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Optical Coatings - Filter - Waveplates - Lenses - Prism - Mirrors - Beamsplitters - Windows - Optical Flat - Etalons Lapisan Optik & Pabrik Filter We nawakake off-rak uga diprodhuksi khusus: • Lapisan lan saringan optik, pelat gelombang, lensa, prisma, pangilon, beamsplitters, jendela, flat optik, etalon, polarizer...dll. • Various kemul optik ing landasan preferred, kalebu antireflective, dawa gelombang dirancang khusus transmissive, reflektif. Lapisan optik kita diprodhuksi kanthi teknik sputtering sinar ion lan teknik liyane sing cocog kanggo entuk saringan lan lapisan sing cocog karo spesifikasi sing padhang, awet, lan spektrum. Yen luwih seneng, kita bisa milih materi substrat optik sing paling cocok kanggo aplikasi sampeyan. Cukup menehi katrangan babagan aplikasi lan dawa gelombang, level daya optik lan paramèter kunci liyane lan kita bakal nggarap sampeyan kanggo ngembangake lan nggawe produk sampeyan. Sawetara lapisan optik, saringan lan komponen wis diwasa sajrone pirang-pirang taun lan wis dadi komoditas. Kita nggawe iki ing negara-negara murah ing Asia Tenggara. Ing sisih liya, sawetara lapisan lan komponen optik duwe syarat spektral lan geometris sing ketat, sing digawe ing AS nggunakake desain lan proses ngerti lan peralatan seni. Aja overpay unneccessarily kanggo lapisan optik, saringan lan komponen. Hubungi kita kanggo nuntun sampeyan lan entuk dhuwit paling akeh. Brosur Komponen Optik (kalebu lapisan, saringan, lensa, prisma ... etc) KLIK Product Finder-Locator Service PAGE sadurunge

Micro Assembly & Packaging - Micromechanical Fasteners - Self Assembly - Adhesive Micromechanical Fastening - AGS-TECH Inc. - New Mexico - USA Majelis mikro lan Packaging We have already summarized our MICRO ASSEMBLY & PACKAGING services and products related specifically to microelectronics on our page Microelectronics Manufacturing / Semiconductor Fabrication. Here we will concentrate on more generic and universal micro assembly & packaging techniques we use for all kinds of products including mechanical, optical, microelectronic, optoelectronic and hybrid systems consisting of a combination of these. The techniques we discuss here are more versatile and can be considered to be used in more unusual and nonstandard applications. In other words the micro assembly & packaging techniques discussed here are our tools that help us to think “out of the box”. Here are some of our extraordinary micro assembly & packaging methods: - Manual micro assembly & packaging - Automated micro assembly & packaging - Self assembly methods such as fluidic self-assembly - Stochastic micro assembly using vibration, gravitational or electrostatic forces or else. - Use of micromechanical fasteners - Adhesive micromechanical fastening Let us explore some of our versatile extraordinary microassembly & packaging techniques in more detail. MANUAL MICRO ASSEMBLY & PACKAGING: Manual operations can be cost prohibitive and require a level of precision that can be impractical for an operator due to the strain it causes in the eyes and dexterity limitations associated with assembling such miniature parts under a microscope. However, for low volume special applications manual micro assembly may be the best option because it does not necessarily require the design and construction of automated micro assembly systems. AUTOMATED MICRO ASSEMBLY & PACKAGING: Our micro assembly systems are designed to make assembly easier and more cost effective, enabling the development of new applications for micro machine technologies. We can micro-assemble devices and components in the microns level dimensions using robotic systems. Here are some of our automated micro assembly & packaging equipment and capabilities: • Top notch motion control equipment including a robotic workcell with nanometric position resolution • Fully automated CAD-driven workcells for micro assembly • Fourier optics methods to generate synthetic microscope images from CAD drawings to test image processing routines under varying magnifications and depths of field (DOF) • Custom designing and production capability of micro tweezers, manipulators and actuators for precision micro assembly and packaging • Laser interferometers • Strain gages for force feedback • Real-time computer vision to control servo mechanisms and motors for the micro-alignment and micro-assembly of parts with sub-micron tolerances • Scanning Electron Microscopes (SEM) and Transmission Electron Microscopes (TEM) • 12 degrees of freedom nano manipulator Our automated micro assembly process can place multiple gears or other components on multiple posts or locations in a single step. Our micromanipulation capabilities are enormous. We are here to help you with non-standard extraordinary ideas. MICRO & NANO SELF ASSEMBLY METHODS: In self-assembly processes a disordered system of pre-existing components forms an organized structure or pattern as a consequence of specific, local interactions among the components, without external direction. The self-assembling components experience only local interactions and typically obey a simple set of rules that govern how they combine. Even though this phenomenon is scale-independent and can be utilized for self-constructing and manufacturing systems at nearly every scale, our focus is on micro self assembly and nano self assembly. For building microscopic devices, one of the most promising ideas is to exploit the process of self-assembly. Complex structures can be created by combining building blocks under natural circumstances. To give an example, a method is established for micro assembly of multiple batches of micro components onto a single substrate. The substrate is prepared with hydrophobic coated gold binding sites. To perform micro assembly, a hydrocarbon oil is applied to the substrate and wets exclusively the hydrophobic binding sites in water. Micro components are then added to the water, and assembled on the oil-wetted binding sites. Even more, micro assembly can be controlled to take place on desired binding sites by using an electrochemical method to deactivate specific substrate binding sites. By repeatedly applying this technique, different batches of micro components can be sequentially assembled to a single substrate. After the micro assembly procedure, electroplating takes place to establish electrical connections for micro assembled components. STOCHASTIC MICRO ASSEMBLY: In parallel micro assembly, where parts are assembled simultaneously, there is deterministic and stochastic micro assembly. In the deterministic micro assembly, the relationship between the part and its destination on the substrate is known in advance. In the stochastic micro assembly on the other hand, this relationship is unknown or random. Parts do self-assemble in stochastic processes driven by some motive force. In order for the micro self-assembly to take place, there need to be bonding forces, the bonding needs to occur selectively, and micro assembling parts need to be able to move so they can get together. Stochastic micro assembly is many times accompanied by vibrations, electrostatic, microfluidic or other forces that act on the components. Stochastic micro assembly is especially useful when the building blocks are smaller, because the handling of the individual components becomes more of a challenge. Stochastic self-assembly can be observed in nature as well. MICROMECHANICAL FASTENERS: At the micro scale, conventional types of fasteners like screws and hinges will not easily work due to present fabrication constraints and large friction forces. Micro snap fasteners on the other hand work more easily in micro assembly applications. Micro snap fasteners are deformable devices consisting of pairs of mating surfaces that snap together during micro assembly. Because of the simple and linear assembly motion, snap fasteners have a wide range of applications in micro assembly operations, such as devices with multiple or layered components, or micro opto-mechanical plugs, sensors with memory. Other micro assembly fasteners are “key-lock” joints and “inter-lock” joints. Key-lock joints consist of the insertion of a “key” on one micro-part, into a mating slot on another micro-part. Locking into position is achieved by translating the first micro-part within the other. Inter-lock joints are created by the perpendicular insertion of one micro-part with a slit, into another micro-part with a slit. The slits create an interference fit and are permanent once the micro-parts are joined. ADHESIVE MICROMECHANICAL FASTENING: Adhesive mechanical fastening is used to construct 3D micro devices. The fastening process includes self-alignment mechanisms and adhesive bonding. Self-alignment mechanisms are deployed in adhesive micro assembly to increase the positioning accuracy. A micro probe bonded to a robotic micromanipulator picks up and accurately deposits adhesive to target locations. Curing light hardens the adhesive. The cured adhesive keeps the micro assembled parts into their positions and provides strong mechanical joints. Using conductive adhesive, a reliable electrical connection can be obtained. The adhesive mechanical fastening only requires simple operations, and can result in reliable connections and high positioning accuracies, which are important in automatic microassembly. To demonstrate the feasibility of this method, many three-dimensional MEMS devices have been micro assembled, including a 3D rotary optical switch. KLIK Product Finder-Locator Service PAGE sadurunge

Fasteners including Anchors, Bolts, Nuts, Pin Fasteners, Rivets, Rods, Screws, Sockets, Springs, Struts, Clamps, Washers, Weld Fasteners, Hangers from AGS-TECH Fasteners Manufaktur We manufacture FASTENERS under TS16949, ISO9001 quality management system according to international standards such as ASTM, SAE, ISO, DIN, MIL. All our fasteners are shipped along with material certifications and inspection reports. We supply off-shelf fasteners as well as custom manufacture fasteners according to your technical drawings in case you require something different or special. We do provide engineering services in designing and developing specialty fasteners for your applications. Some major types of fasteners we offer are: • Anchors • Bolts • Hardware • Nails • Nuts • Pin Fasteners • Rivets • Rods • Screws • Security Fasteners • Set Screws • Sockets • Springs • Struts, Clamps, and Hangers • Washers • Weld Fasteners - CLICK HERE to download catalog for rivet nuts, blind rivet, insert nuts, nylon locknuts, welded nuts, flange nuts - CLICK HERE to download additional info-1 on rivet nuts - CLICK HERE to download additional info-2 on rivet nuts - CLICK HERE to download catalog of our titanium bolts and nuts - CLICK HERE to download our catalog containing some popular off-shelf fasteners & hardware suitable for the electronics & computer industry. - Screws and Fasteners (Standard and Specialty) (Click on the blue text above to download the brochure. We can private label these for you. In other words, we can put your name and logo on these products) - Screws for Furniture and Wood (Click on the blue text above to download the brochure. We can private label these for you. In other words, we can put your name and logo on these products) - Screws for Window and Door (Click on the blue text above to download the brochure. We can private label these for you. In other words, we can put your name and logo on these products) - Private Label Hand Tools - Hand Tool Cabinets (Click blue text above to download catalog. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. These hand tools can complement your product offerings in case you are selling fasteners) Our THREADED FASTENERS can be internally threaded as well as externally and come in various forms including: - ISO Metric Screw Thread - ACME - American National Screw Thread (Inch Sizes) - Unified National Screw Thread (Inch Sizes) - Worm - Square - Knuckle - Buttress Our threaded fasteners are available with Right- and Left-Handed Threads as well as with Single and Multiple Threads. Both Inch Threads as well as Metric Threads are available for fasteners. For Inch threaded fasteners external thread classes 1A, 2A and 3A as well as internal thread classes of 1B, 2B and 3B are available. These inch thread classes differ in the amount of allowances and tolerances. Classes 1A and 1B: These fasteners produce the loosest fit in assembly. They are used where ease of assembly and disassembly is needed such as stove bolts and other rough bolts and nuts. Classes 2A and 2B: These fasteners are fit for ordinary commercial products and interchangeable parts. Typical machine screws and fasteners are examples. Classes 3A and 3B: These fasteners are designed for exceptionally high-grade commercial products where a close fit is required. The cost of fasteners with threads in this class is higher. For metric threaded fasteners we have coarse-thread, fine-thread and a series of constant pitches available. Coarse-Thread Series: This series of fasteners are intended for use in general engineering work and commercial applications. Fine-Thread Series: This series of fasteners are for general use where a finer thread than the coarse-thread is needed. When compared to the coarse-thread screw, the fine-thread screw is stronger in both tensile and torsional strength and less likely to loosen under vibration. For the fasteners pitch and crest diameter, we have a number of tolerance grades as well as tolerance positions available. PIPE THREADS: Besides fasteners, we can machine threads on pipes according to the designation provided by you. Make sure to call out the size of thread on your technical blueprints for custom pipes. THREADED ASSEMBLIES: If you provide us threaded assembly drawings we can use our machines making fasteners for machining your assemblies. If you are unfamiliar with screw thread representations, we can prepare the blueprints for you. SELECTION OF FASTENERS: Product selection should ideally begin at the design stage. Please determine the objectives of your fastening job and consult us. Our fasteners experts will review your objectives and circumstances and recommend the right fasteners at the best in-place cost. To obtain the maximum machine-screw efficiency, a thorough knowledge of the properties of both screw and fastened materials is needed. Our fastener experts have this knowledge available to assist you. We will need from you some input such as the loads that the screws and fasteners must withstand, whether the load on the fasteners and screws is one of tension or shear, and whether the fastened assembly will be subject to impact shock or vibrations. Depending on all these and other factors such as ease of assembly, cost….etc., the recommended size, strength, head shape, thread type of the screws and fasteners will be proposed to you. Among our most common threaded fasteners are SCREWS, BOLTS and STUDS. MACHINE SCREWS: These fasteners have either fine or coarse threads and are available with a variety of heads. Machine screws can be used in tapped holes or with nuts. CAP SCREWS: These are threaded fasteners that join two or more parts by passing through a clearance hole in one part and screwing into a tapped hole in the other. Cap screws are also available with various head types. CAPTIVE SCREWS: These fasteners remain attached to the panel or parent material even when the mating part is disengaged. Captive screws meet military requirements, to prevent screws from being lost, for enabling faster assembly / disassembly and prevent damage from loose screws falling into moving parts and electrical circuits. TAPPING SCREWS: These fasteners cut or form a mating thread when driven into preformed holes. Tapping screws permit rapid installation, because nuts are not used and access is required from only one side of the joint. The mating thread produced by the tapping screw fits the screw threads closely, and no clearance is necessary. The close fit usually keeps the screws tight, even when vibration is present. Self-drilling tapping screws have special points for drilling and then tapping their own holes. No drilling or punching is needed for self-drilling tapping screws. Tapping screws are used in steel, aluminum (cast, extruded, rolled or die-formed) die castings, cast iron, forgings, plastics, reinforced plastics, resin-impregnated plywood and other materials. BOLTS: These are threaded fasteners that pass through clearance holes in assembled parts and thread into nuts. STUDS: These fasteners are shafts threaded at both ends and are used in assemblies. Two major types of studs are double-end stud and continuous stud. As for other fasteners, it is important to determine what kind of grade and finish (plating or coating) is the most suitable. NUTS: Both style-1 and style-2 metric nuts are available. These fasteners are used generally with bolts and studs. Hex nuts, hex-flanged nuts, hex-slotted nuts are popular. There are also variations within these groups. WASHERS: These fasteners perform many varied functions in mechanically fastened assemblies. Washers functions can be to span an oversized clearance hole, give better bearing for nuts and screw faces, distribute loads over larger areas, serve as locking devices for threaded fasteners, maintain spring resistance pressure, guard surfaces against marring, provide sealing function and much more. Many types of these fasteners are available such as flat washers, conical washers, helical spring washers, tooth-lock types, spring washers, special purpose types…etc. SETSCREWS: These are used as semipermanent fasteners to hold a collar, sheave, or gear on a shaft against rotational and translational forces. These fasteners are basically compression devices. Users should find the best combination of setscrew form, size, and point style that provides required holding power. Setscrews are categorized by their head style and point style desired. LOCKNUTS: These fasteners are nuts with special internal means for gripping threaded fasteners to prevent rotation. We can view locknuts basically as standard nuts, but with an added locking feature. Locknuts have many very useful application areas including tubular fastening, use of locknuts on spring clamps, use of locknut where assembly is subjected to vibratory or cyclic motions that could cause loosening, for spring mounted connections where the nut must remain stationary or is subject to adjustment. CAPTIVE OR SELF-RETAINING NUTS: This class of fasteners provide a permanent, strong, multiple-thread fastening on thin materials. Captive or self-retaining nuts are especially good when there are blind locations, and they can be attached without damaging finishes. INSERTS: These fasteners are special form nuts designed to serve the function of a tapped hole in blind or through-hole locations. Different types are available such as molded-in inserts, self-tapping inserts, external-internal threaded inserts, pressed-in inserts, thin material inserts. SEALING FASTENERS: This class of fasteners not only hold two or more parts together, but they can simultaneously offer sealing function for gases and liquids against leakage. We offer many types of sealing fasteners as well as custom designed sealed-joint constructions. Some popular products are sealing screws, sealing rivets, sealing nuts and sealing washers. RIVETS: Riveting is a fast, simple, versatile and economical method of fastening. Rivets are considered permanent fasteners as opposed to removable fasteners such as screws and bolts. Simply described, rivets are ductile metal pins inserted through holes in two or more parts and having the ends formed over to securely hold the parts. Since rivets are permanent fasteners, riveted parts cannot be disassembled for maintenance or replacement without knocking the rivet out and installing a new one in place for reassembly. The type of rivets available are large and small rivets, rivets for aerospace equipment, blind rivets. As with all fasteners we sell, we do help our customers in the design and product selection process. From the type of rivet suitable for your application, to the speed of installation, in-place costs, spacing, length, edge distance and more, we are capable to assist you in your design process. Reference Code: OICASRET-GLOBAL, OICASTICDM KLIK Product Finder-Locator Service PAGE sadurunge

Metal Stamping & Sheet Metal Fabrication, Zinc Plated Metal Stamped Parts, Wire and Spring Forming Metal Stamping & Sheet Metal Fabrikasi Seng dilapisi bagean prangko Stamping presisi lan mbentuk kawat Stamping logam presisi sing dilapisi seng Precision prangko bagean AGS-TECH Inc. presisi logam stamping Sheet Metal Fabrication dening AGS-TECH Inc. Sheet Metal Rapid Prototyping dening AGS-TECH Inc. Stamping saka washers ing volume dhuwur Pangembangan lan manufaktur omah Filter lenga sheet metal Fabrikasi komponen lembaran logam kanggo Filter lenga lan perakitan lengkap Pabrikan khusus lan perakitan produk lembaran logam Fabrikasi Head Gasket dening AGS-TECH Inc. Fabrikasi Set Gasket ing AGS-TECH Inc. Fabrikasi kandang lembaran logam - AGS-TECH Inc Prasaja Single lan Progressive Stamping saka AGS-TECH Inc. Stamping saka Metal lan Metal Alloys - AGS-TECH Inc Bagean lembaran logam sadurunge rampung operasi Sheet Metal Forming - Enclosure Listrik - AGS-TECH Inc Manufaktur Titanium Coated Cutting Blades kanggo Industri Pangan Fabrikasi Skiving Blades kanggo Industri Kemasan Pangan PAGE sadurunge

We offer a large variety of cutting tools, drilling tools, grinding tool, polishing tools, lapping, dicing tool, material shaping tools, blades, drill bits, and more Alat Cutting, Drilling, Grinding, Lapping, Polishing, Dicing lan Shaping We have a wide selection of cutting, grinding, lapping, polishing, dicing and shaping tools that can be used in machine shops, auto mechanics, by carpenter's, construction sites, equipment manufacturers....etc. Our cutting, drilling, grinding, lapping, polishing, dicing and shaping tools, blades, discs, drill bits... are manufactured at ISO9001 or TS16949 certified plants and conform to internationally accepted industry standards. Please click on the highlighted text below to move to the relevant submenu: Hole Saws Metal Cutting & Shaping Tools Wood Cutting Shaping Tools Masonry Cutting Shaping Tools Cutting & Grinding Disc Diamond Tools Glass Cutting Shaping Tools Gear Cutting Shaping Tools Specialty Cutting Tools Equipment to Cut Drill Polish Waca liyane Waca liyane Read More Waca liyane Waca liyane Waca liyane Waca liyane Waca liyane Waca liyane Waca liyane KLIK Product Finder-Locator Service PAGE sadurunge

