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Cable Assembly - Wire Harness - Cable Management Accessories - Connectorization - Cable Fan Out - Interconnects Majelis & Interkoneksi Kabel Listrik & Elektronik We offer: • Various kinds of wires, cables, cable assembly and cable management accessories, unshielded or shielded cable for power distribution, high voltage, low signal, telecommunications…etc., inteconnects and interconnect components. • Connectors, plugs, adaptors and mating sleeves, connectorized patch panel, splicing enclosure. Cable Termination Products Brochure (Tubing, Insulation, Protection, Heat Shrinkable, Cable Repair, Breakout Boots, Clamps, Cable Ties and Clips, Wire Markers, Tapes, Cable End Caps, Distribution Slots) Custom Specialized Cable Assemblies Brochure for Lighting, Touch Technology, Industrial Electronics, Security, White Goods, Aerospace, Military, Telecom, Medical & Sterilizable, Renewable Energy...etc. Download our catalog for off-shelf interconnect components and hardware, please CLICK HERE. IGOYE Brand Solar Products Catalog Includes Solar Connectors & Cables, EV Charging Sockets. Microwave Flexible Cable Assembly Microwave and Milimeter Wave Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Precision RF Adapters Catalog Private Label Low-Voltage Cables (We can put your name and logo on these, so you can market your name when you sell or install these cables) Private Label Low-Voltage Cables & Accessories for AV - DataCom - CATV - Security - LAN - Electrical (We can put your name and logo on these, so you can market your name when you sell or install these cables) Receptacles-Power Entry-Connectors Catalogue RF Components Brochure for Coaxial Fixed Attenuators, Coaxial Terminations, DC Blocks, Coax Adapters, Waveguide Components, Power Dividers, RF Connectors, RF Tools. Terminal Blocks and Connectors Terminal Blocks General Catalogue - Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum components, BNC, SHV adapters and connectors, conductors and contact pins, connector terminals can be found here: Factory Brochure Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Interconnects and cable assembly products come in a large variety. Please specify us the type, application, specification sheets if available and we will offer you the most suitable product. We can custom tailor these for you in case it is not an off-the-shelf product. Our cable assemblies and interconnects are CE or UL marked by authorized organizations and comply with industry regulations and standards such as IEEE, IEC, ISO...etc. To find out more about our engineering and research & development capabilities instead of manufacturing operations, we invite you to visit our engineering site http://www.ags-engineering.com KLIK Product Finder-Locator Service PREVIOUS PAGE

Industrial leather products including honing and sharpening belts, leather transmission belts, sewing machine leather treadle belt, leather tool organizers and holders, leather gun holsters, leather steering wheel covers and more. Produk Kulit Industri Industrial leather products manufactured include: - Leather Honing and Sharpening Belts - Leather Transmission Belts - Sewing Machine Leather Treadle Belt - Leather Tool Organizers & Holders - Leather Gun Holsters Leather is a natural product with outstanding properties that make it a good fit for many applications. Industrial leather belts are used in power transmissions, as sewing machine leather treadle belts as well as fastening, securing, honing and sharpening of metal blades among many others. Besides our off-shelf industrial leather belts listed in our brochures, endless belts and special lengths / widths can also be produced for you. Applications of industrial leather includes Flat Leather Belting for power transmission and Round Leather Belting for Industrial Sewing Machines. Industrial leather is one of the oldest types of manufactured products. Our Vegetable Tanned Industrial leathers are pit tanned for many months and heavily dressed with a mixture of oils and greased to give its ultimate strength. Our Chrome Industrial Leathers can be manufactured in various ways, waxed, oiled or dry for moulding. We offer a chrome-retanned leather manufactured to withstand very high temperatures and they can be used for hydraulic applications and packings. Our Chrome Friction leathers are designed to have extraordinary abrasion properties. Various Shore Hardnesses are available. Many other applications of industrial leather products exist, including wearable tool organizers, tool holders, leather threads, steering wheel covers...etc. We are here to help you in your projects. A blueprint, a sketch, a photo or sample can serve to make us understand your product needs. We can either manufacture the industrial leather product according to your design, or we can help you in your design work and once you approve the final design, we can manufacture the product for you. Since we supply a wide variety of industrial leather products with different dimensions, applications and material grade; it is impossible to list them all here. We encourage you to email or call us so we can determine which product is the best fit for you. When contacting us, please make sure to inform us about: - Your application for the industrial leather products - Material grade desired & needed - Dimensions - Finish - Packaging requirements - Labeling requirements - Quantity PAGE sadurunge

Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. Mikroelektronika & Semikonduktor Manufaktur lan Fabrikasi Many of our nanomanufacturing, micromanufacturing and mesomanufacturing techniques and processes explained under the other menus can be used for MICROELECTRONICS MANUFACTURING too. However due to the importance of microelectronics in our products, we will concentrate on the subject specific applications of these processes here. Microelectronics related processes are also widely referred to as SEMICONDUCTOR FABRICATION processes. Our semiconductor engineering design and fabrication services include: - FPGA board design, development and programming - Microelectronics foundry services: Design, prototyping and manufacturing, third-party services - Semiconductor wafer preparation: Dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection - Microelectronic package design and fabrication: Both off-shelf and custom design and fabrication - Semiconductor IC assembly & packaging & test: Die, wire and chip bonding, encapsulation, assembly, marking and branding - Lead frames for semiconductor devices: Both off-shelf and custom design and fabrication - Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication - Sensor & actuator design and fabrication: Both off-shelf and custom design and fabrication - Optoelectronic & photonic circuits design and fabrication Let us examine the microelectronics and semiconductor fabrication and test technologies in more detail so you can better understand the services and products we are offering. FPGA Board Design & Development and Programming: Field-programmable gate arrays (FPGAs) are reprogrammable silicon chips. Contrary to processors that you find in personal computers, programming an FPGA rewires the chip itself to implement user’s functionality rather than running a software application. Using prebuilt logic blocks and programmable routing resources, FPGA chips can be configured to implement custom hardware functionality without using a breadboard and soldering iron. Digital computing tasks are carried out in software and compiled down to a configuration file or bitstream that contains information on how the components should be wired together. FPGAs can be used to implement any logical function that an ASIC could perform and are completely reconfigurable and can be given a completely different “personality” by recompiling a different circuit configuration. FPGAs combine the best parts of application-specific integrated circuits (ASICs) and processor-based systems. These benefits include the following: • Faster I/O response times and specialized functionality • Exceeding the computing power of digital signal processors (DSPs) • Rapid prototyping and verification without the fabrication process of custom ASIC • Implementation of custom functionality with the reliability of dedicated deterministic hardware • Field-upgradable eliminating the expense of custom ASIC re-design and maintenance FPGAs provide speed and reliability, without requiring high volumes to justify the large upfront expense of custom ASIC design. Reprogrammable silicon also has the same flexibility of software running on processor-based systems, and it is not limited by the number of processing cores available. Unlike processors, FPGAs are truly parallel in nature, so different processing operations do not have to compete for the same resources. Each independent processing task is assigned to a dedicated section of the