or hydrodynamic. Hydraulic pumps generate flow with enough power to overcome pressure induced by the load at the pump outlet. Hydraulic pumps in operation create a vacuum at the pump inlet, forcing liquid from the reservoir into the inlet line to the pump and by mechanical action delivering this liquid to the pump outlet and forcing it into the hydraulic system. Hydrostatic pumps are positive displacement pumps while hydrodynamic pumps can be fixed displacement pumps, in which the displacement (flow through the pump per rotation of the pump) cannot be adjusted, or variable displacement pumps, which have a more complicated construction that allows the displacement to be adjusted. Hydrostatic pumps are of various types and work on the principle of Pascal's law. It states that the increase in pressure at one point of the enclosed liquid in equilibrium is transmitted equally to all other points of the liquid, unless the effect of gravity is neglected. A pump produces liquid movement or flow, and does not generate pressure. Pumps produce the flow necessary for the development of pressure which is a function of resistance to fluid flow in the system. As an example, the pressure of the fluid at the pump outlet is zero for a pump not connected to a system or load. On the other hand, for a pump delivering into a system, the pressure will rise only to the level necessary to overcome the resistance of the load. All pumps may be classified as either positive-displacement or non-positive-displacement. The majority of pumps used in hydraulic systems are positive-displacement. A Non-Positive-Displacement Pump produces a continuous flow. However, since it does not provide a positive internal seal against slippage, its output varies considerably as the pressure varies. Examples of non-positive-displacement pumps are centrifugal and propeller pumps. If the output port of a non-positive-displacement pump were blocked off, the pressure would rise, and output would decrease to zero. Although the pumping element would continue moving, flow would stop because of the slippage inside the pump. On the other hand, in aPositive-Displacement Pump, slippage is negligible compared to the pump's volumetric output flow. If the output port were plugged, pressure would increase instantaneously to the point that the pump's pumping elements or the pump’s case would fail, or the pump's prime mover would stall. A positive-displacement pump is one that displaces or delivers the same amount of liquid with each rotating cycle of the pumping element. Constant delivery during each cycle is possible because of the close-tolerance fit between the pumping elements and the pump case. This means, the amount of liquid that slips past the pumping element in a positive-displacement pump is minimal and negligible compared to the theoretical maximum possible delivery. In positive-displacement pumps the delivery per cycle remains almost constant, regardless of changes in pressure against which the pump is working. If fluid slippage is substantial, this means the pump is not operating properly and should be repaired or replaced. Positive-displacement pumps can be of either fixed or variable displacement type. The output of a fixed displacement pump remains constant at a given pump speed during each pumping cycle. The output of a variable displacement pump can be changed by altering the geometry of the displacement chamber. The term Hydrostatic is used for positive-displacement pumps and Hydrodynamic is used for non-positive-displacement pumps. Hydrostatic meaning that the pump converts mechanical energy to hydraulic energy with comparatively small quantity and velocity of liquid. On the other hand, in a hydrodynamic pump, liquid velocity and movement are large and output pressure depends on the velocity at which the liquid is made to flow. Here are the commercially available hydraulic pumps: - Reciprocating pumps: As the piston extends, the partial vacuum created in the pump chamber draws some liquid from the reservoir through the inlet check valve into the chamber. The partial vacuum helps seat the outlet check valve firmly. The volume of liquid drawn into the chamber is known because of the geometry of the pump case. As the piston retracts, the inlet check valve reseats, closing the valve, and the force of the piston unseats the outlet check valve, forcing liquid out of the pump and into the system. - Rotary pumps (external-gear pumps, lobe pump, screw pump, internal-gear pumps, vane pumps): In a rotary-type pump, rotary motion carries the liquid from the pump inlet to the pump outlet. Rotary pumps are usually classified according to the type of element that transmits the liquid. - Piston pumps (axial-piston pumps, inline-piston pumps, bent-axis pumps, radial-piston pumps, plunger pumps): The piston pump is a rotary unit which uses the principle of the reciprocating pump to produce fluid flow. Instead of using a single piston, these pumps have many piston-cylinder combinations. Part of the pump mechanism rotates about a drive shaft to generate the reciprocating motions, which draw fluid into each cylinder and then expels it, producing flow. Plunger pumps are somewhat similar to rotary piston pumps, in that pumping is the result of pistons reciprocating in cylinder bores. However, the cylinders are fixed in these pumps. Cylinders do not rotate around the drive shaft. Pistons may be reciprocated by a crankshaft, by eccentrics on a shaft, or by a wobble plate. VACUUM PUMPS: A vacuum pump is a device that removes gas molecules from a sealed volume in order to leave behind a partial vacuum. The mechanics of the pump design inherently dictate the pressure range at which the pump is able to operate. The vacuum industry recognizes the following pressure regimes: Coarse Vacuum: 760 - 1 Torr Rough Vacuum: 1 Torr – 10exp-3 Torr High Vacuum: 10exp-4 – 10exp-8 Torr Ultra High Vacuum: 10exp-9 – 10exp-12 Torr The transition from atmospheric pressure to the bottom of the UHV range (approx. 