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Micro-Optics, Micro-Optical, Microoptical, Wafer Level Optics, Gratings, Fresnel Lenses, Lens Array, Micromirrors, Micro Reflectors, Collimators, Aspheres, LED Micro-Optics Manufacturing One of the fields in microfabrication we are involved in is MICRO-OPTICS MANUFACTURING. Micro-optics allows the manipulation of light and the management of photons with micron and sub-micron scale structures and components. Some applications of MICRO-OPTICAL COMPONENTS and SUBSYSTEMS are: Information technology: In micro-displays, micro-projectors, optical data storage, micro-cameras, scanners, printers, copiers…etc. Biomedicine: Minimally-invasive/point of care diagnostics, treatment monitoring, micro-imaging sensors, retinal implants, micro-endoscopes. Lighting: Systems based on LEDs and other efficient light sources Safety and Security Systems: Infrared night vision systems for automotive applications, optical fingerprint sensors, retinal scanners. Optical Communication & Telecommunication: In photonic switches, passive fiber optic components, optical amplifiers, mainframe and personal computer interconnect systems Smart structures: In optical fiber-based sensing systems and much more The types of micro-optical components and subsystems we manufacture and supply are: - Wafer Level Optics - Refractive Optics - Diffractive Optics - Filters - Gratings - Computer Generated Holograms - Hybrid Microoptical Components - Infrared Micro-Optics - Polymer Micro-Optics - Optical MEMS - Monolithically and Discretely Integrated Micro-Optic Systems Some of our most widely used micro-optical products are: - Bi-convex and plano-convex lenses - Achromat lenses - Ball lenses - Vortex Lenses - Fresnel Lenses - Multifocal Lens - Cylindrical Lenses - Graded Index (GRIN) Lenses - Micro-Optical Prisms - Aspheres - Arrays of Aspheres - Collimators - Micro-Lens Arrays - Diffraction Gratings - Wire-Grid Polarizers - Micro-Optic Digital Filters - Pulse Compression Gratings - LED Modules - Beam Shapers - Beam Sampler - Ring Generator - Micro-Optical Homogenizers / Diffusers - Multispot Beam Splitters - Dual Wavelength Beam Combiners - Micro-Optical Interconnects - Intelligent Micro-Optics Systems - Imaging Microlenses - Micromirrors - Micro Reflectors - Micro-Optical Windows - Dielectric Mask - Iris Diaphragms Let us provide you some basic information about these micro-optical products and their applications: BALL LENSES: Ball lenses are completely spherical micro-optic lenses most commonly used to couple light in and out of fibers. We supply a range of micro-optic stock ball lenses and can manufacture also to your own specifications. Our stock ball lenses from quartz have excellent UV and IR transmission between 185nm to >2000nm, and our sapphire lenses have a higher refractive index, allowing a very short focal length for excellent fiber coupling. Micro-optical ball lenses from other materials and diameters are available. Besides fiber coupling applications, micro-optical ball lenses are used as objective lenses in endoscopy, laser measurement systems and bar-code scanning. On the other hand, micro-optic half ball lenses offer uniform dispersion of light and are widely used in LED displays and traffic lights. MICRO-OPTICAL ASPHERES and ARRAYS: Aspheric surfaces have a non-spherical profile. Use of aspheres can reduce the number of optics required to reach a desired optical performance. Popular applications for micro-optical lens arrays with spherical or aspherical curvature are imaging and illumination and the effective collimation of laser light. Substitution of a single aspheric microlens array for a complex multilens system results not only in smaller size, lighter weight, compact geometry, and lower cost of an optical system, but also in significant improvement of its optical performance such as better imaging quality. However, the fabrication of aspheric microlenses and microlens arrays is challenging, because conventional technologies used for macro-sized aspheres like single-point diamond milling and thermal reflow are not capable of defining a complicated micro-optic lens profile in an area as small as several to tens of micrometers. We possess the know-how of producing such micro-optical structures using advanced techniques such as femtosecond lasers. MICRO-OPTICAL ACHROMAT LENSES: These lenses are ideal for applications requiring color correction, while aspheric lenses are designed to correct spherical aberration. An achromatic lens or achromat is a lens that is designed to limit the effects of chromatic and spherical aberration. Micro-optical achromatic lenses make corrections to bring two wavelengths (such as red and blue colors) into focus on the same plane. CYLINDRICAL LENSES: These lenses focus light into a line instead of a point, as a spherical lens would. The curved face or faces of a cylindrical lens are sections of a cylinder, and focus the image passing through it into a line parallel to the intersection of the surface of the lens and a plane tangent to it. The cylindrical lens compresses the image in the direction perpendicular to this line, and leaves it unaltered in the direction parallel to it (in the tangent plane). Tiny micro-optical versions are available which are suitable for use in micro optical environments, requiring compact-size fiber optical components, laser systems, and micro-optical devices. MICRO-OPTICAL WINDOWS and FLATS: Milimetric micro-optical windows meeting tight tolerance requirements are available. We can custom manufacture them to your specifications from any of the optical grade glasses. We offer a variety of micro-optical windows made of different materials such as fused silica, BK7, sapphire, zinc sulphide….etc. with transmission from UV to middle IR range. IMAGING MICROLENSES: Microlenses are small lenses, generally with a diameter less than a millimetre (mm) and as small as 10 micrometres. Imaging Lenses are used to view objects in imaging systems. Imaging Lenses are used in imaging systems to focus an image of an examined object onto a camera sensor. Depending on the lens, imaging lenses can be used to remove parallax or perspective error. They can also offer adjustable magnifications, field of views, and focal lengths. These lenses allow an object to be viewed in several ways to illustrate certain features or characteristics that may be desirable in certain applications. MICROMIRRORS: Micromirror devices are based on microscopically small mirrors. The mirrors are Microelectromechanical systems (MEMS). The states of these micro-optical devices are controlled by applying a voltage between the two electrodes around the mirror arrays. Digital micromirror devices are used in video projectors and optics and micromirror devices are used for light deflection and control. MICRO-OPTIC COLLIMATORS & COLLIMATOR ARRAYS: A variety of micro-optical collimators are available off-the-shelf. Micro-optical small beam collimators for demanding applications are produced using laser fusion technology. The fiber end is directly fused to the optical center of the lens, thereby eliminated epoxy within the optical path. The micro-optic collimator lens surface is then laser polished to within a millionth of an inch of the ideal shape. Small Beam collimators produce collimated beams with beam waists under a millimeter. Micro-optical small beam collimators are typically used at 1064, 1310 or 1550 nm wavelengths. GRIN lens based micro-optic collimators are also available as well as collimator array and collimator fiber array assemblies. MICRO-OPTICAL FRESNEL LENSES: A Fresnel lens is a type of compact lens designed to allow the construction of lenses of large aperture and short focal length without the mass and volume of material that would be required by a lens of conventional design. A Fresnel lens can be made much thinner than a comparable conventional lens, sometimes taking the form of a flat sheet. A Fresnel lens can capture more oblique light from a light source, thus allowing the light to be visible over greater distances. The Fresnel lens reduces the amount of material required compared to a conventional lens by dividing the lens into a set of concentric annular sections. In each section, the overall thickness is decreased compared to an equivalent simple lens. This can be viewed as dividing the continuous surface of a standard lens into a set of surfaces of the same curvature, with stepwise discontinuities between them. Micro-optic Fresnel lenses focus light by refraction in a set of concentric curved surfaces. These lenses can be made very thin and lightweight. Micro-optical Fresnel lenses offer opportunities in optics for highresolution Xray applications, throughwafer optical interconnection capabilities. We have a number of fabrication methods including micromolding and micromachining to manufacture micro-optical Fresnel lenses and arrays specifically for your applications. We can design a positive Fresnel lens as a collimator, collector or with two finite conjugates. Micro-Optical Fresnel lenses are usually corrected for spherical aberrations. Micro-optic positive lenses can be metalized for use as a second surface reflector and negative lenses can be metalized for use as a first surface reflector. MICRO-OPTICAL PRISMS: Our line of precision micro-optics includes standard coated and uncoated micro prisms. They are suitable for use with laser sources and imaging applications. Our micro-optical prisms have submilimeter dimensions. Our coated micro-optical prisms can also be used as mirror reflectors with respect to incoming light. Uncoated prisms act as mirrors for light incident on one of the short sides since incident light is totally internally reflected at the hypotenuse. Examples of our micro-optical prism capabilities include right angle prisms, beamsplitter cube assemblies, Amici prisms, K-prisms, Dove prisms, Roof prisms, Cornercubes, Pentaprisms, Rhomboid prisms, Bauernfeind prisms, Dispersing prisms, Reflecting prisms. We also offer light guiding and de-glaring optical micro-prisms made from acrylic, polycarbonate and other plastic materials by hot embossing manufacturing process for applications in lamps and luminaries, LEDs. They are highly efficient, strong light guiding precise prism surfaces, support luminaries to fulfill office regulations for de-glaring. Additional customized prism structures are possible. Microprisms and microprism arrays on wafer level are also possible using microfabrication techniques. DIFFRACTION GRATINGS: We offer design and manufacture of diffractive micro-optical elements (DOEs). A diffraction grating is an optical component with a periodic structure, which splits and diffracts light into several beams travelling in different directions. The directions of these beams depend on the spacing of the grating and the wavelength of the light so that the grating acts as the dispersive element. This makes grating a suitable element to be used in monochromators and spectrometers. Using wafer-based lithography, we produce diffractive micro-optical elements with exceptional thermal, mechanical and optical performance characteristics. Wafer-level processing of micro-optics provides excellent manufacturing repeatability and economic output. Some of the available materials for diffractive micro-optical elements are crystal-quartz, fused-silica, glass, silicon and synthetic substrates. Diffraction gratings are useful in applications such as spectral analysis / spectroscopy, MUX/DEMUX/DWDM, precision motion control such as in optical encoders. Lithography techniques make the fabrication of precision micro-optical gratings with tightly-controlled groove spacings possible. AGS-TECH offers both custom and stock designs. VORTEX LENSES: In laser applications there is a need to convert