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Soft Lithography - Microcontact Printing - Microtransfer Molding - Micromolding in Capillaries - AGS-TECH Inc. - NM - USA Мека литографија SOFT LITHOGRAPHY is a term used for a number of processes for pattern transfer. A master mold is needed in all cases and is microfabricated using standard lithography methods. Using the master mold, we produce an elastomeric pattern / stamp to be used in soft lithography. Elastomers used for this purpose need to be chemically inert, have good thermal stability, strength, durability, surface properties and be hygroscopic. Silicone rubber and PDMS (Polydimethylsiloxane) are two good candidate materials. These stamps can be used many times in soft lithography. One variation of soft lithography is MICROCONTACT PRINTING. The elastomer stamp is coated with an ink and pressed against a surface. The pattern peaks contact the surface and a thin layer of about 1 monolayer of the ink is transferred. This thin film monolayer acts as the mask for selective wet etching. A second variation is MICROTRANSFER MOLDING, in which the recesses of the elastomer mold are filled with liquid polymer precursor and pushed against a surface. Once the polymer cures after microtransfer molding, we peel off the mold, leaving behind the desired pattern. Lastly a third variation is MICROMOLDING IN CAPILLARIES, where the elastomer stamp pattern consists of channels that use capillary forces to wick a liquid polymer into the stamp from its side. Basically, a small amount of the liquid polymer is placed adjacent to the capillary channels and the capillary forces pull the liquid into the channels. Excess liquid polymer is removed and polymer inside the channels is allowed to cure. The stamp mold is peeled off and the product is ready. If the channel aspect ratio is moderate and the channel dimensions allowed depend on the liquid used, good pattern replication can be assured. The liquid used in micromolding in capillaries can be thermosetting polymers, ceramic sol-gel or suspensions of solids within liquid solvents. The micromolding in capillaries technique has been used in sensor manufacturing. Soft lithography is used to construct features measured on the micrometer to nanometer scale. Soft lithography has advantages over other forms of lithography like photolithography and electron beam lithography. The advantages include the following: • Lower cost in mass production than traditional photolithography • Suitability for applications in biotechnology and plastic electronics • Suitability for applications involving large or nonplanar (nonflat) surfaces • Soft lithography offers more pattern-transferring methods than traditional lithography techniques (more ''ink'' options) • Soft lithography does not need a photo-reactive surface to create nanostructures • With soft lithography we can achieve smaller details than photolithography in laboratory settings (~30 nm vs ~100 nm). The resolution depends on the mask used and can reach values down to 6 nm. MULTILAYER SOFT LITHOGRAPHY is a fabrication process in which microscopic chambers, channels, valves and vias are molded within bonded layers of elastomers. Using multilayer soft lithography devices consisting of multiple layers may be fabricated from soft materials. The softness of these materials allows the device areas to be reduced by more than two orders of magnitude compared with silicon-based devices. The other advantages of soft lithography, such as rapid prototyping, ease of fabrication, and biocompatibility, are also valid in multilayer soft lithography. We use this technique to build active microfluidic systems with on-off valves, switching valves, and pumps entirely out of elastomers. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

AGS-TECH, Inc. is a global manufacturer of fasteners and rigging hardware including shackles, eye bolt and nut, turnbuckles, wire rope clip, hooks, load binder, steel and synthetic plastic wires, cables and ropes, traditional ropes from manila, polyhemp, sisal, cotton, link chains, steel chain and more. Сврзувачки елементи, Производство на хардвер за местење For information on our manufacturing capabilities of fasteners, you may visit our dedicated page by clicking here: Go to Fasteners Page However, if you are looking for Rigging Hardware, then continue reading and scroll down this page please. Rigging Hardware Rigging hardware is an essential component in any hoisting, lifting, fastening system involving ropes, belts, chains...etc. The quality, strength, durability, lifetime and overall reliability of rigging hardware can be a bottleneck, a limiting factor if the right product of high quality is not chosen for your systems, no matter how good the other components are. You can think of it like a chain, where a single damaged chain link can potentially cause failure of the entire chain. Our rigging hardware products include many items such as cable gliders, clevises, fittings, hooks, shackles, snap hooks, connecting links, swivels, grab links, wire rope clips and much more. Prices of fasteners and rigging hardware components depend on product, model and quantity of your order. It also depends on whether you need an off-the-shelf product or need us to custom manufacture the fasteners and rigging hardware components to your specifications, drawings and needs. Since we carry a wide variety of fasteners and rigging hardware with different dimensions, applications, material grade and coating; in case you can't find a suitable product below in one of our catalogs, we encourage you to email or call us so we can determine which product is the best fit for you. When contacting us, please make sure to provide us some of the following key information: - Application for the fasteners or rigging hardware product - Material grade needed for your fasteners & rigging hardware components - Dimensions - Finish - Packaging requirements - Labeling requirements - Quantity per order / Yearly demand Please download our relevant product brochures by clicking on the colored links below: Standard Rigging Hardware - Shackles Standard Rigging Hardware - Eye Bolt and Nut Standard Rigging Hardware - Turnbuckles Standard Rigging Hardware - Wire Rope Clip Standard Rigging Hardware - Hooks Standard Rigging Hardware - Load Binder Standard Rigging Hardware - New Products Standard Rigging Hardware - Stainless Steel Standard Rigging Hardware - Steel Wires - Steel Wire Ropes and Cables Standard Rigging Hardware - Synthetic Plastic Ropes Standard Rigging Hardware - Traditional-Ropes-Manila-Polyhemp-Sisal-Cotton LINK CHAINS have torus shaped links. They are used in bicycle locks, as locking chains, sometimes as pulling & hoisting chains and similar applications. Here is our downloadable product brochure for off-the-shelf link chains: Link Chains - Steel Chains - International Chains - Stainless Steel Chains and Accessories КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

LED Assemblies, Light Emitting Diodes Power Supply, Plastic Molded Lenses LED склопови на производи LED склоп - задно светло за мотоцикл LED склопови на производи AGS-TECH Inc. склопи обликувани пластични компоненти со диоди што емитуваат светлина - задни светла за мотоцикли Задно светло на мотоцикл со вградени диоди што емитуваат светлина Водоотпорно LED напојување Моќни LED светлосни склопови Пакување на производот според барањата на клиентите AGS-TECH нуди прилагодено пакување за вашите произведени производи Собрание на LED PCB Производство на LED улично осветлување ЛЕД драјвер за затемнување на задниот раб Склопови на LED PCB LED склопови со висока моќност LED драјвер со висока моќност ПРЕТХОДНА СТРАНИЦА

Electrochemical Machining and Grinding - ECM - Reverse Electroplating - Custom Machining - AGS-TECH Inc. - NM - USA ECM обработка, електрохемиска обработка, мелење Some of the valuable NON-CONVENTIONAL MANUFACTURING processes AGS-TECH Inc offers are ELECTROCHEMICAL MACHINING (ECM), SHAPED-TUBE ELECTROLYTIC MACHINING (STEM), PULSED ELECTROCHEMICAL MACHINING (PECM), ELECTROCHEMICAL GRINDING (ECG), HYBRID MACHINING PROCESSES. ELECTROCHEMICAL MACHINING (ECM) is a non-conventional manufacturing technique where metal is removed by an electrochemical process. ECM is typically a mass production technique, used for machining extremely hard materials and materials that are difficult to machine using the conventional manufacturing methods. Electrochemical-machining systems we use for production are numerically controlled machining centers with high production rates, flexibility, perfect control of dimensional tolerances. Electrochemical machining is capable of cutting small and odd-shaped angles, intricate contours or cavities in hard and exotic metals like titanium aluminides, Inconel, Waspaloy, and high nickel, cobalt, and rhenium alloys. Both external and internal geometries can be machined. Modifications of the electrochemical machining process are used for operations like turning, facing, slotting, trepanning, profiling where the electrode becomes the cutting tool. The metal removal rate is only a function of ion exchange rate and is not affected by the strength, hardness or toughness of the workpiece. Unfortunately the method of electrochemical machining (ECM) is limited to electrically conductive materials. Another important point to consider deploying the ECM technique is to compare the mechanical properties of the produced parts with those produced by other machining methods. ECM removes material instead of adding it and therefore is sometimes referred to as ''reverse electroplating''. It resembles in some ways to electrical discharge machining (EDM) in that a high current is passed between an electrode and the part, through an electrolytic material removal process having a negatively charged electrode (cathode), a conductive fluid (electrolyte), and a conductive workpiece (anode). The electrolyte acts as the current carrier and is a highly conductive inorganic salt solution like sodium chloride mixed and dissolved in water or sodium nitrate. The advantage of ECM is that there is no tool wear. The ECM cutting tool is guided along the desired path close to the work but without touching the piece. Unlike EDM, however, no sparks are created. High metal removal rates and mirror surface finishes are possible with ECM, with no thermal or mechanical stresses being transferred to the part. ECM does not cause any thermal damage to the part and since there are no tool forces there is no distortion to the part and no tool wear, as would be the case with typical machining operations. In electrochemical machining cavity produced is the female mating image of the tool. In the ECM process, a cathode tool is moved into an anode workpiece. The shaped tool is generally made of copper, brass, bronze or stainless steel. The pressurized electrolyte is pumped at a high rate at a set temperature through the passages in the tool to the area being cut. The feed rate is the same as the rate of ''liquification'' of the material, and the electrolyte movement in the tool-workpiece gap washes metal ions away from the workpiece anode before they have a chance to plate onto the cathode tool. The gap between the tool and the workpiece varies between 80-800 micrometers and the DC power supply in the range 5 – 25 V maintains current densities between 1.5 – 8 A/mm2 of active machined surface. As electrons cross the gap, material from the workpiece is dissolved, as the tool forms the desired shape in the workpiece. The electrolytic fluid carries away the metal hydroxide formed during this process. Commercial electrochemical machines with current capacities between 5A and 40,000A are available. The material removal rate in electrochemical machining can be expressed as: MRR = C x I x n Here MRR=mm3/min, I=current in amperes, n=current efficiency, C=a material constant in mm3/A-min. The constant C depends on valence for pure materials. The higher the valence, the lower is its value. For most metals it is in between 1 and 2. If Ao denotes the uniform cross-sectional area being electrochemically machined in mm2, the feed rate f in mm/min can be expressed as: F = MRR / Ao Feed rate f is the speed the electrode is penetrating the workpiece. In the past there were problems of poor dimensional accuracy and environmentally polluting waste from electrochemical machining operations. These have largely been overcome. Some of the applications of electrochemical machining of high-strength materials are: - Die-Sinking operations. Die-sinking is machining forging – die cavities. - Drilling a jet engine turbine blades, jet-engine parts and nozzles. - Multiple small holes drilling. The electrochemical machining process leaves a burr-free surface. - Steam turbine blades can be machined within close limits. - For deburring of surfaces. In deburring, ECM removes metal projections left from the machining processes and so dulls sharp edges. Electrochemical machining process is fast and often more convenient than the conventional methods of deburring by hand or non-traditional machining processes. SHAPED-TUBE ELECTROLYTIC MACHINING (STEM) is a version of electrochemical machining process we use for drilling small diameter deep holes. A titanium tube is used as the tool which is coated with an electrically insulating resin to prevent the removal of material from other regions like the lateral faces of the hole and tube. We can drill hole sizes of 0.5 mm with depth-to-diameter ratios of 300:1 PULSED ELECTROCHEMICAL MACHINING (PECM): We use very high pulsed current densities in the order of 100 A/cm2. By using pulsed currents we eliminate the need for high electrolyte flow rates which poses limitations for the ECM method in mold and die fabrication. Pulsed electrochemical machining improves fatigue life and eliminates the recast layer left by the electrical discharge machining (EDM) technique on mold and die surfaces. In ELECTROCHEMICAL GRINDING (ECG) we combine the conventional grinding operation with electrochemical machining. The grinding wheel is a rotating cathode with abrasive particles of diamond or aluminum oxide that are metal bonded. The current densities range between 1 and 3 A/mm2. Similar to ECM, an electrolyte such as sodium nitrate flows and the metal removal in electrochemical grinding is dominated by the electrolytic action. Less than 5% of metal removal is by abrasive action of the wheel. The ECG technique is well suited for carbides and high-strength alloys, but not so much of a fit for die-sinking or mould making because the grinder may not easily access deep cavities. The material removal rate in electrochemical grinding can be expressed as: MRR = G I / d F Here MRR is in mm3/min, G is mass in grams, I is current in amperes, d is density in g/mm3 and F is Faraday’s constant (96,485 Coulombs/mole). The speed of penetration of the grinding wheel into workpiece can be expressed as: Vs = (G / d F) x (E / g Kp) x K Here Vs is in mm3/min, E is cell voltage in volts, g is wheel to workpiece gap in mm, Kp is coefficient of loss and K is electrolyte conductivity. The advantage of the electrochemical grinding method over conventional grinding is less wheel wear because less than 5% of the metal removal is by abrasive action of the wheel. There are similarities between EDM and ECM: 1. The tool and workpiece are separated by a very small gap without a contact in between them. 2. Both tool and material must be conductors of electricity. 