chip, and can function autonomously without any influence from other logic blocks. As a result, the performance of one part of the application is not affected when more processing is added on. Some FPGAs have analog features in addition to digital functions. Some common analog features are programmable slew rate and drive strength on each output pin, allowing the engineer to set slow rates on lightly loaded pins that would otherwise ring or couple unacceptably, and to set stronger, faster rates on heavily loaded pins on high-speed channels that would otherwise run too slowly. Another relatively common analog feature is differential comparators on input pins designed to be connected to differential signaling channels. Some mixed signal FPGAs have integrated peripheral analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) with analog signal conditioning blocks that allow them to operate as a system-on-a-chip. Briefly, the top 5 benefits of FPGA chips are: 1. Good Performance 2. Short Time to Market 3. Low Cost 4. High Reliability 5. Long-Term Maintenance Capability Good Performance – With their capability of accommodating parallel processing, FPGAs have better computing power than digital signal processors (DSPs) and do not require sequential execution as DSPs and can accomplish more per clock cycles. Controlling inputs and outputs (I/O) at the hardware level provides faster response times and specialized functionality to closely match application requirements. Short Time to market - FPGAs offer flexibility and rapid prototyping capabilities and thus shorter time-to-market. Our customers can test an idea or concept and verify it in hardware without going through the long and expensive fabrication process of custom ASIC design. We can implement incremental changes and iterate on an FPGA design within hours instead of weeks. Commercial off-the-shelf hardware is also available with different types of I/O already connected to a user-programmable FPGA chip. The growing availability of high-level software tools offer valuable IP cores (prebuilt functions) for advanced control and signal processing. Low Cost—The nonrecurring engineering (NRE) expenses of custom ASIC designs exceed that of FPGA-based hardware solutions. The large initial investment in ASICs can be justified for OEMs producing many chips per year, however many end users need custom hardware functionality for the many systems in development. Our programmable silicon FPGA offers you something with no fabrication costs or long lead times for assembly. System requirements frequently change over time, and the cost of making incremental changes to FPGA designs is negligible when compared to the large expense of respinning an ASIC. High Reliability - Software tools provide the programming environment and FPGA circuitry is a true implementation of program execution. Processor-based systems generally involve multiple layers of abstraction to help task scheduling and share resources among multiple processes. The driver layer controls hardware resources and the OS manages memory and processor bandwidth. For any given processor core, only one instruction can execute at a time, and processor-based systems are continually at risk of time-critical tasks preempting one another. FPGAs, do not use OSs, pose minimum reliability concerns with their true parallel execution and deterministic hardware dedicated to every task. Long-term Maintenance Capability - FPGA chips are field-upgradable and do not require the time and cost involved with redesigning ASIC. Digital communication protocols, for example, have specifications that can change over time, and ASIC-based interfaces may cause maintenance and forward-compatibility challenges. To the contrary, reconfigurable FPGA chips can keep up with potentially necessary future modifications. As products and systems mature, our customers can make functional enhancements without spending time redesigning hardware and modifying the board layouts. Microelectronics Foundry Services: Our microelectronics foundry services include design, prototyping and manufacturing, third-party services. We provide our customers with assistance throughout the entire product development cycle - from design support to prototyping and manufacturing support of semiconductor chips. Our objective in design support services is to enable a first-time right approach for digital, analog, and mixed-signal designs of semiconductor devices. For example, MEMS specific simulation tools are available. Fabs that can handle 6 and 8 inch wafers for integrated CMOS and MEMS are at your service. We offer our clients design support for all major electronic design automation (EDA) platforms, supplying correct models, process design kits (PDK), analog and digital libraries, and design for manufacturing (DFM) support. We offer two prototyping options for all technologies: the Multi Product Wafer (MPW) service, where several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. These are more economical than the full mask set. The MLM service is highly flexible compared to the fixed dates of the MPW service. Companies may prefer outsourcing semiconductor products to a microelectronics foundry for a number of reasons including the need for a second source, using internal resources for other products and services, willingness to go fabless and decrease risk and burden of running a semiconductor fab…etc. AGS-TECH offers open-platform microelectronics fabrication processes that can be scaled down for small wafer runs as well as mass manufacturing. Under certain circumstances, your existing microelectronics or MEMS fabrication tools or complete tool sets can be transferred as consigned tools or sold tools from your fab into our fab site, or your existing microelectronics and MEMS products can be redesigned using open platform process technologies and ported to a process available at our fab. This is faster and more economical than a custom technology transfer. If desired however customer’s existing microelectronics / MEMS fabrication processes may be transferred. Semiconductor Wafer Preparation: If desired by customers after wafers are microfabricated, we carry out dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection operations on semiconductor wafers. Semiconductor wafer processing involves metrology in between the various processing steps. For example, thin film test methods based on ellipsometry or reflectometry, are used to tightly control the thickness of gate oxide, as well as the thickness, refractive index and extinction coefficient of photoresist and other coatings. We use semiconductor wafer test equipment to verify that the wafers haven't been damaged by previous processing steps up until testing. Once the front-end processes have been completed, the semiconductor microelectronic devices are subjected to a variety of electrical tests to determine if they function properly. We refer to the proportion of microelectronics devices on the wafer found to perform properly as the “yield”. Testing of microelectronics chips on the wafer are carried out with an electronic tester that presses tiny probes against the semiconductor chip. The automated machine marks each bad microelectronics chip with a drop of dye. Wafer test data is logged into a central computer database and semiconductor chips are sorted into virtual bins according to predetermined test limits. The resulting binning data can be graphed, or logged, on a wafer map to trace manufacturing defects and mark bad chips. This map can also be used during wafer assembly and packaging. In final testing, microelectronics chips are tested again after packaging, because bond wires may be missing, or analog performance may be altered by the package. After a semiconductor wafer is tested, it is typically reduced in thickness before the wafer is scored and then broken into individual dies. This process is called semiconductor wafer dicing. We use automated pick-and-place machines specially manufactured for microelectronics industry to sort out the good and bad semiconductor dies. Only the good, unmarked semiconductor chips are packaged. Next, in the microelectronics plastic or ceramic packaging process we mount the semiconductor die, connect the die pads to the pins on the package, and seal the die. Tiny gold wires are used to connect the pads to the pins using automated machines. Chip scale package (CSP) is another microelectronics packaging technology. A plastic dual in-line package (DIP), like most packages, is multiple times larger than the actual semiconductor die placed inside, whereas CSP chips are nearly the size of the microelectronics die; and a CSP can be constructed for each die before the semiconductor wafer is diced. The packaged microelectronics chips are re-tested to make sure that they are not damaged during packaging and that the die-to-pin interconnect process was completed correctly. Using