a Gaussian beam to a donut-shaped energy ring. This is achieved using Vortex lenses. Some applications are in lithography and high-resolution microscopy. Polymer on glass Vortex phase plates are also available. MICRO-OPTICAL HOMOGENIZERS / DIFFUSERS: A variety of technologies are used to fabricate our micro-optical homogenizers and diffusers, including embossing, engineered diffuser films, etched diffusers, HiLAM diffusers. Laser Speckle is the optical phenomena resulting from the random interference of coherent light. This phenomenon is utilized to measure the Modulation Transfer Function (MTF) of detector arrays. Microlens diffusers are shown to be efficient micro-optic devices for speckle generation. BEAM SHAPERS: A micro-optic beam shaper is an optic or a set of optics that transforms both the intensity distribution and the spatial shape of a laser beam to something more desirable for a given application. Frequently, a Gaussian-like or non-uniform laser beam is transformed to a flat top beam. Beam shaper micro-optics are used to shape and manipulate single mode and multi-mode laser beams. Our beam shaper micro-optics provide circular, square, rectilinear, hexagonal or line shapes, and homogenize the beam (flat top) or provide a custom intensity pattern according to the requirements of the application. Refractive, diffractive and reflective micro-optical elements for laser beam shaping and homogenizing have been manufactured. Multifunctional micro-optical elements are used for shaping arbitrary laser beam profiles into a variety of geometries like, a homogeneous spot array or line pattern, a laser light sheet or flat-top intensity profiles. Fine beam application examples are cutting and keyhole welding. Broad beam application examples are conduction welding, brazing, soldering, heat treatment, thin film ablation, laser peening. PULSE COMPRESSION GRATINGS: Pulse compression is a useful technique that takes advantage of the relationship between pulse duration and spectral width of a pulse. This enables the amplification of laser pulses above the normal damage threshold limits imposed by the optical components in the laser system. There are linear and nonlinear techniques for reducing the durations of optical pulses. There is variety of methods for temporally compressing / shortening optical pulses, i.e., reducing the pulse duration. These methods generally start in the picosecond or femtosecond region, i.e. already in the regime of ultrashort pulses. MULTISPOT BEAM SPLITTERS: Beam splitting by means of diffractive elements is desirable when one element is required to produce several beams or when very exact optical power separation is required. Precise positioning can also be achieved, for example, to create holes at clearly defined and accurate distances. We have Multi-Spot Elements, Beam Sampler Elements, Multi-Focus Element. Using a diffractive element, collimated incident beams are split into several beams. These optical beams have equal intensity and equal angle to one another. We have both one-dimensional and two-dimensional elements. 1D elements split beams along a straight line whereas 2D elements produce beams arranged in a matrix of, for example, 2 x 2 or 3 x 3 spots and elements with spots that are arranged hexagonally. Micro-optical versions are available. BEAM SAMPLER ELEMENTS: These elements are gratings that are used for inline monitoring of high power lasers. The ± first diffraction order can be used for beam measurements. Their intensity is significantly lower than that of the main beam and can be custom designed. Higher diffraction orders can also be used for measurement with even lower intensity. Variations in intensity and changes in the beam profile of high power lasers can be reliably monitored inline using this method. MULTI-FOCUS ELEMENTS: With this diffractive element several focal points can be created along the optical axis. These optical elements are used in sensors, ophthalmology, material processing. Micro-optical versions are available. MICRO-OPTICAL INTERCONNECTS: Optical interconnects have been replacing electrical copper wires at the different levels in the interconnect hierarchy. One of the possibilities to bring the advantages of micro-optics telecommunications to the computer backplane, the printed circuit board, the inter-chip and on-chip interconnect level, is to use free-space micro-optical interconnect modules made of plastic. These modules are capable of carrying high aggregate communication bandwidth through thousands of point-to-point optical links on a footprint of a square centimeter. Contact us for off-shelf as well as custom tailored micro-optical interconnects for computer backplane, the printed circuit board, the inter-chip and on-chip interconnect levels. INTELLIGENT MICRO-OPTICS SYSTEMS: Intelligent micro-optic light modules are used in smart phones and smart devices for LED flash applications, in optical interconnects for transporting data in supercomputers and telecommunications equipment, as miniaturized solutions for near-infrared beam shaping, detection in gaming applications and for supporting gesture control in natural user interfaces. Sensing opto-electronic modules are used for a number of product applications such as ambient light and proximity sensors in smart phones. Intelligent imaging micro-optic systems are used for primary and front-facing cameras. We offer also customized intelligent micro-optical systems with high performance and manufacturability. LED MODULES: You can find our LED chips, dies and modules on our page Lighting & Illumination Components Manufacturing by clicking here. WIRE-GRID POLARIZERS: These consist of a regular array of fine parallel metallic wires, placed in a plane perpendicular to the incident beam. The polarization direction is perpendicular to the wires. Patterned polarizers have applications in polarimetry, interferometry, 3D displays, and optical data storage. Wire-grid polarizers are extensively used in infrared applications. On the other hand micropatterned wire-grid polarizers have limited spatial resolution and poor performance at visible wavelengths, are susceptible to defects and cannot be easily extended to non-linear polarizations. Pixelated polarizers use an array of micro-patterned nanowire grids. The pixelated micro-optical polarizers can be aligned with cameras, plane arrays, interferometers, and microbolometers without the need for mechanical polarizer switches. Vibrant images distinguishing between multiple polarizations across the visible and IR wavelengths can be captured simultaneously in real-time enabling fast, high resolution images. Pixelated micro-optical polarizers also enable clear 2D and 3D images even in low-light conditions. We offer patterned polarizers for two, three and four-state imaging devices. Micro-optical versions are available. GRADED INDEX (GRIN) LENSES: Gradual variation of the refractive index (n) of a material can be used to produce lenses with flat surfaces, or lenses that do not have the aberrations typically observed with traditional spherical lenses. Gradient-index (GRIN) lenses may have a refraction gradient that is spherical, axial, or radial. Very small micro-optical versions are available. MICRO-OPTIC DIGITAL FILTERS: Digital neutral density filters are used to control the intensity profiles of illumination and projection systems. These micro-optic filters contain well-defined metal absorber micro-structures that are randomly distributed on a fused silica substrate. Properties of these micro-optical components are high accuracy, large clear aperture, high damage threshold, broadband attenuation for DUV to IR wavelengths, well defined one or two dimensional transmission profiles. Some applications are soft edge apertures, precise correction of intensity profiles in illumination or projection systems, variable attenuation filters for high-power lamps and expanded laser beams. We can customize the density and size of the structures to meet precisely the transmission profiles required by the application. MULTI-WAVELENGTH BEAM COMBINERS: Multi-Wavelength beam combiners combine two LED collimators of different wavelengths into a single collimated beam. Multiple combiners can be cascaded to combine more than two LED collimator sources. Beam combiners are made of high-performance dichroic beam splitters that combine two wavelengths with >95% efficiency. Very small micro-optic versions are available. CLICK Product Finder-Locator Service PREVIOUS PAGE

Industrial Chemicals, Industrial Consumables, Aerosols, Sprays, Industrial Chemical Agents Industrial Chemicals and Consumables There are many specialty chemicals that are use in the industry. Contact us if you would like to know how we can help you formulating and producing a specialty chemical product. We also offer some off-the-shelf chemical products that are used in various industrial applications such as the automotive and motor vehicle industries, electronic industry, optical industry, medical facilities, clean rooms, pharmaceutical plants.....etc. Please note that we engineer, design and manufacture products to your needs and specifications. We can either manufacture products according to your specifications or, If desired, we can help you in choosing the right materials and designing the product. You can click on the blue highlighted text below and download the industrial chemicals and consumables product brochures: - Filters & Filtration Products & Membranes - Private Label Aerosols and Sprays We can label these products with your name and logo if you wish - Private Label Cleanroom Consumables and Apparel We can label these products with your name and logo if you wish - Private Label Epoxy Solutions for Construction, Electrical, Industrial Assembly (We can put your name, label, logo on these epoxies if you wish) - Private Label Nano Surface Protection Car Care Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Industrial Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Marine Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Products We can label these products with your name and logo if you wish - Private Label Tapes for Every Application We can label these products with your name and logo if you wish PREVIOUS PAGE