3. Both techniques need high capital investment. Modern CNC machines are used 4. Both methods consume lots of electric power. 5. A conductive fluid is used as a medium between the tool and the work piece for ECM and a dielectric fluid for EDM. 6. The tool is fed continuously towards the workpiece to maintain a constant gap between them (EDM may incorporate intermittent or cyclic, typically partial, tool withdrawal). HYBRID MACHINING PROCESSES: We frequently take advantage of the benefits of hybrid machining processes where two or more different processes such as ECM, EDM….etc. are used in combination. This gives us the opportunity to overcome the shortcomings of one process by the other, and benefit from the advantages of each process. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Electronic Components, Diodes, Transistors - Resistors, Thermoelectric Cooler, Heating Elements, Capacitors, Inductors, Driver, Device Sockets and Adapters Електрични и електронски компоненти и склопови As a custom manufacturer and engineering integrator, AGS-TECH can supply you the following ELECTRONIC COMPONENTS and ASSEMBLIES: • Active and passive electronic components, devices, subassemblies and finished products. We can either use the electronic components in our catalogs and brochures listed below or use your prefered manufacturers components in your electronic products assembly. Some of the electronic components and assembly can be custom tailored according to your needs and requirements. If your order quantities justify, we can have the manufacturing plant produce according to your specifications. You can scroll down and download our brochures of interest by clicking on highlighted text: Antenna Brochure for 5G - LTE 4G - LPWA 3G - 2G - GPS - GNSS - WLAN - BT - Combo - ISM Chip resistors Chip resistors product line Custom Specialized Cable Assemblies Brochure for Lighting, Touch Technology, Industrial Electronics, Security, White Goods, Aerospace, Military, Telecom, Medical & Sterilizable, Renewable Energy...etc. Diodes and rectifiers Disc capacitors catalog High frequency devices product line (Band Pass Filters, Low Pass Filters, IPD, CPL, Balanced Filter, Diplexer, Balun, Chip Antenna...etc.) Microwave Flexible Cable Assembly Microwave and Milimeter Wave Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Microwave Waveguides - Coaxial Components - Milimeterwave Antennas (Straight Waveguide, Waveguide Bend, Waveguide to Coaxial Adapter, Directional Couplers, Waveguide Tee, Circulators, Isolators......etc.) Multilayer ceramic capacitors MLCC catalog Multilayer ceramic capacitors MLCC product line Off-shelf interconnect components and hardware Precision RF Adapter s Catalog (Coax RF, Microwave, mmWave Adapters such as SMA, SSMA, SMP, BNC, Type-N, 3.5 mm.....etc) RF Components Brochure for Coaxial Fixed Attenuators, Coaxial Terminations, DC Blocks, Coax Adapters, Waveguide Components, Power Dividers, RF Connectors, RF Tools. RF devices and high frequency inductors (Multilayer Ceramic Capacitors, Chip-Resistor, Disc Capacitors, RF & HF Inductor Varistors & SMD-Varistors, Chip Antenna, Filters, Coupler) RF and Microwave Components (Broadband 90/180 Degree Hybrid and Coupler, Broadband Power Divider, Filter, RF switch, Broadband Amplifier, Broadband Frequency Synthesizer) RF Product Overview Chart (RF Antenna, Multilayer Ceramic Filter, Multilayer Ceramic Balun, Ceramic Diplexer) Soft Ferrites - Cores - Toroids - EMI Suppression Products - RFID Transponders and Accessories Brochure Terminal Blocks and Connectors Terminal Blocks General Catalogue Receptacles-Power Entry-Connectors Catalogue Vandal-Proof IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals Varistors Varistors product overview Yaren Model MOSFET - SCR - FRD - Voltage Control Devices - Bipolar Transistors Zeasset Model Electrolytic Capacitors • Other electronic components and assembly we have been providing are pressure sensors, temperature sensors, conductivity sensors, proximity sensors, humidity sensors, speed sensor, shock sensor, chemical sensor, inclination sensor, load cell, strain gauges. To download related catalogs and brochures of these, please click on colored text: Coding system for off-shelf strain gauges Digital Temperature Transmitter UTI2 Digital Temperature Transmitter UTI6 Din Rail Mounted Temperature Transmitters UTB11 Electronic Temperature Switch UTS2 Explosive Proof Temperature Transmitter UTB4 Integrated Temperature Transmitter UTB8 Intelligent Temperature Transmitter UTI5 Load cells, weight sensors, load gauges, transducers and transmitters Pressure sensors, pressure gauges, transducers and transmitters Process Automation Solutions (We private label these with your brand name and logo if you wish) Proximity sensors Sensors & Analytical Measurement Systems for Liquid Analysis (We private label these with your brand name and logo if you wish) Sensors & Analytical Measurement Systems for Optical OEM Applications in Liquid Analysis (We private label these with your brand name and logo if you wish) Sensors & Analytical Measurement Systems for pH Testing (We private label these with your brand name and logo if you wish) Smart Temperature Transmitter UTB-101 Sockets and accessories of proximity sensors Strain Gauges for Stress Analysis Temperature Humidity Transmitters Temperature Pressure Integration Transmitter UTB5 Thermal Resistor Temperature Transducer UTC1 (-50~+600 C) Thermal Resistor Temperature Transducer UTC2 (-40~+200 C) Wireless Digital Temperature Gauge UTI7 • Chip level micrometer scale tiny Microelectromechanical Systems (MEMS) based devices such as micropumps, micromirrors, micromotors, microfluidic devices. • Integrated Circuits (IC) • Switching elements, switch, relay, contactor, circuit breaker Contactors with UL and CE Certification NC1100111-1042532 Contactors with UL and CE Certification NC2100111-1044422 Contactors with UL and CE Certifications NC6100111-1040002 Definite Purpose Contactor with UL and CE Certifications NCK3100111-1052422 Electronic Overload Relay with UL and CE Certification NRE8100111-1143132 Miniature Circuit Breakers with UL and CE Certification NB1100111-1114242 Miniature Power Relay with UL and CE Certification JQX-10F100111-1153432 Miniature Power Relay with UL and CE Certifications JQX-13F100111-1154072 Miniature Power Relay with UL and CE Certification JTX100111-1155122 Miniature Power Relay with UL and CE Certification MK100111-1155402 Miniature Power Relay with UL and CE Certification NJX-13FW100111-1152352 Push button and rotary switches & control boxes Sub-Miniature Power Relay with UL and CE Certification JQC-3F100111-1153132 Thermal Overload Relay with UL and CE Certification NR2100111-1144062 • Electric fans and coolers for installation in electronic and industrial devices • Heating elements, thermoelectric coolers (TEC) Easy Click heat sinks Extruded heat sinks Heat sinks with Super Fins Standard heat sinks Super cooling plates Super Power heat sinks for medium - high power electronic systems Waterless cooling plates • We supply Electronic Enclosures for protection of your electronic components and assembly. Besides these off-shelf electronic enclosures, we do custom injection mold and thermoform electronic enclosures that fit your technical drawings. Please download from links below: Economic 17 Series Hand Held Enclosures Tibox Model Enclosures and Cabinets 01 Series Instrument Case System-I 02 Series Plastic and Aluminum Instrument Case Systems II 03 Series Plastic and Steel Enclosures 05 Series Instrument Case System-V 08 Series Plastic Cases 10 Series Sealed Plastic Enclosures 11 Series Die-cast Aluminium Boxes 14 Series PLC Enclosures 15 Series Modular Plastic Enclosures 16 Series DIN rail module enclosures 18 Series Special Plastic Enclosures 19 Series Desktop Enclosures 20 Series Wall-Mounting Enclosures 21 Series Card Reader Enclosures 24 Series DIN Plastic Enclosures 31 Series Potting and Power Supply Enclosures 37 Series Plastic Equipment Cases • Telecommunication and datacommunication products, lasers, receivers, transceivers, transponders, modulators, amplifiers. CATV products such as CAT3, CAT5, CAT5e, CAT6, CAT7 cables, CATV splitters. • Laser components and assembly • Acoustic components and assemblies, recording electronics - These catalogs contain only some brands we sell. We also have generic brand names and other brands with similar good quality for you to choose from. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM - Contact us for your special electronic assembly requests. We integrate various components & products and manufacture complex assemblies. We can either design it for you or assemble according to your design. Reference Code: OICASANLY КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Panel PC - Industrial Computer - Multitouch Displays - Janz Tec - AGS-TECH Inc. - NM - USA Панелен компјутер, дисплеи со повеќе допир, екрани на допир A subset of industrial PCs is the PANEL PC where a display, such as an LCD, is incorporated into the same enclosure as the motherboard and other electronics. These are typically panel mounted and often incorporate TOUCH SCREENS or MULTITOUCH DISPLAYS for interaction with users. They are offered in low cost versions with no environmental sealing, heavier duty models sealed to IP67 standards to be waterproof at the front panel and models which are explosion proof for installation into hazardous environments. Here you can download product literature of the brand names JANZ TEC, DFI-ITOX and others we have in stock. CLICK ON BLUE COLORED TEXT BELOW TO DOWNLOAD PRODUCT BROCHURES AND CATALOGS: - Catalog for Vandal-Proof IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals - DFI-ITOX brand Panel PC brochure - DFI-ITOX brand Industrial Touch Monitors - ICP DAS brand Industrial Touch Pad brochure - JANZ TEC brand compact product brochure - Kiosk Systems (We private label these with your brand name and logo if you wish) - Kiosk Systems Accessories Guide (We private label these with your brand name and logo if you wish) - Mobile Computers for Enterprises (We private label these with your brand name and logo if you wish) To choose a suitable panel PC for your project, please go to our industrial computer store by CLICKING HERE. Our JANZ TEC brand scalable product series of emVIEW systems offers a wide spectrum of processor performance and display sizes from 6.5'' up to currently 19''. Custom tailored solutions for optimal adaptation to your task definition can be implemented by us. Some of our popular panel PC products are: HMI Systems and Fanless Industrial Display Solutions Multitouch Display Industrial TFT LCD Displays AGS-TECH Inc. as an established ENGINEERING INTEGRATOR and CUSTOM MANUFACTURER will offer you turn-key solutions in case you need to integrate our panel PCs with your equipment or in case you need our touch screen panels designed differently. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Glass and Ceramic Manufacturing, Hermetic Packages Seals and Bonding, Tempered Bulletproof Glass, Blow Moulding, Optical Grade Glass, Conductive Glass, Molding Формирање и обликување на стакло и керамика The type of glass manufacturing we offer are container glass, glass blowing, glass fiber & tubing & rod, domestic and industrial glassware, lamp and bulb, precision glass moulding, optical components and assemblies, flat & sheet & float glass. We perform both hand forming as well as machine forming. Our popular technical ceramic manufacturing processes are die pressing, isostatic pressing, hot isostatic pressing, hot pressing, slip casting, tape casting, extrusion, injection moulding, green machining, sintering or firing, diamond grinding, hermetic assemblies. We recommend that you click here to DOWNLOAD our Schematic Illustrations of Glass Forming and Shaping Processes by AGS-TECH Inc. DOWNLOAD our Schematic Illustrations of Technical Ceramic Manufacturing Processes by AGS-TECH Inc. These downloadable files with photos and sketches will help you better understand the information we are providing you below. • CONTAINER GLASS MANUFACTURE: We have automated PRESS AND BLOW as well as BLOW AND BLOW lines for manufacturing. In the blow and blow process we drop a gob into blank mold and form the neck by applying a blow of compressed air from top. Immediately following this, compressed air is blown a second time from the other direction through the container neck to form the pre-form of the bottle. This pre-form is then transferred to the actual mold, reheated to soften and compressed air is applied to give the pre-form its final container shape. More explicitly, it is pressurized and pushed against the walls of the blow mold cavity to take its desired shape. Finally, the manufactured glass container is transfered into an annealing oven for subsequent reheating and removal of stresses produced during the molding and is cooled in a controlled fashion. In the press and blow method, molten gobs are put into a parison mold (blank mold) and pressed into the parison shape (blank shape). The blanks are then transfered to blow molds and blown similar to the process described above under “Blow and Blow Process”. Subsequent steps like annealing and stress relieve are similar or the same. • GLASS BLOWING : We have been manufacturing glass products using conventional hand blowing as well as using compressed air with automated equipment. For some orders conventional blowing is necessary, such as projects involving glass art work, or projects that require a smaller number of parts with loose tolerances, prototyping / demo projects….etc. Conventional glass blowing involves the dipping of a hollow metal pipe into a pot of molten glass and rotating the pipe for collecting some amount of the glass material. The glass collected on the tip of the pipe is rolled on flat iron, shaped as desired, elongated, re-heated and air blown. When ready, it is inserted into a mould and air is blown. The mould cavity is wet to avoid contact of the glass with metal. The water film acts like a cushion between them. Manual blowing is a labor intensive slow process and only suitable for prototyping or items of high value, not suitable for inexpensive per piece high volume orders. • MANUFACTURING OF DOMESTIC & INDUSTRIAL GLASSWARE : Using various types of glass material a large variety of glassware is being produced. Some glasses are heat resistant and suitable for laboratory glassware whereas some are good enough for withstanding dishwashers for many times and are fit for making domestic products. Using Westlake machines tens of thousands of pieces of drinking glasses are being produced per day. To simplify, molten glass is collected by vacuum and inserted into moulds to make the pre-forms. Then air is blown into the moulds, these are transfered to another mould and air is blown again