Clutch, Brake, Friction Clutches, Belt Clutch, Dog Clutch, Hydraulic Clutch, Electromagnetic Clutch, Overruning Clutch, Wrap Spring Clutch, Frictional Brake Kopling & Brake Assembly CLUTCHES are a type of coupling that permit shafts to be connected or disconnected as desired. A CLUTCH is a mechanical device that transmits power and motion from one component (the driving member) to another (the driven member) when engaged, but can be disengaged when desired. Clutches are used whenever the transmission of power or motion needs to be controlled either in amount or over time (for example electric screwdrivers use clutches to limit how much torque is transmitted through; automobile clutches control transmitted engine power to the wheels). In simplest applications, clutches are employed in devices which have two rotating shafts (drive shaft or line shaft). In these devices, one shaft is typically attached to a motor or other type of power unit (the driving member) while the other shaft (the driven member) provides output power for work to be done. As an example, in a torque-controlled drill, one shaft is driven by a motor and the other drives a drill chuck. The clutch connects the two shafts so that they may be locked together and spin at the same speed (engaged), locked together but spinning at different speeds (slipping), or unlocked and spinning at different speeds (disengaged). We offer the following types of clutches: FRICTION CLUTCHES: - Multiple plate clutch - Wet & dry - Centrifugal - Cone clutch - Torque limiter BELT CLUTCH DOG CLUTCH HYDRAULIC CLUTCH ELECTROMAGNETIC CLUTCH OVERRUNING CLUTCH (FREEWHEEL) WRAP-SPRING CLUTCH Contact us for clutch assemblies to be used in your manufacturing line for motorcycles, automobiles, trucks, trailers, lawn movers, industrial machines...etc. BRAKES: A BRAKE is a mechanical device inhibiting motion. Most commonly brakes use friction to convert kinetic energy into heat, though other methods of energy conversion may also be employed. Regenerative braking converts much of the energy to electrical energy, which may be stored in batteries for later use. Eddy current brakes use magnetic fields to convert kinetic energy into electric current in the brake disc, fin, or rail, which is subsequently converted into heat. Other methods of brake systems convert kinetic energy into potential energy in such stored forms as pressurized air or pressurized oil. There are braking methods that transform kinetic energy into different forms, such as transferring the energy to a rotating flywheel. Generic Types of brakes we offer are: FRICTIONAL BRAKE PUMPING BRAKE ELECTROMAGNETIC BRAKE We have the capability to design and fabricate custom clutch and break systems tailored to your application. - Download our catalog for Powder Clutches and Brakes and Tension Control System by CLICKING HERE - Download our catalog for Non-Excited Brakes by CLICKING HERE Click on the links below to download our catalog for: - Air Disk and Air Shaft Brakes & Clutches and Safety Disc Spring Brakes - pages 1 to 35 - Air Disk and Air Shaft Brakes & Clutches and Safety Disc Spring Brakes - pages 36 to 71 - Air Disk and Air Shaft Brakes & Clutches and Safety Disc Spring Brakes - pages 72 to 86 - Electromagnetic Clutch and Brakes CLICK Product Finder-Locator Service PAGE sadurunge

Rubber and Elastomer Molds & Molding, Rubber Injection Molding, Rubber Toy Manufacturing Karet lan Elastomer Molds & Molding Bagian cetakan injeksi karet dipasang karo bagean logam liyane. Kita nggawe cetakan lan alat kanggo ngasilake bagean khusus sampeyan. Déwan mekanik kanthi komponen cetakan injeksi karet. Kabeh perakitan diprodhuksi dening AGS-TECH Inc. Dolanan karet diprodhuksi dening AGS-TECH Inc. Bagean khusus digawe saka macem-macem bahan karet Cetakan Karet Kustom Mats Otomotif kanggo Salah sawijining Pelanggan - AGS-TECH Inc - Dolan maring kita ing www.agstech.net Komponen karet sing dicetak dirakit dadi barang olahraga. Kabeh komponen sing diprodhuksi lan dirakit dening AGS-TECH Inc. Pabrikan Sabuk Karet dening AGS-TECH Inc. Manufaktur O-Ring ing AGS-TECH Inc. Mould O-Ring Kits Bagian Karet Ekstrusi saka EPDM - NBR - CR - SILIKON - PVC - TPE - TPV Ekstrusi Karet saka EPDM - NBR - CR - SILIKON - PVC - TPE - TPV digawe dening AGS-TECH Ekstrusi saka EPDM - NBR - CR - SILIKON - PVC - TPE - TPV Bagian Karet Cetakan saka EPDM - NBR - CR - SILIKON - PVC - TPE - TPV Karet Ekstrusi digawe saka EPDM - NBR - CR - SILIKON - PVC - TPE - TPV PAGE sadurunge

AGS-TECH Inc. Quoting Process for Custom Manufactured Components, Subassemblies, Assemblies and Products Carane kita Quote Projects? Kutipan Komponen, Majelis lan Produk sing Diproduksi Khusus Quoting off-shelf products is simple. However, more than half of the enquiries we receive are manufacturing requests for non-standard components, assemblies and products. These are categorized as CUSTOM MANUFACTURING PROJECTS. We receive from our existing as well as new potential customers RFQs (Request for Quote) and RFPs (Request for Proposals) for new projects, parts, assemblies and products on a continuous daily basis. Having to deal with out-of-the-ordinary manufacturing requests for many years, we have developed an efficient, fast, accurate quotation process that covers a wide spectrum of technologies. AGS-TECH Inc. is the World’s MOST DIVERSE ENGINEERING INTEGRATOR. The most outstanding advantage we offer you is being a one-stop source for all your manufacturing, fabrication, engineering, integration needs. QUOTING PROCESS at AGS-TECH Inc: Let us provide you some basic information about our quoting process for custom manufactured components, assemblies and products, so that when you send us RFQ and RFPs, you will better know what we need to know to provide you the most accurate quotes. Please keep in mind that the more accurate our quote is, the lower the prices will be. Ambiguities will only result in us quoting higher prices so we do not have losses at the end of a project. Understanding the quotation process will help you for all purposes. When an RFQ or RFP for a custom part or product is received by AGS-TECH Inc’s sales department, it is immediately scheduled for engineering review. Reviews take place on a daily basis and even several of these may be scheduled for a day. Participants to these meetings come from various departments such as planning, quality control, engineering, packaging, sales…etc and each makes its contribution for accurate calculation of lead times and cost. When various contributors to cost and standard lead times are added up, we come up with a total cost & lead time, from which a formal quote is drafted. The actual process involves of course much more than this. Each participant to the engineering meeting receives a preliminary document ahead of the meeting summarizing the projects that will be reviewed at a particular time and does his / her own estimations prior to the meeting. In other words, participants come prepared to these meetings and after reviewing all information as a group, refinements and adjustments are made and final numbers are calculated. Team members use advanced software tools such as GROUP TECHNOLOGY, to aid them to obtain the most accurate numbers for each quote prepared. Using Group Technology, new part designs can be developed using already existing and similar designs, thus saving a significant amount of time and work. Product designers can determine very fast whether data on a similar component already exists in the computer files. Custom manufacturing costs can more easily be estimated and the relevant statistics on materials, processes, number of parts produced, and other factors can easily be obtained. With Group Technology, process plans are standardized and scheduled more efficiently, orders are grouped for more efficient production, machine utilization is optimized, set-up times are lowered, components and assemblies are manufactured more efficiently and with higher quality. Similar tools, fixtures, machines are shared in the production of a family of parts. Since we have manufacturing operations at multiple plants, Group Technology also helps us determine which plant is the most suitable for a particular manufacturing request. In other words, the system compares and matches available equipment at each plant with the requirements of a particular part or assembly and determines which of our plant or plants are the best fit for that planned work order. Even geographic proximity of the plants to the products shipping destination and shipping prices are taken into account by our computer integrated system. Together with Group Technology, we implement CAD/CAM, cellular manufacturing, computer integrated manufacturing and improve productivity and reduce costs even in small-batch production approaching mass production prices per piece. All these capabilities along with manufacturing operations in low-cost countries enables AGS-TECH Inc., the World’s most diverse engineering integrator to provide the most outstanding quotations for custom manufacturing RFQs. Other powerful tools we use in our quoting process of custom manufactured components are COMPUTER SIMULATIONS of MANUFACTURING PROCESSES and SYSTEMS. A process simulation can be: -A model of a manufacturing operation, for the purpose of determining the viability of a process or for improving its performance. -A model of multiple processes and their interactions to help our process planners optimize process routes and layout of machinery. Frequent problems addressed by these models include process viability such as assessing the formability and behavior of a certain gauge sheet metal in a certain pressworking operation or process optimization such as analyzing the metal-flow pattern in a die forging operation to identify potential defects. This kind of information obtained help our estimators better determine whether we should quote a particular RFQ or not. If we determine to quote it, these simulations give us a better idea about the expected yields, cycle times, prices and lead times. Our dedicated software program simulates an entire manufacturing system that involves multiple processes and equipment. This helps identify critical machinery, assists in scheduling and routing of work orders and eliminates potential production bottlenecks. Scheduling and routing information obtained helps us in our quotation of RFQs. The more accurate our info is, the more accurate and lower our quoted prices will be. WHAT INFORMATION SHOULD CUSTOMERS PROVIDE AGS-TECH Inc. TO GET THE BEST PRICE QUOTE WITHIN SHORTEST TIME ? Best quotation is the one with lowest possible price (with no sacrifice on quality), shortest or customer preferred lead time formally provided to customer quickly. Providing the best quotation is always our goal, however it depends on you (the customer) just as much as on us. Here is the information we would expect from you when you send us a Request for Quote (RFQ). We may not need all of these to quote your components and assemblies, but the more of these you can provide the more likely it is that you will receive a very competitive quotation from us. - 2D Blueprints (technical drawings) of parts and assemblies. Blueprints should clearly show dimensions, tolerances, surface finish, coatings if applicable, material information, blueprint revision number or letter, Bill of Materials (BOM), part view from different directions…etc. These can be in PDF, JPEG format or else. - 3D CAD files of parts and assemblies. These can be in DFX, STL, IGES, STEP, PDES format or else. - Quantities of parts for quote. Generally, the higher the quantity the lower will be the price in our quote (please be honest with your actual quantities for quote). - If there are off-the-shelf components that are assembled with your parts, please feel free to include them in your blueprints. If assembly is complicated, separate assembly blueprints help us much in the quotation process. We may buy and assemble the off-shelf components into your products or custom manufacture depending on the economic viability. In any case we can include those in our quote. - Clearly indicate whether you want us to quote individual components or a subassembly or an assembly. This will save us time and hassle in the quotation process. -Shipping address of parts for quote. This helps us quote shipping in case you do not have a courier account or forwarder. - Indicate whether it is a batch production request or a long term repeat order that is planned. A repeat order over long term generally receives a better price quotation. A blanket order does generally also receive a better quote. - Indicate whether you want special packaging, labeling, marking…etc of your products. Indicating all your requirements in the beginning will save both parties time and effort in the quotation process. If not indicated at the beginning, we will likely need to re-quote later and this will only delay the process. - If you need us to sign an NDA prior to quoting your projects, please email them over to us. We gladly accept signing NDAs prior to quoting projects that have confidential content. If you do not have an NDA, but need one, just tell us and we will send it to you prior to quoting. Our NDA covers both sides. WHAT PRODUCT DESIGN CONSIDERATIONS SHOULD CUSTOMERS HAVE GONE THROUGH TO GET THE BEST PRICE QUOTE WITHIN SHORTEST TIME ? Some fundamental design considerations customers should take into account for obtaining the best quotation are: - Is it possible to simplify product design and reduce the number of components for a better quote without adversely affecting intended functions and performance ? - Were environmental considerations taken into account and incorporated