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PCB - PCBA - Printed Circuit Board Assembly - Rigid Flexible Multilayer - Surface Mount Assembly - SMA - AGS-TECH Inc. PCB & PCBA Manufacturing and Assembly We offer: PCB: Printed Circuit Board PCBA: Printed Circuit Board Assembly • Printed Circuit Board Assemblies of all types (PCB, rigid, flexible and multilayer) • Substrates or complete PCBA assembly depending on your needs. • Thru-Hole and Surface Mount Assembly (SMA) Please send us your Gerber files, BOM, component specifications. We can either assemble your PCBs and PCBA's using your exact components specified, or we can offer you our matching alternatives. We are experienced shipping PCBs and PCBAs and will make sure to package them in antistatic bags to avoid electrostatic damage. PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. Our conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Some are engineering plastics sputtered onto the PCB in a vacuum chamber. Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Our tests analyze characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts. The PCB boards may use organic or inorganic base materials in a single or multilayer, rigid or flexible form. Circuitry construction may include etched, die stamped, precut, flush press, additive, and plated conductor techniques. Printed-component parts may be used. The suitability of the pattern parameters, temperature and maximum solder limits shall be determined in accordance with the applicable end-product construction and requirements. Don't wait, call us for more information, design assistance, prototypes and mass production. If you need, we will take care of all the labeling, packaging, shipping, import & customs, storage and delivery. Below you can download our relevant brochures and catalogs for PCB and PCBA assembly: General process capabilities & tolerances for rigid PCB manufacturing General process capabilities & tolerances for aluminum PCB manufacturing General process capabilities & tolerances for flexible and rigid-flexible PCB manufacturing General PCB Fabrication Processes General process summary of Printed Circuit Board Assembly PCBA manufacturing Overview of Printed Circuit Boards Manufacturing Plant Some more brochures of our products we can use in your PCB and PCBA assembly projects: To download our catalog for off-shelf interconnect components & hardware such as quick-fit terminals, USB plugs & sockets, micro pins & jacks and more, please CLICK HERE Terminal Blocks and Connectors Terminal Blocks General Catalogue Standard heat sinks Extruded heat sinks Easy Click heat sinks a perfect product for PCB assemblies Super Power heat sinks for medium - high power electronic systems Heat sinks with Super Fins LCD modules Receptacles-Power Entry-Connectors Catalogue Dowload brochure for our DESIGN PARTNERSHIP PROGRAM If you are interested in our engineering and research & development capabilities instead of manufacturing operations and capabilities, then we invite you to visit our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Computer Storage Devices - Disk Array - NAS Array - Storage Area Network - SAN - Utility Storage Arrays - AGS-TECH Inc. Storage Devices, Disk Arrays and Storage Systems, SAN, NAS A STORAGE DEVICE or also known as STORAGE MEDIUM is any computing hardware that is used for storing, porting and extracting data files and objects. Storage devices can hold and store information temporarily as well as permanently. They can be internal or external to a computer, to a server or to any similar computing device. Our focus is on DISK ARRAY which is a hardware element that contains a large group of hard disk drives (HDDs). Disk arrrays may contain several disk drive trays and have architectures improving speed and increasing data protection. A storage controller runs the system, which coordinates activity within the unit. Disk arrays are the backbone of modern storage networking environments. A disk array is a DISK STORAGE SYSTEM which contains multiple disk drives and is differentiated from a disk enclosure, in that an array has cache memory and advanced functionality such as RAID and virtualization. RAID stands for Redundant Array of Inexpensive (or Independent) Disks and employs two or more drives to improve performance and fault tolerance. RAID enables the storage of data in multiple places to protect the data against corruption and to serve it to users faster. Click on the blue highlighted text to download catalogs and brochures: Private Label Flash Storage for Embedded Industrial Applications (We can put your name, logo, brand on these.........) To choose a suitable Industrial Grade Storage Device for your project, please go to our industrial computer store by CLICKING HERE. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Components of a typical disk array include: - Disk array controllers - Cache memories - Disk enclosures - Power supplies Generally disk arrays provide increased availability, resiliency and maintainability by using additional, redundant components such as controllers, power supplies, fans, etc., to the degree that all single points of failure are eliminated from the design. These components are most of the time hot-swappable. Typically, disk arrays are divided into categories: NETWORK ATTACHED STORAGE (NAS) ARRAYS : NAS is a dedicated file storage device that provides local-area network (LAN) users with centralized, consolidated disk storage through a standard Ethernet connection. Each NAS device is connected to the LAN as an independent network device and assigned an IP address. Its main advantage is that network storage is not limited to the storage capacity of a computing device or the number of disks in a local server. NAS products can generally hold enough disks to support RAID, and multiple NAS appliances can be attached to the network for storage expansion. STORAGE AREA NETWORK (SAN) ARRAYS : They contain one or more disk arrays that function as the repository for the data which is moved in and out of the SAN. Storage arrays connect to the fabric layer with cables running from the devices in the fabric layer to the GBICs in the ports on the array. There are mainly two types of storage area network arrays, namely modular SAN arrays and monolithic SAN arrays. Both of them use built-in computer memory to speed up and cache access to slow disk drives. The two types use memory cache differently. Monolithic arrays generally have more cache memory compared to modular arrays. 1.) MODULAR SAN ARRAYS : These have fewer port connections, they store less data and connect to fewer servers compared to monolithic SAN arrays. They make it possible for the user such as small companies to start small with a few disk drives and to increase the number as storage needs grow. They have shelves for holding disk drives. If connected to only a few servers, modular SAN arrays can be very fast and offer companies a flexibility. Modular SAN arrays fit into standard 19” racks. They generally use two controllers with separate cache memory in each and mirror the cache between the controllers to prevent data loss. 2.) MONOLITHIC SAN ARRAYS : These are big collections of disk drives in data centers. They can store much more data compared to modular SAN arrays and generally connect to mainframes. Monolithic SAN arrays have many controllers that can share direct access to fast global memory cache. Monolithic arrays generally have more physical ports to connect to storage area networks. Thus more servers can use the array. Typically monolithic arrays are more valuable and have superior built-in redundancy and reliability. UTILITY STORAGE ARRAYS : In utility storage service model, a provider offers storage capacity to individuals or organizations on a pay-per-use basis. This service model is also referred to as storage on demand. This facilitates efficient use of resources and reduces cost. This can be more cost effective to companies by eliminating the need to purchase, manage and maintain infrastructures that meet peak requirements which may be beyond the needed capacity limits. STORAGE VIRTUALIZATION : This uses virtualization to enable better functionality and more advanced features in computer data storage systems. Storage virtualization is the apparent pooling of data from several same-type or different types of storage devices into what appears to be a single device managed from a central console. It helps storage administrators perform backup, archiving and recovery more easily and faster by overcoming the complexity of a storage area network (SAN). This can be achieved by implementing virtualization with software applications or using hardware and software hybrid appliances. CLICK Product Finder-Locator Service PREVIOUS PAGE

Computer Networking Equipment - Intermediate Systems - InterWorking Unit - IWU - IS - Router - Bridge - Switch - Hub available from AGS-TECH Inc. Networking Equipment, Network Devices, Intermediate Systems, Interworking Unit COMPUTER NETWORKING DEVICES are equipment that mediate data in computer networks. Computer networking devices are also called NETWORK EQUIPMENT, INTERMEDIATE SYSTEMS (IS) or INTERWORKING UNIT (IWU). Devices which are the last receiver or that generate data are called HOST or DATA TERMINAL EQUIPMENT. Among the high quality brands we offer are ATOP TECHNOLOGIES, JANZ TEC , ICP DAS and KORENIX. - ATOP TECHNOLOGIES compact product brochure - ATOP Technologies Product List 2021) - Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) - Barcode Scanners (We private label these with your brand name and logo if you wish) - CISCO Start Catalog (Networking Equipment, Switches, Wireless Controllers, Wireless Access Points (WAP), Cloud Managed Access Points, Routers) - Fixed Industrial Scanners (We private label these with your brand name and logo if you wish) - ICP DAS brand industrial communication and networking products brochure - ICP DAS brand industrial Ethernet switch for rugged environments - ICP DAS brand PACs Embedded Controllers & DAQ brochure - ICP DAS brand Industrial Touch Pad brochure - ICP DAS brand Remote IO Modules and IO Expansion Units brochure - ICP DAS brand PCI Boards and IO Cards - J ANZ TEC brand compact product brochure - Kiosk Systems (We private label these with your brand name and logo if you wish) - Kiosk Systems Accessories Guide (We private label these with your brand name and logo if you wish) - KORENIX brand compact product brochure - Mobile Computers for Enterprises (We private label these with your brand name and logo if you wish) - Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) - RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) To choose a suitable Industrial Grade Networking Device for your project, please go to our industrial computer store by CLICKING HERE. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Below is some fundamental information about networking devices that you may find useful. List of computer networking devices / Common basic networking devices: ROUTER: This is a specialized network device that determines the next network point where it can forward a data packet towards the destination of the packet. Unlike a gateway, it cannot interface different protocols. Works on OSI layer 3. BRIDGE: This is a device connecting multiple network segments along the data link layer. Works on OSI layer 2. SWITCH: This is a device that allocates traffic from one network segment to certain lines (intended destination(s)) which connect the segment to another network segment. So unlike a hub a switch splits the network traffic and sends it to different destinations rather than to all systems on the network. Works on OSI layer 2. HUB: Connects multiple Ethernet segments together and makes them act as a single segment. In other words, a hub provides bandwidth which is shared among all the objects. A hub is one of the most basic hardware devices that connects two or more Ethernet terminals in a network. Therefore, only one computer connected to the hub is able to transmit at a time, contrary to switches, which provide a dedicated connection between individual nodes. Works on OSI layer 1. REPEATER: This is a device to amplify and/or regenerate digital signals received while sending them from one part of a network to another. Works on OSI layer 1. Some of our HYBRID NETWORK devices: MULTILAYER SWITCH: This is a switch that besides switching on OSI layer 2, provides functionality at higher protocol layers. PROTOCOL CONVERTER: This is a hardware device that converts between two different types of transmissions, such as asynchronous and synchronous transmissions. BRIDGE ROUTER (B ROUTER): This piece of equipment combines router and bridge functionalities and therefore works on OSI layers 2 and 3. Here are some of our hardware and software components that most often are placed on the connection points of different networks, e.g. between internal and external networks: PROXY: This is a computer network service that allows clients to make indirect network connections to other network services FIREWALL: This is a piece of hardware and/or software placed on the network to prevent the type of communications that are forbidden by the network policy. NETWORK ADDRESS TRANSLATOR: Network services provided as hardware and/or software that convert internal to external network addresses and vice versa. Other popular hardware for establishing networks or dial-up connections: MULTIPLEXER: This device combines several electrical signals into a single signal. NETWORK INTERFACE CONTROLLER: A piece of computer hardware which allows the attached computer to communicate by network. WIRELESS NETWORK INTERFACE CONTROLLER: A piece of computer hardware which allows the attached computer to communicate by WLAN. MODEM: This is a device that modulates an analog ''carrier'' signal (such as sound), to encode digital information, and that also demodulates such a carrier signal to decode the transmitted information, as a computer communicating with another computer over the telephone network. ISDN TERMINAL ADAPTER (TA): This is a specialized gateway for Integrated Services Digital Network (ISDN) LINE DRIVER: This is a device that increases transmission distances by amplifying the signal. Base-band networks only. CLICK Product Finder-Locator Service PREVIOUS PAGE

Composite Stereo Microscopes - Metallurgical Microscope - Fiberscope - Borescope - SADT -AGS-TECH Inc - New Mexico - USA Microscope, Fiberscope, Borescope, Vision Measuring Machines, Profile Projectors We supply MICROSCOPES, FIBERSCOPES, BORESCOPES, VISION MEASURING MACHINES, PROFILE PROJECTORS from manufacturers like SADT, SINOAGE, SINOWON for industrial applications. There are a large number of microscopes based on the physical principle used to produce an image and based on their area of application. The type of instruments we supply are OPTICAL MICROSCOPES (COMPOUND / STEREO TYPES), and METALLURGICAL MICROSCOPES. You can purchase brand new as well as refurbished or used equipment from us. Browse through our catalogs below and let us know the brand and model number and we will provide you our offers: HAIDA Color Assessment Cabinet SADT-SINOAGE Brand Metrology and Test Equipment Catalog In this catalog you will find some high quality metallurgical microscopes and inverted microscopes. SINOWON Instant Vision Measuring System SINOWON Profile Projector SINOWON Toolmakers Microscope SINOWON Vision Measuring Machine SINOWON Video Microscope We offer both FLEXIBLE and RIGID FIBERSCOPE and BORESCOPE models and they are primarily used for NONDESTRUCTIVE TESTING in confined spaces, like crevices in some concrete structures and aircraft engines. Both of these optical instruments are used for visual inspection. There are however differences between fiberscopes and borescopes: One of them is the flexibility aspect. Fiberscopes are made of flexible optic fibers and have a viewing lens attached to their head. The operator can turn the lens after insertion of the fiberscope into a crevice. This increases the operator’s view. To the contrary, borescopes are generally rigid and allow the user to view only straight ahead or at right angles. Another difference is the light source. A fiberscope does transmit light down its optical fibers to illuminate the observation area. On the other hand, a borescope has mirrors and lenses so light can be bounced from between mirrors to illuminate the observation area. Lastly, the clarity is different. Whereas fiberscopes are limited to a range of 6 to 8 inches, borescopes can provide a wider and clearer view as compared to fiberscopes. OPTICAL MICROSCOPES : These optical instruments use visible light (or UV light in the case of fluorescence microscopy) to produce an image. Optical lenses are used to refract the light. The first microscopes that were invented were optical. Optical microscopes can be further subdivided into several categories. We focus our attention to two of them: 1.) COMPOUND MICROSCOPE : These microscopes are composed of two lens systems, an objective and an ocular (eye piece). The maximum useful magnification is about 1000x. 2.) STEREO MICROSCOPE (also known as DISSECTING MICROSCOPE): These microscopes magnify to about maximum 100x and supply a 3D view of the specimen. They are useful for observing opaque objects. METALLURGICAL MICROSCOPES : Our downloadable SADT catalog with the link above does contain metallurgical and inverted metallographic microscopes. So please see our catalog for product details. In order to acquire a basic understanding about these types of microscopes, please go to our page COATING SURFACE TEST INSTRUMENTS. FIBERSCOPES : Fiberscopes incorporate fiber optic bundles, consisting of numerous fiber optic cables. Fiber optic cables are made of optically pure glass and are as thin as a human’s hair. The main components to a fiber optic cable are: Core, which is the center made of high purity glass, cladding which is he outer material surrounding the core that prevents light from leaking and finally buffer which is the protective plastic coating. Generally there are two different fiber optic bundles in a fiberscope: The first one is the illumination bundle which is designed to carry light from the source to the eyepiece and the second one is the imaging bundle designed to carry an image from the lens to the eyepiece. A typical fiberscope is made up of the following components: -Eyepiece: This is the part from where we observe the image. It magnifies the image carried by the imaging bundle for easy viewing. -Imaging Bundle: A strand of flexible glass fibers transmitting the images to the eyepiece. -Distal Lens: A combination of multiple micro lenses that take images and focus them into the small imaging bundle. -Illumination System: A Fiber optic light guide that sends light from the source to the target area (eyepiece) -Articulation System: The system providing the user the ability to control the movement of the bending section of the fiberscope that is directly attached to the distal lens. -Fiberscope Body: The control section designed to help one hand operation. -Insertion Tube: This flexible and durable tube protects the fiber optic bundle and articulation cables. -Bending Section – The most flexible part of the fiberscope connecting the insertion tube to the distal viewing section. -Distal Section: ending location for both the illumination and imaging fiber bundle. BORESCOPES / BOROSCOPES : A borescope is an optical device consisting of a rigid or flexible tube with an eyepiece on one end, and an objective lens on the other end linked together by a light transmitting optical system in between. Optical fibers surrounding the system are generally used for illuminating the object to be viewed. An internal image of the illuminated object is formed by the objective lens, magnified by the eyepiece and presented to the viewer's eye. Many modern borescopes can be fitted with imaging and video devices. Borescopes are used similar to fiberscopes for visual inspection where the area to be inspected is inaccessible by other means. Borescopes are considered nondestructive test instruments for viewing and examining defects and imperfections. The areas of application is only limited by your imagination. The term FLEXIBLE BORESCOPE is sometimes used interchangeably with the term fiberscope. One disadvantage for flexible borescopes originates from pixelation and pixel crosstalk due to the fiber image guide. Image quality varies widely among different models of flexible borescopes depending on the number of fibers and construction used in the fiber image guide. High end borescopes offer a visual grid on image captures that aids in evaluating the size of the area under inspection. For flexible borescopes, articulation mechanism components, range of articulation, field of view and angles of view of the objective lens are also important. Fiber content in the flexible relay is also critical to provide the highest possible resolution. Minimal quantity is 10,000 pixels while the best images are obtained with higher numbers of fibers in the 15,000 to 22,000 pixels range for the larger diameter borescopes. The ability to control the light at the end of the insertion tube allows the user to make adjustments that can significantly improve the clarity of images taken. On the other hand, RIGID BORESCOPES generally provide a superior image and lower cost compared to a flexible borescope. The shortcoming of rigid borescopes is the limitation that access to what is to be viewed must be in a straight line. Therefore, rigid borescopes have a limited area of application. For similar-quality instruments, the largest rigid borescope that will fit the hole gives the best image. A VIDEO BORESCOPE is similar to the flexible borescope but uses a miniature video camera at the end of the flexible tube. The end of the insertion tube includes a light which makes it possible to capture video or still images deep within the area of investigation. The ability of video borescopes to capture video and still images for later inspection is very useful. Viewing position can be changed via a joystick control and displayed on the screen mounted on its handle. Because the complex optical waveguide is replaced with an inexpensive electrical cable, video borescopes can be much less costly and potentially offer better resolution. Some borescopes offer USB cable connection. For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Adhesive Bonding - Adhesives - Sealing - Fastening - Joining Nonmetallic Materials - Optical Contacting - UV Bonding - Specialty Glue - Epoxy - Custom Assembly Adhesive Bonding & Sealing & Custom Mechanical Fastening and Assembly Among our other most valuable JOINING techniques are ADHESIVE BONDING, MECHANICAL FASTENING and ASSEMBLY, JOINING NONMETALLIC MATERIALS. We dedicate this section to these joining and assembly techniques because of their importance in our manufacturing operations and the extensive content related to them. ADHESIVE BONDING: Did you know that there are specialized epoxies that can be used for almost hermetic level sealing ? Depending on the level of sealing you require, we will choose or formulate a sealant for you. Also do you know that some sealants can be heat cured whereas others require only a UV light to be cured ? If you explain us your application, we can formulate the right epoxy for you. You may require something that is bubble free or something that matches the thermal coefficient of expansion of your mating parts. We have it all ! Contact us and explain your application. We will then choose the most suitable material for you or custom formulate a solution for your challenge. Our materials come with inspection reports, material data sheets and certification. We are capable to assemble your components