lasers we then etch the chip names and numbers on the package. Microelectronic Package Design and Fabrication: We offer both off-shelf and custom design and fabrication of microelectronic packages. As part of this service, modeling and simulation of microelectronic packages is also carried out. Modeling and simulation ensures virtual Design of Experiments (DoE) to achieve the optimal solution, rather than testing packages on the field. This reduces the cost and production time, especially for new product development in microelectronics. This work also gives us the opportunity to explain our customers how the assembly, reliability and testing will impact their microelectronic products. The primary objective of microelectronic packaging is to design an electronic system that will satisfy the requirements for a particular application at a reasonable cost. Because of the many options available to interconnect and house a microelectronics system, the choice of a packaging technology for a given application needs expert evaluation. Selection criteria for microelectronics packages may include some of the following technology drivers: -Wireability -Yield -Cost -Heat dissipation properties -Electromagnetic shielding performance -Mechanical toughness -Reliability These design considerations for microelectronics packages affect speed, functionality, junction temperatures, volume, weight and more. The primary goal is to select the most cost-effective yet reliable interconnection technology. We use sophisticated analysis methods and software to design microelectronics packages. Microelectronics packaging deals with the design of methods for the fabrication of interconnected miniature electronic systems and the reliability of those systems. Specifically, microelectronics packaging involves routing of signals while maintaining signal integrity, distributing ground and power to semiconductor integrated circuits, dispersing dissipated heat while maintaining structural and material integrity, and protecting the circuit from environmental hazards. Generally, methods for packaging microelectronics ICs involve the use of a PWB with connectors that provide the real-world I/Os to an electronic circuit. Traditional microelectronics packaging approaches involve the use of single packages. The main advantage of a single-chip package is the ability to fully test the microelectronics IC before interconnecting it to the underlying substrate. Such packaged semiconductor devices are either through-hole mounted or surface mounted to the PWB. Surface-mounted microelectronics packages do not require via holes to go through the entire board. Instead, surface-mounted microelectronics components can be soldered to both sides of the PWB, enabling higher circuit density. This approach is called surface-mount technology (SMT). The addition of area-array–style packages such as ball-grid arrays (BGAs) and chip-scale packages (CSPs) is making SMT competitive with the highest-density semiconductor microelectronics packaging technologies. A newer packaging technology involves the attachment of more than one semiconductor device onto a high-density interconnection substrate, which is then mounted in a large package, providing both I/O pins and environmental protection. This multichip module (MCM) technology is further characterized by the substrate technologies used to interconnect the attached ICs. MCM-D represents deposited thin film metal and dielectric multilayers. MCM-D substrates have the highest wiring densities of all MCM technologies thanks to the sophisticated semiconductor processing technologies. MCM-C refers to multilayered “ceramic” substrates, fired from stacked alternating layers of screened metal inks and unfired ceramic sheets. Using MCM-C we obtain a moderately dense wiring capacity. MCM-L refers to multilayer substrates made from stacked, metallized PWB “laminates,” that are individually patterned and then laminated. It used to be a low-density interconnect technology, however now MCM-L is quickly approaching the density of MCM-C and MCM-D microelectronics packaging technologies. Direct chip attach (DCA) or chip-on-board (COB) microelectronics packaging technology involves mounting the microelectronics ICs directly to the PWB. A plastic encapsulant, which is “globbed” over the bare IC and then cured, provides environmental protection. Microelectronics ICs can be interconnected to the substrate using either flip-chip, or wire bonding methods. DCA technology is particularly economical for systems that are limited to 10 or fewer semiconductor ICs, since larger numbers of chips can affect system yield and DCA assemblies can be difficult to rework. An advantage common to both the DCA and MCM packaging options is the elimination of the semiconductor IC package interconnection level, which allows closer proximity (shorter signal transmission delays) and reduced lead inductance. The primary disadvantage with both methods is the difficulty in purchasing fully tested microelectronics ICs. Other disadvantages of DCA and MCM-L technologies include poor thermal management thanks to the low thermal conductivity of PWB laminates and a poor coefficient of thermal expansion match between the semiconductor die and the substrate. Solving the thermal expansion mismatch problem requires an interposer substrate such as molybdenum for wire bonded die and an underfill epoxy for flip-chip die. The multichip carrier module (MCCM) combines all the positive aspects of DCA with MCM technology. The MCCM is simply a small MCM on a thin metal carrier that can be bonded or mechanically attached to a PWB. The metal bottom acts as both a heat dissipater and a stress interposer for the MCM substrate. The MCCM has peripheral leads for wire bonding, soldering, or tab bonding to a PWB. Bare semiconductor ICs are protected using a glob-top material. When you contact us, we will discuss your application and requirements to choose the best microelectronics packaging option for you. Semiconductor IC Assembly & Packaging & Test: As part of our microelectronics fabrication services we offer die, wire and chip bonding, encapsulation, assembly, marking and branding, testing. For a semiconductor chip or integrated microelectronics circuit to function, it needs to be connected to the system that it will control or provide instructions to. Microelectronics IC assembly does provide the connections for power and information transfer between the chip and the system. This is accomplished by connecting the microelectronics chip to a package or directly connecting it to the PCB for these functions. Connections between the chip and the package or printed circuit board (PCB) are via wire bonding, thru-hole or flip chip assembly. We are an industry leader in finding microelectronics IC packaging solutions to meet the complex requirements of the wireless and internet markets. We offer thousands of different package formats and sizes, ranging from traditional leadframe microelectronics IC packages for thru-hole and surface mount, to the latest chip scale (CSP) and ball grid array (BGA) solutions required in high pin count and high density applications. A wide variety of packages are available from stock including CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, PLCC, PoP - Package on Package, PoP TMV - Through Mold Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Wafer Level Package)…..etc. Wire bonding using copper, silver or gold are among the popular in microelectronics. Copper (Cu) wire has been a method of connecting silicon semiconductor dies to the microelectronics package terminals. With recent increase in gold (Au) wire cost, copper (Cu) wire is an attractive way to manage overall package cost in microelectronics. It also resembles gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are almost the same for gold (Au) and copper (Cu) wire with copper (Cu) wire having lower resistivity. In microelectronics applications where resistance due to bond wire can negatively impact circuit performance, using copper (Cu) wire can offer improvement. Copper, Palladium Coated Copper (PCC) and Silver (Ag) alloy wires have emerged as alternatives to gold bond wires due to cost. Copper-based wires are inexpensive and have low electrical resistivity. However, the hardness of copper makes it difficult to use in many applications such as those with fragile bond pad structures. For these applications, Ag-Alloy offers properties similar to those of gold while its cost is similar to that of PCC. Ag-Alloy wire is softer than PCC resulting in lower Al-Splash and lower risk of bond pad damage. Ag-Alloy wire is the best low cost replacement for applications that need die-to-die bonding, waterfall bonding, ultra-fine bond pad pitch and small bond pad openings, ultra low loop height. We provide a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and complete end-of-line services. We test a