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Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. Mikroelektronika & Semikonduktor Manufaktur lan Fabrikasi Many of our nanomanufacturing, micromanufacturing and mesomanufacturing techniques and processes explained under the other menus can be used for MICROELECTRONICS MANUFACTURING too. However due to the importance of microelectronics in our products, we will concentrate on the subject specific applications of these processes here. Microelectronics related processes are also widely referred to as SEMICONDUCTOR FABRICATION processes. Our semiconductor engineering design and fabrication services include: - FPGA board design, development and programming - Microelectronics foundry services: Design, prototyping and manufacturing, third-party services - Semiconductor wafer preparation: Dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection - Microelectronic package design and fabrication: Both off-shelf and custom design and fabrication - Semiconductor IC assembly & packaging & test: Die, wire and chip bonding, encapsulation, assembly, marking and branding - Lead frames for semiconductor devices: Both off-shelf and custom design and fabrication - Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication - Sensor & actuator design and fabrication: Both off-shelf and custom design and fabrication - Optoelectronic & photonic circuits design and fabrication Let us examine the microelectronics and semiconductor fabrication and test technologies in more detail so you can better understand the services and products we are offering. FPGA Board Design & Development and Programming: Field-programmable gate arrays (FPGAs) are reprogrammable silicon chips. Contrary to processors that you find in personal computers, programming an FPGA rewires the chip itself to implement user’s functionality rather than running a software application. Using prebuilt logic blocks and programmable routing resources, FPGA chips can be configured to implement custom hardware functionality without using a breadboard and soldering iron. Digital computing tasks are carried out in software and compiled down to a configuration file or bitstream that contains information on how the components should be wired together. FPGAs can be used to implement any logical function that an ASIC could perform and are completely reconfigurable and can be given a completely different “personality” by recompiling a different circuit configuration. FPGAs combine the best parts of application-specific integrated circuits (ASICs) and processor-based systems. These benefits include the following: • Faster I/O response times and specialized functionality • Exceeding the computing power of digital signal processors (DSPs) • Rapid prototyping and verification without the fabrication process of custom ASIC • Implementation of custom functionality with the reliability of dedicated deterministic hardware • Field-upgradable eliminating the expense of custom ASIC re-design and maintenance FPGAs provide speed and reliability, without requiring high volumes to justify the large upfront expense of custom ASIC design. Reprogrammable silicon also has the same flexibility of software running on processor-based systems, and it is not limited by the number of processing cores available. Unlike processors, FPGAs are truly parallel in nature, so different processing operations do not have to compete for the same resources. Each independent processing task is assigned to a dedicated section of the chip, and can function autonomously without any influence from other logic blocks. As a result, the performance of one part of the application is not affected when more processing is added on. Some FPGAs have analog features in addition to digital functions. Some common analog features are programmable slew rate and drive strength on each output pin, allowing the engineer to set slow rates on lightly loaded pins that would otherwise ring or couple unacceptably, and to set stronger, faster rates on heavily loaded pins on high-speed channels that would otherwise run too slowly. Another relatively common analog feature is differential comparators on input pins designed to be connected to differential signaling channels. Some mixed signal FPGAs have integrated peripheral analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) with analog signal conditioning blocks that allow them to operate as a system-on-a-chip. Briefly, the top 5 benefits of FPGA chips are: 1. Good Performance 2. Short Time to Market 3. Low Cost 4. High Reliability 5. Long-Term Maintenance Capability Good Performance – With their capability of accommodating parallel processing, FPGAs have better computing power than digital signal processors (DSPs) and do not require sequential execution as DSPs and can accomplish more per clock cycles. Controlling inputs and outputs (I/O) at the hardware level provides faster response times and specialized functionality to closely match application requirements. Short Time to market - FPGAs offer flexibility and rapid prototyping capabilities and thus shorter time-to-market. Our customers can test an idea or concept and verify it in hardware without going through the long and expensive fabrication process of custom ASIC design. We can implement incremental changes and iterate on an FPGA design within hours instead of weeks. Commercial off-the-shelf hardware is also available with different types of I/O already connected to a user-programmable FPGA chip. The growing availability of high-level software tools offer valuable IP cores (prebuilt functions) for advanced control and signal processing. Low Cost—The nonrecurring engineering (NRE) expenses of custom ASIC designs exceed that of FPGA-based hardware solutions. The large initial investment in ASICs can be justified for OEMs producing many chips per year, however many end users need custom hardware functionality for the many systems in development. Our programmable silicon FPGA offers you something with no fabrication costs or long lead times for assembly. System requirements frequently change over time, and the cost of making incremental changes to FPGA designs is negligible when compared to the large expense of respinning an ASIC. High Reliability - Software tools provide the programming environment and FPGA circuitry is a true implementation of program execution. Processor-based systems generally involve multiple layers of abstraction to help task scheduling and share resources among multiple processes. The driver layer controls hardware resources and the OS manages memory and processor bandwidth. For any given processor core, only one instruction can execute at a time, and processor-based systems are continually at risk of time-critical tasks preempting one another. FPGAs, do not use OSs, pose minimum reliability concerns with their true parallel execution and deterministic hardware dedicated to every task. Long-term Maintenance Capability - FPGA chips are field-upgradable and do not require the time and cost involved with redesigning ASIC. Digital communication protocols, for example, have specifications that can change over time, and ASIC-based interfaces may cause maintenance and forward-compatibility challenges. To the contrary, reconfigurable FPGA chips can keep up with potentially necessary future modifications. As products and systems mature, our customers can make functional enhancements without spending time redesigning hardware and modifying the board layouts. Microelectronics Foundry Services: Our microelectronics foundry services include design, prototyping and manufacturing, third-party services. We provide our customers with assistance throughout the entire product development cycle - from design support to prototyping and manufacturing support of semiconductor chips. Our objective in design support services is to enable a first-time right approach for digital, analog, and mixed-signal designs of semiconductor devices. For example, MEMS specific simulation tools are available. Fabs that can handle 6 and 8 inch wafers for integrated CMOS and MEMS are at your service. We offer our clients design support for all major electronic design automation (EDA) platforms, supplying correct models, process design kits (PDK), analog and digital libraries, and design for manufacturing (DFM) support. We offer two prototyping options for all technologies: the Multi Product Wafer (MPW) service, where several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. These are more economical than the full mask set. The MLM service is highly flexible compared to the fixed dates of the MPW service. Companies may prefer outsourcing semiconductor products to a microelectronics foundry for a number of reasons including the need for a second source, using internal resources for other products and services, willingness to go fabless and decrease risk and burden of running a semiconductor fab…etc. AGS-TECH offers open-platform microelectronics fabrication processes that can be scaled down for small wafer runs as well as mass manufacturing. Under certain circumstances, your existing microelectronics or MEMS fabrication tools or complete tool sets can be transferred as consigned tools or sold tools from your fab into our fab site, or your existing microelectronics and MEMS products can be redesigned using open platform process technologies and ported to a process available at our fab. This is faster and more economical than a custom technology transfer. If desired however customer’s existing microelectronics / MEMS fabrication processes may be transferred. Semiconductor Wafer Preparation: If desired by customers after wafers are microfabricated, we carry out dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection operations on semiconductor wafers. Semiconductor wafer processing involves metrology in between the various processing steps. For example, thin film test methods based on ellipsometry or reflectometry, are used to tightly control the thickness of gate oxide, as well as the thickness, refractive index and extinction coefficient of photoresist and other coatings. We use semiconductor wafer test equipment to verify that the wafers haven't been damaged by previous processing steps up until testing. Once the front-end processes have been completed, the semiconductor microelectronic devices are subjected to a variety of electrical tests to determine if they function properly. We refer to the proportion of microelectronics devices on the wafer found to perform properly as the “yield”. Testing of microelectronics chips on the wafer are carried out with an electronic tester that presses tiny probes against the semiconductor chip. The automated machine marks each bad microelectronics chip with a drop of dye. Wafer test data is logged into a central computer database and semiconductor chips are sorted into virtual bins according to predetermined test limits. The resulting binning data can be graphed, or logged, on a wafer map to trace manufacturing defects and mark bad chips. This map can also be used during wafer assembly and packaging. In final testing, microelectronics chips are tested again after packaging, because bond wires may be missing, or analog performance may be altered by the package. After a semiconductor wafer is tested, it is typically reduced in thickness before the wafer is