very economically and ship you completed and quality inspected products. Adhesives are available to us in various forms such as liquids, solutions, pastes, emulsions, powder, tape and films. We use three basic types of adhesives for our joining processes: -Natural Adhesives -Inorganic Adhesives -Synthetic Organic Adhesives For load-bearing applications in manufacturing and fabrication we use adhesives with high cohesive strength, and they are mostly synthetic organic adhesives, which may be thermoplastics or thermosetting polymers. Synthetic organic adhesives are our most important category and can be classified as: Chemically Reactive Adhesives: Popular examples are silicones, polyurethanes, epoxies, phenolics, polyimides, anaerobics like Loctite. Pressure Sensitive Adhesives: Common examples are natural rubber, nitrile rubber, polyacrylates, butyl rubber. Hot Melt Adhesives: Examples are thermoplastics like ethylene-vinyl-acetate copolymers, polyamides, polyester, polyolefins. Reactive Hot Melt Adhesives: They have a thermoset portion based on urethane’s chemistry. Evaporative / Diffusion Adhesives: Popular ones are vinyls, acrylics, phenolics, polyurethanes, synthetic and natural rubbers. Film and Tape Type Adhesives: Examples are nylon-epoxies, elastomer-epoxies, nitrile-phenolics, polyimides. Delayed Tack Adhesives: These include polyvinyl acetates, polystyrenes, polyamides. Electrically and Thermally Conductive Adhesives: Popular examples are epoxies, polyurethanes, silicones, polyimides. According to their chemistries adhesives we use in manufacturing can be classified as: - Epoxy based adhesive systems: High strength and high temperature endurance as high as 473 Kelvin are characteristic of these. Bonding agents in sand mold castings are this type. - Acrylics: These are suitable for applications that involve contaminated dirty surfaces. - Anaerobic adhesive systems: Curing by oxygen deprivation. Hard and brittle bonds. - Cyanoacrylate: Thin bond lines with setting times under 1 minute. - Urethanes: We use them as popular sealants with high toughness and flexibility. - Silicones: Well known for their resistance against moisture and solvents, high impact and peel strength. Relatively long curing times of up to a few days. To optimize the properties in adhesive bonding, we may combine several adhesives. Examples are epoxy-silicon, nitrile-phenolic combined adhesive systems. Polyimides and polybenzimidazoles are used in high-temperature applications. Adhesive joints withstand shear, compressive, and tensile forces pretty well but they may easily fail when subjected to peeling forces. Therefore, in adhesive bonding, we must consider the application and design the joint accordingly. Surface preparation is also of critical importance in adhesive bonding. We clean, treat and modify surfaces to increase the strength and reliability of interfaces in adhesive bonding. Using special primers, wet and dry etching techniques such as plasma cleaning are among our common methods. An adhesion promoting layer such as a thin oxide may improve adhesion in some applications. Increasing surface roughness may also be beneficial prior to adhesive bonding but needs to be well controlled and not exaggerated because excessive roughness can result in trapping of air and therefore a weaker adhesively bonded interface. We use nondestructive methods for testing the quality and strength of our products after adhesive bonding operations. Our techniques include methods such as acoustic impact, IR detection, ultrasonic testing. Advantages of adhesive bonding are: -Adhesive bonding can provide structural strength, sealing and insulation function, suppression of vibration and noise. -Adhesive bonding can eliminate localized stresses at the interface by eliminating the need for joining using fasteners or welding. -Generally no holes are needed for adhesive bonding, and therefore external appearance of components is unaffected. -Thin and fragile parts can be adhesively joined without damage and without significant increase in weight. -Adhesive joining can be used to bond parts made of very different materials with significantly different sizes. -Adhesive bonding can be used on heat sensitive components safely due to low temperatures involved. However some disadvantages do exist for adhesive bonding and our customers should consider these prior to finalizing their designs of joints: -Service temperatures are relatively low for adhesively joint components -Adhesive bonding may require long bonding and curing times. -Surface preparation is needed in adhesive bonding. -Especially for large structures it may be difficult to test adhesively bonded joints nondestructively. -Adhesive bonding may pose reliability concerns in the long term due to degradation, stress corrosion, dissolution….and the like. One of our outstanding products is ELECTRICALLY CONDUCTIVE ADHESIVE, which can replace lead-based solders. Fillers such as silver, aluminum, copper, gold make these pastes conductive. Fillers can be in the form of flakes, particles or polymeric particles coated with thin films of silver or gold. Fillers can also improve thermal conductivity besides electrical. Let us continue with our other joining processes used in manufacturing products. MECHANICAL FASTENING and ASSEMBLY: Mechanical fastening offers us ease of manufacturing, ease of assembly and disassembly, ease of transportation, ease of parts replacement, maintenance and repair, ease in design of movable and adjustable products, lower cost. For fastening we use: Threaded Fasteners: Bolts, screws and nuts are examples of these. Depending on your application, we can provide you specially designed nuts and lock washers for dampening vibration. Riveting: Rivets are among our most common methods of permanent mechanical joining and assembly processes. Rivets are placed in holes and their ends are deformed by upsetting. We perform assembly using riveting at room temperature as well as at high temperatures. Stitching / Stapling / Clinching: These assembly operations are widely used in manufacturing and are basically the same as is used on papers and cardboards. Both metallic and nonmetallic materials can be joined and assembled quickly without need to predrill holes. Seaming: An inexpensive fast joining technique we use widely in manufacturing of containers and metal cans. It is based on folding two thin pieces of material together. Even airtight and watertight seams are possible, especially if seaming is performed jointly with using sealants and adhesives. Crimping: Crimping is a joining method where we do not use fasteners. Electrical or fiber optic connectors are sometimes installed using crimping. In high volume manufacturing, crimping is an indispensible technique for fast joining and assembly of both flat and tubular components. Snap-in Fasteners: Snap fits are also an economical joining technique in assembly and manufacturing. They permit quick assembly and disassembly of components and are a good fit for household products, toys, furniture among others. Shrink and Press Fits: Another mechanical assembly technique, namely shrink fitting is based on the principle of differential thermal expansion and contraction of two components, whereas in press fitting one component is forced over another resulting in good joint strength. We use shrink fitting widely in the assembly and manufacturing of cable harness, and mounting gears and cams on shafts. JOINING NONMETALLIC MATERIALS: Thermoplastics can be heated and melted at the interfaces to be joined and by applying pressure adhesive joining can be accomplished by fusion. Alternatively thermoplastic fillers of the same type may be used for the joining process. Joining of some polymers such as polyethylene may be difficult due to oxidation. In such cases, an inert shielding gas like nitrogen may be used against oxidation. Both external as well as internal heat sources can be used in adhesive joining of polymers. Examples of external sources we commonly use in adhesive joining of thermoplastics are hot air or gases, IR radiation, heated tools, lasers, resistive electrical heating elements. Some of our internal heat sources are ultrasonic welding and friction welding. In some assembly and manufacturing applications we use adhesives for bonding polymers. Some polymers such as PTFE (Teflon) or PE (Polyethylene) have low surface energies and therefore a primer is first applied prior to completing the adhesive bonding process with a suitable adhesive. Another popular technique in joining is the “Clearweld Process” where a toner is first applied to the polymer interfaces. A laser is then directed at the interface, but it does not heat the polymer, but does heat the toner. This makes it possible to heat only well-defined interfaces resulting in localized welds. Other alternative joining techniques in the assembly of thermoplastics are using fasteners, self-tapping screws, integrated snap-fasteners. An exotic technique in manufacturing and assembly operations is embedding tiny micron-sized particles into the polymer and using high-frequency electromagnetic field to inductively heat and melt it at the interfaces to be joined. Thermoset materials on the other hand, do not soften or melt with increasing temperatures. Therefore, adhesive joining of thermoset plastics are usually carried out using threaded or other molded-in inserts, mechanical fasteners and solvent bonding. Regarding joining and assembly operations involving glass and ceramics in our manufacturing plants, here are a few common observations: In cases where a ceramic or glass have to be joined with difficult-to-bond materials, the ceramic or glass materials are frequently coated with a metal that bonds itself easily to them, and then joined to the difficult-to-bond material. When ceramic or glass has a thin metal coating it can be more readily brazed to metals. Ceramics are sometimes joined and assembled together during their shaping process while still hot, soft and tacky. Carbides can be more easily brazed to metals if they have as their matrix material a metal binder such as cobalt or nickel-molybdenum alloy. We braze carbide cutting tools to steel toolholders. Glasses bond well to each other and metals when hot and soft. Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum and fluid control components can be found here: Brazing Factory Brochure Private Label Epoxy Solutions for Construction, Electrical, Industrial Assembly (Download brochure by clicking on blue text. We can put your name, label, logo on these epoxies if you wish) CLICK Product Finder-Locator Service PREVIOUS PAGE

