Search Results

Manufacturing Pneumatic Hydraulic Vacuum Products, Custom Pneumatics, Hydrolics, Control Valves, Pipes, Tubes, Hoses, Bellows, Seals & Fittings & Connections Пневматика и хидраулика и вакуумски производи Прочитај повеќе Компресори и пумпи и мотори Прочитај повеќе Вентили за пневматика и хидраулика и вакуум Прочитај повеќе Цевки и цевки и црева и мевови и компоненти за дистрибуција Прочитај повеќе Заптивки и фитинзи и стеги и врски и адаптери и прирабници и брзи спојки Прочитај повеќе Filters & Treatment Components Прочитај повеќе Активатори Акумулатори Прочитај повеќе Резервоари и комори за хидраулика и пневматика и вакуум Прочитај повеќе Сервисни и поправки комплети за пневматика и хидраулика и вакуум Прочитај повеќе Системски компоненти за пневматика и хидраулика и вакуум Прочитај повеќе Алатки за хидраулика и пневматика и вакуум AGS-TECH supplies off-shelf as well as custom manufactured PNEUMATICS & HYDRAULICS and VACUUM PRODUCTS. We offer original brand name components, generic brand and AGS-TECH brand pneumatic, hydraulic and vacuum products. Regardless of which category, our components are manufactured at plants certified to international standards and meet related industrial standards. Here is a brief summary of our pneumatic, hydraulic and vacuum products. You can find more detailed information by clicking on the submenu titles on the side. COMPRESSORS & PUMPS & MOTORS: A variety of these are offered off-shelf for pneumatic, hydraulic and vacuum applications. We have specialized compressors, pumps and motors for each type of application. You may choose the products you need in our downloadable brochures on relevant pages or if you are unsure, you may describe us your needs and applications and we can offer you the suitable pneumatics, hydraulics and vacuum products. For some of our compressors, pumps and motors we are capable to make modifications or manufacture them custom tailored to your applications. To give you a feeling of the wide spectrum of compressors, pumps and motors we can supply, here are a few types: Oilless air motors, cast iron and aluminum rotary vane air motors, piston air compressor / vacuum pump, positive displacement blowers, diaphragm compressor, hydraulic gear pump, hydraulic radial piston pump, hydraulic track drive motors. CONTROL VALVES: Models of these for either hydraulics, pneumatics or vacuum are available. Similar to our other products, you can order off-shelf as well as custom manufactured versions. The types we carry range from air cylinder speed control valves to filtered ball valves, from directional control valves to auxiliary valves and from angle valves to venting valves. PIPES & TUBES & HOSES & BELLOWS: These are manufactured according to the application environment and conditions. For example hydraulic tubes for A/C refrigeration requires the tube material to withstand cold temperatures, while a hydraulic beverage dispensing tube needs to be food grade and made from materials that do not pose health hazard. On the other hand, the shape of pneumatic/hydraulic/vacuum tubes and hoses shows also a variety, such as coiled air hose assemblies which are easy to handle because of their compactness and coiled structure and ability to extend when needed. Bellows used for vacuum systems need to have perfect sealing capability to maintain high vacuum while being flexible and be able to be bent when needed. SEALS & FITTINGS & CONNECTIONS & ADAPTORS & FLANGES: These may be overlooked because of being only a small component in the entire pneumatic / hydraulic or vacuum system. However even the smallest member of a system is very critical as a simple leak of air through a seal or fitting can easily prevent a quality vacuum to be achieved in a high vacuum system and result in costly repairs and production re-runs. On the other hand, a small leak of a toxic gas in a pneumatic gas delivery line can result in a disaster. Once again, our task is to understand our customers needs and requirements very well and provide them the exact pneumatics & hydraulics or vacuum product matching their application. FILTERS & TREATMENT COMPONENTS: Without filtering and treatment of the liquids and gases, a hydraulic, pneumatic or vacuum system cannot fulfill its tasks to full extent. As an example, a vacuum system will need air intake after an operation is complete so the system can be opened. If the air entering the vacuum system is dirty and contains oils, it will be very difficult to obtain high vacuum for the next operation cycle. A filter at air intake can eliminate such problems. On the other hand, breather filters are common in hydraulics. Filters must be of highest quality and suitable for their intended use. For example they need to be reliable and not pose risks of contaminating the pneumatic, hydraulic or vacuum system they are used in. Their inner content (such as dessicant dryers) and components cannot degrade quickly when exposed to certain chemicals, oils or humidity. On the other hand, some systems, such as it is the case in some pneumatic systems, do require lubrication of the air and therefore compressed air lubricators are used. Other examples of treatment components are electronic proportional regulators used in pneumatics, pneumatic coalescing filter elements, pneumatic oil/water separators. ACTUATORS & ACCUMULATORS: A hydraulic actuator is a cylinder or fluid motor that converts hydraulic power into useful mechanical work. The mechanical motion produced can be linear, rotary, or oscillatory. Operation exhibits high force capability, high power per unit weight and volume, good mechanical stiffness, and a high dynamic response. These properties lead to a wide use in precision control systems, heavy-duty machine tools, transportation, marine, and aerospace applications. Similarly a pneumatic actuator converts energy that is typically in the form of compressed air into mechanical motion. The motion can be rotary or linear, depending on the type of pneumatic actuator. Accumulators usually are installed in hydraulic systems to store energy and to smooth out pulsations. A hydraulic system with an accumulator can use a smaller pump because the accumulator stores energy from the pump during periods of low demand. This accumulated energy is available for instantaneous use, released upon demand at a much higher rate than could be supplied by the hydraulic pump alone. Accumulators can also be used as surge or pulsation absorbers. Accumulators can cushion hydraulic hammer, reducing shocks caused by rapid operation or sudden starting and stopping of power cylinders in a hydraulic circuit. A variety of models of these for either hydraulics, pneumatics are available. Similar to our other products, you can order off-shelf as well as custom manufactured actuator and accumulator versions. RESERVOIRS & CHAMBERS FOR HYDRAULICS & PNEUMATICS & VACUUM: Hydraulic systems need a finite amount of liquid fluid that must be stored and reused continually as the circuit works. Because of this, part of any hydraulic circuit is a storage reservoir or tank. This tank may be part of the machine framework or a separate stand-alone unit. Similarly, a pneumatic or air receiver tank is an integral and important part of any compressed air system. Typically a receiver tank is sized at 6-10 times the flow rate of the system. In a pneumatic compressed air system, a receiver tank can provide several benefits such as: -Acting as a reservoir of compressed air for peak demands. -A pneumatic receiver tank can help remove water from the system by giving the air a chance to cool. -A pneumatic receiver tank is able to minimize pulsation in the system caused by a reciprocating compressor or a cyclic process downstream. Vacuum chambers on the other hand are the containers inside which the vacuum is created and maintained. They must be strong enough not to implode and also be manufactured so that they are not prone to contamination. The size of vacuum chambers can vary vastly depending on the application. Vacuum chambers are made of materials that do not outgas either as this would unable the user to obtain and keep vacuum at desired low levels. Details of these can be found on the submenus. DISTRIBUTION EQUIPMENT is all that we have for hydraulics, pneumatics and vacuum systems that serves the purpose of distributing either the liquid, gas or vacuum from one place or system component to the other. Some of these products have already been mentioned above under the titles seals & fittings & connections & adaptors & flanges and pipes & tubes & hoses & bellows. However there are others that do not fall within the above mentioned titles such as pneumatic and hydraulic manifolds, chamfer tools, hose barbs, reducing bracket, drop brackets, pipe cutter, pipe clips, feedthroughs. SYSTEM COMPONENTS: We also supply pneumatic, hydraulic and vacuum system components not mentioned elsewhere here under any title. Some of them are air knives, booster regulators, sensors and gauges (pressure….etc), pneumatic slides, air cannons, air conveyors, cylinder position sensors, feedthroughs, vacuum regulators, pneumatic cylinder controls…etc. TOOLS FOR HYDRAULICS & PNEUMATICS & VACUUM: Pneumatic tools are work tools or other tools that operate with compressed air rather than purely electric energy. Examples are air hammers, screwdrivers, drills, bevellers, air die grinders….etc. Similarly, hydraulic tools are work tools that operate with compressed hydraulic liquids rather than electricity such as hydraulic paving breaker, drivers and pullers, crimping and cutting tools, hydraulic chainsaw…etc. Industrial vacuum tools are those that can be connected to an industrial vacuum line and be used for holding, gripping, manipulating objects or products in the workplace, such as vacuum handling tools. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Metal Stamping & Sheet Metal Fabrication, Zinc Plated Metal Stamped Parts, Wire and Spring Forming Метално штанцување и изработка на лим Цинк обложени печат делови Прецизни печати и формирање на жица Цинк обложени прилагодени прецизни метални печати Прецизно печатени делови AGS-TECH Inc. прецизно печат на метал Изработка на лим од AGS-TECH Inc. Брзо прототипирање на лим од AGS-TECH Inc. Печатење на подлошки во голем волумен Развој и изработка на куќиште за филтер за масло од лим Изработка на компоненти од лим за филтер за масло и комплетна монтажа Прилагодено изработка и монтажа на производи од лим Изработка на дихтунзи за глава од AGS-TECH Inc. Изработка на заптивки во AGS-TECH Inc. Изработка на куќишта од лим - AGS-TECH Inc Едноставни единечни и прогресивни печати од AGS-TECH Inc. Печати од метал и метални легури - AGS-TECH Inc Метални делови пред завршувањето на работата Формирање лим - Електрично куќиште - AGS-TECH Inc Производство на сечила за сечење обложени со титаниум за прехранбената индустрија Изработка на ножеви за скијање за индустријата за пакување храна PREVIOUS PAGE

Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. Микроелектроника и производство и производство на полупроводници Many of our nanomanufacturing, micromanufacturing and mesomanufacturing techniques and processes explained under the other menus can be used for MICROELECTRONICS MANUFACTURING too. However due to the importance of microelectronics in our products, we will concentrate on the subject specific applications of these processes here. Microelectronics related processes are also widely referred to as SEMICONDUCTOR FABRICATION processes. Our semiconductor engineering design and fabrication services include: - FPGA board design, development and programming - Microelectronics foundry services: Design, prototyping and manufacturing, third-party services - Semiconductor wafer preparation: Dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection - Microelectronic package design and fabrication: Both off-shelf and custom design and fabrication - Semiconductor IC assembly & packaging & test: Die, wire and chip bonding, encapsulation, assembly, marking and branding - Lead frames for semiconductor devices: Both off-shelf and custom design and fabrication - Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication - Sensor & actuator design and fabrication: Both off-shelf and custom design and fabrication - Optoelectronic & photonic circuits design and fabrication Let us examine the microelectronics and semiconductor fabrication and test technologies in more detail so you can better understand the services and products we are offering. FPGA Board Design & Development and Programming: Field-programmable gate arrays (FPGAs) are reprogrammable silicon chips. Contrary to processors that you find in personal computers, programming an FPGA rewires the chip itself to implement user’s functionality rather than running a software application. Using prebuilt logic blocks and programmable routing resources, FPGA chips can be configured to implement custom hardware functionality without using a breadboard and soldering iron. Digital computing tasks are carried out in software and compiled down to a configuration file or bitstream that contains information on how the components should be wired together. FPGAs can be used to implement any logical function that an ASIC could perform and are completely reconfigurable and can be given a completely different “personality” by recompiling a different circuit configuration. FPGAs combine the best parts of application-specific integrated circuits (ASICs) and processor-based systems. These benefits include the following: • Faster I/O response times and specialized functionality • Exceeding the computing power of digital signal processors (DSPs) • Rapid prototyping and verification without the fabrication process of custom ASIC • Implementation of custom functionality with the reliability of dedicated deterministic hardware • Field-upgradable eliminating the expense of custom ASIC re-design and maintenance FPGAs provide speed and reliability, without requiring high volumes to justify the large upfront expense of custom ASIC design. Reprogrammable silicon also has the same flexibility of software running on processor-based systems, and it is not limited by the number of processing cores available. Unlike processors, FPGAs are truly parallel in nature, so different processing operations do not have to compete for the same resources. Each independent processing task is assigned to a dedicated section of the chip, and can function autonomously without any influence from other logic blocks. As a result, the performance of one part of the application is not affected when more processing is added on. Some FPGAs have analog features in addition to digital functions. Some common analog features are programmable slew rate and drive strength on each output pin, allowing the engineer to set slow rates on lightly loaded pins that would otherwise ring or couple unacceptably, and to set stronger, faster rates on heavily loaded pins on high-speed channels that would otherwise run too slowly. Another relatively common analog feature is differential comparators on input pins designed to be connected to differential signaling channels. Some mixed signal FPGAs have integrated peripheral analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) with analog signal conditioning blocks that allow them to operate as a system-on-a-chip. Briefly, the top 5 benefits of FPGA chips are: 1. Good Performance 2. Short Time to Market 3. Low Cost 4. High Reliability 5. Long-Term Maintenance Capability Good Performance – With their capability of accommodating parallel processing, FPGAs have better computing power than digital signal processors (DSPs) and do not require sequential execution as DSPs and can accomplish more per clock cycles. Controlling inputs and outputs (I/O) at the hardware level provides faster response times and specialized functionality to closely match application requirements. Short Time to market - FPGAs offer flexibility and rapid prototyping capabilities and thus shorter time-to-market. Our customers can test an idea or concept and verify it in hardware without going through the long and expensive fabrication process of custom ASIC design. We can implement incremental changes and iterate on an FPGA design within hours instead of weeks. Commercial off-the-shelf hardware is also available with different types of I/O already connected to a user-programmable FPGA chip. The growing availability of high-level software tools offer valuable IP cores (prebuilt functions) for advanced control and signal processing. Low Cost—The nonrecurring engineering (NRE) expenses of custom ASIC designs exceed that of FPGA-based hardware solutions. The large initial investment in ASICs can be justified for OEMs producing many chips per year, however many end users need custom hardware functionality for the many systems in development. Our programmable silicon FPGA offers you something with no fabrication costs or long lead times for assembly. System requirements frequently change over time, and the cost of making incremental changes to FPGA designs is negligible when compared to the large expense of respinning an ASIC. High Reliability - Software tools provide the programming environment and FPGA circuitry is a true implementation of program execution. Processor-based systems generally involve multiple layers of abstraction to help task scheduling and share resources among multiple processes. The driver layer controls hardware resources and the OS manages memory and processor bandwidth. For any given processor core, only one instruction can execute at a time, and processor-based systems are continually at risk of time-critical tasks preempting one another. FPGAs, do not use OSs, pose minimum reliability concerns with their true parallel execution and deterministic hardware dedicated to every task. Long-term Maintenance Capability - FPGA chips are field-upgradable and do not require the time and cost involved with redesigning ASIC. Digital communication protocols, for example, have specifications that can change over time, and ASIC-based interfaces may cause maintenance and forward-compatibility challenges. To the contrary, reconfigurable FPGA chips can keep up with potentially necessary future modifications. As products and systems mature, our customers can make functional enhancements without spending time redesigning hardware and modifying the board layouts. Microelectronics Foundry Services: Our microelectronics foundry services include design, prototyping and manufacturing, third-party services. We provide our customers with assistance throughout the entire product development cycle - from design support to prototyping and manufacturing support of semiconductor chips. Our objective in design support services is to enable a first-time right approach for digital, analog, and mixed-signal designs of semiconductor devices. For example, MEMS specific simulation tools are available. Fabs that can handle 6 and 8 inch wafers for integrated CMOS and MEMS are at your service. We offer our clients design support for all major electronic design automation (EDA) platforms, supplying correct models, process design kits (PDK), analog and digital libraries, and design for manufacturing (DFM) support. We offer two prototyping options for all technologies: the Multi Product Wafer (MPW) service, where several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. These are more economical than the full mask set. The MLM service is highly flexible compared to the fixed dates of the MPW service. Companies may prefer outsourcing semiconductor products to a microelectronics foundry for a number of reasons including the need for a second source, using internal resources for other products and services, willingness to go fabless and decrease risk and burden of running a semiconductor fab…etc. AGS-TECH offers open-platform microelectronics fabrication processes that can be scaled down for small wafer runs as well as mass manufacturing. Under certain circumstances, your existing microelectronics or MEMS fabrication tools or complete tool sets can be transferred as consigned tools or sold tools from your fab into our fab site, or your existing microelectronics and MEMS products can be redesigned using open platform process technologies and ported to a process available at our fab. This is faster and more economical than a custom technology transfer. If desired however customer’s existing microelectronics / MEMS fabrication processes may be transferred. Semiconductor Wafer Preparation: If desired by customers after wafers are microfabricated, we carry out dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection operations on semiconductor wafers. Semiconductor wafer processing involves metrology in between the various processing steps. For example, thin film test methods based on ellipsometry or reflectometry, are used to tightly control the thickness of gate oxide, as well as the thickness, refractive index and extinction coefficient of photoresist and other coatings. We use semiconductor wafer test