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Mesomanufacturing - Mesoscale Manufacturing - Miniature Device Fabrication - Tiny Motors - AGS-TECH Inc. - New Mexico Мезоскала Производство / Мезопроизводство With conventional production techniques we produce “macroscale” structures that are relatively large and visible to the naked eye. With MESOMANUFACTURING however we produce components for miniature devices. Mesomanufacturing is also referred to as MESOSCALE MANUFACTURING or MESO-MACHINING. Mesomanufacturing overlaps both macro and micromanufacturing. Examples of mesomanufacturing are hearing aides, stents, very small motors. The first approach in mesomanufacturing is to scale macromanufacturing processes down. For example a tiny lathe with dimensions in the few dozen millimeters and a motor of 1.5W weighing 100 grams is a good example of mesomanufacturing where downscaling has taken place. The second approach is to scale micromanufacturing processes up. As an example LIGA processes can be upscaled and enter the realm of mesomanufacturing. Our mesomanufacturing processes are bridging the gap between silicon-based MEMS processes and conventional miniature machining. Mesoscale processes can fabricate two and three-dimensional parts having micron size features in traditional materials such as stainless steels, ceramics, and glass. Mesomanufacturing processes that are currently available to us include, focused ion beam (FIB) sputtering, micro-milling, micro-turning, excimer laser ablation, femto-second laser ablation, and micro electro-discharge (EDM) machining. These mesoscale processes employ subtractive machining technologies (i.e., material removal), whereas the LIGA process, is an additive mesoscale process. Mesomanufacturing processes have different capabilities and performance specifications. Machining performance specifications of interest include minimum feature size, feature tolerance, feature location accuracy, surface finish, and material removal rate (MRR). We have the capability of mesomanufacturing electro-mechanical components that require mesoscale parts. The mesoscale parts fabricated by subtractive mesomanufacturing processes have unique tribological properties because of the variety of materials and the surface conditions produced by the different mesomanufacturing processes. These subtractive mesoscale machining technologies bring us concerns related to cleanliness, assembly, and tribology. Cleanliness is vital in mesomanufacturing because mesoscale dirt and debris particle size created during the meso-machining process can be comparable to mesoscale features. Mesoscale milling and turning can create chips and burrs that can block holes. Surface morphology and surface finish conditions vary greatly depending on the mesomanufacturing method. Mesoscale parts are difficult to handle and align which makes assembly a challenge which most of our competitors are unable to overcome. Our yield rates in mesomanufacturing is far higher than our competitors which gives us the advantage of being able to offer better prices. MESOSCALE MACHINING PROCESSES: Our major mesomanufacturing techniques are Focused Ion Beam (FIB), Micro-milling, & Micro-turning, laser meso-machining, Micro-EDM (electro-discharge machining) Mesomanufacturing using focused Ion Beam (FIB), Micro-milling, & Micro-turning: The FIB sputters material from a workpiece by Gallium ion beam bombardment. The workpiece is mounted to a set of precision stages and is placed in a vacuum chamber underneath the source of Gallium. The translation and rotation stages in the vacuum chamber make various locations on the work piece available to the beam of Gallium ions for FIB mesomanufacturing. A tunable electric field scans the beam to cover a pre-defined projected area. A high voltage potential causes a source of Gallium ions to accelerate and collide with the work piece. The collisions strip away atoms from the work piece. The result of the FIB meso-machining process can be the creation of a near vertical facets. Some FIBs available to us have beam diameters as small as 5 nanometers, making the FIB a mesoscale and even microscale capable machine. We mount micro-milling tools on high precision milling machines to machine channels in aluminum. Using FIB we can fabricate micro-turning tools which can then be used on a lathe to fabricate finely threaded rods. In other words, FIB can be used to machine hard tooling besides directly meso-machining features onto the end work piece. The slow material removal rate has rendered the FIB as impractical for directly machining large features. The hard tools, however, can remove material at an impressive rate and are durable enough for several hours of machining time. Nevertheless, the FIB is practical for directly meso-machining complex three dimensional shapes that do not require a substantial material removal rate. Length of exposure and angle of incidence can greatly affect the geometry of directly machined features. Laser Mesomanufacturing: Excimer lasers are used for mesomanufacturing. The excimer laser machines material by pulsing it with nanosecond pulses of ultraviolet light. The work piece is mounted to precision translational stages. A controller coordinates the motion of the work piece relative to the stationary UV laser beam and coordinates the firing of the pulses. A mask projection technique can be used to define meso-machining geometries. The mask is inserted into the expanded part of the beam where the laser fluence is too low to ablate the mask. The mask geometry is de-magnified through the lens and projected onto the work piece. This approach can be used for machining multiple holes (arrays) simultaneously. Our excimer and YAG lasers can be used to machine polymers, ceramics, glass and metals having feature sizes as small as 12 microns. Good coupling between the UV wavelength (248 nm) and the workpiece in laser mesomanufacturing / meso-machining results in vertical channel walls. A cleaner laser meso-machining approach is to use a Ti-sapphire femtosecond laser. The detectable debris from such mesomanufacturing processes are nano-sized particles. Deep one micron-size features can be microfabricated using the femtosecond laser. The femtosecond laser ablation process is unique in that it breaks atomic bonds instead of thermally ablating material. The femtosecond laser meso-machining / micromachining process has a special place in mesomanufacturing because it is cleaner, micron capable, and it is not material specific. Mesomanufacturing using Micro-EDM (electro-discharge machining): Electro-discharge machining removes material through a spark erosion process. Our micro-EDM machines can produce features as small as 25 microns. For the sinker and the wire micro-EDM machine, the two major considerations for determining feature size are the electrode size and the over-bum gap. Electrodes little over 10 microns in diameter and over-bum as little as a few microns are being used. Creating an electrode having a complex geometry for the sinker EDM machine requires know-how. Both graphite and copper are popular as electrode materials. One approach to fabricating a complicated sinker EDM electrode for a mesoscale part is to use the LIGA process. Copper, as the electrode material, can be plated into LIGA molds. The copper LIGA electrode can then be mounted onto the sinker EDM machine for mesomanufacturing a part in a different material such as stainless steel or kovar. No one mesomanufacturing process is sufficient for all operations. Some mesoscale processes are more wide reaching than others, but each process has its niche. Most of the time we require a variety of materials to optimize performance of mechanical components and are comfortable with traditional materials such as stainless steel because these materials have a long history and have been very well characterized through the years. Mesomanufacturing processes allow us to use traditional materials. Subtractive mesoscale machining technologies expand our material base. Galling may be an-issue with some material combinations in mesomanufacturing. Each particular mesoscale machining process uniquely affects the surface roughness and morphology. Micro-milling and micro-turning may generate burrs and particles that can cause mechanical problems. Micro-EDM may leave a recast layer that can have particular wear and friction characteristics. Friction effects between mesoscale parts may have limited points of contact and are not accurately modeled by surface contact models. Some mesoscale machining technologies, such as micro-EDM, are fairly mature, as opposed to others, such as femtosecond laser meso-machining, which still require additional development. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

PCB - PCBA - Printed Circuit Board Assembly - Rigid Flexible Multilayer - Surface Mount Assembly - SMA - AGS-TECH Inc. PCB & PCBA Производство и склопување We offer: PCB: Printed Circuit Board PCBA: Printed Circuit Board Assembly • Printed Circuit Board Assemblies of all types (PCB, rigid, flexible and multilayer) • Substrates or complete PCBA assembly depending on your needs. • Thru-Hole and Surface Mount Assembly (SMA) Please send us your Gerber files, BOM, component specifications. We can either assemble your PCBs and PCBA's using your exact components specified, or we can offer you our matching alternatives. We are experienced shipping PCBs and PCBAs and will make sure to package them in antistatic bags to avoid electrostatic damage. PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. Our conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Some are engineering plastics sputtered onto the PCB in a vacuum chamber. Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Our tests analyze characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts. The PCB boards may use organic or inorganic base materials in a single or multilayer, rigid or flexible form. Circuitry construction may include etched, die stamped, precut, flush press, additive, and plated conductor techniques. Printed-component parts may be used. The suitability of the pattern parameters, temperature and maximum solder limits shall be determined in accordance with the applicable end-product construction and requirements. Don't wait, call us for more information, design assistance, prototypes and mass production. If you need, we will take care of all the labeling, packaging, shipping, import & customs, storage and delivery. Below you can download our relevant brochures and catalogs for PCB and PCBA assembly: General process capabilities & tolerances for rigid PCB manufacturing General process capabilities & tolerances for aluminum PCB manufacturing General process capabilities & tolerances for flexible and rigid-flexible PCB manufacturing General PCB Fabrication Processes General process summary of Printed Circuit Board Assembly PCBA manufacturing Overview of Printed Circuit Boards Manufacturing Plant Some more brochures of our products we can use in your PCB and PCBA assembly projects: To download our catalog for off-shelf interconnect components & hardware such as quick-fit terminals, USB plugs & sockets, micro pins & jacks and more, please CLICK HERE Terminal Blocks and Connectors Terminal Blocks General Catalogue Standard heat sinks Extruded heat sinks Easy Click heat sinks a perfect product for PCB assemblies Super Power heat sinks for medium - high power electronic systems Heat sinks with Super Fins LCD modules Receptacles-Power Entry-Connectors Catalogue Dowload brochure for our DESIGN PARTNERSHIP PROGRAM If you are interested in our engineering and research & development capabilities instead of manufacturing operations and capabilities, then we invite you to visit our engineering site http://www.ags-engineering.com КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Brazing - Soldering - Welding - Joining Processes - Assembly Services - Subassemblies - Assemblies - Custom Manufacturing - AGS-TECH Inc. - NM - USA Лемење и лемење и заварување Among the many JOINING techniques we deploy in manufacturing, special emphasis is given to WELDING, BRAZING, SOLDERING, ADHESIVE BONDING and CUSTOM MECHANICAL ASSEMBLY because these techniques are widely used in applications like manufacturing of hermetic assemblies, high-tech product manufacturing and specialized sealing. Here we will concentrate on the more specialized aspects of these joining techniques as they are related to manufacturing of advanced products and assemblies. FUSION WELDING: We use heat to melt and coalesce materials. Heat is supplied by electricity or high-energy beams. The types of fusion welding we deploy are OXYFUEL GAS WELDING, ARC WELDING, HIGH-ENERGY-BEAM WELDING. SOLID-STATE WELDING: We join parts without melting and fusion. Our solid-state welding methods are COLD, ULTRASONIC, RESISTANCE, FRICTION, EXPLOSION WELDING and DIFFUSION BONDING. BRAZING & SOLDERING: They use filler metals and give us the advantage of working at lower temperatures than in welding, thus less structural damage to products. Information on our brazing facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum and fluid control components can be found here: Brazing Factory Brochure Brazing Machines (We private label these with your brand name and logo if you wish. This way you can promote your brand name when you resell these machines to your customers) ADHESIVE BONDING: Because of the diversity of adhesives used in industry and also diversity of applications, we have a dedicated page for this. To go to our page about adhesive bonding, please click here. CUSTOM MECHANICAL ASSEMBLY: We use a variety of fasteners such as bolts, screws, nuts, rivets. Our fasteners are not limited to standard off-shelf fasteners. We design, develop and manufacture specialty fasteners that are made from nonstandard materials so they can meet requirements for special applications. Sometimes electrical or heat non-conductivity is desired whereas sometimes conductivity. For some special applications, a customer may want special fasteners that cannot be removed without destroying the product. There are endless ideas and applications. We have it all for you, if not off-shelf we can quickly develop it. To go to our page on mechanical assembly, please click here . Let us examine our various joining techniques in more details. OXYFUEL GAS WELDING (OFW): We use a fuel gas mixed with oxygen to produce the welding flame. When we use acetylene as the fuel and oxygen, we call it oxyacetylene gas welding. Two chemical reactions occur in the oxyfuel gas combustion process: C2H2 + O2 ------» 2CO + H2 + Heat 2CO + H2 + 1.5 O2--------» 2 CO2 + H2O + Heat The first reaction dissociates the acetylene into carbon monoxide and hydrogen while producing about 33% of the total heat generated. The second process above represents further combustion of the hydrogen and carbon monoxide while producing about 67% of the total heat. Temperatures in the flame are between 1533 to 3573 Kelvin. The oxygen percentage in the gas mixture is important. If the oxygen content is more than half, the flame becomes an oxidizing