Wireless Components - Antenna - Radio Frequency Devices - RF Devices - Remote Sensing and Control - High Frequency RF and Wireless Devices Manufacturing & Assembly • Wireless components, devices and assemblies for remote sensing, remote control and communication. We can help you during the design, development, prototyping or mass production of various types of fixed, mobile, and portable two way radios, cellular telephones, GPS units, personal digital assistants (PDAs), smart and remote control equipment and wireless networking devices and instruments. We also have off-shelf wireless components and devices you can select from our brochures below. Antenna Brochure for 5G - LTE 4G - LPWA 3G - 2G - GPS - GNSS - WLAN - BT - Combo - ISM Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) Barcode Scanners (We private label these with your brand name and logo if you wish) High frequency devices product line (Band Pass Filters, Low Pass Filters, IPD, CPL, Balanced Filter, Diplexer, Balun, Chip Antenna...etc.) Microwave Flexible Cable Assembly Microwave and Milimeter Wave Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Precision RF Adapter s Catalog (Coax RF, Microwave, mmWave Adapters such as SMA, SSMA, SMP, BNC, Type-N, 3.5 mm.....etc) Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) RF Components Brochure for Coaxial Fixed Attenuators, Coaxial Terminations, DC Blocks, Coax Adapters, Waveguide Components, Power Dividers, RF Connectors, RF Tools. RF devices and high frequency inductors (Multilayer Ceramic Capacitors, Chip-Resistor, Disc Capacitors, RF & HF Inductor Varistors & SMD-Varistors, Chip Antenna, Filters, Coupler) RF and Microwave Components (Broadband 90/180 Degree Hybrid and Coupler, Broadband Power Divider, Filter, RF switch, Broadband Amplifier, Broadband Frequency Synthesizer) RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) RF Product Overview Chart (RF Antenna, Multilayer Ceramic Filter, Multilayer Ceramic Balun, Ceramic Diplexer) Soft Ferrites - Cores - Toroids - EMI Suppression Products - RFID Transponders and Accessories Brochure Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum components, BNC, SHV adapters and connectors, conductors and contact pins, connector terminals can be found here: Factory Brochure Dowload brochure for our DESIGN PARTNERSHIP PROGRAM We also participate in Third Party Resource Program and are a reseller of products offered by RF Digital ( Website: http://www.rfdigital.com ) , a company that manufactures an extensive line of fully integrated, low cost, high quality, high performance, configurable Wireless RF Transmitter, Receiver & Transceiver Modules, suitable for a wide range of applications. We participate in RF Digital's referral program as a Product Design and Development Company. Contact us to take advantage of our fully integrated, configurable Wireless RF Transmitter, Receiver & Transceiver Modules, High Frequency RF Devices, and most importantly of our consulting services regarding the implementation and application of these wireless components and devices and our engineering integration services. We can make you realize your new product development cycle by assisting you at every phase of the process, from concept to design to prototyping to first article manufacturing to mass production. • Some applications of wireless technology we can help you with are: - Wireless security systems - Remote control of consumer electronic devices or commercial equipment. - Cellular telephony (phones and modems): - WiFi - Wireless energy transfer - Radio communication devices - Short-range point-to-point communication devices such as wireless microphones, remote controls, IrDA, RFID (Radio Frequency Identification), Wireless USB, DSRC (Dedicated Short Range Communications), EnOcean, Near Field Communication, Wireless Sensor Networks : ZigBee, EnOcean; Personal area networks, Bluetooth, Ultra-wideband, wireless computer networks: Wireless Local Area Networks (WLAN), Wireless Metropolitan Area Networks (WMAN)...etc. More information on our engineering and research & development capabilities is available at our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Glass Cutting Shaping Tools offered by AGS-TECH, Inc. We supply high quality diamond wheel series, diamond wheel for solar glass, diamond wheel for CNC machine, peripheral diamond wheel, cup & bowl shape diamond wheels, resin wheel series, polishing wheel series, felt wheel, stone wheel, coating removal wheel... Glass Cutting Shaping Tools Please click on the Glass Cutting and Shaping Tools of interest below to download related brochure. Diamond Wheel Series Diamond Wheel for Solar Glass Diamond Wheel for CNC Machine Peripheral Diamond Wheel Cup & Bowl Shape Diamond Wheel Resin Wheel Series Polishing Wheel Series 10S Polishing Wheel Felt Wheel Stone Wheel Coating Removal Wheel BD Polishing Wheel BK Polishing Wheel 9R Ploshing Wheel Polishing Material series Cerium Oxide Series Glass Drill Series Glass Tool Series Other Glass Tools Glass Plier Glass Suction & Lifter Grinding Tool Power Tool UV,Testing Tool Sandblast Fittings Series Machine Fittings Series Cutting Discs Glass Cutters Ungrouped Price of our glass cutting shaping tools depends on model and quantity of order. If you would like us to design and/or manufacture glass cutting and shaping tools specifically for you, please either provide us detailed blueprints, or ask us for help. We will then design, prototype and manufacture them specially for you. Since we carry a wide variety of glass cutting, drilling, grinding, polishing and shaping products with different dimensions, applications and material; it is impossible to list them here. We encourage you to email or call us so we can determine which product is the best fit for you. When contacting us, please inform us about: - Intended application - Material grade preferred - Dimensions - Finishing requirements - Packaging requirements - Labeling requirements - Quantity of your planned order & estimated yearly demand Private Label Auto Glass Repair and Replacement Systems We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools for Every Industry This catalog contains a few glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tool Accessories This brochure includes some glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry This catalog contains some glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. CLICK HERE to download our technical capabilities and reference guide for specialty cutting, drilling, grinding, forming, shaping, polishing tools used in medical, dental, precision instrumentation, metal stamping, die forming and other industrial applications. CLICK Product Finder-Locator Service Click Here to go to Cutting, Drilling, Grinding, Lapping, Polishing, Dicing and Shaping Tools Menu Ref. Code: OICASANHUA

Motion Control, Positioning, Motorized Stage, Actuator, Gripper, Servo Amplifier, Hardware Software Interface Card, Translation Stages, Rotary Table,Servo Motor Automation & Robotic Systems Manufacturing and Assembly Being an engineering integrator, we can provide you AUTOMATION SYSTEMS including: • Motion control and positioning assemblies, motors, motion controller, servo amplifier, motorized stage, lift stage, goniometers, drives, actuators, grippers, direct drive air bearing spindles, hardware-software interface cards and software, custom built pick and place systems, custom built automated inspection systems assembled from translation/rotary stages and cameras, custom built robots, custom automation systems. We also supply manual positioner, manual tilt, rotary or linear stage for simpler applications. A large selection of linear and rotary tables/slides/stages that utilize brushless linear direct-drive servomotors, as well as ball screw models driven with brush or brushless rotary motors are available. Air bearing systems are also an option in automation. Depending on your automation requirements and application, we choose translation stages with suitable travel distance, speed, accuracy, resolution, repeatability, load capacity, in-position stability, reliability...etc. Again, depending on your automation application we can supply you either a purely linear or linear/rotary combination stage. We can manufacture special fixtures, tools and combine them with your motion control hardware to turn them into a complete turnkey automation solution for you. If you require also assistance with installing drivers, code writing for specially developed software with user friendly interface, we can send our experienced automation engineer to your site on a contract basis. Our engineer can directly communicate with you on a daily basis so that at the end you have a custom tailored automation system free of bugs and meeting your expectations. Goniometers: For high-accuracy angular alignment of optical components. The design utilizes direct-drive noncontact motor technology. When used with the multiplier, it provides a positioning speed of 150 degrees per second. So whether you are thinking of an automation system with a moving camera, taking snapshots of a product and analyzing the images acquired to determine a product defect, or whether you are trying to reduce manufacturing leadtimes by integrating a pick and place robot to your automated manufacturing, call us, contact us and you will be glad with the solutions we can provide you. ROBOTS and COBOTS Here are brochures of some off-shelf robots you can download. If you wish we can build you customized robots and cobots that will better fit your needs and applications. We can either redesign and modify existing robot platforms or make new designs for you. Click on blue colored text below to download catalogs: - Collaborative Robots - Customized Agricultural Robots - Customized Commercial Places Robots - Customized Health Care and Hospital Robots - Customized Warehousing Robots - Customized Robots for a Variety of Applications - Food and Beverage Delivery Robot-A302-A302D - Hospital Delivery Robot A801 - Indoor Delivery Robots A301-A301A - Indoor Delivery Robot A305 - Mobile Robot Platform A001 - Robotic Laser Welding Workstation - Robotics Product Brochure - Robotics Workstations - Robot Palletizing Workstation - Robotic Vending Machine A406 - Security Robot A602 - Selection Guide of Industrial Robot Platforms - Small Objects Transfer Robot A503 - Warehouse Logistics Robots A201-A201A - Welding Robots Brochure OTHER ALTERNATIVE ROBOTS and COBOTS No one design or product meets every customer's needs. Below are downloadable brochures for our other products. - Hikrobot Mobile Robots Catalog - Hikvision Logistic Vision Solutions AUTOMATION COMPONENTS AND SPARE PARTS Click on highlighted text to download brochures and catalogs of products you can use as accessories, spare components in building automation systems, robots and cobots: - Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) - Barcode Scanners (We private label these with your brand name and logo if you wish) - Fixed Industrial Scanners (We private label these with your brand name and logo if you wish) - Hikrobot Machine Vision Products - Hikrobot Smart Machine Vision Products - Hikrobot Machine Vision Standard Products - Kinco automation products, including HMI, stepper system, ED servo, CD servo, PLC, field bus. - Kiosk Systems (We private label these with your brand name and logo if you wish) - Kiosk Systems Accessories Guide (We private label these with your brand name and logo if you wish) - Linear Bearings, Die-Set Flange Mount Bearings, Pillow Blocks, Square Bearings and various Shafts & Slides for motion control - Mobile Computers for Enterprises (We private label these with your brand name and logo if you wish) - Motor Starter with UL and CE Certification NS2100111-1158052 - Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) - Process Automation Solutions (We private label these with your brand name and logo if you wish) - RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) - Vandal-Proof IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals Download brochure for our CUSTOM MACHINE AND EQUIPMENT MANUFACTURING Dowload brochure for our DESIGN PARTNERSHIP PROGRAM If you are looking for industrial computers, embedded computers, panel PC for your automation system, we invite you to visit our industrial computers store at http://www.agsindustrialcomputers.com If you would like to obtain more information about our engineering and research & development capabilities besides manufacturing capabilities, then we invite you to visit our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Ultrasonic Machining, Ultrasonic Impact Grinding, Rotary Ultrasonic Machining, Non-Conventional Machining, Custom Manufacturing - AGS-TECH Inc. New Mexico, USA Ultrasonic Machining & Rotary Ultrasonic Machining & Ultrasonic Impact Grinding Another popular NON-CONVENTIONAL MACHINING technique we frequently use is ULTRASONIC MACHINING (UM), also widely known as ULTRASONIC IMPACT GRINDING, where material is removed from a workpiece surface by microchipping and erosion with abrasive particles using a vibrating tool oscillating at ultrasonic frequencies, aided by an abrasive slurry that flows