1 x 10exp-12 Torr) is a dynamic range of about 10exp+15 and beyond the capabilities of any single pump. Indeed, to get to any pressure below 10exp-4 Torr requires more than one pump. - Positive displacement pumps: These expand a cavity, seal, exhaust and repeat it. - Momentum transfer pumps (molecular pumps): These use high speed liquids or blades to knock gasses around. - Entrapment pumps (cryopumps): Create solids or adsorbed gases . In vacuum systems roughing pumps are used from atmospheric pressure down to rough vacuum (0.1 Pa, 1X10exp-3 Torr). Roughing pumps are necessary because turbo pumps have trouble starting from atmospheric pressure. Usually Rotary Vane Pumps are used for roughing. They may have oil or not. After roughing, if lower pressures (better vacuum) are needed, Turbomolecular Pumps are useful. Gas molecules interact with spinning blades and are preferentially forced downward. High vacuum (10exp-6 Pa) requires rotation of 20,000 to 90,000 revolutions per minute. Turbomolecular pumps generally work between 10exp-3 and 10exp-7 Torr Turbomolecular pumps are ineffective before gas is in “molecular flow”. PNEUMATIC MOTORS: Pneumatic motors, also called compressed air engines are types of motors which do mechanical work by expanding compressed air. Pneumatic motors generally convert the compressed air energy to mechanical work through either linear or rotary motion. Linear motion can come from a diaphragm or piston actuator, while rotary motion can come from either a vane type air motor, piston air motor, air turbine or gear type motor. Pneumatic motors have found widespread use in the hand-held tool industry for impact wrenches, pulse tools, screwdrivers, nut runners, drills, grinders, sanders, …etc, dentistry, medicine and a wide range of industrial applications. There are several advantages of pneumatic motors over electric tools. Pneumatic motors offer greater power density because a smaller pneumatic motor can provide the same amount of power as a larger electric motor. Pneumatic motors do not require an auxiliary speed controller which adds to their compactness, they generate less heat, and can be used in more volatile atmospheres because they do not require electric power, nor do they create sparks. They can be loaded to stop with full torque without damage. Please click on highlighted text below to download our product brochures: - Oil-Less Mini Air Compressors - YC Series Hydraulic Gear Pumps (Motors) - Medium and Medium-High Pressure Hydraulic Vane Pumps - Caterpillar Series Hydraulic Pumps - Komatsu Series Hydraulic Pumps - Vickers Series Hydraulic Vane Pumps and Motors - Vickers Series Valves - YC-Rexroth Series Variable Displacement Piston Pumps-Hydraulic Valves-Multiple Valves - Yuken Series Vane Pumps - Valves KLIK Product Finder-Locator Service PREVIOUS PAGE

Mechanical Assembly, Joining and Fastening, Welded Metal Subassembly, Subassemblies, Contract Manufacturing, Custom Manufacturing and Assembling Majelis Mekanik Mechanical Assembly Majelis Mekanik Kasusun saka Balls Steel, Springs lan Komponen Machined komponen logam gandheng digawe dening AGS-TECH Rakitan mekanik nggunakake kabeh jinis pengikat sing digawe ing rak lan khusus Majelis mekanik kanthi tombol khusus, benang lan unsur mesin Welded Steel Assembly dening AGS-TECH Inc. Mirror Rampung Majelis Welded Stainless Steel dening AGS-TECH Inc. Perakitan Mekanik Bagian Presisi dening AGS-TECH Inc. CNC machined, knurled, Utas lan nglumpuk komponen Bagian Kuningan Berlapis Nikel Dirakit menyang Tube Majelis Mekanik Custom dening AGS-TECH Inc. Dial mesin lan perakitan gear - AGS-TECH Inc. Piranti mesin lan perakitan dial kanggo pengukur tekanan sing diprodhuksi dening AGS-TECH Inc. Rakitan kacang heksagon Manufaktur hexagon nut rakitan Majelis Parts Metal Welded dening AGS-TECH Inc. Majelis Pompa Majelis Mekanik - AGS-TECH Inc. Majelis Pin Bearing Pin Bearing saka AGS-TECH Inc. Majelis Bearing Majelis bantalan saka AGS-TECH Inc. Precision Mechanical Assemblies for Industrial Applications - AGS-TECH Inc Komponen Mesin lan Dirakit Presisi kanggo Aplikasi Sealing - AGS-TECH Inc Perakitan Mekanik Serat Karbon Wing-I Tipe kanggo Mobil Majelis Mekanik lan Welding - AGS-TECH Precision Assemblies saka Hinges Springs Screws lan Komponen Liyane - AGS-TECH Inc Déwan chain Custom - AGS-TECH Rakitan Mekanik Serat Karbon Wing-E Tipe Déwan chain khusus Manufaktur lan Majelis Mekanik Pengukur Tekanan Khusus dening AGS-TECH Inc. Mburi Sisih saka Custom Pressure Gauge Majelis PAGE sadurunge