and the glass takes its final shape. Like in hand blowing, these moulds are kept wet with water. Further stretching is part of the finishing operation where the neck is being formed. Excess glass is burnt off. Thereafter the controlled re-heating and cooling process described above follows. • GLASS TUBE & ROD FORMING : The main processes we use for manufacturing of glass tubes are the DANNER and VELLO processes. In the Danner Process, glass from a furnace flows and falls on an inclined sleeve made of refractory materials. The sleeve is carried on a rotating hollow shaft or blowpipe. The glass is then wrapped around the sleeve and forms a smooth layer flowing down the sleeve and over the tip of the shaft. In the case of tube forming, air is blown through a blowpipe with hollow tip, and in the case of rod forming we use solid tips on the shaft. The tubes or rods are then drawn over carrying rollers. The dimensions like wall thickness and diameter of the glass tubes are adjusted to desired values by setting the diameter of the sleeve and blowing air pressure to a desired value, adjusting the temperature, rate of flow of glass and speed of drawing. The Vello glass tube manufacturing process on the other hand involves glass that travels out a furnace and into a bowl with a hollow mandrel or bell. The glass then goes through the air space between the mandrel and the bowl and takes the shape of a tube. Thereafter it travels over rollers to a drawing machine and is cooled. At the end of the cooling line cutting and final processing takes place. The tube dimensions can be adjusted just like in the Danner process. When comparing the Danner to Vello process, we can say that Vello process is a better fit for large quantity production whereas the Danner process may be a better fit for precise smaller volume tube orders. • PROCESSING OF SHEET & FLAT & FLOAT GLASS : We have large quantities of flat glass in thicknesses ranging from submilimeter thicknesses to several centimeters. Our flat glasses are of almost optical perfection. We offer glass with special coatings such as optical coatings, where chemical vapor deposition technique is used to put coatings such as antireflection or mirror coating. Also transparent conductive coatings are common. Also available are hydrophobic or hydrophilic coatings on glass, and coating that makes glass self-cleaning. Tempered, bulletproof and laminated glasses are yet other popular items. We cut glass into desired shape with desired tolerances. Other secondary operations such as curving or bending flat glass are available. • PRECISION GLASS MOLDING : We use this technique mostly for manufacturing precision optical components without the need for more expensive and time consuming techniques like grinding, lapping and polishing. This technique is not always sufficient for making the best of the best optics, but in some cases like consumer products, digital cameras, medical optics it can be a less expensive good option for high volume manufacturing. Also it has an advantage over the other glass forming techniques where complex geometries are required, such as in the case of aspheres. The basic process involves loading of the lower side of our mold with the glass blank, evacuation of the process chamber for oxygen removal, near closing of the mold, fast and isothermal heating of die and glass with infrared light, further closing of the mould halves to press the softened glass slowly in a controlled fashion to the desired thickness, and finally cooling of the glass and filling the chamber with nitrogen and removal of the product. Precise temperature control, mould closure distance, mould closure force, matching the coefficients of expansion of the mold and glass material are key in this process. • MANUFACTURE OF GLASS OPTICAL COMPONENTS AND ASSEMBLIES : Besides precision glass molding, there are a number of valuable processes we use for making high quality optical components and assemblies for demanding applications. Grinding, lapping and polishing of optical grade glasses in fine special abrasive slurries is an art and science for making optical lenses, prisms, flats and more. Surface flatness, waviness, smoothness and defect free optical surfaces require lots of experience with such processes. Small changes in environment can result in out of specification products and bring the manufacturing line to a stop. There are cases where a single wipe on the optical surface with a clean cloth can make a product meet the specifications or fail the test. Some popular glass materials used are fused silica, quartz, BK7. Also the assembly of such components requires specialized niche experience. Sometimes special glues are being used. However, sometimes a technique called optical contacting is the best choice and involves no material in between attached optical glasses. It consists of physically contacting flat surfaces to attach to each other without glue. In some cases mechanical spacers, precision glass rods or balls, clamps or machined metal components are being used to assemble the optical components at certain distances and with certain geometric orientations to each other. Let us examine some of our popular techniques for manufacturing high end optics. GRINDING & LAPPING & POLISHING : The rough shape of the optical component is obtained with grinding a glass blank. Thereafter lapping and polishing are carried out by rotating and rubbing the rough surfaces of the optical components against tools with desired surface shapes. Slurries with tiny abrasive particles and fluid are being poured in between the optics and the shaping tools. The abrasive particle sizes in such slurries can be chosen according to the degree of flatness desired. The deviations of critical optical surfaces from desired shapes are expressed in terms of wavelengths of the light being used. Our high precision optics have tenth of a wavelength (Wavelength/10) tolerances or even tighter is possible. Besides surface profile, the critical surfaces are scanned and evaluated for other surface features and defects such as dimensions, scratches, chips, pits, specks...etc. The tight control of environmental conditions in the optical manufacturing floor and extensive metrology and testing requirements with state-of-the-art equipment make this a challenging branch of industry. • SECONDARY PROCESSES IN GLASS MANUFACTURING: Again, we are only limited with your imagination when it comes to secondary and finishing processes of glass. Here we list some of them: -Coatings on glass (optical, electrical, tribological, thermal, functional, mechanical...). As an example we can alter surface properties of glass making it for example reflect heat so that it keeps building interiors cool, or make one side infrared absorbing using nanotechnology. This helps keep the inside of buildings warm because the outermost surface layer of glass will absorb the infrared radiation inside the building and radiate it back to the inside. -Etching on glass -Applied Ceramic Labeling (ACL) -Engraving -Flame polishing -Chemical polishing -Staining MANUFACTURING OF TECHNICAL CERAMICS • DIE PRESSING : Consists of uniaxial compaction of granular powders confined in a die • HOT PRESSING : Similar to die pressing but with the addition of temperature to enhance densification. Powder or compacted preform is placed into graphite die and uniaxial pressure is applied while the die is kept at high temperatures such as 2000 C. Temperatures can be different depending on the type of ceramic powder being processed. For complicated shapes and geometries other subsequent processing such as diamond grinding may be needed. • ISOSTATIC PRESSING : Granular powder or die pressed compacts are placed in airtight containers and then into a closed pressure vessel with liquid inside. Thereafter they are compacted by increasing the pressure vessel’s pressure. The liquid inside the vessel transfers the pressure forces uniformly over the entire surface area of the airtight container. The material is thus compacted uniformly and takes the shape of its flexible container and its internal profile and features. • HOT ISOSTATIC PRESSING : Similar to isostatic pressing, but in addition to pressurized gas atmosphere, we sinter the compact at high temperature. Hot isostatic pressing results in additional densification and increased strength. • SLIP CASTING / DRAIN CASTING : We fill the mould with a suspension of micrometer sized ceramic particles and carrier liquid. This mixture is called “slip”. The mould has pores and therefore the liquid in the mixture is filtered into the mould. As a result, a cast is formed on the inner surfaces of the mould. After sintering, the parts can be taken out of the mould. • TAPE CASTING : We manufacture ceramic tapes by casting ceramic slurries onto flat moving carrier surfaces. The slurries contain ceramic powders mixed with other chemicals for binding and carrying purposes. As the solvents evaporate dense and flexible sheets of ceramic are left behind which can be cut or rolled as desired. • EXTRUSION FORMING : As in other extrusion processes, a soft mixture of ceramic powder with binders and other chemicals is passed through a die to acquire its cross-sectional shape and is then cut at desired lengths. The process is performed with cold or heated ceramic mixtures. • LOW PRESSURE INJECTION MOLDING : We prepare a mixture of ceramic powder with binders and solvents and heat it to a temperature where it can easily be pressed and forced into the tool cavity. Once the moulding cycle is complete, the part is ejected and the binding chemical is burned off. Using injection molding, we can obtain intricate parts at high volumes economically. Holes that are a tiny fraction of a milimeter on a 10mm thick wall are possible, threads are possible without forther machining, tolerances as tight as +/- 0.5% are possible and even lower when parts are machined, wall thicknesses in the order of 0.5mm to a length of 12.5 mm are possible as well as wall thicknesses of 6.5mm to a length of 150mm. • GREEN MACHINING : Using the same metal machining tools, we can machine pressed ceramic materials while they are still soft like chalk. Tolerances of +/- 1% are possible. For better tolerances we use diamond grinding. • SINTERING or FIRING : Sintering makes full densification possible. Significant shrinkage occurs on the green compact parts, but this is not a big problem since we take into account these dimensional changes when we design the part and tooling. Powder particles are bonded together and porosity induced by the compaction process is removed to great extent.. • DIAMOND GRINDING : The World’s hardest material “diamond” is being used to grind hard materials like ceramics and precision parts are obtained. Tolerances in the micrometer range and very smooth surfaces are being achieved. Due to its expense, we only consider this technique when we really need it. • HERMETIC ASSEMBLIES are those that practically speaking do not allow any exchange of matter, solids, liquids or gases between interfaces. Hermetic sealing is airtight. For example hermetic electronic enclosures are those that keep the sensitive interior contents of a packaged device unharmed by moisture, contaminants or gases. Nothing is 100% hermetic, but when we speak of hermeticity we mean that in practical terms, that there is hermeticity to the extent that the leak rate is so low that the devices are safe under normal environmental conditions for very long times. Our hermetic assemblies consist of metal, glass and ceramic components, metal-ceramic, ceramic-metal-ceramic, metal-ceramic-metal, metal to metal, metal-glass, metal-glass-metal, glass-metal-glass, glass-metal and glass to glass and all other combinations of metal-glass-ceramic bonding. We can for example metal coat the ceramic components so they can be strongly bonded to other components in the assembly and have excellent sealing capability. We have the know-how of coating optical fibers or feedthroughs with metal and soldering or brazing them to the enclosures, so no gases pass or leak into the enclosures. Therefore they are used for manufacturing electronic enclosures to encapsulate sensitive devices and protect them from the outer atmosphere. Besides their excellent sealing characteristics, other properties such as the thermal expansion coefficient, deformation resistance, non-outgassing nature, very long lifetime, nonconductive nature, thermal insulation properties, antistatic nature...etc. make glass and ceramic materials the choice for certain applications. Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum and fluid control components can be found here: Hermetic Components Factory Brochure КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

We are a major supplier of high quality Wood Cutting Shaping Tools including Multi Angle Drill Bits, 3 Flute Router Bits, Wood Boring Bits, TCT Saw Blades, Router Bits, HSS Wood Turning Tools, Woodworker Chisel, Countersink for Wood, Woodworking Plane, Hinge Drilling Vix Bits, Jigsaw Blades, Auger Bits and more Алатки за сечење и обликување дрво Our wood cutting and shaping tools are widely used by professional carpenters, furniture production plants, forestry workers, hobby shops and many others. Please click on the highlighted text of wood cutting & shaping tools of interest below to download related brochure or catalog. We do have a wide spectrum of wood cutting & shaping tools suitable for almost any application. There is a wide variety of wood cutting & shaping tools with different dimensions, applications and material; it is impossible to present them all here. If you cannot find or if you are not sure which wood cutting and shaping tools will meet your expectations and requirements, email or call us so we can determine which product is the best fit for you. When contacting us, please try to provide us as much detail as possible such as your application, dimensions, material grade if you know, finishing requirements, packaging & labeling requirements and of course quantity of your planned order. Multi Angle Drill Bits New!! 3 Flute Router Bits New!! Wood Boring Bits TCT Saw Blades Router Bits HSS Wood Turning Tools Woodworker Chisel Countersinks for Wood Woodworking Plane Hinge Drilling Vix Bits Hollow Chisel Jigsaw Blades Reciprocating Saw Blade Auger Bits Wood Brad Drill Bits Multi-spur Bits Hinge Boring Bits Multi-boring Dowel Drills Forstner Bits Spade Bits (Flat Bits) Door Lock Drill Set Plug Cutters Private Label Abrasives (We can put your company name, logo, brand on these. In other words we offer you private label) Private Label Abrasives Ordering Instructions Guide Private Label Drill Bits (We can private label these drill bits with your company name and logo) Private Label Hand Tools for Every Industry This catalog contains some wood cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tool Accessories This brochure includes some wood cutting and shaping tools . We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry This catalog contains some wood cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Taps - Cutting Tools (We can private label these drill bits with your company name and logo) КЛИКНЕТЕ ТУКА за да ги преземете нашите технички способности и референтниот водич за специјализирани алатки за сечење, дупчење, мелење, обликување, обликување, полирање што се користат во медицински, стоматолошки, прецизни инструменти, печат на метал, обликување матрица и други индустриски апликации. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор Кликнете овде за да отидете во менито Алатки за сечење, дупчење, брусење, преклопување, полирање, коцки и обликување Уп. Шифра: OICASOSTAR