freely between the workpiece and the tool. It differs from most other conventional machining operations because very little heat is produced. The tip of the ultrasonic machining tool is called a “sonotrode” which vibrates at amplitudes of 0.05 to 0.125 mm and frequencies around 20 kHz. The vibrations of the tip transmit high velocities to fine abrasive grains between the tool and the surface of the workpiece. The tool never contacts the workpiece and therefore the grinding pressure is rarely more than 2 pounds. This working principle makes this operation perfect for machining extremely hard and brittle materials, such as glass, sapphire, ruby, diamond, and ceramics. The abrasive grains are located within a water slurry with a concentration between 20 to 60% by volume. The slurry also acts as the carrier of the debris away from the cutting / machining region. We use as abrasive grains mostly boron carbide, aluminum oxide and silicon carbide with grain sizes ranging from 100 for roughing processes to 1000 for our finishing processes. The ultrasonic-machining (UM) technique is best suited for hard and brittle materials like ceramics and glass, carbides, precious stones, hardened steels. The surface finish of ultrasonic machining depends upon the hardness of the workpiece/tool and the average diameter of the abrasive grains used. The tool tip is generally a low-carbon steel, nickel and soft steels attached to a transducer through the toolholder. The ultrasonic-machining process utilizes the plastic deformation of metal for the tool and the brittleness of the workpiece. The tool vibrates and pushes down on the abrasive slurry containing grains until the grains impact the brittle workpiece. During this operation, the workpiece is broken down while the tool bends very slightly. Using fine abrasives, we can achieve dimensional tolerances of 0.0125 mm and even better with ultrasonic-machining (UM). Machining time depends upon the frequency at which the tool is vibrating, the grain size and hardness, and the viscosity of the slurry fluid. The less viscous the slurry fluid, the faster it can carry away used abrasive. Grain size must be equal or greater than the hardness of the workpiece. As an example we can machine multiple aligned holes 0.4 mm in diameter on a 1.2 mm wide glass strip with ultrasonic machining. Let us get a little bit into the physics of the ultrasonic machining process. Microchipping in ultrasonic machining is possible thanks to the high stresses produced by particles striking the solid surface. Contact times between particles and surfaces are very short and in the order of 10 to 100 microseconds. The contact time can be expressed as: to = 5r/Co x (Co/v) exp 1/5 Here r is the radius of the spherical particle, Co is the elastic wave velocity in the workpiece (Co = sqroot E/d) and v is the velocity that the particle hits the surface with. The force a particle exerts on the surface is obtained from the rate of change of momentum: F = d(mv)/dt Here m is the grain mass. The average force of the particles (grains) hitting and rebounding from the surface is: Favg = 2mv / to Here to is the contact time. When numbers are plugged into this expression, we see that even though the parts are very small, since the contact area is also very small, the forces and thus the stresses exerted are significantly high to cause microchipping and erosion. ROTARY ULTRASONIC MACHINING (RUM): This method is a variation of ultrasonic machining, where we replace the abrasive slurry with a tool that has metal-bonded diamond abrasives that have been either impregnated or electroplated on the tool surface. The tool is rotated and ultrasonically vibrated. We press the workpiece at constant pressure against the rotating and vibrating tool. The rotary ultrasonic machining process gives us capabilities such as producing deep holes in hard materials at high material removal rates. Since we deploy a number of conventional and non-conventional manufacturing techniques, we can be of help to you whenever you have questions about a particular product and the fastest and most economical way of manufacturing & fabricating it. CLICK Product Finder-Locator Service PREVIOUS PAGE

Chemical Physical Environmental Analyzers, NDT, Nondestructive Testing, Analytical Balance, Chromatograph, Mass Spectrometer, Gas Analyzer, Moisture Analyzer Chemical, Physical, Environmental Analyzers The industrial CHEMICAL ANALYZERS we provide are: CHROMATOGRAPHS, MASS SPECTROMETERS, RESIDUAL GAS ANALYZERS, GAS DETECTORS, MOISTURE ANALYZER, DIGITAL GRAIN AND WOOD MOISTURE METERS, ANALYTICAL BALANCE The industrial PHYSICAL ANALYSIS INSTRUMENTS we offer are: SPECTROPHOTOMETERS, POLARIMETER, REFRACTOMETER, LUX METER, GLOSS METERS, COLOR READERS, COLOR DIFFERENCE METER , DIGITAL LASER DISTANCE METERS, LASER RANGEFINDER, ULTRASONIC CABLE HEIGHT METER, SOUND LEVEL METER, ULTRASONIC DISTANCE METER , DIGITAL ULTRASONIC FLAW DETECTOR , HARDNESS TESTER , METALLURGICAL MICROSCOPES , SURFACE ROUGHNESS TESTER , ULTRASONIC THICKNESS GAUGE , VIBRATION METER , TACHOMETER . and others...... For the highlighted products, please visit our related pages by clicking on the corresponding colored text above. The ENVIRONMENTAL ANALYZERS we provide are: TEMPERATURE & HUMIDITY CYCLING CHAMBERS, ENVIRONMENTAL TESTING CHAMBERS, LIQUID ANALYSIS & TEST SYSTEMS. Click on Colored Text to Download Catalogs below. Choose the brand and model number of your interest and let us know whether you need brand new, or refurbished / used equipment: AMETEK-LLOYD Instruments Materials Testing (Versatile Materials Testing Equipment, Universal Test Machines, Tensile Strength, Compressibility, Hardness, Elasticity, Peeling, Adhesion...etc.) ELCOMETER Inspection Equipment Catalog ( Physical Test Equipment , Gloss & Reflectance , Colour Measurement , Fineness Of Grind/Dispersion , Density & Specific Gravity , Viscosity & Flow Measurement , Film Application & Test Charts , Drying Time & Permeability , Washability & Abrasion , Hardness & Scratch Resistance , Elasticity, Bend & Impact Testers , Flash Point, Concrete Inspection Equipment ) FLUKE Test Tools Catalog (includes Indoor Air Quality Tools, Air Meter, Airflow Meter, Temperature-Humidity Meter, Particle Counter, Carbon Monoxide Meters) HAIDA Anti-Yellowing Aging Test Chamber HAIDA Color Assessment Cabinet HAIDA IPX1＆X2 Water Drip Test Chamber HAIDA Rapid-Rate Thermal Cycle Chamber HAIDA Salt Corrosion Spray Test Chamber HAIDA Salt Spray Test Chamber HAIDA Sand Dust Proofing Test Chamber HAIDA Temperature Humidity Test Chamber HAIDA Thermal Shock Test Chamber HAIDA Ultraviolet Weathering Test Chamber HAIDA Walk-In Environmental Test Chamber HAIDA Xenon Aging Test Chamber High HAIDA Xenon Aging Test Chamber Standard Helium Leak Tester (We private label these with your brand name and logo if you wish) METTLER TOLEDO Weighing Solutions for Retail Stores SADT-SINOAGE brand metrology and test equipment, please CLICK HERE . You will find some models of the above listed equipment here. Sensors & Analytical Measurement Systems for Liquid Analysis (Products in this brochure are used for environmental tests and and tests carried out in process industries. Example products are conductivity sensors, dissolved oxygen sensors, chlorine sensors, turbidity/suspended solids sensors, optical sensors, transmitters....etc. We private label these with your brand name and logo if you wish) Sensors & Analytical Measurement Systems for Optical OEM Applications in Liquid Analysis (We private label these with your brand name and logo if you wish) Sensors & Analytical Measurement Systems for pH Testing (We private label these with your brand name and logo if you wish) Some fundamental information on these test systems: CHROMATOGRAPHY is a physical method of separation that distribute s components to separate between two phases, one stationary (stationary phase), the other (the mobile phase) moving in a definite direction. In other words, it refers to laboratory techniques for the separation of mixtures. The mixture is dissolved in a fluid called the mobile phase, which carries it through a structure holding another material called the stationary phase. The various constituents of the mixture travel at different speeds, which causes them to separate. The separation is based on differential partitioning between the mobile and stationary phases. Small differences in partition coefficient of a compound results in differential retention on the stationary phase and thus changing the separation. Chromatography can be used to separate the components of a mixture for more advanced use such as purification) or for measuring the relative proportions of analytes (which is the substance to be separated during chromatography) in a mixture. Several chromatographic methods exist, such as paper chromatography, gas chromatography and high performance liquid chromatography. ANALYTICAL CHROMATOGRAPHY is used to determine the existence and the concentration of analyte(s) in a sample. In a chromatogram different peaks or patterns correspond to different components of the separated mixture. In an optimal system each signal is proportional to the concentration of the corresponding analyte that was separated. An equipment called CHROMATOGRAPH enables a sophisticated separation. There are specialized types according to the physical state of the mobile phase such as GAS CHROMATOGRAPHS and LIQUID CHROMATOGRAPHS. Gas chromatography (GC), also sometimes called gas-liquid chromatography (GLC), is a separation technique in which the mobile phase is a gas. High temperatures used in Gas Chromatographs make it unsuitable for high molecular weight biopolymers or proteins encountered in biochemistry because heat denatures them. The technique is however well suited for use in the petrochemical, environmental monitoring, chemical research and industrial chemical fields. On the other hand, Liquid Chromatography (LC) is a separation technique in which the mobile phase is a liquid. In order to measure the characteristics of individual molecules, a MASS SPECTROMETER converts them to ions so that they can be accelerated, and moved about by external electric and magnetic fields. Mass spectrometers are used in Chromatographs explained above, as well as in other analysis instruments. The associated components of a typical mass spectrometer are: Ion Source: A small sample is ionized, usually to cations by loss of an electron. Mass Analyzer: The ions are sorted and separated according to their mass and charge. Detector: The separated ions are measured and results displayed on a chart. Ions are very reactive and short-lived, therefore their formation and manipulation must be conducted in a vacuum. The pressure under which ions may be handled is roughly 10-5 to 10-8 torr. The three tasks listed above may be accomplished in different ways. In one common procedure, ionization is effected by a high energy beam of electrons, and ion separation is achieved by accelerating and focusing the ions in a beam, which is then bent by an external magnetic field. The ions are then detected electronically and the resulting information is stored and analyzed in a computer. The heart of the spectrometer is the ion source. Here molecules of the sample are bombarded by electrons emanating from a heated filament. This is called an electron source. Gases and volatile liquid samples are allowed to leak into the ion source from a reservoir and non-volatile solids and liquids may be introduced directly. Cations formed by the electron bombardment are pushed away by a charged repeller plate (anions are attracted to it), and accelerated toward other electrodes, having slits through which the ions pass as a beam. Some of these ions fragment into smaller cations and neutral fragments. A perpendicular magnetic field deflects the ion beam in an arc whose radius is inversely proportional to the mass of each ion. Lighter