equipment to verify that the wafers haven't been damaged by previous processing steps up until testing. Once the front-end processes have been completed, the semiconductor microelectronic devices are subjected to a variety of electrical tests to determine if they function properly. We refer to the proportion of microelectronics devices on the wafer found to perform properly as the “yield”. Testing of microelectronics chips on the wafer are carried out with an electronic tester that presses tiny probes against the semiconductor chip. The automated machine marks each bad microelectronics chip with a drop of dye. Wafer test data is logged into a central computer database and semiconductor chips are sorted into virtual bins according to predetermined test limits. The resulting binning data can be graphed, or logged, on a wafer map to trace manufacturing defects and mark bad chips. This map can also be used during wafer assembly and packaging. In final testing, microelectronics chips are tested again after packaging, because bond wires may be missing, or analog performance may be altered by the package. After a semiconductor wafer is tested, it is typically reduced in thickness before the wafer is scored and then broken into individual dies. This process is called semiconductor wafer dicing. We use automated pick-and-place machines specially manufactured for microelectronics industry to sort out the good and bad semiconductor dies. Only the good, unmarked semiconductor chips are packaged. Next, in the microelectronics plastic or ceramic packaging process we mount the semiconductor die, connect the die pads to the pins on the package, and seal the die. Tiny gold wires are used to connect the pads to the pins using automated machines. Chip scale package (CSP) is another microelectronics packaging technology. A plastic dual in-line package (DIP), like most packages, is multiple times larger than the actual semiconductor die placed inside, whereas CSP chips are nearly the size of the microelectronics die; and a CSP can be constructed for each die before the semiconductor wafer is diced. The packaged microelectronics chips are re-tested to make sure that they are not damaged during packaging and that the die-to-pin interconnect process was completed correctly. Using lasers we then etch the chip names and numbers on the package. Microelectronic Package Design and Fabrication: We offer both off-shelf and custom design and fabrication of microelectronic packages. As part of this service, modeling and simulation of microelectronic packages is also carried out. Modeling and simulation ensures virtual Design of Experiments (DoE) to achieve the optimal solution, rather than testing packages on the field. This reduces the cost and production time, especially for new product development in microelectronics. This work also gives us the opportunity to explain our customers how the assembly, reliability and testing will impact their microelectronic products. The primary objective of microelectronic packaging is to design an electronic system that will satisfy the requirements for a particular application at a reasonable cost. Because of the many options available to interconnect and house a microelectronics system, the choice of a packaging technology for a given application needs expert evaluation. Selection criteria for microelectronics packages may include some of the following technology drivers: -Wireability -Yield -Cost -Heat dissipation properties -Electromagnetic shielding performance -Mechanical toughness -Reliability These design considerations for microelectronics packages affect speed, functionality, junction temperatures, volume, weight and more. The primary goal is to select the most cost-effective yet reliable interconnection technology. We use sophisticated analysis methods and software to design microelectronics packages. Microelectronics packaging deals with the design of methods for the fabrication of interconnected miniature electronic systems and the reliability of those systems. Specifically, microelectronics packaging involves routing of signals while maintaining signal integrity, distributing ground and power to semiconductor integrated circuits, dispersing dissipated heat while maintaining structural and material integrity, and protecting the circuit from environmental hazards. Generally, methods for packaging microelectronics ICs involve the use of a PWB with connectors that provide the real-world I/Os to an electronic circuit. Traditional microelectronics packaging approaches involve the use of single packages. The main advantage of a single-chip package is the ability to fully test the microelectronics IC before interconnecting it to the underlying substrate. Such packaged semiconductor devices are either through-hole mounted or surface mounted to the PWB. Surface-mounted microelectronics packages do not require via holes to go through the entire board. Instead, surface-mounted microelectronics components can be soldered to both sides of the PWB, enabling higher circuit density. This approach is called surface-mount technology (SMT). The addition of area-array–style packages such as ball-grid arrays (BGAs) and chip-scale packages (CSPs) is making SMT competitive with the highest-density semiconductor microelectronics packaging technologies. A newer packaging technology involves the attachment of more than one semiconductor device onto a high-density interconnection substrate, which is then mounted in a large package, providing both I/O pins and environmental protection. This multichip module (MCM) technology is further characterized by the substrate technologies used to interconnect the attached ICs. MCM-D represents deposited thin film metal and dielectric multilayers. MCM-D substrates have the highest wiring densities of all MCM technologies thanks to the sophisticated semiconductor processing technologies. MCM-C refers to multilayered “ceramic” substrates, fired from stacked alternating layers of screened metal inks and unfired ceramic sheets. Using MCM-C we obtain a moderately dense wiring capacity. MCM-L refers to multilayer substrates made from stacked, metallized PWB “laminates,” that are individually patterned and then laminated. It used to be a low-density interconnect technology, however now MCM-L is quickly approaching the density of MCM-C and MCM-D microelectronics packaging technologies. Direct chip attach (DCA) or chip-on-board (COB) microelectronics packaging technology involves mounting the microelectronics ICs directly to the PWB. A plastic encapsulant, which is “globbed” over the bare IC and then cured, provides environmental protection. Microelectronics ICs can be interconnected to the substrate using either flip-chip, or wire bonding methods. DCA technology is particularly economical for systems that are limited to 10 or fewer semiconductor ICs, since larger numbers of chips can affect system yield and DCA assemblies can be difficult to rework. An advantage common to both the DCA and MCM packaging options is the elimination of the semiconductor IC package interconnection level, which allows closer proximity (shorter signal transmission delays) and reduced lead inductance. The primary disadvantage with both methods is the difficulty in purchasing fully tested microelectronics ICs. Other disadvantages of DCA and MCM-L technologies include poor thermal management thanks to the low thermal conductivity of PWB laminates and a poor coefficient of thermal expansion match between the semiconductor die and the substrate. Solving the thermal expansion mismatch problem requires an interposer substrate such as molybdenum for wire bonded die and an underfill epoxy for flip-chip die. The multichip carrier module (MCCM) combines all the positive aspects of DCA with MCM technology. The MCCM is simply a small MCM on a thin metal carrier that can be bonded or mechanically attached to a PWB. The metal bottom acts as both a heat dissipater and a stress interposer for the MCM substrate. The MCCM has peripheral leads for wire bonding, soldering, or tab bonding to a PWB. Bare semiconductor ICs are protected using a glob-top material. When you contact us, we will discuss your application and requirements to choose the best microelectronics packaging option for you. Semiconductor IC Assembly & Packaging & Test: As part of our microelectronics fabrication services we offer die, wire and chip bonding, encapsulation, assembly, marking and branding, testing. For a semiconductor chip or integrated microelectronics circuit to function, it needs to be connected to the system that it will control or provide instructions to. Microelectronics IC assembly does provide the connections for power and information transfer between the chip and the system. This is accomplished by connecting the microelectronics chip to a package or directly connecting it to the PCB for these functions. Connections between the chip and the package or printed circuit board (PCB) are via wire bonding, thru-hole or flip chip assembly. We are an industry leader in finding microelectronics IC packaging solutions to meet the complex requirements of the wireless and internet markets. We offer thousands of different package formats and sizes, ranging from traditional leadframe microelectronics IC packages for thru-hole and surface mount, to the latest chip scale (CSP) and ball grid array (BGA) solutions required in high pin count and high density applications. A wide variety of packages are available from stock including CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, PLCC, PoP - Package on Package, PoP TMV - Through Mold Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Wafer Level Package)…..etc. Wire bonding using copper, silver or gold are among the popular in microelectronics. Copper (Cu) wire has been a method of connecting silicon semiconductor dies to the microelectronics package terminals. With recent increase in gold (Au) wire cost, copper (Cu) wire is an attractive way to manage overall package cost in microelectronics. It also resembles gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are almost the same for gold (Au) and copper (Cu) wire with copper (Cu) wire having lower resistivity. In microelectronics applications where resistance due to bond wire can negatively impact circuit performance, using copper (Cu) wire can offer improvement. Copper, Palladium Coated Copper (PCC) and Silver (Ag) alloy wires have emerged as alternatives to gold bond wires due to cost. Copper-based wires are inexpensive and