Glass Cutting Shaping Tools offered by AGS-TECH, Inc. We supply high quality diamond wheel series, diamond wheel for solar glass, diamond wheel for CNC machine, peripheral diamond wheel, cup & bowl shape diamond wheels, resin wheel series, polishing wheel series, felt wheel, stone wheel, coating removal wheel... Алатки за обликување на сечење стакло Please click on the Glass Cutting and Shaping Tools of interest below to download related brochure. Diamond Wheel Series Diamond Wheel for Solar Glass Diamond Wheel for CNC Machine Peripheral Diamond Wheel Cup & Bowl Shape Diamond Wheel Resin Wheel Series Polishing Wheel Series 10S Polishing Wheel Felt Wheel Stone Wheel Coating Removal Wheel BD Polishing Wheel BK Polishing Wheel 9R Ploshing Wheel Polishing Material series Cerium Oxide Series Glass Drill Series Glass Tool Series Other Glass Tools Glass Plier Glass Suction & Lifter Grinding Tool Power Tool UV,Testing Tool Sandblast Fittings Series Machine Fittings Series Cutting Discs Glass Cutters Ungrouped Price of our glass cutting shaping tools depends on model and quantity of order. If you would like us to design and/or manufacture glass cutting and shaping tools specifically for you, please either provide us detailed blueprints, or ask us for help. We will then design, prototype and manufacture them specially for you. Since we carry a wide variety of glass cutting, drilling, grinding, polishing and shaping products with different dimensions, applications and material; it is impossible to list them here. We encourage you to email or call us so we can determine which product is the best fit for you. When contacting us, please inform us about: - Intended application - Material grade preferred - Dimensions - Finishing requirements - Packaging requirements - Labeling requirements - Quantity of your planned order & estimated yearly demand Private Label Auto Glass Repair and Replacement Systems We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools for Every Industry This catalog contains a few glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tool Accessories This brochure includes some glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry This catalog contains some glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. КЛИКНЕТЕ ТУКА за да ги преземете нашите технички способности и референтниот водич за специјализирани алатки за сечење, дупчење, мелење, обликување, обликување, полирање што се користат во медицински, стоматолошки, прецизни инструменти, печат на метал, обликување матрица и други индустриски апликации. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор Кликнете овде за да отидете во менито Алатки за сечење, дупчење, брусење, преклопување, полирање, коцки и обликување Уп. Шифра: OICASANHUA

Joining & Assembly & Fastening Processes, Welding, Brazing, Soldering, Sintering, Adhesive Bonding, Press Fitting, Wave and Reflow Solder Process, Torch Furnace Процеси на спојување и склопување и прицврстување We join, assemble and fasten your manufactured parts and turn them into finished or semi-finished products using WELDING, BRAZING, SOLDERING, SINTERING, ADHESIVE BONDING, FASTENING, PRESS FITTING. Some of our most popular welding processes are arc, oxyfuel gas, resistance, projection, seam, upset, percussion, solid state, electron beam, laser, thermit, induction welding. Our popular brazing processes are torch, induction, furnace and dip brazing. Our soldering methods are iron, hot plate, oven, induction, dip, wave, reflow and ultrasonic soldering. For adhesive bonding we frequently use thermoplastics and thermo-setting, epoxies, phenolics, polyurethane, adhesive alloys as well as some other chemicals and tapes. Finally our fastening processes consist of nailing, screwing, nuts and bolts, riveting, clinching, pinning, stitching & stapling and press fitting. - Screws and Fasteners (Standard and Specialty) (Click on the blue text above to download the brochure. We can private label these for you. In other words, we can put your name and logo on these products) - Screws for Furniture and Wood (Click on the blue text above to download the brochure. We can private label these for you. In other words, we can put your name and logo on these products) - Screws for Window and Door (Click on the blue text above to download the brochure. We can private label these for you. In other words, we can put your name and logo on these products) • WELDING : Welding involves joining of materials by melting the work pieces and introducing filler materials, that also joins the molten weld pool. When the area cools, we obtain a strong joint. Pressure is applied in some cases. Contrary to welding, the brazing and soldering operations involve only the melting of a material with lower melting point between the workpieces, and workpieces do not melt. We recommend that you click here to DOWNLOAD our Schematic Illustrations of Welding Processes by AGS-TECH Inc. This will help you better understand the information we are providing you below. In ARC WELDING, we use a power supply and an electrode to create an electric arc that melts the metals. Welding point is protected by a shielding gas or vapor or other material. This process is popular for welding automotive parts and steel structures. In shelded metal arc welding (SMAW) or also known as stick welding, an electrode stick is brought close to the base material and an electric arc is generated between them. The electrode rod melts and acts as the filler material. The electrode also contains flux that acts as a layer of slag and gives off vapors that act as the shielding gas. These protect the weld area from environmental contamination. No other fillers are being used. The disadvantages of this process are its slowness, need to replace electrodes frequently, the need to chip away the residual slag originating from flux. A number of metals such as iron, steel, nickel, aluminum, copper…etc. Can be welded. Its advantages are its inexpensive tools and ease of use. Gas metal arc welding (GMAW) also known as metal-inert gas (MIG), we have continuous feeding of a consumable electrode wire filler and an inert or partially inert gas that flows around the wire against environmental contamination of the weld region. Steel, aluminum and other non-ferrous metals can be welded. The advantages of MIG are high welding speeds and good quality. The disadvantages are its complicated equipment and challenges faced in windy outdoor environments because we have to maintain the shielding gas around the welding area stable. A variation of GMAW is flux-cored arc welding (FCAW) which consists of a fine metal tube filled with flux materials. Sometimes the flux inside the tube is sufficient for protection from environmental contamination. Submerged Arc Welding (SAW) widely an automated process, involves continuous wire feeding and arc that is struck under a layer of flux cover. The production rates and quality are high, welding slag comes off easily, and we have a smoke free work environment. The disadvantage is that it can only be used to weld parts in certain positions. In gas tungsten arc welding (GTAW) or tungsten-inert gas welding (TIG) we use a Tungsten electrode along with a separate filler and inert or near inert gases. As we know Tungsten has a high melting point and it is a very suitable metal for very high temperatures. The Tungsten in TIG is not consumed contrary to the other methods explained above. A slow but a high quality welding technique advantageous over other techniques in welding of thin materials. Suitable for many metals. Plasma arc welding is similar but uses plasma gas to create the arc. The arc in plasma arc welding is relatively more concentrated in comparison to GTAW and can be used for a wider range of metal thicknesses at much higher speeds. GTAW and plasma arc welding can be applied to more or less same materials. OXY-FUEL / OXYFUEL WELDING also called oxyacetylene welding, oxy welding, gas welding is carried out using gas fuels and oxygen for welding. Since no electric power is used it is portable and can be used where there is no electricity. Using a welding torch we heat the pieces and the filler material to produce a shared molten metal pool. Various fuels can be used such as acetylene, gasoline, hydrogen, propane, butane…etc. In oxy-fuel welding we use two containers, one for the fuel and the other for oxygen. The oxygen oxidizes the fuel (burns it). RESISTANCE WELDING: This type of welding takes advantage of joule heating and heat is generated at the location where electric current is applied for a certain time. High currents are passed through the metal. Pools of molten metal are formed at this location. Resistance welding methods are popular due to their efficiency, little pollution potential. However disadvantages are equipment costs being relatively significant and the inherent limitation to relatively thin work pieces. SPOT WELDING is one major type of resistance welding. Here we join two or more overlapping sheets or work pieces by using two copper electrodes to clamp the sheets together and pass a high current through them. The material between the copper electrodes heats up and a molten pool is generated at that location. The current is then stopped and the copper electrode tips cool the weld location because the electrodes are water cooled. Applying the right amount of heat to the right material and thickness is key for this technique, because if applied wrongly the joint will be weak. Spot welding has the advantages of causing no significant deformation to workpieces, energy efficiency, ease of automation and outstanding production rates, and not requiring any fillers. The disadvantage is that since welding takes place at spots rather than forming a continuous seam, the overall strength can be relatively lower as compared to other welding methods. SEAM WELDING on the other hand produces welds at the faying surfaces of similar materials. The seam can be butt or overlap joint. Seam welding starts at one end and moves progressively to the other. This method also uses two electrodes from copper to apply pressure and current to the weld region. The disc shaped electrodes rotate with constant contact along the seam line and make a continuous weld. Here too, electrodes are cooled by water. The welds are very strong and reliable. Other methods are projection, flash and upset welding techniques. SOLID-STATE WELDING is a bit different than the previous methods explained above. Coalescence takes place at temperatures below the melting temperature of the metals joined and with no use of metal filler. Pressure may be used in some processes. Various methods are COEXTRUSION WELDING where dissimilar metals are extruded through the same die, COLD PRESSURE WELDING where we join soft alloys below their melting points, DIFFUSION WELDING a technique without visible weld lines, EXPLOSION WELDING for joining dissimilar materials, e.g. corrosion resistant alloys to structural steels, ELECTROMAGNETIC PULSE WELDING where we accelerate tubes and sheets by electromagnetic forces, FORGE WELDING that consists of heating the metals to high temperatures and hammering them together, FRICTION WELDING where with sufficient friction welding is performed, FRICTION STIR WELDING that involves a rotating non-consumable tool traversing the joint line, HOT PRESSURE WELDING where we press metals together at elevated temperatures below the melting temperature in vacuum or inert gases, HOT ISOSTATIC PRESSURE WELDING a process where we apply pressure using inert gases inside a vessel, ROLL WELDING where we join dissimilar materials by forcing them between two rotating wheels, ULTRASONIC WELDING where thin metal or plastic sheets are welded using high frequency vibrational energy. Our other welding processes are ELECTRON BEAM WELDING with deep penetration and fast processing but being an expensive method we consider it for special cases, ELECTROSLAG WELDING a method suitable for heavy thick plates and work pieces of steel only, INDUCTION WELDING where we use electromagnetic induction and heat our electrically conductive or ferromagnetic workpieces, LASER BEAM WELDING also with deep penetration and fast processing but an expensive method, LASER HYBRID WELDING that combines LBW with GMAW in the same welding head and capable of bridging gaps of 2 mm between plates, PERCUSSION WELDING that involves an electric discharge followed by forging the materials with applied pressure, THERMIT WELDING involving exothermic reaction between aluminum and iron oxide powders., ELECTROGAS WELDING with consumable electrodes and used with only steel in vertical position, and finally STUD ARC WELDING for joining stud to base material with heat and pressure. We recommend that you click here to DOWNLOAD our Schematic Illustrations of Brazing, Soldering and Adhesive Bonding Processes by AGS-TECH Inc This will help you better understand the information we are providing you below. • BRAZING : We join two or more metals by heating filler metals in between them above their melting points and using capillary action to spread. The process is similar to soldering but the temperatures involved to melt the filler are higher in brazing. Like in welding, flux does protect the filler material from atmospheric contamination. After cooling the workpieces are joined together. The process involves the following key steps: Good fit and clearance, proper cleaning of base materials, proper fixturing, proper flux and atmosphere selection, heating the assembly and finally the cleaning of brazed assembly. Some of our brazing processes are TORCH BRAZING, a popular method carried out manually or in an automated manner. It is suitable for low volume production orders and specialized cases. Heat is applied using gas flames near the joint being brazed. FURNACE BRAZING requires less operator skill and is a semi-automatic process suitable for industrial mass production. Both temperature control and control of the atmosphere in the furnace are advantages of this technique, because the former enables us to have controlled heat cycles and eliminate local heating as is the case in torch brazing, and the latter protects the part from oxidation. Using jigging we are capable to reduce manufacturing costs to a minimum. The disadvantages are high power consumption, equipment costs and more challenging design considerations. VACUUM BRAZING takes place in a furnace of vacuum. Temperature uniformity is maintained and we obtain flux free, very clean joints with very little residual stresses. Heat treatments can take place during vacuum brazing, because of the