ions are deflected more than heavier ions. By varying the strength of the magnetic field, ions of different mass can be focused progressively on a detector fixed at the end of a curved tube under a high vacuum. A mass spectrum is displayed as a vertical bar graph, each bar representing an ion having a specific mass-to-charge ratio (m/z) and the length of the bar indicates the relative abundance of the ion. The most intense ion is assigned an abundance of 100, and it is referred to as the base peak. Most of the ions formed in a mass spectrometer have a single charge, so the m/z value is equivalent to mass itself. Modern mass spectrometers have very high resolutions and can easily distinguish ions differing by only a single atomic mass unit (amu). A RESIDUAL GAS ANALYZER (RGA) is a small and rugged mass spectrometer. We have explained mass spectrometers above. RGAs are designed for process control and contamination monitoring in vacuum systems such as research chambers, surface science setups, accelerators, scanning microscopes. Utilizing quadrupole technology, there are two implementations, utilizing either an open ion source (OIS) or a closed ion source (CIS). RGAs are used in most cases to monitor the quality of the vacuum and easily detect minute traces of impurities possessing sub-ppm detectability in the absence of background interferences. These impurities can be measured down to (10)Exp -14 Torr levels, Residual Gas Analyzers are also used as sensitive in-situ, helium leak detectors. Vacuum systems require checking of the integrity of the vacuum seals and the quality of the vacuum for air leaks and contaminants at low levels before a process is initiated. Modern residual gas analyzers come complete with a quadrupole probe, electronics control unit , and a real-time Windows software package that is used for data acquisition and analysis, and probe control. Some software supports multiple head operation when more than one RGA is needed. Simple design with a small number of parts will minimize outgassing and reduce the chances of introducing impurities into your vacuum system. Probe designs using self-aligning parts will ensure easy reassembled after cleaning. LED indicators on modern devices provide instant feedback on the status of the electron multiplier, filament, electronics system and the probe. Long-life, easily changeable filaments are used for electron emission. For increased sensitivity and faster scan rates, an optional electron multiplier is sometimes offered that detects partial pressures down to 5 × (10)Exp -14 Torr. Another attractive feature of residual gas analyzers is the built-in degassing feature. Using electron impact desorption, the ion source is thoroughly cleaned, greatly reducing the ionizer's contribution to background noise. With a large dynamic range the user can make measurements of small and large gas concentrations simultaneously. A MOISTURE ANALYZER determines the remaining dry mass after a drying process with infrared energy of the original matter which is previously weighed. Humidity is calculated in relation to the weight of the wet matter. During the drying process, the decrease of moisture in the material is shown on the display. The moisture analyzer determines moisture and the amount of dry mass as well as the consistency of volatile and fixed substances with high accuracy. The weighing system of the moisture analyzer possesses all the properties of modern balances. These metrology tools are used in the industrial sector to analyze pastes, wood, adhesive materials, dust,…etc. There are many applications where trace moisture measurements are necessary for manufacturing and process quality assurance. Trace moisture in solids must be controlled for plastics, pharmaceuticals and heat treatment processes. Trace moisture in gases and liquids need to be measured and controlled as well. Examples include dry air, hydrocarbon processing, pure semiconductor gases, bulk pure gases, natural gas in pipelines….etc. The loss on drying type analyzers incorporate an electronic balance with a sample tray and surrounding heating element. If the volatile content of the solid is primarily water, the LOD technique gives a good measure of moisture content. An accurate method for determining the amount of water is the Karl Fischer titration, developed by the German chemist. This method detects only water, contrary to loss on drying, which detects any volatile substances. Yet for natural gas there are specialized methods for the measurement of moisture, because natural gas poses a unique situation by having very high levels of solid and liquid contaminants as well as corrosives in varying concentrations. MOISTURE METERS are test equipment for measuring the percentage of water in a substance or material. Using this information, workers in various industries determine if the material is ready for use, too wet or too dry. For example, wood and paper products are very sensitive to their moisture content. Physical properties including dimensions and weight are strongly affected by moisture content. If you are purchasing large quantities of wood by weight, it will be a wise thing to measure the moisture content to make sure it is not intentionally watered to increase the price. Generally two basic types of moisture meters are available. One type measures the electrical resistance of the material, which becomes increasingly lower as the moisture content of it rises. With the electrical resistance type of moisture meter, two electrodes are driven into the material and the electrical resistance is translated into moisture content on the device’s electronic output. A second type of moisture meter relies on the dielectric properties of the material, and requires only surface contact with it. The ANALYTICAL BALANCE is a basic tool in quantitative analysis, used for the accurate weighing of samples and precipitates. A typical balance should be able to determine differences in mass of 0.1 milligram. In microanalyses the balance must be about 1,000 times more sensitive. For special work, balances of even higher sensitivity are available. The measuring pan of an analytical balance is inside a transparent enclosure with doors so that dust does not collect and air currents in the room do not affect the balance's operation. There is a smooth turbulence-free airflow and ventilation that prevents balance fluctuation and the measure of mass down to 1 microgram without fluctuations or loss of product. Maintaining consistent response throughout the useful capacity is achieved by maintaining a constant load on the balance beam, thus the fulcrum, by subtracting mass on the same side of the beam to which the sample is added. Electronic analytical balances measure the force needed to counter the mass being measured rather than using actual masses. Therefore they must have calibration adjustments made to compensate for gravitational differences. Analytical balances use an electromagnet to generate a force to counter the sample being measured and outputs the result by measuring the force needed to achieve balance. SPECTROPHOTOMETRY is the quantitative measurement of the reflection or transmission properties of a material as a function of wavelength, and SPECTROPHOTOMETER is the test equipment used for this purpose. The spectral bandwidth (the range of colors it can transmit through the test sample), the percentage of sample-transmission, the logarithmic range of sample-absorption and percentage of reflectance measurement are critical for spectrophotometers. These test instruments are widely used in optical component testing where optical filters, beam splitters, reflectors, mirrors…etc need to be evaluated for their performance. There are many other applications of spectrophotometers including the measurement of transmission and reflection properties of pharmaceutical and medical solutions, chemicals, dyes, colors……etc. These tests ensure consistency from batch to batch in production. A spectrophotometer is able to determine, depending on the control or calibration, what substances are present in a target and their quantities through calculations using observed wavelengths. The range of wavelengths covered is generally between 200 nm - 2500 nm using different controls and calibrations. Within these ranges of light, calibrations are needed on the machine using specific standards for the wavelengths of interest. There are two major types of spectrophotometers, namely single beam and double beam. Double beam spectrophotometers compare the light intensity between two light paths, one path containing a reference sample and the other path containing the test sample. A single-beam spectrophotometer on the other hand measures the relative light intensity of the beam before and after a test sample is inserted. Although comparing measurements from double-beam instruments are easier and more stable, single-beam instruments can have a larger dynamic range and are optically simpler and more compact. Spectrophotometers can be installed also into other instruments and systems which can help users to perform in-situ measurements during production…etc. The typical sequence of events in a modern spectrophotometer can be summarized as: First the light source is imaged upon the sample, a fraction of the light is transmitted or reflected from the sample. Then the light from the sample is imaged upon the entrance slit of the monochromator, which separates the wavelengths of light and focuses each of them onto the photodetector sequentially. The most common spectrophotometers are UV & VISIBLE SPECTROPHOTOMETERS which operate in the ultraviolet and 400–700 nm wavelength range. Some of them cover the near-infrared region too. On the other hand, IR SPECTROPHOTOMETERS are more complicated and expensive because of the technical requirements of measurement in the infrared region. Infrared photosensors are more valuable and Infrared measurement is also challenging because almost everything emits IR light as thermal radiation, especially at wavelengths beyond about 5 m. Many materials used in other types of spectrophotometers such as glass and plastic absorb infrared light, making them unfit as the optical medium. Ideal optical materials are salts such as potassium bromide, which do not absorb strongly. A POLARIMETER measures the angle of rotation caused by passing polarized light through an optically active material. Some chemical materials are optically active, and polarized (unidirectional) light will rotate either to the left (counter-clockwise) or right (clockwise) when passed through them. The amount by which the light is rotated is called the angle of rotation. One popular application, concentration and purity measurements are made to determine product or ingredient quality in the food, beverage and pharmaceutical industries. Some samples that display specific rotations that can be calculated for purity with a polarimeter include the Steroids, Antibiotics, Narcotics, Vitamins, Amino Acids, Polymers, Starches, Sugars. Many chemicals exhibit a unique specific rotation which can be used to distinguish them. A Polarimeter can identify unknown specimens based on this if other variables like concentration and length of sample cell are controlled or at least known. On the other hand, if the specific rotation of a sample is already known, then the concentration and/or purity of a solution containing it can be calculated. Automatic polarimeters calculate these once some input on variables are entered by the user. A REFRACTOMETER is a piece of optical test equipment for the measurement of index of refraction. These instruments measure the extent to which light is bent, i.e. refracted when it moves from air into the sample and are typically used to determine the refractive index of samples. There are five types of refractometers: traditional handheld refractometers, digital handheld