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Hardness Tester - Rockwell - Brinell - Vickers - Leeb - Microhardness - Universal - AGS-TECH Inc. - New Mexico - USA Panguji kekerasan AGS-TECH Inc. stocks a comprehensive range of hardness testers including ROCKWELL, BRINELL, VICKERS, LEEB, KNOOP, MICROHARDNESS TESTERS, UNIVERSAL HARDNESS TESTER, PORTABLE HARDNESS TESTING INSTRUMENTS, optical systems and software for measurement, data acquisition and analysis, test blocks, indenters, anvils and related accessories. Some of the brand name hardness testers we sell are BUEHLER, ELCOMETER, MITECH, SADT, SINOAGE, SINOWON ..... You can purchase brand new, refurbished or used equipment from us. Simply choose the product from the following catalogs and provide us the brand name and model of your choice: BUEHLER Hardness Testing Catalog ELCOMETER Inspection Equipment Catalog (does offer Physical Test Equipment , Concrete Inspection Equipment, Concrete Test Hammers , Hardness & Scratch Resistance Testers ) MITECH MH600 P ortable Hardness Tester MITECH Hardness Testers P roduct Comparison Table MITUTOYO Hardness Testing Machines SADT-SINOAGE B rand M etrology and T est E quipment Catalog SINOWON Rockwell Hardness Tester SINOWON Portable Ultrasonic Hardness Tester One of the most common tests for assessing the mechanical properties of materials is the hardness test. Hardness of a material is its resistance to permanent indentation. One may also say hardness is a material’s resistance to scratching and to wear. There are several techniques to measure the hardness of materials using various geometries and materials. The measurement results are not absolute, they are more of a relative comparative indicator, because the results depend on the shape of the indenter and the applied load. Our portable hardness testers can generally run any hardness test listed above. They can be configured for particular geometric features and materials such as hole interiors, gear teeth…etc. Let us briefly go over the various hardness test methods. BRINELL TEST : In this test, a steel or tungsten carbide ball with 10 mm diameter is pressed against a surface with a load of 500, 1500 or 3000 Kg force. Brinell hardness number is the ratio of the load to the curved area of indentation. A Brinell test leaves behind different types of impressions on the surface depending on the tested material’s condition. For example, on annealed materials a rounded profile is left behind whereas on cold-worked materials we observe a sharp profile. Tungsten carbide indenter balls are recommended for Brinell hardness numbers higher than 500. For harder workpiece materials a 1500 Kg or 3000 Kg load is recommended so that the impressions left behind are sufficiently large for accurate measurement. Because of the fact that impressions made by the same indenter at different loads are not geometrically similar, the Brinell hardness number depends on the load used. Therefore one should always note the load employed on the test results. Brinell test is well suited for materials between low to medium hardness. ROCKWELL TEST : In this test the depth of penetration is measured. The indenter is pressed on the surface initially with a minor load and then a major load. The difference in the penetration debth is a measure of hardness. Several Rockwell hardness scales exist employing different loads, indenter materials and geometries. The Rockwell hardness number is read directly from a dial on the testing machine. For example, if the hardness number is 55 using the C scale, it is written as 55 HRC. VICKERS TEST : Sometimes also referred to as the DIAMOND PYRAMID HARDNESS TEST, it uses a pyramid-shaped diamond indenter with loads ranging from 1 to 120 Kg. The Vickers hardness number is given by HV=1.854P / square L. The L here is the diagonal length of the diamond pyramid. The Vickers test gives basically the same hardness number regardless of the load. The Vickers test is suitable for testing materials with a wide range of hardness including very hard materials. KNOOP TEST : In this test, we use a diamond indenter in the shape of an elongated pyramid and loads between 25g to 5 Kg. The Knoop hardness number is given as HK=14.2P / square L. Here the letter L is the length of the elongated diagonal. The size of indentations in Knoop tests is relatively small, in the range of 0.01 to 0.10 mm. Due to this small number surface preparation for the material is very important. Test results should cite the load applied because the hardness number obtained depends on the applied load. Because light loads are used, the Knoop test is considered a MICROHARDNESS TEST. The Knoop test is therefore suitable for very small, thin specimens, brittle materials such as gemstones, glass and carbides, and even for measuring the hardness of individual grains in a metal. LEEB HARDNESS TEST : It is based on rebound technique measuring the Leeb hardness. It is an easy and industrially popular method. This portable method is mostly used for testing sufficiently large workpieces above 1 kg. An impact body with a hard metal test tip is propelled by spring force against the workpiece surface. When the impact body hits the workpiece, surface deformation takes place which will result in loss of kinetic energy. Velocity measurements reveal this loss in kinetic energy. When the impact body passes coil at a precise distance from the surface, a signal voltage is induced during the impact and rebound phases of the test. These voltages are proportional to the velocity. Using electronic signal processing one gets the Leeb hardness value from display. Our PORTABLE HARDNESS TESTERS from SADT / HARTIP HARDNESS TESTER SADT HARTIP2000/HARTIP2000 D&DL : This is an innovative portable Leeb hardness tester with newly patented technology, which makes HARTIP 2000 a universal angle (UA) impact direction hardness tester. There is no need to set up impact direction when taking measurements at any angle. Therefore, HARTIP 2000 offers a linear accuracy compared to the angle compensating method. HARTIP 2000 is also a cost saving hardness tester and has many other features. The HARTIP2000 DL is equipped with SADT unique D and DL 2-in-1 probe. SADT HARTIP1800 Plus/1800 Plus D&DL : This device is an advanced state-of-the-art palm sized metal hardness tester with many new features. Using a patented technology, SADT HARTIP1800 Plus is a new generation product. It has a high accuracy of +/-2 HL (or 0.3% @HL800) with high contract OLED display and wide environmental temperature range (-40ºC~60ºC). Apart from huge memories in 400 blocks with 360k data, HARTIP1800 Plus can download measured data to PC and printout to mini-printer by USB port and wirelessly with internal blue-tooth module. The battery can be charged simply from USB port. It has a customer re-calibration and statics function. HARTIP 1800 plus D&DL is equipped with two-in-one probe. With unique two-in-one probe, HARTIP1800plus D&DL can convert between probe D and probe DL simply by changing impact body. It’s more economical than buying them individually. It has the same configuration with HARTIP1800 plus except two-in-one probe. SADT HARTIP1800 Basic/1800 Basic D&DL : This is a basic model for HARTIP1800plus. With most of core functions of HARTIP1800 plus and a lower price, HARTIP1800 Basic is a good choice for the customer with limited budget. HARTIP1800 Basic also can be equipped with our unique D/DL two-in-one impact device. SADT HARTIP 3000 : This is an advanced hand-held digital metal hardness tester with high accuracy, wide measurement range and ease of operation. It is suitable for testing the hardness of all metals especially on site for large structural and assembled components, which are widely used in the power, petrochemical, aerospace, automotive and machine building industries. SADT HARTIP1500/HARTIP1000 : This is an integrated handheld metal hardness tester that combines impact device (probe) and processor into one unit. The size is much smaller than the standard impact device, which allows HARTIP 1500/1000 to meet not only normal measurement conditions, but also can take measurements at narrow spaces. HARTIP 1500/1000 is suitable for testing the hardness of almost all ferrous and nonferrous materials. With its new technology, its accuracy is improved to a higher level than the standard type. HARTIP 1500/1000 is one of the most economic hardness testers in its class. BRINELL HARDNESS READING AUTOMATIC MEASURING SYSTEM / SADT HB SCALER : HB Scaler is an optical measuring system which can automatically measure the size of indentation from Brinell hardness tester and gives the Brinell hardness readings. All values and indentation images can be saved in PC. With the software, all values can be processed and printed out as a report. Our BENCH HARDNESS TESTER products from SADT are: SADT HR-150A ROCKWELL HARDNESS TESTER : The manually operated HR-150A Rockwell hardness tester is known for its perfection and ease of operation. This machine uses the standard preliminary test force of 10kgf and main loads of 60/100/150 kilograms while conforming to the international Rockwell standard. After each test, the HR-150A shows the Rockwell B or Rockwell C hardness value directly on the dial indicator. The preliminary test force has to be applied manually, followed by applying the main load by means of the lever at the right side of the hardness tester. After unloading, the dial indicates the requested hardness value directly with high accuracy and repeatability. SADT HR-150DT MOTORIZED ROCKWELL HARDNESS TESTER : This series of hardness testers are recognized for their accuracy and ease of operation, function entirely conforming to the international Rockwell standard. Depending on the combination of indenter type and applied total test force, a unique symbol is given to each Rockwell scale. HR-150DT and HRM-45DT feature both specific Rockwell scales of HRC and HRB on a dial. The appropriate force should be adjusted manually, using the dial on the right side of the machine. After application of the preliminary force, the HR150DT and HRM-45DT will proceed with a fullly automated testing: loading, waiting, unloading, and at the end will display the hardness. SADT HRS-150 DIGITAL ROCKWELL HARDNESS TESTER : The HRS-150 digital Rockwell hardness tester is designed for ease of use and safety of operation. It conforms with the international Rockwell standard. Depending on the combination of indenter type and applied total test force, a unique symbol is given to each Rockwell scale. The HRS-150 will automatically show your selection of a specific Rockwell scale on the LCD display, and will indicate which load is being used. The integrated autobrake mechanism allows the preliminary test force to be applied manually without the possibility of an error. After application of the preliminary force, the HRS-150 will proceed with a fully automatic test: loading, dwell time, unloading, and computation of the hardness value and its display. Connected to the included printer through an RS232 output, it’s possible to print out all results. Our BENCH TYPE SUPERFICIAL ROCKWELL HARDNESS TESTER products from SADT are: SADT HRM-45DT MOTORIZED SUPERFICIAL ROCKWELL HARDNESS TESTER : This series hardness testers are recognized for their accuracy and ease of operation, perform entirely conforming to the international Rockwell standard. Depending on the combination of indenter type and applied total test force, a unique symbol is given to each Rockwell scale. HR-150DT and HRM-45DT feature both of the specific Rockwell scales HRC and HRB on a dial. The appropriate force should be adjusted manually, using the dial on the right side of the machine. After application of the preliminary force, the HR150DT and HRM-45DT will proceed with a fullly automatic test process: loading, dwelling, unloading, and at the end will display the hardness. SADT HRMS-45 SUPERFICIAL ROCKWELL HARDNESS TESTER : HRMS-45 Digital Superficial Rockwell Hardness Tester is a novel product integrating advanced mechanical and electronic technologies. The dual display of LCD and LED digital diodes, make it an upgraded product version of the standard type superficial Rockwell tester. It measures the hardness of ferrous, nonferrous metals and hard materials, carburized and nitrided layers, and other chemically treated layers. It is also used for the measurement of hardness of thin pieces. SADT XHR-150 PLASTIC ROCKWELL HARDNESS TESTER : XHR-150 plastics Rockwell hardness tester adopts a motorized testing method, testing force can be loaded, kept at dwelling and unloaded automatically. Human error is minimized and easy to operate. It is used to measure hard plastics, hard rubbers, aluminum, tin, copper, soft steel, synthetic resins, tribologic materials, etc. Our BENCH TYPE VICKERS HARDNESS TESTER products from SADT are: SADT HVS-10/50 LOW LOAD VICKERS HARDNESS TESTER : This low load Vicker’s hardness tester with digital display is a new hi-tech product integrating mechanical and photoelectrical technologies. As a substitute for traditional small-load Vicker’s hardness testers, it features an easy operation and good reliability, which is specially designed for testing small, thin samples or parts after surface coating. Suitable for research institutes, industrial labs and QC departments, this is an ideal hardness testing instrument for research and measurement purposes. It offers integration of computer programming