low residual stresses present during slow heating and cooling cycles. The major disadvantage is its high cost because the creation of vacuum environment is an expensive process. Yet another technique DIP BRAZING joins fixtured parts where brazing compound is applied to mating surfaces. Thereafter the fixtured parts are dipped into a bath of a molten salt such as Sodium Chloride (table salt) which acts as a heat transfer medium and flux. Air is excluded and therefore no oxide formation takes place. In INDUCTION BRAZING we join materials by a filler metal that has a lower melting point than the base materials. The alternating current from the induction coil creates an electromagnetic field which induces induction heating on mostly ferrous magnetic materials. The method provides selective heating, good joints with fillers only flowing in desired areas, little oxidation because no flames are present and cooling is fast, fast heating, consistency and suitability for high volume manufacturing. To speed up our processes and to assure consistency we frequently use preforms. Information on our brazing facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum and fluid control components can be found here: Brazing Factory Brochure Brazing Machines (We private label these with your brand name and logo if you wish. This way you can promote your brand name when you resell these machines to your customers) • SOLDERING : In soldering we do not have melting of the work pieces, but a filler metal with a lower melting point than the joining parts that flows into the joint. The filler metal in soldering melts at lower temperature than in brazing. We use lead-free alloys for soldering and have RoHS compliance and for different applications and requirements we have different and suitable alloys such as silver alloy. Soldering offers us joints that are gas and liquid-tight. In SOFT SOLDERING, our filler metal has a melting point below 400 Centigrade, whereas in SILVER SOLDERING and BRAZING we need higher temperatures. Soft soldering uses lower temperatures but does not result in strong joints for demanding applications at elevated temperatures. Silver soldering on the other hand, requires high temperatures provided by torch and gives us strong joints suitable for high temperature applications. Brazing requires the highest temperatures and usually a torch is being used. Since brazing joints are very strong, they are a good candidates for repairing heavy iron objects. In our manufacturing lines we use both manual hand soldering as well as automated solder lines. INDUCTION SOLDERING uses high frequency AC current in a copper coil to facilitate induction heating. Currents are induced in the soldered part and as a result heat is generated at the high resistance joint. This heat melts the filler metal. Flux is also used. Induction soldering is a good method for soldering cyclinders and pipes in a continuous process by wrapping the coils around them. Soldering some materials such as graphite and ceramics is more difficult because it requires the plating of the workpieces with a suitable metal prior to soldering. This facilitates interfacial bonding. We do solder such materials especially for hermetic packaging applications. We manufacture our printed circuit boards (PCB) in high volume mostly using WAVE SOLDERING. Only for small quantity of prototyping purposes we use hand soldering using soldering iron. We use wave soldering for both through-hole as well as surface mount PCB assemblies (PCBA). A temporary glue keeps the components attached to the circuit board and the assembly is placed on a conveyor and moves through an equipment that contains molten solder. First the PCB is fluxed and then enters the preheating zone. The molten solder is in a pan and has a pattern of standing waves on its surface. When the PCB moves over these waves, these waves contact the bottom of the PCB and stick to the soldering pads. The solder stays on pins and pads only and not on the PCB itself. The waves in the molten solder has to be well controlled so there is no splashing and the wave tops do not touch and contaminate undesired areas of the boards. In REFLOW SOLDERING, we use a sticky solder paste to temporarily attach the electronic components to the boards. Then the boards are put through a reflow oven with temperature control. Here the solder melts and connects the components permanently. We use this technique for both surface mount components as well as for through-hole components. Proper temperature control and adjustment of oven temperatures is essential to avoid destruction of electronic components on the board by overheating them above their maximum temperature limits. In the process of reflow soldering we actually have several regions or stages each with a distinct thermal profile, such as preheating step, thermal soaking step, reflow and cooling steps. These different steps are essential for a damage free reflow soldering of printed circuit board assemblies (PCBA). ULTRASONIC SOLDERING is another frequently used technique with unique capabilities- It can be used to solder glass, ceramic and non-metallic materials. For example photovoltaic panels which are non-metallic need electrodes which can be affixed using this technique. In ultrasonic soldering, we deploy a heated soldering tip that also emits ultrasonic vibrations. These vibrations produce cavitation bubbles at the interface of the substrate with the molten solder material. The implosive energy of cavitation modifies the oxide surface and removes the dirt and oxides. During this time an alloy layer is also formed. The solder at the bonding surface incorporates oxygen and enables the formation of a strong shared bond between the glass and solder. DIP SOLDERING can be regarded as a simpler version of wave soldering suitable for only small scale production. First cleaning flux is applied as in other processes. PCBs with mounted components are dipped manually or in a semi-automated fashion into a tank containing molten solder. The molten solder sticks to the exposed metallic areas unprotected by solder mask on the board. The equipment is simple and inexpensive. • ADHESIVE BONDING : This is another popular technique we frequently use and it involves bonding of surfaces using glues, epoxies, plastic agents or other chemicals. Bonding is accomplished by either evaporating the solvent, by heat curing, by UV light curing, by pressure curing or waiting for a certain time. Various high performance glues are used in our production lines. With properly engineered application and curing processes, adhesive bonding can result in very low stress bonds that are strong and reliable. Adhesive bonds can be good protectors against environmental factors such as moisture, contaminants, corrosives, vibration…etc. Advantages of adhesive bonding are: they can be applied to materials that would otherwise be hard to solder, weld or braze. Also it can be preferable for heat sensitive materials that would be damaged by welding or other high temperature processes. Other advantages of adhesives are they can be applied to irregular shaped surfaces and increase assembly weight by very very small amounts when compared to other methods. Also dimensional changes in parts are very minimal. Some glues have index matching properties and can be used in between optical components without decreasing the light or optical signal strength significantly. Disadvantages on the other hand are longer curing times which may slow down manufacturing lines, fixturing requirements, surface preparation requirements and difficulty to disassemble when rework is needed. Most of our adhesive bonding operations involve the following steps: -Surface treatment: Special cleaning procedures such as deionized water cleaning, alcohol cleaning, plasma or corona cleaning are common. After cleaning we may apply adhesion promoters onto the surfaces to assure the best possible joints. -Part Fixturing: For both adhesive application as well as for curing we design and use custom fixtures. -Adhesive Application: We sometimes use manual, and sometimes depending on the case automated systems such as robotics, servo motors, linear actuators to deliver the adhesives to the right location and we use dispensers to deliver it at right volume and quantity. -Curing: Depending on the adhesive, we may use simple drying and curing as well as curing under UV lights that act as catalyst or heat curing in an oven or using resistive heating elements mounted on jigs and fixtures. Private Label Epoxy Solutions for Construction, Electrical, Industrial Assembly (Download brochure by clicking on blue text. We can put your name, label, logo on these epoxies if you wish) We recommend that you click here to DOWNLOAD our Schematic Illustrations of Fastening Processes by AGS-TECH Inc. This will help you better understand the information we are providing you below. • FASTENING PROCESSES : Our mechanical joining processes fall into two brad categories: FASTENERS and INTEGRAL JOINTS. Examples of fasteners we use are screws, pins, nuts, bolts, rivets. Examples of integral joints we use are snap and shrink fits, seams, crimps. Using a variety of fastening methods we make sure our mechanical joints are strong and reliable for many years of use. SCREWS and BOLTS are some of the most commonly used fasteners for holding objects together and positioning. Our screws and bolts meet ASME standards. Various types of screws and bolts are deployed including hex cap screws and hex bolts, lag screws and bolts, double ended screw, dowel screw, eye screw, mirror screw, sheet metal screw, fine adjustment screw, self-drilling and self-tapping screws, set screw, screws with built-in washers,…and more. We have various screw head types such as countersunk, dome, round, flanged head and various screw drive types such as slot, phillips, square, hex socket. A RIVET on the other hand is a permanent mechanical fastener consisting of a smooth cylindirical shaft and a head on the one hand. After insertion, the other end of the rivet is deformed and its diameter is expanded so that it stays in place. In other words, prior to installation a rivet has one head and after installation it has two. We install various types of rivets depending on application, strength, accessibility and cost such as solid/round head rivets, structural, semi-tubular, blind, oscar, drive, flush, friction-lock, self-piercing rivets. Riveting can be preferred in cases where heat deformation and change in material properties due to welding heat needs to be avoided. Riveting also offers light weight and especially good strength and endurance against shear forces. Against tensile loads however screws, nuts and bolts may be more suitable. In the CLINCHING process we use special punch and dies to form a mechanical interlock between sheet metals being joined. The punch pushes the layers of sheet metal into die cavity and results in the formation of a permanent joint. No heating and no cooling is required in clinching and it is a cold working process. It is an economical process that can replace spot welding in some cases. In PINNING we use pins which are machine elements used to secure positions of machine parts relative to each other. Major types are clevis pins, cotter pin, spring pin, dowel pins, and split pin. In STAPLING we use stapling guns and staples which are two-pronged fasteners used to join or bind materials. Stapling has the following advantages: Economical, simple and fast to use, the crown of the staples can be used to bridge materials butted together, The crown of the staple can facilitate bridging a piece like a cable and fastening it to a surface without puncturing or damaging, relatively easy removal. PRESS FITTING is performed by pushing parts together and the friction between them fastens the parts. Press fit parts consisting of an oversized shaft and an undersized hole are generally assembled by one of two methods: Either by applying force or taking advantage of thermal expansion or contraction of the parts. When a press fitting is established by applying a force, we either use a hydraulic press or a hand operated press. On the other hand when press fitting is established by thermal expansion we heat the enveloping parts and assemble them into their place while hot. When they cool they contract and get back to their normal dimensions. This results in a good press fit. We call this alternatively SHRINK-FITTING. The other way of doing this is by cooling the enveloped parts before assembly and then sliding them into their mating parts. When the assembly warms up they expand and we obtain a tight fit. This latter method may be preferable in cases where heating poses the risk of changing material properties. Cooling is safer in those cases. Pneumatic & Hydraulic Components and Assemblies • Valves, hydraulic and pneumatic components such as O-ring, washer, seals, gasket, ring, shim. Since valves and pneumatic components come in a large variety, we cannot list everything here. Depending on the physical and chemical environments of your application, we do have special products for you. Please specify us the application, type of component, specifications, environmental conditions such as pressure, temperature, liquids or gases that will be in contact with your valves and pneumatic components; and we will choose the most suitable product for you or manufacture it specially for your application. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