agent. This is undesirable for some metals but desirable for others. An example when oxidizing flame is desirable is copper-based alloys because it forms a passivation layer over the metal. On the other hand, when the oxygen content is reduced, full combustion is not possible and the flame becomes a reducing (carburizing) flame. The temperatures in a reducing flame are lower and therefore it is suitable for processes like soldering and brazing. Other gases are also potential fuels, but they have some disadvantages over acetylene. Occasionally we supply filler metals to the weld zone in the form of filler rods or wire. Some of them are coated with flux to retard oxidation of surfaces and thus protecting the molten metal. An additional benefit the flux gives us is the removal of oxides and other substances from the weld zone. This leads to stronger bonding. A variation of the oxyfuel gas welding is the PRESSURE GAS WELDING, where the two components are heated at their interface using oxyacetylene gas torch and once the interface starts to melt, the torch is withdrawn and an axial force is applied to press the two parts together until the interface is solidified. ARC WELDING: We use electrical energy to produce an arc between the electrode tip and parts to be welded. The power supply can be AC or DC while the electrodes are either consumable or nonconsumable. Heat transfer in arc welding can be expressed by the following equation: H / l = e x V I / v Here H is the heat input, l is the weld length, V and I are the voltage and current applied, v is the welding speed and e is the process efficiency. The higher the efficiency “e” the more beneficially the available energy is used to melt the material. The heat input can also be expressed as : H = u x (Volume) = u x A x l Here u is the specific energy for melting, A the cross section of the weld and l the weld length. From the two equations above we can obtain: v = e x V I / u A A variation of arc welding is the SHIELDED METAL ARC WELDING (SMAW) which constitutes about 50% of all industrial and maintenance welding processes. ELECTRIC ARC WELDING (STICK WELDING) is performed by touching the tip of a coated electrode to the workpiece and quickly withdrawing it to a distance sufficient to maintain the arc. We call this process also stick-welding because the electrodes are thin and long sticks. During the welding process, the tip of the electrode melts along with its coating and the base metal in the vicinity of the arc. A mixture of the base metal, electrode metal and substances from the electrode coating solidify in the weld area. The coating of the electrode deoxidizes and provides a shielding gas in the weld region, thus protecting it from the oxygen in the environment. Therefore the process is referred to as shielded metal arc welding. We use currents between 50 and 300 Amperes and power levels generally less than 10 kW for optimum weld performance. Also of importance is the polarity of the DC current (direction of current flow). Straight polarity where the workpiece is positive and the electrode is negative is preferred in welding of sheet metals because of its shallow penetration and also for joints with very wide gaps. When we have reverse polarity, i.e. the electrode is positive and workpiece negative we can achieve deeper weld penetrations. With AC current, since we have pulsating arcs, we can weld thick sections using large diameter electrodes and maximum currents. The SMAW welding method is suitable for workpiece thicknesses of 3 to 19 mm and even more using multiple-pass techniques. The slag formed on top of the weld needs to be removed using a wire brush, so that there is no corrosion and failure at the weld area. This of course adds to the cost of shielded metal arc welding. Nevertheless the SMAW is the most popular welding technique in industry and repair work. SUBMERGED ARC WELDING (SAW): In this process we shield the weld arc using granular flux materials like lime, silica, calcium floride, manganese oxide….etc. The granular flux is fed into the weld zone by gravity flow through a nozzle. The flux covering the molten weld zone significantly protects from sparks, fumes, UV radiation….etc and acts as a thermal insulator, thus letting heat penetrate deep into workpiece. The unfused flux is recovered, treated and reused. A coil of bare is used as electrode and fed through a tube to the area of weld. We use currents between 300 and 2000 Amperes. The submerged arc welding (SAW) process is limited to horizontal and flat positions and circular welds if rotation of the circular structure (such as pipes) is possible during welding. Speeds can reach 5 m/min. The SAW process is suitable for thick plates and results in high-quality, tough, ductile and uniform welds. The productivity, that is the amount of weld material deposited per hour is 4 to 10 times the amount as compared to the SMAW process. Another arc welding process, namely the GAS METAL ARC WELDING (GMAW) or alternatively referred to as METAL INERT GAS WELDING (MIG) is based on the weld area being shielded by external sources of gases like helium, argon, carbon dioxide….etc. There may be additional deoxidizers present in the electrode metal. Consumable wire is fed through a nozzle into the weld zone. Fabrication involving bot ferrous as well as nonferrous metals is carried out using gas metal arc welding (GMAW). Welding productivity is about 2 times that of the SMAW process. Automated welding equipment is being used. Metal is transferred in one of three ways in this process: “Spray Transfer” involves transfer of several hundred small metal droplets per second from electrode to the weld area. In “Globular Transfer” on the other hand, carbon dioxide rich gases are used and globules of molten metal are propelled by the electric arc. Welding currents are high and weld penetration deeper, welding speed greater than in spray transfer. Thus the globular transfer is better for welding heavier sections. Finally, in the “Short Circuiting” method, the electrode tip touches the molten weld pool, short circuiting it as metal at rates over 50 droplets/second is transferred in individual droplets. Low currents and voltages are used along with thinner wire. Powers used are about 2 kW and temperatures relatively low, making this method suitable for thin sheets less than 6mm thickness. Another variation the FLUX-CORED ARC WELDING (FCAW) process is similar to gas metal arc welding, except that the electrode is a tube filled with flux. The advantages of using cored-flux electrodes is that they produce more stable arcs, give us the opportunity to improve properties of weld metals, less brittle and flexible nature of its flux as compared to SMAW welding, improved welding contours. Self-shielded cored electrodes contain materials that shield the weld zone against the atmosphere. We use about 20 kW power. Like the GMAW process, the FCAW process also offers the opportunity to automate processes for continuous welding, and it is economical. Different weld metal chemistries can be developed by adding various alloys to the flux core. In ELECTROGAS WELDING (EGW) we weld the pieces placed edge to edge. It is sometimes also called BUTT WELDING. Weld metal is put into a weld cavity between two pieces to be joined. The space is enclosed by two water-cooled dams to keep the molten slag from pouring out. The dams are moved up by mechanical drives. When workpiece can be rotated, we can use the electrogas welding technique for circumferential welding of pipes too. Electrodes are fed through a conduit to keep a continuous arc. Currents can be around 400Amperes or 750 Amperes and power levels around 20 kW. Inert gases originating from either a flux-cored electrode or external source provide shielding. We use the electrogas welding (EGW) for metals such as steels, titanium….etc with thicknesses from 12mm to 75mm. The technique is a good fit for large structures. Yet, in another technique called ELECTROSLAG WELDING (ESW) the arc is ignited between the electrode and the bottom of the workpiece and flux is added. When molten slag reaches the electrode tip, the arc is extinguished. Energy is continuously supplied through the electrical resistance of the molten slag. We can weld plates with thicknesses between 50 mm and 900 mm and even higher. Currents are around 600 Ampere while voltages are between 40 – 50 V. The welding speeds are around 12 to 36 mm/min. Applications are similar to electrogas welding. One of our nonconsumable electrode processes, the GAS TUNGSTEN ARC WELDING (GTAW) also known as TUNGSTEN INERT GAS WELDING (TIG) involves the supply of a filler metal by a wire. For closely-fit joints sometimes we do not use the filler metal. In the TIG process we do not use flux, but use argon and helium for shielding. Tungsten has a high melting point and is not consumed in the TIG welding process, therefore constant current as well as arc gaps can be maintained. Power levels are between 8 to 20 kW and currents at either 200 Ampere (DC) or 500 Ampere (AC). For aluminum and magnesium we use AC current for its oxide cleaning function. To avoid contamination of the tungsten electrode, we avoid its contact with molten metals. Gas Tungsten Arc Welding (GTAW) is especially useful for welding thin metals. GTAW welds are of very high quality with good surface finish. Due to the higher cost of hydrogen gas, a less frequently used technique is ATOMIC HYDROGEN WELDING (AHW), where we generate an arc between two tungsten electrodes in a shielding atmosphere of flowing hydrogen gas. The AHW is also a nonconsumable electrode welding process. The diatomic hydrogen gas H2 breaks down into its atomic form near the welding arc where temperatures are over 6273 Kelvin. While breaking down, it absorbs large amount of heat from the arc. When the hydrogen atoms strike the weld zone which is a relatively cold surface, they recombine into diatomic form and release the stored heat. Energy can be varied by changing the workpiece to arc distance. In another nonconsumable electrode process, PLASMA ARC WELDING (PAW) we have a concentrated plasma arc directed toward the weld zone. The temperatures reach 33,273 Kelvin in PAW. A nearly equal number of electrons and ions make up the plasma gas. A low-current pilot arc initiates the plasma which is between the tungsten electrode and orifice. Operating currents are generally around 100 Amperes. A filler metal may be fed. In plasma arc welding, shielding is accomplished by an outer shielding ring and using gases such as argon and helium. In plasma arc welding, the arc may be between the electrode and workpiece or between the electrode and nozzle. This welding technique has the advantages over other methods of higher energy concentration, deeper and narrower welding capability, better arc stability, higher welding speeds up to 1 meter/min, less thermal distortion. We generally use plasma arc welding for thicknesses less than 6 mm and sometimes up to 20 mm for aluminum and titanium. HIGH-ENERGY-BEAM WELDING: Another type of fusion welding method with electron-beam welding (EBW) and laser welding (LBW) as two variants. These techniques are of particular value for our high-tech products manufacturing work. In electron-beam welding, high speed electrons strike the workpiece and their kinetic energy is converted to heat. The narrow beam of electrons travel easily in the vacuum chamber. Generally we use high vacuum in e-beam welding. Plates as thick as 150 mm can be welded. No shielding gases, flux or filler material is needed. Elecron beam guns have 100 kW capacities. Deep and narrow welds with high aspect ratios up to 30 and small heat-affected zones are possible. Welding speeds can reach 12 m/min. In laser-beam welding we use high-power lasers as the source of heat. Laser beams as small as 10 microns with high density enable deep penetration into the workpiece. Depth-to-width ratios as much as 10 is possible with laser-beam welding. We use both pulsed as well as continuous wave lasers, with the former in applications for thin materials and the latter mostly for thick workpieces up to about 25 mm. Power levels are up to 100 kW. The laser beam welding is not well suited for optically very reflective materials. Gases may also be used in the welding process. The laser beam welding method is well fit for automation & high volume manufacturing and can offer welding speeds between 2.5 m/min and 80 m/min. One major advantage this welding technique offers is access to areas where other techniques cannot be used. Laser beams can easily travel to such difficult regions. No vacuum as in electron-beam welding is needed. Welds with good quality & strength, low shrinkage, low distortion, low porosity can be obtained with laser beam welding. Laser beams can be easily manipulated and shaped using fiber optic cables. The technique is thus well suitable for welding of precision hermetic assemblies, electronic packages…etc. Let us look at our SOLID STATE WELDING techniques. COLD WELDING (CW) is a process where pressure instead of heat is applied using dies or rolls to the parts that are mated. In cold welding, at least one of the mating parts needs to be ductile. Best results are obtained with two similar materials. If the two metals to be joined with cold welding are dissimilar, we may get weak and brittle joints. The cold welding method is well suited for soft, ductile and small workpieces such as electrical connections, heat sensitive container edges, bimetallic strips for thermostats…etc. One variation of cold welding is roll bonding (or roll welding), where the pressure is applied through a pair of rolls. Sometimes we perform roll welding at elevated temperatures for better interfacial strength. Another solid state welding process we use is the ULTRASONIC WELDING (USW), where the workpieces are subjected to a static normal force and oscillating shearing stresses. The oscillating shearing stresses are applied through the tip of a transducer. Ultrasonic welding deploys oscillations with frequencies from 10 to 75 kHz. In some applications such as seam welding, we use a rotating welding disk as the tip. Shearing stresses applied to the workpieces cause small plastic deformations, break up oxide layers, contaminants and lead to solid state bonding. Temperatures involved in ultrasonic welding are way below melting point temperatures for metals and no fusion takes place. We frequently use the ultrasonic welding (USW) process for nonmetallic materials like plastics. In thermoplastics, the temperatures do reach melting points however. Another popular technique, in FRICTION WELDING (FRW) the heat is generated through friction at the interface of the workpieces to be joined. In friction welding we keep one of the workpieces stationary while the other workpiece is held in a fixture and rotated at a constant speed. The workpieces are then brought into contact under an axial force. The surface speed of rotation in friction welding may reach 900m/min in some cases. After sufficient interfacial contact, the rotating workpiece is brought to a sudden stop and the axial force is increased. The