How to Become a Supplier for Engineering Integrator and Custom Manufacturer AGS-TECH Inc. of Albuquerque - NM - USA Become a Supplier for Engineering Integrator and Custom Manufacturer AGS-TECH Inc. Want to become a global supplier for engineering integrator and custom manufacturer AGS-TECH Inc. ? To become a potential supplier for us: 1.) Please click here to visit our supplier platform: https://www.agsoutsourcing.com/online-supplier-application-platfor 2.) On this form, please fill out as much detail as possible. Once your data is entered into our system it is filtered, screened and evaluated. Depending on keywords and input content, it is categorized, rated and evaluated for further processing. If your company is found appropriate and suitable for our needs, we will then send you RFQs (Request for Quote) and RFPs (Request for Proposal). Since we are a custom manufacturer and engineering integrator, of particular value to us are global manufacturers in areas where the most shortage of skill is present. If you are a supplier for the following, we encourage you to register your company to our database via the above link: -Custom manufacturer of low to medium volume plastic moulds (100 to 500 pieces per order). -Custom manufacturer of low to medium volume metal castings and CNC machined parts (100 to 500 pieces per order). -Engineering integrator and custom manufacturer that has the capability to be a supplier of both metal and polymer parts and that can accept parts assembly as part of a contract. -Small to intermediate volume custom manufacturer of electric cable assemblies and wire harness (100 to 500 pieces per order). -Engineering integrator with capability to integrate custom hardware with new software. -Supplier of test and metrology equipment that is new to us and not to be found in our brochures. -Engineering integrator and custom manufacturer who can complement or contribute to our product lines in unique ways. -Engineering integrator and custom manufacturer of micromanufactured and mesomanufactured products such as miniature custom sensors and actuators, miniature electronic and optoelectronic devices. -Supplier of smaller quantity custom coatings. As an engineering integrator and custom manufacturer we bring together parts, subassemblies and products from the best plants and assemble them together, package and label them according to requirements and ship to our customers. Integration is the process of bringing together the components into one system and ensuring that the subsystems function together as a system. To keep our spot as a distinguished engineering integrator and custom manufacturer, we have to keep working with the finest suppliers and assure that they do have valid and up-to-date quality related certifications obtained from well established certification bodies. An ISO9001, TS16949, QS9000, AS9001, ISO13485 are among the first requirements for any custom manufacturer of products and/or provider of engineering services to us. In addition to one of these certifications, any custom manufacturer or engineering services provider will need to present further evidence of being capable to contribute successfully to our engineering and integration efforts by showing examples of products for which a CE or UL mark was obtained, evidence of having successfully sold products meeting international standards such as IEEE, IEC, ASTM, DIN, MIL-SPEC…etc. to customers in the US, Canadian, Australian, EU and Japanese markets. If you are an engineering integrator and custom manufacturer, you are especially important for us because of your ability to integrate at least some of the components at your facility before shipping them to us. Being a globally recognized engineering integrator and custom manufacturer, logistics is a key element in our business. We must keep being able to ship fast, damage-free and economically. Therefore having presence in one of the logistically key locations is very important for every engineering integrator and custom manufacturer willing to collaborate and partner with us. Logistics is a complex issue we constantly work on and keep improving. As an example, sometimes the best option is to ship a product as individual components and parts from one or several plants to an assembly plant that is in the vicinity of our customer. This saves on shipping cost because the final product may be large and bulky and the final assembly plant being close to customer will keep shipping prices to a minimum and at the same time be a safer option where the most value is put into the product that is shipped only a short distance to its final destination. PREVIOUS PAGE

Vibration Meter - Tachometer - Accelerometer -Vibrometer- Nondestructive Testing - SADT-Mitech- AGS-TECH Inc. - NM - USA Vibration Meters, Tachometers VIBRATION METERS and NON-CONTACT TACHOMETERS are widely used in inspection, manufacturing, production, laboratory and R&D. Please download catalogs from colored links below and let us know the brand name and model number of the product of your choice. We can offer you brand new as well as refurbished / used vibration meters, tachometers at the most competitive prices: FLUKE Test Tools Catalog (includes vibration meters, vibration testers, laser shaft alignment tool) SADT-SINOAGE Brand Metrology and Test Equipment, please CLICK HERE. In this catalog you will find some high quality vibration meters and tachometers. The vibration meter is used to measure vibrations and oscillations in machines, installations, tools or components. Measurements of the vibration meter provides the following parameters: vibration acceleration, vibration velocity and vibration displacement. This way the vibration is recorded with great precision. They are mostly portable devices and the readings can be stored and retrieved for later use. Critical frequencies which can cause damage or disturbing noise level may be detected using a vibration meter. We sell and service a number of vibration meter and non-contact tachometer brands including SINOAGE, SADT. Modern versions of these test instruments are capable of simultaneously measuring and recording a variety of parameters such as temperature, humidity, pressure, 3-axis acceleration and light; their data logger record over millions of measured values, have optional microSD cards making the able to record even over a billion measured values. Many have selectable parameters, housings, external sensors, and USB-interfaces. WIRELESS VIBRATION METERS provide the comfort of transmitting data wirelessly from the tested machine to the receiver for inspection and analysis. VIBRATION TRANSMITTERS are perfect solutions for continuous monitoring. A vibration transmitter can be used for vibration monitoring of equipment in remote or hazardous locations. They are designed in rugged NEMA 4 rated cases. Programmable version are available. Other versions include the POCKET ACCELEROMETER to measure vibration velocity in machines and installations. MULTICHANNEL VIBRATION METERS to perform vibration measurements on multiple places at the same time. The vibration velocity, acceleration and expansion in a wide frequency range can be measured. The cables of the vibration sensors are long, so the vibration measuring device is able to record vibrations at different points of the component to be tested. Many vibration meters are used primarily to determine vibrations in machines and installations revealing vibration acceleration, vibration velocity and vibration displacement. With the help of these vibration meters, the technicians are able to quickly determine the current state of the machine and the causes of the vibrations, and make the necessary adjustments and assess new conditions afterwards. However some vibration meter models can be used in the same way, but they also have functions to analyze the FAST FOURIER TRANSFORM (FFT) and display if any specific frequencies are occurring within the vibrations. These are used preferably for investigation development of machines and installations or to take measurements over a period of time in a test environment. The Fast Fourier Transform (FFT) models can also determine and analyze the 'Harmonics' with ease and precision. Vibration meters are normally used for the control rotational axis of machinery so the technicians are able to determine and evaluate the development of an axis with accuracy. In cases of emergency, the axis may be modified and changed during a scheduled pause of the machine. Many factors can cause excessive vibration in rotating machinery such as worn out bearings and couplings, foundation damage, broken mounting bolts, misalignment and unbalance. A well scheduled vibration measurement procedure helps to detect and eliminate these failures early on before any serious machine problems occur. A TACHOMETER (also called a revolution-counter, RPM gauge) is an instrument that measures the rotation speed of a shaft or disk, as in a motor or machine. These devices display the revolutions per minute (RPM) on a calibrated analogue or digital dial or display. The term tachometer is usually restricted to mechanical or electrical instruments that indicate instantaneous values of speed in revolutions per minute, rather than devices that count the number of revolutions in a measured time interval and indicate only average values for the interval. There are CONTACT TACHOMETERS as well as NON-CONTACT TACHOMETERS (also referred to as a PHOTO TACHOMETER or LASER TACHOMETER or INFRARED TACHOMETER depending on the light source used). Yet some others are referred to as COMBINATION TACHOMETERS combining a contact and photo tachometer in one unit. Modern combination tachometers show reverse direction characters on display depending on contact or photo mode, use visible light to read several inches of distance from target, the memory/readings button holds the last reading and recalls min/max readings. Just as with vibration meters, there are many models of tachometers including multi-channel instruments for measuring speed at multiple locations simultaneously, wireless versions for providing information from remote locations….etc. RPM ranges for modern instruments vary from a few RPMs to hundred or hundreds of thousands of RPM values, they offer automatic range selection, auto-zero adjustment, values such as +/- 0.05% accuracy. Our vibration meters and non-contact tachometers from SADT are: Portable Vibration Meter SADT Model EMT220 : Integrated vibration transducer, annular shear type acceleration transducer (only for integrated type), separate, built-in electric charge amplifier, shear type acceleration transducer (only for separate type), temperature transducer, type K thermoelectric couple transducer (only for EMT220 with temperature measuring function). Device has root mean square detector, vibration measurement scale for displacement is 0.001~1.999 mm (peak to peak), for velocity is 0.01~19.99 cm/s (rms value), for acceleration is 0.1~199.9 m/s2 (peak value), for vibration acceleration is 199.9 m/s2 (peak value). Temperature measurement scale is -20~400°C (only for EMT220 with temperature-measuring function). Accuracy for vibration measurement: ±5% Measurement value ±2 Digits. Temperature measurement: ±1% Measurement value ±1 Digit, Vibration Frequency Range: 10~1 kHz (Normal type) 5~1 kHz (Low frequency type) 1~15 kHz (only at “HI” position for acceleration). Display is liquid crystal display (LCD), Sample period: 1 second, vibration measurement value readout: Displacement: Peak to peak value (r.m.s.×2squareroot2), Velocity: Root mean square (r.m.s.), Acceleration: Peak value (r.m.s.×squareroot 2), Readout-keeping function: Readout of vibration / temperature value can be remembered after releasing the Measure Key (Vibration / Temperature Switch), Output Signal: 2V AC (peak value) (load resistance above 10 k at full measuring scale), Power supply: 6F22 9V laminated cell, battery life about 30 hours for continuous use, Power on / off: Power up when pressing Measure Key (Vibration / Temperature Switch), power automatically shuts off after releasing the Measure Key for one minute, Operating conditions: Temperature: 0~50°C, Humidity: 90% RH , Dimensions:185mm×68mm×30mm, Net weight:200g Portable Optical Tachometer SADT Model EMT260 : Unique ergonomic design provides direct line-of-sight viewing of display and target, easily readable 5 digit LCD display, on-target and low battery indicator, maximum, minimum and last measurement of rotational speed, frequency, cycle, linear speed and counter. Speed Ranges: Rotational speed:1~99999r/min, Frequency: 0.0167~1666.6Hz, Cycle:0.6~60000ms, Counter:1~99999, Linear speed:0.1~3000.0m/min, 0.0017~16.666m/s, Accuracy:±0.005% of reading, Display:5 digit LCD display, Input signal:1-5VP-P Pulse Input, Output signal: TTL compatible Pulse Output, Power:2x1.5V batteries, Dimensions (LxWxH): 128mmx58mmx26mm, Net weight:90g For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Microfluidic Devices - Microfluidics - Micropumps - Microvalves - Lab-on-a-Chip Systems - Microhydraulic - Micropneumatic - AGS-TECH Inc.- New Mexico - USA Microfluidic Devices Manufacturing Our MICROFLUIDIC DEVICES MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. We have the capability to design microfluidic devices for you and offer prototyping & micromanufacturing custom tailored for your applications. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In MICROFLUIDICS we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. Some major applications of microfluidic devices and systems are: - Laboratories on a chip - Drug screening - Glucose tests - Chemical microreactor - Microprocessor cooling - Micro fuel cells - Protein crystallization - Rapid drugs change, manipulation of single cells - Single cell studies - Tunable optofluidic microlens arrays - Microhydraulic & micropneumatic systems (liquid pumps, gas valves, mixing systems…etc) - Biochip early warning systems - Detection of chemical species - Bioanalytical applications - On-chip DNA and protein analysis - Nozzle spray devices - Quartz flow cells for detection of bacteria - Dual or multiple droplet generation chips Our design engineers have many years of experience in modeling, designing and testing of microfluidic devices for a range of applications. Our design expertise in the area of microfluidics includes: • Low temperature thermal bonding process for microfluidics • Wet etching of microchannels with etch depths of nm to mm deep in glass and borosilicate. • Grinding and polishing for a wide range of substrate thicknesses from as thin as 100 microns to over 40 mm. • Ability to fuse multiple layers to create complex microfluidic devices. • Drilling, dicing and ultrasonic machining techniques suitable for microfluidic devices • Innovative dicing techniques with precise edge connection for interconnectibility of microfluidic devices • Accurate alignment • Variety of deposited coatings, microfluidic chips can be sputtered with metals such as platinum, gold, copper and titanium to create a wide range of features, such as embedded RTDs, sensors, mirrors and electrodes. Besides our custom fabrication capabilities we have hundreds of off-the-shelf standard microfluidic chip designs available with hydrophobic, hydrophilic or fluorinated coatings and a wide range of channel sizes (100 nanometers to 1mm), inputs, outputs, different geometries such as circular cross, pillar arrays and micromixer. Our microfluidic devices offer excellent chemical resistance and optical transparency, high temperature stability up to 500 Centigrade, high pressure range up to 300 Bar. Some popular microfluidic off-shelf chips are: MICROFLUIDIC DROPLET CHIPS: Glass Droplet Chips with different junction geometries, channel sizes and surface properties are available. Microfluidic droplet chips have excellent optical transparency for clear imaging. Advanced hydrophobic coating treatments enable water-in-oil droplets to be generated as well as oil-in-water droplets formed in the untreated chips. MICROFLUIDIC MIXER CHIPS: Enabling mixing of two fluid streams within miliseconds, the micromixer chips benefit a wide range of applications including reaction kinetics, sample dilution, rapid crystallisation and nanoparticle synthesis. SINGLE MICROFLUIDIC CHANNEL CHIPS: AGS-TECH Inc. offers single channel microfluidic chips with one inlet and one outlet for several applications. Two different chip dimensions are available off-the-shelf (66x33mm and 45x15mm). We also stock compatible chip holders. CROSS MICROFLUIDIC CHANNEL CHIPS: We also offer microfluidic chips with two simple channels crossing each other. Ideal for droplet generation and flow focusing applications. Standard chip dimensions are 45x15mm and we have a compatible chip holder. T-JUNCTION CHIPS: The T-Junction is a basic geometry used in microfluidics for liquid contacting and droplet formation. These microfluidic chips are available in a number of forms including thin layer, quartz, platinum coated, hydrophobic and hydrophilic versions. Y-JUNCTION CHIPS: These are glass microfluidic devices designed for a wide range of applications including liquid-liquid contacting and diffusion studies. These microfluidic devices feature two connected Y-Junctions and two straight channels for observation of microchannel flow. MICROFLUIDIC REACTOR CHIPS: Microreactor chips are compact glass microfluidic devices designed for rapid mixing and reaction of two or three liquid reagent streams. WELLPLATE CHIPS: This is a tool for analytical research and clinical diagnostic laboratories. Wellplate chips are for holding small droplets of reagents or groups of cells in nano-litre wells. MEMBRANE DEVICES: These membrane devices are designed to be used for liquid-liquid separation, contacting or extraction, cross-flow filtration and surface chemistry reactions. These devices benefit from a low dead volume and a disposable membrane. MICROFLUIDIC RESEALABLE CHIPS: Designed for microfluidic chips that can be opened and resealed, the resealable chips enable up to eight fluidic and eight electrical connections and deposition of reagents, sensors or cells onto the channel surface. Some applications are cell culture and analysis, impedance detection and biosensor testing. POROUS MEDIA CHIPS: This is a glass microfluidic device designed for statistical modeling of a complex porous sandstone rock structure. Among the applications of this microfluidic chip are research in earth science & engineering, petrochemical industry, environmental testing, groundwater analysis. CAPILLARY ELECTROPHORESIS CHIP (CE chip): We offer capillary electrophoresis chips with and without integrated electrodes for DNA analysis and separation of biomolecules. Capillary electrophoresis chips are compatible with encapsulates of dimensions 45x15mm. We have CE chips one with classical crossing and one with T-crossing. All needed accessories such as chip holders, connectors are available. Besides microfluidic chips, AGS-TECH offers a wide range of pumps, tubing, microfluidic systems, connectors and accessories. Some off-shelf microfluidic systems are: MICROFLUIDIC DROPLET STARTER SYSTEMS: Syringe-based droplet starter system provides a complete solution for the generation of monodispersed droplets that range from 10 to 250 micron diameter. Operating over wide flow ranges between 0.1 microliters/min to 10 microliters/min, the chemically resistant microfluidics system is ideal for initial concept work and experimentation. The pressure-based droplet starter system on the other hand is a tool for preliminary work in microfluidics. The system provides a complete solution containing all needed pumps, connectors and microfluidic chips enabling the production of highly monodispersed droplets ranging from 10 to 150 microns. Operating over a wide pressure range between 0 to 10 bars, this system is chemically resistant and its modular design makes it easily expandable for future applications. By providing a stable liquid flow, this modular toolkit eliminates dead volume and sample waste to effectively reduce associated reagent costs. This microfluidic system offers the ability to provide a quick liquid changeover. A lockable pressure chamber and an innovative 3-way chamber lid allow simultaneous pumping of up to three liquids. ADVANCED MICROFLUIDIC DROPLET SYSTEM: A modular microfluidic system that enables production of extremely consistent sized droplets, particles, emulsions, and bubbles. The advanced microfluidic droplet system uses flow focusing technology in a microfluidic chip with a pulseless liquid flow to produce monodispersed droplets between nanometers and hundreds of microns size. Well suited for encapsulation of cells, producing beads, controlling nanoparticle formation etc. Droplet size, flow rates, temperatures, mixing junctions, surface properties and order of additions can be quickly varied for process optimization. The microfluidic system contains all the parts required including pumps, flow sensors, chips, connectors and automation components. Accessories are also available, including optical systems, larger reservoirs and reagent kits. Some microfluidics applications for this system are encapsulation of cells, DNA and magnetic beads for research and analysis, drug delivery via polymer particles and drug formulation, precision manufacturing of emulsions and foams for food and cosmetics, production of paints and polymer particles, microfluidics research on droplets, emulsions, bubbles and particles. MICROFLUIDIC SMALL DROPLET SYSTEM: An ideal system for producing and analyzing microemulsions that offer increased stability, a higher interfacial area and the capacity to solubilize both aqueous and oil-soluble compounds. Small droplet microfluidic chips allow the generation of highly monodispersed micro-droplets ranging from 5 to 30 microns. MICROFLUIDIC PARALLEL DROPLET SYSTEM: A high throughput system for the production of up to 30,000 monodispersed microdroplets per second ranging from 20 to 60 microns. The microfluidic parallel droplet system allows users to create stable water-in-oil or oil-in-water droplets facilitating a broad range of applications in drug and food production. MICROFLUIDIC DROPLET COLLECTION SYSTEM: This system is well suited for the generation, collection and analysis of monodispersed emulsions. The microfluidic droplet collection system features the droplet collection module that allows emulsions to be collected without flow disruption or droplet coalescence. The microfluidic droplet size can be accurately adjusted and quickly changed enabling full control over emulsion characteristics. MICROFLUIDIC MICROMIXER SYSTEM: This system is made of a microfluidic device, precision pumping, microfluidic elements and software to obtain excellent mixing. A lamination-based compact micromixer glass microfluidic device allows rapid mixing of two or three fluid streams in each of the two independent mixing geometries. Perfect mixing can be achieved with this microfluidic device at both high and low flow rate ratios. The microfluidic device, and its surrounding components offer excellent chemical stability, high visibility for optics, and good optical transmission. The micromixer system performs exceptionally fast, works in continuous flow mode and can completely mix two or three fluid streams within milliseconds. Some applications of this microfluidic mixing device are reaction kinetics, sample dilution, improved reaction selectivity, rapid crystallization and nanoparticle synthesis, cell activation, enzyme reactions and DNA hybridization. MICROFLUIDIC DROPLET-ON-DEMAND SYSTEM: This is a compact and portable droplet-on-demand microfluidic system to generate droplets of up to 24 different samples and store up to 1000 droplets with sizes down to 25 nanoliters. The microfluidic system offers excellent control of droplet size and frequency as well as allowing the use of multiple reagents to create complex assays quickly and easily. Microfluidic droplets can be stored, thermally cycled, merged or split from nanoliter to picoliter droplets. Some applications are, generation of screening libraries, cell encapsulation, encapsulation of organisms, automation of ELISA tests, preparation of concentration gradients, combinatorial chemistry, cell assays. NANOPARTICLE SYNTHESIS SYSTEM: Nanoparticles are smaller than 100nm and benefit a range of applications such as the synthesis of silicon based fluorescent nanoparticles (quantum dots) to label biomolecules for diagnostic purposes, drug delivery, and cellular imaging. Microfluidics technology is ideal for nanoparticle synthesis. Reducing reagent consumption, it allows tighter particle size distributions, improved control over reaction times and temperatures, as well as better mixing efficiency. MICROFLUIDIC DROPLET MANUFACTURE SYSTEM: High-throughput microfluidic system that facilitates production of up to a tonne of highly monodispersed droplets, particles or emulsion a month. This modular, scalable and highly flexible microfluidic system allows up to 10 modules to be assembled in parallel, enabling identical conditions for up to 70 microfluidic chip droplet junctions. Mass-production of highly monodispersed microfluidic droplets ranging between 20 microns and 150 microns is possible that can be flowed directly off the chips, or into tubes. Applications include particle production - PLGA, gelatine, alginate, polystyrene, agarose, drug delivery in creams, aerosols, bulk precision manufacturing of emulsions and foams in food, cosmetics, paint industries, nanoparticle synthesis, parallel micromixing and micro-reactions. PRESSURE-DRIVEN MICROFLUIDIC FLOW CONTROL SYSTEM: The closed-loop smart flow control provides control of flow rates from nanoliters/min to mililiters/min, at pressures from 10 bar down to vacuum. A flow rate sensor connected in-line between the pump and the microfluidic device facilitates users to enter a flow rate target directly on the pump without the need for a PC. Users will get smoothness of pressure and repeatability of volumetric flow in their microfluidic devices. Systems can be extended to multiple pumps, which will all control flow rate independently. To operate in flow control mode, the flow rate sensor needs to be connected to the pump using either the sensor display or sensor interface. CLICK Product Finder-Locator Service PREVIOUS PAGE