have low electrical resistivity. However, the hardness of copper makes it difficult to use in many applications such as those with fragile bond pad structures. For these applications, Ag-Alloy offers properties similar to those of gold while its cost is similar to that of PCC. Ag-Alloy wire is softer than PCC resulting in lower Al-Splash and lower risk of bond pad damage. Ag-Alloy wire is the best low cost replacement for applications that need die-to-die bonding, waterfall bonding, ultra-fine bond pad pitch and small bond pad openings, ultra low loop height. We provide a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and complete end-of-line services. We test a variety of semiconductor device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various combinations such as ASIC, multi chip modules, System-in-Package (SiP), and stacked 3D packaging, sensors and MEMS devices such as accelerometers and pressure sensors. Our test hardware and contacting equipment are suitable for custom package size SiP, dual-sided contacting solutions for Package on Package (PoP), TMV PoP, FusionQuad sockets, multiple-row MicroLeadFrame, Fine-Pitch Copper Pillar. Test equipment and test floors are integrated with CIM / CAM tools, yield analysis and performance monitoring to deliver very high efficiency yield the first time. We offer numerous adaptive microelectronics test processes for our customers and offer distributed test flows for SiP and other complex assembly flows. AGS-TECH provides a full range of test consultation, development and engineering services across your entire semiconductor and microelectronics product lifecycle. We understand the unique markets and testing requirements for SiP, automotive, networking, gaming, graphics, computing, RF / wireless. Semiconductor manufacturing processes require fast and precisely controlled marking solutions. Marking speeds over 1000 characters/second and material penetration depths less than 25 microns are common in semiconductor microelectronics industry using advanced lasers. We are capable of marking mold compounds, wafers, ceramics and more with minimal heat input and perfect repeatability. We use lasers with high accuracy to mark even the smallest parts without damage. Lead frames for Semiconductor Devices: Both off-shelf and custom design and fabrication are possible. Lead frames are utilized in the semiconductor device assembly processes, and are essentially thin layers of metal that connect the wiring from tiny electrical terminals on the semiconductor microelectronics surface to the large-scale circuitry on electrical devices and PCBs. Lead frames are used in almost all semiconductor microelectronics packages. Most microelectronics IC packages are made by placing the semiconductor silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and subsequently covering the microelectronics chip with plastic cover. This simple and relatively low cost microelectronics packaging is still the best solution for many applications. Lead frames are produced in long strips, which allows them to be quickly processed on automated assembly machines, and generally two manufacturing processes are used: photo etching of some sort and stamping. In microelectronics lead frame design often demand is for customized specifications and features, designs that enhance electrical and thermal properties, and specific cycle time requirements. We have in-depth experience of microelectronics lead frame manufacturing for an array of different customers using laser assisted photo etching and stamping. Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication. With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. The consistency in performance and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a semiconductor microelectronics component may be achieved by effectively controlling the device operating temperature within the limits set by the designers. Heat sinks are devices that enhance heat dissipation from a hot surface, usually the outer case of a heat generating component, to a cooler ambient such as air. For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation. A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant. This allows more heat to be dissipated and/or lowers the semiconductor device operating temperature. The primary purpose of a heat sink is to maintain the microelectronics device temperature below the maximum allowable temperature specified by the semiconductor device manufacturer. We can classify heat sinks in terms of manufacturing methods and their shapes. The most common types of air-cooled heat sinks include: - Stampings: Copper or aluminum sheet metals are stamped into desired shapes. they are used in traditional air cooling of electronic components and offer an economical solution to low density thermal problems. They are suitable for high volume production. - Extrusion: These heat sinks allow the formation of elaborate two-dimensional shapes capable of dissipating large heat loads. They may be cut, machined, and options added. A cross-cutting will produce omnidirectional, rectangular pin fin heat sinks, and incorporating serrated fins improves the performance by approximately 10 to 20%, but with a slower extrusion rate. Extrusion limits, such as the fin height-to-gap fin thickness, usually dictate the flexibility in design options. Typical fin height-to-gap aspect ratio of up to 6 and a minimum fin thickness of 1.3mm, are attainable with standard extrusion techniques. A 10 to 1 aspect ratio and a fin thickness of 0.8″can be obtained with special die design features. However, as the aspect ratio increases, the extrusion tolerance is compromised. - Bonded/Fabricated Fins: Most air cooled heat sinks are convection limited, and the overall thermal performance of an air cooled heat sink can often be improved significantly if more surface area can be exposed to the air stream. These high performance heat sinks utilize thermally conductive aluminum-filled epoxy to bond planar fins onto a grooved extrusion base plate. This process allows for a much greater fin height-to-gap aspect ratio of 20 to 40, significantly increasing the cooling capacity without increasing the need for volume. - Castings: Sand, lost wax and die casting processes for aluminum or copper / bronze are available with or without vacuum assistance. We use this technology for fabrication of high density pin fin heat sinks which provide maximum performance when using impingement cooling. - Folded Fins: Corrugated sheet metal from aluminum or copper increases surface area and the volumetric performance. The heat sink is then attached to either a base plate or directly to the heating surface via epoxy or brazing. It is not suitable for high profile heat sinks on account of the availability and fin efficiency. Hence, it allows high performance heat sinks to be fabricated. In selecting an appropriate heat sink meeting the required thermal criteria for your microelectronics applications, we need to examine various parameters that affect not only the heat sink performance itself, but also the overall performance of the system. The choice of a particular type of heat sink in microelectronics depends largely to the thermal budget allowed for the heat sink and external conditions surrounding the heat sink. There is never a single value of thermal resistance assigned to a given heat sink, since the thermal resistance varies with external cooling conditions. Sensor & Actuator Design and Fabrication: Both off-shelf and custom design and fabrication are available. We offer solutions with ready-to-use processes for inertial sensors, pressure and relative pressure sensors and IR temperature sensor devices. By using our IP blocks for accelerometers, IR and pressure sensors or applying your design according to available specifications and design rules, we can have MEMS based sensor devices delivered to you within weeks. Besides MEMS, other types of sensor and actuator structures can be fabricated. Optoelectronic & photonic circuits design and fabrication: A photonic or optical integrated circuit (PIC) is a device that integrates multiple photonic functions. It can be resembled to electronic integrated circuits in microelectronics. The major difference between the two is that a photonic integrated circuit provides functionality for information signals imposed on optical wavelengths in the visible spectrum or near infrared 850 nm-1650 nm. Fabrication techniques are similar to those used in microelectronics integrated circuits where photolithography is used to pattern wafers for etching and material deposition. Unlike semiconductor microelectronics where the primary device is the transistor, there is no single dominant device in optoelectronics. Photonic chips include low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and fabrication techniques and therefore it is difficult to realize all of them on a single chip. Our applications of photonic integrated circuits are mainly in the areas of fiber-optic communication, biomedical and photonic computing. Some example optoelectronic products we can design and fabricate for you are LEDs (Light Emitting Diodes), diode lasers, optoelectronic receivers, photodiodes, laser distance modules, customized laser modules and more. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Industrial Servers - Database Server - File Server - Mail Server - Print Server - Web Server - AGS-TECH Inc. - NM - USA Индустриски сервери When referring to client-server architecture, a SERVER is a computer program that runs to serve the requests of other programs, also considered as the ''clients''. In other words the ''server'' performs computational tasks on behalf of its ''clients''. The clients may either run on the same computer or be connected through the network. In popular use however, a server is a physical computer dedicated to running as a host one or more of these services and to serve the needs of users of the other computers on the network. A server could be a DATABASE SERVER, FILE SERVER, MAIL SERVER, PRINT SERVER, WEB SERVER, or else depending on the computing service it offers. We offer the best quality industrial server brands available such as ATOP TECHNOLOGIES, KORENIX and JANZ TEC . Click on blue highlighted text below to download respective catalogs and brochures: - ATOP TECHNOLOGIES compact product brochure - ATOP Technologies Product List 2021) - ICP DAS brand industrial communication and networking products brochure - ICP DAS brand Tiny Device Server and Modbus Gateway brochure - JANZ TEC brand compact product brochure - KORENIX brand compact product brochure To choose a suitable Industrial Grade Server, please go to our industrial computer store by CLICKING HERE. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM DATABASE SERVER : This term is used to refer to the back-end system of a database application using client/server architecture. The back-end database server performs tasks such as data analysis, data storage, data manipulation, data archiving, and other non-user specific tasks. FILE SERVER : In the client/server model, this is a computer responsible for the central storage and management of data files so that other computers on the same network can access them. File servers allow users to share information over a network without physically transferring files by floppy disk or other external storage devices. In sophisticated and professional networks, a file server might be a dedicated network-attached storage (NAS) device that also serves as a remote hard disk drive for other computers. Thus anyone on the network can store files on it like to their own hard drive. MAIL SERVER : A mail server, also called an e-mail server is a computer within your network that works as your virtual post office. It consists of a storage area where e-mail is stored for local users, a set of user defined rules determining how the mail server should react to the destination of a specific message, a database of user accounts that the mail server will recognize and deal with locally, and communications modules which handle the transfer of messages to and from other email servers and clients. Mail servers are generally designed to operate with no manual intervention during normal operation. PRINT SERVER : Sometimes called a printer server, this is a device that connects printers to client computers over a network. Print servers accept print jobs from the computers and send the jobs to the appropriate printers. Print server queues jobs locally because work may arrive more quickly than the printer can actually handle it. WEB SERVER : These are computers that deliver and serve Web pages. All Web servers have IP addresses and generally domain names. When we enter the URL of a website in our browser, this sends a request to the Web server whose domain name is the website entered. The server then fetches the page named index.html and sends it to our browser. Any computer can be turned into a Web server by installing server software and connecting the machine to the Internet. There are many Web server software applications such as packages from Microsoft and Netscape. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Custom Electric Electronics Manufacturing, Lighting, Display, Touchscreen, Cable Assembly, PCB, PCBA, Wireless Devices, Wire Harness, Microwave Components Прилагодено Производство на електрични и електронски производи Прочитај повеќе Склопување на електрични и електронски кабли и меѓусебно поврзување Прочитај повеќе PCB & PCBA Производство и склопување Прочитај повеќе Производство и склопување на компоненти и системи за електрична енергија и енергија Прочитај повеќе Производство и склопување на RF и безжични уреди Прочитај повеќе Производство и склопување на компоненти и системи за микробранови Прочитај повеќе Производство и монтажа на системи за осветлување и осветлување Прочитај повеќе Соленоиди и електромагнетни компоненти и склопови Прочитај повеќе Електрични и електронски компоненти и склопови Прочитај повеќе Производство и монтажа на екран и екран на допир и монитор Прочитај повеќе Автоматизација и роботски системи Производство и склопување Прочитај повеќе Вградени системи и индустриски компјутери и панел компјутер Прочитај повеќе Индустриска опрема за тестирање Ние нудиме: • Прилагодено собрание на кабел, ПХБ, дисплеј и екран на допир (како што е iPod), компоненти за напојување и енергија, безжични, микробранови, компоненти за контрола на движење, производи за осветлување, електромагнетни и електронски компоненти. Ние градиме производи според вашите посебни спецификации и барања. Нашите производи се произведени во ISO9001:2000, QS9000, ISO14001, TS16949 сертифицирани средини и поседуваат ознака CE, UL и ги исполнуваат другите индустриски стандарди како што се IEEE, ANSI. Откако ќе бидеме назначени за вашиот проект, можеме да се грижиме за целото производство, монтажа, тестирање, квалификација, испорака и царина. Ако сакате, можеме да ги складираме вашите делови, да составиме прилагодени комплети, да печатиме и да ги означиме името и брендот на вашата компанија и да ги испратиме до вашите клиенти. Со други зборови, ние можеме да бидеме ваш складишен и дистрибутивен центар ако го претпочитате ова. Бидејќи нашите магацини се наоѓаат во близина на главните поморски пристаништа, тоа ни дава логистичка предност. На пример, кога вашите производи ќе пристигнат на големо американско пристаниште, можеме да ги транспортираме директно до блискиот магацин каде што можеме да складираме, составуваме, правиме комплети, етикетираме, печатиме, пакуваме според ваш избор и да им го предадеме бродот на вашите клиенти ако сакате. . Ние не само што снабдуваме производи. Нашата компанија работи на сопствени договори каде доаѓаме до вашата страница, го оценуваме вашиот проект на лице место и развиваме предлог-проект прилагодено дизајниран за вас. Потоа го испраќаме нашиот искусен тим да го спроведе проектот. Примери за договорна работа вклучуваат инсталирање на соларни модули, генератори на ветер, LED осветлување и системи за автоматизација за заштеда на енергија во вашиот индустриски капацитет за да се намалат сметките за енергија, инсталација на систем за детекција со фибероптички за да се открие каква било штета на вашите цевководи или да се детектираат потенцијални натрапници кои провалуваат во вашиот простории. Преземаме мали проекти, како и големи проекти во индустриско ниво. Како прв чекор, можеме да ве поврземе или преку телефон, телеконференција или MSN-месинџер со нашите членови на стручниот тим, за да можете директно да комуницирате со експерт, да поставувате прашања и да разговарате за вашиот проект. По потреба ќе дојдеме и ќе ве посетиме. Ако имате потреба за некој од овие производи или имате прашања, ве молиме јавете ни се на +1-505-550-6501 или ни е-пошта на sales@agstech.net Ако сте најмногу заинтересирани за нашите инженерски и истражувачки и развојни способности наместо производствените способности, тогаш ве покануваме да ја посетите нашата веб-страница за инженерство http://www.ags-engineering.com КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Microfluidic Devices - Microfluidics - Micropumps - Microvalves - Lab-on-a-Chip Systems - Microhydraulic - Micropneumatic - AGS-TECH Inc.- New Mexico - USA Производство на микрофлуидни уреди Our MICROFLUIDIC DEVICES MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. We have the capability to design microfluidic devices for you and offer prototyping & micromanufacturing custom tailored for your applications. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In MICROFLUIDICS we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. Some major applications of microfluidic devices and systems are: - Laboratories on a chip - Drug screening - Glucose tests - Chemical microreactor - Microprocessor cooling - Micro fuel cells - Protein crystallization - Rapid drugs change, manipulation of single cells - Single cell studies - Tunable optofluidic microlens arrays - Microhydraulic & micropneumatic systems (liquid pumps, gas valves, mixing systems…etc) - Biochip early warning systems - Detection of chemical species - Bioanalytical applications - On-chip DNA and protein analysis - Nozzle spray devices - Quartz flow cells for detection of bacteria - Dual or multiple droplet generation chips Our design engineers have many years of experience in modeling, designing and testing of microfluidic devices for a range of applications. Our design expertise in the area of microfluidics includes: • Low temperature thermal bonding process for microfluidics • Wet etching of microchannels with etch depths of nm to mm deep in glass and borosilicate. • Grinding and polishing for a wide range of substrate thicknesses from as thin as 100 microns to over 40 mm. • Ability to fuse multiple layers to create complex microfluidic devices. • Drilling, dicing and ultrasonic machining techniques suitable for microfluidic devices • Innovative dicing techniques with precise edge connection for interconnectibility of microfluidic devices • Accurate alignment • Variety of deposited coatings, microfluidic chips can be sputtered with metals such as platinum, gold, copper and titanium to create a wide range of features, such as embedded RTDs, sensors, mirrors and electrodes. Besides our custom fabrication capabilities we have hundreds of off-the-shelf standard microfluidic chip designs available with hydrophobic, hydrophilic or fluorinated coatings and a wide range of channel sizes (100 nanometers to 1mm), inputs, outputs, different geometries such as circular cross, pillar arrays and micromixer. Our microfluidic devices offer excellent chemical resistance and optical transparency, high temperature stability up to 500 Centigrade, high pressure range up to 300 Bar. Some popular microfluidic off-shelf chips are: MICROFLUIDIC DROPLET CHIPS: Glass Droplet Chips with different junction geometries, channel sizes and surface properties are available. Microfluidic droplet chips have excellent optical transparency for clear imaging. Advanced hydrophobic coating treatments enable water-in-oil droplets to be generated as well as oil-in-water droplets formed in the untreated chips. MICROFLUIDIC MIXER CHIPS: Enabling mixing of two fluid streams within miliseconds, the micromixer chips benefit a wide range of applications including reaction kinetics, sample dilution, rapid crystallisation and nanoparticle synthesis. SINGLE MICROFLUIDIC CHANNEL CHIPS: AGS-TECH Inc. offers single channel microfluidic chips with one inlet and one outlet for several applications. Two different chip dimensions are available off-the-shelf (66x33mm and 45x15mm). We also stock compatible chip holders. CROSS MICROFLUIDIC CHANNEL CHIPS: We also offer microfluidic chips with two simple channels crossing each other. Ideal for droplet generation and flow focusing applications. Standard chip dimensions are 45x15mm and we have a compatible chip holder. T-JUNCTION CHIPS: The T-Junction is a basic geometry used in microfluidics for liquid contacting and droplet formation. These microfluidic