weld zone is generally a narrow region. The friction welding technique can be used to join solid and tubular parts made of a variety of materials. Some flash may develop at the interface in FRW, but this flash can be removed by secondary machining or grinding. Variations of the friction welding process exist. For example “inertia friction welding” involves a flywheel whose rotational kinetic energy is used to weld the parts. The weld is complete when the flywheel comes to a stop. The rotating mass can be varied and thus the rotational kinetic energy. Another variation is “linear friction welding”, where linear reciprocating motion is imposed on at least one of the components to be joined. In linear friction welding parts do not have to be circular, they can be rectangular, square or of other shape. Frequencies can be in the tens of Hz, amplitudes in the millimeters range and pressures in the tens or hundreds of MPa. Finally “friction stir welding” is somewhat different than the other two explained above. Whereas in inertia friction welding and linear friction welding heating of interfaces is achieved through friction by rubbing two contacting surfaces, in the friction stir welding method a third body is rubbed against the two surfaces to be joined. A rotating tool of 5 to 6 mm diameter is brought into contact with the joint. The temperatures can increase to values between 503 to 533 Kelvin. Heating, mixing and stirring of the material in the joint takes place. We use the friction stir welding on a variety of materials including aluminum, plastics and composites. Welds are uniform and quality is high with minimum pores. No fumes or spatter are produced in friction stir welding and the process is well automated. RESISTANCE WELDING (RW): The heat required for welding is produced by the electrical resistance between the two workpieces to be joined. No flux, shielding gases or consumable electrodes are used in resistance welding. Joule heating takes place in resistance welding and can be expressed as: H = (Square I) x R x t x K H is heat generated in joules (watt-seconds), I current in Amperes, R resistance in Ohms, t is the time in seconds the current flows through. The factor K is less than 1 and represents the fraction of energy that is not lost through radiation and conduction. Currents in resistance welding processes can reach levels as high as 100,000 A but voltages are typically 0.5 to 10 Volts. Electrodes are typically made of copper alloys. Both similar and dissimilar materials can be joined by resistance welding. Several variations exist for this process: “Resistance spot welding” involves two opposing round electrodes contacting the surfaces of the lap joint of the two sheets. Pressure is applied until current is turned off. The weld nugget is generally up to 10 mm in diameter. Resistance spot welding leaves slightly discolored indentation marks at weld spots. Spot welding is our most popular resistance welding technique. Various electrode shapes are used in spot welding in order to reach difficult areas. Our spot welding equipment is CNC controlled and has multiple electrodes that can be used simultaneously. Another variation “resistance seam welding” is carried out with wheel or roller electrodes that produce continuous spot welds whenever the current reaches a sufficiently high level in the AC power cycle. Joints produced by resistance seam welding are liquid and gas tight. Welding speeds of about 1.5 m/min are normal for thin sheets. One may apply intermittent currents so that spot welds are produced at desired intervals along the seam. In “resistance projection welding” we emboss one or more projections (dimples) on one of the workpiece surfaces to be welded. These projections may be round or oval. High localized temperatures are reached at these embossed spots that come into contact with the mating part. Electrodes exert pressure to compress these projections. Electrodes in resistance projection welding have flat tips and are water cooled copper alloys. The advantage of resistance projection welding is our ability to a number of welds in one stroke, thus the extended electrode life, capability to weld sheets of various thicknesses, capability to weld nuts and bolts to sheets. Disadvantage of resistance projection welding is the added cost of embossing the dimples. Yet another technique, in “flash welding” heat is generated from the arc at the ends of the two workpieces as they begin to make contact. This method may also alternatively considered arc welding. The temperature at the interface rises, and material softens. An axial force is applied and a weld is formed at the softened region. After the flash welding is complete, the joint can be machined for improved appearance. Weld quality obtained by flash welding is good. Power levels are 10 to 1500 kW. Flash welding is suitable for edge-to-edge joining of similar or dissimilar metals up to 75 mm diameter and sheets between 0.2 mm to 25 mm thickness. “Stud arc welding” is very similar to flash welding. The stud such as a bolt or threaded rod serves as one electrode while being joined to a workpiece such as a plate. To concentrate the generated heat, prevent oxidation and retain the molten metal in the weld zone, a disposable ceramic ring is placed around the joint. Finally “percussion welding” another resistance welding process, utilizes a capacitor to supply the electrical energy. In percussion welding the power is discharged within milliseconds of time very quickly developing high localized heat at the joint. We use percussion welding widely in the electronics manufacturing industry where heating of sensitive electronic components in the vicinity of the joint has to be avoided. A technique called EXPLOSION WELDING involves detonation of a layer of explosive that is put over one of the workpieces to be joined. The very high pressure exerted on the workpiece produces a turbulent and wavy interface and mechanical interlocking takes place. Bond strengths in explosive welding are very high. Explosion welding is a good method for cladding of plates with dissimilar metals. After cladding, the plates may be rolled into thinner sections. Sometimes we use explosion welding for expanding tubes so that they get sealed tightly against the plate. Our last method within the domain of solid state joining is DIFFUSION BONDING or DIFFUSION WELDING (DFW) in which a good joint is achieved mainly by diffusion of atoms across the interface. Some plastic deformation at the interface also contributes to the welding. Temperatures involved are around 0.5 Tm where Tm is melting temperature of the metal. Bond strength in diffusion welding depends on pressure, temperature, contact time and cleanliness of contacting surfaces. Sometimes we use filler metals at the interface. Heat and pressure are required in diffusion bonding and are supplied by electrical resistance or furnace and dead weights, press or else. Similar and dissimilar metals can be joined with diffusion welding. The process is relatively slow due to the time it takes for atoms to migrate. DFW can be automated and is widely used in the fabrication of complex parts for the aerospace, electronics, medical industries. Products manufactured include orthopedic implants, sensors, aerospace structural members. Diffusion bonding can be combined with SUPERPLASTIC FORMING to fabricate complex sheet metal structures. Selected locations on sheets are first diffusion bonded and then the unbonded regions are expanded into a mold using air pressure. Aerospace structures with high stiffness-to-weight ratios are manufactured using this combination of methods. The diffusion welding / superplastic forming combined process reduces the number of parts required by eliminating the need for fasteners, results in low-stress highly accurate parts economically and with short lead times. BRAZING: The brazing and soldering techniques involve lower temperatures than those required for welding. Brazing temperatures are higher than soldering temperatures however. In brazing a filler metal is placed between the surfaces to be joined and temperatures are raised to the melting temperature of the filler material above 723 Kelvin but below the melting temperatures of the workpieces. The molten metal fills the closely fitting space between workpieces. Cooling and subsequent solidification of the filer metal results in strong joints. In braze welding the filler metal is deposited at the joint. Considerably more filler metal is used in braze welding compared to brazing. Oxyacetylene torch with oxidizing flame is used to deposit the filler metal in braze welding. Due to lower temperatures in brazing, problems at heat affected zones such as warping and residual stresses are less. The smaller the clearance gap in brazing the higher is the shear strength of the joint. Maximum tensile strength however is achieved at an optimum gap (a peak value). Below and above this optimum value, the tensile strength in brazing decreases. Typical clearances in brazing can be between 0.025 and 0.2 mm. We use a variety of brazing materials with different shapes such as performs, powder, rings, wire, strip…..etc. and can manufacture these performs specially for your design or product geometry. We do also determine the content of the brazing materials according to your base materials and application. We frequently use fluxes in brazing operations to remove unwanted oxide layers and prevent oxidation. To avoid subsequent corrosion, fluxes are generally removed after the joining operation. AGS-TECH Inc. uses various brazing methods, including: - Torch Brazing - Furnace Brazing - Induction Brazing - Resistance Brazing - Dip Brazing - Infrared Brazing - Diffusion Brazing - High Energy Beam Our most common examples of brazed joints are made of dissimilar metals with good strength such as carbide drill bits, inserts, optoelectronic hermetic packages, seals. SOLDERING : This is one of our most frequently used techniques where the solder (filler metal) fills the joint as in brazing between closely fitting components. Our solders have melting points below 723 Kelvin. We deploy both manual and automated soldering in manufacturing operations. Compared to brazing, soldering temperatures are lower. Soldering is not very suitable for high-temperature or high-strength applications. We use lead-free solders as well as tin-lead, tin-zinc, lead-silver, cadmium-silver, zinc-aluminum alloys besides others for soldering. Both noncorrosive resin-based as well as inorganic acids and salts are used as flux in soldering. We use special fluxes to solder metals with low solderability. In applications where we have to solder ceramic materials, glass or graphite, we first plate the parts with a suitable metal for increased solderability. Our popular soldering techniques are: -Reflow or Paste Soldering -Wave Soldering -Furnace Soldering -Torch Soldering -Induction Soldering -Iron Soldering -Resistance Soldering -Dip soldering -Ultrasonic Soldering -Infrared Soldering Ultrasonic soldering offers us a unique advantage whereby the need for fluxes is eliminated due to ultrasonic cavitation effect which removes oxide films from the surfaces being joined. Reflow and Wave soldering are our industrially outstanding techniques for high volume manufacturing in electronics and therefore worth explaining in greater detail. In reflow soldering, we use semisolid pastes that include solder-metal particles. The paste is placed onto the joint using a screening or stenciling process. In printed circuit boards (PCB) we frequently use this technique. When electrical components are placed onto these pads from paste, the surface tension keeps the surface-mount packages aligned. After placing the components, we heat the assembly in a furnace so the reflow soldering takes place. During this process, the solvents in the paste evaporate, the flux in the paste is activated, the components are preheated, the solder particles are melted and wet the joint, and finally the PCB assembly is cooled slowly. Our second popular technique for high volume production of PCB boards, namely wave soldering relias on the fact that molten solders wet metal surfaces and form good bonds only when the metal is preheated. A standing laminar wave of molten solder is first generated by a pump and the preheated and prefluxed PCBs are conveyed over the wave. The solder wets only exposed metal surfaces but does not wet the IC polymer packages nor the polymer-coated circuit boards. A high-velocity of hot water jet blows excess solder from the joint and prevents bridging between adjacent leads. In wave soldering of surface-mount packages we first adhesively bond them to the circuit board before soldering. Again screening and stenciling is used but this time for epoxy. After the components are placed in their correct locations, the epoxy is cured, the boards are inverted and wave soldering takes place. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Adhesive Bonding - Adhesives - Sealing - Fastening - Joining Nonmetallic Materials - Optical Contacting - UV Bonding - Specialty Glue - Epoxy - Custom Assembly Лепливо врзување и запечатување и прилагодено механичко прицврстување и склопување Among our other most valuable JOINING techniques are ADHESIVE BONDING, MECHANICAL FASTENING and ASSEMBLY, JOINING NONMETALLIC MATERIALS. We dedicate this section to these joining and assembly techniques because of their importance in our manufacturing operations and the extensive content related to them. ADHESIVE BONDING: Did you know that there are specialized epoxies that can be used for almost hermetic level sealing ? Depending on the level of sealing you require, we will choose or formulate a sealant for you. Also do you know that some sealants can be heat cured whereas others require only a UV light to be cured ? If you explain us your application, we can formulate the right epoxy for you. You may require something that is bubble free or something that matches the thermal coefficient of expansion of your mating parts. We have it all ! Contact us and explain your application. We will then choose the most suitable material for you or custom formulate a solution for your challenge. Our materials come with inspection reports, material data sheets and certification. We are capable to assemble your components very economically and ship you completed and quality inspected products. Adhesives are available to us in various forms such as liquids, solutions, pastes, emulsions, powder, tape and films. We use three basic types of adhesives for our joining processes: -Natural Adhesives -Inorganic Adhesives -Synthetic Organic Adhesives For load-bearing applications in manufacturing and fabrication we use adhesives with high cohesive strength, and they are mostly synthetic organic adhesives, which may be thermoplastics or thermosetting polymers. Synthetic organic adhesives are our most important category and can be classified as: Chemically Reactive Adhesives: Popular examples are silicones, polyurethanes, epoxies, phenolics, polyimides, anaerobics like Loctite. Pressure Sensitive Adhesives: Common examples are natural rubber, nitrile rubber, polyacrylates, butyl rubber. Hot Melt Adhesives: Examples are thermoplastics like ethylene-vinyl-acetate copolymers, polyamides, polyester, polyolefins. Reactive Hot Melt Adhesives: They have a thermoset portion based on urethane’s chemistry. Evaporative / Diffusion Adhesives: Popular ones are vinyls, acrylics, phenolics, polyurethanes, synthetic and natural rubbers. Film and Tape Type Adhesives: Examples are nylon-epoxies, elastomer-epoxies, nitrile-phenolics, polyimides. Delayed Tack Adhesives: These include polyvinyl acetates, polystyrenes, polyamides. Electrically and Thermally Conductive Adhesives: Popular examples are epoxies, polyurethanes, silicones, polyimides. According to their chemistries adhesives we use in manufacturing can be classified as: - Epoxy based adhesive systems: High strength and high temperature endurance as high as 473 Kelvin are characteristic of these. Bonding agents in sand mold castings are this type. - Acrylics: These are suitable for applications that involve contaminated dirty surfaces. - Anaerobic adhesive systems: Curing by oxygen deprivation. Hard and brittle bonds. - Cyanoacrylate: Thin bond lines with setting times under 1 minute. - Urethanes: We use them as popular sealants with high toughness and flexibility. - Silicones: Well known for their resistance against moisture and solvents, high impact and peel strength. Relatively long curing times of up to a few days. To optimize the properties in adhesive bonding, we may combine several adhesives. Examples are epoxy-silicon, nitrile-phenolic combined adhesive systems. Polyimides and polybenzimidazoles are used in high-temperature applications. Adhesive joints withstand shear, compressive, and tensile forces pretty well but they may easily fail when subjected to peeling forces. Therefore, in adhesive bonding, we must consider the application and design the joint accordingly. Surface preparation is also of critical importance in adhesive bonding. We clean, treat and modify surfaces to increase the strength and reliability of interfaces in adhesive bonding. Using special primers, wet and dry etching techniques such as plasma cleaning are among our common methods. An adhesion promoting layer such as a thin oxide may improve adhesion in some applications. Increasing surface roughness may also be beneficial prior to adhesive bonding but needs to be well controlled and not exaggerated because excessive roughness can result in trapping of air and therefore a weaker adhesively bonded interface. We use nondestructive methods for testing the quality and strength of our products after adhesive bonding operations. Our techniques include methods such as acoustic impact, IR detection, ultrasonic testing. Advantages of adhesive bonding are: -Adhesive bonding can provide structural strength, sealing and insulation function, suppression of vibration and noise. -Adhesive bonding can eliminate localized stresses at the interface by eliminating the need for joining using fasteners or welding. -Generally no holes are needed for adhesive bonding, and therefore external appearance of components is unaffected. -Thin and fragile parts can be adhesively joined without damage and without significant increase in weight. -Adhesive joining can be used to bond parts made of very different materials with significantly different sizes. -Adhesive bonding can be used on heat sensitive components safely due to low temperatures involved. However some disadvantages do exist for adhesive bonding and our customers should consider these prior to finalizing their designs of joints: -Service temperatures are relatively low for adhesively joint components -Adhesive bonding may require long bonding and curing times. -Surface preparation is needed in adhesive bonding. -Especially for large structures it may be difficult to test adhesively bonded joints nondestructively. -Adhesive bonding may pose reliability concerns in the long term due to degradation, stress corrosion, dissolution….and the like. One of our outstanding products is ELECTRICALLY CONDUCTIVE ADHESIVE, which can replace lead-based solders. Fillers such as silver, aluminum, copper, gold make these pastes conductive. Fillers can be in the form of flakes, particles or polymeric particles coated with thin films of silver or gold. Fillers can also improve thermal conductivity besides electrical. Let us continue with our other joining processes used in manufacturing products. MECHANICAL FASTENING and ASSEMBLY: Mechanical fastening offers us ease of manufacturing, ease of assembly and disassembly, ease of transportation, ease of parts replacement, maintenance and repair, ease in design of movable and adjustable products, lower cost. For fastening we use: Threaded Fasteners: Bolts, screws and nuts are examples of these. Depending on your application, we can provide you specially designed nuts and lock washers for dampening vibration. Riveting: Rivets are among our most common methods of permanent mechanical joining and assembly processes. Rivets are placed in holes and their ends are deformed by upsetting. We perform assembly using riveting at room temperature as well as at high temperatures. Stitching / Stapling / Clinching: These assembly operations are widely used in manufacturing and are basically the same as is used on papers and cardboards. Both metallic and nonmetallic materials can be joined and assembled quickly without need to predrill holes. Seaming: An inexpensive fast joining technique we use widely in manufacturing of containers and metal cans. It is based on folding two thin pieces of material together. Even airtight and watertight seams are possible, especially if seaming is performed jointly with using sealants and adhesives. Crimping: Crimping is a joining method where we do not use fasteners. Electrical or fiber optic connectors are sometimes installed using crimping. In high volume manufacturing, crimping is an indispensible technique for fast joining and assembly of both flat and tubular components. Snap-in Fasteners: Snap fits are also an economical joining technique in assembly and manufacturing. They permit quick assembly and disassembly of components and are a good fit for household products, toys, furniture among others. Shrink and Press Fits: Another mechanical assembly technique, namely shrink fitting is based on the principle of differential thermal expansion and contraction of two components, whereas in press fitting one component is forced over another resulting in good joint strength. We use shrink fitting widely in the assembly and manufacturing of cable harness, and mounting gears and cams on shafts. JOINING NONMETALLIC MATERIALS: Thermoplastics can be heated and melted at the interfaces to be joined and by applying pressure adhesive joining can be accomplished by fusion. Alternatively thermoplastic fillers of the same type may be used for the joining process. Joining of some polymers such as polyethylene may be difficult due to oxidation. In such cases, an inert shielding gas like nitrogen may be used against oxidation. Both external as well as internal heat sources can be used in adhesive joining of polymers. Examples of external sources we commonly use in adhesive joining of thermoplastics are hot air or gases, IR radiation, heated tools, lasers, resistive electrical heating elements. Some of our internal heat sources are ultrasonic welding and friction welding. In some assembly and manufacturing applications we use adhesives for bonding polymers. Some polymers such as PTFE (Teflon) or PE (Polyethylene) have low surface energies and therefore a primer is first applied prior to completing the adhesive bonding process with a suitable adhesive. Another popular technique in joining is the “Clearweld Process” where a toner is first applied to the polymer interfaces. A laser is then directed at the interface, but it does not heat the polymer, but does heat the toner. This makes it possible to heat only well-defined interfaces resulting in localized welds. Other alternative joining techniques in the assembly of thermoplastics are using fasteners, self-tapping screws, integrated snap-fasteners. An exotic technique in manufacturing and assembly operations is embedding tiny micron-sized particles into the polymer and using high-frequency electromagnetic field to inductively heat and melt it at the interfaces to be joined. Thermoset materials on the other hand, do not soften or melt with increasing temperatures. Therefore, adhesive joining of thermoset plastics are usually carried out using threaded or other molded-in inserts, mechanical fasteners and solvent bonding. Regarding joining and assembly operations involving glass and ceramics in our manufacturing plants, here are a few common observations: In cases where a ceramic or glass have to be joined with difficult-to-bond materials, the ceramic or glass materials are frequently coated with a metal that bonds itself easily to them, and then joined to the difficult-to-bond material. When ceramic or glass has a thin metal coating it can be more readily brazed to metals. Ceramics are sometimes joined and assembled together during their shaping process while still hot, soft and tacky. Carbides can be more easily brazed to metals if they have as their matrix material a metal binder such as cobalt or nickel-molybdenum alloy. We braze carbide cutting tools to steel toolholders. Glasses bond well to each other and metals when hot and soft. Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum and fluid control components can be found here: Brazing Factory Brochure Private Label Epoxy Solutions for Construction, Electrical, Industrial Assembly (Download brochure by clicking on blue text. We can put your name, label, logo on these epoxies if you wish) КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

LED Assemblies, Light Emitting Diodes Power Supply, Plastic Molded Lenses LED склопови на производи LED склоп - задно светло за мотоцикл LED склопови на производи AGS-TECH Inc. склопи обликувани пластични компоненти со диоди што емитуваат светлина - задни светла за мотоцикли Задно светло на мотоцикл со вградени диоди што емитуваат светлина Водоотпорно LED напојување Моќни LED светлосни склопови Пакување на производот според барањата на клиентите AGS-TECH нуди прилагодено пакување за вашите произведени производи Собрание на LED PCB Производство на LED улично осветлување ЛЕД драјвер за затемнување на задниот раб Склопови на LED PCB LED склопови со висока моќност LED драјвер со висока моќност ПРЕТХОДНА СТРАНИЦА

Electronic Testers - Electrical Test Equipment - Electrical Properties Testing - Oscilloscope - Signal Generator - Function Generator - Pulse Generator - Frequency Synthesizer - Multimeter Електрична и електронска опрема за тестирање With the term ELECTRONIC TESTER we refer to test equipment that is used primarily for testing, inspection and analysis of electrical and electronic components and systems. We offer the most popular ones in the industry: POWER SUPPLIES & SIGNAL GENERATING DEVICES: POWER SUPPLY, SIGNAL GENERATOR, FREQUENCY SYNTHESIZER, FUNCTION GENERATOR, DIGITAL PATTERN GENERATOR, PULSE GENERATOR, SIGNAL INJECTOR METERS: DIGITAL MULTIMETERS, LCR METER, EMF METER, CAPACITANCE METER, BRIDGE INSTRUMENT, CLAMP METER, GAUSSMETER / TESLAMETER/ MAGNETOMETER, GROUND RESISTANCE METER ANALYZERS: OSCILLOSCOPES, LOGIC ANALYZER, SPECTRUM ANALYZER, PROTOCOL ANALYZER, VECTOR SIGNAL ANALYZER, TIME-DOMAIN REFLECTOMETER, SEMICONDUCTOR CURVE TRACER, NETWORK ANALYZER, PHASE ROTATION TESTER, FREQUENCY COUNTER You can purchase brand new, refurbished or used test equipment from us at the most competitive discounted prices. Simply choose the product from the downloadable catalogs and let us know the product name, product code and relevant information and we will send you our quote. Download by clicking on highlighted text: ANRITSU Electronic Measuring Instruments FLUKE Test Tools Catalog KEYSIGHT Basic Automotive Test Products KEYSIGHT Basic Instruments KEYSIGHT Bench and Power Products KEYSIGHT Network Analyzer Products KEYSIGHT Signal Generation Solutions KEYSIGHT Smart Bench Essentials Series Products KEYSIGHT High-Volume Traffic Generator Products KEYSIGHT Layer 4-7 Network Test Products KEYSIGHT Layer 2-3 Network Test Products KEYSIGHT Distribution Products Catalog MEGGER Low Voltage Test Tools Catalog MICROWAVE Flexible Cable Assembly MICROWAVE and MILIMETER WAVE Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Private Label Hand Tools for Every Industry (This catalog contains a few electrical & electronic test instruments. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers.) ROHDE SCHWARZ Benchtop Power Supplies Ideal for labs and system racks, galvanic isolation, floating channels, constant voltage or current modes, protection functions, parallel and serial operation, low ripple/noise, remote sensing option ROHDE SCHWARZ Test Equipment Catalog (Oscilloscopes, Power Supplies, Signal Generators, Handheld Analyzers, Spectrum Analyzers, Vector Network Analyzers, Meters & Counters) TEKTRONIX Product Catalog for Test and Measurement Solutions VANDAL-PROOF IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com Let us briefly go over some of these equipment in everyday use throughout the industry: The electrical power supplies we supply for metrology purposes are discrete, benchtop and stand-alone devices. The ADJUSTABLE REGULATED ELECTRICAL POWER SUPPLIES are some of the most popular ones, because their output values can be adjusted and their output voltage or current is maintained constant even if there are variations in input voltage or load current. ISOLATED POWER SUPPLIES have power outputs that are electrically independent of their power inputs. Depending on their power conversion method, there are LINEAR and SWITCHING POWER SUPPLIES. The linear power supplies process the input power directly with all their active power conversion components working in the linear regions, whereas the switching power supplies have components working predominantly in non-linear modes (such as transistors) and convert power to AC or DC pulses before processing. Switching power supplies are generally more efficient than linear supplies because they lose less power due to shorter times their components spend in the linear operating regions. Depending on application, a DC or AC power is used. Other popular devices are PROGRAMMABLE POWER SUPPLIES, where voltage, current or frequency can be remotely controlled through an analog input or digital interface such as an RS232 or GPIB. Many of them have an integral microcomputer to monitor and control the operations. Such instruments are essential for automated testing purposes. Some electronic power supplies use current limiting instead of cutting off power when overloaded. Electronic limiting is commonly used on lab bench type instruments. SIGNAL GENERATORS are another widely used instruments in lab and industry, generating repeating or non-repeating analog or digital signals. Alternatively they are also called FUNCTION GENERATORS, DIGITAL PATTERN GENERATORS or FREQUENCY GENERATORS. Function generators