Industrial Servers - Database Server - File Server - Mail Server - Print Server - Web Server - AGS-TECH Inc. - NM - USA Industrial Servers When referring to client-server architecture, a SERVER is a computer program that runs to serve the requests of other programs, also considered as the ''clients''. In other words the ''server'' performs computational tasks on behalf of its ''clients''. The clients may either run on the same computer or be connected through the network. In popular use however, a server is a physical computer dedicated to running as a host one or more of these services and to serve the needs of users of the other computers on the network. A server could be a DATABASE SERVER, FILE SERVER, MAIL SERVER, PRINT SERVER, WEB SERVER, or else depending on the computing service it offers. We offer the best quality industrial server brands available such as ATOP TECHNOLOGIES, KORENIX and JANZ TEC . Click on blue highlighted text below to download respective catalogs and brochures: - ATOP TECHNOLOGIES compact product brochure - ATOP Technologies Product List 2021) - ICP DAS brand industrial communication and networking products brochure - ICP DAS brand Tiny Device Server and Modbus Gateway brochure - JANZ TEC brand compact product brochure - KORENIX brand compact product brochure To choose a suitable Industrial Grade Server, please go to our industrial computer store by CLICKING HERE. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM DATABASE SERVER : This term is used to refer to the back-end system of a database application using client/server architecture. The back-end database server performs tasks such as data analysis, data storage, data manipulation, data archiving, and other non-user specific tasks. FILE SERVER : In the client/server model, this is a computer responsible for the central storage and management of data files so that other computers on the same network can access them. File servers allow users to share information over a network without physically transferring files by floppy disk or other external storage devices. In sophisticated and professional networks, a file server might be a dedicated network-attached storage (NAS) device that also serves as a remote hard disk drive for other computers. Thus anyone on the network can store files on it like to their own hard drive. MAIL SERVER : A mail server, also called an e-mail server is a computer within your network that works as your virtual post office. It consists of a storage area where e-mail is stored for local users, a set of user defined rules determining how the mail server should react to the destination of a specific message, a database of user accounts that the mail server will recognize and deal with locally, and communications modules which handle the transfer of messages to and from other email servers and clients. Mail servers are generally designed to operate with no manual intervention during normal operation. PRINT SERVER : Sometimes called a printer server, this is a device that connects printers to client computers over a network. Print servers accept print jobs from the computers and send the jobs to the appropriate printers. Print server queues jobs locally because work may arrive more quickly than the printer can actually handle it. WEB SERVER : These are computers that deliver and serve Web pages. All Web servers have IP addresses and generally domain names. When we enter the URL of a website in our browser, this sends a request to the Web server whose domain name is the website entered. The server then fetches the page named index.html and sends it to our browser. Any computer can be turned into a Web server by installing server software and connecting the machine to the Internet. There are many Web server software applications such as packages from Microsoft and Netscape. CLICK Product Finder-Locator Service PREVIOUS PAGE

Global Product Finder Locator for Off Shelf Products AGS-TECH, Inc. is your Global Custom Manufacturer, Integrator, Consolidator, Outsourcing Partner. We are your one-stop source for manufacturing, fabrication, engineering, consolidation, outsourcing. If you exactly know the product you are searching, please fill out the table below If filling out the form below is not possible or too difficult, we do accept your request by email also. Simply write us at sales@agstech.net Get a Price Quote on a known brand, model, part number....etc. First name Last name Email Phone Product Name Product Make or Brand Please Enter Manufacturer Part Number if Known Please Enter SKU Code if You Know: Your Application for the Product Quantity Needed Do You have a price target ? If so, please let us know: Give us more details if you want: Condition of Product Needed New Used Does Not Matter If you have any, upload product relevant files by clicking at the below link. Don't worry, the link below will pop up a new window for downloading your files. You will not navigate away from this current window. After uploading your files, close ONLY the Dropbox Window, but not this page. Make sure to fill out all spaces and click the submit button below. CLICK HERE TO UPLOAD FILES Request a Quote Thanks! We’ll send you a price quote shortly. PREVIOUS PAGE We are AGS-TECH Inc., your one-stop source for manufacturing & fabrication & engineering & outsourcing & consolidation. We are the World's most diverse engineering integrator offering you custom manufacturing, subassembly, assembly of products and engineering services.

Wireless Components - Antenna - Radio Frequency Devices - RF Devices - Remote Sensing and Control - High Frequency RF and Wireless Devices Manufacturing & Assembly • Wireless components, devices and assemblies for remote sensing, remote control and communication. We can help you during the design, development, prototyping or mass production of various types of fixed, mobile, and portable two way radios, cellular telephones, GPS units, personal digital assistants (PDAs), smart and remote control equipment and wireless networking devices and instruments. We also have off-shelf wireless components and devices you can select from our brochures below. Antenna Brochure for 5G - LTE 4G - LPWA 3G - 2G - GPS - GNSS - WLAN - BT - Combo - ISM Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) Barcode Scanners (We private label these with your brand name and logo if you wish) High frequency devices product line (Band Pass Filters, Low Pass Filters, IPD, CPL, Balanced Filter, Diplexer, Balun, Chip Antenna...etc.) Microwave Flexible Cable Assembly Microwave and Milimeter Wave Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Precision RF Adapter s Catalog (Coax RF, Microwave, mmWave Adapters such as SMA, SSMA, SMP, BNC, Type-N, 3.5 mm.....etc) Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) RF Components Brochure for Coaxial Fixed Attenuators, Coaxial Terminations, DC Blocks, Coax Adapters, Waveguide Components, Power Dividers, RF Connectors, RF Tools. RF devices and high frequency inductors (Multilayer Ceramic Capacitors, Chip-Resistor, Disc Capacitors, RF & HF Inductor Varistors & SMD-Varistors, Chip Antenna, Filters, Coupler) RF and Microwave Components (Broadband 90/180 Degree Hybrid and Coupler, Broadband Power Divider, Filter, RF switch, Broadband Amplifier, Broadband Frequency Synthesizer) RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) RF Product Overview Chart (RF Antenna, Multilayer Ceramic Filter, Multilayer Ceramic Balun, Ceramic Diplexer) Soft Ferrites - Cores - Toroids - EMI Suppression Products - RFID Transponders and Accessories Brochure Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum components, BNC, SHV adapters and connectors, conductors and contact pins, connector terminals can be found here: Factory Brochure Dowload brochure for our DESIGN PARTNERSHIP PROGRAM We also participate in Third Party Resource Program and are a reseller of products offered by RF Digital ( Website: http://www.rfdigital.com ) , a company that manufactures an extensive line of fully integrated, low cost, high quality, high performance, configurable Wireless RF Transmitter, Receiver & Transceiver Modules, suitable for a wide range of applications. We participate in RF Digital's referral program as a Product Design and Development Company. Contact us to take advantage of our fully integrated, configurable Wireless RF Transmitter, Receiver & Transceiver Modules, High Frequency RF Devices, and most importantly of our consulting services regarding the implementation and application of these wireless components and devices and our engineering integration services. We can make you realize your new product development cycle by assisting you at every phase of the process, from concept to design to prototyping to first article manufacturing to mass production. • Some applications of wireless technology we can help you with are: - Wireless security systems - Remote control of consumer electronic devices or commercial equipment. - Cellular telephony (phones and modems): - WiFi - Wireless energy transfer - Radio communication devices - Short-range point-to-point communication devices such as wireless microphones, remote controls, IrDA, RFID (Radio Frequency Identification), Wireless USB, DSRC (Dedicated Short Range Communications), EnOcean, Near Field Communication, Wireless Sensor Networks : ZigBee, EnOcean; Personal area networks, Bluetooth, Ultra-wideband, wireless computer networks: Wireless Local Area Networks (WLAN), Wireless Metropolitan Area Networks (WMAN)...etc. More information on our engineering and research & development capabilities is available at our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Test Equipment for Furniture Testing, Sofa Durability Tester, Chair Base Static Tester, Chair Drop Impact Tester, Mattress Firmness Tester Test Equipment for Furniture Testing Specialized Test Equipment for Testing of Furniture are used for testing furniture products such as chairs, table, sofas, mattress....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of furniture are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of furniture can be downloaded from the colored links below: HAIDA Bifma Furnitures Testing Machine HAIDA Chair Arm and Leg Tester HAIDA Chair Base Static Tester HAIDA Chair Caster Durability Tester HAIDA Chair Drop Impact Tester HAIDA Chair and Foam Testing Machine HAIDA Chair Seating and Back Durability HAIDA Chair Strength Tester HAIDA Chair Swivel Tester Catalog Download HAIDA Chair Universal Test Machine HAIDA Color Assessment Cabinet HAIDA Foam Pounding Fatigue Tester HAIDA Furniture Universal Test Machine HAIDA Mattress Cornell Tester HAIDA Mattress Firmness Tester HAIDA Mattress Rollator Durability Tester HAIDA Mattress Rollator Durability Tester-2 HAIDA Sofa Durability Tester HD-F769 HAIDA Sofa Durability Tester HD-F761 HAIDA Sofa Iron Frame Fatigue Tester HAIDA Universal Test Field for Tables Chairs For other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