technology, high resolution optical measuring system and photoelectrical technique, soft key input, light source adjustment, selectable testing model, conversion tables, pressure-holding time, file number input and data saving functions. It has a big LCD screen to display the test model, test pressure, indention length, hardness values, pressure holding time and the numbers of tests. Offers also date recording, test results recording and data processing, printing output function, through an RS232 interface. SADT HV-10/50 LOW LOAD VICKERS HARDNESS TESTER : These low load Vickers hardness testers are new hi-tech products integrating mechanical and photoelectrical technologies. These testers are specially designed for testing small and thin samples and parts after surface coating. Suitable for research institutes, industrial labs and QC departments. Key features and functions are microcomputer control, adjustment of light source via soft keys, adjustment of pressure holding time and LED/LCD display, its unique measurement conversion device and unique micro eyepiece one-time measurement readout device that ensures easy use and high accuracy. SADT HV-30 VICKERS HARDNESS TESTER : The HV-30 model Vickers hardness tester is specially designed for testing small, thin samples and parts after surface coating. Suitable for research institutes, factory labs and QC departments, these are ideal hardness testing instruments for research and test purposes. Key features and functions are micro computer control, automatic loading and unloading mechanism, adjustment of lighting source via hardware, adjustment of pressure holding time (0~30s), unique measurement conversion device and unique micro eyepiece one-time measurement readout device, ensuring easy use and high accuracy. Our BENCH TYPE MICRO HARDNESS TESTER products from SADT are: SADT HV-1000 MICRO HARDNESS TESTER / HVS-1000 DIGITAL MICRO HARDNESS TESTER : This product is especially well suited for high precision hardness testing of small and thin samples such as sheet, foil, coatings, ceramic products and hardened layers. To ensure a satisfactory indentation, the HV1000 / HVS1000 features automatic loading and unloading operations, a very accurate loading mechanism and a robust lever system. The micro-computer controlled system ensures an absolutely precise hardness measurement with adjustable dwell time. SADT DHV-1000 MICRO HARDNESS TESTER / DHV-1000Z DIGITAL VICKERS HARDNESS TESTER : These micro Vickers hardness testers made with a unique and precise design are able to produce a clearer indentation and hence a more accurate measurement. By means of a 20 × lens and a 40 × lens the instrument has a wider measurement field and a broader application range. Equipped with a digital microscope, on its LCD screen it shows the measuring methods, the test force, the indentation length, the hardness value, the dwell time of the test force as well as the number of the measurements. In addition, it is equipped with an interface linked to a digital camera and a CCD video camera. This tester is widely used for measuring ferrous metals, non-ferrous metals, IC thin sections, coatings, glass, ceramics, precious stones, quench hardened layers and more. SADT DXHV-1000 DIGITAL MICRO HARDNESS TESTER : These micro Vickers hardness testers made with a unique and precise are able to produce a clearer indentation and hence more accurate measurements. By means of a 20 × lens and a 40 × lens the tester has a wider measurement field and a broader application range. With an automatically turning device ( the automatically turning turret ), the operation has become easier; and with a threaded interface, it can be linked to a digital camera and a CCD video camera. First the device lets the LCD touch screen to be used, thus allowing the operation to be more human controlled. The device has capabilities such as direct reading of the measurements, the easy change of the hardness scales, the saving of the data, the printing and the connection with the RS232 interface. This tester is widely used for measuring ferrous metals, non-ferrous metals, IC thin sections, coatings, glass, ceramics, precious stones; thin plastic sections, quench hardened layers and more. Our BENCH TYPE BRINELL HARDNESS TESTER / MULTI-PURPOSE HARDNESS TESTER products from SADT are: SADT HD9-45 SUPERFICIAL ROCKWELL & VICKERS OPTICAL HARDNESS TESTER : This device serves the purpose of measuring the hardness of ferrous, nonferrous metals, hard metals, carburized and nitrided layers and chemically treated layers and thin pieces. SADT HBRVU-187.5 BRINELL ROCKWELL & VICKERS OPTICAL HARDNESS TESTER : This instrument is used for determining the Brinell, Rockwell and Vickers hardness of ferrous, nonferrous metals, hard metals, carburized layers and chemically treated layers. It can be used in plants, scientific & research institutes, laboratories and colleges. SADT HBRV-187.5 BRINELL ROCKWELL & VICKERS HARDNESS TESTER (NOT OPTICAL) : This instrument is used for determining the Brinell, Rockwell and Vickers hardness of ferrous, non-ferrous metals, hard metals, carburized layers and chemically treated layers. It can be used in factories, scientific & research institutes, laboratories and colleges. It’s not an optical type hardness tester. SADT HBE-3000A BRINELL HARDNESS TESTER : This automatic Brinell hardness tester features a wide measurement range up to 3000 Kgf with a high accuracy conforming to DIN 51225/1 standard. During the automatic test cycle the applied force will be controlled by a closed loop system guaranteeing a constant force on the work piece, conforming to DIN 50351 standard. The HBE-3000A comes completely with a reading microscope with enlargement factor 20X and a micrometer resolution of 0.005 mm. SADT HBS-3000 DIGITAL BRINELL HARDNESS TESTER : This digital Brinell hardness tester is a new generation state-of-the-art device. It can be used to determine the Brinell hardness of ferrous and non-ferrous metals. The tester offers electronic auto loading, computer software programming, high power optical measurement, photosensor and other features. Each operational process and test result can be displayed on its large LCD screen. The test results can be printed. Device is suitable for manufacturing environments, colleges and scientific institutions. SADT MHB-3000 DIGITAL ELECTRONIC BRINELL HARDNESS TESTER : This instrument is an integrated product combining optical, mechanical and electronic techniques, adopting a precise mechanical structure and computer controlled closed-circuit system. The instrument loads and unloads the testing force with its motor. Using a 0.5% accuracy compression sensor to feedback the information and the CPU to control, the instrument compensates automatically for the varying testing forces. Equipped with a digital micro eyepiece on the instrument, the length of indentation can be measured directly. All testing data such as the test method, the test force value, the length of test indentation, the hardness value and the dwell time of testing force can be shown on the LCD screen. There is no need to input the value of the diagonal length for the indentation and no need to look up the hardness value from the hardness table. Therefore the read data is more accurate and operation of this instrument is easier. For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PAGE sadurunge

Active Optical Components - Lasers - Photodetectors - LED Dies - Photomicrosensor - Fiber Optic - AGS-TECH Inc. - USA Komponen Optik Aktif Manufaktur & Majelis The ACTIVE OPTICAL COMPONENTS we manufacture and supply are: • Lasers and photodetectors, PSD (Position Sensitive Detectors), quadcells and other optical sensors and sensor systems with electrical connections. Our active optical components span a large spectrum of wavelength regions. Whether your application is high power lasers for industrial cutting, drilling, welding...etc, or medical lasers for surgery or diagnostics, or telecommunication lasers or detectors suitable for the ITU grid, we are your one-stop source. Below are downloadable brochures for some of our off-the-shelf active optical components and devices. If you cannot find what you are searching for, please contact us and we will have something to offer you. We do also custom manufacture active optical components and assemblies according to your application and requirements. • Among the many achievements of our optical engineers is the concept design, optical and opto-mechanical design of optical scan head for GS 600 LASER DRILLING SYSTEM with dual galvo scanners and self compensating alignment. Since its introduction, the GS600 family has become the system of choice for many leading high volume manufacturers around the World. Using optical design tools such as ZEMAX and CodeV, our optical engineers are ready to design your custom systems. If you only have SOLIDWORKS files for your design, don't worry, send them and we will work out and create the optical design files, optimize & simulate and have you approve the final design. Even a hand sketch, a mockup, a prototype or sample is sufficient in most cases for us to take care of your product development needs. Click on blue highlighted text to download brochures and catalogs of some off-the-shelf-ready active optical products: Active fiber optic products Comprehensive electric & electronic components catalog for off-shelf products Hikrobot Machine Vision Products Hikrobot Smart Machine Vision Products Hikrobot Machine Vision Standard Products Hikvision Logistic Vision Solutions LED dies and chips Photomicrosensors Photosensors Photosensors and Photomicrosensors Sockets and Accessories Private Label Medical Endoscopes and Visualization Systems (We can put your company name and logo on these) Sensors & Analytical Measurement Systems for Optical OEM Applications in Liquid Analysis (We private label these with your brand name and logo if you wish. We can customize sensors to your needs and applications, OEM option available) Dowload brochure for our DESIGN PARTNERSHIP PROGRAM R e ference Code: OICASANLY KLIK Product Finder-Locator Service PAGE sadurunge

Electric Discharge Machining - EDM - Spark Machining - Die Sinking - Wire Erosion - Custom Manufacturing - AGS-TECH Inc. Mesin EDM, Penggilingan lan Penggilingan Listrik-Discharge ELECTRICAL DISCHARGE MACHINING (EDM), also referred to as SPARK-EROSION or ELECTRODISCHARGE MACHINING, SPARK ERODING, DIE SINKING or WIRE EROSION, is a NON-CONVENTIONAL MANUFACTURING process where erosion of metals takes place and desired shape is obtained using electrical discharges in the form of sparks. We also offer some varieties of EDM, namely NO-WEAR EDM, WIRE EDM (WEDM), EDM GRINDING (EDG), DIE-SINKING EDM, ELECTRICAL-DISCHARGE MILLING, micro-EDM, m-EDM and ELECTROCHEMICAL-DISCHARGE GRINDING (ECDG). Our EDM systems consist of shaped tools/electrode and the workpiece connected to DC power supplies and inserted in a electrically nonconducting dielectric fluid. After 1940 electrical discharge machining has become one of the most important and popular production technologies in manufacturing industries. When the distance between the two electrodes is reduced, the intensity of the electric field in the volume between the electrodes becomes greater than the strength of the dielectric in some points, which breaks, eventually forming a bridge for current to flow between the two electrodes. An intense electrical arc is generated causing significant heating to melt a portion of the workpiece and some of the tooling material. As a result, material is removed from both the electrodes. At the same time, the dielectric fluid is heated rapidly, resulting in evaporation of the fluid in the arc gap. Once the current flow stops or it is stopped heat is removed from the gas bubble by the surrounding dielectric fluid and the bubble cavitates (collapses). The shock wave created by the bubble’s collapse and the flow of dielectric fluid flush debris from the workpiece surface and entrain any molten workpiece material into the dielectric fluid. The repetition rate for these discharges are between 50 to 500 kHz, voltages between 50 to 380 V and currents between 0.1 and 500 Amperes. New liquid dielectric such as mineral oils, kerosene or distilled & deionized water is usually conveyed into the inter-electrode volume carrying away the solid particles (in the form of debris) and the insulating proprieties of the dielectric is restored. After a current flow, the potential difference between the two electrodes is restored to what it was before the breakdown, so a new liquid dielectric breakdown can occur. Our modern electrical discharge machines (EDM) offer numerically controlled movements and are equipped with pumps and filtering systems for the dielectric fluids. Electrical discharge machining (EDM) is a machining method mainly used for hard metals or those that would be very difficult to machine with conventional techniques. EDM typically works with any materials that are electrical conductors, although methods for machining insulating ceramics with EDM have also been proposed. The melting point and latent heat of melting are properties that determine the volume of metal removed per discharge. The higher these values, the slower the material removal rate. Because the electrical discharge machining process does not involve any mechanical energy, the hardness, strength, and toughness of the workpiece do not affect the removal rate. Discharge