variety of semiconductor device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various combinations such as ASIC, multi chip modules, System-in-Package (SiP), and stacked 3D packaging, sensors and MEMS devices such as accelerometers and pressure sensors. Our test hardware and contacting equipment are suitable for custom package size SiP, dual-sided contacting solutions for Package on Package (PoP), TMV PoP, FusionQuad sockets, multiple-row MicroLeadFrame, Fine-Pitch Copper Pillar. Test equipment and test floors are integrated with CIM / CAM tools, yield analysis and performance monitoring to deliver very high efficiency yield the first time. We offer numerous adaptive microelectronics test processes for our customers and offer distributed test flows for SiP and other complex assembly flows. AGS-TECH provides a full range of test consultation, development and engineering services across your entire semiconductor and microelectronics product lifecycle. We understand the unique markets and testing requirements for SiP, automotive, networking, gaming, graphics, computing, RF / wireless. Semiconductor manufacturing processes require fast and precisely controlled marking solutions. Marking speeds over 1000 characters/second and material penetration depths less than 25 microns are common in semiconductor microelectronics industry using advanced lasers. We are capable of marking mold compounds, wafers, ceramics and more with minimal heat input and perfect repeatability. We use lasers with high accuracy to mark even the smallest parts without damage. Lead frames for Semiconductor Devices: Both off-shelf and custom design and fabrication are possible. Lead frames are utilized in the semiconductor device assembly processes, and are essentially thin layers of metal that connect the wiring from tiny electrical terminals on the semiconductor microelectronics surface to the large-scale circuitry on electrical devices and PCBs. Lead frames are used in almost all semiconductor microelectronics packages. Most microelectronics IC packages are made by placing the semiconductor silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and subsequently covering the microelectronics chip with plastic cover. This simple and relatively low cost microelectronics packaging is still the best solution for many applications. Lead frames are produced in long strips, which allows them to be quickly processed on automated assembly machines, and generally two manufacturing processes are used: photo etching of some sort and stamping. In microelectronics lead frame design often demand is for customized specifications and features, designs that enhance electrical and thermal properties, and specific cycle time requirements. We have in-depth experience of microelectronics lead frame manufacturing for an array of different customers using laser assisted photo etching and stamping. Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication. With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. The consistency in performance and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a semiconductor microelectronics component may be achieved by effectively controlling the device operating temperature within the limits set by the designers. Heat sinks are devices that enhance heat dissipation from a hot surface, usually the outer case of a heat generating component, to a cooler ambient such as air. For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation. A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant. This allows more heat to be dissipated and/or lowers the semiconductor device operating temperature. The primary purpose of a heat sink is to maintain the microelectronics device temperature below the maximum allowable temperature specified by the semiconductor device manufacturer. We can classify heat sinks in terms of manufacturing methods and their shapes. The most common types of air-cooled heat sinks include: - Stampings: Copper or aluminum sheet metals are stamped into desired shapes. they are used in traditional air cooling of electronic components and offer an economical solution to low density thermal problems. They are suitable for high volume production. - Extrusion: These heat sinks allow the formation of elaborate two-dimensional shapes capable of dissipating large heat loads. They may be cut, machined, and options added. A cross-cutting will produce omnidirectional, rectangular pin fin heat sinks, and incorporating serrated fins improves the performance by approximately 10 to 20%, but with a slower extrusion rate. Extrusion limits, such as the fin height-to-gap fin thickness, usually dictate the flexibility in design options. Typical fin height-to-gap aspect ratio of up to 6 and a minimum fin thickness of 1.3mm, are attainable with standard extrusion techniques. A 10 to 1 aspect ratio and a fin thickness of 0.8″can be obtained with special die design features. However, as the aspect ratio increases, the extrusion tolerance is compromised. - Bonded/Fabricated Fins: Most air cooled heat sinks are convection limited, and the overall thermal performance of an air cooled heat sink can often be improved significantly if more surface area can be exposed to the air stream. These high performance heat sinks utilize thermally conductive aluminum-filled epoxy to bond planar fins onto a grooved extrusion base plate. This process allows for a much greater fin height-to-gap aspect ratio of 20 to 40, significantly increasing the cooling capacity without increasing the need for volume. - Castings: Sand, lost wax and die casting processes for aluminum or copper / bronze are available with or without vacuum assistance. We use this technology for fabrication of high density pin fin heat sinks which provide maximum performance when using impingement cooling. - Folded Fins: Corrugated sheet metal from aluminum or copper increases surface area and the volumetric performance. The heat sink is then attached to either a base plate or directly to the heating surface via epoxy or brazing. It is not suitable for high profile heat sinks on account of the availability and fin efficiency. Hence, it allows high performance heat sinks to be fabricated. In selecting an appropriate heat sink meeting the required thermal criteria for your microelectronics applications, we need to examine various parameters that affect not only the heat sink performance itself, but also the overall performance of the system. The choice of a particular type of heat sink in microelectronics depends largely to the thermal budget allowed for the heat sink and external conditions surrounding the heat sink. There is never a single value of thermal resistance assigned to a given heat sink, since the thermal resistance varies with external cooling conditions. Sensor & Actuator Design and Fabrication: Both off-shelf and custom design and fabrication are available. We offer solutions with ready-to-use processes for inertial sensors, pressure and relative pressure sensors and IR temperature sensor devices. By using our IP blocks for accelerometers, IR and pressure sensors or applying your design according to available specifications and design rules, we can have MEMS based sensor devices delivered to you within weeks. Besides MEMS, other types of sensor and actuator structures can be fabricated. Optoelectronic & photonic circuits design and fabrication: A photonic or optical integrated circuit (PIC) is a device that integrates multiple photonic functions. It can be resembled to electronic integrated circuits in microelectronics. The major difference between the two is that a photonic integrated circuit provides functionality for information signals imposed on optical wavelengths in the visible spectrum or near infrared 850 nm-1650 nm. Fabrication techniques are similar to those used in microelectronics integrated circuits where photolithography is used to pattern wafers for etching and material deposition. Unlike semiconductor microelectronics where the primary device is the transistor, there is no single dominant device in optoelectronics. Photonic chips include low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and fabrication techniques and therefore it is difficult to realize all of them on a single chip. Our applications of photonic integrated circuits are mainly in the areas of fiber-optic communication, biomedical and photonic computing. Some example optoelectronic products we can design and fabricate for you are LEDs (Light Emitting Diodes), diode lasers, optoelectronic receivers, photodiodes, laser distance modules, customized laser modules and more. KLIK Product Finder-Locator Service PAGE sadurunge