chips are available in a number of forms including thin layer, quartz, platinum coated, hydrophobic and hydrophilic versions. Y-JUNCTION CHIPS: These are glass microfluidic devices designed for a wide range of applications including liquid-liquid contacting and diffusion studies. These microfluidic devices feature two connected Y-Junctions and two straight channels for observation of microchannel flow. MICROFLUIDIC REACTOR CHIPS: Microreactor chips are compact glass microfluidic devices designed for rapid mixing and reaction of two or three liquid reagent streams. WELLPLATE CHIPS: This is a tool for analytical research and clinical diagnostic laboratories. Wellplate chips are for holding small droplets of reagents or groups of cells in nano-litre wells. MEMBRANE DEVICES: These membrane devices are designed to be used for liquid-liquid separation, contacting or extraction, cross-flow filtration and surface chemistry reactions. These devices benefit from a low dead volume and a disposable membrane. MICROFLUIDIC RESEALABLE CHIPS: Designed for microfluidic chips that can be opened and resealed, the resealable chips enable up to eight fluidic and eight electrical connections and deposition of reagents, sensors or cells onto the channel surface. Some applications are cell culture and analysis, impedance detection and biosensor testing. POROUS MEDIA CHIPS: This is a glass microfluidic device designed for statistical modeling of a complex porous sandstone rock structure. Among the applications of this microfluidic chip are research in earth science & engineering, petrochemical industry, environmental testing, groundwater analysis. CAPILLARY ELECTROPHORESIS CHIP (CE chip): We offer capillary electrophoresis chips with and without integrated electrodes for DNA analysis and separation of biomolecules. Capillary electrophoresis chips are compatible with encapsulates of dimensions 45x15mm. We have CE chips one with classical crossing and one with T-crossing. All needed accessories such as chip holders, connectors are available. Besides microfluidic chips, AGS-TECH offers a wide range of pumps, tubing, microfluidic systems, connectors and accessories. Some off-shelf microfluidic systems are: MICROFLUIDIC DROPLET STARTER SYSTEMS: Syringe-based droplet starter system provides a complete solution for the generation of monodispersed droplets that range from 10 to 250 micron diameter. Operating over wide flow ranges between 0.1 microliters/min to 10 microliters/min, the chemically resistant microfluidics system is ideal for initial concept work and experimentation. The pressure-based droplet starter system on the other hand is a tool for preliminary work in microfluidics. The system provides a complete solution containing all needed pumps, connectors and microfluidic chips enabling the production of highly monodispersed droplets ranging from 10 to 150 microns. Operating over a wide pressure range between 0 to 10 bars, this system is chemically resistant and its modular design makes it easily expandable for future applications. By providing a stable liquid flow, this modular toolkit eliminates dead volume and sample waste to effectively reduce associated reagent costs. This microfluidic system offers the ability to provide a quick liquid changeover. A lockable pressure chamber and an innovative 3-way chamber lid allow simultaneous pumping of up to three liquids. ADVANCED MICROFLUIDIC DROPLET SYSTEM: A modular microfluidic system that enables production of extremely consistent sized droplets, particles, emulsions, and bubbles. The advanced microfluidic droplet system uses flow focusing technology in a microfluidic chip with a pulseless liquid flow to produce monodispersed droplets between nanometers and hundreds of microns size. Well suited for encapsulation of cells, producing beads, controlling nanoparticle formation etc. Droplet size, flow rates, temperatures, mixing junctions, surface properties and order of additions can be quickly varied for process optimization. The microfluidic system contains all the parts required including pumps, flow sensors, chips, connectors and automation components. Accessories are also available, including optical systems, larger reservoirs and reagent kits. Some microfluidics applications for this system are encapsulation of cells, DNA and magnetic beads for research and analysis, drug delivery via polymer particles and drug formulation, precision manufacturing of emulsions and foams for food and cosmetics, production of paints and polymer particles, microfluidics research on droplets, emulsions, bubbles and particles. MICROFLUIDIC SMALL DROPLET SYSTEM: An ideal system for producing and analyzing microemulsions that offer increased stability, a higher interfacial area and the capacity to solubilize both aqueous and oil-soluble compounds. Small droplet microfluidic chips allow the generation of highly monodispersed micro-droplets ranging from 5 to 30 microns. MICROFLUIDIC PARALLEL DROPLET SYSTEM: A high throughput system for the production of up to 30,000 monodispersed microdroplets per second ranging from 20 to 60 microns. The microfluidic parallel droplet system allows users to create stable water-in-oil or oil-in-water droplets facilitating a broad range of applications in drug and food production. MICROFLUIDIC DROPLET COLLECTION SYSTEM: This system is well suited for the generation, collection and analysis of monodispersed emulsions. The microfluidic droplet collection system features the droplet collection module that allows emulsions to be collected without flow disruption or droplet coalescence. The microfluidic droplet size can be accurately adjusted and quickly changed enabling full control over emulsion characteristics. MICROFLUIDIC MICROMIXER SYSTEM: This system is made of a microfluidic device, precision pumping, microfluidic elements and software to obtain excellent mixing. A lamination-based compact micromixer glass microfluidic device allows rapid mixing of two or three fluid streams in each of the two independent mixing geometries. Perfect mixing can be achieved with this microfluidic device at both high and low flow rate ratios. The microfluidic device, and its surrounding components offer excellent chemical stability, high visibility for optics, and good optical transmission. The micromixer system performs exceptionally fast, works in continuous flow mode and can completely mix two or three fluid streams within milliseconds. Some applications of this microfluidic mixing device are reaction kinetics, sample dilution, improved reaction selectivity, rapid crystallization and nanoparticle synthesis, cell activation, enzyme reactions and DNA hybridization. MICROFLUIDIC DROPLET-ON-DEMAND SYSTEM: This is a compact and portable droplet-on-demand microfluidic system to generate droplets of up to 24 different samples and store up to 1000 droplets with sizes down to 25 nanoliters. The microfluidic system offers excellent control of droplet size and frequency as well as allowing the use of multiple reagents to create complex assays quickly and easily. Microfluidic droplets can be stored, thermally cycled, merged or split from nanoliter to picoliter droplets. Some applications are, generation of screening libraries, cell encapsulation, encapsulation of organisms, automation of ELISA tests, preparation of concentration gradients, combinatorial chemistry, cell assays. NANOPARTICLE SYNTHESIS SYSTEM: Nanoparticles are smaller than 100nm and benefit a range of applications such as the synthesis of silicon based fluorescent nanoparticles (quantum dots) to label biomolecules for diagnostic purposes, drug delivery, and cellular imaging. Microfluidics technology is ideal for nanoparticle synthesis. Reducing reagent consumption, it allows tighter particle size distributions, improved control over reaction times and temperatures, as well as better mixing efficiency. MICROFLUIDIC DROPLET MANUFACTURE SYSTEM: High-throughput microfluidic system that facilitates production of up to a tonne of highly monodispersed droplets, particles or emulsion a month. This modular, scalable and highly flexible microfluidic system allows up to 10 modules to be assembled in parallel, enabling identical conditions for up to 70 microfluidic chip droplet junctions. Mass-production of highly monodispersed microfluidic droplets ranging between 20 microns and 150 microns is possible that can be flowed directly off the chips, or into tubes. Applications include particle production - PLGA, gelatine, alginate, polystyrene, agarose, drug delivery in creams, aerosols, bulk precision manufacturing of emulsions and foams in food, cosmetics, paint industries, nanoparticle synthesis, parallel micromixing and micro-reactions. PRESSURE-DRIVEN MICROFLUIDIC FLOW CONTROL SYSTEM: The closed-loop smart flow control provides control of flow rates from nanoliters/min to mililiters/min, at pressures from 10 bar down to vacuum. A flow rate sensor connected in-line between the pump and the microfluidic device facilitates users to enter a flow rate target directly on the pump without the need for a PC. Users will get smoothness of pressure and repeatability of volumetric flow in their microfluidic devices. Systems can be extended to multiple pumps, which will all control flow rate independently. To operate in flow control mode, the flow rate sensor needs to be connected to the pump using either the sensor display or sensor interface. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Glass Cutting Shaping Tools offered by AGS-TECH, Inc. We supply high quality diamond wheel series, diamond wheel for solar glass, diamond wheel for CNC machine, peripheral diamond wheel, cup & bowl shape diamond wheels, resin wheel series, polishing wheel series, felt wheel, stone wheel, coating removal wheel... Алатки за обликување на сечење стакло Please click on the Glass Cutting and Shaping Tools of interest below to download related brochure. Diamond Wheel Series Diamond Wheel for Solar Glass Diamond Wheel for CNC Machine Peripheral Diamond Wheel Cup & Bowl Shape Diamond Wheel Resin Wheel Series Polishing Wheel Series 10S Polishing Wheel Felt Wheel Stone Wheel Coating Removal Wheel BD Polishing Wheel BK Polishing Wheel 9R Ploshing Wheel Polishing Material series Cerium Oxide Series Glass Drill Series Glass Tool Series Other Glass Tools Glass Plier Glass Suction & Lifter Grinding Tool Power Tool UV,Testing Tool Sandblast Fittings Series Machine Fittings Series Cutting Discs Glass Cutters Ungrouped Price of our glass cutting shaping tools depends on model and quantity of order. If you would like us to design and/or manufacture glass cutting and shaping tools specifically for you, please either provide us detailed blueprints, or ask us for help. We will then design, prototype and manufacture them specially for you. Since we carry a wide variety of glass cutting, drilling, grinding, polishing and shaping products with different dimensions, applications and material; it is impossible to list them here. We encourage you to email or call us so we can determine which product is the best fit for you. When contacting us, please inform us about: - Intended application - Material grade preferred - Dimensions - Finishing requirements - Packaging requirements - Labeling requirements - Quantity of your planned order & estimated yearly demand Private Label Auto Glass Repair and Replacement Systems We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools for Every Industry This catalog contains a few glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tool Accessories This brochure includes some glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry This catalog contains some glass cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. КЛИКНЕТЕ ТУКА за да ги преземете нашите технички способности и референтниот водич за специјализирани алатки за сечење, дупчење, мелење, обликување, обликување, полирање што се користат во медицински, стоматолошки, прецизни инструменти, печат на метал, обликување матрица и други индустриски апликации. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор Кликнете овде за да отидете во менито Алатки за сечење, дупчење, брусење, преклопување, полирање, коцки и обликување Уп. Шифра: OICASANHUA

Functional & Decorative Coatings, Thin Film, Thick Films, Antireflective and Reflective Mirror Coating - AGS-TECH Inc. Функционални облоги / Декоративни премази / Тенок филм / Дебел филм A COATING is a covering that is applied to the surface of an object. Coatings can be in the form of THIN FILM (less than 1 micron thick) or THICK FILM (over 1 micron thick). Based on the purpose of applying the coating we can offer you DECORATIVE COATINGS and/or FUNCTIONAL COATINGS, or both. Sometimes we apply functional coatings to change the surface properties of the substrate, such as adhesion, wettability, corrosion resistance, or wear resistance. In some other cases such as in semiconductor device fabrication, we apply the functional coatings to add a completely new property such as magnetization or electrical conductivity which become an essential part of the finished product. Our most popular FUNCTIONAL COATINGS are: Adhesive Coatings: Examples are adhesive tape, iron-on fabric. Other functional adhesive coatings are applied to change the adhesion properties, such as non-stick PTFE coated cooking pans, primers that encourage subsequent coatings to adhere well. Tribological Coatings: These functional coatings relate to the principles of friction, lubrication and wear. Any product where one material slides or rubs over another is affected by complex tribological interactions. Products like hip implants and other artificial prosthesis are lubricated in certain ways whereas other products are unlubricated as in high temperature sliding components where conventional lubricants can not be used. The formation of compacted oxide layers have been proven to protect against wear of such sliding mechanical parts. Tribological functional coatings have huge benefits in industry, minimizing wear of machine elements, minimizing wear and tolerance deviations in manufacturing tools such as dies and moulds, minimizing power requirements and making machinery and equipment more energy efficient. Optical Coatings: Examples are Anti-reflective (AR) coatings, reflective coatings for mirrors, UV- absorbent coatings for protection of eyes or for increasing the life of the substrate, tinting used in some colored lighting, tinted glazing and sunglasses. Catalytic Coatings such as applied on self-cleaning glass. Light-Sensitive Coatings used to make products such as photographic films Protective Coatings: Paints can be considered protecting the products besides being decorative in purpose. Hard anti-scratch coatings on plastics and other materials are one of our most widely used functional coatings to reduce scratching, improve wear resistance, …etc. Anti-corrosion coatings such as plating are also very popular. Other protective functional coatings are put on waterproof fabric and paper, antimicrobial surface coatings on surgical tools and implants. Hydrophilic / Hydrophobic Coatings: Wetting (hydrophilic) and unwetting (hydrophobic) functional thin and thick films are important in applications where water absorption is either desired or undesired. Using advanced technology we can alter your product surfaces, to make them either easily wettable or unwettable. Typical applications are in textiles, dressings, leather boots, pharmaceutical or surgical products. Hydrophilic nature refers to a physical property of a molecule that can transiently bond with water (H2O) through hydrogen bonding. This is thermodynamically favorable, and makes these molecules soluble not only in water, but also in other polar solvents. Hydrophilic and hydrophobic molecules are also known as polar molecules and nonpolar molecules, respectively. Magnetic Coatings: These functional coatings add magnetic properties such as is the case for magnetic floppy disks, cassettes, magnetic stripes, magnetooptic storage, inductive recording media, magnetoresist sensors, and thin-film heads on products. Magnetic thin films are sheets of magnetic material with thicknesses of a few micrometers or less, used primarily in the electronics industry. Magnetic thin films can be single-crystal, polycrystalline, amorphous, or multilayered functional coatings in the arrangement of their atoms. Both ferro- and ferrimagnetic films are used. The ferromagnetic functional coatings are usually transition-metal-based alloys. For example, permalloy is a nickel-iron alloy. The ferrimagnetic functional coatings, such as garnets or the amorphous films, contain transition metals such as iron or cobalt and rare earths and the ferrimagnetic properties are advantageous in magnetooptic applications where a low overall magnetic moment can be achieved without a significant change in the Curie temperature. Some sensor elements function on the principle of change in electrical properties, such as the electrical resistance, with a magnetic field. In semiconductor technology, the magnetoresist head used in disk storage technology functions with this principle. Very large magnetoresist signals (giant magnetoresistance) are observed in magnetic multilayers and composites containing a magnetic and nonmagnetic material. Electrical or Electronic Coatings: These functional coatings add electrical or electronic properties such as conductivity to manufacture products such as resistors, insulation properties such as in the case of magnet wire coatings used in transformers. DECORATIVE COATINGS: When we speak of decorative coatings the options are only limited by your imagination. Both thick and thin film type coatings have been successfully engineered and applied in the past to our customers products. Regardless of the difficulty in the geometric shape and material of the substrate and application conditions, we are always capable to formulate the chemistry, physical aspects such as exact Pantone code of color and application method for your desired decorative coatings. Complex patterns involving shapes or different colors are also possible. We can make your plastic polymer parts look metallic. We can color anodize extrusions with various patterns and it won’t even look anodized. We can mirror coat an oddly-shaped part. Furthermore decorative coatings can be formulated that will also act as functional coatings at the same time. Any of the below mentioned thin and thick film deposition techniques used for functional coatings can be deployed for decorative coatings. Here are some of our popular decorative coatings: - PVD Thin Film Decorative Coatings - Electroplated Decorative Coatings - CVD and PECVD Thin Film Decorative Coatings - Thermal Evaporation Decorative Coatings - Roll-to-Roll Decorative Coating - E-Beam Oxide Interference Decorative Coatings - Ion Plating - Cathodic Arc Evaporation for Decorative Coatings - PVD + Photolithography, Heavy Gold Plating on PVD - Aerosol Coatings for Glass Coloring - Anti-tarnish Coating - Decorative Copper-Nickel-Chrome Systems - Decorative Powder Coating - Decorative Painting, Custom Tailored Paint Formulations using Pigments, Fillers, Colloidal Silica Dispersant...etc. If you contact us with your requirements for decorative coatings, we can provide you our expert opinion. We have advanced tools such as color readers, color comparators….etc. to guarantee consistent quality of your coatings. THIN and THICK FILM COATING PROCESSES: Here are the most widely used of our techniques. Electro-Plating / Chemical Plating (hard chromium, chemical nickel) Electroplating is the process of plating one metal onto another by hydrolysis, for decorative purposes, corrosion prevention of a metal or other purposes. Electroplating lets us use inexpensive metals such as steel or zinc or plastics for the bulk of the product and then apply different metals on the outside in the form of a film for better appearance, protection, and for other properties desired for the product. Electroless plating, also known as chemical plating, is a non-galvanic plating method that involves several simultaneous reactions in an aqueous solution, which occur without the use of external electrical power. The reaction is accomplished when hydrogen is released by a reducing agent and oxidized, thus producing a negative charge on the surface of the part. Advantages of these thin and thick films are good corrosion resistance, low processing temperature, possibility to deposit in bore holes, slots… etc. Disadvantages are the limited selection of coating materials, relatively soft nature of the coatings, environmentally polluting treatment baths that are needed including chemicals such as cyanide, heavy metals, fluorides, oils, limited accuracy of surface replication. Diffusion Processes (Nitriding, nitrocarburization, boronizing, phosphating, etc.) In heat treatment furnaces, the diffused elements usually originate from gases reacting at high temperatures with the metal surfaces. This can be a pure thermal and chemical reaction as a