into material, process and design ? Environmentally polluting technologies have higher tax burdens and disposal fees and thus indirectly result in us quoting higher prices. - Have you investigated all alternative designs ? When you send us a request for quote, please feel free to ask whether changes in design or material would make the price quote lower. We will review and give you our feedback about the effect of modifications on the quote. Alternatively you may send us several designs and compare our quotation on each. - Can unnecessary features of the product or its components be eliminated or combined with other features for a better quote ? - Have you considered modularity in your design for a family of similar products and for service and repairs, upgrading and installation ? Modularity can make us quote lower overall prices as well as reduce service and maintenance costs in the long term. For example a number of injection molded parts made of the same plastic material can be manufactured using mold inserts. Our price quotation for a mold insert is much lower than for a new mold for each part. - Can the design be made lighter and smaller ? Lightweight and smaller size not only results in better product quotation, but also saves you much on shipping cost. - Have you specified unnecessary and excessively stringent dimensional tolerances and surface finish ? The tighter the tolerances, the higher the price quote. The more difficult and tighter the surface finish requirements, again the higher the price quote. For the best quote, keep it as simple as needed. - Will it be excessively difficult and time consuming to assemble, disassemble, service, repair and recycle the product ? If so, the price quote will be higher. So again keep it as simple as possible for the best price quote. - Have you considered subassemblies ? The more value added services we add to your product such as subassembly, the better our quote will be. The overall cost of procurement will be much higher if you have several manufacturers get involved in quoting. Have us do as much as possible and for sure you will obtain the best price quote that is potentially out there. - Have you minimized the use of fasteners, their quantities and variety ? Fasteners result in higher price quotation. If easy snap-on or stacking features can be designed into the product it may result in a better price quote. - Are some of the components commercially available ? If you have an assembly for quote, please indicate on your drawing if some components are available off-the-shelf. Sometimes it is less expensive if we buy and incorporate these components instead of manufacturing them. Their manufacturer may be producing them in high volume and give us a better quote than us manufacturing them from scratch especially if the quantities are small. - If possible, choose the safest materials and designs. The safer it is, the lower will be our price quote. WHAT MATERIAL CONSIDERATIONS SHOULD CUSTOMERS HAVE GONE THROUGH TO GET THE BEST PRICE QUOTE WITHIN SHORTEST TIME ? Some fundamental material considerations customers should take into account for obtaining the best quotation are: - Did you select materials with properties that unnecessarily exceed minimum requirements and specifications ? If so, the price quote may be higher. For the lowest quote, try to use the least expensive material that meets or exceeds expectations. - Can some materials be replaced with less expensive ones ? This naturally lowers the price quote. - Do the materials you selected have the appropriate manufacturing characteristics ? If so, the price quote will be lower. If not, it may take more time to manufacture the parts, and we may have more tool wear and thus a higher price quote. In short, there is no need to make a part from tungsten if aluminum does the job. - Are raw materials needed for your products available in standard shapes, dimensions, tolerances, and surface finish ? If not, the price quote will be higher due to additional cutting, grinding, processing…etc. - Is the material supply reliable ? If not, our quotation may well be different each time you reorder the product. Some materials have rapidly and significantly changing prices in the global marketplace. Our quote will be better if the material used is plenty and has a stable supply. - Can the raw materials chosen be obtained in the required quantities in the desired timeframe ? For some materials, raw material suppliers have Minimum Order Quantities (MOQ). Therefore if quantities you requested are low, it may be impossible for us to get a price quote from the material supplier. Again, for some exotic materials, our procurement lead times may be too long. - Some materials are able to improve assembly and even facilitate automated assembly. This may result in a better price quote. For example a ferromagnetic material may easily be picked and placed with electromagnetic manipulators. Consult with our engineers if you do not have internal engineering resources. Automation can lead to a much better quote especially for high volume production. - Choose materials that increase stiffness-to-weight and strength-to-weight ratios of structures whenever possible. This will require less raw material and thus make a lower quotation possible. - Comply with legislation and laws prohibiting the use of environmentally destructive materials. This approach will eliminate high disposal fees for destructive materials and thus make a lower quotation possible. - Choose materials that reduce performance variations, environmental sensitivity of products, improve robustness. This way, there will be less manufacturing scrap and rework and we can quote much better prices. WHAT MANUFACTURING PROCESS CONSIDERATIONS SHOULD CUSTOMERS HAVE GONE THROUGH TO GET THE BEST PRICE QUOTE WITHIN SHORTEST TIME ? Some fundamental process considerations customers should take into account for obtaining the best quotation are: - Have you considered all alternative processes ? Price quote can be surprisingly lower for some processes as compared to others. Therefore, unless necessary, leave the process decision to us. We prefer to quote you considering the lowest cost option. - What are the ecological impacts of the processes ? Try to choose the most ecologically friendly processes. This will result in a lower price quotation because of lower environment related fees. - Are the processing methods considered economical for the type of material, shape produced, and production rate ? If these match well with the processing method, you will receive a more appealing quotation. - Can requirements for tolerances, surface finish, and product quality be met consistently ? The more the consistency, the lower our price quotation and the shorter the lead time. - Can your components be produced to final dimensions without additional finishing operations ? If so, this will give us the opportunity to quote lower prices. - Is the tooling required available or manufacturable at our plants ? Or can we purchase it as an off-shelf item ? If so, we can quote better prices. If not we will need to procure and add it to our quotation. For best quote, try to keep designs and required processes as simple as possible. - Did you think of minimizing the scrap by choosing the right process ? The lower the scrap the lower the quoted price ? We may be able to sell some scrap and deduct from the quote in some cases, but most of the scrap metal and plastics produced during processing are of low value. - Give us the opportunity to optimize all processing parameters. This will result in a more appealing quote. For example, if four weeks lead time is good for you, don’t insist on two weeks which will force us to machine parts faster and therefore have more tool damage, as this will be calculated into the quotation. - Have you explored all the automation possibilities for all phases of the production ? If not, reconsidering your project along these lines can result in a lower price quote. - We implement Group Technology for parts with similar geometries and manufacturing attributes. You will receive a better quotation if you send over RFQs for more parts with similarities in geometry and design. If we evaluate them at the same time together, we will most likely quote lower prices for each (with the condition that they are ordered together). - If you have special inspection and quality control procedures to be implemented by us, make sure they are useful and not misleading. We cannot take responsibility for mistakes arising due to ill-designed procedures imposed on us. Generally speaking, our quotation is more appealing if we implement our own procedures. - For high volume production, our quote will be better if we manufacture all components in your assembly. However, sometimes for low volume production, our final quote can be lower if we can purchase some of the standard items that go into your assembly. Consult with us prior to making a decision. You can watch our Youtube video presentation "How You Can Receive Best Quotes from Custom Manufacturers" by clicking on the highlighted text. You can download a Powerpoint presentation version of the above video "How You Can Receive Best Quotes from Custom Manufacturers" by clicking to the highlighted text. PAGE sadurunge

Cams, Followers, Linkages, Ratchet Wheels Manufacturing, OD or Plate Cam, Barrel Conjugate Dual Cam, Harmonic Transformer, Positive Motion Cam - AGS-TECH Inc. Cams & Followers & Linkages & Manufaktur Roda Ratchet CAMS / FOLLOWERS / LINKAGES / RATCHET WHEELS: A CAM is a machine element designed to generate a desired motion in a follower by means of direct contact. Cams are generally mounted on rotating shafts, even though they can be used so that they remain stationary and the follower moves about them. Cams may also produce oscillating motion or may convert motions from one form to another. The shape of a cam is always determined by the motion of the CAM FOLLOWER. A cam is the end product of a desired follower movement. A MECHANICAL LINKAGE is an assembly of bodies connected to manage forces and movement. Combinations of the crank, link, and sliding elements are commonly termed bar linkages. Linkages are essentially straight members joined together. Only a small number of dimensions need to be held closely. The joints make use of standard bearings, and the links in effect form a solid chain. Systems having cams and linkages convert rotary motion into reciprocating or oscillating motion. RATCHET WHEELS are used to transform reciprocating or oscillatory motion into intermittent motion, to transmit motion in one direction only, or as an indexing device. We offer our customers the following TYPES OF CAMS: - OD or plate cam - Barrel cam (drum or cylinder) - Dual cam - Conjugate cam - Face cam - Combination drum and plate cam - Globoidal cam for automatic tool changer - Positive motion cam - Indexing drive - Multi - station drive - Geneva - type drives We have the following CAM FOLLOWERS: - Flat face follower - Radial follower / Offset radial follower - Swinging follower - Conjugate radial dual roller followers - Closed-cam follower - Spring-loaded conjugate cam roller - Conjugate swing arm dual-roller follower - Index cam follower - Roller followers (round, flat, roller, offset roller) - Yoke - type follower Click here to download our brochure for Cam Followers Some of the MAJOR TYPES OF MOTIONS produced by our cams are: - Uniform motion (constant - velocity motion) - Parabolic motion - Harmonic motion - Cycloidal motion - Modified trapezoidal motion - Modified sine-curve motion - Synthesized, modified sine - harmonic motion Cams have advantages over kinematic four-bar linkages. Cams are easier to design and actions produced by cams can be more accurately forecast. For example, with linkages it is very difficult to cause the follower system to remain stationary during portions of cycles. On the other hand, with cams this is accomplished by a contour surface that runs concentric with the rotation center. We design cams with special computer programs accurately. With standard cam motions we can produce a