We supply custom manufactured and off-shelf jigs, fixtures and workholding tools for industrial applications, manufacturing lines, production lines, test and inspection lines, machine shops, R&D labs.......etc. Jig, Perlengkapan, Alat, Solusi Workholding, Manufaktur Komponen Mould We offer custom manufactured and off-shelf jigs, fixtures and toolings for your workshop, factory, plant lab or other facility. The types of jigs you can purchase from us are: - Template Jig - Plate Jig - Angle-Plate Jig - Channel Jig - Diameter Jig - Leaf Jig - Ring Jig - Box Jig The types of fixtures we can supply you are: - Turning Fixtures - Milling Fixtures - Broaching Fixtures - Grinding Fixtures - Boring Fixtures - Tapping Fixtures - Duplex Fixtures - Welding Fixtures - Assembly Fixtures - Drilling Fixtures - Indexing Fixtures Some categories of industrial machine tools we manufacture and ship include: - Press tools and dies, shears - Extrusion dies - Molds, molding and casting tools - Forming tools - Shaping tools - Drilling, cutting, broaching, hobbing tools - Grinding tools - Machining, milling, turning tools - Holding and clamping tools CLICK ON BLUE TEXT BELOW TO DOWNLOAD CATALOGS & BROCHURES: EDM Tooling - Workholding Catalog Includes EDM Tooling System and Elements, EROWA Link, 3R-Link, UniClamp, Square Clamp, RefTool Holder, PIN Holder System, Clamping Elements, Swivel Block and Vises, CentroClamp, EDM Spare Parts....etc. Hose Crimping Machines and Tools We private label these with your brand name and logo if you wish. Crimp development team can assist you with the design and development of tooling for all of your crimping requirements. Hose Endforming Machines and Tools We private label these with your brand name and logo if you wish. Tool development team can assist you with the design and development of tooling for all of your end-forming tool requirements. Plastic Mold Components Catalog Here you will find off-shelf components, products that you can order and use in manufacturing your molds. These products are ideal for mold makers. Example products you can find here are ejector pins, slide units, pressure plugs, guide pins, sprue bushings, slide holding devices, wear plates, ejector sleeves.....etc. Private Label Auto Glass Repair and Replacement Systems We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools for Every Industry We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools - Hand Tool Cabinets We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Wire EDM Tooling - Workholding Catalog Includes Wire EDM Clamping Systems & Sets, Corner Sets, Ruler & Spanner, EDM Clamping Block, 3D Swivel Head, Vise Set, WEDM Vises and Magnetic Tables, Multiclamp, Wire EDM Pendulum Holder, V-Block, ICS Adapter, Beams, Beam IF, Z-Flex, Turn and Index Table, Collet Chuck Holder, EDM Link and Adapter, 3 Jaw Scroll Chuck ....etc. Workholding Tools Catalog - 1 Check this catalog for our 100% EROWA and 3R compatible workholding tools. We accept OEM work, you can send us a drawing for evaluation. Workholding Tools Catalog - 2 Check this catalog for our Workholding Devices, Die and Mold Clamps, Clamping Elements, Clamping Kits, Fixture Clamps, Toggle Clamps, Milling & MC Vices, Pneumatic & Hydraulic Clamps, Milling & Grinding Accessories, Wire Cut EDM Workholders...etc. We accept OEM work, you can send us a drawing for evaluation. You may also find our following page link useful: Industrial Machines and Equipment Manufacturing KLIK Product Finder-Locator Service PAGE sadurunge

AGS-TECH Inc. supplies high quality cutting and grinding discs, including cut-off wheels, grinding wheels, abrasive flap disc, polishing disc, resinoid flexible wheels, mesh abrasive wheels, flat & turbo fiber disc and more. We also manufacture custom cutting and grinding discs according to your specifications. Nglereni & Grinding Disc Please click on the highlighted cutting & grinding disc and wheels of interest below to download the related brochures. Abrasive Flap Disc Cut-off Wheels Flat/Turbo Fiber Disc Grinding Wheels Mesh Abrasive Wheels Polishing Disc Private Label Abrasives (We can put your company name, logo, brand on these. In other words we offer you private label) Private Label Abrasives Ordering Instructions Guide Private Label Power Tool Accessories This brochure includes some cutting, grinding, polishing discs. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Resinoid Flexible Wheels Prices for our cutting & grinding discs depend on model and quantity of order. For custom designs and custom manufacturing, prices will be calculated based on material, labor, packaging and labeling requirements. Since we carry a wide variety of cutting and grinding discs with different dimensions, applications and material; it is impossible to list them all here. Please email or call us so we can determine which cutting & grinding disc is the most suitable for you. When contacting us, please let us know about: - Intended Application - Material grade desired and preferred - Dimensions - Finishing requirements - Packaging requirements - Labeling requirements - Quantity of order KLIK kene kanggo ngundhuh kemampuan teknis lan pandhuan referensi kanggo nglereni, ngebur, grinding, mbentuk, mbentuk, alat polishing sing digunakake ing medis, dental, instrumentasi presisi, stamping logam, die forming lan aplikasi industri liyane. KLIK Product Finder-Locator Service Klik kene kanggo pindhah menyang Cut, Drilling, Grinding, Lapping, Polishing, Dicing lan Shaping Tools Menu Ref. Kode: OICASOSTAR

Pneumatic Hydraulic & Vacuum Tools, Air Tool, Hydraulic Powered Tools, Air Screwdrivers, Air Drills, Pneumatic Nail Guns, Air Die Grinders,Hydraulic Pipe Cutter Piranti kanggo Hidrolik & Pneumatik & Vakum We also supply widely used industrial tools for pneumatic, hydraulic and vacuum systems. PNEUMATIC TOOLS (also called AIR TOOLS or AIR-POWERED TOOLS or PNEUMATIC-POWERED TOOLS are types of power tools driven by compressed air, supplied by air compressors. Pneumatic tools can also be driven by compressed carbon dioxide (CO2) stored in small cylinders allowing portability and use where no compressed air lines are available. Pneumatic tools are safer to run and easier to maintain than electric power tool equivalents. Pneumatic tools also have a higher power-to-weight ratio, allowing a smaller, lighter tool to accomplish the same task. General grade pneumatic tools with short life span are generally less expensive. Both disposable as well as industrial grade pneumatic tools with long life span are available. Generally speaking, pneumatic tools are cheaper than the equivalent electric-powered tools. Air tools are becoming more and more popular in the DIY (Do it yourself) market. HYDRAULIC-POWERED TOOLS on the other hand are generally more powerful tools used for applications that require higher pressures and forces. Liquids are much much less compressible than gases and that is the reason why hydraulic powered tools are able to supply such large forces. INDUSTRIAL VACUUM TOOLS offered are mostly manipulators, grippers, holders, lifters used in handling, moving, removing parts and components in industrial settings. Vacuum is also used in packaging to remove air from inside packages to extend the shelf life of products and protect them from moisture, air and early corrosion and decay. We supply both off-shelf and custom manufactured pneumatic, hydraulic and vacuum tools. Here is a list of some common tools: AIR SCREWDRIVERS, ROUTERS AIR RATCHET AIR & HYDRAULIC DRILLS PNEUMATIC NAIL GUN AIR & HYDRAULIC HAMMERS RIVETER & RIVETING HAMMER AIR GUNS and NOZZLES SANDBLASTER AIRBRUSH PAINT SPRAYER AIR CAULK GUNS AIR DIE GRINDERS AIR SANDER AIR BEVELERS AIR CUT-OFF TOOLS SWIVEL CONNECTORS AIR KNIVES PNEUMATIC SLIDES AIR CANNONS AIR AMPLIFIERS AIR CONVEYORS HYDRAULIC & PNEUMATIC TORQUE WRENCH HYDRAULIC PRESSES HYDRAULIC PIPE CUTTERS HYDRAULIC PULLER HYDRAULIC BOLTING TOOLS HYDRAULIC WORKHOLDING DEVICES VACUUM MANIPULATORS and GRIPPERS VACUUM LIFTERS VACUUM PACKAGING TOOLS CUSTOM SPECIALTY TOOLS Click links below to download our relevant brochures: - Air Tool Kits - Air Tools Accessories and Special Industrial Pneumatic Tools - Air Nailers and Staplers - Air Spray Guns - Air Brushes - Air Guns, Hoses, Connectors, Splitters and Accessories - DIY Air Tools - DIY Air Tools Assortment & Wet Air Tools - Oil-Less Mini Air Compressors - Private Label Pneumatic Air Blow Guns (We can put your company name, brand, logo, label on these if you wish) - Private Label Pneumatic Compressed Air Tools (We can put your company name, brand, logo, label on these if you wish) - Professional Air Tools Part-1 - Professional Air Tools Part-2 - Professional Air Tools Part-3 - Professional Air Tools Assortment KLIK Product Finder-Locator Service PAGE sadurunge

Optical Displays, Screen, Monitors, Touch Panel Manufacturing Manufaktur & Perakitan Tampilan Optik, Layar, Monitor Unduh brosur kanggo PROGRAM KEMITRAAN DESIGN KLIK Product Finder-Locator Service PAGE sadurunge