refractometers, laboratory or Abbe refractometers, inline process refractometers and finally Rayleigh Refractometers for measuring the refractive indices of gases. Refractometers are widely used in various disciplines such as mineralogy, medicine, veterinary, automotive industry…..etc., to examine products as diverse as gemstones, blood samples, auto coolants, industrial oils. The refractive index is an optical parameter to analyze liquid samples. It serves to identify or confirm the identity of a sample by comparing its refractive index to known values, helps assess the purity of a sample by comparing its refractive index to the value for the pure substance, helps determine the concentration of a solute in a solution by comparing the solution's refractive index to a standard curve. Let us go briefly over the types of refractometers: TRADITIONAL REFRACTOMETERS take advantage of the critical angle principle by which a shadow line is projected onto a small glass thru prisms and lenses. The specimen is placed between a small cover plate and a measuring prism. The point at which the shadow line crosses the scale indicates the reading. There is automatic temperature compensation, because the refractive index varies based on temperature. DIGITAL HANDHELD REFRACTOMETERS are compact, lightweight, water and high temperature resistant testing devices. Measurement times are very short and in the range of two to three seconds only. LABORATORY REFRACTOMETERS are ideal for users planning to measure multiple parameters and get the outputs in various formats, take printouts. Laboratory refractometers offer a wider range and higher accuracy than handheld refractometers. They can be connected to computers and controlled externally. INLINE PROCESS REFRACTOMETERS can be configured to constantly collect specified statistics of the material remotely. The microprocessor control provides computer power that makes these devices very versatile, time-saving and economical. Finally, the RAYLEIGH REFRACTOMETER is used for measuring the refractive indices of gases. Quality of light is very important in the workplace, factory floor, hospitals, clinics, schools, public buildings and many other places. LUX METERS are used to measure luminuous intensity (brightness). Special optic filters match the spectral sensitivity of the human eye. Luminous intensity is measured and reported in foot-candle or lux (lx). One lux is equal to one lumen per square meter and one foot-candle is equal to one lumen per square foot. Modern lux meters are equipped with internal memory or a data logger to record the measurements, cosine correction of the angle of incident light and software to analyze readings. There are lux meters for measuring UVA radiation. High end version lux meters offer Class A status to meet CIE, graphic displays, statistical analysis functions, large measurement range up to 300 klx, manual or automatic range selection, USB and other outputs. A LASER RANGEFINDER is a test instrument which uses a laser beam to determine the distance to an object. Most laser rangefinders operation is based on the time of flight principle. A laser pulse is sent in a narrow beam towards the object and the time taken by the pulse to be reflected off the target and returned to the sender is measured. This equipment is not suitable however for high precision sub-millimeter measurements. Some laser rangefinders use the Doppler effect technique to determine whether the object is moving towards or away from the rangefinder as well as the object’s speed. The precision of a laser rangefinder is determined by the rise or fall time of the laser pulse and the speed of the receiver. Rangefinders that use very sharp laser pulses and very fast detectors are capable to measure the distance of an object to within a few millimeters. Laser beams will eventually spread over long distances due to the divergence of the laser beam. Also distortions caused by air bubbles in the air make it difficult to get an accurate reading of the distance of an object over long distances of more than 1 km in open and unobscured terrain and over even shorter distances in humid and foggy places. High end military rangefinders operate at ranges up to 25 km and are combined with binoculars or monoculars and can be connected to computers wirelessly. Laser rangefinders are used in 3-D object recognition and modelling, and a wide variety of computer vision-related fields such as time-of-flight 3D scanners offering high-precision scanning abilities. The range data retrieved from multiple angles of a single object can be used to produce complete 3-D models with as little error as possible. Laser rangefinders used in computer vision applications offer depth resolutions of tenths of millimeters or less. Many other application areas for laser rangefinders exist, such as sports, construction, industry, warehouse management. Modern laser measurement tools include functions such as capability to make simple calculations, such as the area and volume of a room, switching between imperial and metric units. An ULTRASONIC DISTANCE METER works on a similar principle as a laser distance meter, but instead of light it uses sound with a pitch too high for the human ear to hear. The speed of sound is only about 1/3 of a km per second, so the time measurement is easier. Ultrasound has many of the same advantages of a Laser Distance Meter, namely a single person and one-handed operation. There is no need to access the target personally. However ultrasound distance meters are intrinsically less accurate, because sound is far more difficult to focus than laser light. Accuracy is typically several centimeters or even worse, while it is a few millimeters for laser distance meters. Ultrasound needs a large, smooth, flat surface as the target. This is a severe limitation. You can’t measure to a narrow pipe or similar smaller targets. The ultrasound signal spreads out in a cone from the meter and any objects in the way can interfere with the measurement. Even with laser aiming, one cannot be sure that the surface from which the sound reflection is detected is the same as that where the laser dot is showing. This can lead to errors. Range is limited to tens of meters, whereas laser distance meters can measure hundreds of meters. Despite all these limitations, ultrasonic distance meters cost much less. Handheld ULTRASONIC CABLE HEIGHT METER is a test instrument for measuring cable sag, cable height and overhead clearance to ground. It is the safest method for cable height measurement because it eliminates cable contact and the use of heavy fiberglass poles. Similar to other ultrasonic distance meters, the cable height meter is a one-man simple operation device that sends ultrasound waves to target, measures time to echo, calculates distance based on speed of sound and adjusts itself for air temperature. A SOUND LEVEL METER is a testing instrument that measures sound pressure level. Sound level meters are useful in noise pollution studies for the quantification of different kinds of noise. The measurement of noise pollution is important in construction, aerospace, and many other industries. The American National Standards Institute (ANSI) specifies sound level meters as three different types, namely 0, 1 and 2. The relevant ANSI standards set performance and accuracy tolerances according to three levels of precision: Type 0 is used in laboratories, Type 1 is used for precision measurements in the field, and Type 2 is used for general-purpose measurements. For compliance purposes, readings with an ANSI Type 2 sound level meter and dosimeter are considered to have an accuracy of ±2 dBA, whereas a Type 1 instrument has an accuracy of ±1 dBA. A Type 2 meter is the minimum requirement by OSHA for noise measurements, and is usually sufficient for general purpose noise surveys. The more accurate Type 1 meter is intended for the design of cost-effective noise controls. International industry standards related to frequency weighting, peak sound pressure levels….etc are beyond the scope here due to the details associated with them . Before purchasing a particular sound level meter, we advise that you make sure to know what standards compliance your workplace requires and make the right decision in purchasing a particular model of test instrument. ENVIRONMENTAL ANALYZERS like TEMPERATURE & HUMIDITY CYCLING CHAMBERS, ENVIRONMENTAL TESTING CHAMBERS come in a variety of sizes, configurations and functions depending on the area of application, the specific industrial standards compliance needed and the end users needs. They can be configured and manufactured according to custom requirements. There is a broad range of test specifications such as MIL-STD, SAE, ASTM to help determine the most appropriate temperature humidity profile for your product. Temperature / humidity testing is generally carried out for : Accelerated Aging: Estimates the life of a product when actual lifespan is unknown under normal use. Accelerated aging exposes the product to high levels of controlled temperature, humidity, and pressure within a relatively shorter timeframe than the expected lifespan of the product. Instead of waiting long times and years to see product lifespan, one can determine it using these tests within a much shorter and reasonable time using these chambers. Accelerated Weathering: Simulates exposure from moisture, dew, heat, UV….etc. Weathering and UV exposure causes damage to coatings, plastics, inks, organic materials, devices…etc. Fading, yellowing, cracking, peeling, brittleness, loss of tensile strength, and delamination occur under prolonged UV exposure. Accelerated weathering tests are designed to determine if products will stand the test of time. Heat Soak/Exposure Thermal Shock: Aimed to determine the ability of materials, parts and components to withstand sudden changes in temperature. Thermal shock chambers rapidly cycle products between hot and cold temperature zones to see the effect of multiple thermal expansions and contractions as would be the case in nature or industrial environments throughout the many seasons and years. Pre & Post Conditioning: For conditioning of materials, containers, packages, devices…etc For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Micromanufacturing, Nanomanufacturing, Mesomanufacturing - Electronic & Magnetic Optical & Coatings, Thin Film, Nanotubes, MEMS, Microscale Fabrication Nanoscale & Microscale & Mesoscale Manufacturing Read More Our NANOMANUFACTURING, MICROMANUFACTURING and MESOMANUFACTURING processes can be categorized as: Surface Treatments and Modification Functional Coatings / Decorative Coatings / Thin Film / Thick Film Nanoscale Manufacturing / Nanomanufacturing Microscale Manufacturing / Micromanufacturing / Micromachining Mesoscale Manufacturing / Mesomanufacturing Microelectronics & Semiconductor Manufacturing and Fabrication Microfluidic Devices Manufacturing Micro-Optics Manufacturing Micro Assembly and Packaging Soft Lithography In every smart product designed today, one can consider an element that will increase efficiency, versatility, reduce power consumption, reduce waste, increase lifetime of the product and thus be environmentally friendly. For this purpose, AGS-TECH is focusing on a number of processes and products that can be incorporated into devices and equipment to achieve these goals. For example low-friction FUNCTIONAL COATINGS can reduce power consumption. Some other functional coating examples are scratch resistant coatings, anti-wetting SURFACE TREATMENTS and coatings (hydrophobic), wetness promoting (hydrophilic) surface treatment and coatings, anti-fungal coatings, diamond like carbon coatings for cutting and scribing tools, THIN FILMelectronic coatings, thin film magnetic coatings, multilayer optical coatings. In NANOMANUFACTURING or NANOSCALE MANUFACTURING, we produce parts at nanometer length scales. In practice it