Sheet Metal Forming and Fabrication, Stamping, Punching, Bending, Progressive Die, Spot Welding, Deep Drawing, Metal Blanking and Slitting at AGS-TECH Inc. Stampings & Sheet Metal Fabrikasi We offer sheet metal stamping, shaping, forming, bending, punching, blanking, slitting, perforating, notching, nibbling, shaving, pressworking, fabrication, deep drawing using single punch / single stroke dies as well as progressive dies and spinning, rubber forming and hydroforming; sheet metal cutting using water jet, plasma, laser, saw, flame; sheet metal assembly using welding, spot welding; sheet metal tube bulging and bending; sheet metal surface finishing including dip or spray painting, electrostatic powder coating, anodizing, plating, sputtering and more. Our services range from rapid sheet metal prototyping to high volume manufacturing. We recommend that you click here to DOWNLOAD our Schematic Illustrations of Sheet Metal Fabrication and Stamping Processes by AGS-TECH Inc. This will help you better understand the information we are providing you below. • SHEET METAL CUTTING : We offer CUTOFFS and PARTINGS. Cutoffs cut the sheet metal over one path at a time and there is basically no waste of material, whereas with partings the shape cannot be nestled precisely and therefore certain amount of material is wasted. One of our most popular processes is PUNCHING, where a piece of material round or other shape is cut out from sheet metal. The piece that is cut out is waste. Another version of punching is SLOTTING, where rectangular or elongated holes are punched. BLANKING on the other hand is the same process as punching, with the distinction of the piece being cut out is the work and is kept. FINE BLANKING, a superior version of blanking, creates cuts with close tolerances and straight smooth edges and does not require secondary operations for perfection of the workpiece. Another process we frequently use is SLITTING, which is a shearing process where sheet metal is cut by two opposing circular blades in a straight or curved path. Can opener is a simple example of the slitting process. Another popular process for us is PERFORATING, where many holes round or other shape are punched in sheet metal in a certain pattern. A typical example for a perforated product is metal filters with many holes for fluids. In NOTCHING, another sheet metal cutting process, we remove material from a work piece, starting at the edge or elsewhere and cut inward until the desired shape is obtained. It is a progressive process where each operation removes another piece until the desired contour is obtained. For small production runs we sometimes use a relatively slower process called NIBBLING which consists of many rapid punches of overlapping holes to make a larger more complex cut. In PROGRESSIVE CUTTING we use a series of different operations to obtain a single cut or a certain geometry. Finally SHAVING a secondary process helps us to improve edges of cuts that have already been made. It is used for cutting off the chips, rough edges on sheet metal work. • SHEET METAL BENDING : Besides cutting, bending is an essential process without which we would not be able to produce most products. Mostly a cold working operation but sometimes also performed when warm or hot. We use dies and press most of the time for this operation. In PROGRESSIVE BENDING we use a series of different punch and die operations to obtain a single bend or a certain geometry. AGS-TECH uses a variety of bending processes and makes the choice depending on the workpiece material, its size, thickness, desired size of bend, radius, curvature and angle of bend, location of bend, economy of operation, quantities to be manufactured…etc. We use V-BENDING where a V shaped punch forces the sheet metal into the V shaped die and bends it. Good for both very acute and obtuse angles and in between, including 90 degrees. Using wiping dies we perform EDGE BENDING. Our equipment enables us to obtain angles even larger than 90 degrees. In edge bending the workpiece is sandwiched between a pressure pad and the die, the area for bending is located on the die edge and the rest of the workpiece is held over space like a cantilever beam. When the punch acts on the cantilever portion, it is bent over the edge of the die. FLANGING is an edge bending process resulting in a 90 degree angle. Main goals of the operation are the elimination of sharp edges and obtaining geometric surfaces to ease the joining of parts. BEADING, another common edge bending process forms a curl over a part’s edge. HEMMING on the other hand results with an edge of the sheet that is bent completely over on itself. In SEAMING, the edges of two parts are bent over on each other and joined. DOUBLE SEAMING on the other hand provides watertight and airtight sheet metal joints. Similar to edge bending, a process called ROTARY BENDING deploys a cylinder with the desired angle cut out and serving as the punch. As the force is transmitted to the punch, it closes with the workpiece. The groove of the cylinder gives the cantilever portion the desired angle. The groove can have an angle smaller or larger than 90 degrees. In AIR BENDING, we do not need the lower die to have an angled groove. The sheet metal is supported by two surfaces on opposite sides and at a certain distance. The punch then applies a force at the right location and bends the workpiece. CHANNEL BENDING is performed using a channel shaped punch and die, and U-BEND is achieved with a U-shaped punch. OFFSET BENDING produces offsets on the sheet metal. ROLL BENDING, a technique good for thick work and bending of large pieces of metal plates, uses three rolls to feed and bend the plates to desired curvatures. Rolls are arranged so that the desired bend of the work is obtained. The distance and angle between the rolls is controlled to obtain the desired outcome. A moveable roll makes it possible to control the curvature. TUBE FORMING is another popular sheet metal bending operation involving multiple dies. Tubes are obtained after multiple actions. CORRUGATION is also performed by bending operations. Basically it is the symmetrical bending at regular intervals across an entire piece of sheet metal. Various shapes can be used for corrugating. Corrugated sheet metal is more rigid and has better resistance against bending and therefore has applications in the construction