frequency or energy per discharge, the voltage and current are varied to control material removal rates. Rate of material removal and surface roughness increase with increasing current density and decreasing spark frequency. We can cut intricate contours or cavities in pre-hardened steel using EDM without the need for heat treatment to soften and re-harden them. We can use this method with any metal or metal alloys like titanium, hastelloy, kovar, and inconel. Applications of the EDM process include shaping of polycrystalline diamond tools. EDM is considered a non-traditional or non-conventional machining method along with processes such as electrochemical machining (ECM), water jet cutting (WJ, AWJ), laser cutting. On the other hand the conventional machining methods include turning, milling, grinding, drilling and other process whose material removal mechanism is essentially based on mechanical forces. Electrodes for electrical-discharge machining (EDM) are made of graphite, brass, copper and copper-tungsten alloy. Electrode diameters down to 0.1mm are possible. Since tool wear is an undesired phenomenon adversely affecting dimensional accuracy in EDM, we take advantage of a process called NO-WEAR EDM, by reversing polarity and using copper tools to minimize tool wear. Ideally speaking, the electrical-discharge machining (EDM) can be considered a series of breakdown and restoration of the dielectric liquid between the electrodes. In reality however, the removal of the debris from the inter-electrode area is almost always partial. This causes the electrical proprieties of the dielectric in the inter-electrodes area to be different from their nominal values and vary with time. The inter-electrode distance, (spark-gap), is adjusted by the control algorithms of the specific machine used. The spark-gap in EDM can unfortunately sometimes be short-circuited by the debris. The control system of the electrode may fail to react quickly enough to prevent the two electrodes (tool and workpiece) from short circuiting. This unwanted short circuit contributes to material removal differently from the ideal case. We pay utmost importance to flushing action in order to restore the insulating properties of the dielectric so that the current always happens in the point of the inter-electrode area, thereby minimizing the possibility of unwanted change of shape (damage) of the tool-electrode and workpiece. To obtain a specific geometry, the EDM tool is guided along the desired path very close to the workpiece without touching it, We pay utmost attention to the performance of motion control in use. This way, a large number of current discharges / sparks take place, and each contributes to the removal of material from both tool and workpiece, where small craters are formed. The size of the craters is a function of the technological parameters set for the specific job at hand and dimensions may range from the nanoscale (such as in the case of micro-EDM operations) to some hundreds of micrometers in roughing conditions. These small craters on the tool cause gradual erosion of the electrode called “tool wear”. To counteract the detrimental effect of the wear on the geometry of the workpiece we continuously replace the tool-electrode during a machining operation. Sometimes we achieve this by using a continuously replaced wire as electrode ( this EDM process is also called WIRE EDM ). Sometimes we use the tool-electrode in such a way that only a small portion of it is actually engaged in the machining process and this portion is changed on a regular basis. This is, for instance, the case when using a rotating disk as a tool-electrode. This process is called EDM GRINDING. Yet another technique we deploy consists of using a set of electrodes with different sizes and shapes during the same EDM operation to compensate for wear. We call this multiple electrode technique, and is most commonly used when the tool electrode replicates in negative the desired shape and is advanced towards the blank along a single direction, usually the vertical direction (i.e. z-axis). This resembles the sink of the tool into the dielectric liquid in which the workpiece is immersed, and therefore it is referred to as DIE-SINKING EDM (sometimes called CONVENTIONAL EDM or RAM EDM). The machines for this operation are called SINKER EDM. The electrodes for this type of EDM have complex forms. If the final geometry is obtained using a usually simple-shaped electrode moved along several directions and is also subject to rotations, we call it EDM MILLING. The amount of wear is strictly dependent on the technological parameters used in the operation ( polarity, maximum current, open circuit voltage). For example, in micro-EDM, also known as m-EDM, these parameters are usually set at values which generates severe wear. Therefore, wear is a major problem in that area which we minimize using our accumulated know-how. For example to minimize wear to graphite electrodes, a digital generator, controllable within milliseconds, reverses polarity as electro-erosion takes place. This results in an effect similar to electroplating that continuously deposits the eroded graphite back on the electrode. In another method, a so-called ''Zero Wear'' circuit we minimize how often the discharge starts and stops, keeping it on for as long a time as possible. The material removal rate in electrical-discharge machining can be estimated from: MRR = 4 x 10 exp(4) x I x Tw exp (-1.23) Here MRR is in mm3/min, I is current in Amperes, Tw is workpiece melting point in K-273.15K. The exp stands for exponent. On the other hand, the wear rate Wt of the electrode can be obtained from: Wt = ( 1.1 x 10exp(11) ) x I x Ttexp(-2.38) Here Wt is in mm3/min and Tt is melting point of the electrode material in K-273.15K Finally, the wear ratio of the workpiece to electrode R can be obtained from: R = 2.25 x Trexp(-2.38) Here Tr is the ratio of melting points of workpiece to electrode. SINKER EDM : Sinker EDM, also referred to as CAVITY TYPE EDM or VOLUME EDM, consists of an electrode and workpiece submerged in an insulating liquid. The electrode and workpiece are connected to a power supply. The power supply generates an electrical potential between the two. As the electrode approaches the workpiece, dielectric breakdown occurs in the fluid, forming a plasma channel, and a small spark jumps. The sparks usually strike one at a time because it is highly unlikely that different locations in the inter-electrode space have identical local electrical characteristics which would enable a spark to occur in all such locations simultaneously. Hundreds of thousands of these sparks happen at random points between the electrode and the workpiece per second. As the base metal erodes, and the spark gap subsequently increases, the electrode is lowered automatically by our CNC machine so that the process can continue uninterrupted. Our equipment has controlling cycles known as ''on time'' and ''off time''. The on time setting determines the length or duration of the spark. A longer on time produces a deeper cavity for that spark and all subsequent sparks for that cycle, creating a rougher finish on the workpiece and vice versa. The off time is the period of time that one spark is replaced by another. A longer off time permits the dielectric fluid to flush through a nozzle to clean out the eroded debris, thereby avoiding a short circuit. These settings are adjusted in micro seconds. WIRE EDM : In WIRE ELECTRICAL DISCHARGE MACHINING (WEDM), also called WIRE-CUT EDM or WIRE CUTTING, we feed a thin single-strand metal wire of brass through the workpiece, which is submerged in a tank of dielectric fluid. Wire EDM is an important variation of EDM. We occasionally use wire-cut EDM to cut plates as thick as 300mm and to make punches, tools, and dies from hard metals that are difficult to machine with other manufacturing methods. In this process which resembles to contour cutting with a band saw, the wire, which is constantly fed from a spool, is held between upper and lower diamond guides. The CNC-controlled guides move in the x–y plane and the upper guide can also move independently in the z–u–v axis, giving rise to the ability to cut tapered and transitioning shapes (such as circle on the bottom and square at the top). The upper guide can control axis movements in x–y–u–v–i–j–k–l–. This allows the WEDM to cut very intricate and delicate shapes. The average cutting kerf of our equipment that achieves the best economic cost and machining time is 0.335 mm using Ø 0.25 brass, copper or tungsten wire. However the upper and lower diamond guides of our CNC equipment are accurate to about 0.004 mm, and can have a cutting path or kerf as small as 0.021 mm using Ø 0.02 mm wire. So really narrow cuts are possible. The cutting width is greater than the width of the wire because sparking occurs from the sides of the wire to the workpiece, causing erosion. This ''overcut'' is necessary, for many applications it is predictable and therefore can be compensated for ( in micro-EDM this is not often the case). The wire spools are long—an 8 kg spool of 0.25 mm wire is just over 19 kilometers in length. Wire diameter can be as small as 20 micrometres and the geometry precision is in the neighborhood of +/- 1 micrometer. We generally use the wire only once and recycle it because it is relatively inexpensive. It travels at a constant velocity of 0.15 to 9m/min and a constant kerf (slot) is maintained during a cut. In the wire-cut EDM process we use water as the dielectric fluid, controlling its resistivity and other electrical properties with filters and de-ionizer units. The water flushes the cut debris away from the cutting zone. Flushing is an important factor in determining the maximum feed rate for a given material thickness and therefore we keep it consistent. Cutting speed in wire EDM is stated in terms of the cross-sectional area cut per unit time, such as 18,000 mm2/hr for 50mm thick D2 tool steel. The linear cutting speed for this case would be 18,000/50 = 360mm/hr The material removal rate in wire EDM is: MRR = Vf x h x b Here MRR is in mm3/min, Vf is the feed rate of the wire into workpiece in mm/min, h is thickness or height in mm, and b is the kerf, which is: b = dw + 2s Here dw is wire diameter and s is gap between wire and workpiece in mm. Along with tighter tolerances, our modern multi axis EDM wire-cutting machining centers have added features such as multi heads for cutting two parts at the same time, controls for preventing wire breakage, automatic self-threading features in case of wire breakage, and programmed machining strategies to optimize the operation, straight and angular cutting capabilities. Wire-EDM offers us low residual stresses, because it does not require high cutting forces for removal of material. When the energy/power per pulse is relatively low (as in finishing operations), little change in the mechanical properties of a material is expected due to low residual stresses. ELECTRICAL-DISCHARGE GRINDING (EDG) : The grinding wheels do not contain abrasives, they are made of graphite or brass. Repetitive sparks between the rotating wheel and workpiece remove material from workpiece surfaces. The material removal rate is: MRR = K x I Here MRR is in mm3/min, I is current in Amperes, and K is workpiece material factor in mm3/A-min. We frequently use electrical-discharge grinding to saw narrow slits on components. We sometimes combine EDG (Electrical-Discharge Grinding) process with ECG (Electrochemical Grinding) process where material is removed by chemical action, the electrical discharges from the graphite wheel breaking up the oxide film and washed away by the electrolyte. The process is called ELECTROCHEMICAL-DISCHARGE GRINDING (ECDG). Even though the ECDG process consumes relatively more power, it is a faster process than the EDG. We mostly grind carbide tools using this technique. Applications of Electrical Discharge Machining: Prototype production: We use the EDM process in mold-making, tool and die manufacturing, as well as for making prototype and production parts, especially for the aerospace, automobile and electronics industries in which production quantities are relatively low. In Sinker EDM, a graphite, copper tungsten or pure copper electrode is machined into the desired (negative) shape and fed into the workpiece on the end of a vertical ram. Coinage die making: For the creation of dies for producing jewelry and badges by the coinage (stamping) process, the positive master may be made from sterling silver, since (with appropriate machine settings) the master is significantly eroded and is used only once. The resultant negative die is then hardened and used in a drop hammer to produce stamped flats from cutout sheet blanks of bronze, silver, or low proof gold alloy. For badges these flats may be further shaped to a curved surface by another die. This type of EDM is usually performed submerged in an oil-based dielectric. The finished object may be further refined by hard (glass) or soft (paint) enameling and/or electroplated with pure gold or nickel. Softer materials such as silver may be hand engraved as a refinement. Drilling of Small Holes: On our wire-cut EDM machines, we use small hole drilling EDM to make a through hole in a workpiece through which to thread the wire for the wire-cut EDM operation. Separate EDM heads specifically for small hole drilling are mounted on our