predetermined motion, velocity and acceleration during a specific portion of a cam cycle, which would be much more difficult using linkages. When designing high quality cams for fast machines, we take into account proper dynamic design considering velocity, acceleration and jerk characteristics of the follower system. This includes vibrational analysis as well as shaft torque analysis. Also of utmost importance are proper material selection for cams taking into account factors such as stresses present, wear, lifetime and cost of the system where the cams will be installed. Our software tools and design experience allows us to optimize cam size for best performance and material & cost savings. To produce master cams, we prepare or obtain from our clients a table of cam radii with corresponding cam angles. Cams are then cut on a milling machine by point settings. As a result, a cam surface with a series of ridges is obtained which is subsequently filed down to a smooth profile. The cam radius, cutting radius and frequency of machine settings determine the extent of filing and accuracy of the cam profile. To produce accurate master cams, settings are in 0.5 degree increments, calculated to seconds. Cam size depends primarily on three factors. These are the pressure angle, curvature of profile, camshaft size. Secondary factors affecting cam size are cam-follower stresses, available cam material and space available for the cam. A cam is of no value and useless without a follower linkage. A linkage is generally a group of levers and links. Linkage mechanisms offer a number of advantages over cams, with the exception that the functions must be continuous. LINKAGES we offer are: - Harmonic transformer - Four-bar linkage - Straight-line mechanism - Cam linkage / Systems having linkages and cams Click on highlighted text to download our catalog for our NTN Model Constant Velocity Joints for Industrial Machines Download Catalog of Rod Ends and Spherical Plain Bearings Ratchet wheels are used to transform reciprocating or oscillating motion to intermittent motion, to transmit motion in one direction only or as indexing devices. Ratchets are generally lower in cost than cams and a ratchet has different capabilities than a cam. When motion needs to be transmitted at intervals instead of continuously and if the loads are light, ratchets can be ideal. RATCHET WHEELS we offer are: - External ratchet - U-shaped pawl - Double-acting rotary ratchet - Internal ratchet - Friction ratchet - Sheet metal ratchet and pawl - Ratchet with two pawls - Ratchet assemblies (wrench, jack) KLIK Product Finder-Locator Service PAGE sadurunge

Filters for Pneumatics Hydraulics - Treatment Components - Air-Preparation Units - Filtration Systems - Regulators Filter & Komponen Perawatan FILTERS remove dirt, water, and other contaminants that can decrease the efficiency and eventually destroy pneumatic and hydraulic equipment. Our filters have high dirt-holding capacity for long life, improved flow paths that lead to better energy efficiency, and some filters can even alert users when they need maintenance. TREATMENT COMPONENTS on the other hand include devices such as regulators, mist separators, dryers, lubricators, adsorber lters eliminating odors. Both off-shelf as well as custom manufactured filters and treatment components can be sourced from us. PNEUMATIC FILTERS and TREATMENT COMPONENTS: Repairable-inline-filters protect small air tools including grinders, impact wrenches, and screwdrivers. The light and compact aluminum units can install directly before an air tool. Repairable inline filters extend tool life and reduce downtime by capturing foreign particles in the air stream. Repairable inline filters can also be used in low-pressure hydraulic applications. Our other Air-Preparation Units have a lightweight polymer construction and smooth surfaces, and are useful in industries like food and packaging. These includes filter choices of activated carbon, as well as regulators, lubricators, and other modular components that permit standard and custom combinations. Air-preparation units can be customized with lockout or soft-start valves, distribution blocks, filter-regulator combinations, and other accessories. Rapid-clamping system lets users of our filter systems remove and replace one element from the group without disassembling the others. Some of our systems include filters that use centrifugal forces to force water and large solid particles against the side of the housing, where they collect and eventually precipitate to the lower part of the bowl. The air filter captures smaller particles. The units also include adjustable regulators and lubricators that control oil dispersal with an adjustable needle valve. Variations include stacking filters and regulators, bowl and drain options. Metal bowls and bowl guards are now available for modular air-preparation products, in addition to standard polycarbonate bowls. The metal bowls have nylon sight tubes and manual or auto drains for filters. Air-preparation units can include a filters, mist separators, regulators, and lubricators in various combinations. Some of our modular units include pressure regulators, on/off and soft-start valves, filters, dryers, and lubricators, as well as integrated sensors for remote adjustability and monitoring. Differential pressure gages warn users when pressure drop exceeds a certain value and the element should be changed. All our modules can be replaced without disassembling the entire system. Some units can be combined with soft-start and quick-exhaust valves for rapid venting during an emergency shutdown in safety-critical areas. Our Stainless Steel Air Preparation Units include filters with all metal SS 316 stainless steel components, including internal components. All particulate filters use dense-pack elements to ensure maximum impaction, minimal pressure drop, and long duty life. The stainless steel units resist chemical degradation and are well suited for food & beverage, pharmaceutical, natural gas, wastewater-treatment and marine applications. Our Stainless Steel Three-Stage Filtration Systemremoves water vapor, particulates, and oil from compressed air and hydrocarbon gases in corrosive environments. It is designed for applications where clean and dry air is critical to protect downstream equipment and sensitive instruments from premature failure. The three-stage filtration system has two general-purpose filters that remove particles and water, and a third filter, a stainless-steel coalescer, removing oil. Some of our filters are for high-flow applications. Our High-Flow Filters are suited for heavy-duty applications that demand minimum pressure drop. Large filter-element surfaces provide low pressure drop and long life, and an internal deflector plate creates swirling of the air stream to ensure efficient water and dirt separation. Our high-flow filters deploy large-capacity bowls that minimize maintenance operations. Our Compact Modular-Style Air Filters combine the element and bowl in one piece, simplifying element replacement. The units are much smaller compared to others and reduce space requirements. Their bowl is covered with a transparent bowl guard, allowing 360 degrees circumferential monitoring. The modular design permits simple connection with other air-preparation and treatment components. The Energy Efficient Filters are designed to minimize pressure losses and reduce the operating costs of pneumatic systems. The housing’s “bell-mouth” inlet provides a smooth, turbulent-free transition that lets air enter the filters without restriction. A smooth 90° elbow directs air into the filter element, reducing turbulence and pressure losses. Some models of our energy efficient filters also include aerospace turning vanes which efficiently channel air throughout the filter; and upper flow distributors and lower conical diffusers which provide turbulent-free flow through the entire media, including the lowest section of the element. This further increases filters performance and reduces energy consumption. Deep-pleated elements and specially treated filtration media have much much greater filtration surface area compared to conventional wrapped filters and typical pleated filter elements. The elements significantly reduce pressure losses and energy consumption in these filters. HYDRAULIC FILTERS and TREATMENT COMPONENTS: Over 90% of all hydraulic system failures are caused by contaminants in the fluids. Even when immediate failures do not occur, high contamination levels can drastically decrease operating efficiency. Contamination, which is foreign materials, particles, substances in a fluid system, can exist as a gas, liquid or solid. High contamination levels accelerate component wear, decrease service life and increase maintenance costs. Contaminants either enter the system from outside (ingestion) or are generated from within (ingression). New systems often have contaminants left behind from manufacturing and assembly operations. If they are not filtered as they enter the circuit, both the original fluid and make-up fluids are likely to contain more contaminants than the system can tolerate. Most systems ingest contaminants through components such as inefficient air breathers and worn cylinder rod seals during operation. Airborne contaminants can gain admittance during routine servicing or maintenance, friction and heat can also produce internally generated contamination. Pick up high-quality hydraulic filters from AGS-TECH to help keep your hydraulic fluid reservoir safe from particle and water vapor damage. Shop with us and you'll find hydraulic spin-on filter heads with a variety of filter ratings. You can trust us to provide you with high-quality hydraulic filters to help you keep your systems running smoothly. AGS-TECH can help you select the correct filters which will provide the optimal cleanliness solution for your hydraulic system. We supply different types of hydraulic filters: • Suction filters • Return line filters • Bypass filter systems • Pressure filters • Fillers and breathers • Filter elements We also supply interchange elements at competitive prices and equivalent or better quality compared to the OEM's originally installed hydraulic filter elements. AGS-TECH Inc. can also supply the indicators that monitor a system's contamination levels. Contamination indicators ensure that our customers can maintain the cleanliness of their hydraulic systems and their filters efficiency and condition. Suction Filters: The suction filters provide protection of the hydraulic pumps from particles larger than 10 microns. Suction filters are useful if there is any likelihood of pump damage due to larger particles or pieces of dirt. This can occur when it is difficult to clean the tank or if several hydraulic systems use the same tank for oil supply. Characteristics of suction filters are their low cost, servicing difficulty, because mounting is below fluid level, grade of filtration which is coarse filtration, 25 to 90 microns using stainless steel filter mesh, 10 microns using paper, 10 to 25 microns using glass fiber, they are equipped with bypass check valves and have very low opening pressures. Pressure Line Filters: They are also referred to as a high pressure filters, and are most commonly used in a hydraulic systems. Pressure line filters are also equipped with bypass check valves. When pressure line filters are installed directly in the back of pumps, they act as the main filters for the complete flow and protect hydraulic components against wear. Characteristics of pressure line filters are their medium cost, high grade of filtration, easy use of clogging indicators, their grade of filtration which is the finest level, 25 to 660 microns using stainless steel filter mesh, 1 to 20 microns using paper / glass fiber and polyester, they are equipped with bypass check valves that open at 7 bar (maximum). Pressure line filters act as safety filters when installed in front of an endangered component such as a servo control valve. To ensure maximum functionality of these critical components, the