Test Equipment for Furniture Testing, Sofa Durability Tester, Chair Base Static Tester, Chair Drop Impact Tester, Mattress Firmness Tester Peralatan Test kanggo Testing Furnitur Specialized Test Equipment for Testing of Furniture are used for testing furniture products such as chairs, table, sofas, mattress....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of furniture are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of furniture can be downloaded from the colored links below: HAIDA Bifma Furnitures Testing Machine HAIDA Chair Arm and Leg Tester HAIDA Chair Base Static Tester HAIDA Chair Caster Durability Tester HAIDA Chair Drop Impact Tester HAIDA Chair and Foam Testing Machine HAIDA Chair Seating and Back Durability HAIDA Chair Strength Tester HAIDA Chair Swivel Tester Catalog Download HAIDA Chair Universal Test Machine HAIDA Color Assessment Cabinet HAIDA Foam Pounding Fatigue Tester HAIDA Furniture Universal Test Machine HAIDA Mattress Cornell Tester HAIDA Mattress Firmness Tester HAIDA Mattress Rollator Durability Tester HAIDA Mattress Rollator Durability Tester-2 HAIDA Sofa Durability Tester HD-F769 HAIDA Sofa Durability Tester HD-F761 HAIDA Sofa Iron Frame Fatigue Tester HAIDA Universal Test Field for Tables Chairs Kanggo peralatan liyane sing padha, bukak situs web peralatan kita: http://www.sourceindustrialsupply.com KLIK Product Finder-Locator Service PREVIOUS PAGE

Optomechanical Assembly, Endoscope Coupler Manufacturing, Optocouplers Custom Fabrication Majelis Optomekanik Majelis optomekanik Majelis Optomekanik - AGS-TECH Majelis Proyektor Optik saka AGS-TECH Inc. Majelis Optomekanik - Sistem Kamera - AGS-TECH, Inc. AGS-TECH ngrancang lan mrodhuksi optocoupler kayata Iphone kanggo endoscope coupler Fiberscope diwenehake dening AGS-TECH Inc. Komponen Optomekanik Mirror Rampung Majelis Sheet Metal Reflektif kanggo Aplikasi Solar dening AGS-TECH Inc. PAGE sadurunge

Thermal Infrared Test Equipment, Thermal Camera, Differential Scanning Calorimeter, Thermo Gravimetric Analyzer, Thermo Mechanical Analyzer, Dynamic Mechanical Peralatan Tes Termal & IR KLIK Product Finder-Locator Service Among the many THERMAL ANALYSIS EQUIPMENT, we focus our attention to the popular ones in industry, namely the DIFFERENTIAL SCANNING CALORIMETRY ( DSC ), THERMO-GRAVIMETRIC ANALYSIS ( TGA ), THERMO-MECHANICAL ANALYSIS ( TMA ), DILATOMETRY,DYNAMIC MECHANICAL ANALYSIS ( DMA ), DIFFERENTIAL THERMAL ANALYSIS ( DTA). Our INFRARED TEST EQUIPMENT involves THERMAL IMAGING INSTRUMENTS, INFRARED THERMOGRAPHERS, INFRARED CAMERAS. Some applications for our thermal imaging instruments are Electrical and Mechanical System Inspection, Electronic Component Inspection, Corrosion Damage and Metal Thinning, Flaw Detection. Please download catalogs from colored links below and let us know your prefered brand and model number of the product. You can purchase brand new or refurbished / used Thermal & IR Test Equipment from us: FLUKE Test Tools Catalog (includes Thermal Imagers, Thermometers) HAIDA Color Assessment Cabinet Private Label Hand Tools for Every Industry (This catalog contains a few thermal & IR test instruments. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers.) DIFFERENTIAL SCANNING CALORIMETERS (DSC) : A technique in which the difference in the amount of heat required to increase the temperature of a sample and reference is measured as a function of temperature. Both the sample and reference are maintained at nearly the same temperature throughout the experiment. The temperature program for a DSC analysis is established so that the sample holder temperature increases linearly as a function of time. The reference sample has a well-defined heat capacity over the range of temperatures to be scanned. DSC experiments provide as a result a curve of heat flux versus temperature or versus time. Differential scanning calorimeters are frequently used to study what happens to polymers when they're heated. The thermal transitions of a polymer can be studied using this technique. Thermal transitions are changes that take place in a polymer when they are heated. The melting of a crystalline polymer is an example. The glass transition is also a thermal transition. DSC thermal analysis is carried out for determining Thermal Phase Changes, Thermal Glass Transition Temperature (Tg), Crystalline Melt Temperatures, Endothermic Effects, Exothermic Effects, Thermal Stabilities, Thermal Formulation Stabilities, Oxidative Stabilities, Transition Phenomena, Solid State Structures. DSC analysis determines the Tg Glass Transition Temperature, temperature at which amorphous polymers or an amorphous part of a crystalline polymer go from a hard brittle state to a soft rubbery state, melting point, temperature at which a crystalline polymer melts, Hm Energy Absorbed (joules/gram), amount of energy a sample absorbs when melting, Tc Crystallization Point, temperature at which a polymer crystallizes upon heating or cooling, Hc Energy Released (joules/gram), amount of energy a sample releases when crystallizing. Differential Scanning Calorimeters can be used to determine the thermal properties of plastics, adhesives, sealants, metal alloys, pharmaceutical materials, waxes, foods, oils and lubricants and catalysts….etc. DIFFERENTIAL THERMAL ANALYZERS (DTA): An alternative technique to DSC. In this technique it is the heat flow to the sample and reference that remains the same instead of the temperature. When the sample and reference are heated identically, phase changes and other thermal processes cause a difference in temperature between the sample and reference. DSC measures the energy required to keep both the reference and the sample at the same temperature whereas DTA measures the difference in temperature between the sample and the reference when they are both put under the same heat. So they are similar techniques. THERMOMECHANICAL ANALYZER (TMA) : The TMA reveals the change in the dimensions of a sample as a function of temperature. One can regard TMA as a very sensitive micrometer. The TMA is a device that allows precise measurements of position and can be calibrated against known standards. A temperature control system consisting of a furnace, heat sink and a thermocouple surrounds the samples. Quartz, invar or ceramic fixtures hold the samples during tests. TMA measurements record changes caused by changes in the free volume of a polymer. Changes in free volume are volumetric changes in the polymer caused by the absorption or release of heat associated with that change; the loss of stiffness; increased flow; or by the change in relaxation time. The free volume of a polymer is known to be related to viscoelasticity, aging, penetration by solvents, and impact properties. The glass transition temperature Tg in a polymer corresponds to the expansion of the free volume allowing greater chain mobility above this transition. Seen as an inflection or bending in the thermal expansion curve, this change in the TMA can be seen to cover a range of temperatures. The glass transition temperature Tg is calculated by an agreed upon method. Perfect agreement is not immediately witnessed in the value of the Tg when comparing different methods, however if we carefully examine the agreed upon methods in determining the Tg values then we understand that there is actually good agreement. Besides its absolute value, the width of the Tg is also an indicator of changes in the material. TMA is a relatively simple technique to carry out. TMA is often used for measuring Tg of materials such as highly cross-linked thermoset polymers for which the Differential Scanning Calorimeter (DSC) is difficult to use. In addition to Tg, the coefficient of thermal expansion (CTE) is obtained from thermomechanical analysis. The CTE is calculated from the linear sections of the TMA curves. Another useful result the TMA can provide us is finding out the orientation of crystals or fibers. Composite materials may have three distinct thermal expansion coefficients in the x, y and z directions. By recording the CTE in x, y and z directions one may understand in which direction fibers or crystals are predominantly oriented. To measure the bulk expansion of the material a technique called DILATOMETRY can be used. The sample is immersed in a fluid such as silicon oil or Al2O3 powder in the dilatometer, run thru the temperature cycle and the expansions in all directions are converted to a vertical movement, which is measured by the TMA. Modern thermomechanical analyzers make this easy for users. If a pure liquid is used, the dilatometer is filled with that liquid instead of the silicon oil or alumina oxide. Using diamond TMA the users can run stress strain curves, stress relaxation experiments, creep-recovery and dynamic mechanical temperature scans. The TMA is an indispensible test equipment for industry and research. THERMOGRAVIMETRIC ANALYZERS ( TGA ) : Thermogravimetric Analysis is a technique where the mass of a substance or specimen is monitored as a function of temperature or time. The sample specimen is subjected to a controlled temperature program in a