wire-cut machines which allow large hardened plates to have finished parts eroded from them as needed and without pre-drilling. We also use small hole EDM to drill rows of holes into the edges of turbine blades used in jet engines. Gas flow through these small holes allows the engines to use higher temperatures than otherwise possible. The high-temperature, very hard, single crystal alloys these blades are made of makes conventional machining of these holes with high aspect ratio extremely difficult and even impossible. Other application areas for small hole EDM is to create microscopic orifices for fuel system components. Besides the integrated EDM heads, we deploy stand-alone small hole drilling EDM machines with x–y axes to machine blind or through holes. EDM drills bore holes with a long brass or copper tube electrode that rotates in a chuck with a constant flow of distilled or deionized water flowing through the electrode as a flushing agent and dielectric. Some small-hole drilling EDMs are able to drill through 100 mm of soft or even hardened steel in less than 10 seconds. Holes between 0.3 mm and 6.1 mm can be achieved in this drilling operation. Metal disintegration machining: We also have special EDM machines for the specific purpose of removing broken tools (drill bits or taps) from work pieces. This process is called ''metal disintegration machining''. Advantages and Disadvantages Electrical-Discharge Machining: Advantages of EDM include machining of: - Complex shapes that would otherwise be difficult to produce with conventional cutting tools - Extremely hard material to very close tolerances - Very small work pieces where conventional cutting tools may damage the part from excess cutting tool pressure. - There is no direct contact between tool and work piece. Therefore delicate sections and weak materials can be machined without any distortion. - A good surface finish can be obtained. - Very fine holes can be easily drilled. Disadvantages of EDM include: - The slow rate of material removal. - The additional time and cost used for creating electrodes for ram/sinker EDM. - Reproducing sharp corners on the workpiece is difficult due to electrode wear. - Power consumption is high. - ''Overcut'' is formed. - Excessive tool wear occurs during machining. - Electrically non-conductive materials can be machined only with specific set-up of the process. KLIK Product Finder-Locator Service PAGE sadurunge

Micromanufacturing, Nanomanufacturing, Mesomanufacturing - Electronic & Magnetic Optical & Coatings, Thin Film, Nanotubes, MEMS, Microscale Fabrication Manufaktur Nanoscale & Microscale & Mesoscale Waca liyane Our NANOMANUFACTURING, MICROMANUFACTURING and MESOMANUFACTURING processes can be categorized as: Surface Treatments and Modification Functional Coatings / Decorative Coatings / Thin Film / Thick Film Nanoscale Manufacturing / Nanomanufacturing Microscale Manufacturing / Micromanufacturing / Micromachining Mesoscale Manufacturing / Mesomanufacturing Microelectronics & Semiconductor Manufacturing and Fabrication Microfluidic Devices Manufacturing Micro-Optics Manufacturing Micro Assembly and Packaging Soft Lithography In every smart product designed today, one can consider an element that will increase efficiency, versatility, reduce power consumption, reduce waste, increase lifetime of the product and thus be environmentally friendly. For this purpose, AGS-TECH is focusing on a number of processes and products that can be incorporated into devices and equipment to achieve these goals. For example low-friction FUNCTIONAL COATINGS can reduce power consumption. Some other functional coating examples are scratch resistant coatings, anti-wetting SURFACE TREATMENTS and coatings (hydrophobic), wetness promoting (hydrophilic) surface treatment and coatings, anti-fungal coatings, diamond like carbon coatings for cutting and scribing tools, THIN FILMelectronic coatings, thin film magnetic coatings, multilayer optical coatings. In NANOMANUFACTURING or NANOSCALE MANUFACTURING, we produce parts at nanometer length scales. In practice it refers to manufacturing operations below micrometer scale. Nanomanufacturing is still in its infancy when compared to micromanufacturing, however the trend is in that direction and nanomanufacturing is definitely very important for the near future. Some applications of nanomanufacturing today are carbon nanotubes as reinforcing fibers for composite materials in bicycle frames, baseball bats and tennis racquets. Carbon nanotubes, depending on the orientation of the graphite in the nanotube, can act as semiconductors or conductors. Carbon nanotubes have very high current-carrying capability, 1000 times higher than silver or copper. Another application of nanomanufacturing is nanophase ceramics. By using nanoparticles in producing ceramic materials, we can simultaneously increase both the strength and ductility of the ceramic. Please click on the submenu for more information. MICROSCALE MANUFACTURING or MICROMANUFACTURING refers to our manufacturing and fabrication processes on a microscopic scale not visible to the naked eye. The terms micromanufacturing, microelectronics, microelectromechanical systems are not limited to such small length scales, but instead, suggest a material and manufacturing strategy. In our micromanufacturing operations some popular techniques we use are lithography, wet and dry etching, thin film coating. A wide variety of sensors & actuators, probes, magnetic hard-drive heads, microelectronic chips, MEMS devices such as accelerometers and pressure sensors among others are manufactured using such micromanufacturing methods. You will find more detailed information on these in the submenus. MESOSCALE MANUFACTURING or MESOMANUFACTURING refers to our processes for fabrication of miniature devices such as hearing aids, medical stents, medical valves, mechanical watches and extremely small motors. Mesoscale manufacturing overlaps both macro and micromanufacturing. Miniature lathes, with 1.5 Watt motor and dimensions of 32 x 25 x 30.5 mm and weights of 100 grams have been fabricated using mesoscale manufacturing methods. Using such lathes, brass has been machined to a diameter as small as 60 microns and surface roughnesses in the order of a micron or two. Other such miniature machine tools such as milling machines and presses have also been manufactured using mesomanufacturing. In MICROELECTRONICS MANUFACTURING we use the same techniques as in micromanufacturing. Our most popular substrates are silicon, and others like gallium arsenide, Indium Phosphide and Germanium are also used. Films/coatings of many types and especially conducting and insulating thin film coatings are used in the fabrication of microelectronic devices and circuits. These devices are usually obtained from multilayers. Insulating layers are generally obtained by oxidation such as SiO2. Dopants (both p and n) type are common and parts of the devices are doped in order to alter their electronic properties and obtain p and n type regions. Using lithography such as ultraviolet, deep or extreme ultraviolet photolithography, or X-ray, electron beam lithography we transfer geometric patterns defining the devices from a photomask/mask to the substrate surfaces. These lithography processes are applied several times in the micromanufacturing of microelectronic chips in order to achieve the required structures in the design. Also etching processes are carried out by which entire films or particular sections of films or substrate are removed. Briefly, by using various deposition, etching and multiple lithographic steps we obtain the multilayer structures on the supporting semiconductor substrates. After the wafers are processed and many circuits are microfabricated on them, the repetitive parts are cut and individual dies are obtained. Each die is thereafter wire bonded, packaged and tested and becomes a commercial microelectronic product. Some more details of microelectronics manufacturing can be found in our submenu, however the subject is very extensive and therefore we encourgae you to contact us in case you need product specific information or more details. Our MICROFLUIDICS MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In microfluidics we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. We have the capability to design microfluidic devices for you and offer microfluidics prototyping & micromanufacturing custom tailored for your applications. Another promising field in microfabrication is MICRO-OPTICS MANUFACTURING. Micro-optics allows the manipulation of light and the management of photons with micron and sub-micron scale structures and components. Micro-optics allows us to interface the macroscopic world we live in with the microscopic world of opto- and nano-electronic data processing. Micro-optical components and subsystems find widespread applications in the following fields: Information technology: In micro-displays, micro-projectors, optical data storage, micro-cameras, scanners, printers, copiers…etc. Biomedicine: Minimally-invasive/point of care diagnostics, treatment monitoring, micro-imaging sensors, retinal implants. Lighting: Systems based on LEDs and other efficient light sources Safety and Security Systems: Infrared night vision systems for automotive applications, optical fingerprint sensors, retinal scanners. Optical Communication & Telecommunication: In photonic switches, passive fiber optic components, optical amplifiers, mainframe and personal computer interconnect systems Smart structures: In optical fiber-based sensing systems and much more As the most diverse engineering integration provider we pride ourselves with our capability to provide a solution for almost any consulting, engineering, reverse engineering, rapid prototyping, product development, manufacturing, fabrication and assembly needs. After micromanufacturing our components, very often we need to continue with MICRO ASSEMBLY & PACKAGING. This involves processes such as die attachment, wire bonding, connectorization, hermetic sealing of packages, probing, testing of packaged products for environmental reliability…etc. After micromanufacturing devices on a die, we attach the die to a more rugged foundation to ensure reliability. Frequently we use special epoxy cements or eutectic alloys to bond the die to its package. After the chip or die is bonded to its substrate, we connect it electrically to the package leads using wire bonding. One method is to use very thin gold wires from the package leads to bonding pads located around the perimeter of the die. Lastly we need to do the final packaging of the connected circuit. Depending on the application and operating environment, a variety of standard and custom manufactured packages are available for micromanufactured electronic, electro-optic, and microelectromechanical devices. Another micromanufacturing technique we use is SOFT LITHOGRAPHY, a term used for a number of processes for pattern transfer. A master mold is needed in all cases and is microfabricated using standard lithography methods. Using the master mold, we produce an elastomeric pattern / stamp. One variation of soft lithography is “microcontact printing”. The elastomer stamp is coated with an ink and pressed against a surface. The pattern peaks contact the surface and a thin layer of about 1 monolayer of the ink is transfered. This thin film monolayer acts as the mask for selective wet etching. A second variation is “microtransfer molding”, in which the recesses of the elastomer mold are filled with liquid polymer precursor and pushed against a surface. Once the polymer cures, we peel off the mold, leaving behind the desired pattern. Lastly a third variation is “micromolding in capillaries”, where the elastomer stamp pattern consists of channels that use capillary forces to wick a liquid polymer into the stamp from its side. Basically, a small amount of the liquid polymer is placed adjacent to the capillary channels and the capillary forces pull the liquid into the channels. Excess liquid polymer is removed and polymer inside the channels is allowed to cure. The stamp mold is peeled off and the product is ready. You can find more details about our soft lithography micromanufacturing techniques by clicking on the related submenu on the side of this page. If you are mostly interested in our engineering and research & development capabilities instead of manufacturing capabilities, then we invite you to also visit our engineering website http://www.ags-engineering.com Waca liyane Waca liyane Waca liyane Waca liyane Read More Waca liyane Waca liyane Waca liyane Waca liyane KLIK Product Finder-Locator Service PAGE sadurunge