AGS-TECH Inc. is a supplier of equipment to cut, drill and polish materials such as glass, semiconductors, wood, masonry...etc. Contact us for mini lathe, mini milling machine, ultrasonic drill, mini hobbing machine, desktop stamping press, desktop laser cutter, mini waterjet cutter, desktop plasma cutting machine... Equipment for Cutting, Drilling, Polishing Please click on the products of interest below to download related brochures. Equipment we supply to cut, drill and polish are generally tabletop, compact, small and economical, yet efficient, versatile, high return on investment type equipment suitable for prototype manufacturing, research & development and small scale industrial production. Our strength is also in customizing equipment to cut drill and polish. We are capable of building equipment for you which you may not be able to find readily in the market. - Hose-Cut-Off-Skive-Machine (We private label these with your brand name and logo if you wish) - Mini Lathe - Mini Milling Machine - Mini Hobbing Machine - Mini Stamping Press - Mini Laser Cutter - Mini Waterjet Cutter - Mini Plasma Cutter - Power Tools for Every Industry (We private label these with your brand name and logo if you wish) - Servo C-Frame Utility Press (We private label these with your brand name and logo if you wish) - Ultrasonic Drill Since we offer a wide variety of equipment for cutting, dicing, drilling, lapping, polishing, shaping; it is impossible to list them all here. From time to time we introduce also new equipment to the market. We encourage you to email or call us so we can jointly determine which product is the best fit for you. When you contact us, please make sure to inform us about: - Your application - Type and grade of material to be processed - Dimensions of material to be processed - Finish required after processing - Quantity / Number of units to be processed per hour or day. CLICK HERE to download our technical capabilities and reference guide for specialty cutting, drilling, grinding, forming, shaping, polishing tools used in medical, dental, precision instrumentation, metal stamping, die forming and other industrial applications. CLICK Product Finder-Locator Service Click Here to go to Cutting, Drilling, Grinding, Lapping, Polishing, Dicing and Shaping Tools Menu Ref. Code: oicaszhengzhouhongtuo, oicaslzqtool

We have high quality metal cutting & shaping tools such as solid carbide end mills, drills, HSS end mills, HSS step drill bits, HSS countersinks, HSS counterbores, twist drill bits, center drills, saw drills, tool bits, carbide rotary burs and more. Metal Cutting & Shaping Tools Here you will find tools, products and components used in cutting and shaping of metal. Tools for cutting and shaping of wood will be damaged and broken when used on metal. Metal and metal alloys need to be processed using metal cutting & shaping tools otherwise tool life will be severely shortened. Click on the highlighted metal cutting & shaping tools of interest below to download related brochure or catalog. We do have a wide spectrum of metal cutting & shaping tools suitable for almost any application. There is a wide variety of metal cutting & shaping tools with different dimensions, applications and material; it is impossible to present them all here. If you cannot find or if you are not sure which metal cutting and shaping tools will meet your expectations and requirements, email or call us so we can determine which product is the best fit for you. When contacting us, please try to provide us as much detail as possible such as your application, dimensions, material grade if you know, finishing requirements, packaging & labeling requirements and of course quantity of your planned order. Solid Carbide End mills Solid Carbide Drills HSS End mills HSS Step Drill Bits HSS Countersinks HSS Tube & Sheet Drills HSS Counterbores HSS Twist Drills HSS Center Drills HSS Saw Drills HSS Tool bits Carbide Brazed Tool bits Carbide Rotary Burs Taps & Dies Milling Cutters Saw Blades Screw Extractor Steel Files Private Label Abrasives (We can put your company name, logo, brand on these. In other words we offer you private label) Private Label Abrasives Ordering Instructions Guide Private Label Drill Bits (We can private label these drill bits with your company name and logo) Private Label Hand Tools for Every Industry This catalog contains some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tool Accessories This brochure includes some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry This catalog contains some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Taps - Cutting Tools (We can private label these drill bits with your company name and logo) CLICK HERE to download our technical capabilities and reference guide for specialty cutting, drilling, grinding, forming, shaping, polishing tools used in medical, dental, precision instrumentation, metal stamping, die forming and other industrial applications. CLICK Product Finder-Locator Service Click Here to go to Cutting, Drilling, Grinding, Lapping, Polishing, Dicing and Shaping Tools Menu Ref. Code: OICASOSTAR

Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. Microelectronics & Semiconductor Manufacturing and Fabrication Many of our nanomanufacturing, micromanufacturing and mesomanufacturing techniques and processes explained under the other menus can be used for MICROELECTRONICS MANUFACTURING too. However due to the importance of microelectronics in our products, we will concentrate on the subject specific applications of these processes here. Microelectronics related processes are also widely referred to as SEMICONDUCTOR FABRICATION processes. Our semiconductor engineering design and fabrication services include: - FPGA board design, development and programming - Microelectronics foundry services: Design, prototyping and manufacturing, third-party services - Semiconductor wafer preparation: Dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection - Microelectronic package design and fabrication: Both off-shelf and custom design and fabrication - Semiconductor IC assembly & packaging & test: Die, wire and chip bonding, encapsulation, assembly, marking and branding - Lead frames for semiconductor devices: Both off-shelf and custom design and fabrication - Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication - Sensor & actuator design and fabrication: Both off-shelf and custom design and fabrication - Optoelectronic & photonic circuits design and fabrication Let us examine the microelectronics and semiconductor fabrication and test technologies in more detail so you can better understand the services and products we are offering. FPGA Board Design & Development and Programming: Field-programmable gate arrays (FPGAs) are reprogrammable silicon chips. Contrary to processors that you find in personal computers, programming an FPGA rewires the chip itself to implement user’s functionality rather than running a software application. Using prebuilt logic blocks and programmable routing resources, FPGA chips can be configured to implement custom hardware functionality without using a breadboard and soldering iron. Digital computing tasks are carried out in software and compiled down to a configuration file or bitstream that contains information on how the components should be wired together. FPGAs can be used to implement any logical function that an ASIC could perform and are completely reconfigurable and can be given a completely different “personality” by recompiling a different circuit configuration. FPGAs combine the best parts of application-specific integrated circuits (ASICs) and processor-based systems. These benefits include the following: • Faster I/O response times and specialized functionality • Exceeding the computing power of digital signal processors (DSPs) • Rapid prototyping and verification without the fabrication process of custom ASIC • Implementation of custom functionality with the reliability of dedicated deterministic hardware • Field-upgradable eliminating the expense of custom ASIC re-design and maintenance FPGAs provide speed and reliability, without requiring high volumes to justify the large upfront expense of custom ASIC design. Reprogrammable silicon also has the same flexibility of software running on processor-based systems, and it is not limited by the number of processing cores available. Unlike processors, FPGAs are truly parallel in nature, so different processing operations do not have to compete for the same resources. Each independent processing task is assigned to a dedicated section of the chip, and can function autonomously without any influence from other logic blocks. As a result, the performance of one part of the application is not affected when more processing is added on. Some FPGAs have analog features in addition to digital functions. Some common analog features are programmable slew rate and drive strength on each output pin, allowing the engineer to set slow rates on lightly loaded pins that would otherwise ring or couple unacceptably, and to set stronger, faster rates on heavily loaded pins on high-speed channels that would otherwise run too slowly. Another relatively common analog feature is differential comparators on input pins designed to be connected to differential signaling channels. Some mixed signal FPGAs have integrated peripheral analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) with analog signal conditioning blocks that allow them to operate as a system-on-a-chip. Briefly, the top 5 benefits of FPGA chips are: 1. Good Performance 2. Short Time to Market 3. Low Cost 4. High Reliability 5. Long-Term Maintenance Capability Good Performance – With their capability of accommodating parallel processing, FPGAs have better computing power than digital signal processors (DSPs) and do not require sequential execution as DSPs and can accomplish more per clock cycles. Controlling inputs and outputs (I/O) at the hardware level provides faster response times and specialized functionality to closely match application requirements. Short Time to market - FPGAs offer flexibility and rapid prototyping capabilities and thus shorter time-to-market. Our customers can test an idea or concept and verify it in hardware without going through the long and expensive fabrication process of custom ASIC design. We can implement incremental changes and iterate on an FPGA design within hours instead of weeks. Commercial off-the-shelf hardware is also available with different types of I/O already connected to a user-programmable FPGA chip. The growing availability of high-level software tools offer valuable IP cores (prebuilt functions) for advanced control and signal processing. Low Cost—The nonrecurring engineering (NRE) expenses of custom ASIC designs exceed that of FPGA-based hardware solutions. The large initial investment in ASICs can be justified for OEMs producing many chips per year, however many end users need custom hardware functionality for the many systems in development. Our programmable silicon FPGA offers you something with no fabrication costs or long lead times for assembly. System requirements frequently change over time, and the cost of making incremental changes to FPGA designs is negligible when compared to the large expense of respinning an ASIC. High Reliability - Software tools provide the programming environment and FPGA circuitry is a true implementation of program execution. Processor-based