normal practice is that the pressure line safety filter must be fitted as close as possible to the component it is protecting. Return Line Filters: Almost every hydraulic system uses return line filters which are designed to mount directly onto the tank cover. Therefore, you can easily replace filter element(s) when needed. Users select return line filter based on the maximum flow of the hydraulic system. Characteristics of a return line filter are their low cost, ease of servicing, no downtime because they incorporate duplex filters, their grade of fine filtration, 40 to 90 microns using stainless steel filter mesh, 10 microns using filter paper, 10 to 25 microns using glass fiber, return line filters are equipped with a bypass check valve that opens at 2 bar (maximum). Bypass Filtration: Hydraulic systems use bypass filters as main flow filters, i.e. system filters or working filters. These systems generally consist of bypass units complete with pumps, filters and oil coolers. Bypass filters are also used in mobile hydraulics and are connected to the pressure side of the system. Flow control valves ensure constant flow with low-flow pulsations. Characteristics of bypass filters are their high costs, high returns due to improved component lifetime and slowing down of the ageing process of the hydraulic fluids, very high grade of filtration around 0.5 microns, silt removal from the fluid, flow through bypass filters are completely free of pressure shocks, possibility of offline filtration. With 0.5 micron filtration capability, bypass filters allow very dense hydraulic filtration by removing even the smallest dirt particles. Silt would otherwise degrade the dopes, that are added to the hydraulic oil to form a protecting layer for the moving parts of the system. Fillers and Breathers: Breathers or fillers are used when the air compresses or expands due to increasing/decreasing levels of fluid in the tank. The function of a breather is to filter the air flowing in and out of the tank. Breathers may be designed to work as fillers. Breathers are currently considered to be the most important components for filtration in hydraulic systems. A large amount of ambient contamination enters hydraulic systems through low quality ventilation devices. Other measures, such as the pressurization of oil tanks, are generally speaking uneconomic when compared to the highly effective breathers we have. Contamination Indicators: The grade of filtration determines the level of contamination in filters. Contamination indicators can determine the level of contamination in filters. Contamination indicators consist of a sensor and warning device. Generally, the hydraulic fluid enters the inlet of the filter, passes through the filter element, and leaves the filter through the outlet. As the fluid passes through the filter element, impurities are deposited on the outside of the element. With accumulating deposits, a differential pressure is build up between the inlet and outlet of the filter. The pressure is sensed across the contamination indicator switch, and actuates a warning device such as flashing lights. When warning signal is observed or heard, the hydraulic pump is stopped and the filter serviced, cleaned, or replaced. Filters with a grade of filtration of 1 micron are more vulnerable to clogging than filters with a filtration grade of 10 microns. Please click on highlighted text below to download our product brochures for pneumatic filters: - Pneumatic Filters - Private Label Industrial Filters (We can put your company name and logo on these filters) CLICK Product Finder-Locator Service GAUGE sadurunge

Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. Mikroelektronika & Semikonduktor Manufaktur lan Fabrikasi Many of our nanomanufacturing, micromanufacturing and mesomanufacturing techniques and processes explained under the other menus can be used for MICROELECTRONICS MANUFACTURING too. However due to the importance of microelectronics in our products, we will concentrate on the subject specific applications of these processes here. Microelectronics related processes are also widely referred to as SEMICONDUCTOR FABRICATION processes. Our semiconductor engineering design and fabrication services include: - FPGA board design, development and programming - Microelectronics foundry services: Design, prototyping and manufacturing, third-party services - Semiconductor wafer preparation: Dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection - Microelectronic package design and fabrication: Both off-shelf and custom design and fabrication - Semiconductor IC assembly & packaging & test: Die, wire and chip bonding, encapsulation, assembly, marking and branding - Lead frames for semiconductor devices: Both off-shelf and custom design and fabrication - Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication - Sensor & actuator design and fabrication: Both off-shelf and custom design and fabrication - Optoelectronic & photonic circuits design and fabrication Let us examine the microelectronics and semiconductor fabrication and test technologies in more detail so you can better understand the services and products we are offering. FPGA Board Design & Development and Programming: Field-programmable gate arrays (FPGAs) are reprogrammable silicon chips. Contrary to processors that you find in personal computers, programming an FPGA rewires the chip itself to implement user’s functionality rather than running a software application. Using prebuilt logic blocks and programmable routing resources, FPGA chips can be configured to implement custom hardware functionality without using a breadboard and soldering iron. Digital computing tasks are carried out in software and compiled down to a configuration file or bitstream that contains information on how the components should be wired together. FPGAs can be used to implement any logical function that an ASIC could perform and are completely reconfigurable and can be given a completely different “personality” by recompiling a different circuit configuration. FPGAs combine the best parts of application-specific integrated circuits (ASICs) and processor-based systems. These benefits include the following: • Faster I/O response times and specialized functionality • Exceeding the computing power of digital signal processors (DSPs) • Rapid prototyping and verification without the fabrication process of custom ASIC • Implementation of custom functionality with the reliability of dedicated deterministic hardware • Field-upgradable eliminating the expense of custom ASIC re-design and maintenance FPGAs provide speed and reliability, without requiring high volumes to justify the large upfront expense of custom ASIC design. Reprogrammable silicon also has the same flexibility of software running on processor-based systems, and it is not limited by the number of processing cores available. Unlike processors, FPGAs are truly parallel in nature, so different processing operations do not have to compete for the same resources. Each independent processing task is assigned to a dedicated section of the chip, and can function autonomously without any influence from other logic blocks. As a result, the performance of one part of the application is not affected when more processing is added on. Some FPGAs have analog features in addition to digital functions. Some common analog features are programmable slew rate and drive strength on each output pin, allowing the engineer to set slow rates on lightly loaded pins that would otherwise ring or couple unacceptably, and to set stronger, faster rates on heavily loaded pins on high-speed channels that would otherwise run too slowly. Another relatively common analog feature is differential comparators on input pins designed to be connected to differential signaling channels. Some mixed signal FPGAs have integrated peripheral analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) with analog signal conditioning blocks that allow them to operate as a system-on-a-chip. Briefly, the top 5 benefits of FPGA chips are: 1. Good Performance 2. Short Time to Market 3. Low Cost 4. High Reliability 5. Long-Term Maintenance Capability Good Performance – With their capability of accommodating parallel processing, FPGAs have better computing power than digital signal processors (DSPs) and do not require sequential execution as DSPs and can accomplish more per clock cycles. Controlling inputs and outputs (I/O) at the hardware level provides faster response times and specialized functionality to closely match application requirements. Short Time to market - FPGAs offer flexibility and rapid prototyping capabilities and thus shorter time-to-market. Our customers can test an idea or concept and verify it in hardware without going through the long and expensive fabrication process of custom ASIC design. We can implement incremental changes and iterate on an FPGA design within hours instead of weeks. Commercial off-the-shelf hardware is also available with different types of I/O already connected to a user-programmable FPGA chip. The growing availability of high-level software tools offer valuable IP cores (prebuilt functions) for advanced control and signal processing. Low Cost—The nonrecurring engineering (NRE) expenses of custom ASIC designs exceed that of FPGA-based hardware solutions. The large initial investment in ASICs can be justified for OEMs producing many chips per year, however many end users need custom hardware functionality for the many systems in development. Our programmable silicon FPGA offers you something with no fabrication costs or long lead times for assembly. System requirements frequently change over time, and the cost of making incremental changes to FPGA designs is negligible when compared to the large expense of respinning an ASIC. High Reliability - Software tools provide the programming environment and FPGA circuitry is a true implementation of program execution. Processor-based systems generally involve multiple layers of abstraction to help task scheduling and share resources among multiple processes. The driver layer controls hardware resources and the OS manages memory and processor bandwidth. For any given processor core, only one instruction can execute at a time, and processor-based systems are continually at risk of time-critical tasks preempting one another. FPGAs, do not use OSs, pose minimum reliability concerns with their true parallel execution and deterministic hardware dedicated to every task. Long-term Maintenance Capability - FPGA chips are field-upgradable and do not require the time and cost involved with redesigning ASIC. Digital communication protocols, for example, have specifications that can change over time, and ASIC-based interfaces may cause maintenance and forward-compatibility challenges. To the contrary, reconfigurable FPGA chips can keep up with potentially necessary future modifications. As products and systems mature, our customers can make functional enhancements without spending time redesigning hardware and modifying the board layouts. Microelectronics Foundry Services: Our microelectronics foundry services include design, prototyping and manufacturing, third-party services. We provide our customers with assistance throughout the entire product development cycle - from design support to prototyping and manufacturing support of semiconductor chips. Our objective in design support services is to enable a first-time right approach for digital, analog, and mixed-signal designs of semiconductor devices. For example, MEMS specific simulation tools are available. Fabs that can handle 6 and 8 inch wafers for integrated CMOS and MEMS are at your service. We offer our clients design support for all major electronic design automation (EDA) platforms, supplying correct models, process design kits (PDK), analog and digital libraries, and design for manufacturing (DFM) support. We offer two prototyping options for all technologies: the Multi Product Wafer (MPW) service, where several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. These are more economical than the