AGS-TECH supplies off-the-shelf and custom manufactured filters, filtration products and membranes including air purification filters, ceramic foam filters, activated carbon filters, HEPA filters, pre-filtering media and coarse filters, wire mesh and cloth filters, oil & fuel & gas filters. Филтри и производи за филтрирање и мембрани We supply filters, filtration products and membranes for industrial and consumer applications. Products include: - Activated carbon based filters - Planar wire mesh filters made to customer's specifications - Irregular shaped wire mesh filters made to customer's specifications. - Other type of filters such as air, oil, fuel filters. - Ceramic foam and ceramic membrane filters for various industrial applications in petrochemistry, chemical manufacturing, pharmaceuticals...etc. - High performance clean room and HEPA filters. We stock off-the-shelf wholesale filters, filtration products and membranes with various dimensions and specifications. We also manufacture and supply filters & membranes according to customers specifications. Our filter products comply with international standards such as CE, UL and ROHS standards. Please click on the links below to select the filtration product of your interest. Activated Carbon Filters Activated carbon also called activated charcoal, is a form of carbon processed to have small, low-volume pores that increase the surface area available for adsorption or chemical reactions. Due to its high degree of microporosity, just one gram of activated carbon has a surface area in excess of 1,300 m2 (14,000 sq ft). An activation level sufficient for useful application of activated carbon may be attained solely from high surface area; however, further chemical treatment often enhances adsorption properties. Activated carbon is widely used in filters for gas purification, filters for decaffeination, metal extraction & purification, filtration & purification of water, medicine, treatment of sewage, air filters in gas masks and respirators, compressed air filters, filtering of alcoholic beverages like vodka and whiskey from organic impurities which can affect taste, odor and color among many other applications. Activated carbon is being used in various types of filters, most commonly in panel filters, non-woven fabric, cartridge type filters....etc. You can download brochures of our activated carbon filters from the links below. - Air Purification Filters (includes folded type and V-shaped Activated Carbon Air Filters) Ceramic Membrane Filters Ceramic membrane filters are inorganic, hydrophilic, and are ideal for extreme nano-, ultra-, and micro-filtration applications that require longevity, superior pressure/temperature tolerances and resistance to aggressive solvents. Ceramic membrane filters are basically ultra-filtration or micro-filtration filters, used to treat wastewater and water at higher elevated temperatures. Ceramic membrane filters are produced from inorganic materials such as aluminum oxide, silicon carbide, titanium oxide, and zirconium oxide. The membrane porous core material is first formed through extrusion process which becomes the support structure for the ceramic membrane. Then coatings are applied to the inner face or the filtering face with the same ceramic particles or sometimes different particles, depending on the application. For example, if your core material is aluminum oxide, we also use aluminum oxide particles as the coating. The size of ceramic particles used for the coating, as well as the number of coating applied will determine the pore size of the membrane as well as the distribution characteristics. After depositing the coating to the core, high-temperature sintering takes place inside a furnace, making the membrane layer integral of the core support structure. This provides us a very durable and hard surface. This sintered bonding ensures a very long life for the membrane. We can custom manufacture ceramic membrane filters for you from micro-filtration range to ultra-filtration range by varying the number of coatings and by using the right particle size for the coating. Standard pore sizes can vary from 0.4 microns to .01 micron size. Ceramic membrane filters are like glass, very hard and durable, unlike polymeric membranes. Therefore ceramic membrane filters offer a very high mechanical strength. Ceramic membrane filters are chemically inert, and they can be used at a very high flux compared to polymeric membranes. Ceramic membrane filters can be vigorously cleaned and are thermally stable. Ceramic membrane filters have a very long operational life, roughly three to four times as long compared to the polymeric membranes. Compared to polymeric filters, ceramic filters are very expensive, because ceramic filtration applications start where the polymeric applications end. Ceramic membrane filters have various applications, mostly in treating very difficult to treat water and wastewater, or where high temperature operations are involved. It also has vast applications in oil and gas, wastewater recycling, as a pre‑treatment for RO, and for removing precipitated metals from any precipitation process, for oil & water separation, food and beverage industry, microfiltration of milk, clarification of fruit juice, reclamation and collection of nano powders and catalyzers, in the pharmaceutical industry, in mining where you have to treat the wasted tailing ponds. We offer single channel as well as multiple channel shaped ceramic membrane filters. Both off-the-shelf as well as custom manufacturing is offered to you by AGS-TECH Inc. Ceramic Foam Filters Ceramic foam filter is a tough foam made from ceramics . Open-cell polymer foams are internally impregnated with ceramic slurry and then fired in a kiln , leaving only ceramic material. The foams may consist of several ceramic materials such as aluminium oxide , a common high-temperature ceramic. Ceramic foam filters get insulating properties from the many tiny air-filled voids within the material. Ceramic foam filters are used for filtration of molten metal alloys, absorption of environmental pollutants , and as substrate for catalysts requiring large internal surface area. Ceramic foam filters are hardened ceramics with pockets of air or other gases trapped in pores throughout the body of the material. These materials can be fabricated as high as 94 to 96% air by volume with high temperature resistances such as 1700 °C. Since most ceramics are already oxides or other inert compounds, there is no danger of oxidation or reduction of the material in ceramic foam filters. - Ceramic Foam Filters Brochure - Ceramic Foam Filter User's Guide HEPA Filters HEPA is a type of air filter and the abbreviation stands for High-Efficiency Particulate Arrestance (HEPA). Filters meeting the HEPA standard have many applications in clean rooms, medical facilities, automobiles, aircraft and homes. HEPA filters must satisfy certain standards of efficiency such as those set by the United States Department of Energy (DOE). To qualify as HEPA by US government standards, an air filter must remove from the air that passes through 99.97% of particles that are sized 0.3 µm. HEPA filter's minimal resistance to airflow, or pressure drop, is generally specified as 300 pascals (0.044 psi) at its nominal flow rate. HEPA filtration works by mechanical means and does not resemble the Ionic and Ozone filtration methods which use negative ions and ozone gas respectively. Therefore, the chances of potential pulmonary side-effects like asthma and allergies is much lower with HEPA filtering systems. HEPA filters are also used in high quality vacuum cleaners effectively to protect users from asthma and allergies, because HEPA filter traps fine particles such as pollens and dust mite feces which trigger allergy and asthma symptoms. Contact us if you would like to get our opinion about using HEPA filters for a particular application or project. You can download our product brochures for off-the-shelf HEPA filters below. If you cannot find the right size or shape you would need we will be happy to design and manufacture custom HEPA filters for your special application. - Air Purification Filters (includes HEPA Filters) - Private Label Industrial Filters (We can put your company name and logo on these filters. Includes also HEPA filters) Coarse Filters & Pre-Filtering Media Coarse filters and pre-filtering media are used to block large debris. They are of critical importance because they are inexpensive and protect the more expensive higher grade filters from being contaminated with coarse particulates and contaminants. Without coarse filters and pre-filtering media, the cost of filtering would have been much much higher as we would need to change fine filters much more frequently. Most of our coarse filters and pre-filtering media are made of synthetic fibers with controlled diameters and pore sizes. Coarse filter materials include the popular material polyester. Filtering efficiency grade is an important parameter to check for before choosing a particular coarse filter / pre-filtering media. Other parameters and features to check for are whether the pre-filtering media is washable, reusable, arrestance value, resistance against air or fluid flow, rated air flow, dust and particulate holding capacity, temperature resistance, flammability, pressure drop characteristics, dimensional and shape related specification...etc. Contact us for opinion before choosing the right coarse filters & pre-filtering media for your products and systems. - Wire Mesh and Cloth Brochure (includes information on our wire mesh & cloth filters manufacturing capabilities. Metal and nonmetal wire cloth can be used as coarse filters and pre-filtering media in some applications) - Air Purification Filters (includes Coarse Filters & Pre-Filtering Media for air) Oil, Fuel, Gas, Air and Water Filters AGS-TECH Inc. designs and manufactures oil, fuel, gas, air and water filters according to customer's requirements for industrial machinery, automobiles, motorboats, motorcycles...etc. Oil filters are designed to remove contaminants from engine oil , transmission oil , lubricating oil , hydraulic oil . Oil filters are used in many different types of hydraulic machinery . Oil production, transportation industry, and recycling facilities also employ oil and fuel filters in their manufacturing processes. OEM orders are welcome, we label, silkscreen print, laser mark oil, fuel, gas, air and water filters according to your requirements, we put your logos on the product and package according to your needs and requirements. If desired, housing materials for your oil, fuel, gas, air, water filters can be customized depending on your particular application. Information about our standard off-the-shelf oil, fuel, gas, air and water filters can be downloaded below. - Air Purification Filters - Oil - Fuel - Gas - Air - Water Filters Selection Brochure for Automobiles, Motorcycles, Trucks and Buses - Private Label Industrial Filters (We can put your company name and logo on these filters) Membranes A membrane is a selective barrier; it allows some things to pass through but stops others. Such things may be molecules, ions, or other small particles. Generally, polymeric membranes are used to separate, concentrate, or fractionate a wide variety of liquids. Membranes serve as a thin barrier between miscible fluids that allow for preferential transport of one or more feed components when a driving force is applied, such as a pressure differential. We offer a suite of nanofiltration, ultrafiltration and microfiltration membranes that are engineered to provide optimal flux and rejection and can be customized to meet the unique requirements of specific process applications. Membrane filtration systems are the heart of many separation processes. Technology selection, equipment design, and fabrication quality are all critical factors in the ultimate success of a project. To start, the proper membrane configuration must be selected. Contact us for help in your projects. ПРЕТХОДНА СТРАНИЦА

Electronic Testers - Electrical Test Equipment - Electrical Properties Testing - Oscilloscope - Signal Generator - Function Generator - Pulse Generator - Frequency Synthesizer - Multimeter Електрична и електронска опрема за тестирање With the term ELECTRONIC TESTER we refer to test equipment that is used primarily for testing, inspection and analysis of electrical and electronic components and systems. We offer the most popular ones in the industry: POWER SUPPLIES & SIGNAL GENERATING DEVICES: POWER SUPPLY, SIGNAL GENERATOR, FREQUENCY SYNTHESIZER, FUNCTION GENERATOR, DIGITAL PATTERN GENERATOR, PULSE GENERATOR, SIGNAL INJECTOR METERS: DIGITAL MULTIMETERS, LCR METER, EMF METER, CAPACITANCE METER, BRIDGE INSTRUMENT, CLAMP METER, GAUSSMETER / TESLAMETER/ MAGNETOMETER, GROUND RESISTANCE METER ANALYZERS: OSCILLOSCOPES, LOGIC ANALYZER, SPECTRUM ANALYZER, PROTOCOL ANALYZER, VECTOR SIGNAL ANALYZER, TIME-DOMAIN REFLECTOMETER, SEMICONDUCTOR CURVE TRACER, NETWORK ANALYZER, PHASE ROTATION TESTER, FREQUENCY COUNTER You can purchase brand new, refurbished or used test equipment from us at the most competitive discounted prices. Simply choose the product from the downloadable catalogs and let us know the product name, product code and relevant information and we will send you our quote. Download by clicking on highlighted text: ANRITSU Electronic Measuring Instruments FLUKE Test Tools Catalog KEYSIGHT Basic Automotive Test Products KEYSIGHT Basic Instruments KEYSIGHT Bench and Power Products KEYSIGHT Network Analyzer Products KEYSIGHT Signal Generation Solutions KEYSIGHT Smart Bench Essentials Series Products KEYSIGHT High-Volume Traffic Generator Products KEYSIGHT Layer 4-7 Network Test Products KEYSIGHT Layer 2-3 Network Test Products KEYSIGHT Distribution Products Catalog MEGGER Low Voltage Test Tools Catalog MICROWAVE Flexible Cable Assembly MICROWAVE and MILIMETER WAVE Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Private Label Hand Tools for Every Industry (This catalog contains a few electrical & electronic test instruments. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers.) ROHDE SCHWARZ Benchtop Power Supplies Ideal for labs and system racks, galvanic isolation, floating channels, constant voltage or current modes, protection functions, parallel and serial operation, low ripple/noise, remote sensing option ROHDE SCHWARZ Test Equipment Catalog (Oscilloscopes, Power Supplies, Signal Generators, Handheld Analyzers, Spectrum Analyzers, Vector Network Analyzers, Meters & Counters) TEKTRONIX Product Catalog for Test and Measurement Solutions VANDAL-PROOF IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com Let us briefly go over some of these equipment in everyday use throughout the industry: The electrical power supplies we supply for metrology purposes are discrete, benchtop and stand-alone devices. The ADJUSTABLE REGULATED ELECTRICAL POWER SUPPLIES are some of the most popular ones, because their output values can be adjusted and their output voltage or current is maintained constant even if there are variations in input voltage or load current. ISOLATED POWER SUPPLIES have power outputs that are electrically independent of their power inputs. Depending on their power conversion method, there are LINEAR and SWITCHING POWER SUPPLIES. The linear power supplies process the input power directly with all their active power conversion components working in the linear regions, whereas the switching power supplies have components working predominantly in non-linear modes (such as transistors) and convert power to AC or DC pulses before processing. Switching power supplies are generally more efficient than linear supplies because they lose less power due to shorter times their components spend in the linear operating regions. Depending on application, a DC or AC power is used. Other popular devices are PROGRAMMABLE POWER SUPPLIES, where voltage, current or frequency can be remotely controlled through an analog input or digital interface such as an RS232 or GPIB. Many of them have an integral microcomputer to monitor and control the operations. Such instruments are essential for automated testing purposes. Some electronic power supplies use current limiting instead of cutting off power when overloaded. Electronic limiting is commonly used on lab bench type instruments. SIGNAL GENERATORS are another widely used instruments in lab and industry, generating repeating or non-repeating analog or digital signals. Alternatively they are also called FUNCTION GENERATORS, DIGITAL PATTERN GENERATORS or FREQUENCY GENERATORS. Function generators generate simple repetitive waveforms such as sine waves, step pulses, square & triangular and arbitrary waveforms. With Arbitrary waveform