generate simple repetitive waveforms such as sine waves, step pulses, square & triangular and arbitrary waveforms. With Arbitrary waveform generators the user can generate arbitrary waveforms, within published limits of frequency range, accuracy, and output level. Unlike function generators, which are limited to a simple set of waveforms, an arbitrary waveform generator allows the user to specify a source waveform in a variety of different ways. RF and MICROWAVE SIGNAL GENERATORS are used for testing components, receivers and systems in applications such as cellular communications, WiFi, GPS, broadcasting, satellite communications and radars. RF signal generators generally work between a few kHz to 6 GHz, while microwave signal generators operate within a much wider frequency range, from less than 1 MHz to at least 20 GHz and even up to hundreds of GHz ranges using special hardware. RF and microwave signal generators can be classified further as analog or vector signal generators. AUDIO-FREQUENCY SIGNAL GENERATORS generate signals in the audio-frequency range and above. They have electronic lab applications checking of the frequency response of audio equipment. VECTOR SIGNAL GENERATORS, sometimes also referred to as DIGITAL SIGNAL GENERATORS are capable of generating digitally-modulated radio signals. Vector signal generators can generate signals based on industry standards such as GSM, W-CDMA (UMTS) and Wi-Fi (IEEE 802.11). LOGIC SIGNAL GENERATORS are also called DIGITAL PATTERN GENERATOR. These generators produce logic types of signals, that is logic 1s and 0s in the form of conventional voltage levels. Logic signal generators are used as stimulus sources for functional validation & testing of digital integrated circuits and embedded systems. The devices mentioned above are for general-purpose use. There are however many other signal generators designed for custom specific applications. A SIGNAL INJECTOR is a very useful and quick troubleshooting tool for signal tracing in a circuit. Technicians can determine the faulty stage of a device such as a radio receiver very quickly. The signal injector can be applied to the speaker output, and if the signal is audible one can move to the preceding stage of the circuit. In this case an audio amplifier, and if the injected signal is heard again one can move the signal injection up the stages of the circuit until the signal is no longer audible. This will serve the purpose of locating the location of the problem. A MULTIMETER is an electronic measuring instrument combining several measurement functions in one unit. Generally, multimeters measure voltage, current, and resistance. Both digital and analog version are available. We offer portable hand-held multimeter units as well as laboratory-grade models with certified calibration. Modern multimeters can measure many parameters such as: Voltage (both AC / DC), in volts, Current (both AC / DC), in amperes, Resistance in ohms. Additionally, some multimeters measure: Capacitance in farads, Conductance in siemens, Decibels, Duty cycle as a percentage, Frequency in hertz, Inductance in henries, Temperature in degrees Celsius or Fahrenheit, using a temperature test probe. Some multimeters also include: Continuity tester; sounds when a circuit conducts, Diodes (measuring forward drop of diode junctions), Transistors (measuring current gain and other parameters), battery checking function, light level measuring function, acidity & Alkalinity (pH) measuring function and relative humidity measuring function. Modern multimeters are often digital. Modern digital multimeters often have an embedded computer to make them very powerful tools in metrology and testing. They include features such as:: •Auto-ranging, which selects the correct range for the quantity under test so that the most significant digits are shown. •Auto-polarity for direct-current readings, shows if the applied voltage is positive or negative. •Sample and hold, which will latch the most recent reading for examination after the instrument is removed from the circuit under test. •Current-limited tests for voltage drop across semiconductor junctions. Even though not a replacement for a transistor tester, this feature of digital multimeters facilitates testing diodes and transistors. •A bar graph representation of the quantity under test for better visualization of fast changes in measured values. •A low-bandwidth oscilloscope. •Automotive circuit testers with tests for automotive timing and dwell signals. •Data acquisition feature to record maximum and minimum readings over a given period, and to take a number of samples at fixed intervals. •A combined LCR meter. Some multimeters can be interfaced with computers, while some can store measurements and upload them to a computer. Yet another very useful tool, an LCR METER is a metrology instrument for measuring the inductance (L), capacitance (C), and resistance (R) of a component. The impedance is measured internally and converted for display to the corresponding capacitance or inductance value. Readings will be reasonably accurate if the capacitor or inductor under test does not have a significant resistive component of impedance. Advanced LCR meters measure true inductance and capacitance, and also the equivalent series resistance of capacitors and the Q factor of inductive components. The device under test is subjected to an AC voltage source and the meter measures the voltage across and the current through the tested device. From the ratio of voltage to current the meter can determine the impedance. The phase angle between the voltage and current is also measured in some instruments. In combination with the impedance, the equivalent capacitance or inductance, and resistance, of the device tested can be calculated and displayed. LCR meters have selectable test frequencies of 100 Hz, 120 Hz, 1 kHz, 10 kHz, and 100 kHz. Benchtop LCR meters typically have selectable test frequencies of more than 100 kHz. They often include possibilities to superimpose a DC voltage or current on the AC measuring signal. While some meters offer the possibility to externally supply these DC voltages or currents other devices supply them internally. An EMF METER is a test & metrology instrument for measuring electromagnetic fields (EMF). Majority of them measure the electromagnetic radiation flux density (DC fields) or the change in an electromagnetic field over time (AC fields). There are single axis and tri-axis instrument versions. Single axis meters cost less than tri-axis meters, but take longer to complete a test because the meter only measures one dimension of the field. Single axis EMF meters have to be tilted and turned on all three axes to complete a measurement. On the other hand, tri-axis meters measure all three axes simultaneously, but are more expensive. An EMF meter can measure AC electromagnetic fields, which emanate from sources such as electrical wiring, while GAUSSMETERS / TESLAMETERS or MAGNETOMETERS measure DC fields emitted from sources where direct current is present. The majority of EMF meters are calibrated to measure 50 and 60 Hz alternating fields corresponding to the frequency of US and European mains electricity. There are other meters which can measure fields alternating at as low as 20 Hz. EMF measurements can be broadband across a wide range of frequencies or frequency selective monitoring only the frequency range of interest. A CAPACITANCE METER is a test equipment used to measure capacitance of mostly discrete capacitors. Some meters display the capacitance only, whereas others also display leakage, equivalent series resistance, and inductance. Higher end test instruments use techniques such as inserting the capacitor-under-test into a bridge circuit. By varying the values of the other legs in the bridge so as to bring the bridge into balance, the value of the unknown capacitor is determined. This method ensures greater precision. The bridge may also be capable to measure series resistance and inductance. Capacitors over a range from picofarads to farads may be measured. Bridge circuits do not measure leakage current, but a DC bias voltage can be applied and the leakage measured directly. Many BRIDGE INSTRUMENTS can be connected to computers and data exchange be made to download readings or to control the bridge externally. Such bridge instruments aso offer go / no go testing for automation of tests in a fast paced production & quality control environment. Yet, another test instrument, a CLAMP METER is an electrical tester combining a voltmeter with a clamp type current meter. Most modern versions of clamp meters are digital. Modern clamp meters have most of the basic functions of a Digital Multimeter, but with the added feature of a current transformer built into the product. When you clamp the instrument’s “jaws” around a conductor carrying a large ac current, that current is coupled through the jaws, similar to the iron core of a power transformer, and into a secondary winding which is connected across the shunt of the meter’s input, the principle of operation resembling much that of a transformer. A much smaller current is delivered to the meter’s input due to the ratio of the number of secondary windings to the number of primary windings wrapped around the core. The primary is represented by the one conductor around which the jaws are clamped. If the secondary has 1000 windings, then the secondary current is 1/1000 the current flowing in the primary, or in this case the conductor being measured. Thus, 1 amp of current in the conductor being measured would produce 0.001 amps of current at the input of the meter. With clamp meters much larger currents can be easily measured by increasing the number of turns in the secondary winding. As with most of our test equipment, advanced clamp meters offer logging capability. GROUND RESISTANCE TESTERS are used for testing the earth electrodes and the soil resistivity. The instrument requirements depend on the range of applications. Modern clamp-on ground testing instruments simplify ground loop testing and enable non-intrusive leakage current measurements. Among the ANALYZERS we sell are OSCILLOSCOPES without doubt one of the most widely used equipment. An oscilloscope, also called an OSCILLOGRAPH, is a type of electronic test instrument that allows observation of constantly varying signal voltages as a two-dimensional plot of one or more signals as a function of time. Non-electrical signals like sound and vibration can also be converted to voltages and displayed on oscilloscopes. Oscilloscopes are used to observe the change of an electrical signal over time, the voltage and time describe a shape which is continuously graphed against a calibrated scale. Observation and analysis of the waveform reveals us properties such as amplitude, frequency, time interval, rise time, and distortion. Oscilloscopes can be adjusted so that repetitive signals can be observed as a continuous shape on the screen. Many oscilloscopes have storage function that allows single events to be captured by the instrument and displayed for a relatively long time. This allows us to observe events too fast to be directly perceptible. Modern oscilloscopes are lightweight, compact and portable instruments. There are also miniature battery-powered instruments for field service applications. Laboratory grade oscilloscopes are generally bench-top devices. There is a vast variety of probes and input cables for use with oscilloscopes. Please contact us in case you need advice about which one to use in your application. Oscilloscopes with two vertical inputs are called dual-trace oscilloscopes. Using a single-beam CRT, they multiplex the inputs, usually switching between them fast enough to display two traces apparently at once. There are also oscilloscopes with more traces; four inputs are common among these. Some multi-trace oscilloscopes use the external trigger input as an optional vertical input, and some have third and fourth channels with only minimal controls. Modern oscilloscopes have several inputs for voltages, and thus can be used to plot one varying voltage versus another. This is used for example for graphing I-V curves (current versus voltage characteristics) for components such as diodes. For high frequencies and with fast digital signals the bandwidth of the vertical amplifiers and sampling rate must be high enough. For-general purpose use a bandwidth of at least 100 MHz is usually sufficient. A much lower bandwidth is sufficient for audio-frequency applications only. Useful range of sweeping is from one second to 100 nanoseconds, with appropriate triggering and sweep delay. A well-designed, stable, trigger circuit is required for a steady display. The quality of the trigger circuit is key for good oscilloscopes. Another key selection criteria is the sample memory depth and sample rate. Basic level modern DSOs now have 1MB or more of sample memory per channel. Often this sample memory is shared between channels, and can sometimes only be fully available at lower sample rates. At the highest sample rates the memory may be limited to a few 10's of KB. Any modern ''real-time'' sample rate DSO will have typically 5-10 times the input bandwidth in sample rate. So a 100 MHz bandwidth DSO would have 500 Ms/s - 1 Gs/s sample rate. Greatly increased sample rates have largely eliminated the display of incorrect signals that was sometimes present in the first generation of digital scopes. Most modern oscilloscopes provide one or more external interfaces or buses such as GPIB, Ethernet, serial port, and USB to allow remote instrument control by external software. Here is a list of different oscilloscope types: CATHODE RAY OSCILLOSCOPE DUAL-BEAM OSCILLOSCOPE ANALOG STORAGE OSCILLOSCOPE DIGITAL OSCILLOSCOPES MIXED-SIGNAL OSCILLOSCOPES HANDHELD OSCILLOSCOPES PC-BASED OSCILLOSCOPES A LOGIC ANALYZER is an instrument that captures and displays multiple signals from a digital system or digital circuit. A logic analyzer may convert the captured data into timing diagrams, protocol decodes, state machine traces, assembly language. Logic Analyzers have advanced triggering capabilities, and are useful when the user needs to see the timing relationships between many signals in a digital system. MODULAR LOGIC ANALYZERS consist of both a chassis or mainframe and logic analyzer modules. The chassis or mainframe contains the display, controls, control computer, and multiple slots into which the data-capturing hardware is installed. Each module has a specific number of channels, and multiple modules can be combined to obtain a very high channel count. The ability to combine multiple modules to obtain a high channel count and the generally higher performance of modular logic analyzers makes them more expensive. For the very high end modular logic analyzers, the users may need to provide their own host PC or purchase an embedded controller compatible with the system. PORTABLE LOGIC ANALYZERS integrate everything into a single package, with options installed at the factory. They generally have lower performance than modular ones, but are economical