refers to manufacturing operations below micrometer scale. Nanomanufacturing is still in its infancy when compared to micromanufacturing, however the trend is in that direction and nanomanufacturing is definitely very important for the near future. Some applications of nanomanufacturing today are carbon nanotubes as reinforcing fibers for composite materials in bicycle frames, baseball bats and tennis racquets. Carbon nanotubes, depending on the orientation of the graphite in the nanotube, can act as semiconductors or conductors. Carbon nanotubes have very high current-carrying capability, 1000 times higher than silver or copper. Another application of nanomanufacturing is nanophase ceramics. By using nanoparticles in producing ceramic materials, we can simultaneously increase both the strength and ductility of the ceramic. Please click on the submenu for more information. MICROSCALE MANUFACTURING or MICROMANUFACTURING refers to our manufacturing and fabrication processes on a microscopic scale not visible to the naked eye. The terms micromanufacturing, microelectronics, microelectromechanical systems are not limited to such small length scales, but instead, suggest a material and manufacturing strategy. In our micromanufacturing operations some popular techniques we use are lithography, wet and dry etching, thin film coating. A wide variety of sensors & actuators, probes, magnetic hard-drive heads, microelectronic chips, MEMS devices such as accelerometers and pressure sensors among others are manufactured using such micromanufacturing methods. You will find more detailed information on these in the submenus. MESOSCALE MANUFACTURING or MESOMANUFACTURING refers to our processes for fabrication of miniature devices such as hearing aids, medical stents, medical valves, mechanical watches and extremely small motors. Mesoscale manufacturing overlaps both macro and micromanufacturing. Miniature lathes, with 1.5 Watt motor and dimensions of 32 x 25 x 30.5 mm and weights of 100 grams have been fabricated using mesoscale manufacturing methods. Using such lathes, brass has been machined to a diameter as small as 60 microns and surface roughnesses in the order of a micron or two. Other such miniature machine tools such as milling machines and presses have also been manufactured using mesomanufacturing. In MICROELECTRONICS MANUFACTURING we use the same techniques as in micromanufacturing. Our most popular substrates are silicon, and others like gallium arsenide, Indium Phosphide and Germanium are also used. Films/coatings of many types and especially conducting and insulating thin film coatings are used in the fabrication of microelectronic devices and circuits. These devices are usually obtained from multilayers. Insulating layers are generally obtained by oxidation such as SiO2. Dopants (both p and n) type are common and parts of the devices are doped in order to alter their electronic properties and obtain p and n type regions. Using lithography such as ultraviolet, deep or extreme ultraviolet photolithography, or X-ray, electron beam lithography we transfer geometric patterns defining the devices from a photomask/mask to the substrate surfaces. These lithography processes are applied several times in the micromanufacturing of microelectronic chips in order to achieve the required structures in the design. Also etching processes are carried out by which entire films or particular sections of films or substrate are removed. Briefly, by using various deposition, etching and multiple lithographic steps we obtain the multilayer structures on the supporting semiconductor substrates. After the wafers are processed and many circuits are microfabricated on them, the repetitive parts are cut and individual dies are obtained. Each die is thereafter wire bonded, packaged and tested and becomes a commercial microelectronic product. Some more details of microelectronics manufacturing can be found in our submenu, however the subject is very extensive and therefore we encourgae you to contact us in case you need product specific information or more details. Our MICROFLUIDICS MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In microfluidics we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. We have the capability to design microfluidic devices for you and offer microfluidics prototyping & micromanufacturing custom tailored for your applications. Another promising field in microfabrication is MICRO-OPTICS MANUFACTURING. Micro-optics allows the manipulation of light and the management of photons with micron and sub-micron scale structures and components. Micro-optics allows us to interface the macroscopic world we live in with the microscopic world of opto- and nano-electronic data processing. Micro-optical components and subsystems find widespread applications in the following fields: Information technology: In micro-displays, micro-projectors, optical data storage, micro-cameras, scanners, printers, copiers…etc. Biomedicine: Minimally-invasive/point of care diagnostics, treatment monitoring, micro-imaging sensors, retinal implants. Lighting: Systems based on LEDs and other efficient light sources Safety and Security Systems: Infrared night vision systems for automotive applications, optical fingerprint sensors, retinal scanners. Optical Communication & Telecommunication: In photonic switches, passive fiber optic components, optical amplifiers, mainframe and personal computer interconnect systems Smart structures: In optical fiber-based sensing systems and much more As the most diverse engineering integration provider we pride ourselves with our capability to provide a solution for almost any consulting, engineering, reverse engineering, rapid prototyping, product development, manufacturing, fabrication and assembly needs. After micromanufacturing our components, very often we need to continue with MICRO ASSEMBLY & PACKAGING. This involves processes such as die attachment, wire bonding, connectorization, hermetic sealing of packages, probing, testing of packaged products for environmental reliability…etc. After micromanufacturing devices on a die, we attach the die to a more rugged foundation to ensure reliability. Frequently we use special epoxy cements or eutectic alloys to bond the die to its package. After the chip or die is bonded to its substrate, we connect it electrically to the package leads using wire bonding. One method is to use very thin gold wires from the package leads to bonding pads located around the perimeter of the die. Lastly we need to do the final packaging of the connected circuit. Depending on the application and operating environment, a variety of standard and custom manufactured packages are available for micromanufactured electronic, electro-optic, and microelectromechanical devices. Another micromanufacturing technique we use is SOFT LITHOGRAPHY, a term used for a number of processes for pattern transfer. A master mold is needed in all cases and is microfabricated using standard lithography methods. Using the master mold, we produce an elastomeric pattern / stamp. One variation of soft lithography is “microcontact printing”. The elastomer stamp is coated with an ink and pressed against a surface. The pattern peaks contact the surface and a thin layer of about 1 monolayer of the ink is transfered. This thin film monolayer acts as the mask for selective wet etching. A second variation is “microtransfer molding”, in which the recesses of the elastomer mold are filled with liquid polymer precursor and pushed against a surface. Once the polymer cures, we peel off the mold, leaving behind the desired pattern. Lastly a third variation is “micromolding in capillaries”, where the elastomer stamp pattern consists of channels that use capillary forces to wick a liquid polymer into the stamp from its side. Basically, a small amount of the liquid polymer is placed adjacent to the capillary channels and the capillary forces pull the liquid into the channels. Excess liquid polymer is removed and polymer inside the channels is allowed to cure. The stamp mold is peeled off and the product is ready. You can find more details about our soft lithography micromanufacturing techniques by clicking on the related submenu on the side of this page. If you are mostly interested in our engineering and research & development capabilities instead of manufacturing capabilities, then we invite you to also visit our engineering website http://www.ags-engineering.com Read More Read More Read More Read More Read More Read More Read More Read More Read More CLICK Product Finder-Locator Service PREVIOUS PAGE

Clutch, Brake, Friction Clutches, Belt Clutch, Dog Clutch, Hydraulic Clutch, Electromagnetic Clutch, Overruning Clutch, Wrap Spring Clutch, Frictional Brake Clutch & Brake Assembly CLUTCHES are a type of coupling that permit shafts to be connected or disconnected as desired. A CLUTCH is a mechanical device that transmits power and motion from one component (the driving member) to another (the driven member) when engaged, but can be disengaged when desired. Clutches are used whenever the transmission of power or motion needs to be controlled either in amount or over time (for example electric screwdrivers use clutches to limit how much torque is transmitted through; automobile clutches control transmitted engine power to the wheels). In simplest applications, clutches are employed in devices which have two rotating shafts (drive shaft or line shaft). In these devices, one shaft is typically attached to a motor or other type of power unit (the driving member) while the other shaft (the driven member) provides output power for work to be done. As an example, in a torque-controlled drill, one shaft is driven by a motor and the other drives a drill chuck. The clutch connects the two shafts so that they may be locked together and spin at the same speed (engaged), locked together but spinning at different speeds (slipping), or unlocked and spinning at different speeds (disengaged). We offer the following types of clutches: FRICTION CLUTCHES: - Multiple plate clutch - Wet & dry - Centrifugal - Cone clutch - Torque limiter BELT CLUTCH DOG CLUTCH HYDRAULIC CLUTCH ELECTROMAGNETIC CLUTCH OVERRUNING CLUTCH (FREEWHEEL) WRAP-SPRING CLUTCH Contact us for clutch assemblies to be used in your manufacturing line for motorcycles, automobiles, trucks, trailers, lawn movers, industrial machines...etc. BRAKES: A BRAKE is a mechanical device inhibiting motion. Most commonly brakes use friction to convert kinetic energy into heat, though other methods of energy conversion may also be employed. Regenerative braking converts much of the energy to electrical energy, which may be stored in batteries for later use. Eddy current brakes use magnetic fields to convert kinetic energy into electric current in the brake disc, fin, or rail, which is subsequently converted into heat. Other methods of brake systems convert kinetic energy into potential energy in such stored forms as pressurized air or pressurized oil. There are braking methods that transform kinetic energy into different forms, such as transferring the energy to a rotating flywheel. Generic Types of brakes we offer are: FRICTIONAL BRAKE PUMPING BRAKE ELECTROMAGNETIC BRAKE We have the capability to design and fabricate custom clutch and break systems tailored to your application. - Download our catalog for Powder Clutches and Brakes and Tension Control System by CLICKING HERE - Download our catalog for Non-Excited Brakes by CLICKING HERE Click on the links below to download our catalog for: - Air Disk and Air Shaft Brakes & Clutches and Safety Disc Spring Brakes - pages 1 to 35 - Air Disk and Air Shaft Brakes & Clutches and Safety Disc Spring Brakes - pages 36 to 71 - Air Disk and Air Shaft Brakes & Clutches and Safety Disc Spring Brakes - pages 72 to 86 - Electromagnetic Clutch and Brakes CLICK Product Finder-Locator Service PREVIOUS PAGE