generators the user can generate arbitrary waveforms, within published limits of frequency range, accuracy, and output level. Unlike function generators, which are limited to a simple set of waveforms, an arbitrary waveform generator allows the user to specify a source waveform in a variety of different ways. RF and MICROWAVE SIGNAL GENERATORS are used for testing components, receivers and systems in applications such as cellular communications, WiFi, GPS, broadcasting, satellite communications and radars. RF signal generators generally work between a few kHz to 6 GHz, while microwave signal generators operate within a much wider frequency range, from less than 1 MHz to at least 20 GHz and even up to hundreds of GHz ranges using special hardware. RF and microwave signal generators can be classified further as analog or vector signal generators. AUDIO-FREQUENCY SIGNAL GENERATORS generate signals in the audio-frequency range and above. They have electronic lab applications checking of the frequency response of audio equipment. VECTOR SIGNAL GENERATORS, sometimes also referred to as DIGITAL SIGNAL GENERATORS are capable of generating digitally-modulated radio signals. Vector signal generators can generate signals based on industry standards such as GSM, W-CDMA (UMTS) and Wi-Fi (IEEE 802.11). LOGIC SIGNAL GENERATORS are also called DIGITAL PATTERN GENERATOR. These generators produce logic types of signals, that is logic 1s and 0s in the form of conventional voltage levels. Logic signal generators are used as stimulus sources for functional validation & testing of digital integrated circuits and embedded systems. The devices mentioned above are for general-purpose use. There are however many other signal generators designed for custom specific applications. A SIGNAL INJECTOR is a very useful and quick troubleshooting tool for signal tracing in a circuit. Technicians can determine the faulty stage of a device such as a radio receiver very quickly. The signal injector can be applied to the speaker output, and if the signal is audible one can move to the preceding stage of the circuit. In this case an audio amplifier, and if the injected signal is heard again one can move the signal injection up the stages of the circuit until the signal is no longer audible. This will serve the purpose of locating the location of the problem. A MULTIMETER is an electronic measuring instrument combining several measurement functions in one unit. Generally, multimeters measure voltage, current, and resistance. Both digital and analog version are available. We offer portable hand-held multimeter units as well as laboratory-grade models with certified calibration. Modern multimeters can measure many parameters such as: Voltage (both AC / DC), in volts, Current (both AC / DC), in amperes, Resistance in ohms. Additionally, some multimeters measure: Capacitance in farads, Conductance in siemens, Decibels, Duty cycle as a percentage, Frequency in hertz, Inductance in henries, Temperature in degrees Celsius or Fahrenheit, using a temperature test probe. Some multimeters also include: Continuity tester; sounds when a circuit conducts, Diodes (measuring forward drop of diode junctions), Transistors (measuring current gain and other parameters), battery checking function, light level measuring function, acidity & Alkalinity (pH) measuring function and relative humidity measuring function. Modern multimeters are often digital. Modern digital multimeters often have an embedded computer to make them very powerful tools in metrology and testing. They include features such as:: •Auto-ranging, which selects the correct range for the quantity under test so that the most significant digits are shown. •Auto-polarity for direct-current readings, shows if the applied voltage is positive or negative. •Sample and hold, which will latch the most recent reading for examination after the instrument is removed from the circuit under test. •Current-limited tests for voltage drop across semiconductor junctions. Even though not a replacement for a transistor tester, this feature of digital multimeters facilitates testing diodes and transistors. •A bar graph representation of the quantity under test for better visualization of fast changes in measured values. •A low-bandwidth oscilloscope. •Automotive circuit testers with tests for automotive timing and dwell signals. •Data acquisition feature to record maximum and minimum readings over a given period, and to take a number of samples at fixed intervals. •A combined LCR meter. Some multimeters can be interfaced with computers, while some can store measurements and upload them to a computer. Yet another very useful tool, an LCR METER is a metrology instrument for measuring the inductance (L), capacitance (C), and resistance (R) of a component. The impedance is measured internally and converted for display to the corresponding capacitance or inductance value. Readings will be reasonably accurate if the capacitor or inductor under test does not have a significant resistive component of impedance. Advanced LCR meters measure true inductance and capacitance, and also the equivalent series resistance of capacitors and the Q factor of inductive components. The device under test is subjected to an AC voltage source and the meter measures the voltage across and the current through the tested device. From the ratio of voltage to current the meter can determine the impedance. The phase angle between the voltage and current is also measured in some instruments. In combination with the impedance, the equivalent capacitance or inductance, and resistance, of the device tested can be calculated and displayed. LCR meters have selectable test frequencies of 100 Hz, 120 Hz, 1 kHz, 10 kHz, and 100 kHz. Benchtop LCR meters typically have selectable test frequencies of more than 100 kHz. They often include possibilities to superimpose a DC voltage or current on the AC measuring signal. While some meters offer the possibility to externally supply these DC voltages or currents other devices supply them internally. An EMF METER is a test & metrology instrument for measuring electromagnetic fields (EMF). Majority of them measure the electromagnetic radiation flux density (DC fields) or the change in an electromagnetic field over time (AC fields). There are single axis and tri-axis instrument versions. Single axis meters cost less than tri-axis meters, but take longer to complete a test because the meter only measures one dimension of the field. Single axis EMF meters have to be tilted and turned on all three axes to complete a measurement. On the other hand, tri-axis meters measure all three axes simultaneously, but are more expensive. An EMF meter can measure AC electromagnetic fields, which emanate from sources such as electrical wiring, while GAUSSMETERS / TESLAMETERS or MAGNETOMETERS measure DC fields emitted from sources where direct current is present. The majority of EMF meters are calibrated to measure 50 and 60 Hz alternating fields corresponding to the frequency of US and European mains electricity. There are other meters which can measure fields alternating at as low as 20 Hz. EMF measurements can be broadband across a wide range of frequencies or frequency selective monitoring only the frequency range of interest. A CAPACITANCE METER is a test equipment used to measure capacitance of mostly discrete capacitors. Some meters display the capacitance only, whereas others also display leakage, equivalent series resistance, and inductance. Higher end test instruments use techniques such as inserting the capacitor-under-test into a bridge circuit. By varying the values of the other legs in the bridge so as to bring the bridge into balance, the value of the unknown capacitor is determined. This method ensures greater precision. The bridge may also be capable to measure series resistance and inductance. Capacitors over a range from picofarads to farads may be measured. Bridge circuits do not measure leakage current, but a DC bias voltage can be applied and the leakage measured directly. Many BRIDGE INSTRUMENTS can be connected to computers and data exchange be made to download readings or to control the bridge externally. Such bridge instruments aso offer go / no go testing for automation of tests in a fast paced production & quality control environment. Yet, another test instrument, a CLAMP METER is an electrical tester combining a voltmeter with a clamp type current meter. Most modern versions of clamp meters are digital. Modern clamp meters have most of the basic functions of a Digital Multimeter, but with the added feature of a current transformer built into the product. When you clamp the instrument’s “jaws” around a conductor carrying a large ac current, that current is coupled through the jaws, similar to the iron core of a power transformer, and into a secondary winding which is connected across the shunt of the meter’s input, the principle of operation resembling much that of a transformer. A much smaller current is delivered to the meter’s input due to the ratio of the number of secondary windings to the number of primary windings wrapped around the core. The primary is represented by the one conductor around which the jaws are clamped. If the secondary has 1000 windings, then the secondary current is 1/1000 the current flowing in the primary, or in this case the conductor being measured. Thus, 1 amp of current in the conductor being measured would produce 0.001 amps of current at the input of the meter. With clamp meters much larger currents can be easily measured by increasing the number of turns in the secondary winding. As with most of our test equipment, advanced clamp meters offer logging capability. GROUND RESISTANCE TESTERS are used for testing the earth electrodes and the soil resistivity. The instrument requirements depend on the range of applications. Modern clamp-on ground testing instruments simplify ground loop testing and enable non-intrusive leakage current measurements. Among the ANALYZERS we sell are OSCILLOSCOPES without doubt one of the most widely used equipment. An oscilloscope, also called an OSCILLOGRAPH, is a type of electronic test instrument that allows observation of constantly varying signal voltages as a two-dimensional plot of one or more signals as a function of time. Non-electrical signals like sound and vibration can also be converted to voltages and displayed on oscilloscopes. Oscilloscopes are used to observe the change of an electrical signal over time, the voltage and time describe a shape which is continuously graphed against a calibrated scale. Observation and analysis of the waveform reveals us properties such as amplitude, frequency, time interval, rise time, and distortion. Oscilloscopes can be adjusted so that repetitive signals can be observed as a continuous shape on the screen. Many oscilloscopes have storage function that allows single events to be captured by the instrument and displayed for a relatively long time. This allows us to observe events too fast to be directly perceptible. Modern oscilloscopes are lightweight, compact and portable instruments. There are also miniature battery-powered instruments for field service applications. Laboratory grade oscilloscopes are generally bench-top devices. There is a vast variety of probes and input cables for use with oscilloscopes. Please contact us in case you need advice about which one to use in your application. Oscilloscopes with two vertical inputs are called dual-trace oscilloscopes. Using a single-beam CRT, they multiplex the inputs, usually switching between them fast enough to display two traces apparently at once. There are also oscilloscopes with more traces; four inputs are common among these. Some multi-trace oscilloscopes use the external trigger input as an optional vertical input, and some have third and fourth channels with only minimal controls. Modern oscilloscopes have several inputs for voltages, and thus can be used to plot one varying voltage versus another. This is used for example for graphing I-V curves (current versus voltage characteristics) for components such as diodes. For high frequencies and with fast digital signals the bandwidth of the vertical amplifiers and sampling rate must be high enough. For-general purpose use a bandwidth of at least 100 MHz is usually sufficient. A much lower bandwidth is sufficient for audio-frequency applications only. Useful range of sweeping is from one second to 100 nanoseconds, with appropriate triggering and sweep delay. A well-designed, stable, trigger circuit is required for a steady display. The quality of the trigger circuit is key for good oscilloscopes. Another key selection criteria is the sample memory depth and sample rate. Basic level modern DSOs now have 1MB or more of sample memory per channel. Often this sample memory is shared between channels, and can sometimes only be fully available at lower sample rates. At the highest sample rates the memory may be limited to a few 10's of KB. Any modern ''real-time'' sample rate DSO will have typically 5-10 times the input bandwidth in sample rate. So a 100 MHz bandwidth DSO would have 500 Ms/s - 1 Gs/s sample rate. Greatly increased sample rates have largely eliminated the display of incorrect signals that was sometimes present in the first generation of digital scopes. Most modern oscilloscopes provide one or more external interfaces or buses such as GPIB, Ethernet, serial port, and USB to allow remote instrument control by external software. Here is a list of different oscilloscope types: CATHODE RAY OSCILLOSCOPE DUAL-BEAM OSCILLOSCOPE ANALOG STORAGE OSCILLOSCOPE DIGITAL OSCILLOSCOPES MIXED-SIGNAL OSCILLOSCOPES HANDHELD OSCILLOSCOPES PC-BASED OSCILLOSCOPES A LOGIC ANALYZER is an instrument that captures and displays multiple signals from a digital system or digital circuit. A logic analyzer may convert the captured data into timing diagrams, protocol decodes, state machine traces, assembly language. Logic Analyzers have advanced triggering capabilities, and are useful when the user needs to see the timing relationships between many signals in a digital system. MODULAR LOGIC ANALYZERS consist of both a chassis or mainframe and logic analyzer modules. The chassis or mainframe contains the display, controls, control computer, and multiple slots into which the data-capturing hardware is installed. Each module has a specific number of channels, and multiple modules can be combined to obtain a very high channel count. The ability to combine multiple modules to obtain a high channel count and the generally higher performance of modular logic analyzers makes them more expensive. For the very high end modular logic analyzers, the users may need to provide their own host PC or purchase an embedded controller compatible with the system. PORTABLE LOGIC ANALYZERS integrate everything into a single package, with options installed at the factory. They generally have lower performance than modular ones, but are economical metrology tools for general purpose debugging. In PC-BASED LOGIC ANALYZERS, the hardware connects to a computer through a USB or Ethernet