metrology tools for general purpose debugging. In PC-BASED LOGIC ANALYZERS, the hardware connects to a computer through a USB or Ethernet connection and relays the captured signals to the software on the computer. These devices are generally much smaller and less expensive because they make use of a personal computer’s existing keyboard, display and CPU. Logic analyzers can be triggered on a complicated sequence of digital events, then capture large amounts of digital data from the systems under test. Today specialized connectors are in use. The evolution of logic analyzer probes has led to a common footprint that multiple vendors support, which provides added freedom to end users: Connectorless technology offered as several vendor-specific trade names such as Compression Probing; Soft Touch; D-Max is being used. These probes provide a durable, reliable mechanical and electrical connection between the probe and the circuit board. A SPECTRUM ANALYZER measures the magnitude of an input signal versus frequency within the full frequency range of the instrument. The primary use is to measure the power of the spectrum of signals. There are optical and acoustical spectrum analyzers as well, but here we will discuss only electronic analyzers that measure and analyze electrical input signals. The spectra obtained from electrical signals provides us information about frequency, power, harmonics, bandwidth…etc. The frequency is displayed on the horizonal axis and the signal amplitude on the vertical. Spectrum analyzers are widely used in the electronics industry for the analyses of the frequency spectrum of radio frequency, RF and audio signals. Looking at the spectrum of a signal we are able to reveal elements of the signal, and the performance of the circuit producing them. Spectrum analyzers are able to make a large variety of measurements. Looking at the methods used to obtain the spectrum of a signal we can categorize the spectrum analyzer types. - A SWEPT-TUNED SPECTRUM ANALYZER uses a superheterodyne receiver to down-convert a portion of the input signal spectrum (using a voltage-controlled oscillator and a mixer) to the center frequency of a band-pass filter. With a superheterodyne architecture, the voltage-controlled oscillator is swept through a range of frequencies, taking advantage of the full frequency range of the instrument. Swept-tuned spectrum analyzers are descended from radio receivers. Therefore swept-tuned analyzers are either tuned-filter analyzers (analogous to a TRF radio) or superheterodyne analyzers. In fact, in their simplest form, you could think of a swept-tuned spectrum analyzer as a frequency-selective voltmeter with a frequency range that is tuned (swept) automatically. It is essentially a frequency-selective, peak-responding voltmeter calibrated to display the rms value of a sine wave. The spectrum analyzer can show the individual frequency components that make up a complex signal. However it does not provide phase information, only magnitude information. Modern swept-tuned analyzers (superheterodyne analyzers, in particular) are precision devices that can make a wide variety of measurements. However, they are primarily used to measure steady-state, or repetitive, signals because they can't evaluate all frequencies in a given span simultaneously. The ability to evaluate all frequencies simultaneously is possible with only the real-time analyzers. - REAL-TIME SPECTRUM ANALYZERS: A FFT SPECTRUM ANALYZER computes the discrete Fourier transform (DFT), a mathematical process that transforms a waveform into the components of its frequency spectrum, of the input signal. The Fourier or FFT spectrum analyzer is another real-time spectrum analyzer implementation. The Fourier analyzer uses digital signal processing to sample the input signal and convert it to the frequency domain. This conversion is done using the Fast Fourier Transform (FFT). The FFT is an implementation of the Discrete Fourier Transform, the math algorithm used for transforming data from the time domain to the frequency domain. Another type of real-time spectrum analyzers, namely the PARALLEL FILTER ANALYZERS combine several bandpass filters, each with a different bandpass frequency. Each filter remains connected to the input at all times. After an initial settling time, the parallel-filter analyzer can instantaneously detect and display all signals within the analyzer's measurement range. Therefore, the parallel-filter analyzer provides real-time signal analysis. Parallel-filter analyzer is fast, it measures transient and time-variant signals. However, the frequency resolution of a parallel-filter analyzer is much lower than most swept-tuned analyzers, because the resolution is determined by the width of the bandpass filters. To get fine resolution over a large frequency range, you would need many many individual filters, making it costly and complex. This is why most parallel-filter analyzers, except the simplest ones in the market are expensive. - VECTOR SIGNAL ANALYSIS (VSA) : In the past, swept-tuned and superheterodyne spectrum analyzers covered wide frequency ranges from audio, thru microwave, to millimeter frequencies. In addition, digital signal processing (DSP) intensive fast Fourier transform (FFT) analyzers provided high-resolution spectrum and network analysis, but were limited to low frequencies due to the limits of analog-to-digital conversion and signal processing technologies. Today's wide-bandwidth, vector-modulated, time-varying signals benefit greatly from the capabilities of FFT analysis and other DSP techniques. Vector signal analyzers combine superheterodyne technology with high speed ADC's and other DSP technologies to offer fast high-resolution spectrum measurements, demodulation, and advanced time-domain analysis. The VSA is especially useful for characterizing complex signals such as burst, transient, or modulated signals used in communications, video, broadcast, sonar and ultrasound imaging applications. According to form factors, spectrum analyzers are grouped as benchtop, portable, handheld and networked. Benchtop models are useful for applications where the spectrum analyzer can be plugged into AC power,such as in a lab environment or manufacturing area. Bench top spectrum analyzers generally offer better performance and specifications than the portable or handheld versions. However they are generally heavier and have several fans for cooling. Some BENCHTOP SPECTRUM ANALYZERS offer optional battery packs, allowing them to be used away from a mains outlet. Those are referred to as a PORTABLE SPECTRUM ANALYZERS. Portable models are useful for applications where the spectrum analyzer needs to be taken outside to make measurements or carried while in use. A good portable spectrum analyzer is expected to offer optional battery-powered operation to allow the user to work in places without power outlets, a clearly viewable display to allow the screen to be read in bright sunlight, darkness or dusty conditions, light weight. HANDHELD SPECTRUM ANALYZERS are useful for applications where the spectrum analyzer needs to be very light and small. Handheld analyzers offer a limited capability as compared to larger systems. Advantages of handheld spectrum analyzers are however their very low power consumption, battery-powered operation while in the field to allow the user to move freely outside, very small size & light weight. Finally, NETWORKED SPECTRUM ANALYZERS do not include a display and they are designed to enable a new class of geographically-distributed spectrum monitoring and analysis applications. The key attribute is the ability to connect the analyzer to a network and monitor such devices across a network. While many spectrum analyzers have an Ethernet port for control, they typically lack efficient data transfer mechanisms and are too bulky and/or expensive to be deployed in such a distributed manner. The distributed nature of such devices enable geo-location of transmitters, spectrum monitoring for dynamic spectrum access and many other such applications. These devices are able to synchronize data captures across a network of analyzers and enable Network-efficient data transfer for a low cost. A PROTOCOL ANALYZER is a tool incorporating hardware and/or software used to capture and analyze signals and data traffic over a communication channel. Protocol analyzers are mostly used for measuring performance and troubleshooting. They connect to the network to calculate key performance indicators to monitor the network and speed-up troubleshooting activities. A NETWORK PROTOCOL ANALYZER is a vital part of a network administrator's toolkit. Network protocol analysis is used to monitor the health of network communications. To find out why a network device is functioning in a certain way, administrators use a protocol analyzer to sniff the traffic and expose the data and protocols that pass along the wire. Network protocol analyzers are used to - Troubleshoot hard-to-solve problems - Detect and identify malicious software / malware. Work with an Intrusion Detection System or a honeypot. - Gather information, such as baseline traffic patterns and network-utilization metrics - Identify unused protocols so that you can remove them from the network - Generate traffic for penetration testing - Eavesdrop on traffic (e.g., locate unauthorized Instant Messaging traffic or wireless Access Points) A TIME-DOMAIN REFLECTOMETER (TDR) is an instrument that uses time-domain reflectometry to characterize and locate faults in metallic cables such as twisted pair wires and coaxial cables, connectors, printed circuit boards,….etc. Time-Domain Reflectometers measure reflections along a conductor. In order to measure them, the TDR transmits an incident signal onto the conductor and looks at its reflections. If the conductor is of a uniform impedance and is properly terminated, then there will be no reflections and the remaining incident signal will be absorbed at the far end by the termination. However, if there is an impedance variation somewhere, then some of the incident signal will be reflected back to the source. The reflections will have the same shape as the incident signal, but their sign and magnitude depend on the change in impedance level. If there is a step increase in the impedance, then the reflection will have the same sign as the incident signal and if there is a step decrease in impedance, the reflection will have the opposite sign. The reflections are measured at the output/input of the Time-Domain Reflectometer and displayed as a function of time. Alternatively, the display can show the transmission and reflections as a function of cable length because the speed of signal propagation is almost constant for a given transmission medium. TDRs can be used to analyze cable impedances and lengths, connector and splice losses and locations. TDR impedance measurements provide designers the opportunity to perform signal integrity analysis of system interconnects and accurately predict the digital system performance. TDR measurements are widely used in board characterization work. A circuit board designer can determine the characteristic impedances of board traces, compute accurate models for board components, and predict board performance more accurately. There are many other areas of application for time-domain reflectometers. A SEMICONDUCTOR CURVE TRACER is a test equipment used to analyze the characteristics of discrete semiconductor devices such as diodes, transistors, and thyristors. The instrument is based on oscilloscope, but contains also voltage and current sources that can be used to stimulate the device under test. A swept voltage is applied to two terminals of the device under test, and the amount of current that the device permits to flow at each voltage is measured. A graph called V-I (voltage versus current) is displayed on the oscilloscope screen. Configuration includes the maximum voltage applied, the polarity of the voltage applied (including the automatic application of both positive and negative polarities), and the resistance inserted in series with the device. For two terminal devices like diodes, this is sufficient to fully characterize the device. The curve tracer can display all of the interesting parameters such as the diode's forward voltage, reverse leakage current, reverse breakdown voltage,…etc. Three-terminal devices such as transistors and FETs also use a connection to the control terminal of the device being tested such as the Base or Gate terminal. For transistors and other current based devices, the base or other control terminal current is stepped. For field effect transistors (FETs), a stepped voltage is used instead of a stepped current. By sweeping the voltage through the configured range of main terminal voltages, for each voltage step of the control signal, a group of V-I curves is generated automatically. This group of curves makes it very easy to determine the gain of a transistor, or the trigger voltage of a thyristor or TRIAC. Modern semiconductor curve tracers offer many attractive features such as intuitive Windows based user interfaces, I-V, C-V and pulse generation, and pulse I-V, application libraries included for every technology…etc. PHASE ROTATION TESTER / INDICATOR: These are compact and rugged test instruments to identify phase sequence on three-phase systems and open/de-energized phases. They are ideal for installing rotating machinery, motors and for checking generator output. Among the applications are the identification of proper phase sequences, detection of missing wire phases, determination of proper connections for rotating machinery, detection of live circuits. A FREQUENCY COUNTER is a test instrument that is used for measuring frequency. Frequency counters generally use a counter which accumulates the number of events occurring within a specific period of time. If the event to be counted is in electronic form, simple interfacing to the instrument is all that is needed. Signals of higher complexity may need some conditioning to make them suitable for counting. Most frequency counters have some form of amplifier, filtering and shaping circuitry at the input. Digital signal processing, sensitivity control and hysteresis are other techniques to improve performance. Other types of periodic events that are not inherently electronic in nature will need to be converted using transducers. RF frequency counters operate on the same principles as lower frequency counters. They have more range before overflow. For very high microwave frequencies, many designs use a high-speed prescaler to bring the signal frequency down to a point where normal digital circuitry can operate. Microwave frequency counters can measure frequencies up to almost 100 GHz. Above these high frequencies the signal to be measured is combined in a mixer with the signal from a local oscillator, producing a signal at the difference frequency, which is low enough for direct measurement. Popular interfaces on frequency counters are RS232, USB, GPIB and Ethernet similar to other modern instruments. In addition to sending measurement