scored and then broken into individual dies. This process is called semiconductor wafer dicing. We use automated pick-and-place machines specially manufactured for microelectronics industry to sort out the good and bad semiconductor dies. Only the good, unmarked semiconductor chips are packaged. Next, in the microelectronics plastic or ceramic packaging process we mount the semiconductor die, connect the die pads to the pins on the package, and seal the die. Tiny gold wires are used to connect the pads to the pins using automated machines. Chip scale package (CSP) is another microelectronics packaging technology. A plastic dual in-line package (DIP), like most packages, is multiple times larger than the actual semiconductor die placed inside, whereas CSP chips are nearly the size of the microelectronics die; and a CSP can be constructed for each die before the semiconductor wafer is diced. The packaged microelectronics chips are re-tested to make sure that they are not damaged during packaging and that the die-to-pin interconnect process was completed correctly. Using lasers we then etch the chip names and numbers on the package. Microelectronic Package Design and Fabrication: We offer both off-shelf and custom design and fabrication of microelectronic packages. As part of this service, modeling and simulation of microelectronic packages is also carried out. Modeling and simulation ensures virtual Design of Experiments (DoE) to achieve the optimal solution, rather than testing packages on the field. This reduces the cost and production time, especially for new product development in microelectronics. This work also gives us the opportunity to explain our customers how the assembly, reliability and testing will impact their microelectronic products. The primary objective of microelectronic packaging is to design an electronic system that will satisfy the requirements for a particular application at a reasonable cost. Because of the many options available to interconnect and house a microelectronics system, the choice of a packaging technology for a given application needs expert evaluation. Selection criteria for microelectronics packages may include some of the following technology drivers: -Wireability -Yield -Cost -Heat dissipation properties -Electromagnetic shielding performance -Mechanical toughness -Reliability These design considerations for microelectronics packages affect speed, functionality, junction temperatures, volume, weight and more. The primary goal is to select the most cost-effective yet reliable interconnection technology. We use sophisticated analysis methods and software to design microelectronics packages. Microelectronics packaging deals with the design of methods for the fabrication of interconnected miniature electronic systems and the reliability of those systems. Specifically, microelectronics packaging involves routing of signals while maintaining signal integrity, distributing ground and power to semiconductor integrated circuits, dispersing dissipated heat while maintaining structural and material integrity, and protecting the circuit from environmental hazards. Generally, methods for packaging microelectronics ICs involve the use of a PWB with connectors that provide the real-world I/Os to an electronic circuit. Traditional microelectronics packaging approaches involve the use of single packages. The main advantage of a single-chip package is the ability to fully test the microelectronics IC before interconnecting it to the underlying substrate. Such packaged semiconductor devices are either through-hole mounted or surface mounted to the PWB. Surface-mounted microelectronics packages do not require via holes to go through the entire board. Instead, surface-mounted microelectronics components can be soldered to both sides of the PWB, enabling higher circuit density. This approach is called surface-mount technology (SMT). The addition of area-array–style packages such as ball-grid arrays (BGAs) and chip-scale packages (CSPs) is making SMT competitive with the highest-density semiconductor microelectronics packaging technologies. A newer packaging technology involves the attachment of more than one semiconductor device onto a high-density interconnection substrate, which is then mounted in a large package, providing both I/O pins and environmental protection. This multichip module (MCM) technology is further characterized by the substrate technologies used to interconnect the attached ICs. MCM-D represents deposited thin film metal and dielectric multilayers. MCM-D substrates have the highest wiring densities of all MCM technologies thanks to the sophisticated semiconductor processing technologies. MCM-C refers to multilayered “ceramic” substrates, fired from stacked alternating layers of screened metal inks and unfired ceramic sheets. Using MCM-C we obtain a moderately dense wiring capacity. MCM-L refers to multilayer substrates made from stacked, metallized PWB “laminates,” that are individually patterned and then laminated. It used to be a low-density interconnect technology, however now MCM-L is quickly approaching the density of MCM-C and MCM-D microelectronics packaging technologies. Direct chip attach (DCA) or chip-on-board (COB) microelectronics packaging technology involves mounting the microelectronics ICs directly to the PWB. A plastic encapsulant, which is “globbed” over the bare IC and then cured, provides environmental protection. Microelectronics ICs can be interconnected to the substrate using either flip-chip, or wire bonding methods. DCA technology is particularly economical for systems that are limited to 10 or fewer semiconductor ICs, since larger numbers of chips can affect system yield and DCA assemblies can be difficult to rework. An advantage common to both the DCA and MCM packaging options is the elimination of the semiconductor IC package interconnection level, which allows closer proximity (shorter signal transmission delays) and reduced lead inductance. The primary disadvantage with both methods is the difficulty in purchasing fully tested microelectronics ICs. Other disadvantages of DCA and MCM-L technologies include poor thermal management thanks to the low thermal conductivity of PWB laminates and a poor coefficient of thermal expansion match between the semiconductor die and the substrate. Solving the thermal expansion mismatch problem requires an interposer substrate such as molybdenum for wire bonded die and an underfill epoxy for flip-chip die. The multichip carrier module (MCCM) combines all the positive aspects of DCA with MCM technology. The MCCM is simply a small MCM on a thin metal carrier that can be bonded or mechanically attached to a PWB. The metal bottom acts as both a heat dissipater and a stress interposer for the MCM substrate. The MCCM has peripheral leads for wire bonding, soldering, or tab bonding to a PWB. Bare semiconductor ICs are protected using a glob-top material. When you contact us, we will discuss your application and requirements to choose the best microelectronics packaging option for you. Semiconductor IC Assembly & Packaging & Test: As part of our microelectronics fabrication services we offer die, wire and chip bonding, encapsulation, assembly, marking and branding, testing. For a semiconductor chip or integrated microelectronics circuit to function, it needs to be connected to the system that it will control or provide instructions to. Microelectronics IC assembly does provide the connections for power and information transfer between the chip and the system. This is accomplished by connecting the microelectronics chip to a package or directly connecting it to the PCB for these functions. Connections between the chip and the package or printed circuit board (PCB) are via wire bonding, thru-hole or flip chip assembly. We are an industry leader in finding microelectronics IC packaging solutions to meet the complex requirements of the wireless and internet markets. We offer thousands of different package formats and sizes, ranging from traditional leadframe microelectronics IC packages for thru-hole and surface mount, to the latest chip scale (CSP) and ball grid array (BGA) solutions required in high pin count and high density applications. A wide variety of packages are available from stock including CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, PLCC, PoP - Package on Package, PoP TMV - Through Mold Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Wafer Level Package)…..etc. Wire bonding using copper, silver or gold are among the popular in microelectronics. Copper (Cu) wire has been a method of connecting silicon semiconductor dies to the microelectronics package terminals. With recent increase in gold (Au) wire cost, copper (Cu) wire is an attractive way to manage overall package cost in microelectronics. It also resembles gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are almost the same for gold (Au) and copper (Cu) wire with copper (Cu) wire having lower resistivity. In microelectronics applications where resistance due to bond wire can negatively impact circuit performance, using copper (Cu) wire can offer improvement. Copper, Palladium Coated Copper (PCC) and Silver (Ag) alloy wires have emerged as alternatives to gold bond wires due to cost. Copper-based wires are inexpensive and have low electrical resistivity. However, the hardness of copper makes it difficult to use in many applications such as those with fragile bond pad structures. For these applications, Ag-Alloy offers properties similar to those of gold while its cost is similar to that of PCC. Ag-Alloy wire is softer than PCC resulting in lower Al-Splash and lower risk of bond pad damage. Ag-Alloy wire is the best low cost replacement for applications that need die-to-die bonding, waterfall bonding, ultra-fine bond pad pitch and small bond pad openings, ultra low loop height. We provide a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and complete end-of-line services. We test a variety of semiconductor device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various combinations such as ASIC, multi chip modules, System-in-Package (SiP), and stacked 3D packaging, sensors and MEMS devices such as accelerometers and pressure sensors. Our test hardware and contacting equipment are suitable for custom package size SiP, dual-sided contacting solutions for Package on Package (PoP), TMV PoP, FusionQuad sockets, multiple-row MicroLeadFrame, Fine-Pitch Copper Pillar. Test equipment and test floors are integrated with CIM / CAM tools, yield analysis and performance monitoring to deliver very high efficiency yield the first time. We offer numerous adaptive microelectronics test processes for our customers and offer distributed test flows for SiP and other complex assembly flows. AGS-TECH provides a full range of test consultation, development and engineering services across your entire semiconductor and microelectronics product lifecycle. We understand the unique markets and testing requirements for SiP, automotive, networking, gaming, graphics, computing, RF / wireless. Semiconductor manufacturing processes require fast and precisely controlled marking solutions. Marking speeds over 1000 characters/second and material penetration depths less than 25 microns are common in semiconductor microelectronics industry using advanced lasers. We are capable of marking mold compounds, wafers, ceramics and more with minimal heat input and perfect repeatability. We use lasers with high accuracy to mark even the smallest parts without damage. Lead frames for Semiconductor Devices: Both off-shelf and custom design and fabrication are possible. Lead frames are utilized in the semiconductor device assembly processes, and are essentially thin layers of metal that connect the wiring from tiny electrical terminals on the semiconductor microelectronics surface to the large-scale circuitry on electrical devices and PCBs. Lead frames are used in almost all semiconductor microelectronics packages. Most microelectronics IC packages are made by placing the semiconductor silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and subsequently covering the microelectronics chip with plastic cover. This simple and relatively low cost microelectronics packaging is still the best solution for many applications. Lead frames are produced in long strips, which allows them to be quickly processed on automated assembly machines, and generally two manufacturing processes are used: photo etching of some sort and stamping. In microelectronics lead frame design often demand is for customized specifications and features, designs that enhance electrical and thermal properties, and specific cycle time requirements. We have in-depth experience of microelectronics lead frame manufacturing for an array of different customers using laser assisted photo etching and stamping. Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication. With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. The consistency in performance and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a semiconductor microelectronics component may be achieved by effectively controlling the device operating temperature within the limits set by the designers. Heat sinks are devices that enhance heat dissipation from a hot surface, usually the outer case of a heat generating component, to a cooler ambient such as air. For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation. A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant. This allows more heat to be dissipated and/or lowers the semiconductor device operating temperature. The primary purpose of a heat sink is to maintain the microelectronics device temperature below the maximum allowable temperature specified by the semiconductor device manufacturer. We can classify heat sinks in terms of manufacturing methods and their shapes. The most common types of air-cooled heat sinks include: - Stampings: Copper or aluminum sheet metals are stamped into desired shapes. they are used in traditional air cooling of electronic components and offer an economical solution to low density thermal problems. They are suitable for high volume production. - Extrusion: These heat sinks allow the formation of elaborate two-dimensional shapes capable of dissipating large heat loads. They may be cut, machined, and options added. A cross-cutting will produce omnidirectional, rectangular pin fin heat sinks, and incorporating serrated fins improves the performance by approximately 10 to 20%, but with a slower extrusion rate. Extrusion limits, such as the fin height-to-gap fin thickness, usually dictate the flexibility in design options. Typical fin height-to-gap aspect ratio of up to 6 and a minimum fin thickness of 1.3mm, are attainable with standard extrusion techniques. A 10 to 1 aspect ratio and a fin thickness of 0.8″can be obtained with special die design features. However, as the aspect ratio increases, the extrusion tolerance is compromised. - Bonded/Fabricated Fins: Most air cooled heat sinks are convection limited, and the overall thermal performance of an air cooled heat sink can often be improved significantly if more surface area can be exposed to the air stream. These high performance heat sinks utilize thermally conductive aluminum-filled epoxy to bond planar fins onto a grooved extrusion base plate. This process allows for a much greater fin height-to-gap aspect ratio of 20 to 40, significantly increasing the cooling capacity without increasing the need for volume. - Castings: Sand, lost wax and die casting processes for aluminum or copper / bronze are available with or without vacuum assistance. We use this technology for fabrication of high density pin fin heat sinks which provide maximum performance when using impingement cooling. - Folded Fins: Corrugated sheet metal from aluminum or copper increases surface area and the volumetric performance. The heat sink is then attached to either a base plate or directly to the heating surface via epoxy or brazing. It is not suitable for high profile heat sinks on account of the availability and fin efficiency. Hence, it allows high performance heat sinks to be fabricated. In selecting an appropriate heat sink meeting the required thermal criteria for your microelectronics applications, we need to examine various parameters that affect not only the heat sink performance itself, but also the overall performance of the system. The choice of a particular type of heat sink in microelectronics depends largely to the thermal budget allowed for the heat sink and external conditions surrounding the heat sink. There is never a single value of thermal resistance assigned to a given heat sink, since the thermal resistance varies with external cooling conditions. Sensor & Actuator Design and Fabrication: Both off-shelf and custom design and fabrication are available. We offer solutions with ready-to-use processes for inertial sensors, pressure and relative pressure sensors and IR temperature sensor devices. By using our IP blocks for accelerometers, IR and pressure sensors or applying your design according to available specifications and design rules, we can have MEMS based sensor devices delivered to you within weeks. Besides MEMS, other types of sensor and actuator structures can be fabricated. Optoelectronic & photonic circuits design and fabrication: A photonic or optical integrated circuit (PIC) is a device that integrates multiple photonic functions. It can be resembled to electronic integrated circuits in microelectronics. The major difference between the two is that a photonic integrated circuit provides functionality for information signals imposed on optical wavelengths in the visible spectrum or near infrared 850 nm-1650 nm. Fabrication techniques are similar to those used in microelectronics integrated circuits where photolithography is used to pattern wafers for etching and material deposition. Unlike semiconductor microelectronics where the primary device is the transistor, there is no single dominant device in optoelectronics. Photonic chips include low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and fabrication techniques and therefore it is difficult to realize all of them on a single chip. Our applications of photonic integrated circuits are mainly in the areas of fiber-optic communication, biomedical and photonic computing. Some example optoelectronic products we can design and fabricate for you are LEDs (Light Emitting Diodes), diode lasers, optoelectronic receivers, photodiodes, laser distance modules, customized laser modules and more. KLIK Product Finder-Locator Service PAGE sadurunge

We supply custom manufactured and off-shelf jigs, fixtures and workholding tools for industrial applications, manufacturing lines, production lines, test and inspection lines, machine shops, R&D labs.......etc. Jig, Perlengkapan, Alat, Solusi Workholding, Manufaktur Komponen Mould We offer custom manufactured and off-shelf jigs, fixtures and toolings for your workshop, factory, plant lab or other facility. The types of jigs you can purchase from us are: - Template Jig - Plate Jig - Angle-Plate Jig - Channel Jig - Diameter Jig - Leaf Jig - Ring Jig - Box Jig The types of fixtures we can supply you are: - Turning Fixtures - Milling Fixtures - Broaching Fixtures - Grinding Fixtures - Boring Fixtures - Tapping Fixtures - Duplex Fixtures - Welding Fixtures - Assembly Fixtures - Drilling Fixtures - Indexing Fixtures Some categories of industrial machine tools we manufacture and ship include: - Press tools and dies, shears - Extrusion dies - Molds, molding and casting tools - Forming tools - Shaping tools - Drilling, cutting, broaching, hobbing tools - Grinding tools - Machining, milling, turning tools - Holding and clamping tools CLICK ON BLUE TEXT BELOW TO DOWNLOAD CATALOGS & BROCHURES: EDM Tooling - Workholding Catalog Includes EDM Tooling System and Elements, EROWA Link, 3R-Link, UniClamp, Square Clamp, RefTool Holder, PIN Holder System, Clamping Elements, Swivel Block and Vises, CentroClamp, EDM Spare Parts....etc. Hose Crimping Machines and Tools We private label these with your brand name and logo if you wish. Crimp development team can assist you with the design and development of tooling for all of your crimping requirements. Hose Endforming Machines and Tools We private label these with your brand name and logo if you wish. Tool development team can assist you with the design and development of tooling for all of your end-forming tool requirements. Plastic Mold Components Catalog Here you will find off-shelf components, products that you can order and use in manufacturing your molds. These products are ideal for mold makers. Example products you can find here are ejector pins, slide units, pressure plugs, guide pins, sprue bushings, slide holding devices, wear plates, ejector sleeves.....etc. Private Label Auto Glass Repair and Replacement Systems We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools for Every Industry We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools - Hand Tool Cabinets We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Wire EDM Tooling - Workholding Catalog Includes Wire EDM Clamping Systems & Sets, Corner Sets, Ruler & Spanner, EDM Clamping Block, 3D Swivel Head, Vise Set, WEDM Vises and Magnetic Tables, Multiclamp, Wire EDM Pendulum Holder, V-Block, ICS Adapter, Beams, Beam IF, Z-Flex, Turn and Index Table, Collet Chuck Holder, EDM Link and Adapter, 3 Jaw Scroll Chuck ....etc. Workholding Tools Catalog - 1 Check this catalog for our 100% EROWA and 3R compatible workholding tools. We accept OEM work, you can send us a drawing for evaluation. Workholding Tools Catalog - 2 Check this catalog for our Workholding Devices, Die and Mold Clamps, Clamping Elements, Clamping Kits, Fixture Clamps, Toggle Clamps, Milling & MC Vices, Pneumatic & Hydraulic Clamps, Milling & Grinding Accessories, Wire Cut EDM Workholders...etc. We accept OEM work, you can send us a drawing for evaluation. You may also find our following page link useful: Industrial Machines and Equipment Manufacturing KLIK Product Finder-Locator Service PAGE sadurunge