industry. SHEET METAL ROLL FORMING, a continuous manufacturing process is deployed to bend cross sections of a certain geometry using rolls and the work is bent in sequential steps, with the final roll completing the work. In some cases a single roll and in some cases a series of rolls are employed. • COMBINED SHEET METAL CUTTING & BENDING PROCESSES : These are the processes that cut and bend at the same time. In PIERCING, a hole is createdusing a pointed punch. As the punchwidens the hole in the sheet, the material is bent simultaneously into an internal flange for the hole. The flange obtained may have important functions. The LANCING operation on the other hand cuts and bends the sheet to create a raised geometry. • METAL TUBE BULGING AND BENDING : In BULGING some internal part of a hollow tube is pressurized, causing the tube to bulge outward. Since the tube is inside a die, the bulge geometry is controlled by the shape of the die. In STRETCH BENDING, a metal tube is stretched using forces parallel to the tube’s axis and bending forces to pull the tube over a form block. In DRAW BENDING, we clamp the tube near its end to a rotating form block that bends the tube while rotating. Lastly, in COMPRESSION BENDING the tube is held by force to a fixed form block, and a die bends it over the form block. • DEEP DRAWING : In one of our most popular operations, a punch, a matching die and a blank holder are used. The sheet metal blank is placed over the die opening and the punch moves towards the blank held by the blank holder. Once they come into contact, the punch forces the sheet metal into the die cavity to form the product. Deep drawing operation resembles cutting, however the clearance between the punch and die prevents the sheet from being cut. Another factor assuring the sheet is deep drawn and not cut are the rounded corners on the die and punch which prevents the shearing and cutting. To achieve a greater magnitude of deep drawing, a REDRAWING process is being deployed where a subsequent deep drawing takes place on a part that has already undergone a deep drawing process. In REVERSE REDRAWING, the deep drawn part is flipped over and drawn in the opposite direction. Deep drawing can provide irregular shaped objects such as domed, tapered or stepped cups, In EMBOSSING we use a male and female die pair to impress the sheet metal with a design or script. • SPINNING : An operation where a flat or preformed workpiece is held between a rotating mandrel and tail stock and a tool applies localized pressure to the work as it gradually moves up the mandrel. As a result, the workpiece is wrapped over the mandrel and takes its shape. We use this technique as an alternative to deep drawing where the quantity of an order is small, the parts are large (diameters up to 20 feet) and have unique curves. Even though the per piece prices are generally higher, the set-up costs for CNC spinning operation are low compared to deep drawing. To the contrary, deep drawing requires high initial investment for set-up, but the per piece costs are low when high quantity of parts are produced. Another version of this process is SHEAR SPINNING, where there is also metal flow within the workpiece. The metal flow will reduce the thickness of the workpiece as the process is carried out. Yet another related process is TUBE SPINNING, which is applied on cylindirical parts. Also in this process there is metal flow within the workpiece. The thickness is thus reduced and the tube’s length is increased. The tool can be moved to create features on the inside or outside of the tube. • RUBBER FORMING OF SHEET METAL : Rubber or polyurethane material is put in a container die and the work piece is placed on the surface of the rubber. A punch is then acted upon the work piece and forces it into the rubber. Since the pressure generated by the rubber is low, the depth of parts produced is limited. Since tooling costs are low, the process is suitable for low quantity production. • HYDROFORMING : Similar to rubber forming, in this process sheet metal work is pressed by a punch into a pressurized liquid inside a chamber. The sheet metal work is sandwiched between the punch and a rubber diaphragm. The diaphragm surrounds the workpiece completely and the pressure of the fluid forces it to form on the punch. Very deep draws even deeper than in the deep drawing process can be obtained with this technique. We manufacture single-punch dies as well as progessive dies depending on your part. Single stroke stamping dies are a cost effective method for producing large quantities of simple sheet metal parts such as washers quickly. Progressive dies or the deep drawing technique are used for manufacturing more complex geometries. Depending on your case, waterjet, laser or plasma cutting can be used to produce your sheet metal parts inexpensively, fast and accurately. Many suppliers have no idea about these alternative techniques or do not have it and therefore they go through lengthy and expensive ways of making dies and tools that only waste customers time and money. If you require custom built sheet metal components such as enclosures, electronic housings...etc as fast as within days, then contact us for our RAPID SHEET METAL PROTOTYPING service. KLIK Product Finder-Locator Service MENU sadurunge