full mask set. The MLM service is highly flexible compared to the fixed dates of the MPW service. Companies may prefer outsourcing semiconductor products to a microelectronics foundry for a number of reasons including the need for a second source, using internal resources for other products and services, willingness to go fabless and decrease risk and burden of running a semiconductor fab…etc. AGS-TECH offers open-platform microelectronics fabrication processes that can be scaled down for small wafer runs as well as mass manufacturing. Under certain circumstances, your existing microelectronics or MEMS fabrication tools or complete tool sets can be transferred as consigned tools or sold tools from your fab into our fab site, or your existing microelectronics and MEMS products can be redesigned using open platform process technologies and ported to a process available at our fab. This is faster and more economical than a custom technology transfer. If desired however customer’s existing microelectronics / MEMS fabrication processes may be transferred. Semiconductor Wafer Preparation: If desired by customers after wafers are microfabricated, we carry out dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection operations on semiconductor wafers. Semiconductor wafer processing involves metrology in between the various processing steps. For example, thin film test methods based on ellipsometry or reflectometry, are used to tightly control the thickness of gate oxide, as well as the thickness, refractive index and extinction coefficient of photoresist and other coatings. We use semiconductor wafer test equipment to verify that the wafers haven't been damaged by previous processing steps up until testing. Once the front-end processes have been completed, the semiconductor microelectronic devices are subjected to a variety of electrical tests to determine if they function properly. We refer to the proportion of microelectronics devices on the wafer found to perform properly as the “yield”. Testing of microelectronics chips on the wafer are carried out with an electronic tester that presses tiny probes against the semiconductor chip. The automated machine marks each bad microelectronics chip with a drop of dye. Wafer test data is logged into a central computer database and semiconductor chips are sorted into virtual bins according to predetermined test limits. The resulting binning data can be graphed, or logged, on a wafer map to trace manufacturing defects and mark bad chips. This map can also be used during wafer assembly and packaging. In final testing, microelectronics chips are tested again after packaging, because bond wires may be missing, or analog performance may be altered by the package. After a semiconductor wafer is tested, it is typically reduced in thickness before the wafer is scored and then broken into individual dies. This process is called semiconductor wafer dicing. We use automated pick-and-place machines specially manufactured for microelectronics industry to sort out the good and bad semiconductor dies. Only the good, unmarked semiconductor chips are packaged. Next, in the microelectronics plastic or ceramic packaging process we mount the semiconductor die, connect the die pads to the pins on the package, and seal the die. Tiny gold wires are used to connect the pads to the pins using automated machines. Chip scale package (CSP) is another microelectronics packaging technology. A plastic dual in-line package (DIP), like most packages, is multiple times larger than the actual semiconductor die placed inside, whereas CSP chips are nearly the size of the microelectronics die; and a CSP can be constructed for each die before the semiconductor wafer is diced. The packaged microelectronics chips are re-tested to make sure that they are not damaged during packaging and that the die-to-pin interconnect process was completed correctly. Using lasers we then etch the chip names and numbers on the package. Microelectronic Package Design and Fabrication: We offer both off-shelf and custom design and fabrication of microelectronic packages. As part of this service, modeling and simulation of microelectronic packages is also carried out. Modeling and simulation ensures virtual Design of Experiments (DoE) to achieve the optimal solution, rather than testing packages on the field. This reduces the cost and production time, especially for new product development in microelectronics. This work also gives us the opportunity to explain our customers how the assembly, reliability and testing will impact their microelectronic products. The primary objective of microelectronic packaging is to design an electronic system that will satisfy the requirements for a particular application at a reasonable cost. Because of the many options available to interconnect and house a microelectronics system, the choice of a packaging technology for a given application needs expert evaluation. Selection criteria for microelectronics packages may include some of the following technology drivers: -Wireability -Yield -Cost -Heat dissipation properties -Electromagnetic shielding performance -Mechanical toughness -Reliability These design considerations for microelectronics packages affect speed, functionality, junction temperatures, volume, weight and more. The primary goal is to select the most cost-effective yet reliable interconnection technology. We use sophisticated analysis methods and software to design microelectronics packages. Microelectronics packaging deals with the design of methods for the fabrication of interconnected miniature electronic systems and the reliability of those systems. Specifically, microelectronics packaging involves routing of signals while maintaining signal integrity, distributing ground and power to semiconductor integrated circuits, dispersing dissipated heat while maintaining structural and material integrity, and protecting the circuit from environmental hazards. Generally, methods for packaging microelectronics ICs involve the use of a PWB with connectors that provide the real-world I/Os to an electronic circuit. Traditional microelectronics packaging approaches involve the use of single packages. The main advantage of a single-chip package is the ability to fully test the microelectronics IC before interconnecting it to the underlying substrate. Such packaged semiconductor devices are either through-hole mounted or surface mounted to the PWB. Surface-mounted microelectronics packages do not require via holes to go through the entire board. Instead, surface-mounted microelectronics components can be soldered to both sides of the PWB, enabling higher circuit density. This approach is called surface-mount technology (SMT). The addition of area-array–style packages such as ball-grid arrays (BGAs) and chip-scale packages (CSPs) is making SMT competitive with the highest-density semiconductor microelectronics packaging technologies. A newer packaging technology involves the attachment of more than one semiconductor device onto a high-density interconnection substrate, which is then mounted in a large package, providing both I/O pins and environmental protection. This multichip module (MCM) technology is further characterized by the substrate technologies used to interconnect the attached ICs. MCM-D represents deposited thin film metal and dielectric multilayers. MCM-D substrates have the highest wiring densities of all MCM technologies thanks to the sophisticated semiconductor processing technologies. MCM-C refers to multilayered “ceramic” substrates, fired from stacked alternating layers of screened metal inks and unfired ceramic sheets. Using MCM-C we obtain a moderately dense wiring capacity. MCM-L refers to multilayer substrates made from stacked, metallized PWB “laminates,” that are individually patterned and then laminated. It used to be a low-density interconnect technology, however now MCM-L is quickly approaching the density of MCM-C and MCM-D microelectronics packaging technologies. Direct chip attach (DCA) or chip-on-board (COB) microelectronics packaging technology involves mounting the microelectronics ICs directly to the PWB. A plastic encapsulant, which is “globbed” over the bare IC and then cured, provides environmental protection. Microelectronics ICs can be interconnected to the substrate using either flip-chip, or wire bonding methods. DCA technology is particularly economical for systems that are limited to 10 or fewer semiconductor ICs, since larger numbers of chips can affect system yield and DCA assemblies can be difficult to rework. An advantage common to both the DCA and MCM packaging options is the elimination of the semiconductor IC package interconnection level, which allows closer proximity (shorter signal transmission delays) and reduced lead inductance. The primary disadvantage with both methods is the difficulty in purchasing fully tested microelectronics ICs. Other disadvantages of DCA and MCM-L technologies include poor thermal management thanks to the low thermal conductivity of PWB laminates and a poor coefficient of thermal expansion match between the semiconductor die and the substrate. Solving the thermal expansion mismatch problem requires an interposer substrate such as molybdenum for wire bonded die and an underfill epoxy for flip-chip die. The multichip carrier module (MCCM) combines all the positive aspects of DCA with MCM technology. The MCCM is simply a small MCM on a thin metal carrier that can be bonded or mechanically attached to a PWB. The metal bottom acts as both a heat dissipater and a stress interposer for the MCM substrate. The MCCM has peripheral leads for wire bonding, soldering, or tab bonding to a PWB. Bare semiconductor ICs are protected using a glob-top material. When you contact us, we will discuss your application and requirements to choose the best microelectronics packaging option for you. Semiconductor IC Assembly & Packaging & Test: As part of our microelectronics fabrication services we offer die, wire and chip bonding, encapsulation, assembly, marking and branding, testing. For a semiconductor chip or integrated microelectronics circuit to function, it needs to be connected to the system that it will control or provide instructions to. Microelectronics IC assembly does provide the connections for power and information transfer between the chip and the system. This is accomplished by connecting the microelectronics chip to a package or directly connecting it to the PCB for these functions. Connections between the chip and the package or printed circuit board (PCB) are via wire bonding, thru-hole or flip chip assembly. We are an industry leader in finding microelectronics IC packaging solutions to meet the complex requirements of the wireless and internet markets. We offer thousands of different package formats and sizes, ranging from traditional leadframe microelectronics IC packages for thru-hole and surface mount, to the latest chip scale (CSP) and ball grid array (BGA) solutions required in high pin count and high density applications. A wide variety of packages are available from stock including CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, PLCC, PoP - Package on Package, PoP TMV - Through Mold Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Wafer Level Package)…..etc. Wire bonding using copper, silver or gold are among the popular in microelectronics. Copper (Cu) wire has been a method of connecting silicon semiconductor dies to the microelectronics package terminals. With recent increase in gold (Au) wire cost, copper (Cu) wire is an attractive way to manage overall package cost in microelectronics. It also resembles gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are almost the same for gold (Au) and copper (Cu) wire with copper (Cu) wire having lower resistivity. In microelectronics applications where resistance due to bond wire can negatively impact circuit performance, using copper (Cu) wire can offer improvement. Copper, Palladium Coated Copper (PCC) and Silver (Ag) alloy wires have emerged as alternatives to gold bond wires due to cost. Copper-based