controlled atmosphere. The TGA measures a sample’s weight as it is heated or cooled in its furnace. A TGA instrument consists of a sample pan that is supported by a precision balance. That pan resides in a furnace and is heated or cooled during the test. The mass of the sample is monitored during the test. Sample environment is purged with an inert or a reactive gas. Thermogravimetric analyzers can quantify loss of water, solvent, plasticizer, decarboxylation, pyrolysis, oxidation, decomposition, weight % filler material, and weight % ash. Depending on the case, information may be obtained upon heating or cooling. A typical TGA thermal curve is displayed from left to right. If the TGA thermal curve descends, it indicates a weight loss. Modern TGAs are capable of conducting isothermal experiments. Sometimes the user may want to use a reactive sample purge gases, such as oxygen. When using oxygen as a purge gas user may want to switch gases from nitrogen to oxygen during the experiment. This technique is frequently used to identify the percent carbon in a material. Thermogravimetric analyzer can be used to compare two similar products, as a quality control tool to ensure products meet their material specifications, to ensure products meet safety standards, to determine carbon content, identifying counterfeit products, to identify safe operating temperatures in various gases, to enhance product formulation processes, to reverse engineer a product. Finally it is worth mentioning that combinations of a TGA with a GC/MS are available. GC is short for Gas Chromatography and MS is short for Mass Spectrometry. DYNAMIC MECHANICAL ANALYZER ( DMA) : This is a technique where a small sinusoidal deformation is applied to a sample of known geometry in a cyclic manner. The materials response to stress, temperature, frequency and other values is then studied. The sample can be subjected to a controlled stress or a controlled strain. For a known stress, the sample will deform a certain amount, depending on its stiffness. DMA measures stiffness and damping, these are reported as modulus and tan delta. Because we are applying a sinusoidal force, we can express the modulus as an in-phase component (the storage modulus), and an out of phase component (the loss modulus). The storage modulus, either E’ or G’, is the measure of the sample’s elastic behavior. The ratio of the loss to the storage is the tan delta and is called damping. It is considered a measure of the energy dissipation of a material. Damping varies with the state of the material, its temperature, and with the frequency. DMA is sometimes called DMTA standing for DYNAMIC MECHANICAL THERMAL ANALYZER. Thermomechanical Analysis applies a constant static force to a material and records the material dimensional changes as temperature or time varies. The DMA on the other hand, applies an oscillatory force at a set frequency to the sample and reports changes in stiffness and damping. DMA data provides us modulus information whereas the TMA data gives us the coefficient of thermal expansion. Both techniques detect transitions, but DMA is much more sensitive. Modulus values change with temperature and transitions in materials can be seen as changes in the E’ or tan delta curves. This includes glass transition, melting and other transitions that occur in the glassy or rubbery plateau which are indicators of subtle changes in the material. THERMAL IMAGING INSTRUMENTS, INFRARED THERMOGRAPHERS, INFRARED CAMERAS : These are devices that form an image using infrared radiation. Standard everyday cameras form images using visible light in the 450–750 nanometer wavelength range. Infrared cameras however operate in the infrared wavelength range as long as 14,000 nm. Generally, the higher an object's temperature, the more infrared radiation is emitted as black-body radiation. Infrared cameras work even in total darkness. Images from most infrared cameras have a single color channel because the cameras generally use an image sensor that does not distinguish different wavelengths of infrared radiation. To differentiate wavelengths color image sensors require a complex construction. In some test instruments these monochromatic images are displayed in pseudo-color, where changes in color are used rather than changes in intensity to display changes in the signal. The brightest (warmest) parts of images are customarily colored white, intermediate temperatures are colored red and yellow, and the dimmest (coolest) parts are colored black. A scale is generally shown next to a false color image to relate colors to temperatures. Thermal cameras have resolutions considerably lower than that of optical cameras, with values in the neighborhood of 160 x 120 or 320 x 240 pixels. More expensive infrared cameras can achieve a resolution of 1280 x 1024 pixels. There are two main categories of thermographic cameras: COOLED INFRARED IMAGE DETECTOR SYSTEMS and UNCOOLED INFRARED IMAGE DETECTOR SYSTEMS. Cooled thermographic cameras have detectors contained in a vacuum-sealed case and are cryogenically cooled. The cooling is necessary for the operation of the semiconductor materials used. Without cooling, these sensors would be flooded by their own radiation. Cooled infrared cameras are however expensive. Cooling requires much energy and is time-consuming, requiring several minutes of cooling time prior to working. Although the cooling apparatus is bulky and expensive, cooled infrared cameras offer users superior image quality compared to uncooled cameras. The better sensitivity of cooled cameras allows the use of lenses with higher focal length. Bottled nitrogen gas can be used for cooling. Uncooled thermal cameras use sensors operating at ambient temperature, or sensors stabilized at a temperature close to ambient using temperature control elements. Uncooled infrared sensors are not cooled to low temperatures and therefore do not require bulky and expensive cryogenic coolers. Their resolution and image quality however is lower as compared to cooled detectors. Thermographic cameras offer many opportunities. Overheating spots is power lines can be located and repaired. Electric circuitry can be observed and unusually hot spots can indicate problems such as short circuit. These cameras are also widely used in buildings and energy systems to locate places where there is significant heat loss so that better heat insulation can be considered at those points. Thermal imaging instruments serve as non-destructive test equipment. For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com PAGE sadurunge

Manufacturing and Assembly of Simple Machines, Lever Assembly, Wheel and Axle, Pulley, Pulley System, Hoist, Inclined Plane, Wedge, Screws from AGS-TECH Inc. Majelis Mesin Prasaja A SIMPLE MACHINE is a mechanical device that changes the direction or magnitude of a force. SIMPLE MACHINES can be defined as the simplest mechanisms that provide mechanical advantage. In other words, simple machines are devices with few or no moving parts that make work easier. Mechanical advantage is an advantage gained by using simple machines to accomplish work with less effort. The goal is to make the task easier (which means it requires less force), but this may necessitate more time or room to work (more distance, rope, etc.). An example of this is, applying a smaller force over a longer distance to achieve the same effect as applying a large force over a small distance. Mathematically speaking mechanical advantage is the ratio of the output force exerted by a simple machine to the input force applied to it. Simple machines have been around for a very long time. Using simple machines, Egyptians built the Great Pyramids thousands of years ago. Simple machines will always be around in more advanced forms as building blocks of compound machines and other complex machinery. Simple machines we supply our clients can be broadly categorized as: - Lever, Lever Assembly - Wheel and axle assemblies - Pulley & Hoist, Pulley Systems - Inclined plane - Wedge and wedge based systems - Screw and screw systems A simple machine is an elementary device that has a specific movement (often called a mechanism), which can be combined with other devices and movements to form a machine. Thus simple machines are considered to be the ''building blocks'' of more complicated machines. As an example, a lawn mover may incorporate six simple machines. We do use visual simulation tools in the design of some simple machines, which aids in the optimization process. To give you a more familiar example, a bicycle may have the following simple machines: Levers: Shifters, the pedal levers, derailleurs, handlebars, freewheel assembly, brakes. Wheel and axle: The wheels, pedals, crankset Pulleys: Parts of the shifting and braking mechanisms, drive train (chain and gears). Screws: Many of these hold parts together Wedges: The teeth on the gears. Some gooseneck assemblies