Rapid Electronic Prototyping, Custom Robot Assembly, Optomechanical Prototype Manufacturing, AGS-TECH Elektronik Prototyping Robot elektronik prototipe kanthi detektor inframerah cedhak, tahap rotasi lan sirah miring tip Prototyping elektronik cepet Papat lapisan PCB karo RO4003C ing ndhuwur lapisan kecemplung emas PCB prototyping kanggo proyek solar Loro Layer PCBA Prototype Design lan Layout Robot prototipe optoelektronik Layanan Prototyping PCBA Papan Multilayer PCBA Prototyping Printed Circuit Board Déwan Prototyping Prototyping Majelis Wire Harness Elektronik Custom Amplifier Prototyping Elektronik Amplifier Prototyping PREVIOUS PAGE

Manufacturing Pneumatic Hydraulic Vacuum Products, Custom Pneumatics, Hydrolics, Control Valves, Pipes, Tubes, Hoses, Bellows, Seals & Fittings & Connections Pneumatics & Hydraulics & Vacuum Products Waca liyane Kompresor & Pompa & Motor Waca liyane Valves for Pneumatics & Hydraulics & Vacuum Waca liyane Pipa & Tabung & Selang & Bellows lan Komponen Distribusi Waca liyane Segel & Fitting & Clamps & Sambungan & Adaptor & Flanges & Couplings cepet Waca liyane Filters & Treatment Components Read More Aktuator Akumulator Waca liyane Reservoir & Chambers kanggo Hidrolik & Pneumatik & Vakum Read More Service & Repair Kits for Pneumatics & Hydraulics and Vacuum Waca liyane System Components for Pneumatics & Hydraulics and Vacuum Waca liyane Piranti kanggo Hidrolik & Pneumatik & Vakum AGS-TECH supplies off-shelf as well as custom manufactured PNEUMATICS & HYDRAULICS and VACUUM PRODUCTS. We offer original brand name components, generic brand and AGS-TECH brand pneumatic, hydraulic and vacuum products. Regardless of which category, our components are manufactured at plants certified to international standards and meet related industrial standards. Here is a brief summary of our pneumatic, hydraulic and vacuum products. You can find more detailed information by clicking on the submenu titles on the side. COMPRESSORS & PUMPS & MOTORS: A variety of these are offered off-shelf for pneumatic, hydraulic and vacuum applications. We have specialized compressors, pumps and motors for each type of application. You may choose the products you need in our downloadable brochures on relevant pages or if you are unsure, you may describe us your needs and applications and we can offer you the suitable pneumatics, hydraulics and vacuum products. For some of our compressors, pumps and motors we are capable to make modifications or manufacture them custom tailored to your applications. To give you a feeling of the wide spectrum of compressors, pumps and motors we can supply, here are a few types: Oilless air motors, cast iron and aluminum rotary vane air motors, piston air compressor / vacuum pump, positive displacement blowers, diaphragm compressor, hydraulic gear pump, hydraulic radial piston pump, hydraulic track drive motors. CONTROL VALVES: Models of these for either hydraulics, pneumatics or vacuum are available. Similar to our other products, you can order off-shelf as well as custom manufactured versions. The types we carry range from air cylinder speed control valves to filtered ball valves, from directional control valves to auxiliary valves and from angle valves to venting valves. PIPES & TUBES & HOSES & BELLOWS: These are manufactured according to the application environment and conditions. For example hydraulic tubes for A/C refrigeration requires the tube material to withstand cold temperatures, while a hydraulic beverage dispensing tube needs to be food grade and made from materials that do not pose health hazard. On the other hand, the shape of pneumatic/hydraulic/vacuum tubes and hoses shows also a variety, such as coiled air hose assemblies which are easy to handle because of their compactness and coiled structure and ability to extend when needed. Bellows used for vacuum systems need to have perfect sealing capability to maintain high vacuum while being flexible and be able to be bent when needed. SEALS & FITTINGS & CONNECTIONS & ADAPTORS & FLANGES: These may be overlooked because of being only a small component in the entire pneumatic / hydraulic or vacuum system. However even the smallest member of a system is very critical as a simple leak of air through a seal or fitting can easily prevent a quality vacuum to be achieved in a high vacuum system and result in costly repairs and production re-runs. On the other hand, a small leak of a toxic gas in a pneumatic gas delivery line can result in a disaster. Once again, our task is to understand our customers needs and requirements very well and provide them the exact pneumatics & hydraulics or vacuum product matching their application. FILTERS & TREATMENT COMPONENTS: Without filtering and treatment of the liquids and gases, a hydraulic, pneumatic or vacuum system cannot fulfill its tasks to full extent. As an example, a vacuum system will need air intake after an operation is complete so the system can be opened. If the air entering the vacuum system is dirty and contains oils, it will be very difficult to obtain high vacuum for the next operation cycle. A filter at air intake can eliminate such problems. On the other hand, breather filters are common in hydraulics. Filters must be of highest quality and suitable for their intended use. For example they need to be reliable and not pose risks of contaminating the pneumatic, hydraulic or vacuum system they are used in. Their inner content (such as dessicant dryers) and components cannot degrade quickly when exposed to certain chemicals, oils or humidity. On the other hand, some systems, such as it is the case in some pneumatic systems, do require lubrication of the air and therefore compressed air lubricators are used. Other examples of treatment components are electronic proportional regulators used in pneumatics, pneumatic coalescing filter elements, pneumatic oil/water separators. ACTUATORS & ACCUMULATORS: A hydraulic actuator is a cylinder or