connection and relays the captured signals to the software on the computer. These devices are generally much smaller and less expensive because they make use of a personal computer’s existing keyboard, display and CPU. Logic analyzers can be triggered on a complicated sequence of digital events, then capture large amounts of digital data from the systems under test. Today specialized connectors are in use. The evolution of logic analyzer probes has led to a common footprint that multiple vendors support, which provides added freedom to end users: Connectorless technology offered as several vendor-specific trade names such as Compression Probing; Soft Touch; D-Max is being used. These probes provide a durable, reliable mechanical and electrical connection between the probe and the circuit board. A SPECTRUM ANALYZER measures the magnitude of an input signal versus frequency within the full frequency range of the instrument. The primary use is to measure the power of the spectrum of signals. There are optical and acoustical spectrum analyzers as well, but here we will discuss only electronic analyzers that measure and analyze electrical input signals. The spectra obtained from electrical signals provides us information about frequency, power, harmonics, bandwidth…etc. The frequency is displayed on the horizonal axis and the signal amplitude on the vertical. Spectrum analyzers are widely used in the electronics industry for the analyses of the frequency spectrum of radio frequency, RF and audio signals. Looking at the spectrum of a signal we are able to reveal elements of the signal, and the performance of the circuit producing them. Spectrum analyzers are able to make a large variety of measurements. Looking at the methods used to obtain the spectrum of a signal we can categorize the spectrum analyzer types. - A SWEPT-TUNED SPECTRUM ANALYZER uses a superheterodyne receiver to down-convert a portion of the input signal spectrum (using a voltage-controlled oscillator and a mixer) to the center frequency of a band-pass filter. With a superheterodyne architecture, the voltage-controlled oscillator is swept through a range of frequencies, taking advantage of the full frequency range of the instrument. Swept-tuned spectrum analyzers are descended from radio receivers. Therefore swept-tuned analyzers are either tuned-filter analyzers (analogous to a TRF radio) or superheterodyne analyzers. In fact, in their simplest form, you could think of a swept-tuned spectrum analyzer as a frequency-selective voltmeter with a frequency range that is tuned (swept) automatically. It is essentially a frequency-selective, peak-responding voltmeter calibrated to display the rms value of a sine wave. The spectrum analyzer can show the individual frequency components that make up a complex signal. However it does not provide phase information, only magnitude information. Modern swept-tuned analyzers (superheterodyne analyzers, in particular) are precision devices that can make a wide variety of measurements. However, they are primarily used to measure steady-state, or repetitive, signals because they can't evaluate all frequencies in a given span simultaneously. The ability to evaluate all frequencies simultaneously is possible with only the real-time analyzers. - REAL-TIME SPECTRUM ANALYZERS: A FFT SPECTRUM ANALYZER computes the discrete Fourier transform (DFT), a mathematical process that transforms a waveform into the components of its frequency spectrum, of the input signal. The Fourier or FFT spectrum analyzer is another real-time spectrum analyzer implementation. The Fourier analyzer uses digital signal processing to sample the input signal and convert it to the frequency domain. This conversion is done using the Fast Fourier Transform (FFT). The FFT is an implementation of the Discrete Fourier Transform, the math algorithm used for transforming data from the time domain to the frequency domain. Another type of real-time spectrum analyzers, namely the PARALLEL FILTER ANALYZERS combine several bandpass filters, each with a different bandpass frequency. Each filter remains connected to the input at all times. After an initial settling time, the parallel-filter analyzer can instantaneously detect and display all signals within the analyzer's measurement range. Therefore, the parallel-filter analyzer provides real-time signal analysis. Parallel-filter analyzer is fast, it measures transient and time-variant signals. However, the frequency resolution of a parallel-filter analyzer is much lower than most swept-tuned analyzers, because the resolution is determined by the width of the bandpass filters. To get fine resolution over a large frequency range, you would need many many individual filters, making it costly and complex. This is why most parallel-filter analyzers, except the simplest ones in the market are expensive. - VECTOR SIGNAL ANALYSIS (VSA) : In the past, swept-tuned and superheterodyne spectrum analyzers covered wide frequency ranges from audio, thru microwave, to millimeter frequencies. In addition, digital signal processing (DSP) intensive fast Fourier transform (FFT) analyzers provided high-resolution spectrum and network analysis, but were limited to low frequencies due to the limits of analog-to-digital conversion and signal processing technologies. Today's wide-bandwidth, vector-modulated, time-varying signals benefit greatly from the capabilities of FFT analysis and other DSP techniques. Vector signal analyzers combine superheterodyne technology with high speed ADC's and other DSP technologies to offer fast high-resolution spectrum measurements, demodulation, and advanced time-domain analysis. The VSA is especially useful for characterizing complex signals such as burst, transient, or modulated signals used in communications, video, broadcast, sonar and ultrasound imaging applications. According to form factors, spectrum analyzers are grouped as benchtop, portable, handheld and networked. Benchtop models are useful for applications where the spectrum analyzer can be plugged into AC power,such as in a lab environment or manufacturing area. Bench top spectrum analyzers generally offer better performance and specifications than the portable or handheld versions. However they are generally heavier and have several fans for cooling. Some BENCHTOP SPECTRUM ANALYZERS offer optional battery packs, allowing them to be used away from a mains outlet. Those are referred to as a PORTABLE SPECTRUM ANALYZERS. Portable models are useful for applications where the spectrum analyzer needs to be taken outside to make measurements or carried while in use. A good portable spectrum analyzer is expected to offer optional battery-powered operation to allow the user to work in places without power outlets, a clearly viewable display to allow the screen to be read in bright sunlight, darkness or dusty conditions, light weight. HANDHELD SPECTRUM ANALYZERS are useful for applications where the spectrum analyzer needs to be very light and small. Handheld analyzers offer a limited capability as compared to larger systems. Advantages of handheld spectrum analyzers are however their very low power consumption, battery-powered operation while in the field to allow the user to move freely outside, very small size & light weight. Finally, NETWORKED SPECTRUM ANALYZERS do not include a display and they are designed to enable a new class of geographically-distributed spectrum monitoring and analysis applications. The key attribute is the ability to connect the analyzer to a network and monitor such devices across a network. While many spectrum analyzers have an Ethernet port for control, they typically lack efficient data transfer mechanisms and are too bulky and/or expensive to be deployed in such a distributed manner. The distributed nature of such devices enable geo-location of transmitters, spectrum monitoring for dynamic spectrum access and many other such applications. These devices are able to synchronize data captures across a network of analyzers and enable Network-efficient data transfer for a low cost. A PROTOCOL ANALYZER is a tool incorporating hardware and/or software used to capture and analyze signals and data traffic over a communication channel. Protocol analyzers are mostly used for measuring performance and troubleshooting. They connect to the network to calculate key performance indicators to monitor the network and speed-up troubleshooting activities. A NETWORK PROTOCOL ANALYZER is a vital part of a network administrator's toolkit. Network protocol analysis is used to monitor the health of network communications. To find out why a network device is functioning in a certain way, administrators use a protocol analyzer to sniff the traffic and expose the data and protocols that pass along the wire. Network protocol analyzers are used to - Troubleshoot hard-to-solve problems - Detect and identify malicious software / malware. Work with an Intrusion Detection System or a honeypot. - Gather information, such as baseline traffic patterns and network-utilization metrics - Identify unused protocols so that you can remove them from the network - Generate traffic for penetration testing - Eavesdrop on traffic (e.g., locate unauthorized Instant Messaging traffic or wireless Access Points) A TIME-DOMAIN REFLECTOMETER (TDR) is an instrument that uses time-domain reflectometry to characterize and locate faults in metallic cables such as twisted pair wires and coaxial cables, connectors, printed circuit boards,….etc. Time-Domain Reflectometers measure reflections along a conductor. In order to measure them, the TDR transmits an incident signal onto the conductor and looks at its reflections. If the conductor is of a uniform impedance and is properly terminated, then there will be no reflections and the remaining incident signal will be absorbed at the far end by the termination. However, if there is an impedance variation somewhere, then some of the incident signal will be reflected back to the source. The reflections will have the same shape as the incident signal, but their sign and magnitude depend on the change in impedance level. If there is a step increase in the impedance, then the reflection will have the same sign as the incident signal and if there is a step decrease in impedance, the reflection will have the opposite sign. The reflections are measured at the output/input of the Time-Domain Reflectometer and displayed as a function of time. Alternatively, the display can show the transmission and reflections as a function of cable length because the speed of signal propagation is almost constant for a given transmission medium. TDRs can be used to analyze cable impedances and lengths, connector and splice losses and locations. TDR impedance measurements provide designers the opportunity to perform signal integrity analysis of system interconnects and accurately predict the digital system performance. TDR measurements are widely used in board characterization work. A circuit board designer can determine the characteristic impedances of board traces, compute accurate models for board components, and predict board performance more accurately. There are many other areas of application for time-domain reflectometers. A SEMICONDUCTOR CURVE TRACER is a test equipment used to analyze the characteristics of discrete semiconductor devices such as diodes, transistors, and thyristors. The instrument is based on oscilloscope, but contains also voltage and current sources that can be used to stimulate the device under test. A swept voltage is applied to two terminals of the device under test, and the amount of current that the device permits to flow at each voltage is measured. A graph called V-I (voltage versus current) is displayed on the oscilloscope screen. Configuration includes the maximum voltage applied, the polarity of the voltage applied (including the automatic application of both positive and negative polarities), and the resistance inserted in series with the device. For two terminal devices like diodes, this is sufficient to fully characterize the device. The curve tracer can display all of the interesting parameters such as the diode's forward voltage, reverse leakage current, reverse breakdown voltage,…etc. Three-terminal devices such as transistors and FETs also use a connection to the control terminal of the device being tested such as the Base or Gate terminal. For transistors and other current based devices, the base or other control terminal current is stepped. For field effect transistors (FETs), a stepped voltage is used instead of a stepped current. By sweeping the voltage through the configured range of main terminal voltages, for each voltage step of the control signal, a group of V-I curves is generated automatically. This group of curves makes it very easy to determine the gain of a transistor, or the trigger voltage of a thyristor or TRIAC. Modern semiconductor curve tracers offer many attractive features such as intuitive Windows based user interfaces, I-V, C-V and pulse generation, and pulse I-V, application libraries included for every technology…etc. PHASE ROTATION TESTER / INDICATOR: These are compact and rugged test instruments to identify phase sequence on three-phase systems and open/de-energized phases. They are ideal for installing rotating machinery, motors and for checking generator output. Among the applications are the identification of proper phase sequences, detection of missing wire phases, determination of proper connections for rotating machinery, detection of live circuits. A FREQUENCY COUNTER is a test instrument that is used for measuring frequency. Frequency counters generally use a counter which accumulates the number of events occurring within a specific period of time. If the event to be counted is in electronic form, simple interfacing to the instrument is all that is needed. Signals of higher complexity may need some conditioning to make them suitable for counting. Most frequency counters have some form of amplifier, filtering and shaping circuitry at the input. Digital signal processing, sensitivity control and hysteresis are other techniques to improve performance. Other types of periodic events that are not inherently electronic in nature will need to be converted using transducers. RF frequency counters operate on the same principles as lower frequency counters. They have more range before overflow. For very high microwave frequencies, many designs use a high-speed prescaler to bring the signal frequency down to a point where normal digital circuitry can operate. Microwave frequency counters can measure frequencies up to almost 100 GHz. Above these high frequencies the signal to be measured is combined in a mixer with the signal from a local oscillator, producing a signal at the difference frequency, which is low enough for direct measurement. Popular interfaces on frequency counters are RS232, USB, GPIB and Ethernet similar to other modern instruments. In addition to sending measurement results, a counter can notify the user when user-defined measurement limits are exceeded. For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА