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Electromagnetic Components Manufacturing and Assembly, Selenoid, Electromagnet, Transformer, Electric Motor, Generator, Meters, Indicators, Scales,Electric Fans Solenoids and Electromagnetic Components & Assemblies As a custom manufacturer and engineering integrator, AGS-TECH can provide you the following ELECTROMAGNETIC COMPONENTS AND ASSEMBLIES: • Selenoid, electromagnet, transformer, electric motor and generator assemblies • Electromagnetic meters, indicators, scales specifically manufactured to suit your measuring device. • Electromagnetic sensor and actuator assemblies • Electric fans and coolers of various size for electronic devices and industrial applications • Other complex electromagnetic systems assembly Click here to download brochure of our Panel Meters - OICASCHINT Soft Ferrites - Cores - Toroids - EMI Suppression Products - RFID Transponders and Accessories Brochure Dowload brochure for our DESIGN PARTNERSHIP PROGRAM If you are mostly interested in our engineering and research & development capabilities instead of manufacturing capabilities, then we invite you to visit our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Micromanufacturing - Surface & Bulk Micromachining - Microscale Manufacturing - MEMS - Accelerometers - AGS-TECH Inc. Microscale Manufacturing / Micromanufacturing / Micromachining / MEMS MICROMANUFACTURING, MICROSCALE MANUFACTURING, MICROFABRICATION or MICROMACHINING refers to our processes suitable for making tiny devices and products in the micron or microns of dimensions. Sometimes the overall dimensions of a micromanufactured product may be larger, but we still use this term to refer to the principles and processes that are involved. We use the micromanufacturing approach to make the following types of devices: Microelectronic Devices: Typical examples are semiconductor chips that function based on electrical & electronic principles. Micromechanical Devices: These are products that are purely mechanical in nature such as very small gears and hinges. Microelectromechanical Devices: We use micromanufacturing techniques to combine mechanical, electrical and electronic elements at very small length scales. Most of our sensors are in this category. Microelectromechanical Systems (MEMS): These microelectromechanical devices also incorporate an integrated electrical system in one product. Our popular commercial products in this category are MEMS accelerometers, air-bag sensors and digital micromirror devices. Depending on the product to be fabricated, we deploy one of the following major micromanufacturing methods: BULK MICROMACHINING: This is a relatively older method which uses orientation-dependent etches on single-crystal silicon. The bulk micromachining approach is based on etching down into a surface, and stopping on certain crystal faces, doped regions, and etchable films to form the required structure. Typical products we are capable of micromanufacturing using bulk micromachining technique are: - Tiny cantilevers - V-groves in silicon for alignment and fixation of optical fibers. SURFACE MICROMACHINING: Unfortunately bulk micromachining is restricted to single-crystal materials, since polycrystalline materials will not machine at different rates in different directions using wet etchants. Therefore surface micromachining stands out as an alternative to bulk micromachining. A spacer or sacrificial layer such as phosphosilicate glass is deposited using CVD process onto a silicon substrate. Generally speaking, structural thin film layers of polysilicon, metal, metal alloys, dielectrics are deposited onto the spacer layer. Using dry etching techniques, the structural thin film layers are patterned and wet etching is used to remove the sacrificial layer, thereby resulting in free-standing structures such as cantilevers. Also possible is using combinations of bulk and surface micromachining techniques for turning some designs into products. Typical products suitable for micromanufacturing using a combination of the above two techniques: - Submilimetric size microlamps (in the order of 0.1 mm size) - Pressure sensors - Micropumps - Micromotors - Actuators - Micro-fluid-flow devices Sometimes, in order to obtain high vertical structures, micromanufacturing is performed on large flat structures horizontally and then the structures are rotated or folded into an upright position using techniques such as centrifuging or microassembly with probes. Yet very tall structures can be obtained in single crystal silicon using silicon fusion bonding and deep reactive ion etching. Deep Reactive Ion Etching (DRIE) micromanufacturing process is carried out on two separate wafers, then aligned and fusion bonded to produce very tall structures that would otherwise be impossible. LIGA MICROMANUFACTURING PROCESSES: The LIGA process combines X-ray lithography, electrodeposition, molding and generally involves the following steps: 1. A few hundreds of microns thick polymethylmetacrylate (PMMA) resist layer is deposited onto the primary substrate. 2. The PMMA is developed using collimated X-rays. 3. Metal is electrodeposited onto the primary substrate. 4. PMMA is stripped and a freestanding metal structure remains. 5. We use the remaining metal structure as a mould and perform injection molding of plastics. If you analyze the basic five steps above, using the LIGA micromanufacturing / micromachining techniques we can obtain: - Freestanding metal structures - Injection molded plastic structures - Using injection molded structure as a blank we can investment cast metal parts or slip-cast ceramic parts. The LIGA micromanufacturing / micromachining processes are time consuming and expensive. However LIGA micromachining produces these submicron precision molds which can be used to replicate the desired structures with distinct advantages. LIGA micromanufacturing can be used for example to fabricate very strong miniature magnets from rare-earth powders. The rare-earth powders are mixed with an epoxy binder and pressed to the PMMA mold, cured under high pressure, magnetized under strong magnetic fields and finally the PMMA is dissolved leaving behind the tiny strong rare-earth magnets which are one of the wonders of micromanufacturing / micromachining. We are also capable to develop multilevel MEMS micromanufacturing / micromachining techniques through wafer-scale diffusion bonding. Basically we can have overhanging geometries within MEMS devices, using a batch diffusion bonding and release procedure. For example we prepare two PMMA patterned and electroformed layers with the PMMA subsequently released. Next, the wafers are aligned face to face with guide pins and press fit together in a hot press. The sacrificial layer on one of the substrates is etched away which results in one of the layers bonded to the other. Other non-LIGA based micromanufacturing techniques are also available to us for the fabrication of various complex multilayer structures. SOLID FREEFORM MICROFABRICATION PROCESSES: Additive micromanufacturing is used for rapid prototyping. Complex 3D structures can be obtained by this micromachining method and no material removal takes place. Microstereolithography process uses liquid thermosetting polymers, photoinitiator and a highly focused laser source to a diameter as small as 1 micron and layer thicknesses of about 10 microns. This micromanufacturing technique is however limited to production of nonconducting polymer structures. Another micromanufacturing method, namely “instant masking” or also known as “electrochemical fabrication” or EFAB involves the production of an elastomeric mask using photolithography. The mask is then pressed against the substrate in an electrodeposition bath so that the elastomer conforms to substrate and excludes plating solution in contact areas. Areas that are not masked are electrodeposited as the mirror image of the mask. Using a sacrificial filler, complex 3D shapes are microfabricated. This “instant masking” micromanufacturing / micromachining method makes it also possible to produce overhangs, arches…etc. CLICK Product Finder-Locator Service PREVIOUS PAGE

Microwave Components - Subassembly - Microwave Circuits - RF Transformer - LNA - Mixer - Fixed Attenuator - AGS-TECH Microwave Components and Systems Manufacturing & Assembly We manufacture and supply: Microwave electronics including silicon microwave diodes, dot touch diodes, schottky diodes, PIN diodes, varactor diodes, step recovery diodes, microwave integrated circuits, splitters/combiners, mixers, directional couplers, detectors, I/Q modulators, filters, fixed attenuators, RF transformers, simulation phase shifters, LNA, PA, switches, attenuators, and limiters. We also custom manufacture microwave subassemblies and assemblies according to users' requirements. Please download our microwave components and systems brochures from the links below: Antenna Brochure for 5G - LTE 4G - LPWA 3G - 2G - GPS - GNSS - WLAN - BT - Combo - ISM Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) Barcode Scanners (We private label these with your brand name and logo if you wish) Microwave Flexible Cable Assembly Microwave and Milimeter Wave Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Microwave Waveguides - Coaxial Components - Milimeterwave Antennas (Straight Waveguide, Waveguide Bend, Waveguide to Coaxial Adapter, Directional Couplers, Waveguide Tee, Circulators, Isolators......etc.) Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) RF and Microwave Components (Broadband 90/180 Degree Hybrid and Coupler, Broadband Power Divider, Filter, RF switch, Broadband Amplifier, Broadband Frequency Synthesizer) RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) Soft Ferrites - Cores - Toroids - EMI Suppression Products - RFID Transponders and Accessories Brochure Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Microwaves are electromagnetic waves with wavelengths ranging from 1 mm to 1 m, or frequencies between 0.3 GHz and 300 GHz.The microwave range includes ultra-high frequency (UHF) (0.3–3 GHz), super high frequency (SHF) (3–30 GHz), and extremely high frequency (EHF) (30–300 GHz) signals. Uses of microwave technology: COMMUNICATION SYSTEMS: Before the invention of fiber optic transmission technology, most long distance telephone calls were carried via microwave point-to-point links through sites like the AT&T Long Lines. Starting in the early 1950s, frequency division multiplexing was used to send up to 5,400 telephone channels on each microwave radio channel, with as many as ten radio channels combined into one antenna for the hop to the next site, that was up to 70 km away. Wireless LAN protocols, such as Bluetooth and the IEEE 802.11 specifications, also use microwaves in the 2.4 GHz ISM band, although 802.11a uses ISM band and U-NII frequencies in the 5 GHz range. Licensed long-range (up to about 25 km) Wireless Internet Access services can be found in many countries in the 3.5–4.0 GHz range (not in the USA however). Metropolitan Area Networks: MAN protocols, such as WiMAX (Worldwide Interoperability for Microwave Access) based in the IEEE 802.16 specification. The IEEE 802.16 specification was designed to operate between 2 to 11 GHz frequencies. The commercial implementations are in the 2.3GHz, 2.5 GHz, 3.5 GHz and 5.8 GHz frequency ranges. Wide Area Mobile Broadband Wireless Access: MBWA protocols based on standards specifications such as IEEE 802.20 or ATIS/ANSI HC-SDMA (e.g. iBurst) are designed to operate between 1.6 and 2.3 GHz to give mobility and in-building penetration characteristics similar to mobile phones but with much much greater spectral efficiency. Some of the lower microwave frequency spectrum is used on Cable TV and Internet access on coaxial cable as well as broadcast television. Also some mobile phone networks, like GSM, also use lower microwave frequencies. Microwave radio is used in broadcasting and telecommunication transmissions because, due to their short wavelength, highly directive antennas are smaller and therefore more practical than they would be at lower frequencies (longer wavelengths). There is also more bandwidth in the microwave spectrum than in the rest of the radio spectrum; the usable bandwidth below 300 MHz is less than 300 MHz while many GHz can be used above 300 MHz. Typically, microwaves are used in television news to transmit a signal from a remote location to a television station in a specially equipped van. The C, X, Ka, or Ku Bands of the microwave spectrum are used in the operation of most satellite communications systems. These frequencies allow large bandwidth while avoiding the crowded UHF frequencies and staying below the atmospheric absorption of EHF frequencies. Satellite TV either operates in the C band for the traditional large dish Fixed Satellite Service or Ku band for Direct Broadcast Satellite. Military communication systems run primarily over X or Ku Band links, with Ka band being used for Milstar. REMOTE SENSING: Radars use microwave frequency radiation to detect the range, speed, and other characteristics of remote objects. Radars are widely used for applications including air traffic control, navigation of ships, and traffic speed limit control. Besides ultrasonic decices, sometimes Gunn diode oscillators and waveguides are used as motion detectors for automatic door openers. Much of radio astronomy uses microwave technology. NAVIGATION SYSTEMS: Global Navigation Satellite Systems (GNSS) including the American Global Positioning System (GPS), the Chinese Beidou and the Russian GLONASS broadcast navigational signals in various bands between about 1.2 GHz and 1.6 GHz. POWER: A microwave oven passes (non-ionizing) microwave radiation (at a frequency near 2.45 GHz) through food, causing dielectric heating by absorption of energy in the water, fats and sugar contained in the food. Microwave ovens became common following development of inexpensive cavity magnetrons. Microwave heating is widely used in industrial processes for drying and curing products. Many semiconductor processing techniques use microwaves to generate plasma for purposes such as reactive ion etching (RIE) and plasma-enhanced chemical vapor deposition (PECVD). Microwaves can be used to transmit power over long distances. NASA worked in the 1970s and early 1980s to research the possibilities of using Solar Power Satellite (SPS) systems with large solar arrays that would beam power down to the Earth's surface via microwaves. Some light weaponry uses millimeter waves to heat a thin layer of human skin to an intolerable temperature to make the targeted person move away. A two-second burst of the 95 GHz focused beam heats the skin to a temperature of 130 °F (54 °C) at a depth of 1/64th of an inch (0.4 mm). The United States Air Force and Marines use this type of Active Denial System. If your interest is in engineering and research & development, please visit our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Plastic and Rubber Parts, Mold Making, Injection Molding, Thermoforming, Blow Mould, Vacuum Forming, Thermoset Mold, Polymer Components, at AGS-TECH Inc. Plastic & Rubber Molds and Molding We custom manufacture plastic and rubber moulds and moulded parts using injection moulding, transfer molding, thermoforming, compression moulding, thermoset moulding, vacuum forming, blow moulding, rotational moulding, insert moulding, pour moulding, metal to rubber and metal to plastic bonding, ultrasonic welding, secondary manufacturing & fabrication processes. We recommend that you click here to DOWNLOAD our Schematic Illustrations of Plastic and Rubber Molding Processes by AGS-TECH Inc. This will help you better understand the information we are providing you below. • INJECTION MOULDING : A thermoset compound is fed and injected with a high speed reciprocating screw or plunger system. Injection molding can produce small to medium sized parts in high volume economically, tight tolerances, consistency between parts and good strength can be achieved. This technique is the most common plastic products manufacturing method of AGS-TECH Inc. Our standard moulds have cycle times in the order of 500,000 times and are made of P20 tool steel. With larger injection moulds and deeper cavities consistency and hardness throughout the material becomes even more important, therefore we only use certified highest quality tool steel from major suppliers with strong traceability and quality assurance systems. Not all P20 tool steels are the same. Their quality can vary from supplier to supplier and from country to country. Therefore for even our injection moulds manufactured in China we use tool steel imported from US, Germany and Japan. We have accumulated the know-how of using modified P20 steel chemistries for injection moulding of products with surfaces requiring very tight tolerance mirror finishes. This makes us capable of manufacturing even optical lens moulds. Another type of challenging surface finish is textured surfaces. These necessitate consistent hardness across the surface. Therefore any inhomogeneity in the steel can result in less than perfect surface textures. For this reason some of our steel used for such moulds incorporates special alloying elements and is cast using advanced metallurgical techniques. Miniature plastic parts and gears are components that require know how on suitable plastic materials and processes which we have gained over the years. We manufacture tiny precision plastic components with tight tolerances for a company making micromotors. Not every plastic moulding company is capable of producing such tiny accurate parts, because it requires know-how which is acquired only through years of research and development experience. We offer the various types of this molding technique, including gas assisted injection molding. • INSERT MOULDING : Inserts can either be incorporated at the time of the molding process, or be inserted after the molding process. When incorporated as part of the molding process, the inserts can be loaded by robots or by the operator. If the inserts are incorporated after the molding operation, they can usually be applied any time after the molding process. A common insert moulding process is the process of molding plastic around preformed metal inserts. For example, electronic connectors do have metal pins or components enclosed by the sealing plastic material. We have acquired years of experience keeping the cycle time constant from shot to shot even in post moulding insertion, because variations in cycle time between shots will result in poor quality. • THERMOSET MOLDING : This technique is characterized by the requirement of heating the mold versus cooling for thermoplastic. Parts manufactured by thermoset molding are ideal for applications requiring high mechanical strength, widely usable temperature range and unique dielectric properties. Thermosetting plastics can be molded in any of the three molding processes: Compression, Injection or Transfer molding. The delivery method of the material into the mold cavities distinguishes these three techniques. For all three processes, a mold constructed of mild or hardened tool steel is heated. The mold is chrome plated to reduce wear on the mold and improve part release. Parts are ejected with hydraulically actuated ejector pins and air poppets. Part removal can either be manual or automatic. Thermoset moulded components for electrical applications require stability against flow and melt at elevated temperatures. As everyone knows, electrical and electronic components warm up during operation and only suitable plastic materials can be used for safety and long term operation. We are experienced in CE and UL qualifications of plastic components for the electronic industry. • TRANSFER MOLDING : A measured amount of molding material is preheated and inserted into a chamber known as the transfer pot. A mechanism known as the plunger forces the material from the pot through the channels known as sprue and runner system into mold cavities. While material is inserted the mold remains closed and is only opened when it is time to release the produced part. Keeping the mold walls at a higher than melting temperature of the plastic material assures fast flow of material through the cavities. We use this technique for frequently for: - Encapsulation purposes where complex metallic inserts are molded into the part - Small to medium sized parts at reasonably high volume - When parts with tight tolerances are needed and low shrinkage materials are necessary - Consistency is needed because the transfer molding technique allows consistent material delivery • THERMOFORMING : This is a generic term used to describe a group of processes to produce plastic parts from flat sheets of plastic under temperature and pressure. In this technique plastic sheets are heated and formed over a male or female mold. After forming they are trimmed to create a usable product. The trimmed material is reground and recycled. Basically there are two types of thermoforming processes, namely vacuum forming and pressure forming (which are explained below). Engineering and tooling costs are low and turnaround times are short. Therefore this method is well suited for prototyping and low volume production. Some thermoform plastic materials are ABS, HIPS, HDPE, HMWPE, PP, PVC, PMMA, modified PETG. The process is suitable for large panels, enclosures and housings and is preferable for such products to injection molding due to lower cost and faster tooling manufacture. Thermoforming is best suited for parts with important features mostly confined to one of its sides. However, AGS-TECH Inc. is capable to use the technique together with additional methods such as trimming, fabrication and assembly to manufacture parts that have critical features on both sides. • COMPRESSION MOULDING : Compression molding is a forming process where a plastic material is placed directly into a heated metal mold, where it is softened by the heat and forced to conform to the shape of the mold as the mold closes. Ejector pins in the bottom of the molds quickly eject finished pieces from the mold and the process is finished. Thermoset plastic in either preform or granular pieces is commonly used as the material. Also high-strength fiberglass reinforcements are suitable for this technique. To avoid excess flash, the material is measured prior to molding. The advantages of compression molding are its ability to mold large intricate parts, being one of the lowest cost molding methods compared with other methods such as injection moulding; little material waste. On the other hand, compression molding often provides poor product consistency and relatively difficult control of flash. When compared to injection molding, there are fewer knit lines produced and a smaller amount of fiber length degradation occurs. Compression-molding is also suitable for ultra-large basic shape production in sizes beyond the capacity of extrusion techniques. AGS-TECH uses this technique to manufacture mostly electrical parts, electrical housings, plastic cases, containers, knobs, handles, gears, relatively large flat and moderately curved parts. We possess the know-how of determining the right amount of raw material for cost efficient operation and reduced flash, adjusting to the right amount of energy and time for heating the material, choosing the most suitable heating technique for each project, calculating the required force for optimal shaping of material, optimized mould design for fast cooling after each compression cycle. • VACUUM FORMING (also described as a simplified version of THERMOFORMING) : A plastic sheet is heated until soft and draped over a mold. Vacuum is then applied and the sheet is being sucked into the mold. After the sheet takes the desired shape of the mould, it is cooled off and ejected from the mold. AGS-TECH uses sophisticated pneumatic, heat and hydrolic control to achieve high speeds in production by vacuum forming. Materials suitable for this technique are extruded thermoplastic sheets such as ABS, PETG, PS, PC, PVC, PP, PMMA, acrylic. The method is most suitable for forming plastic parts that are rather shallow in depth. However we also manufacture relatively deep parts by mechanically or pneumatically stretching the formable sheet prior to bringing it into contact with the mold surface and applying vacuum. Typical products molded by this technique are foot trays & containers, enclosures, sandwich boxes, shower trays, plastic pots, automobile dashboards. Because the technique uses low pressures, inexpensive mold materials can be used and molds can be manufactured in short time inexpensively. Low quantity production of large parts is thus a possibility. Depending on quantity of production mould functionality can be enhanced when high volume production is needed. We are professional in determining what quality of mold each project requires. It would be a waste of customer’s money and resources to manufacture an unnecessarily complex mold for a low volume production run. For example products such as enclosures for large sized medical machines for production quantities in the range of 300 to 3000 units/year can be vacuum formed from heavy gauge raw materials instead of manufactured with expensive techniques such as injection moulding or sheet metal forming. • BLOW MOULDING : We use this technique for producing hollow plastic parts (also glass parts). A preform or parison which is a tube-like plastic piece is clamped into a mould and compressed air is blown into it through the hole in one end. As a result the plastic perform / parison is pushed outward and acquires the shape of the mould cavity. After the plastic is cooled and solidified, it is ejected from the mould cavity. There are three types of this technique: -Extrusion blow moulding -Injection blow moulding -Injection stretch blow moulding Common materials used in these processes are PP, PE, PET, PVC. Typical items produced using this technique are plastic bottles, buckets, containers. • ROTATIONAL MOULDING (also called ROTAMOULDING or ROTOMOULDING) is a technique suitable to produce hollow plastic products. In rotational molding heating, melting, shaping and cooling occur after the polymer is put into the mold. No external pressure is applied. Rotamolding is economical for producing large products, mold costs are low, products are stress free, no polymer weld lines, few design constraints to deal with. The rotomolding process begins with charging the mold, in other words a controlled amount of polymer powder is put in the mould, closed and loaded into oven. Inside the oven the second process step is carried out: Heating and Fusion. The mould is rotated around two axes with relatively low speed, heating takes place and the molten polymer powder melts and sticks to the mould walls. Thereafter the third step, the cooling takes place solidifying the polymer inside the mould. Lastly, the unloading step involves opening of the mould and removal of the product. These four process steps are then repeated again and again. Some materials used in rotomoulding are LDPE, PP, EVA, PVC. Typical products produced are large plastic products such as SPA, childrens playground slides, large toys, large containers, rainwater tanks, traffic cones, canoes and kayaks...etc. Since rotationally moulded products are generally of large geometries and costly to ship, an important point to remember in rotational moulding is to consider designs that facilitate stacking of products into each other prior to shipment. We help our clients during their design phase if required. • POUR MOLDING : This method is used when multiple items need to be produced. A hollowed out block is used as a mold and filled by simply pouring the liquid material such as melted thermoplastic or a mixture of resin and hardener into it. By doing this one either produces the parts or another mold. The liquid such as plastic is then left to harden and takes on the shape of the mold cavity. Release agent materials are commonly used to release parts from the mold. Pour molding is also sometimes referred to as Plastic Potting or Urethane Casting. We use this process for inexpensively manufacturing products in the shape of statues, ornaments….etc., products that do not need excellent uniformity or excellent material properties but rather only the shape of an object. We sometimes make silicon molds for prototyping purposes. Some of our low volume projects are processed using this technique. Pour moulding can be used for manufacturing glass, metal and ceramic parts as well. Since the set-up and tooling costs are minimal, we consider this technique whenever low quantity production of multiple items with minimal tolerance requirements is on the table. For high volume production, the pour molding technique is generally not suitable because it is slow and therefore expensive when large quantities need to be manufactured. There are however exceptions where pour moulding can be used for large quantity production, such as pour molding potting compounds to encapsulate electronic and electrical components and assemblies for insulation and protection. • RUBBER MOLDING – CASTING – FABRICATION SERVICES : We custom manufacture rubber components from natural as well as synthetic rubber using some of the above explained processes. We can adjust the hardness and other mechanical properties according to your application. By incorporating other organic or inorganic additives, we can increase the heat stability of your rubber parts such as balls for high temperature cleaning purposes. Various other properties of rubber can be modified as needed and desired. Also be assured that we do not use toxic or hazardous materials for manufacturing toys or other elastomer / elastomeric molded products. We provide Material Safety Data Sheets (MSDS), conformance reports, material certifications and other documents such as ROHS compliance for our materials and products. Additional special tests are carried out at certified government or government approved laboratories if needed. We have been manufacturing automobile mats from rubber, small rubber statues and toys for many years. • SECONDARY MANUFACTURING & FABRICATION PROCESSES : Finally, keep in mind that we also offer a large variety of secondary processes such as chrome coating of plastic products for mirror-type applications or giving plastics the metal-like shiny finish. Ultrasonic welding is another example of a secondary process offered for plastic components. Yet a third example of secondary process on plastics can be surface treatment prior to coating to enhance coating adhesion. Automobile bumpers are well known to benefit from this secondary process. Metal-rubber bonding, metal-plastic bonding are other common processes we are experienced with. When we evaluate your project, we can jointly determine which secondary processes would be the most suitable for your product. Here are some of commonly used plastic products. Since these are off-the-shelf, you can save on mould costs in case any of these fits your requirements. Click here to download our economic 17 Series Hand Held Plastic Enclosures from AGS-Electronics Click here to download our 10 Series Sealed Plastic Enclosures from AGS-Electronics Click here to download our 08 Series Plastic Cases from AGS-Electronics Click here to download our 18 Series Special Plastic Enclosures from AGS-Electronics Click here to download our 24 Series DIN Plastic Enclosures from AGS-Electronics Click here to download our 37 Series Plastic Equipment Cases from AGS-Electronics Click here to download our 15 Series Modular Plastic Enclosures from AGS-Electronics Click here to download our 14 Series PLC Enclosures from AGS-Electronics Click here to download our 31 Series Potting and Power Supply Enclosures from AGS-Electronics Click here to download our 20 Series Wall-Mounting Enclosures from AGS-Electronics Click here to download our 03 Series Plastic and Steel Enclosures from AGS-Electronics Click here to download our 02 Series Plastic and Aluminum Instrument Case Systems II from AGS-Electronics Click here to download our 16 Series DIN rail module enclosures from AGS-Electronics Click here to download our 19 Series Desktop Enclosures from AGS-Electronics Click here to download our 21 Series Card Reader Enclosures from AGS-Electronics CLICK Product Finder-Locator Service BACK to PREVIOUS MENU

Micromanufacturing, Nanomanufacturing, Mesomanufacturing - Electronic & Magnetic Optical & Coatings, Thin Film, Nanotubes, MEMS, Microscale Fabrication Nanoscale & Microscale & Mesoscale Manufacturing Read More Our NANOMANUFACTURING, MICROMANUFACTURING and MESOMANUFACTURING processes can be categorized as: Surface Treatments and Modification Functional Coatings / Decorative Coatings / Thin Film / Thick Film Nanoscale Manufacturing / Nanomanufacturing Microscale Manufacturing / Micromanufacturing / Micromachining Mesoscale Manufacturing / Mesomanufacturing Microelectronics & Semiconductor Manufacturing and Fabrication Microfluidic Devices Manufacturing Micro-Optics Manufacturing Micro Assembly and Packaging Soft Lithography In every smart product designed today, one can consider an element that will increase efficiency, versatility, reduce power consumption, reduce waste, increase lifetime of the product and thus be environmentally friendly. For this purpose, AGS-TECH is focusing on a number of processes and products that can be incorporated into devices and equipment to achieve these goals. For example low-friction FUNCTIONAL COATINGS can reduce power consumption. Some other functional coating examples are scratch resistant coatings, anti-wetting SURFACE TREATMENTS and coatings (hydrophobic), wetness promoting (hydrophilic) surface treatment and coatings, anti-fungal coatings, diamond like carbon coatings for cutting and scribing tools, THIN FILMelectronic coatings, thin film magnetic coatings, multilayer optical coatings. In NANOMANUFACTURING or NANOSCALE MANUFACTURING, we produce parts at nanometer length scales. In practice it refers to manufacturing operations below micrometer scale. Nanomanufacturing is still in its infancy when compared to micromanufacturing, however the trend is in that direction and nanomanufacturing is definitely very important for the near future. Some applications of nanomanufacturing today are carbon nanotubes as reinforcing fibers for composite materials in bicycle frames, baseball bats and tennis racquets. Carbon nanotubes, depending on the orientation of the graphite in the nanotube, can act as semiconductors or conductors. Carbon nanotubes have very high current-carrying capability, 1000 times higher than silver or copper. Another application of nanomanufacturing is nanophase ceramics. By using nanoparticles in producing ceramic materials, we can simultaneously increase both the strength and ductility of the ceramic. Please click on the submenu for more information. MICROSCALE MANUFACTURING or MICROMANUFACTURING refers to our manufacturing and fabrication processes on a microscopic scale not visible to the naked eye. The terms micromanufacturing, microelectronics, microelectromechanical systems are not limited to such small length scales, but instead, suggest a material and manufacturing strategy. In our micromanufacturing operations some popular techniques we use are lithography, wet and dry etching, thin film coating. A wide variety of sensors & actuators, probes, magnetic hard-drive heads, microelectronic chips, MEMS devices such as accelerometers and pressure sensors among others are manufactured using such micromanufacturing methods. You will find more detailed information on these in the submenus. MESOSCALE MANUFACTURING or MESOMANUFACTURING refers to our processes for fabrication of miniature devices such as hearing aids, medical stents, medical valves, mechanical watches and extremely small motors. Mesoscale manufacturing overlaps both macro and micromanufacturing. Miniature lathes, with 1.5 Watt motor and dimensions of 32 x 25 x 30.5 mm and weights of 100 grams have been fabricated using mesoscale manufacturing methods. Using such lathes, brass has been machined to a diameter as small as 60 microns and surface roughnesses in the order of a micron or two. Other such miniature machine tools such as milling machines and presses have also been manufactured using mesomanufacturing. In MICROELECTRONICS MANUFACTURING we use the same techniques as in micromanufacturing. Our most popular substrates are silicon, and others like gallium arsenide, Indium Phosphide and Germanium are also used. Films/coatings of many types and especially conducting and insulating thin film coatings are used in the fabrication of microelectronic devices and circuits. These devices are usually obtained from multilayers. Insulating layers are generally obtained by oxidation such as SiO2. Dopants (both p and n) type are common and parts of the devices are doped in order to alter their electronic properties and obtain p and n type regions. Using lithography such as ultraviolet, deep or extreme ultraviolet photolithography, or X-ray, electron beam lithography we transfer geometric patterns defining the devices from a photomask/mask to the substrate surfaces. These lithography processes are applied several times in the micromanufacturing of microelectronic chips in order to achieve the required structures in the design. Also etching processes are carried out by which entire films or particular sections of films or substrate are removed. Briefly, by using various deposition, etching and multiple lithographic steps we obtain the multilayer structures on the supporting semiconductor substrates. After the wafers are processed and many circuits are microfabricated on them, the repetitive parts are cut and individual dies are obtained. Each die is thereafter wire bonded, packaged and tested and becomes a commercial microelectronic product. Some more details of microelectronics manufacturing can be found in our submenu, however the subject is very extensive and therefore we encourgae you to contact us in case you need product specific information or more details. Our MICROFLUIDICS MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In microfluidics we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. We have the capability to design microfluidic devices for you and offer microfluidics prototyping & micromanufacturing custom tailored for your applications. Another promising field in microfabrication is MICRO-OPTICS MANUFACTURING. Micro-optics allows the manipulation of light and the management of photons with micron and sub-micron scale structures and components. Micro-optics allows us to interface the macroscopic world we live in with the microscopic world of opto- and nano-electronic data processing. Micro-optical components and subsystems find widespread applications in the following fields: Information technology: In micro-displays, micro-projectors, optical data storage, micro-cameras, scanners, printers, copiers…etc. Biomedicine: Minimally-invasive/point of care diagnostics, treatment monitoring, micro-imaging sensors, retinal implants. Lighting: Systems based on LEDs and other efficient light sources Safety and Security Systems: Infrared night vision systems for automotive applications, optical fingerprint sensors, retinal scanners. Optical Communication & Telecommunication: In photonic switches, passive fiber optic components, optical amplifiers, mainframe and personal computer interconnect systems Smart structures: In optical fiber-based sensing systems and much more As the most diverse engineering integration provider we pride ourselves with our capability to provide a solution for almost any consulting, engineering, reverse engineering, rapid prototyping, product development, manufacturing, fabrication and assembly needs. After micromanufacturing our components, very often we need to continue with MICRO ASSEMBLY & PACKAGING. This involves processes such as die attachment, wire bonding, connectorization, hermetic sealing of packages, probing, testing of packaged products for environmental reliability…etc. After micromanufacturing devices on a die, we attach the die to a more rugged foundation to ensure reliability. Frequently we use special epoxy cements or eutectic alloys to bond the die to its package. After the chip or die is bonded to its substrate, we connect it electrically to the package leads using wire bonding. One method is to use very thin gold wires from the package leads to bonding pads located around the perimeter of the die. Lastly we need to do the final packaging of the connected circuit. Depending on the application and operating environment, a variety of standard and custom manufactured packages are available for micromanufactured electronic, electro-optic, and microelectromechanical devices. Another micromanufacturing technique we use is SOFT LITHOGRAPHY, a term used for a number of processes for pattern transfer. A master mold is needed in all cases and is microfabricated using standard lithography methods. Using the master mold, we produce an elastomeric pattern / stamp. One variation of soft lithography is “microcontact printing”. The elastomer stamp is coated with an ink and pressed against a surface. The pattern peaks contact the surface and a thin layer of about 1 monolayer of the ink is transfered. This thin film monolayer acts as the mask for selective wet etching. A second variation is “microtransfer molding”, in which the recesses of the elastomer mold are filled with liquid polymer precursor and pushed against a surface. Once the polymer cures, we peel off the mold, leaving behind the desired pattern. Lastly a third variation is “micromolding in capillaries”, where the elastomer stamp pattern consists of channels that use capillary forces to wick a liquid polymer into the stamp from its side. Basically, a small amount of the liquid polymer is placed adjacent to the capillary channels and the capillary forces pull the liquid into the channels. Excess liquid polymer is removed and polymer inside the channels is allowed to cure. The stamp mold is peeled off and the product is ready. You can find more details about our soft lithography micromanufacturing techniques by clicking on the related submenu on the side of this page. If you are mostly interested in our engineering and research & development capabilities instead of manufacturing capabilities, then we invite you to also visit our engineering website http://www.ags-engineering.com Read More Read More Read More Read More Read More Read More Read More Read More Read More CLICK Product Finder-Locator Service PREVIOUS PAGE

Test Equipment for Testing Paper & Packaging Products, Adhesive Tape Peel Test Machine, Carton Compressive Tester, Foam Compression Hardness Tester, Zero Drop Test Machine, Package Incline Impact Tester Test Equipment for Testing Paper & Packaging Products Specialized Test Equipment for Testing of Paper & Packaging Products are used for testing paper & packaging products such as cardboard boxes, carton materials, foam and cushioning materials and other types of packages....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for PAPER & PACKAGING TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for PAPER & PACKAGING TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of Paper & Packaging Products are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of Paper & Packaging Products can be downloaded from the colored links below: HAIDA Adhesive Tape Peel Test Machine HAIDA Automatic Bursting Strength Test Machine HAIDA Bursting Strength Tester Series HAIDA Clamping Force Testing Machine HAIDA Computer Servo Carton Compressive Tester Series HAIDA Double-Column Drop Test Machine HAIDA Foam Compression Hardness Tester HAIDA Foam Pounding Fatigue Tester HAIDA Foam Rebound Test Machine HAIDA Foam Tear Resistance Tester HAIDA Four Point Bending Stiffness Tester HAIDA Microcomputer Carton Compressive Tester Series HAIDA Microcomputer Ring Crush & Edge HAIDA Package Incline Impact Tester HAIDA Paper Four Point Bending Resistance Tester HAIDA Ring Crush & Edge Crush Tester Series HAIDA Single Drop Test Machine HAIDA Universal Packaging Material Testing Machine HAIDA Zero Drop Test Machine For other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Test Equipment for Cookware Testing, Cookware Tester, Cutlery Corrosion Resistance Tester, Strength Test Apparatus for Knives, Forks, Spatulas, Bending Strength Tester for Cookware Handles Test Equipment for Cookware Testing Specialized Test Equipment for Testing of Cookware are used for testing cookware products such as pots, pressure cookers....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for COOKWARE TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for COOKWARE TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of cookware are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of cookware can be downloaded from the colored links below: Haida Cookware Testing Machines Catalog For other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

AGS-TECH Inc Past Present Mission - We specialize in Manufacturing, Fabrication, Assembly of Products, Custom Manufacturing of Components, Parts, Subassemblies. Our Manufacturing Past & Present Mission We were established under the name AGS-Group in 1979 as an industrial products and construction supplies manufacturing company. In 2002, the advanced technology group spun-off as AGS-TECH Inc. reflecting its mission in the technology field and focusing on more value added manufacturing and fabrication processes. We keep ourselves at the forefront of technology in the areas of custom manufacturing of moulds and dies, plastic and rubber parts moulding, CNC machining of metal and alloy parts, machining of plastics, metal forging and casting, technical ceramic & glass forming and shaping, sheet metal stamping and fabrication, production of machine elements, electronic components and assemblies, optical components fabrication and assembly, nanomanufacturing, micromanufacturing, mesomanufacturing, nonconventional manufacturing, industrial computers & automation equipment, industrial test and metrology tools and equipment, advanced engineering and technical services. Our difference from other engineering and manufacturing companies is we are capable to supply you a large varety of components, subassemblies, assemblies and finished products all from one single source, namely AGS-TECH Inc. There is no other company that can provide you such a diverse spectrum of engineering services and manufacturing capabilities. Our company is incorporated in the state of New Mexico-USA. AGS group of companies have annual turnover in the multimillion dollar range. The advanced technology group AGS-TECH is a part of this larger group and is still growing year after year. Our technical team members hold multiple patents in their areas of expertise, many have dozens of publications in internationally recognized journals and are inventors with graduate degrees from top universities in the World. Every day our teams review customer supplied blueprints, specification sheets and Bill of Materials, exchange information with customers, hold engineering meetings and consult each other, provide their expert opinion to our clients, modify and improve customers blueprints and design, and sometimes make a new design from scratch. Once they determine the most economic, most suitable and fastest processes for a particular project, a formal quote or proposal is presented to every customer. Upon mutual agreement of both sides, and if the project is ready to be taken to the next level in the manufacturing cycle, either one or several of our plants are assigned for manufacturing the product. All of the factories are either one of ISO9001:2000, QS9000, TS16949, ISO13485 or AS9100 quality management systems certified and manufacture products compliant with European and American industrial standards such as ASTM, ISO, DIN, IEEE, MIL. Whenever needed or required, products are certified and affixed the UL and/or CE mark, or if for medical application, they are accompanied with an FDA certification. We own some of these manufacturing plants and have partial ownership in some others. With some factories and specialized manufacturing establishments we have partnerships or joint venture. We are also on a constant look-out globally to purchase shares or partner with new manufacturing plants if they meet our expectations. This is a never ending cycle that makes us improve and grow day after day. Throughout the years we have been serving many customers. To see what some of them think about AGS-TECH, please click on this link. PREVIOUS PAGE

AGS-TECH Inc. Quoting Process for Custom Manufactured Components, Subassemblies, Assemblies and Products How we Quote Projects ? Quoting Custom Manufactured Components, Assemblies and Products Quoting off-shelf products is simple. However, more than half of the enquiries we receive are manufacturing requests for non-standard components, assemblies and products. These are categorized as CUSTOM MANUFACTURING PROJECTS. We receive from our existing as well as new potential customers RFQs (Request for Quote) and RFPs (Request for Proposals) for new projects, parts, assemblies and products on a continuous daily basis. Having to deal with out-of-the-ordinary manufacturing requests for many years, we have developed an efficient, fast, accurate quotation process that covers a wide spectrum of technologies. AGS-TECH Inc. is the World’s MOST DIVERSE ENGINEERING INTEGRATOR. The most outstanding advantage we offer you is being a one-stop source for all your manufacturing, fabrication, engineering, integration needs. QUOTING PROCESS at AGS-TECH Inc: Let us provide you some basic information about our quoting process for custom manufactured components, assemblies and products, so that when you send us RFQ and RFPs, you will better know what we need to know to provide you the most accurate quotes. Please keep in mind that the more accurate our quote is, the lower the prices will be. Ambiguities will only result in us quoting higher prices so we do not have losses at the end of a project. Understanding the quotation process will help you for all purposes. When an RFQ or RFP for a custom part or product is received by AGS-TECH Inc’s sales department, it is immediately scheduled for engineering review. Reviews take place on a daily basis and even several of these may be scheduled for a day. Participants to these meetings come from various departments such as planning, quality control, engineering, packaging, sales…etc and each makes its contribution for accurate calculation of lead times and cost. When various contributors to cost and standard lead times are added up, we come up with a total cost & lead time, from which a formal quote is drafted. The actual process involves of course much more than this. Each participant to the engineering meeting receives a preliminary document ahead of the meeting summarizing the projects that will be reviewed at a particular time and does his / her own estimations prior to the meeting. In other words, participants come prepared to these meetings and after reviewing all information as a group, refinements and adjustments are made and final numbers are calculated. Team members use advanced software tools such as GROUP TECHNOLOGY, to aid them to obtain the most accurate numbers for each quote prepared. Using Group Technology, new part designs can be developed using already existing and similar designs, thus saving a significant amount of time and work. Product designers can determine very fast whether data on a similar component already exists in the computer files. Custom manufacturing costs can more easily be estimated and the relevant statistics on materials, processes, number of parts produced, and other factors can easily be obtained. With Group Technology, process plans are standardized and scheduled more efficiently, orders are grouped for more efficient production, machine utilization is optimized, set-up times are lowered, components and assemblies are manufactured more efficiently and with higher quality. Similar tools, fixtures, machines are shared in the production of a family of parts. Since we have manufacturing operations at multiple plants, Group Technology also helps us determine which plant is the most suitable for a particular manufacturing request. In other words, the system compares and matches available equipment at each plant with the requirements of a particular part or assembly and determines which of our plant or plants are the best fit for that planned work order. Even geographic proximity of the plants to the products shipping destination and shipping prices are taken into account by our computer integrated system. Together with Group Technology, we implement CAD/CAM, cellular manufacturing, computer integrated manufacturing and improve productivity and reduce costs even in small-batch production approaching mass production prices per piece. All these capabilities along with manufacturing operations in low-cost countries enables AGS-TECH Inc., the World’s most diverse engineering integrator to provide the most outstanding quotations for custom manufacturing RFQs. Other powerful tools we use in our quoting process of custom manufactured components are COMPUTER SIMULATIONS of MANUFACTURING PROCESSES and SYSTEMS. A process simulation can be: -A model of a manufacturing operation, for the purpose of determining the viability of a process or for improving its performance. -A model of multiple processes and their interactions to help our process planners optimize process routes and layout of machinery. Frequent problems addressed by these models include process viability such as assessing the formability and behavior of a certain gauge sheet metal in a certain pressworking operation or process optimization such as analyzing the metal-flow pattern in a die forging operation to identify potential defects. This kind of information obtained help our estimators better determine whether we should quote a particular RFQ or not. If we determine to quote it, these simulations give us a better idea about the expected yields, cycle times, prices and lead times. Our dedicated software program simulates an entire manufacturing system that involves multiple processes and equipment. This helps identify critical machinery, assists in scheduling and routing of work orders and eliminates potential production bottlenecks. Scheduling and routing information obtained helps us in our quotation of RFQs. The more accurate our info is, the more accurate and lower our quoted prices will be. WHAT INFORMATION SHOULD CUSTOMERS PROVIDE AGS-TECH Inc. TO GET THE BEST PRICE QUOTE WITHIN SHORTEST TIME ? Best quotation is the one with lowest possible price (with no sacrifice on quality), shortest or customer preferred lead time formally provided to customer quickly. Providing the best quotation is always our goal, however it depends on you (the customer) just as much as on us. Here is the information we would expect from you when you send us a Request for Quote (RFQ). We may not need all of these to quote your components and assemblies, but the more of these you can provide the more likely it is that you will receive a very competitive quotation from us. - 2D Blueprints (technical drawings) of parts and assemblies. Blueprints should clearly show dimensions, tolerances, surface finish, coatings if applicable, material information, blueprint revision number or letter, Bill of Materials (BOM), part view from different directions…etc. These can be in PDF, JPEG format or else. - 3D CAD files of parts and assemblies. These can be in DFX, STL, IGES, STEP, PDES format or else. - Quantities of parts for quote. Generally, the higher the quantity the lower will be the price in our quote (please be honest with your actual quantities for quote). - If there are off-the-shelf components that are assembled with your parts, please feel free to include them in your blueprints. If assembly is complicated, separate assembly blueprints help us much in the quotation process. We may buy and assemble the off-shelf components into your products or custom manufacture depending on the economic viability. In any case we can include those in our quote. - Clearly indicate whether you want us to quote individual components or a subassembly or an assembly. This will save us time and hassle in the quotation process. -Shipping address of parts for quote. This helps us quote shipping in case you do not have a courier account or forwarder. - Indicate whether it is a batch production request or a long term repeat order that is planned. A repeat order over long term generally receives a better price quotation. A blanket order does generally also receive a better quote. - Indicate whether you want special packaging, labeling, marking…etc of your products. Indicating all your requirements in the beginning will save both parties time and effort in the quotation process. If not indicated at the beginning, we will likely need to re-quote later and this will only delay the process. - If you need us to sign an NDA prior to quoting your projects, please email them over to us. We gladly accept signing NDAs prior to quoting projects that have confidential content. If you do not have an NDA, but need one, just tell us and we will send it to you prior to quoting. Our NDA covers both sides. WHAT PRODUCT DESIGN CONSIDERATIONS SHOULD CUSTOMERS HAVE GONE THROUGH TO GET THE BEST PRICE QUOTE WITHIN SHORTEST TIME ? Some fundamental design considerations customers should take into account for obtaining the best quotation are: - Is it possible to simplify product design and reduce the number of components for a better quote without adversely affecting intended functions and performance ? - Were environmental considerations taken into account and incorporated into material, process and design ? Environmentally polluting technologies have higher tax burdens and disposal fees and thus indirectly result in us quoting higher prices. - Have you investigated all alternative designs ? When you send us a request for quote, please feel free to ask whether changes in design or material would make the price quote lower. We will review and give you our feedback about the effect of modifications on the quote. Alternatively you may send us several designs and compare our quotation on each. - Can unnecessary features of the product or its components be eliminated or combined with other features for a better quote ? - Have you considered modularity in your design for a family of similar products and for service and repairs, upgrading and installation ? Modularity can make us quote lower overall prices as well as reduce service and maintenance costs in the long term. For example a number of injection molded parts made of the same plastic material can be manufactured using mold inserts. Our price quotation for a mold insert is much lower than for a new mold for each part. - Can the design be made lighter and smaller ? Lightweight and smaller size not only results in better product quotation, but also saves you much on shipping cost. - Have you specified unnecessary and excessively stringent dimensional tolerances and surface finish ? The tighter the tolerances, the higher the price quote. The more difficult and tighter the surface finish requirements, again the higher the price quote. For the best quote, keep it as simple as needed. - Will it be excessively difficult and time consuming to assemble, disassemble, service, repair and recycle the product ? If so, the price quote will be higher. So again keep it as simple as possible for the best price quote. - Have you considered subassemblies ? The more value added services we add to your product such as subassembly, the better our quote will be. The overall cost of procurement will be much higher if you have several manufacturers get involved in quoting. Have us do as much as possible and for sure you will obtain the best price quote that is potentially out there. - Have you minimized the use of fasteners, their quantities and variety ? Fasteners result in higher price quotation. If easy snap-on or stacking features can be designed into the product it may result in a better price quote. - Are some of the components commercially available ? If you have an assembly for quote, please indicate on your drawing if some components are available off-the-shelf. Sometimes it is less expensive if we buy and incorporate these components instead of manufacturing them. Their manufacturer may be producing them in high volume and give us a better quote than us manufacturing them from scratch especially if the quantities are small. - If possible, choose the safest materials and designs. The safer it is, the lower will be our price quote. WHAT MATERIAL CONSIDERATIONS SHOULD CUSTOMERS HAVE GONE THROUGH TO GET THE BEST PRICE QUOTE WITHIN SHORTEST TIME ? Some fundamental material considerations customers should take into account for obtaining the best quotation are: - Did you select materials with properties that unnecessarily exceed minimum requirements and specifications ? If so, the price quote may be higher. For the lowest quote, try to use the least expensive material that meets or exceeds expectations. - Can some materials be replaced with less expensive ones ? This naturally lowers the price quote. - Do the materials you selected have the appropriate manufacturing