Vibration Meter - Tachometer - Accelerometer -Vibrometer- Nondestructive Testing - SADT-Mitech- AGS-TECH Inc. - NM - USA Pengukur Getaran, Tachometer VIBRATION METERS and NON-CONTACT TACHOMETERS are widely used in inspection, manufacturing, production, laboratory and R&D. Please download catalogs from colored links below and let us know the brand name and model number of the product of your choice. We can offer you brand new as well as refurbished / used vibration meters, tachometers at the most competitive prices: FLUKE Test Tools Catalog (includes vibration meters, vibration testers, laser shaft alignment tool) SADT-SINOAGE Brand Metrology and Test Equipment, please CLICK HERE. In this catalog you will find some high quality vibration meters and tachometers. The vibration meter is used to measure vibrations and oscillations in machines, installations, tools or components. Measurements of the vibration meter provides the following parameters: vibration acceleration, vibration velocity and vibration displacement. This way the vibration is recorded with great precision. They are mostly portable devices and the readings can be stored and retrieved for later use. Critical frequencies which can cause damage or disturbing noise level may be detected using a vibration meter. We sell and service a number of vibration meter and non-contact tachometer brands including SINOAGE, SADT. Modern versions of these test instruments are capable of simultaneously measuring and recording a variety of parameters such as temperature, humidity, pressure, 3-axis acceleration and light; their data logger record over millions of measured values, have optional microSD cards making the able to record even over a billion measured values. Many have selectable parameters, housings, external sensors, and USB-interfaces. WIRELESS VIBRATION METERS provide the comfort of transmitting data wirelessly from the tested machine to the receiver for inspection and analysis. VIBRATION TRANSMITTERS are perfect solutions for continuous monitoring. A vibration transmitter can be used for vibration monitoring of equipment in remote or hazardous locations. They are designed in rugged NEMA 4 rated cases. Programmable version are available. Other versions include the POCKET ACCELEROMETER to measure vibration velocity in machines and installations. MULTICHANNEL VIBRATION METERS to perform vibration measurements on multiple places at the same time. The vibration velocity, acceleration and expansion in a wide frequency range can be measured. The cables of the vibration sensors are long, so the vibration measuring device is able to record vibrations at different points of the component to be tested. Many vibration meters are used primarily to determine vibrations in machines and installations revealing vibration acceleration, vibration velocity and vibration displacement. With the help of these vibration meters, the technicians are able to quickly determine the current state of the machine and the causes of the vibrations, and make the necessary adjustments and assess new conditions afterwards. However some vibration meter models can be used in the same way, but they also have functions to analyze the FAST FOURIER TRANSFORM (FFT) and display if any specific frequencies are occurring within the vibrations. These are used preferably for investigation development of machines and installations or to take measurements over a period of time in a test environment. The Fast Fourier Transform (FFT) models can also determine and analyze the 'Harmonics' with ease and precision. Vibration meters are normally used for the control rotational axis of machinery so the technicians are able to determine and evaluate the development of an axis with accuracy. In cases of emergency, the axis may be modified and changed during a scheduled pause of the machine. Many factors can cause excessive vibration in rotating machinery such as worn out bearings and couplings, foundation damage, broken mounting bolts, misalignment and unbalance. A well scheduled vibration measurement procedure helps to detect and eliminate these failures early on before any serious machine problems occur. A TACHOMETER (also called a revolution-counter, RPM gauge) is an instrument that measures the rotation speed of a shaft or disk, as in a motor or machine. These devices display the revolutions per minute (RPM) on a calibrated analogue or digital dial or display. The term tachometer is usually restricted to mechanical or electrical instruments that indicate instantaneous values of speed in revolutions per minute, rather than devices that count the number of revolutions in a measured time interval and indicate only average values for the interval. There are CONTACT TACHOMETERS as well as NON-CONTACT TACHOMETERS (also referred to as a PHOTO TACHOMETER or LASER TACHOMETER or INFRARED TACHOMETER depending on the light source used). Yet some others are referred to as COMBINATION TACHOMETERS combining a contact and photo tachometer in one unit. Modern combination tachometers show reverse direction characters on display depending on contact or photo mode, use visible light to read several inches of distance from target, the memory/readings button holds the last reading and recalls min/max readings. Just as with vibration meters, there are many models of tachometers including multi-channel instruments for measuring speed at multiple locations simultaneously, wireless versions for providing information from remote locations….etc. RPM ranges for modern instruments vary from a few RPMs to hundred or hundreds of thousands of RPM values, they offer automatic range selection, auto-zero adjustment, values such as +/- 0.05% accuracy. Our vibration meters and non-contact tachometers from SADT are: Portable Vibration Meter SADT Model EMT220 : Integrated vibration transducer, annular shear type acceleration transducer (only for integrated type), separate, built-in electric charge amplifier, shear type acceleration transducer (only for separate type), temperature transducer, type K thermoelectric couple transducer (only for EMT220 with temperature measuring function). Device has root mean square detector, vibration measurement scale for displacement is 0.001~1.999 mm (peak to peak), for velocity is 0.01~19.99 cm/s (rms value), for acceleration is 0.1~199.9 m/s2 (peak value), for vibration acceleration is 199.9 m/s2 (peak value). Temperature measurement scale is -20~400°C (only for EMT220 with temperature-measuring function). Accuracy for vibration measurement: ±5% Measurement value ±2 Digits. Temperature measurement: ±1% Measurement value ±1 Digit, Vibration Frequency Range: 10~1 kHz (Normal type) 5~1 kHz (Low frequency type) 1~15 kHz (only at “HI” position for acceleration). Display is liquid crystal display (LCD), Sample period: 1 second, vibration measurement value readout: Displacement: Peak to peak value (r.m.s.×2squareroot2), Velocity: Root mean square (r.m.s.), Acceleration: Peak value (r.m.s.×squareroot 2), Readout-keeping function: Readout of vibration / temperature value can be remembered after releasing the Measure Key (Vibration / Temperature Switch), Output Signal: 2V AC (peak value) (load resistance above 10 k at full measuring scale), Power supply: 6F22 9V laminated cell, battery life about 30 hours for continuous use, Power on / off: Power up when pressing Measure Key (Vibration / Temperature Switch), power automatically shuts off after releasing the Measure Key for one minute, Operating conditions: Temperature: 0~50°C, Humidity: 90% RH , Dimensions:185mm×68mm×30mm, Net weight:200g Portable Optical Tachometer SADT Model EMT260 : Unique ergonomic design provides direct line-of-sight viewing of display and target, easily readable 5 digit LCD display, on-target and low battery indicator, maximum, minimum and last measurement of rotational speed, frequency, cycle, linear speed and counter. Speed Ranges: Rotational speed:1~99999r/min, Frequency: 0.0167~1666.6Hz, Cycle:0.6~60000ms, Counter:1~99999, Linear speed:0.1~3000.0m/min, 0.0017~16.666m/s, Accuracy:±0.005% of reading, Display:5 digit LCD display, Input signal:1-5VP-P Pulse Input, Output signal: TTL compatible Pulse Output, Power:2x1.5V batteries, Dimensions (LxWxH): 128mmx58mmx26mm, Net weight:90g For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com KLIK Product Finder-Locator Service PAGE sadurunge

Functional & Decorative Coatings, Thin Film, Thick Films, Antireflective and Reflective Mirror Coating - AGS-TECH Inc. Lapisan Fungsional / Lapisan Dekoratif / Film Tipis / Film Tebal A COATING is a covering that is applied to the surface of an object. Coatings can be in the form of THIN FILM (less than 1 micron thick) or THICK FILM (over 1 micron thick). Based on the purpose of applying the coating we can offer you DECORATIVE COATINGS and/or FUNCTIONAL COATINGS, or both. Sometimes we apply functional coatings to change the surface properties of the substrate, such as adhesion, wettability, corrosion resistance, or wear resistance. In some other cases such as in semiconductor device fabrication, we apply the functional coatings to add a completely new property such as magnetization or electrical conductivity which become an essential part of the finished product. Our most popular FUNCTIONAL COATINGS are: Adhesive Coatings: Examples are adhesive tape, iron-on fabric. Other functional adhesive coatings are applied to change the adhesion properties, such as non-stick PTFE coated cooking pans, primers that encourage subsequent coatings to adhere well. Tribological Coatings: These functional coatings relate to the principles of friction, lubrication and wear. Any product where one material slides or rubs over another is affected by complex tribological interactions. Products like hip implants and other artificial prosthesis are lubricated in certain ways whereas other products are unlubricated as in high temperature sliding components where conventional lubricants can not be used. The formation of compacted oxide layers have been proven to protect against wear of such sliding mechanical parts. Tribological functional coatings have huge benefits in industry, minimizing wear of machine elements, minimizing wear and tolerance deviations in manufacturing tools such as dies and moulds, minimizing power requirements and making machinery and equipment more energy efficient. Optical Coatings: Examples are Anti-reflective (AR) coatings, reflective coatings for mirrors, UV- absorbent coatings for protection of eyes or for increasing the life of the substrate, tinting used in some colored lighting, tinted glazing and sunglasses. Catalytic Coatings such as applied on self-cleaning glass. Light-Sensitive Coatings used to make products such as photographic films Protective Coatings: Paints can be considered protecting the products besides being decorative in purpose. Hard anti-scratch coatings on plastics and other materials are one of our most widely used functional coatings to reduce scratching, improve wear resistance, …etc. Anti-corrosion coatings such as plating are also very popular. Other protective functional coatings are put on waterproof fabric and paper, antimicrobial surface coatings on surgical tools and implants. Hydrophilic / Hydrophobic Coatings: Wetting (hydrophilic) and unwetting (hydrophobic) functional thin and thick films are important in applications where water absorption is either desired or undesired. Using advanced technology we can alter your product surfaces, to make them either easily wettable or unwettable. Typical applications are in textiles, dressings, leather boots, pharmaceutical or surgical products. Hydrophilic nature refers to a physical property of a molecule that can transiently bond with water (H2O) through hydrogen bonding. This is thermodynamically favorable, and makes these molecules soluble not only in water, but also in other polar solvents. Hydrophilic and hydrophobic molecules are also known as polar molecules and nonpolar molecules, respectively. Magnetic Coatings: These functional coatings add magnetic properties such as is the case for magnetic floppy disks, cassettes, magnetic stripes, magnetooptic storage, inductive recording media, magnetoresist sensors, and thin-film heads on products. Magnetic thin films are sheets of magnetic material with thicknesses of a few micrometers or less, used primarily in the electronics industry. Magnetic thin films can be single-crystal, polycrystalline, amorphous, or multilayered functional coatings in the arrangement of their atoms. Both ferro- and ferrimagnetic films are used. The ferromagnetic functional coatings are usually transition-metal-based alloys. For example, permalloy is a nickel-iron alloy. The ferrimagnetic functional coatings, such as garnets or the amorphous films, contain transition metals such as iron or cobalt and rare earths and the ferrimagnetic properties are advantageous in magnetooptic applications where a low overall magnetic moment can be achieved without a significant change in the Curie temperature. Some sensor elements function on the principle of change in electrical properties, such as the electrical resistance, with a magnetic field. In semiconductor technology, the magnetoresist head used in disk storage technology functions with this principle. Very large magnetoresist signals (giant magnetoresistance) are observed in magnetic multilayers and composites containing a magnetic and nonmagnetic material. Electrical or Electronic Coatings: These functional coatings add electrical or electronic properties such as conductivity to manufacture products such as resistors, insulation properties such as in the case of magnet wire coatings used in transformers. DECORATIVE COATINGS: When we speak of decorative coatings the options are only limited by your imagination. Both thick and thin film type coatings have been successfully engineered and applied in the past to our customers products. Regardless of the difficulty in the geometric shape and material of the substrate and application conditions, we are always capable to formulate the chemistry, physical aspects such as exact Pantone code of color and application method for your desired decorative coatings. Complex patterns involving shapes or different