Test Equipment for Furniture Testing, Sofa Durability Tester, Chair Base Static Tester, Chair Drop Impact Tester, Mattress Firmness Tester Peralatan Test kanggo Testing Furnitur Specialized Test Equipment for Testing of Furniture are used for testing furniture products such as chairs, table, sofas, mattress....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of furniture are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of furniture can be downloaded from the colored links below: HAIDA Bifma Furnitures Testing Machine HAIDA Chair Arm and Leg Tester HAIDA Chair Base Static Tester HAIDA Chair Caster Durability Tester HAIDA Chair Drop Impact Tester HAIDA Chair and Foam Testing Machine HAIDA Chair Seating and Back Durability HAIDA Chair Strength Tester HAIDA Chair Swivel Tester Catalog Download HAIDA Chair Universal Test Machine HAIDA Color Assessment Cabinet HAIDA Foam Pounding Fatigue Tester HAIDA Furniture Universal Test Machine HAIDA Mattress Cornell Tester HAIDA Mattress Firmness Tester HAIDA Mattress Rollator Durability Tester HAIDA Mattress Rollator Durability Tester-2 HAIDA Sofa Durability Tester HD-F769 HAIDA Sofa Durability Tester HD-F761 HAIDA Sofa Iron Frame Fatigue Tester HAIDA Universal Test Field for Tables Chairs Kanggo peralatan liyane sing padha, bukak situs web peralatan kita: http://www.sourceindustrialsupply.com KLIK Product Finder-Locator Service PREVIOUS PAGE

Wireless Components - Antenna - Radio Frequency Devices - RF Devices - Remote Sensing and Control - High Frequency RF lan Piranti Nirkabel Manufaktur & Majelis • Wireless components, devices and assemblies for remote sensing, remote control and communication. We can help you during the design, development, prototyping or mass production of various types of fixed, mobile, and portable two way radios, cellular telephones, GPS units, personal digital assistants (PDAs), smart and remote control equipment and wireless networking devices and instruments. We also have off-shelf wireless components and devices you can select from our brochures below. Antenna Brochure for 5G - LTE 4G - LPWA 3G - 2G - GPS - GNSS - WLAN - BT - Combo - ISM Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) Barcode Scanners (We private label these with your brand name and logo if you wish) High frequency devices product line (Band Pass Filters, Low Pass Filters, IPD, CPL, Balanced Filter, Diplexer, Balun, Chip Antenna...etc.) Microwave Flexible Cable Assembly Microwave and Milimeter Wave Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Precision RF Adapter s Catalog (Coax RF, Microwave, mmWave Adapters such as SMA, SSMA, SMP, BNC, Type-N, 3.5 mm.....etc) Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) RF Components Brochure for Coaxial Fixed Attenuators, Coaxial Terminations, DC Blocks, Coax Adapters, Waveguide Components, Power Dividers, RF Connectors, RF Tools. RF devices and high frequency inductors (Multilayer Ceramic Capacitors, Chip-Resistor, Disc Capacitors, RF & HF Inductor Varistors & SMD-Varistors, Chip Antenna, Filters, Coupler) RF and Microwave Components (Broadband 90/180 Degree Hybrid and Coupler, Broadband Power Divider, Filter, RF switch, Broadband Amplifier, Broadband Frequency Synthesizer) RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) RF Product Overview Chart (RF Antenna, Multilayer Ceramic Filter, Multilayer Ceramic Balun, Ceramic Diplexer) Soft Ferrites - Cores - Toroids - EMI Suppression Products - RFID Transponders and Accessories Brochure Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum components, BNC, SHV adapters and connectors, conductors and contact pins, connector terminals can be found here: Factory Brochure Dowload brochure for our DESIGN PARTNERSHIP PROGRAM We also participate in Third Party Resource Program and are a reseller of products offered by RF Digital ( Website: http://www.rfdigital.com ) , a company that manufactures an extensive line of fully integrated, low cost, high quality, high performance, configurable Wireless RF Transmitter, Receiver & Transceiver Modules, suitable for a wide range of applications. We participate in RF Digital's referral program as a Product Design and Development Company. Contact us to take advantage of our fully integrated, configurable Wireless RF Transmitter, Receiver & Transceiver Modules, High Frequency RF Devices, and most importantly of our consulting services regarding the implementation and application of these wireless components and devices and our engineering integration services. We can make you realize your new product development cycle by assisting you at every phase of the process, from concept to design to prototyping to first article manufacturing to mass production. • Some applications of wireless technology we can help you with are: - Wireless security systems - Remote control of consumer electronic devices or commercial equipment. - Cellular telephony (phones and modems): - WiFi - Wireless energy transfer - Radio communication devices - Short-range point-to-point communication devices such as wireless microphones, remote controls, IrDA, RFID (Radio Frequency Identification), Wireless USB, DSRC (Dedicated Short Range Communications), EnOcean, Near Field Communication, Wireless Sensor Networks : ZigBee, EnOcean; Personal area networks, Bluetooth, Ultra-wideband, wireless computer networks: Wireless Local Area Networks (WLAN), Wireless Metropolitan Area Networks (WMAN)...etc. More information on our engineering and research & development capabilities is available at our engineering site http://www.ags-engineering.com KLIK Product Finder-Locator Service PAGE sadurunge

Industrial leather products including honing and sharpening belts, leather transmission belts, sewing machine leather treadle belt, leather tool organizers and holders, leather gun holsters, leather steering wheel covers and more. Produk Kulit Industri Industrial leather products manufactured include: - Leather Honing and Sharpening Belts - Leather Transmission Belts - Sewing Machine Leather Treadle Belt - Leather Tool Organizers & Holders - Leather Gun Holsters Leather is a natural product with outstanding properties that make it a good fit for many applications. Industrial leather belts are used in power transmissions, as sewing machine leather treadle belts as well as fastening, securing, honing and sharpening of metal blades among many others. Besides our off-shelf industrial leather belts listed in our brochures, endless belts and special lengths / widths can also be produced for you. Applications of industrial leather includes Flat Leather Belting for power transmission and Round Leather Belting for Industrial Sewing Machines. Industrial leather is one of the oldest types of manufactured products. Our Vegetable Tanned Industrial leathers are pit tanned for many months and heavily dressed with a mixture of oils and greased to give its ultimate strength. Our Chrome Industrial Leathers can be manufactured in various ways, waxed, oiled or dry for moulding. We offer a chrome-retanned leather manufactured to withstand very high temperatures and they can be used for hydraulic applications and packings. Our Chrome Friction leathers are designed to have extraordinary abrasion properties. Various Shore Hardnesses are available. Many other applications of industrial leather products exist, including wearable tool organizers, tool holders, leather threads, steering wheel covers...etc. We are here to help you in your projects. A blueprint, a sketch, a photo or sample can serve to make us understand your product needs. We can either manufacture the industrial leather product according to your design, or we can help you in your design work and once you approve the final design, we can manufacture the product for you. Since we supply a wide variety of industrial leather products with different dimensions, applications and material grade; it is impossible to list them all here. We encourage you to email or call us so we can determine which product is the best fit for you. When contacting us, please make sure to inform us about: - Your application for the industrial leather products - Material grade desired & needed - Dimensions - Finish - Packaging requirements - Labeling requirements - Quantity PAGE sadurunge

Automation, Small-Batch and Mass Production at AGS-TECH Inc. We manufacture low and high volume custom parts, subassemblies and assemblies for our customers. Automation / Small-Batch and Mass Production at AGS-TECH Inc In order to maintain our top spot as an outstanding supplier and engineering integrator with competitive prices, on-time delivery and high quality, we implement AUTOMATION in all areas of our business, including: - Manufacturing processes and operations - Material handling - Process and product Inspection - Assembly - Packaging Various levels of automation are required depending on product, quantities manufactured, and processes used. We are capable of automating our processes just to the right extent in order to meet the requirements of each order. In other words, if a high level of flexibility is required and quantities produced are low for a particular order, we assign the work order to our JOB SHOP or RAPID PROTOTYPING facility. At the other extreme, for an order that requires minimum flexibility but maximum productivity, we assign the production to our FLOWLINES and TRANSFER LINES. Automation provides us the advantages of integration, improved product quality and uniformity, reduced cycle-times, reduced labor costs, improved productivity, more economic use of floor space, safer environment for high volume production orders. We are equipped for both SMALL-BATCH PRODUCTION with quantities typically ranging between 10 to 100 pieces as well as MASS PRODUCTION involving quantities over 100,000 pieces. Our mass production facilities are equipped with automation equipment which are dedicated special-purpose machinery. Our facilities can accomodate low and high quantity orders because they operate with a variety of machines in combination and with various levels of automation and computer controls. SMALL-BATCH PRODUCTION: Our job shop personnel for small-batch production is highly skilled and experienced in working on special small quantity orders. Our labor costs are very competitive thanks to our highly skilled large number of workers at our China, South Korea, Taiwan, Poland, Slovakia and Malaysia facilities. Small-batch production has always been and will be one of our major areas of service and complements our automated production processes. Manual small-batch production operations with conventional machine tools does not compete with our automation flowlines, it offers us additional extraordinary capabilities and strength that manufacturers with purely automated production lines do not have. Under no circumstances should the value of small-batch production capabilities of our skilled manually working job shop personnel be underestimated. MASS PRODUCTION: For standardized products in large volumes such as valves, gears and spindles, our production machines are designed for hard automation (fixed-position automation). These are high value modern automation equipment called transfer machines that produce components very fast for pennies a piece in most cases. Our transfer lines for mass production are also equipped with automatic gaging and inspection systems that assure parts produced in one station is within specifications before being transferred to the next station in the automation line. Various machining operations including milling, drilling, turning, reaming, boring, honing…etc. can be performed in these automation lines. We also implement soft automation, which is a flexible and programmable automation method involving computer control of machines and their functions through software programs. We can easily reprogram our soft automation machines to manufacture a part that has a different shape or dimensions. These flexible