systems generally involve multiple layers of abstraction to help task scheduling and share resources among multiple processes. The driver layer controls hardware resources and the OS manages memory and processor bandwidth. For any given processor core, only one instruction can execute at a time, and processor-based systems are continually at risk of time-critical tasks preempting one another. FPGAs, do not use OSs, pose minimum reliability concerns with their true parallel execution and deterministic hardware dedicated to every task. Long-term Maintenance Capability - FPGA chips are field-upgradable and do not require the time and cost involved with redesigning ASIC. Digital communication protocols, for example, have specifications that can change over time, and ASIC-based interfaces may cause maintenance and forward-compatibility challenges. To the contrary, reconfigurable FPGA chips can keep up with potentially necessary future modifications. As products and systems mature, our customers can make functional enhancements without spending time redesigning hardware and modifying the board layouts. Microelectronics Foundry Services: Our microelectronics foundry services include design, prototyping and manufacturing, third-party services. We provide our customers with assistance throughout the entire product development cycle - from design support to prototyping and manufacturing support of semiconductor chips. Our objective in design support services is to enable a first-time right approach for digital, analog, and mixed-signal designs of semiconductor devices. For example, MEMS specific simulation tools are available. Fabs that can handle 6 and 8 inch wafers for integrated CMOS and MEMS are at your service. We offer our clients design support for all major electronic design automation (EDA) platforms, supplying correct models, process design kits (PDK), analog and digital libraries, and design for manufacturing (DFM) support. We offer two prototyping options for all technologies: the Multi Product Wafer (MPW) service, where several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. These are more economical than the full mask set. The MLM service is highly flexible compared to the fixed dates of the MPW service. Companies may prefer outsourcing semiconductor products to a microelectronics foundry for a number of reasons including the need for a second source, using internal resources for other products and services, willingness to go fabless and decrease risk and burden of running a semiconductor fab…etc. AGS-TECH offers open-platform microelectronics fabrication processes that can be scaled down for small wafer runs as well as mass manufacturing. Under certain circumstances, your existing microelectronics or MEMS fabrication tools or complete tool sets can be transferred as consigned tools or sold tools from your fab into our fab site, or your existing microelectronics and MEMS products can be redesigned using open platform process technologies and ported to a process available at our fab. This is faster and more economical than a custom technology transfer. If desired however customer’s existing microelectronics / MEMS fabrication processes may be transferred. Semiconductor Wafer Preparation: If desired by customers after wafers are microfabricated, we carry out dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection operations on semiconductor wafers. Semiconductor wafer processing involves metrology in between the various processing steps. For example, thin film test methods based on ellipsometry or reflectometry, are used to tightly control the thickness of gate oxide, as well as the thickness, refractive index and extinction coefficient of photoresist and other coatings. We use semiconductor wafer test equipment to verify that the wafers haven't been damaged by previous processing steps up until testing. Once the front-end processes have been completed, the semiconductor microelectronic devices are subjected to a variety of electrical tests to determine if they function properly. We refer to the proportion of microelectronics devices on the wafer found to perform properly as the “yield”. Testing of microelectronics chips on the wafer are carried out with an electronic tester that presses tiny probes against the semiconductor chip. The automated machine marks each bad microelectronics chip with a drop of dye. Wafer test data is logged into a central computer database and semiconductor chips are sorted into virtual bins according to predetermined test limits. The resulting binning data can be graphed, or logged, on a wafer map to trace manufacturing defects and mark bad chips. This map can also be used during wafer assembly and packaging. In final testing, microelectronics chips are tested again after packaging, because bond wires may be missing, or analog performance may be altered by the package. After a semiconductor wafer is tested, it is typically reduced in thickness before the wafer is scored and then broken into individual dies. This process is called semiconductor wafer dicing. We use automated pick-and-place machines specially manufactured for microelectronics industry to sort out the good and bad semiconductor dies. Only the good, unmarked semiconductor chips are packaged. Next, in the microelectronics plastic or ceramic packaging process we mount the semiconductor die, connect the die pads to the pins on the package, and seal the die. Tiny gold wires are used to connect the pads to the pins using automated machines. Chip scale package (CSP) is another microelectronics packaging technology. A plastic dual in-line package (DIP), like most packages, is multiple times larger than the actual semiconductor die placed inside, whereas CSP chips are nearly the size of the microelectronics die; and a CSP can be constructed for each die before the semiconductor wafer is diced. The packaged microelectronics chips are re-tested to make sure that they are not damaged during packaging and that the die-to-pin interconnect process was completed correctly. Using lasers we then etch the chip names and numbers on the package. Microelectronic Package Design and Fabrication: We offer both off-shelf and custom design and fabrication of microelectronic packages. As part of this service, modeling and simulation of microelectronic packages is also carried out. Modeling and simulation ensures virtual Design of Experiments (DoE) to achieve the optimal solution, rather than testing packages on the field. This reduces the cost and production time, especially for new product development in microelectronics. This work also gives us the opportunity to explain our customers how the assembly, reliability and testing will impact their microelectronic products. The primary objective of microelectronic packaging is to design an electronic system that will satisfy the requirements for a particular application at a reasonable cost. Because of the many options available to interconnect and house a microelectronics system, the choice of a packaging technology for a given application needs expert evaluation. Selection criteria for microelectronics packages may include some of the following technology drivers: -Wireability -Yield -Cost -Heat dissipation properties -Electromagnetic shielding performance -Mechanical toughness -Reliability These design considerations for microelectronics packages affect speed, functionality, junction temperatures, volume, weight and more. The primary goal is to select the most cost-effective yet reliable interconnection technology. We use sophisticated analysis methods and software to design microelectronics packages. Microelectronics packaging deals with the design of methods for the fabrication of interconnected miniature electronic systems and the reliability of those systems. Specifically, microelectronics packaging involves routing of signals while maintaining signal integrity, distributing ground and power to semiconductor integrated circuits, dispersing dissipated heat while maintaining structural and material integrity, and protecting the circuit from environmental hazards. Generally, methods for packaging microelectronics ICs involve the use of a PWB with connectors that provide the real-world I/Os to an electronic circuit. Traditional microelectronics packaging approaches involve the use of single packages. The main advantage of a single-chip package is the ability to fully test the microelectronics IC before interconnecting it to the underlying substrate. Such packaged semiconductor devices are either through-hole mounted or surface mounted to the PWB. Surface-mounted microelectronics packages do not require via holes to go through the entire board. Instead, surface-mounted microelectronics components can be soldered to both sides of the PWB, enabling higher circuit density. This approach is called surface-mount technology (SMT). The addition of area-array–style packages such as ball-grid arrays (BGAs) and chip-scale packages (CSPs) is making SMT competitive with the highest-density semiconductor microelectronics packaging technologies. A newer packaging technology involves the attachment of more than one semiconductor device onto a high-density interconnection substrate, which is then mounted in a large package, providing both I/O pins and environmental protection. This multichip module (MCM) technology is further characterized by the substrate technologies used to interconnect the attached ICs. MCM-D represents deposited thin film metal and dielectric multilayers. MCM-D substrates have the highest wiring densities of all MCM technologies thanks to the sophisticated semiconductor processing technologies. MCM-C refers to multilayered “ceramic” substrates, fired from stacked alternating layers of screened metal inks and unfired ceramic sheets. Using MCM-C we obtain a moderately dense wiring capacity. MCM-L refers to multilayer substrates made from stacked, metallized PWB “laminates,” that are individually patterned and then laminated. It used to be a low-density interconnect technology, however now MCM-L is quickly approaching the density of MCM-C and MCM-D microelectronics packaging technologies. Direct chip attach (DCA) or chip-on-board (COB) microelectronics packaging technology involves mounting the microelectronics ICs directly to the PWB. A plastic encapsulant, which is “globbed” over the bare IC and then cured, provides environmental protection. Microelectronics ICs can be interconnected to the substrate using either flip-chip, or wire bonding methods. DCA technology is particularly economical for systems that are limited to 10 or fewer semiconductor ICs, since larger numbers of chips can affect system yield and DCA assemblies can be difficult to rework. An advantage common to both the DCA and MCM packaging options is the elimination of the semiconductor IC package interconnection level, which allows closer proximity (shorter signal transmission delays) and reduced lead inductance. The primary disadvantage with both methods is the difficulty in purchasing fully tested microelectronics ICs. Other disadvantages of DCA and MCM-L technologies include poor thermal management thanks to the low thermal conductivity of PWB laminates and a poor coefficient of thermal expansion match between the semiconductor die and the substrate. Solving the thermal expansion mismatch problem requires an interposer substrate such as molybdenum for wire bonded die and an underfill epoxy for flip-chip die. The multichip carrier module (MCCM) combines all the positive aspects of DCA with MCM technology. The MCCM is simply a small MCM on a thin metal carrier that can be bonded or mechanically attached to a PWB. The metal bottom acts as both a heat dissipater and a stress interposer for the MCM substrate. The MCCM has peripheral leads for wire