results, a counter can notify the user when user-defined measurement limits are exceeded. For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Embedded Systems - Embedded Computer - Industrial Computers - Janz Tec - Korenix - AGS-TECH Inc. - New Mexico - USA Вградени системи и компјутери An EMBEDDED SYSTEM is a computer system designed for specific control functions within a larger system, often with real-time computing constraints. It is embedded as part of a complete device often including hardware and mechanical parts. By contrast, a general-purpose computer, such as a personal computer (PC), is designed to be flexible and to meet a wide range of end-user needs. The architecture of the embedded system is oriented on a standard PC, whereby the EMBEDDED PC only consists of the components which it really needs for the relevant application. Embedded systems control many devices in common use today. Among the EMBEDDED COMPUTERS we offer you are ATOP TECHNOLOGIES, JANZ TEC, KORENIX TECHNOLOGY, DFI-ITOX and other models of products. Our embedded computers are robust and reliable systems for industrial use where downtime can be disastrous. They are energy efficient, very flexible in use, modularly constructed, compact, powerful like a complete computer, fanless and noise-free. Our embedded computers have outstanding temperature, tightness, shock and vibration resistance in harsh environments and are widely used in machine and factory construction, power and energy plants, traffic and transportation industries, medical, biomedical, bioinstrumentation, automotive industry, military, mining, navy, marine, aerospace and more. Click on blue highlighted text to download brochures and catalogs: - ATOP TECHNOLOGIES compact product brochure - ATOP Technologies Product List 2021) - DFI-ITOX model embedded systems brochure - DFI-ITOX model embedded single board computers brochure - DFI-ITOX model computer-on-board modules brochure - ICP DAS model PACs Embedded Controllers & DAQ brochure - JANZ TEC model compact product brochure - KORENIX model compact product brochure - Private Label Flash Storage for Embedded Industrial Applications (We can put your name, brand, logo on these........) To go to our industrial computer store, please CLICK HERE. Here are a few of the most popular embedded computers we offer: - Embedded PC with Intel ATOM Technology Z510/530 - Fanless Embedded PC - Embedded PC System with Freescale i.MX515 - Rugged-Embedded-PC-Systems - Modular Embedded PC Systems - HMI Systems and Fanless Industrial Display Solutions Please always remember that AGS-TECH Inc. is an established ENGINEERING INTEGRATOR and CUSTOM MANUFACTURER. Therefore, in case you need something custom manufactured, please let us know and we will offer you a turn-key solution that takes away the puzzle from your table and makes your job easier. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Let us briefly introduce you our partners building these embedded computers: JANZ TEC AG: Janz Tec AG, has been a leading manufacturer of electronic assemblies and complete industrial computer systems since 1982. The company develops embedded computing products, industrial computers and industrial communication devices according to customer requirements. All JANZ TEC products are exclusively produced in Germany with the highest quality. With over 30 years of experience in the market, Janz Tec AG is capable of meeting individual customer requirements – this starts from concept phase and continues through the development and production of the components up to delivery. Janz Tec AG is setting the standards in the fields of Embedded Computing, Industrial PC, Industrial communication, Custom Design. Janz Tec AG's employees conceive, develop and produce embedded computer components and systems based on worldwide standards that are individually adapted to the specific customer requirements. Janz Tec embedded computers have the additional benefits of long-term availability and the highest-possible quality along with optimum price to performance ratio. Janz Tec embedded computers are always used when extremely robust and reliable systems are necessary due to the requirements made on them. The modularly-constructed and compact Janz Tec industrial computers are low-maintenance, energy-efficient and extremely flexible. The computer architecture of the Janz Tec embedded systems are oriented on a standard PC, whereby the embedded PC only consists of the components which it really needs for the relevant application. This facilitates completely independent usage in environments in which service would otherwise be extremely cost-intensive. Despite being an embedded computers, many Janz Tec products are so powerful that they can replace a complete computer. Benefits of the Janz Tec brand embedded computers are operation without fan and low maintenance. Janz Tec embedded computers are used in machine and plant construction, power & energy production, transportation & traffic, medical technology, automotive industry, production and manufacturing engineering and many other industrial applications. The processors, which are becoming more and more powerful, enable use of a Janz Tec embedded PC even when particularly complex requirements from these industries are confronted. One advantage of this is the hardware environment familiar to many developers and the availability of appropriate software development environments. Janz Tec AG has been acquiring the necessary experience in the development of its own embedded computer systems, which can be adapted to customer requirements whenever required. The focus of Janz Tec designers in the embedded computing sector is on the optimum solution appropriate to the application and the individual customer requirements. It has always been the goal of Janz Tec AG to provide high quality for the systems, solid design for long-term use, and exceptional price to performance ratios. The modern processors currently used in embedded computer systems are Freescale Intel Core i3/i5/i7, i.MX5x and Intel Atom, Intel Celeron and Core2Duo. In addition, Janz Tec industrial computers are not just fitted with standard interfaces like ethernet, USB and RS 232, but a CANbus interface is also available to the user as a feature. The Janz Tec embedded PC is frequently without a fan, and therefore can be used with CompactFlash media in most cases so that it is maintenance-free. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Soft Lithography - Microcontact Printing - Microtransfer Molding - Micromolding in Capillaries - AGS-TECH Inc. - NM - USA Мека литографија SOFT LITHOGRAPHY is a term used for a number of processes for pattern transfer. A master mold is needed in all cases and is microfabricated using standard lithography methods. Using the master mold, we produce an elastomeric pattern / stamp to be used in soft lithography. Elastomers used for this purpose need to be chemically inert, have good thermal stability, strength, durability, surface properties and be hygroscopic. Silicone rubber and PDMS (Polydimethylsiloxane) are two good candidate materials. These stamps can be used many times in soft lithography. One variation of soft lithography is MICROCONTACT PRINTING. The elastomer stamp is coated with an ink and pressed against a surface. The pattern peaks contact the surface and a thin layer of about 1 monolayer of the ink is transferred. This thin film monolayer acts as the mask for selective wet etching. A second variation is MICROTRANSFER MOLDING, in which the recesses of the elastomer mold are filled with liquid polymer precursor and pushed against a surface. Once the polymer cures after microtransfer molding, we peel off the mold, leaving behind the desired pattern. Lastly a third variation is MICROMOLDING IN CAPILLARIES, where the elastomer stamp pattern consists of channels that use capillary forces to wick a liquid polymer into the stamp from its side. Basically, a small amount of the liquid polymer is placed adjacent to the capillary channels and the capillary forces pull the liquid into the channels. Excess liquid polymer is removed and polymer inside the channels is allowed to cure. The stamp mold is peeled off and the product is ready. If the channel aspect ratio is moderate and the channel dimensions allowed depend on the liquid used, good pattern replication can be assured. The liquid used in micromolding in capillaries can be thermosetting polymers, ceramic sol-gel or suspensions of solids within liquid solvents. The micromolding in capillaries technique has been used in sensor manufacturing. Soft lithography is used to construct features measured on the micrometer to nanometer scale. Soft lithography has advantages over other forms of lithography like photolithography and electron beam lithography. The advantages include the following: • Lower cost in mass production than traditional photolithography • Suitability for applications in biotechnology and plastic electronics • Suitability for applications involving large or nonplanar (nonflat) surfaces • Soft lithography offers more pattern-transferring methods than traditional lithography techniques (more ''ink'' options) • Soft lithography does not need a photo-reactive surface to create nanostructures • With soft lithography we can achieve smaller details than photolithography in laboratory settings (~30 nm vs ~100 nm). The resolution depends on the mask used and can reach values down to 6 nm. MULTILAYER SOFT LITHOGRAPHY is a fabrication process in which microscopic chambers, channels, valves and vias are molded within bonded layers of elastomers. Using multilayer soft lithography devices consisting of multiple layers may be fabricated from soft materials. The softness of these materials allows the device areas to be reduced by more than two orders of magnitude compared with silicon-based devices. The other advantages of soft lithography, such as rapid prototyping, ease of fabrication, and biocompatibility, are also valid in multilayer soft lithography. We use this technique to build active microfluidic systems with on-off valves, switching valves, and pumps entirely out of elastomers. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Rapid Electronic Prototyping, Custom Robot Assembly, Optomechanical Prototype Manufacturing, AGS-TECH Електронско прототипирање Прототип на електронски робот со блиски инфрацрвени детектори, стадиум на ротација и навалена глава на врвот Брзо електронско прототипирање Четирислојна ПХБ со RO4003C на врвот на слој потопено злато Прототип на ПХБ за соларен проект Дизајн и распоред на прототип со два слоја PCBA Оптоелектронски прототип на робот Услуги за прототипирање на PCBA Повеќеслојна плоча PCBA Прототипирање Прототип на склопување на табла со печатено коло Прототип на собранието на електронски жици Прилагодено прототипирање на засилувач Прототипирање на електронски засилувач ПРЕТХОДНА СТРАНИЦА

Electrochemical Machining and Grinding - ECM - Reverse Electroplating - Custom Machining - AGS-TECH Inc. - NM - USA ECM обработка, електрохемиска обработка, мелење Some of the valuable NON-CONVENTIONAL MANUFACTURING processes AGS-TECH Inc offers are ELECTROCHEMICAL MACHINING (ECM), SHAPED-TUBE ELECTROLYTIC MACHINING (STEM), PULSED ELECTROCHEMICAL MACHINING (PECM), ELECTROCHEMICAL GRINDING (ECG), HYBRID MACHINING PROCESSES. ELECTROCHEMICAL MACHINING (ECM) is a non-conventional manufacturing technique where metal is removed by an electrochemical process. ECM is typically a mass production technique, used for machining extremely hard materials and materials that are difficult to machine using the conventional manufacturing methods. Electrochemical-machining systems we use for production are numerically controlled machining centers with high production rates, flexibility, perfect control of dimensional tolerances. Electrochemical machining is capable of cutting small and odd-shaped angles, intricate contours or cavities in hard and exotic metals like titanium aluminides, Inconel, Waspaloy, and high nickel, cobalt, and rhenium alloys. Both external and internal geometries can be machined. Modifications of the electrochemical machining process are used for operations like turning, facing, slotting, trepanning, profiling where the electrode becomes the cutting tool. The metal removal rate is only a function of ion exchange rate and is not affected by the strength, hardness or toughness of the workpiece. Unfortunately the method of electrochemical machining (ECM) is limited to electrically conductive materials. Another important point to consider deploying the ECM technique is to compare the mechanical properties of the produced parts with those produced by other machining methods. ECM removes material instead of adding it and therefore is sometimes referred to as ''reverse electroplating''. It resembles in some ways to electrical discharge machining (EDM) in that a high current is passed between an electrode and the part, through an electrolytic material removal process having a negatively charged electrode (cathode), a conductive fluid (electrolyte), and a conductive workpiece (anode). The electrolyte acts as the current carrier and is a highly conductive inorganic salt solution like sodium chloride mixed and dissolved in water or sodium nitrate. The advantage of ECM is that there is no tool wear. The ECM cutting tool is guided along the desired path close to the work but without touching the piece. Unlike EDM, however, no sparks are created. High metal removal rates and mirror surface finishes are possible with ECM, with no thermal or mechanical stresses being transferred to the part. ECM does not cause any thermal damage to the part and since there are no tool forces there is no distortion to the part and no tool wear, as would be the case with typical machining operations. In electrochemical machining cavity produced is the female mating image of the tool. In the ECM process, a cathode tool is moved into an anode workpiece. The shaped tool is generally made of copper, brass, bronze or stainless steel. The pressurized electrolyte is pumped at a high rate at a set temperature through the passages in the tool to the area being cut. The feed rate is the same as the rate of ''liquification'' of the material, and the electrolyte movement in the tool-workpiece gap washes metal ions away from the workpiece anode before they have a chance to plate onto the cathode tool. The gap between the tool and the workpiece varies between 80-800 micrometers and the DC power supply in the range 5 – 25 V maintains current densities between 1.5 – 8 A/mm2 of active machined surface. As electrons cross the gap, material from the workpiece is dissolved, as the tool forms the desired shape in the workpiece. The electrolytic fluid carries away the metal hydroxide formed during this process. Commercial electrochemical machines with current capacities between 5A and 40,000A are available. The material removal rate in electrochemical machining can be expressed as: MRR = C x I x n Here MRR=mm3/min, I=current in amperes, n=current efficiency, C=a material constant in mm3/A-min. The constant C depends on valence for pure materials. The higher the valence, the lower is its value. For most metals it is in between 1 and 2. If Ao denotes the uniform cross-sectional area being electrochemically machined in mm2, the feed rate f in mm/min can be expressed as: F = MRR / Ao Feed rate f is the speed the electrode is penetrating the workpiece. In the past there were problems of poor dimensional accuracy and environmentally polluting waste from electrochemical machining operations. These have largely been overcome. Some of the applications of electrochemical machining of high-strength materials are: - Die-Sinking operations. Die-sinking is machining forging – die cavities. - Drilling a jet engine turbine blades, jet-engine parts and nozzles. - Multiple small holes drilling. The electrochemical machining process leaves a burr-free surface. - Steam turbine blades can be machined within close limits. - For deburring of surfaces. In deburring, ECM removes metal projections left from the machining processes and so dulls sharp edges. Electrochemical machining process is fast and often more convenient than the conventional methods of deburring by hand or non-traditional machining processes. SHAPED-TUBE ELECTROLYTIC MACHINING (STEM) is a version of electrochemical machining process we use for drilling small diameter deep holes. A titanium tube is used as the tool which is coated with an electrically insulating resin to prevent the removal of material from other regions like the lateral faces of the hole and tube. We can drill hole sizes of 0.5 mm with depth-to-diameter ratios of 300:1 PULSED ELECTROCHEMICAL MACHINING (PECM): We use very high pulsed current densities in the order of 100 A/cm2. By using pulsed currents we eliminate the need for high electrolyte flow rates which poses limitations for the ECM method in mold and die fabrication. Pulsed electrochemical machining improves fatigue life and eliminates the recast layer left by the electrical discharge machining (EDM) technique on mold and die surfaces. In ELECTROCHEMICAL GRINDING (ECG) we combine the conventional grinding operation with electrochemical machining. The grinding wheel is a rotating cathode with abrasive particles of diamond or aluminum oxide that are metal bonded. The current densities range between 1 and 3 A/mm2. Similar to ECM, an electrolyte such as sodium nitrate flows and the metal removal in electrochemical grinding is dominated by the electrolytic action. Less than 5% of metal removal is by abrasive action of the wheel. The ECG technique is well suited for carbides and high-strength alloys, but not so much of a fit for die-sinking or mould making because the grinder may not easily access deep cavities. The material removal rate in electrochemical grinding can be expressed as: MRR = G I / d F Here MRR is in mm3/min, G is mass in grams, I is current in amperes, d is density in g/mm3 and F is Faraday’s constant (96,485 Coulombs/mole). The speed of penetration of the grinding wheel into workpiece can be expressed as: Vs = (G / d F) x (E / g Kp) x K Here Vs is in mm3/min, E is cell voltage in volts, g is wheel to workpiece gap in mm, Kp is coefficient of loss and K is electrolyte conductivity. The advantage of the electrochemical grinding method over conventional grinding is less wheel wear because less than 5% of the metal removal is by abrasive action of the wheel. There are similarities between EDM and ECM: 1. The tool and workpiece are separated by a very small gap without a contact in between them. 2. Both tool and material must be conductors of electricity. 3. Both techniques need high capital investment. Modern CNC machines are used 4. Both methods consume lots of electric power. 5. A conductive fluid is used as a medium between the tool and the work piece for ECM and a dielectric fluid for EDM. 6. The tool is fed continuously towards the workpiece to maintain a constant gap between them (EDM may incorporate intermittent or cyclic, typically partial, tool withdrawal). HYBRID MACHINING PROCESSES: We frequently take advantage of the benefits of hybrid machining processes where two or more different processes such as ECM, EDM….etc. are used in combination. This gives us the opportunity to overcome the shortcomings of one process by the other, and benefit from the advantages of each process. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

Photochemical Machining - PCM - Photo Etching - Chemical Milling - Blanking - Wet Etching - CM - Sheet Metal Components Хемиска обработка и фотохемиско бланирање CHEMICAL MACHINING (CM) technique is based on the fact that some chemicals attack metals and etch them. This results in removal of small layers of material from surfaces. We use reagents and etchants such as acids and alkaline solutions to remove material from surfaces. The hardness of the material is not a factor for etching. AGS-TECH Inc. frequently uses chemical machining for engraving metals, manufacturing printed-circuit boards and deburring of produced parts. Chemical machining is well suited for shallow removal up to 12 mm on large flat or curved surfaces, and CHEMICAL BLANKING of thin sheets. The chemical machining (CM) method involves low tooling and equipment costs and is advantageous over other ADVANCED MACHINING PROCESSES for low production runs. Typical material removal rates or cutting speeds in chemical machining are around 0.025 – 0.1 mm/min. Using CHEMICAL MILLING, we produce shallow cavities on sheets, plates, forgings and extrusions, either to meet design requirements or for reduction of weight in parts. The chemical milling technique can be used on a variety of metals. In our manufacturing processes, we deploy removable layers of maskants to control the selective attack by the chemical reagent on different areas of the workpiece surfaces. In microelectronic industry the chemical milling is widely used to fabricate miniature devices on chips and the technique is referred to as WET ETCHING. Some surface damage may result from chemical milling due to preferential etching and intergranular attack by the chemicals involved. This may result in deterioration of surfaces and roughening. One has to be careful prior to deciding to use chemical milling on metal castings, welded and brazed structures because uneven material removal may occur because the filler metal or the structural material may machine preferentially. In metal castings uneven surfaces may be obtained due to porosity and non-uniformity of the structure. CHEMICAL BLANKING: We use this method to produce features that penetrate through the thickness of the material, having the material removed by chemical dissolution. This method is an alternative to stamping technique we use in sheet metal manufacturing. Also in burr-free etching of printed-circuit boards (PCB) we deploy chemical blanking. PHOTOCHEMICAL BLANKING & PHOTOCHEMICAL MACHINING (PCM): Photochemical blanking is also known as PHOTOETCHING or PHOTO ETCHING, and is a modified version of chemical milling. Material is removed from flat thin sheets using photographic techniques and complex burr-free, stress-free shapes are blanked. Using photochemical blanking we manufacture fine and thin metal screens, printed-circuit cards, electric-motor laminations, flat precision springs. The photochemical blanking technique offers us the advantage of producing small parts, fragile parts without the need to manufacture difficult and expensive blanking dies that are used in traditional sheet metal manufacturing. Photochemical blanking does require skilled personnel, but the tooling costs are low, the process is easily automated and feasibility is high for medium to high volume production. Some disadvantages exist as is the case in every manufacturing process: Environmental concerns due to chemicals and safety concerns due to volatile liquids being used. Photochemical machining also known as PHOTOCHEMICAL MILLING, is the process of fabricating sheet metal components using a photoresist and etchants to corrosively machine away selected areas. Using photo etching we produce highly complex parts with fine details economically. The photochemical milling process is for us an economical alternative to stamping, punching, laser and water jet cutting for thin gauge precision parts. The photochemical milling process is useful for prototyping and allows for easy and quick changes when there is a change in design. It is an ideal technique for research & development. Phototooling is fast and inexpensive to produce. Most phototools cost less than $ 500 and can be produced within two days. Dimensional tolerances are well met with no burrs, no stress and sharp edges. We can start manufacturing a part within hours after receiving your drawing. We can use PCM on most commercially available metals and alloys such as include aluminium, brass, beryllium-copper, copper, molybdenum, inconel, manganese, nickel, silver, steel, stainless steel, zinc and titanium with thicknesses of 0.0005 to 0.080 in (0.013 to 2.0 mm). Phototools are exposed only to light and therefore do not wear out. Due to the cost of hard tooling for stamping and fine blanking, significant volume is required to justify the expense, which is not the case in PCM. We start the PCM process by printing the shape of the part onto optically clear and dimensionally stable photographic film. The phototool consists of two sheets of this film showing negative images of the parts meaning that the area that will become the parts is clear and all of the areas to be etched are black. We register the two sheets optically and mechanically to form the top and bottom halves of the tool. We cut the metal sheets to size, clean and then laminate on both sides with a UV-sensitive photoresist. We place the coated metal between the two sheets of the phototool and a vacuum is drawn to ensure intimate contact between the phototools and the metal plate. We then expose the plate to UV light that allows the areas of resist that are in the clear sections of the film to be hardened. After exposure we wash away the unexposed resist of the plate, leaving the areas to be etched unprotected. Our etching lines have driven-wheel conveyors to move the plates and arrays of spray nozzles above and below the plates. The etchant is typically an aqueous solution of acid such as ferric chloride, that is heated and directed under pressure to both sides of the plate. The etchant reacts with the unprotected metal and corrodes it away. After neutralizing and rinsing, we remove the remaining resist and the sheet of parts is cleaned and dried. Applications of photochemical machining include fine screens and meshes, apertures, masks, battery grids, sensors, springs, pressure membranes, flexible heating elements, RF and microwave circuits and components, semiconductor leadframes, motor and transformer laminations, metal gaskets and seals, shields and retainers, electrical contacts, EMI/RFI shields, washers. Some parts, such as semiconductor leadframes, are very complex and fragile that, despite volumes in the millions of pieces, they can only be produced by photo etching. The accuracy achievable with the chemical etching process offers us tolerances starting at +/-0.010mm depending on the material type and thickness. Features can be positioned with accuracies around +-5 microns. In PCM, the most economical way is to plan the largest sheet size possible consistent with the size and dimensional tolerances of the part. The more parts per sheet are produced the lower the unit labor cost per part. Material thickness affects costs and is proportional to the length of time to etch through. Most alloys etch at rates between 0.0005–0.001 in (0.013–0.025 mm) of depth per minute per side. In general, for steel, copper or aluminum workpieces with thicknesses up to 0.020 in (0.51 mm), part costs will be roughly $0.15–0.20 per square inch. As the geometry of the part becomes more complex, photochemical machining gains greater economic advantage over sequential processes such as CNC punching, laser or water-jet cutting, and electrical discharge machining. Contact us today with your project and let us provide you our ideas and suggestions. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор ПРЕТХОДНА СТРАНИЦА

We are a major supplier of high quality Wood Cutting Shaping Tools including Multi Angle Drill Bits, 3 Flute Router Bits, Wood Boring Bits, TCT Saw Blades, Router Bits, HSS Wood Turning Tools, Woodworker Chisel, Countersink for Wood, Woodworking Plane, Hinge Drilling Vix Bits, Jigsaw Blades, Auger Bits and more Алатки за сечење и обликување дрво Our wood cutting and shaping tools are widely used by professional carpenters, furniture production plants, forestry workers, hobby shops and many others. Please click on the highlighted text of wood cutting & shaping tools of interest below to download related brochure or catalog. We do have a wide spectrum of wood cutting & shaping tools suitable for almost any application. There is a wide variety of wood cutting & shaping tools with different dimensions, applications and material; it is impossible to present them all here. If you cannot find or if you are not sure which wood cutting and shaping tools will meet your expectations and requirements, email or call us so we can determine which product is the best fit for you. When contacting us, please try to provide us as much detail as possible such as your application, dimensions, material grade if you know, finishing requirements, packaging & labeling requirements and of course quantity of your planned order. Multi Angle Drill Bits New!! 3 Flute Router Bits New!! Wood Boring Bits TCT Saw Blades Router Bits HSS Wood Turning Tools Woodworker Chisel Countersinks for Wood Woodworking Plane Hinge Drilling Vix Bits Hollow Chisel Jigsaw Blades Reciprocating Saw Blade Auger Bits Wood Brad Drill Bits Multi-spur Bits Hinge Boring Bits Multi-boring Dowel Drills Forstner Bits Spade Bits (Flat Bits) Door Lock Drill Set Plug Cutters Private Label Abrasives (We can put your company name, logo, brand on these. In other words we offer you private label) Private Label Abrasives Ordering Instructions Guide Private Label Drill Bits (We can private label these drill bits with your company name and logo) Private Label Hand Tools for Every Industry This catalog contains some wood cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tool Accessories This brochure includes some wood cutting and shaping tools . We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry This catalog contains some wood cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Taps - Cutting Tools (We can private label these drill bits with your company name and logo) КЛИКНЕТЕ ТУКА за да ги преземете нашите технички способности и референтниот водич за специјализирани алатки за сечење, дупчење, мелење, обликување, обликување, полирање што се користат во медицински, стоматолошки, прецизни инструменти, печат на метал, обликување матрица и други индустриски апликации. КЛИКНЕТЕ Услуга за пронаоѓање на производи-локатор Кликнете овде за да отидете во менито Алатки за сечење, дупчење, брусење, преклопување, полирање, коцки и обликување Уп. Шифра: OICASOSTAR