automation capabilities give us high levels of efficiency and productivity. Microcomputers, PLCs (Programmable Logic Controller), Numerical Control Machines (NC) and Computer Numerical Control (CNC) are widely deployed in our automation lines for mass production. In our CNC systems, an onboard control microcomputer is an integral part of the manufacturing equipment. Our machine operators program these CNC machines. In our automation lines for mass production and even in our small-batch production lines we take advantage of ADAPTIVE CONTROL, where operating parameters automatically adapt themselves to conform to new circumstances, including changes in the dynamics of the particular process and disturbances that may arise. As an example, in a turning operation on a lathe, our adaptive control system does sense in real time the cutting forces, torque, temperature, tool-wear, tool damage and surface finish of the workpiece. The system converts this information into commands that alter and modify process parameters on the machine tool so that the parameters are either held constant within min and max limits or optimized for the machining operation. We deploy AUTOMATION in MATERIAL HANDLING and MOVEMENT. Material handling consists of functions and systems associated with the transportation, storage and control of materials and parts in the total manufacturing cycle of products. Raw materials and parts may be moved from storage to machines, from one machine to another, from inspection to assembly or inventory, from inventory to shipment….etc. Automated material handling operations are repeatable and reliable. We implement automation in material handling and movement for both small-batch production as well as mass production operations. Automation does reduce costs, and is safer for operators, since it eliminates the need to carry materials by hand. Many types of equipment is deployed in our automated material handling and movement systems, such as conveyors, self-powered monorails, AGV (Automated Guided Vehicles), manipulators, integral transfer devices…etc. Movements of automated guided vehicles are planned on central computers to interface with our automated storage/retrieval systems. We use CODING SYSTEMS as part of automation in material handling to locate and identify parts and subassemblies throughout the manufacturing system and to correctly transfer them to appropriate locations. Our coding systems used in automation are mostly bar coding, magnetic strips and RF tags which offer us the advantage of being rewritable and working even if there is no clear line of sight. Vital components in our automation lines are INDUSTRIAL ROBOTS. These are reprogrammable multifunctional manipulators for moving materials, parts, tools, and devices by means of variable programmed motions. Besides moving objects they do also other operations in our automation lines, such as welding, soldering, arc cutting, drilling, deburring, grinding, spray painting, measuring and testing….etc. Depending on the automated production line, we deploy four, five, six and up to seven degrees-of-freedom robots. For high accuracy demanding operations, we deploy robots with closed loop control systems in our automation lines. Positioning repeatabilities of 0.05 mm are common in our robotic systems. Our articulated variable-sequence robots enable human-like complex movements in multiple operation sequences, any of which they can execute given the proper cue like a specific bar code or a specific signal from an inspection station in the automation line. For demanding automation applications, our intelligent sensory robots carry out functions similar to humans in complexity. These intelligent versions are equipped with visual and tactile (touching) capabilities. Similar to humans, they have perception and pattern recognition capabilities and can make decisions. Industrial robots are not limited to our automated mass production lines, whenever needed we deploy them, small-batch production processes inclusively. Without the use of proper SENSORS, robots alone would not be sufficient for the successful operation of our automation lines. Sensors are an integral part of our data acquisition, monitoring, communication and machine control systems. Sensors widely used in our automation lines and equipment are mechanical, electrical, magnetic, thermal, ultrasonic, optical, fiber-optic, chemical, acoustic sensors. In some automation systems, smart sensors with capabilities to perform logic functions, two-way communication, decision-making and action-taking are deployed. On the other hand, some of our other automation systems or production lines deploy VISUAL SENSING (MACHINE VISION, COMPUTER VISION) involving cameras that optically sense objects, process the images, make measurements…etc. Examples where we use machine vision are real-time inspection in sheet metal inspection lines, verification of part placement and fixturing, monitoring of surface finish. Early in-line detection of defects in our automation lines prevents further processing of components and thus limits economic losses to a minimum. The success of automation lines at AGS-TECH Inc. relies heavily of FLEXIBLE FIXTURING. While some of the clamps, jigs and fixtures are being used in our job shop environment manually for small-batch production operations, other workholding devices such as power chucks, mandrels and collets are operated at various levels of mechanization and automation driven by mechanical, hydraulic and electrical means in mass production. In our automation lines and job shop, besides dedicated fixtures we do use intelligent fixturing systems with built-in flexibility that can accommodate a range of part shapes and dimensions without the need of making extensive changes and adjustments. Modular fixturing for example is widely used in our job shop for small-batch production operations to our advantage by eliminating the cost and time of making dedicated fixtures. Complex workpieces can be located into machines through fixtures produced quickly from standard components off our tool store shelves. Other fixtures we deploy throughout our job shops and automation lines are tombstone fixtures, bed-of-nails devices and adjustable-force clamping. We must emphasize that intelligent and flexible fixturing gives us the advantages of lower costs, shorter lead times, better quality in both small-batch production as well as automated mass production lines. An area of great importance for us is of course PRODUCT ASSEMBLY, DISASSEMBLY and SERVICE. We deploy both manual labor as well as automated assembly. Sometimes the total assembly operation is broken into individual assembly operations called SUBASSEMBLY. We offer manual, high-speed automatic and robotic assembly. Our manual assembly operations generally use simpler tools and are popular in some of our small-batch production lines. The dexterity of human hands and fingers offer us unique capabilities in some small-batch complex parts assemblies. Our high-speed automated assembly lines on the other hand use transfer mechanisms designed specially for assembly operations. In robotic assembly, one or multiple general-purpose robots operate at a single or multistation assembly system. In our automation lines for mass production, assembly systems are generally set up for certain product lines. We do however have also flexible assembly systems in automation which can be modified for increased flexibility in case a variety of models is needed. These assembly systems in automation do possess computer controls, interchangeable and programmable workheads, feeding devices and automated guiding devices. In our automation efforts we do always focus on: -Design for fixturing -Design for assembly -Design for disassembly -Design for service In automation the efficiency of disassembly and service are sometimes as important as the efficiency in assembly. The manner and ease with which a product may be taken apart for maintenance or replacement of its parts and serviced is a vital consideration in some product designs. AGS-TECH, Inc. has become a value added reseller of QualityLine production Technologies, Ltd., a high-tech company that has developed an Artificial Intelligence based software solution that automatically integrates with your worldwide manufacturing data and creates an advanced diagnostics analytics for you. This tool is really different than any others in the market, because it can be implemented very quickly and easily, and will work with any type of equipment and data, data in any format coming from your sensors, saved manufacturing data sources, test stations, manual entry .....etc. No need to change any of your existing equipment to implement this software tool. Besides real time monitoring of key performance parameters, this AI software provides you root cause analytics, provides early warnings and alerts. There is no solution like this in the market. This tool has saved manufacturers plenty of cash reducing rejects, returns, reworks, downtime and gaining customers goodwill. Easy and quick ! To schedule a Discovery Call with us and to find out more about this powerful artıficial intelligence based manufacturing analytics tool: - Please fill out the downloadable QL Questionnaire from the blue link on the left and return to us by email to sales@agstech.net . - Have a look at the blue colored downloadable brochure links to get an idea about this powerful tool. QualityLine One Page Summary and QualityLine Summary Brochure - Also here is a short video that gets to the point: VIDEO of QUALITYLINE MANUFACTURING AN ALYTICS TOOL PAGE sadurunge

Product Finder Locator for Partially Known Products AGS-TECH, Inc. Panjenengan Produsen Kustom Global, Integrator, Konsolidator, Mitra Outsourcing. Kita minangka sumber siji-mandeg kanggo manufaktur, fabrikasi, teknik, konsolidasi, outsourcing. Isi informasi sampeyan yen sampeyan ora ngerti persis produk sing sampeyan goleki nanging mung duwe informasi sebagean: Yen ngisi formulir ing ngisor iki ora bisa utawa angel banget, kita uga nampa panjaluk sampeyan liwat email. Cukup nulis kita ing sales@agstech.net Get a Price Quote on a partially known brand, model, part number....etc. First name Last name Email Phone Product Name if You Know: Product Make or Brand if You Know: Please Enter Manufacturer Part Number if Known: Please Enter SKU Code if You Know: Your Application for the Product: Quantity Needed: Do you have a price target ? If so, please let us know the price you expect: Give us more details if possible: Condition of Product Needed New Used Does Not Matter Yen sampeyan duwe, upload file sing cocog karo produk kanthi ngeklik link ing ngisor iki. Aja kuwatir, link ing ngisor iki bakal mbukak jendhela anyar kanggo ndownload file sampeyan. Sampeyan ora bakal navigasi adoh saka jendhela saiki iki. Sawise ngunggah file, nutup MUNG Jendhela Dropbox, nanging ora kaca iki. Priksa manawa sampeyan ngisi kabeh spasi lan klik tombol kirim ing ngisor iki. KLIK kene kanggo upload file Request a Quote Thanks! We’ll send you a price quote shortly. PAGE sadurunge Kita AGS-TECH Inc., sumber siji-mandeg kanggo manufaktur & fabrikasi & engineering & outsourcing & konsolidasi. Kita minangka integrator teknik paling maneka warna ing Donya sing nawakake sampeyan manufaktur khusus, subassembly, perakitan produk lan layanan teknik.