fluid motor that converts hydraulic power into useful mechanical work. The mechanical motion produced can be linear, rotary, or oscillatory. Operation exhibits high force capability, high power per unit weight and volume, good mechanical stiffness, and a high dynamic response. These properties lead to a wide use in precision control systems, heavy-duty machine tools, transportation, marine, and aerospace applications. Similarly a pneumatic actuator converts energy that is typically in the form of compressed air into mechanical motion. The motion can be rotary or linear, depending on the type of pneumatic actuator. Accumulators usually are installed in hydraulic systems to store energy and to smooth out pulsations. A hydraulic system with an accumulator can use a smaller pump because the accumulator stores energy from the pump during periods of low demand. This accumulated energy is available for instantaneous use, released upon demand at a much higher rate than could be supplied by the hydraulic pump alone. Accumulators can also be used as surge or pulsation absorbers. Accumulators can cushion hydraulic hammer, reducing shocks caused by rapid operation or sudden starting and stopping of power cylinders in a hydraulic circuit. A variety of models of these for either hydraulics, pneumatics are available. Similar to our other products, you can order off-shelf as well as custom manufactured actuator and accumulator versions. RESERVOIRS & CHAMBERS FOR HYDRAULICS & PNEUMATICS & VACUUM: Hydraulic systems need a finite amount of liquid fluid that must be stored and reused continually as the circuit works. Because of this, part of any hydraulic circuit is a storage reservoir or tank. This tank may be part of the machine framework or a separate stand-alone unit. Similarly, a pneumatic or air receiver tank is an integral and important part of any compressed air system. Typically a receiver tank is sized at 6-10 times the flow rate of the system. In a pneumatic compressed air system, a receiver tank can provide several benefits such as: -Acting as a reservoir of compressed air for peak demands. -A pneumatic receiver tank can help remove water from the system by giving the air a chance to cool. -A pneumatic receiver tank is able to minimize pulsation in the system caused by a reciprocating compressor or a cyclic process downstream. Vacuum chambers on the other hand are the containers inside which the vacuum is created and maintained. They must be strong enough not to implode and also be manufactured so that they are not prone to contamination. The size of vacuum chambers can vary vastly depending on the application. Vacuum chambers are made of materials that do not outgas either as this would unable the user to obtain and keep vacuum at desired low levels. Details of these can be found on the submenus. DISTRIBUTION EQUIPMENT is all that we have for hydraulics, pneumatics and vacuum systems that serves the purpose of distributing either the liquid, gas or vacuum from one place or system component to the other. Some of these products have already been mentioned above under the titles seals & fittings & connections & adaptors & flanges and pipes & tubes & hoses & bellows. However there are others that do not fall within the above mentioned titles such as pneumatic and hydraulic manifolds, chamfer tools, hose barbs, reducing bracket, drop brackets, pipe cutter, pipe clips, feedthroughs. SYSTEM COMPONENTS: We also supply pneumatic, hydraulic and vacuum system components not mentioned elsewhere here under any title. Some of them are air knives, booster regulators, sensors and gauges (pressure….etc), pneumatic slides, air cannons, air conveyors, cylinder position sensors, feedthroughs, vacuum regulators, pneumatic cylinder controls…etc. TOOLS FOR HYDRAULICS & PNEUMATICS & VACUUM: Pneumatic tools are work tools or other tools that operate with compressed air rather than purely electric energy. Examples are air hammers, screwdrivers, drills, bevellers, air die grinders….etc. Similarly, hydraulic tools are work tools that operate with compressed hydraulic liquids rather than electricity such as hydraulic paving breaker, drivers and pullers, crimping and cutting tools, hydraulic chainsaw…etc. Industrial vacuum tools are those that can be connected to an industrial vacuum line and be used for holding, gripping, manipulating objects or products in the workplace, such as vacuum handling tools. KLIK Product Finder-Locator Service PAGE sadurunge

Rapid Prototyping, Desktop Manufacturing, Additive Manufacturing, Stereolithography, Polyjet, Fused Deposition Modeling, Selective Laser Sintering, FDM, SLS Aditif lan Rapid Manufaktur In recent years, we have seen an increase in demand for RAPID MANUFACTURING or RAPID PROTOTYPING. This process may be also called DESKTOP MANUFACTURING or FREE-FORM FABRICATION. Basically a solid physical model of a part is made directly from a three dimensional CAD drawing. We use the term ADDITIVE MANUFACTURING for these various techniques where we build parts in layers. Using integrated computer-driven hardware and software we perform additive manufacturing. Our rapid prototyping and manufacturing techniques are STEREOLITHOGRAPHY, POLYJET, FUSED-DEPOSITION MODELING, SELECTIVE LASER SINTERING, ELECTRON BEAM MELTING, THREE-DIMENSIONAL PRINTING, DIRECT MANUFACTURING, RAPID TOOLING. We recommend that you click here to DOWNLOAD our Schematic Illustrations of Additive Manufacturing and Rapid Manufacturing Processes by AGS-TECH Inc. This will help you better understand the information we are providing you below. Rapid prototyping provides us: 1.) The conceptual product design is viewed from different angles on a monitor using a 3D / CAD system. 