bonding, soldering, or tab bonding to a PWB. Bare semiconductor ICs are protected using a glob-top material. When you contact us, we will discuss your application and requirements to choose the best microelectronics packaging option for you. Semiconductor IC Assembly & Packaging & Test: As part of our microelectronics fabrication services we offer die, wire and chip bonding, encapsulation, assembly, marking and branding, testing. For a semiconductor chip or integrated microelectronics circuit to function, it needs to be connected to the system that it will control or provide instructions to. Microelectronics IC assembly does provide the connections for power and information transfer between the chip and the system. This is accomplished by connecting the microelectronics chip to a package or directly connecting it to the PCB for these functions. Connections between the chip and the package or printed circuit board (PCB) are via wire bonding, thru-hole or flip chip assembly. We are an industry leader in finding microelectronics IC packaging solutions to meet the complex requirements of the wireless and internet markets. We offer thousands of different package formats and sizes, ranging from traditional leadframe microelectronics IC packages for thru-hole and surface mount, to the latest chip scale (CSP) and ball grid array (BGA) solutions required in high pin count and high density applications. A wide variety of packages are available from stock including CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, PLCC, PoP - Package on Package, PoP TMV - Through Mold Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Wafer Level Package)…..etc. Wire bonding using copper, silver or gold are among the popular in microelectronics. Copper (Cu) wire has been a method of connecting silicon semiconductor dies to the microelectronics package terminals. With recent increase in gold (Au) wire cost, copper (Cu) wire is an attractive way to manage overall package cost in microelectronics. It also resembles gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are almost the same for gold (Au) and copper (Cu) wire with copper (Cu) wire having lower resistivity. In microelectronics applications where resistance due to bond wire can negatively impact circuit performance, using copper (Cu) wire can offer improvement. Copper, Palladium Coated Copper (PCC) and Silver (Ag) alloy wires have emerged as alternatives to gold bond wires due to cost. Copper-based wires are inexpensive and have low electrical resistivity. However, the hardness of copper makes it difficult to use in many applications such as those with fragile bond pad structures. For these applications, Ag-Alloy offers properties similar to those of gold while its cost is similar to that of PCC. Ag-Alloy wire is softer than PCC resulting in lower Al-Splash and lower risk of bond pad damage. Ag-Alloy wire is the best low cost replacement for applications that need die-to-die bonding, waterfall bonding, ultra-fine bond pad pitch and small bond pad openings, ultra low loop height. We provide a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and complete end-of-line services. We test a variety of semiconductor device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various combinations such as ASIC, multi chip modules, System-in-Package (SiP), and stacked 3D packaging, sensors and MEMS devices such as accelerometers and pressure sensors. Our test hardware and contacting equipment are suitable for custom package size SiP, dual-sided contacting solutions for Package on Package (PoP), TMV PoP, FusionQuad sockets, multiple-row MicroLeadFrame, Fine-Pitch Copper Pillar. Test equipment and test floors are integrated with CIM / CAM tools, yield analysis and performance monitoring to deliver very high efficiency yield the first time. We offer numerous adaptive microelectronics test processes for our customers and offer distributed test flows for SiP and other complex assembly flows. AGS-TECH provides a full range of test consultation, development and engineering services across your entire semiconductor and microelectronics product lifecycle. We understand the unique markets and testing requirements for SiP, automotive, networking, gaming, graphics, computing, RF / wireless. Semiconductor manufacturing processes require fast and precisely controlled marking solutions. Marking speeds over 1000 characters/second and material penetration depths less than 25 microns are common in semiconductor microelectronics industry using advanced lasers. We are capable of marking mold compounds, wafers, ceramics and more with minimal heat input and perfect repeatability. We use lasers with high accuracy to mark even the smallest parts without damage. Lead frames for Semiconductor Devices: Both off-shelf and custom design and fabrication are possible. Lead frames are utilized in the semiconductor device assembly processes, and are essentially thin layers of metal that connect the wiring from tiny electrical terminals on the semiconductor microelectronics surface to the large-scale circuitry on electrical devices and PCBs. Lead frames are used in almost all semiconductor microelectronics packages. Most microelectronics IC packages are made by placing the semiconductor silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and subsequently covering the microelectronics chip with plastic cover. This simple and relatively low cost microelectronics packaging is still the best solution for many applications. Lead frames are produced in long strips, which allows them to be quickly processed on automated assembly machines, and generally two manufacturing processes are used: photo etching of some sort and stamping. In microelectronics lead frame design often demand is for customized specifications and features, designs that enhance electrical and thermal properties, and specific cycle time requirements. We have in-depth experience of microelectronics lead frame manufacturing for an array of different customers using laser assisted photo etching and stamping. Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication. With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. The consistency in performance and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a semiconductor microelectronics component may be achieved by effectively controlling the device operating temperature within the limits set by the designers. Heat sinks are devices that enhance heat dissipation from a hot surface, usually the outer case of a heat generating component, to a cooler ambient such as air. For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation. A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant. This allows more heat to be dissipated and/or lowers the semiconductor device operating temperature. The primary purpose of a heat sink is to maintain the microelectronics device temperature below the maximum allowable temperature specified by the semiconductor device manufacturer. We can classify heat sinks in terms of manufacturing methods and their shapes. The most common types of air-cooled heat sinks include: - Stampings: Copper or aluminum sheet metals are stamped into desired shapes. they are used in traditional air cooling of electronic components and offer an economical solution to low density thermal problems. They are suitable for high volume production. - Extrusion: These heat sinks allow the formation of elaborate two-dimensional shapes capable of dissipating large heat loads. They may be cut, machined, and options added. A cross-cutting will produce omnidirectional, rectangular pin fin heat sinks, and incorporating serrated fins improves the performance by approximately 10 to 20%, but with a slower extrusion rate. Extrusion limits, such as the fin height-to-gap fin thickness, usually dictate the flexibility in design options. Typical fin height-to-gap aspect ratio of up to 6 and a minimum fin thickness of 1.3mm, are attainable with standard extrusion techniques. A 10 to 1 aspect ratio and a fin thickness of 0.8″can be obtained with special die design features. However, as the aspect ratio increases, the extrusion tolerance is compromised. - Bonded/Fabricated Fins: Most air cooled heat sinks are convection limited, and the overall thermal performance of an air cooled heat sink can often be improved significantly if more surface area can be exposed to the air stream. These high performance heat sinks utilize thermally conductive aluminum-filled epoxy to bond planar fins onto a grooved extrusion base plate. This process allows for a much greater fin height-to-gap aspect ratio of 20 to 40, significantly increasing the cooling capacity without increasing the need for volume. - Castings: Sand, lost wax and die casting processes for aluminum or copper / bronze are available with or without vacuum assistance. We use this technology for fabrication of high density pin fin heat sinks which provide maximum performance when using impingement cooling. - Folded Fins: Corrugated sheet metal from aluminum or copper increases surface area and the volumetric performance. The heat sink is then attached to either a base plate or directly to the heating surface via epoxy or brazing. It is not suitable for high profile heat sinks on account of the availability and fin efficiency. Hence, it allows high performance heat sinks to be fabricated. In selecting an appropriate heat sink meeting the required thermal criteria for your microelectronics applications, we need to examine various parameters that affect not only the heat sink performance itself, but also the overall performance of the system. The choice of a particular type of heat sink in microelectronics depends largely to the thermal budget allowed for the heat sink and external conditions surrounding the heat sink. There is never a single value of thermal resistance assigned to a given heat sink, since the thermal resistance varies with external cooling conditions. Sensor & Actuator Design and Fabrication: Both off-shelf and custom design and fabrication are available. We offer solutions with ready-to-use processes for inertial sensors, pressure and relative pressure sensors and IR temperature sensor devices. By using our IP blocks for accelerometers, IR and pressure sensors or applying your design according to available specifications and design rules, we can have MEMS based sensor devices delivered to you within weeks. Besides MEMS, other types of sensor and actuator structures can be fabricated. Optoelectronic & photonic circuits design and fabrication: A photonic or optical integrated circuit (PIC) is a device that integrates multiple photonic functions. It can be resembled to electronic integrated circuits in microelectronics. The major difference between the two is that a photonic integrated circuit provides functionality for information signals imposed on optical wavelengths in the visible spectrum or near infrared 850 nm-1650 nm. Fabrication techniques are similar to those used in microelectronics integrated circuits where photolithography is used to pattern wafers for etching and material deposition. Unlike semiconductor microelectronics where the primary device is the transistor, there is no single dominant device in optoelectronics. Photonic chips include low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and fabrication techniques and therefore it is difficult to realize all of them on a single chip. Our applications of photonic integrated circuits are mainly in the areas of fiber-optic communication, biomedical and photonic computing. Some example optoelectronic products we can design and fabricate for you are LEDs (Light Emitting Diodes), diode lasers, optoelectronic receivers, photodiodes, laser distance modules, customized laser modules and more. CLICK Product Finder-Locator Service PREVIOUS PAGE