Electron Beam Machining, EBM, E-Beam Machining & Cutting & Boring, Custom Manufacturing of Parts - AGS-TECH Inc. - NM - USA EBM Machining & Electron Beam Machining In ELECTRON-BEAM MACHINING (EBM) we have high-velocity electrons concentrated into a narrow beam which are directed toward the work piece, creating heat and vaporizing the material. Thus EBM is a kind of HIGH-ENERGY-BEAM MACHINING technique. Electron-Beam Machining (EBM) can be used for very accurate cutting or boring of a variety of metals. Surface finish is better and kerf width is narrower in comparison to other thermal-cutting processes. The electron beams in EBM-Machining equipment are generated in an electron beam gun. The applications of Electron-Beam Machining are similar to those of Laser-Beam Machining, except that EBM requires a good vacuum. Thus these two processes are classified as electro-optical-thermal processes. The workpiece to be machined with EBM process is located under the electron beam and is kept under vacuum. The electron beam guns in our EBM machines are also provided with illumination systems and telescopes for alignment of the beam with the workpiece. Workpiece is mounted on a CNC table so that holes of any shape can be machined using the CNC control and beam deflection functionality of the gun. To achieve the fast evaporation of the material, the planar density of the power in the beam must be as high as possible. Values up to 10exp7 W/mm2 can be achieved at the spot of impact. The electrons transfer their kinetic energy into heat in a very small area, and the material impacted by the beam is evaporated in a very short time. The molten material at the top of the front, is expelled from the cutting zone by the high vapor pressure at the lower parts. EBM equipment is built similarly to electron beam welding machines. Electron-beam machines usually utilize voltages in the range of 50 to 200 kV to accelerate electrons to about 50 to 80% of the speed of light (200,000 km/s). Magnetic lenses whose function is based on Lorentz forces are used to focus the electron beam to the surface of the workpiece. With the help of a computer, the electromagnetic deflection system positions the beam as needed so holes of any shape can be drilled. In other words, the magnetic lenses in Electron-Beam-Machining equipment shape the beam and reduce the divergence. Apertures on the other hand allow only the convergent electrons to pass and capture the divergent low energy electrons from the fringes. The aperture and the magnetic lenses in EBM-Machines thus improve the quality of the electron beam. The gun in EBM is used in pulsed mode. Holes can be drilled in thin sheets using a single pulse. However for thicker plates, multiple pulses would be needed. Switching pulse durations of as low as 50 microseconds to as long as 15 miliseconds are generally used. To minimize electron collisions with air molecules resulting in scattering and keep contamination to a minimum, vacuum is used in EBM. Vacuum is difficult and expensive to produce. Especially obtaining good vacuum within large volumes and chambers is very demanding. Therefore EBM is best suited for small parts that fit into reasonably sized compact vacuum chambers. The level of vacuum within the EBM’s gun is in the order of 10EXP(-4) to 10EXP(-6) Torr. The interaction of the electron beam with the work piece produces X-rays which pose health hazard, and therefore well trained personnel should operate EBM equipment. Generally speaking, EBM-Machining is used for cutting holes as small as 0.001 inch (0.025 millimetre) in diameter and slots as narrow as 0.001 inch in materials up to 0.250 inch (6.25 millimetres) thick. Characteristic length is the diameter over which the beam is active. Electron beam in EBM may have a characteristic length of tens of microns to mm depending on degree of focusing of the beam. Generally, the high-energy focused electron beam is made to impinge on the workpiece with a spot size of 10 – 100 microns. EBM can provide holes of diameters in the range of 100 microns to 2 mm with a depth up to 15 mm, i.e., with a depth/diameter ratio of around 10. In case of defocused electron beams, power densities would drop as low as 1 Watt/mm2. However in case of focused beams the power densities could be increased to tens of kW/mm2. As a comparison, laser beams can be focused over a spot size of 10 – 100 microns with a power density as high as 1 MW/mm2. Electrical discharge typically provides the highest power densities with smaller spot sizes. Beam current is directly related to the number of electrons available in the beam. Beam current in Electron-Beam-Machining can be as low as 200 microamperes to 1 ampere. Increasing the EBM’s beam current and/or pulse duration directly increases the energy per pulse. We use high-energy pulses in excess of 100 J/pulse to machine larger holes on thicker plates. Under normal conditions, EBM-machining offers us the advantage of burr-free products. The process parameters directly affecting the machining characteristics in Electron-Beam-Machining are: • Acceleration voltage • Beam current • Pulse duration • Energy per pulse • Power per pulse • Lens current • Spot size • Power density Some fancy structures can also be obtained using Electron-Beam-Machining. Holes can be tapered along the depth or barrel shaped. By focusing the beam below the surface, reverse tapers can be obtained. A wide range of materials like steel, stainless steel, titanium and nickel super-alloys, aluminum, plastics, ceramics can be machined using e-beam-machining. There could be thermal damages associated with EBM. However, the heat-affected zone is narrow due to short pulse durations in EBM. The heat-affected zones are generally around 20 to 30 microns. Some materials such as aluminum and titanium alloys are more readily machined compared to steel. Furthermore EBM-machining does not involve cutting forces on the work pieces. This enables machining of fragile and brittle materials by EBM without any significant clamping or attaching as is the case in mechanical machining techniques. Holes can also be drilled at very shallow angles like 20 to 30 degrees. The advantages of Electron-Beam-Machining: EBM provides very high drilling rates when small holes with high aspect ratio are drilled. EBM can machine almost any material regardless of its mechanical properties. No mechanical cutting forces are involved, thus work clamping, holding and fixturing costs are ignorable, and fragile/brittle materials can be processed without problems. Heat affected zones in EBM are small because of shorte pulses. EBM is able of providing any shape of holes with accuracy by using electromagnetic coils to deflect electron beams and the CNC table. The disadvantages of Electron-Beam-Machining: Equipment is expensive and operating and maintaining vacuum systems requires specialized technicians. EBM requires significant vacuum pump down periods for attaining required low pressures. Even though heat affected zone is small in EBM, the recast layer formation occurs frequently. Our many years of experience and know-how helps us to take advantage of this valuable equipment in our manufacturing environment. KLIK Product Finder-Locator Service PAGE sadurunge

Custom Electric Electronics Manufacturing, Lighting, Display, Touchscreen, Cable Assembly, PCB, PCBA, Wireless Devices, Wire Harness, Microwave Components Pabrikan Produk Listrik & Elektronik Kustom Waca liyane Majelis & Interkoneksi Kabel Listrik & Elektronik Waca liyane PCB & PCBA Manufaktur lan Majelis Waca liyane Komponen Listrik & Energi lan Sistem Manufaktur lan Majelis Waca liyane Manufaktur & Majelis Piranti RF lan Nirkabel Waca liyane Komponen Microwave lan Sistem Manufaktur & Majelis Waca liyane Sistem Pencahayaan & Iluminasi Manufaktur lan Majelis Waca liyane Solenoida lan Komponen Elektromagnetik & Majelis Waca liyane Komponen lan Majelis Listrik & Elektronik Waca liyane Tampilan & Layar Demek & Monitor Pabrikan lan Perakitan Waca liyane Otomasi & Sistem Robotik Manufaktur lan Majelis Waca liyane Sistem Embedded & Komputer Industri & PC Panel Waca liyane Peralatan Uji Industri We offer: • Majelis Kabel Custom, PCB, Tampilan & Layar Demek (kayata iPod), Komponen Daya & Energi, Nirkabel, Microwave, Komponen Kontrol Gerakan, Produk Lampu, Komponen Elektromagnetik lan Elektronik. Kita mbangun produk miturut spesifikasi lan syarat tartamtu. Produk kita diprodhuksi ing ISO9001: 2000, QS9000, ISO14001, TS16949 lingkungan certified lan duwe CE, UL tandha lan ketemu standar industri kayata IEEE, ANSI. Sawise ditunjuk kanggo proyek sampeyan, kita bisa ngurus kabeh manufaktur, perakitan, uji coba, kualifikasi, pengiriman & bea cukai. Yen luwih seneng, kita bisa nyimpen bagean sampeyan, ngumpulake kit khusus, nyetak lan menehi label jeneng & merek perusahaan lan dikirim menyang pelanggan. Ing tembung liyane, kita bisa dadi gudang lan pusat distribusi yen sampeyan seneng iki. Amarga gudang kita ana ing cedhak pelabuhan laut utama, iki menehi keuntungan logistik. Contone, nalika produk sampeyan teka ing pelabuhan laut utama AS, kita bisa langsung ngeterake menyang gudang toko sing bisa disimpen, ngumpul, nggawe kit, relabel, nyithak, paket miturut pilihan sampeyan lan ngirim kapal menyang pelanggan yen sampeyan pengin. . Kita ora mung nyedhiyakake produk. Perusahaan kita nggarap kontrak khusus ing ngendi kita teka ing situs sampeyan, ngevaluasi proyek sampeyan ing situs lan ngembangake proposal proyek sing dirancang khusus kanggo sampeyan. Kita banjur ngirim tim sing berpengalaman kanggo ngleksanakake proyek kasebut. Conto kerja kontrak kalebu instalasi modul solar, generator angin, lampu LED lan sistem otomatisasi hemat energi ing fasilitas industri sampeyan kanggo nyuda tagihan energi, instalasi sistem deteksi serat optik kanggo ndeteksi kerusakan ing pipa sampeyan utawa kanggo ndeteksi kemungkinan penyusup sing mlebu ing omah sampeyan. papan. Kita njupuk proyek cilik uga proyek gedhe ing skala industri. Minangka langkah pisanan, kita bisa nyambungake sampeyan liwat telpon, telekonferensi utawa MSN messenger menyang anggota tim ahli, supaya sampeyan bisa komunikasi langsung menyang pakar, takon lan ngrembug proyek sampeyan. Yen perlu, kita bakal teka lan ngunjungi sampeyan. Yen sampeyan butuh produk kasebut utawa sampeyan duwe pitakon, hubungi +1-505-550-6501 utawa email ing sales@agstech.net Yen sampeyan seneng banget karo kemampuan teknik lan riset & pangembangan tinimbang kemampuan manufaktur, mula sampeyan ngajak sampeyan ngunjungi situs web teknik http://www.ags-engineering.com KLIK Product Finder-Locator Service PAGE sadurunge