2.) Prototypes from nonmetallic and metallic materials are manufactured and studied from functional, technical and aesthetic aspects. 3.) Low cost prototyping in a very short time is accomplished. Additive manufacturing can be resembled to the construction of a loaf of bread by stacking and bonding individual slices on top of each other. In other words, the product is manufactured slice by slice, or layer by layer deposited onto each other. Most parts can be produced within hours. The technique is good if parts are needed very quickly or if quantities needed are low and making a mold and tooling is too expensive and time taking. However the cost of a part is expensive due to the expensive raw materials. Rapid Parts & Prototypes Brochure Download • STEREOLITHOGRAPHY : This technique also abbreviated as STL, is based on curing and hardening of a liquid photopolymer into a specific shape by focusing a laser beam on it. The laser polymerizes the photopolymer and cures it. By scanning the UV laser beam according to the programmed shape along the surface of the photopolymer mixture the part is produced from the bottom up in individual slices cascaded on top of each other. The scanning of the laser spot is repeated many times to achieve the geometries programmed into the system. After the part is completely manufactured, it is removed from the platform, blotted and cleaned ultrasonically and with alcohol bath. Next, it is exposed to UV irradiation for a few hours to make sure the polymer is fully cured and hardened. To summarize the process, a platform that is dipped into a photopolymer mixture and a UV laser beam are controled and moved through a servo-control system according tp the shape of the desired part and the part is obtained by photocuring the polymer layer by layer. Of course the maximum dimensions of the produced part are determined by the stereolithography equipment. • POLYJET : Similar to inkjet printing, in polyjet we have eight print heads that deposit photopolymer on the build tray. Ultraviolet light placed alongside the jets immediately cures and hardens each layer. Two materials are used in polyjet. The first material is for manufacturing the actual model. The second material, a gel-like resin is used for support. Both of these materials are deposited layer by layer and simultaneously cured. After the completion of the model, the support material is removed with an aqueous solution. Resins used are similar to stereolithography (STL). The polyjet has the following advantages over stereolithography: 1.) No need for cleaning parts. 2.) No need for postprocess curing 3.) Smaller layer thicknesses are possible and thus we get better resolution and can manufacture finer parts. • FUSED DEPOSITION MODELING : Also abbreviated as FDM, in this method a robot-controlled extruder head moves in two principle directions over a table. The cable is lowered and raised as needed. From the orifice of a heated die on the head, a thermoplastic filament is extruded and an initial layer is deposited on a foam foundation. This is accomplished by the extruder head that follows a predetermined path. After the initial layer, the table is lowered and subsequent layers are deposited on top of each other. Sometimes when manufacturing a complicated part, support structures are needed so that deposition can continue in certain directions. In these cases, a support material is extruded with a less dense spacing of filament on a layer so that it is weaker than the model material. These support structures can later be dissolved or broken off after the completion of the part. The extruder die dimensions determine the thickness of the extruded layers. The FDM process produces parts with stepped surfaces on oblique exterior planes. If this roughness is unacceptable, chemical vapor polishing or a heated tool can be used for smoothing these. Even a polishing wax is available as a coating material to eliminate these steps and achieve reasonable geometric tolerances. • SELECTIVE LASER SINTERING : Also denoted as SLS, the process is based on sintering of a polymer, ceramic or metallic powders selectively into an object. The bottom of the processing chamber has two cylinders: A part-build cylinder and a powder-feed cylinder. The former is lowered incrementally to where the sintered part is being formed and the latter is raised incrementally to supply powder to the part-build cylinder through a roller mechanism. First a thin layer of powder is deposited in the part-build cylinder, then a laser beam is focused on that layer, tracing and melting /sintering a particular cross section, which then resolidifies into a solid. The powder is areas that are not hit by the laser beam remain loose but still supports the solid portion. Then another layer of powder is deposited and the process repeated many times to obtain the part. At the end, the loose powder particles are shaken off. All these are carried out by a process-control computer using instructions generated by the 3D CAD program of the part being manufactured. Various materials such as polymers (such as ABS, PVC, polyester), wax, metals and ceramics with appropriate polymer binders can be deposited. • ELECTRON-BEAM MELTING : Similar to selective laser sintering, but using electron beam to melt titanium or cobalt chrome powders to make prototypes in vacuum. Some developments have been made to perform this process on stainless steels, aluminum and copper alloys. If the fatigue strength of the produced parts need to be increased, we use hot isostatic pressing subsequent