colors are also possible. We can make your plastic polymer parts look metallic. We can color anodize extrusions with various patterns and it won’t even look anodized. We can mirror coat an oddly-shaped part. Furthermore decorative coatings can be formulated that will also act as functional coatings at the same time. Any of the below mentioned thin and thick film deposition techniques used for functional coatings can be deployed for decorative coatings. Here are some of our popular decorative coatings: - PVD Thin Film Decorative Coatings - Electroplated Decorative Coatings - CVD and PECVD Thin Film Decorative Coatings - Thermal Evaporation Decorative Coatings - Roll-to-Roll Decorative Coating - E-Beam Oxide Interference Decorative Coatings - Ion Plating - Cathodic Arc Evaporation for Decorative Coatings - PVD + Photolithography, Heavy Gold Plating on PVD - Aerosol Coatings for Glass Coloring - Anti-tarnish Coating - Decorative Copper-Nickel-Chrome Systems - Decorative Powder Coating - Decorative Painting, Custom Tailored Paint Formulations using Pigments, Fillers, Colloidal Silica Dispersant...etc. If you contact us with your requirements for decorative coatings, we can provide you our expert opinion. We have advanced tools such as color readers, color comparators….etc. to guarantee consistent quality of your coatings. THIN and THICK FILM COATING PROCESSES: Here are the most widely used of our techniques. Electro-Plating / Chemical Plating (hard chromium, chemical nickel) Electroplating is the process of plating one metal onto another by hydrolysis, for decorative purposes, corrosion prevention of a metal or other purposes. Electroplating lets us use inexpensive metals such as steel or zinc or plastics for the bulk of the product and then apply different metals on the outside in the form of a film for better appearance, protection, and for other properties desired for the product. Electroless plating, also known as chemical plating, is a non-galvanic plating method that involves several simultaneous reactions in an aqueous solution, which occur without the use of external electrical power. The reaction is accomplished when hydrogen is released by a reducing agent and oxidized, thus producing a negative charge on the surface of the part. Advantages of these thin and thick films are good corrosion resistance, low processing temperature, possibility to deposit in bore holes, slots… etc. Disadvantages are the limited selection of coating materials, relatively soft nature of the coatings, environmentally polluting treatment baths that are needed including chemicals such as cyanide, heavy metals, fluorides, oils, limited accuracy of surface replication. Diffusion Processes (Nitriding, nitrocarburization, boronizing, phosphating, etc.) In heat treatment furnaces, the diffused elements usually originate from gases reacting at high temperatures with the metal surfaces. This can be a pure thermal and chemical reaction as a consequence of the thermal dissociation of the gases. In some cases, diffused elements originate from solids. The advantages of these thermochemical coating processes are good corrosion resistance, good reproducibility. The disadvantages of these are being relatively soft coatings, limited selection of base material (which must be suitable for nitriding), long processing times, environmental and health hazards involved, requirement of post-treatment. CVD (Chemical Vapor Deposition) CVD is a chemical process used to produce high quality, high-performance, solid coatings. The process produces thin films too. In a typical CVD, the substrates are exposed to one or more volatile precursors, that react and/or decompose on the substrate surface to produce the desired thin film. Advantages of these thin & thick films are their high wear resistance, potential to economically produce thicker coatings, suitability for bore holes, slots ….etc. Disadvantages of CVD processes are their high processing temperatures, difficulty or impossibility of coatings with multiple metals (such as TiAlN), rounding of edges, use of environmentally hazardous chemicals. PACVD / PECVD (Plasma-Assisted Chemical Vapor Deposition) PACVD is also called PECVD standing for Plasma Enhanced CVD. Whereas in a PVD coating process the thin & thick film materials are evaporated from a solid form, in PECVD the coating results from a gas phase. Precursor gasses are cracked in the plasma to become available for the coating. Advantages of this thin and thick film deposition technique is that significantly lower process temperatures are possible as compared to CVD, precise coatings are deposited. Disadvantages of PACVD are that it has only limited suitability for bore holes, slots etc. PVD (Physical Vapor Deposition) PVD processes are a variety of purely physical vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto workpiece surfaces. Sputtering and evaporative coatings are examples of PVD. Advantages are that no environmentally damaging materials and emissions are produced, a large variety of coatings can be produced, coating temperatures are below the final heat treatment temperature of most steels, precisely reproducible thin coatings, high wear resistance, low frictional coefficient. Disadvantages are bore holes, slots ...etc. can only be coated down to a depth equal to the diameter or width of the opening, corrosion resistant only under certain conditions, and for obtaining uniform film thicknesses, parts must be rotated during deposition. The adhesion of functional and decorative coatings are substrate dependent. Furthermore, the lifetime of thin and thick film coatings depends on environmental parameters such as humidity, temperature...etc. Therefore, before considering a functional or decorative coating, contact us for our opinion. We can choose the most suitable coating materials and coating technique that fits your substrates and application and deposit them under the strictest quality standards. Contact AGS-TECH Inc. for details of thin and thick film deposition capabilities. Do you need design assistance ? Do you need prototypes ? Do you need mass manufacturing ? We are here to help you. Click on blue colored text below to download product catalogs and brochures: - Private Label Nano Surface Protection Car Care Products We can label these products with your name and logo if you wish - Private Label Nano Surface Industrial Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Marine Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Products We can label these products with your name and logo if you wish KLIK Product Finder-Locator Service PAGE sadurunge

Soft Lithography - Microcontact Printing - Microtransfer Molding - Micromolding in Capillaries - AGS-TECH Inc. - NM - USA Lithography alus SOFT LITHOGRAPHY is a term used for a number of processes for pattern transfer. A master mold is needed in all cases and is microfabricated using standard lithography methods. Using the master mold, we produce an elastomeric pattern / stamp to be used in soft lithography. Elastomers used for this purpose need to be chemically inert, have good thermal stability, strength, durability, surface properties and be hygroscopic. Silicone rubber and PDMS (Polydimethylsiloxane) are two good candidate materials. These stamps can be used many times in soft lithography. One variation of soft lithography is MICROCONTACT PRINTING. The elastomer stamp is coated with an ink and pressed against a surface. The pattern peaks contact the surface and a thin layer of about 1 monolayer of the ink is transferred. This thin film monolayer acts as the mask for selective wet etching. A second variation is MICROTRANSFER MOLDING, in which the recesses of the elastomer mold are filled with liquid polymer precursor and pushed against a surface. Once the polymer cures after microtransfer molding, we peel off the mold, leaving behind the desired pattern. Lastly a third variation is MICROMOLDING IN CAPILLARIES, where the elastomer stamp pattern consists of channels that use capillary forces to wick a liquid polymer into the stamp from its side. Basically, a small amount of the liquid polymer is placed adjacent to the capillary channels and the capillary forces pull the liquid into the channels. Excess liquid polymer is removed and polymer inside the channels is allowed to cure. The stamp mold is peeled off and the product is ready. If the channel aspect ratio is moderate and the channel dimensions allowed depend on the liquid used, good pattern replication can be assured. The liquid used in micromolding in capillaries can be thermosetting polymers, ceramic sol-gel or suspensions of solids within liquid solvents. The micromolding in capillaries technique has been used in sensor manufacturing. Soft lithography is used to construct features measured on the micrometer to nanometer scale. Soft lithography has advantages over other forms of lithography like photolithography and electron beam lithography. The advantages include the following: • Lower cost in mass production than traditional photolithography • Suitability for applications in biotechnology and plastic electronics • Suitability for applications involving large or nonplanar (nonflat) surfaces • Soft lithography offers more pattern-transferring methods than traditional lithography techniques (more ''ink'' options) • Soft lithography does not need a photo-reactive surface to create nanostructures • With soft lithography we can achieve smaller details than photolithography in laboratory settings (~30 nm vs ~100 nm). The resolution depends on the mask used and can reach values down to 6 nm. MULTILAYER SOFT LITHOGRAPHY is a fabrication process in which microscopic chambers, channels, valves and vias are molded within bonded layers of elastomers. Using multilayer soft lithography devices consisting of multiple layers may be fabricated from soft materials. The softness of these materials allows the device areas to be reduced by more than two orders of magnitude compared with silicon-based devices. The other advantages of soft lithography, such as rapid prototyping, ease of fabrication, and biocompatibility, are also valid in multilayer soft lithography. We use this technique to build active microfluidic systems with on-off valves, switching valves, and pumps entirely out of elastomers. KLIK Product Finder-Locator Service PAGE sadurunge

Automation and Intelligent Systems, Artificial Intelligence, AI, Embedded Systems, Internet of Things, IoT, Industrial Control Systems, Automatic Control, Janz Otomasi & Sistem Cerdas AUTOMATION also referred to as AUTOMATIC CONTROL, is the use of various CONTROL SYSTEMS for operating equipment such as factory machines, heat treating and curing ovens, telecommunication equipment, …etc. with minimal or reduced human intervention. Automation is achieved by using various means including mechanical, hydraulic, pneumatic, electrical, electronic and computers in combination. An INTELLIGENT SYSTEM on the other hand is a machine with an embedded, Internet-connected computer that has the capability to gather and analyze data and communicate with other systems. Intelligent systems require security, connectivity, ability to adapt according to current data, capability for remote monitoring and management. EMBEDDED SYSTEMS are powerful and capable of complex processing and data analysis usually specialized for tasks relevant to the host machine. Intelligent systems are all around in our daily lives. Examples are traffic lights, smart meters, transportation systems and equipment, digital signage. Some brand name products we sell are ATOP TECHNOLOGIES, JANZ TEC, KORENIX, ICP DAS, DFI-ITOX. AGS-TECH Inc. offers you products that you can readily purchase from stock and integrate into your automation or intelligent system as well as custom products designed specifically for your application. As the most diverse ENGINEERING INTEGRATION provider we pride ourselves with our capability to provide a solution for almost any automation or intelligent system needs. Besides products, we are here for your consulting and engineering needs. CLICK ON BLUE COLORED TEXT BELOW TO DOWNLOAD OUR PRODUCT BROCHURES AND CATALOGS: - ATOP TECHNOLOGIES compact product brochure - ATOP Technologies Product List 2021) - Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) - Barcode Scanners (We private label these with your brand name and logo if you wish) - Catalog for Vandal-Proof IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals - DFI-ITOX brand embedded single board computers brochure - Fixed Industrial Scanners (We private label these with your brand name and logo if you wish) - ICP DAS brand industrial communication and networking products brochure - ICP DAS brand Industrial Touch Pad brochure - ICP DAS brand machine automation brochure - ICP DAS brand PACs Embedded Controllers & DAQ brochure - ICP DAS brand PCI Boards and IO Cards - ICP DAS brand Remote IO Modules and IO Expansion Units brochure - JANZ TEC brand compact product brochure - Kiosk Systems (We private label these with your brand name and logo if you wish) - Kiosk Systems Accessories Guide (We private label these with your brand name and logo if you wish) - KORENIX brand compact product brochure - Mobile Computers for Enterprises (We private label these with your brand name and logo if you wish) - Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) - RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Industrial control systems are