Manufacturing and Assembly of Simple Machines, Lever Assembly, Wheel and Axle, Pulley, Pulley System, Hoist, Inclined Plane, Wedge, Screws from AGS-TECH Inc. Majelis Mesin Prasaja A SIMPLE MACHINE is a mechanical device that changes the direction or magnitude of a force. SIMPLE MACHINES can be defined as the simplest mechanisms that provide mechanical advantage. In other words, simple machines are devices with few or no moving parts that make work easier. Mechanical advantage is an advantage gained by using simple machines to accomplish work with less effort. The goal is to make the task easier (which means it requires less force), but this may necessitate more time or room to work (more distance, rope, etc.). An example of this is, applying a smaller force over a longer distance to achieve the same effect as applying a large force over a small distance. Mathematically speaking mechanical advantage is the ratio of the output force exerted by a simple machine to the input force applied to it. Simple machines have been around for a very long time. Using simple machines, Egyptians built the Great Pyramids thousands of years ago. Simple machines will always be around in more advanced forms as building blocks of compound machines and other complex machinery. Simple machines we supply our clients can be broadly categorized as: - Lever, Lever Assembly - Wheel and axle assemblies - Pulley & Hoist, Pulley Systems - Inclined plane - Wedge and wedge based systems - Screw and screw systems A simple machine is an elementary device that has a specific movement (often called a mechanism), which can be combined with other devices and movements to form a machine. Thus simple machines are considered to be the ''building blocks'' of more complicated machines. As an example, a lawn mover may incorporate six simple machines. We do use visual simulation tools in the design of some simple machines, which aids in the optimization process. To give you a more familiar example, a bicycle may have the following simple machines: Levers: Shifters, the pedal levers, derailleurs, handlebars, freewheel assembly, brakes. Wheel and axle: The wheels, pedals, crankset Pulleys: Parts of the shifting and braking mechanisms, drive train (chain and gears). Screws: Many of these hold parts together Wedges: The teeth on the gears. Some gooseneck assemblies where the handlebars attach to the front fork tube may employ a wedge to tighten the connection. A COMPOUND MACHINE is a device that combines two or more simple machines. Using the six basic simple machines, various compound machines can be assembled. There are many simple and compound machines in our homes. Some examples of the compound machines used at home are can openers (wedge and lever), exercise machines/cranes/tow trucks (levers and pulleys), wheel barrow (wheel and axle and lever). As an example, a wheelbarrow combines the use of a wheel and axle with a lever. Car jacks are examples of screw-type simple machines that enable one person to lift up the side of a car. Many of the machine elements we manufacture and supply our customers are used in the assembly of simple machines. The choice of materials, coatings and fabrication processes are very important and depends on the application of the simple machine being designed for a particular task. We will always be pleased to guide you in the design phases of your simple machines and manufacture them for you with the highest quality. Simple machines AGS-TECH Inc. has manufactured are being used in automobiles, motorcycles, auto lift equipment, conveyor systems, production equipment and machines, consumer electronics and goods. Here are brochures and catalogs of some of our off-shelf simple machines for downloading (please click on highlighted text below): - Slewing Drives - Slewing Rings - V-Pulleys - Timing Pulleys - Worm Gear Speed Reducers - WP Model - Worm Gear Speed Reducers - NMRV Model - T-Type Spiral Bevel Gear Redirector - Worm Gear Screw Jacks KLIK Product Finder-Locator Service PAGE sadurunge

Surface Treatment and Modification - Surface Engineering - Hardening - Plasma - Laser - Ion Implantation - Electron Beam Processing at AGS-TECH Pangobatan lumahing lan Modifikasi Surfaces cover everything. The appeal and functions material surfaces provide us are of utmost importance. Therefore SURFACE TREATMENT and SURFACE MODIFICATION are among our everyday industrial operations. Surface treatment & modification leads to enhanced surface properties and can be performed either as a final finishing operation or prior to a coating or joining operation. The processes of surface treatments and modification (also referred to as SURFACE ENGINEERING), tailor the surfaces of materials and products to: - Control friction and wear - Improve corrosion resistance - Enhance adhesion of subsequent coatings or joined parts - Change physical properties conductivity, resistivity, surface energy and reflection - Change chemical properties of surfaces by introducing functional groups - Change dimensions - Change the appearance, e.g., color, roughness…etc. - Clean and / or disinfect the surfaces Using surface treatment and modification, the functions and service lives of materials can be improved. Our common surface treatment and modification methods can be divided into two major categories: Surface Treatment and Modification That Covers Surfaces: Organic Coatings: The organic coatings apply paints, cements, laminates, fused powders and lubricants on the surfaces of materials. Inorganic Coatings: Our popular inorganic coatings are electroplating, autocatalytic plating (electroless platings), conversion coatings, thermal sprays, hot dipping, hardfacing, furnace fusing, thin film coatings such as SiO2, SiN on metal, glass, ceramics,….etc. Surface treatment and modification involving coatings is explained in detail under the related submenu, please click here Functional Coatings / Decorative Coatings / Thin Film / Thick Film Surface Treatment and Modification That Alters Surfaces: Here on this page we will concentrate on these. Not all of the surface treatment and modification techniques we describe below are on the micro or nano-scale, but we will nevertheless mention about them briefly since the basic objectives and methods are similar to significant extent to those that are on the micromanufacturing scale. Hardening: Selective surface hardening by laser, flame, induction and electron beam. High Energy Treatments: Some of our high energy treatments include ion implantation, laser glazing & fusion, and electron beam treatment. Thin Diffusion Treatments: Thin diffusion processes include ferritic-nitrocarburizing, boronizing, other high temperature reaction processes such as TiC, VC. Heavy Diffusion Treatments: Our heavy diffusion processes include carburizing, nitriding, and carbonitriding. Special Surface Treatments: Special treatments such as cryogenic, magnetic, and sonic treatments affect both the surfaces and the bulk materials. The selective hardening processes can be carried out by flame, induction, electron beam, laser beam. Large substrates are deep hardened using flame hardening. Induction hardening on the other hand is used for small parts. Laser and electron beam hardening are sometimes not distinguished from those in hardfacings or high-energy treatments. These surface treatment and modification processes are applicable only to steels that have sufficient carbon and alloy content to allow quench hardening. Cast irons, carbon steels, tool steels, and alloy steels are suitable for this surface treatment and modification method. Dimensions of parts are not significantly altered by these hardening surface treatments. Depth of hardening can vary from 250 microns to the whole section depth. However, in the whole section case, the section must be thin, less than 25 mm (1 in), or small, since the hardening processes require a rapid cooling of materials, sometimes within a second. This is difficult to achieve in large workpieces, and therefore in large sections, only the surfaces can be hardened. As a popular surface treatment and modification process we harden springs, knife blades, and surgical blades among many other products. High-energy processes are relatively new surface treatment and modification methods. Properties of surfaces are changed without changing the dimensions. Our popular high-energy surface treatment processes are electron beam treatment, ion implantation, and laser beam treatment. Electron Beam Treatment: Electron beam surface treatment alters the surface properties by rapid heating and rapid cooling — in the order of 10Exp6 Centigrade/sec (10exp6 Fahrenheit/sec) in a very shallow region around 100 microns near the material surface. Electron beam treatment can also be used in hardfacing to produce surface alloys. Ion Implantation: This surface treatment and modification method uses electron beam or plasma to convert gas atoms to ions with sufficient energy, and implant/insert the ions into atomic lattice of the substrate, accelerated by magnetic coils in a vacuum chamber. Vacuum makes it easier for ions to move freely in the chamber. The mismatch between implanted ions and the surface of the metal creates atomic defects that hardens the surface. Laser Beam Treatment: Like the electron beam surface treatment and modification, laser beam treatment alters the surface properties by rapid heating and rapid cooling in a very shallow region near the surface. This surface treatment & modification method can also be used in hardfacing to produce surface alloys. A know-how in Implant dosages and treatment parameters makes it possible for us to use these high energy surface treatment techniques in our fabrication plants. Thin Diffusion Surface Treatments: Ferritic nitrocarburizing is a case hardening process that diffuses nitrogen and carbon into ferrous metals at sub-critical temperatures. The processing temperature is usually at 565 Centigrade (1049 Fahrenheit). At this temperature steels and other ferrous alloys are still in a ferritic phase, which is advantageous compared to other case hardening processes that occur in the austenitic phase. The process is used to improve: •scuffing resistance •fatigue properties •corrosion resistance Very little shape distortion occurs during the hardening process thanks to the low processing temperatures. Boronizing, is the process where boron is introduced to a metal or alloy. It is a surface hardening and modification process by which boron atoms are diffused into the surface of a metal component. As a result the surface contains metal borides, such as iron borides and nickel borides. In their pure state these borides have extremely high hardness and wear resistance. Boronized metal parts are extremely wear resistant and will often last up to five times longer than components treated with conventional heat treatments such as hardening, carburizing, nitriding, nitrocarburizing or induction hardening. Heavy Diffusion Surface Treatment and Modification: If the carbon content is low (less than 0.25% for example) then we can increase the carbon content of the surface for hardening. The part can be either heat-treated by quenching in a liquid or cooled in still air depending on the properties desired. This method will only allow local hardening on the surface, but not in the core. This is sometimes very desirable because it allows for a hard surface with good wear properties as in gears, but has a tough inner core that will perform well under impact loading. In one of the surface treatment and modification techniques, namely Carburizing we add carbon to the surface. We expose the part to a Carbon rich atmosphere at an elevated temperature and allow