to part manufacture as a secondary process. • THREE-DIMENSIONAL PRINTING : Also denoted by 3DP, in this technique a print head deposits an inorganic binder onto a layer of either nonmetallic or metallic powder. A piston carrying the powder bed is incrementally lowered and at each step the binder is deposited layer by layer and fused by the binder. Powder materials used are polymers blends and fibers, foundry sand, metals. Using different binder heads simultaneously and different color binders we can obtain various colors. The process is similar to inkjet printing but instead of obtaining a colored sheet we obtain a colored three dimensional object. The parts produced may be porous and therefore may require sintering and metal infiltration to increase its density and strength. Sintering will burn off the binder and fuse the metal powders together. Metals such a stainless steel, aluminum, titanium can be used to make the parts and as infiltration materials we commonly use copper and bronze. The beauty of this technique is that even complicated and moving assemblies can be manufactured very quickly. For example a gear assembly, a wrench as a tool can be made and will have moving and turning parts ready to be used. Different components of the assembly can be manufactured with different colors and all in one shot. Download our brochure on: Metal 3D Printing Basics • DIRECT MANUFACTURING and RAPID TOOLING : Besides design evaluation, troubleshooting we use rapid prototyping for direct manufacture of products or direct application into products. In other words, rapid prototyping can be incorporated into conventional processes to make them better and more competitive. For example, rapid prototyping can produce patterns and molds. Patterns of a melting and burning polymer created by rapid prototyping operations can be assembled for investment casting and invested. Another example to mention is using 3DP to produce ceramic casting shell and use that for shell casting operations. Even injection molds and mold inserts can be produced by rapid prototyping and one can save many weeks or months of mold making lead time. By only analyzing a CAD file of the desired part, we can produce the tool geometry using software. Here are some of our popular rapid tooling methods: RTV (Room-Temperature Vulcanizing) MOLDING / URETHANE CASTING : Using rapid prototyping can be used to make the pattern of the desired part. Then this pattern is coated with a parting agent and liquid RTV rubber is poured over the pattern to produce the mold halves. Next, these mold halves are used to injection mold liquid urethanes. The mold life is short, only like 0 or 30 cycles but enough for small batch production. ACES (Acetal Clear Epoxy Solid) INJECTION MOLDING : Using rapid prototyping techniques such as stereolithography, we produce injection molds. These molds are shells with an open end to allow filling with materials such as epoxy, aluminum-filled epoxy or metals. Again mold life is limited to tens or maximum hundreds of parts. SPRAYED METAL TOOLING PROCESS : We use rapid prototyping and make a pattern. We spray a zinc-aluminum alloy on the pattern surface and coat it. The pattern with the metal coating is then placed inside a flask and potted with an epoxy or aluminum-filled epoxy. Finally, it is removed and by producing two such mold halves we obtain a complete mold for injection molding. These molds have longer lives, in some cases depending on material and temperatures they can produce parts in the thousands. KEELTOOL PROCESS : This technique can produce molds with 100,000 to 10 Million cycle lives. Using rapid prototyping we produce an RTV mold. The mold is next filled with a mixture consisting of A6 tool steel powder, tungsten carbide, polymer binder and let to cure. This mold is then heated to get the polymer burned off and the metal powders to fuse. The next step is copper infiltration to produce the final mold. If needed, secondary operations such as machining and polishing can be performed on the mold for better dimensional accuracies. KLIK Product Finder-Locator Service PAGE sadurunge

Optical Coatings - Filter - Waveplates - Lenses - Prism - Mirrors - Beamsplitters - Windows - Optical Flat - Etalons Lapisan Optik & Pabrik Filter We nawakake off-rak uga diprodhuksi khusus: • Lapisan lan saringan optik, pelat gelombang, lensa, prisma, pangilon, beamsplitters, jendela, flat optik, etalon, polarizer...dll. • Various kemul optik ing landasan preferred, kalebu antireflective, dawa gelombang dirancang khusus transmissive, reflektif. Lapisan optik kita diprodhuksi kanthi teknik sputtering sinar ion lan teknik liyane sing cocog kanggo entuk saringan lan lapisan sing cocog karo spesifikasi sing padhang, awet, lan spektrum. Yen luwih seneng, kita bisa milih materi substrat optik sing paling cocok kanggo aplikasi sampeyan. Cukup menehi katrangan babagan aplikasi lan dawa gelombang, level daya optik lan paramèter kunci liyane lan kita bakal nggarap sampeyan kanggo ngembangake lan nggawe produk sampeyan. Sawetara lapisan optik, saringan lan komponen wis diwasa sajrone pirang-pirang taun lan wis dadi komoditas. Kita nggawe iki ing negara-negara murah ing Asia Tenggara. Ing sisih liya, sawetara lapisan lan komponen optik duwe syarat spektral lan geometris sing ketat, sing digawe ing AS nggunakake desain lan proses ngerti lan peralatan seni. Aja overpay unneccessarily kanggo lapisan optik, saringan lan komponen. Hubungi kita kanggo nuntun sampeyan lan entuk dhuwit paling akeh. Brosur Komponen Optik (kalebu lapisan, saringan, lensa, prisma ... etc) KLIK Product Finder-Locator Service PAGE sadurunge