computer-based systems to monitor and control industrial processes. Some of our INDUSTRIAL CONTROL SYSTEMS (ICS) are: - Supervisory Control and Data Acquisition (SCADA) Systems : These systems operate with coded signals over communication channels to provide control of remote equipment, generally using one communication channel per remote station. The control systems may be combined with data acquisition systems by adding the use of coded signals over communication channels to acquire information about the status of the remote equipment for display or for recording functions. SCADA systems are different from other ICS systems by being large-scale processes that can include multiple sites over large distances. SCADA systems can control industrial processes such as manufacturing and fabrication, infrastructure processes such as transport of oil & gas, electric power transmission, and facility-based processes such as monitoring & control of heating, ventilation, air conditioning systems. - Distributed Control Systems (DCS) : A type of automated control system that is distributed throughout a machine to provide instructions to different parts of the machine. Contrary to having a centrally located device controlling all machines, in distributed control systems each section of a machine has its own computer that controls the operation. DCS systems are commonly used in manufacturing equipment, utilizing input and output protocols to control the machine. Distributed Control Systems typically use custom designed processors as controllers. Both proprietary interconnections as well as standard communications protocols are used for communication. Input and output modules are the component parts of a DCS. Input and output signals may be either analog or digital. Buses connect the processor and modules through multiplexers and demultiplexers. They also connect the distributed controllers with the central controller and to the Human–machine interface. DCS are frequently used in: -Petrochemical and chemical plants -Power plant systems, boilers, nuclear power plants -Environmental control systems -Water management systems -Metal manufacturing plants - Programmable Logic Controllers (PLC) : A Programmable Logic Controller is a small computer with a built-in operating system made primarily to control machinery. PLCs operating systems are specialized to handle incoming events in real time. Programmable Logic Controllers can be programmed. A program is written for the PLC which turns on and off outputs based on input conditions and the internal program. PLCs have input lines where sensors are connected to notify events (such as temperature being above/below a certain level, liquid level reached,… etc.), and output lines to signal any reaction to the incoming events (such as start the engine, open or close a specific valve,… etc.). Once a PLC is programmed, it can run repeatedly as needed. PLCs are found inside of machines in industrial environments and can run automatic machines for many years with little human intervention. They are designed for harsh environments. Programmable Logic Controllers are used extensively in process-based industries, they are computer-based solid-state devices that control industrial equipment and processes. Even though PLCs can control system components used in SCADA and DCS systems, they are often the primary components in smaller control systems. KLIK Product Finder-Locator Service PAGE sadurunge

Industrial Computers - Industrial PC - Rugged Computer - Janz Tec - Korenix - AGS-TECH Inc. - New Mexico - USA Komputer Industri, Komputer Industri Industrial PCs are used mostly for PROCESS CONTROL and/or DATA ACQUISITION. Sometimes, an INDUSTRIAL PC is simply used as a front-end to another control computer in a distributed processing environment. Custom software can be written for a particular application, or if available an off-the-shelf package can be used to provide a basic level of programming. Among the industrial PC brands we offer is JANZ TEC from Germany. An application may simply require the I/O such as the serial port provided by the motherboard. In some cases, expansion cards are installed in order to provide analog and digital I/O, specific machine interface, expanded communications ports,…etc., as required by the application. Industrial PCs offer features different from consumer PCs in terms of reliability, compatibility, expansion options and long-term supply. Industrial PCs are generally manufactured in lower volumes than home or office PCs. A popular category of industrial PC is the 19-INCH RACKMOUNT FORM FACTOR. Industrial PCs are typically more expensive than comparable office style computers with similar performance. SINGLE-BOARD COMPUTERS and BACKPLANES are used primarily in Industrial PC systems. However, the majority of industrial PCs are manufactured with COTS MOTHERBOARDS. Construction and Features of Industrial PCs: Virtually all Industrial PCs share an underlying design philosophy of providing a controlled environment for the installed electronics to survive the rigors of the plant floor. The electronic components themselves may be selected for their ability to withstand higher and lower operating temperatures than typical commercial components. - Heavier and rugged metal construction as compared to the typical office non-rugged computer - Enclosure form factor that includes provision for mounting into the surrounding environment (such as 19'' rack, wall mount, panel mount, etc.) - Additional cooling with air filtering - Alternative cooling methods such as using forced air, a liquid, and/or conduction - Retention and support of expansion cards - Enhanced Electromagnetic Interference (EMI) filtering and gasketing - Enhanced environmental protection such as dust proofing, water spray or immersion proofing, etc. - Sealed MIL-SPEC or Circular-MIL connectors - More robust controls and features - Higher grade power supply - Lower consumption 24 V power supply designed for use with DC UPS - Controlled access to the controls through the use of locking doors - Controlled access to the I/O through the use of access covers - Inclusion of a watchdog timer to reset the system automatically in case of a software lock-up DOWNLOAD OUR BROCHURES AND CATALOGS BY CLICKING ON THE BLUE TEXT BELOW: Catalog for Vandal-Proof IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals ATOP TECHNOLOGIES compact product brochure ATOP Technologies Product List 2021) DFI-ITOX brand Industrial Motherboards brochure DFI-ITOX brand embedded single board computers brochure ICP DAS brand PACs Embedded Controllers & DAQ brochure JANZ TEC brand compact product brochure Kiosk Systems (We private label these with your brand name and logo if you wish) Kiosk Systems Accessories Guide (We private label these with your brand name and logo if you wish) KORENIX brand compact product brochure Mobile Computers for Enterprises (We private label these with your brand name and logo if you wish) To choose a suitable Industrial PC for your project, please go to our industrial computer store by CLICKING HERE. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Some of our popular industrial PC products from Janz Tec AG are: - FLEXIBLE 19'' RACK MOUNT SYSTEMS : The areas of operation and requirements for 19'' systems are very wide within the industry. You can choose between industrial main board technology and slot CPU technology with the use of a passive backplane. - SPACE SAVING WALL MOUNTING SYSTEMS : Our ENDEAVOUR series are flexible industrial PCs incorporating industrial components. As the standard, slot CPU boards with passive backplane technology are used. You can select the product matching your requirements, or you can find out more about individual variations of this product family by contacting us. Our Janz Tec industrial PCs can be combined with conventional industrial control systems or PLC controllers. KLIK Product Finder-Locator Service PAGE sadurunge

Test Equipment for Cookware Testing, Cookware Tester, Cutlery Corrosion Resistance Tester, Strength Test Apparatus for Knives, Forks, Spatulas, Bending Strength Tester for Cookware Handles Peralatan Tes kanggo Tes Peralatan Masak Peralatan Tes Khusus kanggo Tes Peralatan Masak digunakake kanggo nguji produk peralatan masak kayata panci, kompor tekanan....dsb., kanggo mriksa kualitas, daya tahan, fungsionalitas, linuwih, safety, tundhuk karo standar domestik lan internasional....dsb. . Peralatan tes khusus bisa uga: - PERALATAN TES KHUSUS DIRANCANG lan DIPRODUKSI KHUSUS kanggo TES WARGA COOKWARE utawa - OFF-rak SPECIALIZED TEST EQUIPMENT kanggo COOKWARE TESTING Peralatan pengujian khusus sing dirancang khusus dirancang lan dikembangake dening kita kanggo kabutuhan khusus para pelanggan, kanthi nimbang syarat khusus para pelanggan, pasar, tanggung jawab hukum ... etc. Kita kerja bareng karo sampeyan kanggo ngrampungake apa sing dibutuhake lan dikarepake. Insinyur kita ngrancang, prototipe lan entuk persetujuan sadurunge nggawe mesin tes sampeyan. Ing sisih liya, peralatan tes khusus kanggo nguji peralatan masak wis dirancang lan digawe sistem sing bisa dituku kanthi cepet saka kita lan digunakake. Yen sampeyan ngandhani apa sing sampeyan butuhake, kita bakal seneng nuntun sampeyan lan ngusulake sistem siap sing bisa mbantu nggayuh tujuan sampeyan. Peralatan uji khusus kanggo nguji peralatan masak bisa didownload saka tautan warna ing ngisor iki: Katalog Mesin Uji Peralatan Masak Haida Kanggo peralatan liyane sing padha, bukak situs web peralatan kita: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PAGE sadurunge

Embedded Systems, Embedded Computer, Industrial Computers, Janz Tec, Korenix, Industrial Workstations, Servers, Computer Rack, Single Board Computer Sistem Embedded & Komputer Industri & PC Panel Waca liyane Embedded Sistem & Komputer Read More Panel PC, Tampilan Multitouch, Layar Tutul Waca liyane PC industri Read More Workstation Industri Waca liyane Peralatan Jaringan, Perangkat Jaringan, Sistem Penengah, Unit Interworking Waca liyane Piranti Panyimpenan, Array Disk lan Sistem Panyimpenan, SAN, NAS Waca liyane Server Industri Read More Sasis, Rak, Gunung kanggo Komputer Industri Waca liyane Aksesoris, Modul, Papan Carrier kanggo Komputer Industri Read More Otomasi & Sistem Cerdas Minangka pemasok produk industri, kita nawakake sawetara komputer industri & server & jaringan & piranti panyimpenan sing paling penting, komputer lan sistem sing dipasang, komputer papan tunggal, PC panel, PC industri, komputer kasar, komputer layar tutul, workstation industri, komputer industri. komponen & aksesoris, piranti I/O digital lan analog, router, jembatan, peralatan switching, hub, repeater, proxy, firewall, modem, pengontrol antarmuka jaringan, konverter protokol, panyimpenan sing dipasang ing jaringan (NAS), susunan jaringan area panyimpenan (SAN), modul relay multisaluran, pengontrol Full-CAN kanggo soket MODULbus, papan operator MODULbus, modul encoder tambahan, konsep link PLC cerdas, pengontrol motor kanggo motor servo DC, modul antarmuka serial, VMEbus Papan prototyping, pinter profibus DP antarmuka abdi, lunak, electronics related, sasis-rak-mounts. Kita nggawa produk komputer industri paling apik ing donya saka pabrik menyang lawang sampeyan. Kauntungan kita yaiku bisa menehi sampeyan macem-macem jeneng merek kayata Janz Tec lan Korenix kanggo rega dhaptar utawa luwih murah saka toko kita. Uga sing ndadekake kita khusus yaiku kemampuan kanggo menehi sampeyan variasi produk / konfigurasi khusus / integrasi karo sistem liyane sing ora bisa dituku saka sumber liyane. We offer sampeyan jeneng merek peralatan kualitas dhuwur kanggo rega dhaftar utawa ngisor. Ana diskon sing signifikan kanggo rega sing dikirim yen jumlah pesenan sampeyan penting. Umume peralatan kita ana ing saham. Yen ora ana ing saham, amarga kita minangka pengecer lan distributor sing disenengi, kita isih bisa nyedhiyakake ing wektu sing luwih cendhek kanggo sampeyan. Saliyane kanggo item Simpenan kita saged kanggo kurban produk khusus dirancang lan diprodhuksi miturut kabutuhan. Mung supaya kita ngerti apa beda sing perlu ing sistem komputer industri lan kita bakal njaluk iku digawe miturut kabutuhan lan panjalukan. We offer sampeyan CUSTOM MANUFACTURING lan ENGINEERING kapabilitas INTEGRASI. Kita uga mbangun SISTEM OTOMATIS KUSTOM, MONITORING lan SISTEM KONTROL PROSES kanthi nggabungake komputer, tahap terjemahan, tahap rotary, komponen bermotor, senjata, kertu akuisisi data, kertu kontrol proses, sensor, aktuator lan komponen hardware lan piranti lunak liyane sing dibutuhake. Preduli saka lokasi ing bumi, kita kapal ing sawetara dina kanggo lawang. Kita duwe perjanjian pengiriman diskon karo UPS, FEDEX, TNT, DHL lan udara standar. Sampeyan bisa pesen online nggunakake opsi kayata kertu kredit nggunakake akun PayPal, transfer kabel, mriksa certified utawa pesenan dhuwit. Yen sampeyan pengin ngomong karo kita sadurunge nggawe keputusan utawa yen sampeyan duwe pitakon, sampeyan mung kudu nelpon lan salah sawijining insinyur komputer lan otomatisasi sing berpengalaman bakal nulungi sampeyan. Kanggo nyedhaki sampeyan, kita duwe kantor lan gudang ing macem-macem lokasi global. Klik ing submenu sing cocog ing ndhuwur kanggo maca liyane babagan produk kita ing kategori komputer industri. Unduh brosur kanggo PROGRAM KEMITRAAN DESIGN Kanggo informasi sing luwih rinci, kita uga ngajak sampeyan ngunjungi toko komputer industri kita http://www.agsindustrialcomputers.com CLICK Product Finder-Locator Service PAGE sadurunge

Microfluidic Devices - Microfluidics - Micropumps - Microvalves - Lab-on-a-Chip Systems - Microhydraulic - Micropneumatic - AGS-TECH Inc.- New Mexico - USA Manufaktur Piranti Mikrofluida Our MICROFLUIDIC DEVICES MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. We have the capability to design microfluidic devices for you and offer prototyping & micromanufacturing custom tailored for your applications. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In MICROFLUIDICS we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. Some major applications of microfluidic devices and systems are: - Laboratories on a chip - Drug screening - Glucose tests - Chemical microreactor - Microprocessor cooling - Micro fuel cells - Protein crystallization - Rapid drugs change, manipulation of single cells - Single cell studies - Tunable optofluidic microlens arrays - Microhydraulic & micropneumatic systems (liquid pumps, gas valves, mixing systems…etc) - Biochip early warning systems - Detection of chemical species - Bioanalytical applications - On-chip DNA and protein analysis - Nozzle spray devices - Quartz flow cells for detection of bacteria - Dual or multiple droplet generation chips Our design engineers have many years of experience in modeling, designing and testing of microfluidic devices for a range of applications. Our design expertise in the area of microfluidics includes: • Low temperature thermal bonding process for microfluidics • Wet etching of microchannels with etch depths of nm to mm deep in glass and borosilicate. • Grinding and polishing for a wide range of substrate thicknesses from as thin as 100 microns to over 40 mm. • Ability to fuse multiple layers to create complex microfluidic devices. • Drilling, dicing and ultrasonic machining techniques suitable for microfluidic devices • Innovative dicing techniques with precise edge connection for interconnectibility of microfluidic devices • Accurate alignment • Variety of deposited coatings, microfluidic chips can be sputtered with metals such as platinum, gold, copper and titanium to create a wide range of features, such as embedded RTDs, sensors, mirrors and electrodes. Besides our custom fabrication capabilities we have hundreds of off-the-shelf standard microfluidic chip designs available with hydrophobic, hydrophilic or fluorinated coatings and a wide range of channel sizes (100 nanometers to 1mm), inputs, outputs, different geometries such as circular cross, pillar arrays and micromixer. Our microfluidic devices offer excellent chemical resistance and optical transparency, high temperature stability up to 500 Centigrade, high pressure range up to 300 Bar. Some popular microfluidic off-shelf chips are: MICROFLUIDIC DROPLET CHIPS: Glass Droplet Chips with different junction geometries, channel sizes and surface properties are available. Microfluidic droplet chips have excellent optical transparency for clear imaging. Advanced hydrophobic coating treatments enable water-in-oil droplets to be generated as well as oil-in-water droplets formed in the untreated chips. MICROFLUIDIC MIXER CHIPS: Enabling mixing of two fluid streams within miliseconds, the micromixer chips benefit a wide range of applications including reaction kinetics, sample dilution, rapid crystallisation and nanoparticle synthesis. SINGLE MICROFLUIDIC CHANNEL CHIPS: AGS-TECH Inc. offers single channel microfluidic chips with one inlet and one outlet for several applications. Two different chip dimensions are available off-the-shelf (66x33mm and 45x15mm). We also stock compatible chip holders. CROSS MICROFLUIDIC CHANNEL CHIPS: We also offer microfluidic chips with two simple channels crossing each other. Ideal for droplet generation and flow focusing applications. Standard chip dimensions are 45x15mm and we have a compatible chip holder. T-JUNCTION CHIPS: The T-Junction is a basic geometry used in microfluidics for liquid contacting and droplet formation. These microfluidic chips are available in a number of forms including thin layer, quartz, platinum coated, hydrophobic and hydrophilic versions. Y-JUNCTION CHIPS: These are glass microfluidic devices designed for a wide range of applications including liquid-liquid contacting and diffusion studies. These microfluidic devices feature two connected Y-Junctions and two straight channels for observation of microchannel flow. MICROFLUIDIC REACTOR CHIPS: Microreactor chips are compact glass microfluidic devices designed for rapid mixing and reaction of two or three liquid reagent streams. WELLPLATE CHIPS: This is a tool for analytical research and clinical diagnostic laboratories. Wellplate chips are for holding small droplets of reagents or groups of cells in nano-litre wells. MEMBRANE DEVICES: These membrane devices are designed to be used for liquid-liquid separation, contacting or extraction, cross-flow filtration and surface chemistry reactions. These devices benefit from a low dead volume and a disposable membrane. MICROFLUIDIC RESEALABLE CHIPS: Designed for microfluidic chips that can be opened and resealed, the resealable chips enable up to eight fluidic and eight electrical connections and deposition of reagents, sensors or cells onto the channel surface. Some applications are cell culture and analysis, impedance detection and biosensor testing. POROUS MEDIA CHIPS: This is a glass microfluidic device designed for statistical modeling of a complex porous sandstone rock structure. Among the applications of this microfluidic chip are research in earth science & engineering, petrochemical industry, environmental testing, groundwater analysis. CAPILLARY ELECTROPHORESIS CHIP (CE chip): We offer capillary electrophoresis chips with and without integrated electrodes for DNA analysis and separation of biomolecules. Capillary electrophoresis chips are compatible with encapsulates of dimensions 45x15mm. We have CE chips one with classical crossing and one with T-crossing. All needed accessories such as chip holders, connectors are available. Besides microfluidic chips, AGS-TECH offers a wide range of pumps, tubing, microfluidic systems, connectors and accessories. Some off-shelf microfluidic systems are: MICROFLUIDIC DROPLET STARTER SYSTEMS: Syringe-based droplet starter system provides a complete solution for the generation of monodispersed droplets that range from 10 to 250 micron diameter. Operating over wide flow ranges between 0.1 microliters/min to 10 microliters/min, the chemically resistant microfluidics system is ideal for initial concept work and experimentation. The pressure-based droplet starter system on the other hand is a tool for preliminary work in microfluidics. The system provides a complete solution containing all needed pumps, connectors and microfluidic chips enabling the production of highly monodispersed droplets ranging from 10 to 150 microns. Operating over a wide pressure range between 0 to 10 bars, this system is chemically resistant and its modular design makes it easily expandable for future applications. By providing a stable liquid flow, this modular toolkit eliminates dead volume and sample waste to effectively reduce associated reagent costs. This microfluidic system offers the ability to provide a quick liquid changeover. A lockable pressure chamber and an innovative 3-way chamber lid allow simultaneous pumping of up to three liquids. ADVANCED MICROFLUIDIC DROPLET SYSTEM: A modular microfluidic system that enables production of extremely consistent sized droplets, particles, emulsions, and bubbles. The advanced microfluidic droplet system uses flow focusing technology in a microfluidic chip with a pulseless liquid flow to produce monodispersed droplets between nanometers and hundreds of microns size. Well suited for encapsulation of cells, producing beads, controlling nanoparticle formation etc. Droplet size, flow rates, temperatures, mixing junctions, surface properties and order of additions can be quickly varied for process optimization. The microfluidic system contains all the parts required including pumps, flow sensors, chips, connectors and automation components. Accessories are also available, including optical systems, larger reservoirs and reagent kits. Some microfluidics applications for this system are encapsulation of cells, DNA and magnetic beads for research and analysis, drug delivery via polymer particles and drug formulation, precision manufacturing of emulsions and foams for food and cosmetics, production of paints and polymer particles, microfluidics research on droplets, emulsions, bubbles and particles. MICROFLUIDIC SMALL DROPLET SYSTEM: An ideal system for producing and analyzing microemulsions that offer increased stability, a higher interfacial area and the capacity to solubilize both aqueous and oil-soluble compounds. Small droplet microfluidic chips allow the generation of highly monodispersed micro-droplets ranging from 5 to 30 microns. MICROFLUIDIC PARALLEL DROPLET SYSTEM: A high throughput system for the production of up to 30,000 monodispersed microdroplets per second ranging from 20 to 60 microns. The microfluidic parallel droplet system allows users to create stable water-in-oil or oil-in-water droplets facilitating a broad range of applications in drug and food production. MICROFLUIDIC DROPLET COLLECTION SYSTEM: This system is well suited for the generation, collection and analysis of monodispersed emulsions. The microfluidic droplet collection system features the droplet collection module that allows emulsions to be collected without flow disruption or droplet coalescence. The microfluidic droplet size can be accurately adjusted and quickly changed enabling full control over emulsion characteristics. MICROFLUIDIC MICROMIXER SYSTEM: This system is made of a microfluidic device, precision pumping, microfluidic elements and software to obtain excellent mixing. A lamination-based compact micromixer glass microfluidic device allows rapid mixing of two or three fluid streams in each of the two independent mixing geometries. Perfect mixing can be achieved with this microfluidic device at both high and low flow rate ratios. The microfluidic device, and its surrounding components offer excellent chemical stability, high visibility for optics, and good optical transmission. The micromixer system performs exceptionally fast, works in continuous flow mode and can completely mix two or three fluid streams within milliseconds. Some applications of this microfluidic mixing device are reaction kinetics, sample dilution, improved reaction selectivity, rapid crystallization and nanoparticle synthesis, cell activation, enzyme reactions and DNA hybridization. MICROFLUIDIC DROPLET-ON-DEMAND SYSTEM: This is a compact and portable droplet-on-demand microfluidic system to generate droplets of up to 24 different samples and store up to 1000 droplets with sizes down to 25 nanoliters. The microfluidic system offers excellent control of droplet size and frequency as well as allowing the use of multiple reagents to create complex assays quickly and easily. Microfluidic droplets can be stored, thermally cycled, merged or split from nanoliter to picoliter droplets. Some applications are, generation of screening libraries, cell encapsulation, encapsulation of organisms, automation of ELISA tests, preparation of concentration gradients, combinatorial chemistry, cell assays. NANOPARTICLE SYNTHESIS SYSTEM: Nanoparticles are smaller than 100nm and benefit a range of applications such as the synthesis of silicon based fluorescent nanoparticles (quantum dots) to label biomolecules for diagnostic purposes, drug delivery, and cellular imaging. Microfluidics technology is ideal for nanoparticle synthesis. Reducing reagent consumption, it allows tighter particle size distributions, improved control over reaction times and temperatures, as well as better mixing efficiency. MICROFLUIDIC DROPLET MANUFACTURE SYSTEM: High-throughput microfluidic system that facilitates production of up to a tonne of highly monodispersed droplets, particles or emulsion a month. This modular, scalable and highly flexible microfluidic system allows up to 10 modules to be assembled in parallel, enabling identical conditions for up to 70 microfluidic chip droplet junctions. Mass-production of highly monodispersed microfluidic droplets ranging between 20 microns and 150 microns is possible that can be flowed directly off the chips, or into tubes. Applications include particle production - PLGA, gelatine, alginate, polystyrene, agarose, drug delivery in creams, aerosols, bulk precision manufacturing of emulsions and foams in food, cosmetics, paint industries, nanoparticle synthesis, parallel micromixing and micro-reactions. PRESSURE-DRIVEN MICROFLUIDIC FLOW CONTROL SYSTEM: The closed-loop smart flow control provides control of flow rates from nanoliters/min to mililiters/min, at pressures from 10 bar down to vacuum. A flow rate sensor connected in-line between the pump and the microfluidic device facilitates users to enter a flow rate target directly on the pump without the need for a PC. Users will get smoothness of pressure and repeatability of volumetric flow in their microfluidic devices. Systems can be extended to multiple pumps, which will all control flow rate independently. To operate in flow control mode, the flow rate sensor needs to be connected to the pump using either the sensor display or sensor interface. KLIK Product Finder-Locator Service PREVIOUS PAGE