wires are inexpensive and have low electrical resistivity. However, the hardness of copper makes it difficult to use in many applications such as those with fragile bond pad structures. For these applications, Ag-Alloy offers properties similar to those of gold while its cost is similar to that of PCC. Ag-Alloy wire is softer than PCC resulting in lower Al-Splash and lower risk of bond pad damage. Ag-Alloy wire is the best low cost replacement for applications that need die-to-die bonding, waterfall bonding, ultra-fine bond pad pitch and small bond pad openings, ultra low loop height. We provide a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and complete end-of-line services. We test a variety of semiconductor device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various combinations such as ASIC, multi chip modules, System-in-Package (SiP), and stacked 3D packaging, sensors and MEMS devices such as accelerometers and pressure sensors. Our test hardware and contacting equipment are suitable for custom package size SiP, dual-sided contacting solutions for Package on Package (PoP), TMV PoP, FusionQuad sockets, multiple-row MicroLeadFrame, Fine-Pitch Copper Pillar. Test equipment and test floors are integrated with CIM / CAM tools, yield analysis and performance monitoring to deliver very high efficiency yield the first time. We offer numerous adaptive microelectronics test processes for our customers and offer distributed test flows for SiP and other complex assembly flows. AGS-TECH provides a full range of test consultation, development and engineering services across your entire semiconductor and microelectronics product lifecycle. We understand the unique markets and testing requirements for SiP, automotive, networking, gaming, graphics, computing, RF / wireless. Semiconductor manufacturing processes require fast and precisely controlled marking solutions. Marking speeds over 1000 characters/second and material penetration depths less than 25 microns are common in semiconductor microelectronics industry using advanced lasers. We are capable of marking mold compounds, wafers, ceramics and more with minimal heat input and perfect repeatability. We use lasers with high accuracy to mark even the smallest parts without damage. Lead frames for Semiconductor Devices: Both off-shelf and custom design and fabrication are possible. Lead frames are utilized in the semiconductor device assembly processes, and are essentially thin layers of metal that connect the wiring from tiny electrical terminals on the semiconductor microelectronics surface to the large-scale circuitry on electrical devices and PCBs. Lead frames are used in almost all semiconductor microelectronics packages. Most microelectronics IC packages are made by placing the semiconductor silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and subsequently covering the microelectronics chip with plastic cover. This simple and relatively low cost microelectronics packaging is still the best solution for many applications. Lead frames are produced in long strips, which allows them to be quickly processed on automated assembly machines, and generally two manufacturing processes are used: photo etching of some sort and stamping. In microelectronics lead frame design often demand is for customized specifications and features, designs that enhance electrical and thermal properties, and specific cycle time requirements. We have in-depth experience of microelectronics lead frame manufacturing for an array of different customers using laser assisted photo etching and stamping. Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication. With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. The consistency in performance and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a semiconductor microelectronics component may be achieved by effectively controlling the device operating temperature within the limits set by the designers. Heat sinks are devices that enhance heat dissipation from a hot surface, usually the outer case of a heat generating component, to a cooler ambient such as air. For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation. A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant. This allows more heat to be dissipated and/or lowers the semiconductor device operating temperature. The primary purpose of a heat sink is to maintain the microelectronics device temperature below the maximum allowable temperature specified by the semiconductor device manufacturer. We can classify heat sinks in terms of manufacturing methods and their shapes. The most common types of air-cooled heat sinks include: - Stampings: Copper or aluminum sheet metals are stamped into desired shapes. they are used in traditional air cooling of electronic components and offer an economical solution to low density thermal problems. They are suitable for high volume production. - Extrusion: These heat sinks allow the formation of elaborate two-dimensional shapes capable of dissipating large heat loads. They may be cut, machined, and options added. A cross-cutting will produce omnidirectional, rectangular pin fin heat sinks, and incorporating serrated fins improves the performance by approximately 10 to 20%, but with a slower extrusion rate. Extrusion limits, such as the fin height-to-gap fin thickness, usually dictate the flexibility in design options. Typical fin height-to-gap aspect ratio of up to 6 and a minimum fin thickness of 1.3mm, are attainable with standard extrusion techniques. A 10 to 1 aspect ratio and a fin thickness of 0.8″can be obtained with special die design features. However, as the aspect ratio increases, the extrusion tolerance is compromised. - Bonded/Fabricated Fins: Most air cooled heat sinks are convection limited, and the overall thermal performance of an air cooled heat sink can often be improved significantly if more surface area can be exposed to the air stream. These high performance heat sinks utilize thermally conductive aluminum-filled epoxy to bond planar fins onto a grooved extrusion base plate. This process allows for a much greater fin height-to-gap aspect ratio of 20 to 40, significantly increasing the cooling capacity without increasing the need for volume. - Castings: Sand, lost wax and die casting processes for aluminum or copper / bronze are available with or without vacuum assistance. We use this technology for fabrication of high density pin fin heat sinks which provide maximum performance when using impingement cooling. - Folded Fins: Corrugated sheet metal from aluminum or copper increases surface area and the volumetric performance. The heat sink is then attached to either a base plate or directly to the heating surface via epoxy or brazing. It is not suitable for high profile heat sinks on account of the availability and fin efficiency. Hence, it allows high performance heat sinks to be fabricated. In selecting an appropriate heat sink meeting the required thermal criteria for your microelectronics applications, we need to examine various parameters that affect not only the heat sink performance itself, but also the overall performance of the system. The choice of a particular type of heat sink in microelectronics depends largely to the thermal budget allowed for the heat sink and external conditions surrounding the heat sink. There is never a single value of thermal resistance assigned to a given heat sink, since the thermal resistance varies with external cooling conditions. Sensor & Actuator Design and Fabrication: Both off-shelf and custom design and fabrication are available. We offer solutions with ready-to-use processes for inertial sensors, pressure and relative pressure sensors and IR temperature sensor devices. By using our IP blocks for accelerometers, IR and pressure sensors or applying your design according to available specifications and design rules, we can have MEMS based sensor devices delivered to you within weeks. Besides MEMS, other types of sensor and actuator structures can be fabricated. Optoelectronic & photonic circuits design and fabrication: A photonic or optical integrated circuit (PIC) is a device that integrates multiple photonic functions. It can be resembled to electronic integrated circuits in microelectronics. The major difference between the two is that a photonic integrated circuit provides functionality for information signals imposed on optical wavelengths in the visible spectrum or near infrared 850 nm-1650 nm. Fabrication techniques are similar to those used in microelectronics integrated circuits where photolithography is used to pattern wafers for etching and material deposition. Unlike semiconductor microelectronics where the primary device is the transistor, there is no single dominant device in optoelectronics. Photonic chips include low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and fabrication techniques and therefore it is difficult to realize all of them on a single chip. Our applications of photonic integrated circuits are mainly in the areas of fiber-optic communication, biomedical and photonic computing. Some example optoelectronic products we can design and fabricate for you are LEDs (Light Emitting Diodes), diode lasers, optoelectronic receivers, photodiodes, laser distance modules, customized laser modules and more. KLIK Product Finder-Locator Service PAGE sadurunge

We have high quality metal cutting & shaping tools such as solid carbide end mills, drills, HSS end mills, HSS step drill bits, HSS countersinks, HSS counterbores, twist drill bits, center drills, saw drills, tool bits, carbide rotary burs and more. Metal Cutting & Shaping Tools Here you will find tools, products and components used in cutting and shaping of metal. Tools for cutting and shaping of wood will be damaged and broken when used on metal. Metal and metal alloys need to be processed using metal cutting & shaping tools otherwise tool life will be severely shortened. Click on the highlighted metal cutting & shaping tools of interest below to download related brochure or catalog. We do have a wide spectrum of metal cutting & shaping tools suitable for almost any application. There is a wide variety of metal cutting & shaping tools with different dimensions, applications and material; it is impossible to present them all here. If you cannot find or if you are not sure which metal cutting and shaping tools will meet your expectations and requirements, email or call us so we can determine which product is the best fit for you. When contacting us, please try to provide us as much detail as possible such as your application, dimensions, material grade if you know, finishing requirements, packaging & labeling requirements and of course quantity of your planned order. Solid Carbide End mills Solid Carbide Drills HSS End mills HSS Step Drill Bits HSS Countersinks HSS Tube & Sheet Drills HSS Counterbores HSS Twist Drills HSS Center Drills HSS Saw Drills HSS Tool bits Carbide Brazed Tool bits Carbide Rotary Burs Taps & Dies Milling Cutters Saw Blades Screw Extractor Steel Files Private Label Abrasives (We can put your company name, logo, brand on these. In other words we offer you private label) Private Label Abrasives Ordering Instructions Guide Private Label Drill Bits (We can private label these drill bits with your company name and logo) Private Label Hand Tools for Every Industry This catalog contains some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tool Accessories This brochure includes some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry This catalog contains some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Taps - Cutting Tools (We can private label these drill bits with your company name and logo) KLIK kene kanggo ngundhuh kemampuan teknis lan pandhuan referensi kanggo nglereni, ngebur, grinding, mbentuk, mbentuk, alat polishing sing digunakake ing medis, dental, instrumentasi presisi, stamping logam, die forming lan aplikasi industri liyane. KLIK Product Finder-Locator Service Klik kene kanggo pindhah menyang Cut, Drilling, Grinding, Lapping, Polishing, Dicing lan Shaping Tools Menu Ref. Kode: OICASOSTAR