where the handlebars attach to the front fork tube may employ a wedge to tighten the connection. A COMPOUND MACHINE is a device that combines two or more simple machines. Using the six basic simple machines, various compound machines can be assembled. There are many simple and compound machines in our homes. Some examples of the compound machines used at home are can openers (wedge and lever), exercise machines/cranes/tow trucks (levers and pulleys), wheel barrow (wheel and axle and lever). As an example, a wheelbarrow combines the use of a wheel and axle with a lever. Car jacks are examples of screw-type simple machines that enable one person to lift up the side of a car. Many of the machine elements we manufacture and supply our customers are used in the assembly of simple machines. The choice of materials, coatings and fabrication processes are very important and depends on the application of the simple machine being designed for a particular task. We will always be pleased to guide you in the design phases of your simple machines and manufacture them for you with the highest quality. Simple machines AGS-TECH Inc. has manufactured are being used in automobiles, motorcycles, auto lift equipment, conveyor systems, production equipment and machines, consumer electronics and goods. Here are brochures and catalogs of some of our off-shelf simple machines for downloading (please click on highlighted text below): - Slewing Drives - Slewing Rings - V-Pulleys - Timing Pulleys - Worm Gear Speed Reducers - WP Model - Worm Gear Speed Reducers - NMRV Model - T-Type Spiral Bevel Gear Redirector - Worm Gear Screw Jacks KLIK Product Finder-Locator Service PAGE sadurunge

Electron Beam Machining, EBM, E-Beam Machining & Cutting & Boring, Custom Manufacturing of Parts - AGS-TECH Inc. - NM - USA EBM Machining & Electron Beam Machining In ELECTRON-BEAM MACHINING (EBM) we have high-velocity electrons concentrated into a narrow beam which are directed toward the work piece, creating heat and vaporizing the material. Thus EBM is a kind of HIGH-ENERGY-BEAM MACHINING technique. Electron-Beam Machining (EBM) can be used for very accurate cutting or boring of a variety of metals. Surface finish is better and kerf width is narrower in comparison to other thermal-cutting processes. The electron beams in EBM-Machining equipment are generated in an electron beam gun. The applications of Electron-Beam Machining are similar to those of Laser-Beam Machining, except that EBM requires a good vacuum. Thus these two processes are classified as electro-optical-thermal processes. The workpiece to be machined with EBM process is located under the electron beam and is kept under vacuum. The electron beam guns in our EBM machines are also provided with illumination systems and telescopes for alignment of the beam with the workpiece. Workpiece is mounted on a CNC table so that holes of any shape can be machined using the CNC control and beam deflection functionality of the gun. To achieve the fast evaporation of the material, the planar density of the power in the beam must be as high as possible. Values up to 10exp7 W/mm2 can be achieved at the spot of impact. The electrons transfer their kinetic energy into heat in a very small area, and the material impacted by the beam is evaporated in a very short time. The molten material at the top of the front, is expelled from the cutting zone by the high vapor pressure at the lower parts. EBM equipment is built similarly to electron beam welding machines. Electron-beam machines usually utilize voltages in the range of 50 to 200 kV to accelerate electrons to about 50 to 80% of the speed of light (200,000 km/s). Magnetic lenses whose function is based on Lorentz forces are used to focus the electron beam to the surface of the workpiece. With the help of a computer, the electromagnetic deflection system positions the beam as needed so holes of any shape can be drilled. In other words, the magnetic lenses in Electron-Beam-Machining equipment shape the beam and reduce the divergence. Apertures on the other hand allow only the convergent electrons to pass and capture the divergent low energy electrons from the fringes. The aperture and the magnetic lenses in EBM-Machines thus improve the quality of the electron beam. The gun in EBM is used in pulsed mode. Holes can be drilled in thin sheets using a single pulse. However for thicker plates, multiple pulses would be needed. Switching pulse durations of as low as 50 microseconds to as long as 15 miliseconds are generally used. To minimize electron collisions with air molecules resulting in scattering and keep contamination to a minimum, vacuum is used in EBM. Vacuum is difficult and expensive to produce. Especially obtaining good vacuum within large volumes and chambers is very demanding. Therefore EBM is best suited for small parts that fit into reasonably sized compact vacuum chambers. The level of vacuum within the EBM’s gun is in the order of 10EXP(-4) to 10EXP(-6) Torr. The interaction of the electron beam with the work piece produces X-rays which pose health hazard, and therefore well trained personnel should operate EBM equipment. Generally speaking, EBM-Machining is used for cutting holes as small as 0.001 inch (0.025 millimetre) in diameter and slots as narrow as 0.001 inch in materials up to 0.250 inch (6.25 millimetres) thick. Characteristic length is the diameter over which the beam is active. Electron beam in EBM may have a characteristic length of tens of microns to mm depending on degree of focusing of the beam. Generally, the high-energy focused electron beam is made to impinge on the workpiece with a spot size of 10 – 100 microns. EBM can provide holes of diameters in the range of 100 microns to 2 mm with a depth up to 15 mm, i.e., with a depth/diameter ratio of around 10. In case of defocused electron beams, power densities would drop as low as 1 Watt/mm2. However in case of focused beams the power densities could be increased to tens of kW/mm2. As a comparison, laser beams can be focused over a spot size of 10 – 100 microns with a power density as high as 1 MW/mm2. Electrical discharge typically provides the highest power densities with smaller spot sizes. Beam current is directly related to the number of electrons available in the beam. Beam current in Electron-Beam-Machining can be as low as 200 microamperes to 1 ampere. Increasing the EBM’s beam current and/or pulse duration directly increases the energy per pulse. We use high-energy pulses in excess of 100 J/pulse to machine larger holes on thicker plates. Under normal conditions, EBM-machining offers us the advantage of burr-free products. The process parameters directly affecting the machining characteristics in Electron-Beam-Machining are: • Acceleration voltage • Beam current • Pulse duration • Energy per pulse • Power per pulse • Lens current • Spot size • Power density Some fancy structures can also be obtained using Electron-Beam-Machining. Holes can be tapered along the depth or barrel shaped. By focusing the beam below the surface, reverse tapers can be obtained. A wide range of materials like steel, stainless steel, titanium and nickel super-alloys, aluminum, plastics, ceramics can be machined using e-beam-machining. There could be thermal damages associated with EBM. However, the heat-affected zone is narrow due to short pulse durations in EBM. The heat-affected zones are generally around 20 to 30 microns. Some materials such as aluminum and titanium alloys are more readily machined compared to steel. Furthermore EBM-machining does not involve cutting forces on the work pieces. This enables machining of fragile and brittle materials by EBM without any significant clamping or attaching as is the case in mechanical machining techniques. Holes can also be drilled at very shallow angles like 20 to 30 degrees. The advantages of Electron-Beam-Machining: EBM provides very high drilling rates when small holes with high aspect ratio are drilled. EBM can machine almost any material regardless of its mechanical properties. No mechanical cutting forces are involved, thus work clamping, holding and fixturing costs are ignorable, and fragile/brittle materials can be processed without problems. Heat affected zones in EBM are small because of shorte pulses. EBM is able of providing any shape of holes with accuracy by using electromagnetic coils to deflect electron beams and the CNC table. The disadvantages of Electron-Beam-Machining: Equipment is expensive and operating and maintaining vacuum systems requires specialized technicians. EBM requires significant vacuum pump down periods for attaining required low pressures. Even though heat affected zone is small in EBM, the recast layer formation occurs frequently. Our many years of experience and know-how helps us to take advantage of this valuable equipment in our manufacturing environment. KLIK Product Finder-Locator Service PAGE sadurunge