consequence of the thermal dissociation of the gases. In some cases, diffused elements originate from solids. The advantages of these thermochemical coating processes are good corrosion resistance, good reproducibility. The disadvantages of these are being relatively soft coatings, limited selection of base material (which must be suitable for nitriding), long processing times, environmental and health hazards involved, requirement of post-treatment. CVD (Chemical Vapor Deposition) CVD is a chemical process used to produce high quality, high-performance, solid coatings. The process produces thin films too. In a typical CVD, the substrates are exposed to one or more volatile precursors, that react and/or decompose on the substrate surface to produce the desired thin film. Advantages of these thin & thick films are their high wear resistance, potential to economically produce thicker coatings, suitability for bore holes, slots ….etc. Disadvantages of CVD processes are their high processing temperatures, difficulty or impossibility of coatings with multiple metals (such as TiAlN), rounding of edges, use of environmentally hazardous chemicals. PACVD / PECVD (Plasma-Assisted Chemical Vapor Deposition) PACVD is also called PECVD standing for Plasma Enhanced CVD. Whereas in a PVD coating process the thin & thick film materials are evaporated from a solid form, in PECVD the coating results from a gas phase. Precursor gasses are cracked in the plasma to become available for the coating. Advantages of this thin and thick film deposition technique is that significantly lower process temperatures are possible as compared to CVD, precise coatings are deposited. Disadvantages of PACVD are that it has only limited suitability for bore holes, slots etc. PVD (Physical Vapor Deposition) PVD processes are a variety of purely physical vacuum deposition methods used to deposit thin films by the condensation of a vaporized form of the desired film material onto workpiece surfaces. Sputtering and evaporative coatings are examples of PVD. Advantages are that no environmentally damaging materials and emissions are produced, a large variety of coatings can be produced, coating temperatures are below the final heat treatment temperature of most steels, precisely reproducible thin coatings, high wear resistance, low frictional coefficient. Disadvantages are bore holes, slots ...etc. can only be coated down to a depth equal to the diameter or width of the opening, corrosion resistant only under certain conditions, and for obtaining uniform film thicknesses, parts must be rotated during deposition. The adhesion of functional and decorative coatings are substrate dependent. Furthermore, the lifetime of thin and thick film coatings depends on environmental parameters such as humidity, temperature...etc. Therefore, before considering a functional or decorative coating, contact us for our opinion. We can choose the most suitable coating materials and coating technique that fits your substrates and application and deposit them under the strictest quality standards. Contact AGS-TECH Inc. for details of thin and thick film deposition capabilities. Do you need design assistance ? Do you need prototypes ? Do you need mass manufacturing ? We are here to help you. Click on blue colored text below to download product catalogs and brochures: - Private Label Nano Surface Protection Car Care Products We can label these products with your name and logo if you wish - Private Label Nano Surface Industrial Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Marine Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Products We can label these products with your name and logo if you wish КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Active Optical Components - Lasers - Photodetectors - LED Dies - Photomicrosensor - Fiber Optic - AGS-TECH Inc. - USA Производство и склопување на активни оптички компоненти The ACTIVE OPTICAL COMPONENTS we manufacture and supply are: • Lasers and photodetectors, PSD (Position Sensitive Detectors), quadcells and other optical sensors and sensor systems with electrical connections. Our active optical components span a large spectrum of wavelength regions. Whether your application is high power lasers for industrial cutting, drilling, welding...etc, or medical lasers for surgery or diagnostics, or telecommunication lasers or detectors suitable for the ITU grid, we are your one-stop source. Below are downloadable brochures for some of our off-the-shelf active optical components and devices. If you cannot find what you are searching for, please contact us and we will have something to offer you. We do also custom manufacture active optical components and assemblies according to your application and requirements. • Among the many achievements of our optical engineers is the concept design, optical and opto-mechanical design of optical scan head for GS 600 LASER DRILLING SYSTEM with dual galvo scanners and self compensating alignment. Since its introduction, the GS600 family has become the system of choice for many leading high volume manufacturers around the World. Using optical design tools such as ZEMAX and CodeV, our optical engineers are ready to design your custom systems. If you only have SOLIDWORKS files for your design, don't worry, send them and we will work out and create the optical design files, optimize & simulate and have you approve the final design. Even a hand sketch, a mockup, a prototype or sample is sufficient in most cases for us to take care of your product development needs. Click on blue highlighted text to download brochures and catalogs of some off-the-shelf-ready active optical products: Active fiber optic products Comprehensive electric & electronic components catalog for off-shelf products Hikrobot Machine Vision Products Hikrobot Smart Machine Vision Products Hikrobot Machine Vision Standard Products Hikvision Logistic Vision Solutions LED dies and chips Photomicrosensors Photosensors Photosensors and Photomicrosensors Sockets and Accessories Private Label Medical Endoscopes and Visualization Systems (We can put your company name and logo on these) Sensors & Analytical Measurement Systems for Optical OEM Applications in Liquid Analysis (We private label these with your brand name and logo if you wish. We can customize sensors to your needs and applications, OEM option available) Dowload brochure for our DESIGN PARTNERSHIP PROGRAM R e ference Code: OICASANLY КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Test Equipment for Furniture Testing, Sofa Durability Tester, Chair Base Static Tester, Chair Drop Impact Tester, Mattress Firmness Tester Тест опрема за тестирање на мебел Specialized Test Equipment for Testing of Furniture are used for testing furniture products such as chairs, table, sofas, mattress....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of furniture are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of furniture can be downloaded from the colored links below: HAIDA Bifma Furnitures Testing Machine HAIDA Chair Arm and Leg Tester HAIDA Chair Base Static Tester HAIDA Chair Caster Durability Tester HAIDA Chair Drop Impact Tester HAIDA Chair and Foam Testing Machine HAIDA Chair Seating and Back Durability HAIDA Chair Strength Tester HAIDA Chair Swivel Tester Catalog Download HAIDA Chair Universal Test Machine HAIDA Color Assessment Cabinet HAIDA Foam Pounding Fatigue Tester HAIDA Furniture Universal Test Machine HAIDA Mattress Cornell Tester HAIDA Mattress Firmness Tester HAIDA Mattress Rollator Durability Tester HAIDA Mattress Rollator Durability Tester-2 HAIDA Sofa Durability Tester HD-F769 HAIDA Sofa Durability Tester HD-F761 HAIDA Sofa Iron Frame Fatigue Tester HAIDA Universal Test Field for Tables Chairs За друга слична опрема, посетете ја нашата веб-страница за опрема: http://www.sourceindustrialsupply.com КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Test Equipment for Testing Paper & Packaging Products, Adhesive Tape Peel Test Machine, Carton Compressive Tester, Foam Compression Hardness Tester, Zero Drop Test Machine, Package Incline Impact Tester Тест опрема за тестирање на хартија и производи за пакување Specialized Test Equipment for Testing of Paper & Packaging Products are used for testing paper & packaging products such as cardboard boxes, carton materials, foam and cushioning materials and other types of packages....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for PAPER & PACKAGING TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for PAPER & PACKAGING TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of Paper & Packaging Products are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of Paper & Packaging Products can be downloaded from the colored links below: HAIDA Adhesive Tape Peel Test Machine HAIDA Automatic Bursting Strength Test Machine HAIDA Bursting Strength Tester Series HAIDA Clamping Force Testing Machine HAIDA Computer Servo Carton Compressive Tester Series HAIDA Double-Column Drop Test Machine HAIDA Foam Compression Hardness Tester HAIDA Foam Pounding Fatigue Tester HAIDA Foam Rebound Test Machine HAIDA Foam Tear Resistance Tester HAIDA Four Point Bending Stiffness Tester HAIDA Microcomputer Carton Compressive Tester Series HAIDA Microcomputer Ring Crush & Edge HAIDA Package Incline Impact Tester HAIDA Paper Four Point Bending Resistance Tester HAIDA Ring Crush & Edge Crush Tester Series HAIDA Single Drop Test Machine HAIDA Universal Packaging Material Testing Machine HAIDA Zero Drop Test Machine За друга слична опрема, посетете ја нашата веб-страница за опрема: http://www.sourceindustrialsupply.com КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор PREVIOUS PAGE

Optical Connectors, Adapters, Terminators, Pigtails, Patchcords, Fiber Distribution Box, AGS-TECH Inc. - USA Оптички конектори и производи за интерконекција Ние снабдуваме: • Склоп на оптички конектор, адаптери, терминатори, пигтили, лепенки, предни плочи на конектори, полици, комуникациски лавици, кутија за дистрибуција на влакна, FTTH јазол, оптичка платформа. Имаме склопување на оптички конектор и компоненти за интерконекција за телекомуникации, пренос на видлива светлина за осветлување, ендоскоп, фиберскоп и друго. Во последниве години, овие производи за оптичко поврзување станаа стока и можете да ги купите од нас за мал дел од цените што веројатно ги плаќате сега. Само оние кои се паметни да ги намалат трошоците за набавка можат да преживеат во денешната глобална економија. CLICK Product Finder-Locator Service ПРЕТХОДНА СТРАНИЦА