diffusion to transfer the Carbon atoms into the steel. Diffusion will happen only if the steel has low carbon content, because diffusion works on the differential of the concentrations principle. Pack Carburizing: Parts are packed in a high carbon medium such as carbon powder and heated in a furnace for 12 to 72 hours at 900 Centigrade (1652 Fahrenheit). At these temperatures CO gas is produced which is a strong reducing agent. The reduction reaction occurs on the surface of the steel releasing carbon. The carbon is then diffused into the surface thanks to the high temperature. The Carbon on the surface is 0.7% to 1.2% depending on process conditions. The hardness achieved is 60 - 65 RC. The depth of the carburized case ranges from about 0.1 mm up to 1.5 mm. Pack carburizing requires good control of temperature uniformity and consistency in heating. Gas Carburizing: In this variant of surface treatment, Carbon Monoxide (CO) gas is supplied to a heated furnace and the reduction reaction of deposition of carbon takes place on the surface of the parts. This process overcomes most of the problems of pack carburizing. One concern however is the safe containment of the CO gas. Liquid Carburizing: The steel parts are immersed in a molten carbon rich bath. Nitriding is a surface treatment and modification process involving diffusion of Nitrogen into the surface of steel. Nitrogen forms Nitrides with elements such as Aluminum, Chromium, and Molybdenum. The parts are heat-treated and tempered before nitriding. The parts are then cleaned and heated in a furnace in an atmosphere of dissociated Ammonia (containing N and H) for 10 to 40 hours at 500-625 Centigrade (932 - 1157 Fahrenheit). Nitrogen diffuses into the steel and forms nitride alloys. This penetrates to a depth of up to 0.65 mm. The case is very hard and distortion is low. Since the case is thin, surface grinding is not recommended and therefore nitriding surface treatment may not be an option for surfaces with very smooth finishing requirements. Carbonitriding surface treatment and modification process is most suitable for low carbon alloy steels. In the carbonitriding process, both Carbon and Nitrogen are diffused into the surface. The parts are heated in an atmosphere of a hydrocarbon (such as methane or propane) mixed with Ammonia (NH3). Simply put, the process is a mix of Carburizing and Nitriding. Carbonitriding surface treatment is performed at temperatures of 760 - 870 Centigrade (1400 - 1598 Fahrenheit), It is then quenched in a natural gas (Oxygen free) atmosphere. The carbonitriding process is not suitable for high precision parts due to the distortions that are inherent. The hardness achieved is similar to carburizing (60 - 65 RC) but not as high as Nitriding (70 RC). The case depth is between 0.1 and 0.75 mm. The case is rich in Nitrides as well as Martensite. Subsequent tempering is needed to reduce brittleness. Special surface treatment and modification processes are in the early stages of development and their effectiveness is as yet unproven. They are: Cryogenic Treatment: Generally applied on hardened steels, slowly cool down the substrate to about -166 Centigrade (-300 Fahrenheit) to increase the density of the material and thus increase the wear resistance and dimension stability. Vibration Treatment: These intend to relieve thermal stress built-up in heat treatments through vibrations and increase the wear life. Magnetic Treatment: These intend to alter the line-up of atoms in materials through magnetic fields and hopefully improve the wear life. The effectiveness of these special surface treatment and modification techniques still remains to be proven. Also these three techniques above affect the bulk material besides surfaces. Please download our catalogs and brochures by clicking on the blue colored text below: - Private Label Nano Surface Protection Car Care Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Industrial Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Marine Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Products We can label these products with your name and logo if you wish KLIK Product Finder-Locator Service PAGE sadurunge

AGS-TECH Inc. News and Announcements - Employment Opportunities - New Product Launch - Corporate News - News about Advancements in Manufacturing and Technology Kabar & Pengumuman saka AGS-TECH Inc November 5 - 2021: AGS-TECH, Inc. has become a value added reseller of QualityLine production Technologies, Ltd., a high-tech company that has developed an Artificial Intelligence based software solution that automatically integrates with your worldwide manufacturing data and creates an advanced diagnostics analytics for you. This tool is really different than any others in the market, because it can be implemented very quickly and easily, and will work with any type of equipment and data, data in any format coming from your sensors, saved manufacturing data sources, test stations, manual entry .....etc. No need to change any of your existing equipment to implement this software tool. Besides real time monitoring of key performance parameters, this AI software provides you root cause analytics, provides early warnings and alerts. There is no solution like this in the market. This tool has saved manufacturers plenty of cash reducing rejects, returns, reworks, downtime and gaining customers goodwill. Easy and quick ! To schedule a Discovery Call with us and to find out more about this powerful artıficial intelligence based manufacturing analytics tool: - Please fill out the downloadable QL Questionnaire from the blue link on the left and return to us by email to sales@agstech.net . - Have a look at the blue colored downloadable brochure links to get an idea about this powerful tool. QualityLine One Page Summary and QualityLine Summary Brochure - Also here is a short video that gets to the point: VIDEO of QUALITYLINE MANUFACTURING AN ALYTICS TOOL September 18 - 2021: AGS-TECH, Inc. has become an ATOP Industrial-Networking and Computing Distribution Partner. You can now order ATOP industrial networking and switching products from us. We offer your enterprise both off-the-shelf as well as custom tailored solutions. Please check our webpages and download respective brochures to help you select the best solution. Download our ATOP TECHNOLOGIES compact product brochure (Download ATOP Technologies Product List 2021) February 4 - 2020: Due to the coronavirus outbreak, we would like to inform our customers that some of our production taking place in China will resume on the 10th of February due to government precautions and measures to stop the spreading. We are sorry for the delay caused by this unfortunate event. July 19 -2018: AGS-TECH, Inc. has launched its renewed global procurement website. Potential suppliers of products and services please visit our procurement & purchasing site http://www.agsoutsourcing.com We encourage you to fill out the online supplier application form by clicking here: https://www.agsoutsourcing.com/online-supplier-application-platfor Filling out this form will enable us to evaluate you as a potential supplier. This is the most preferred way of becoming a supplier of AGS-TECH, Inc., its branches and affiliates. Whether you are a custom manufacturer of parts ad components, an engineering integrator, engineering consultant or services provider, or anything else you may think would be beneficial to us, this is the form you should fill out. January 31 - 2018: AGS-TECH Inc. launched its new website. We hope our existing customers and new potential customers will enjoy our new website and frequently visit us online. January 23 - 2017: Our new Free Space Optical Components brochure is now available for download under Optical / Fiber Optic Products menu or directly from the following link - FREE SPACE OPTICAL COMPONENTS BROCHURE We hope you will find it easy to scroll through our new product brochure. April 27 - 2015: AGS-TECH Inc. has currently the following open positions available. More information about these openings can be obtained from Dr. Zach Miller. Interested applicants, please email your interest along with resumes to info@agstech.net (put as title Career Opportunities) - Project Coordinator (At least a B.S. in Engineering, Physics or Materials Science required. Ideal candidate must have in-depth knowledge and hands-on experience in CNC machining, aluminum die casting, metal forging, joining and assembly processes such as welding, soldering, brazing, fastening, quality control, test and measurement techniques used in metallurgy. At least 5 years industrial experience in US or Canada and fluency in English, Chinese, Mandarin is required. Must have US or Canadian citizenship. - Project Coordinator (At least a B.S. in Engineering, Physics or Materials Science required. Ideal candidate must have in-depth knowledge and experience on fiber optic passive components, DWDM, beamsplitters, optical fiber amplifiers, fiber optic components assembly, quality control, test and measurement techniques such as power monitoring, OTDR, splicing tools, spectrum analyzers used in fiber optics. At least 5 years industrial experience in US or Canada and fluency in English, Chinese, Mandarin is required. Must have US or Canadian citizenship. April 24 - 2015: AGS-TECH Inc. website is currently being updated. Please be patient in case some pages cannot be accessed or have problems. We apologize for the temporary inconvenience this may cause during your visit. March 2014: AGS-TECH Inc. has currently the following open positions available. More information about these openings can be obtained from Dr. Zach Miller. Interested applicants, please email your interest along with resumes to info@agstech.net (put as title Career Opportunities) - Project Coordinator (At least a B.S. in Engineering, Physics or Materials Science required. Ideal candidate must know about machining, casting, precision assembly, quality control, test and measurement techniques used in metallurgy. Fluency in English, Chinese, Mandarin and / or Vietnamese is required) - Project Coordinator (At least a B.S. in Engineering, Physics or Materials Science required. Ideal candidate must know about machining, casting, precision assembly, quality control, test and measurement techniques used in metallurgy. Must speak German and English fluently. Candidates stationed and living in Germany are preferred) - Senior Systems Engineer (At least a B.S. in Engineering, Physics or Materials Science required, at least 5 years industrial experience in fiber optic communication systems preferred, fluency in English, Chinese, Mandarin required) • November 2013: AGS-TECH Inc. is hiring. Interested applicants, please email your interest along with resumes to info@agstech.net Open positions exist for: - Senior Design Engineer (Wireless Communication Systems) - Senior Systems Engineer (Wireless Communication Systems) - Materials or Chemical Engineer (Nanofabrication) - Project Coordinator (must speak Chinese and English fluently) - Project Coordinator (must speak German and English fluently. Candidates stationed and living in Germany are preferred) PAGE sadurunge