characteristics ? If so, the price quote will be lower. If not, it may take more time to manufacture the parts, and we may have more tool wear and thus a higher price quote. In short, there is no need to make a part from tungsten if aluminum does the job. - Are raw materials needed for your products available in standard shapes, dimensions, tolerances, and surface finish ? If not, the price quote will be higher due to additional cutting, grinding, processing…etc. - Is the material supply reliable ? If not, our quotation may well be different each time you reorder the product. Some materials have rapidly and significantly changing prices in the global marketplace. Our quote will be better if the material used is plenty and has a stable supply. - Can the raw materials chosen be obtained in the required quantities in the desired timeframe ? For some materials, raw material suppliers have Minimum Order Quantities (MOQ). Therefore if quantities you requested are low, it may be impossible for us to get a price quote from the material supplier. Again, for some exotic materials, our procurement lead times may be too long. - Some materials are able to improve assembly and even facilitate automated assembly. This may result in a better price quote. For example a ferromagnetic material may easily be picked and placed with electromagnetic manipulators. Consult with our engineers if you do not have internal engineering resources. Automation can lead to a much better quote especially for high volume production. - Choose materials that increase stiffness-to-weight and strength-to-weight ratios of structures whenever possible. This will require less raw material and thus make a lower quotation possible. - Comply with legislation and laws prohibiting the use of environmentally destructive materials. This approach will eliminate high disposal fees for destructive materials and thus make a lower quotation possible. - Choose materials that reduce performance variations, environmental sensitivity of products, improve robustness. This way, there will be less manufacturing scrap and rework and we can quote much better prices. WHAT MANUFACTURING PROCESS CONSIDERATIONS SHOULD CUSTOMERS HAVE GONE THROUGH TO GET THE BEST PRICE QUOTE WITHIN SHORTEST TIME ? Some fundamental process considerations customers should take into account for obtaining the best quotation are: - Have you considered all alternative processes ? Price quote can be surprisingly lower for some processes as compared to others. Therefore, unless necessary, leave the process decision to us. We prefer to quote you considering the lowest cost option. - What are the ecological impacts of the processes ? Try to choose the most ecologically friendly processes. This will result in a lower price quotation because of lower environment related fees. - Are the processing methods considered economical for the type of material, shape produced, and production rate ? If these match well with the processing method, you will receive a more appealing quotation. - Can requirements for tolerances, surface finish, and product quality be met consistently ? The more the consistency, the lower our price quotation and the shorter the lead time. - Can your components be produced to final dimensions without additional finishing operations ? If so, this will give us the opportunity to quote lower prices. - Is the tooling required available or manufacturable at our plants ? Or can we purchase it as an off-shelf item ? If so, we can quote better prices. If not we will need to procure and add it to our quotation. For best quote, try to keep designs and required processes as simple as possible. - Did you think of minimizing the scrap by choosing the right process ? The lower the scrap the lower the quoted price ? We may be able to sell some scrap and deduct from the quote in some cases, but most of the scrap metal and plastics produced during processing are of low value. - Give us the opportunity to optimize all processing parameters. This will result in a more appealing quote. For example, if four weeks lead time is good for you, don’t insist on two weeks which will force us to machine parts faster and therefore have more tool damage, as this will be calculated into the quotation. - Have you explored all the automation possibilities for all phases of the production ? If not, reconsidering your project along these lines can result in a lower price quote. - We implement Group Technology for parts with similar geometries and manufacturing attributes. You will receive a better quotation if you send over RFQs for more parts with similarities in geometry and design. If we evaluate them at the same time together, we will most likely quote lower prices for each (with the condition that they are ordered together). - If you have special inspection and quality control procedures to be implemented by us, make sure they are useful and not misleading. We cannot take responsibility for mistakes arising due to ill-designed procedures imposed on us. Generally speaking, our quotation is more appealing if we implement our own procedures. - For high volume production, our quote will be better if we manufacture all components in your assembly. However, sometimes for low volume production, our final quote can be lower if we can purchase some of the standard items that go into your assembly. Consult with us prior to making a decision. You can watch our Youtube video presentation "How You Can Receive Best Quotes from Custom Manufacturers" by clicking on the highlighted text. You can download a Powerpoint presentation version of the above video "How You Can Receive Best Quotes from Custom Manufacturers" by clicking to the highlighted text. PREVIOUS PAGE

Keys Splines and Pins, Square Flat Key, Pratt and Whitney, Woodruff, Crowned Involute Ball Spline Manufacturing, Serrations, Gib-Head Key from AGS-TECH Inc. Keys & Splines & Pins Manufacturing Other miscellaneous fasteners we provide are keys, splines, pins, serrations. KEYS: A key is a piece of steel lying partly in a groove in the shaft and extending into another groove in the hub. A key is used to secure gears, pulleys, cranks, handles, and similar machine parts to shafts, so that the motion of the part is transmitted to the shaft, or the motion of the shaft to the part, without slippage. The key may also act in a safety capacity; its size can be calculated so that when overloading takes place, the key will shear or break before the part or shaft breaks or deforms. Our keys are also available with a taper on their top surfaces. For tapered keys, the keyway in the hub is tapered to accommodate the taper on the key. Some major types of keys we offer are: Square key Flat key Gib-Head Key – These keys are the same as flat or square tapered keys but with added head for ease of removal. Pratt and Whitney Key – These are rectangular keys with rounded edges. Two-thirds of these keys sit in the shaft and one-third in the hub. Woodruff Key – These keys are semicircular and fit into semicircular keyseats in the shafts and rectangular keyways in the hub. SPLINES: Splines are ridges or teeth on a drive shaft that mesh with grooves in a mating piece and transfer torque to it, maintaining the angular correspondence between them. Splines are capable of carrying heavier loads than keys, permit lateral movement of a part, parallel to the axis of the shaft, while maintaining positive rotation, and allow the attached part to be indexed or changed to another angular position. Some splines have straight-sided teeth, whereas others have curved-sided teeth. Splines with curved-sided teeth are called involute splines. Involute splines have pressure angles of 30, 37.5 or 45 degrees. Both internal and external spline versions are available. SERRATIONS are shallow involute splines with 45 degree pressure angles and are used for holding parts like plastic knobs. Major types of splines we offer are: Parallel key splines Straight-side splines – Also called parallel-side splines, they are used in many automotive and machine industry applications. Involute splines – These splines are similar in shape to involute gears but have pressure angles of 30, 37.5 or 45 degrees. Crowned splines Serrations Helical splines Ball splines PINS / PIN FASTENERS: Pin fasteners are an inexpensive and effective method of assembly when loading is primarily in shear. Pin fasteners can be separated into two groups: Semipermanent Pinsand Quick-Release Pins. Semipermanent pin fasteners require application of pressure or the aid of tools for installation or removal. Two basic types are Machine Pins and Radial Locking Pins. We offer the following machine pins: Hardened and ground dowel pins – We have standardized nominal diameters between 3 to 22 mm available and can machine custom sized dowel pins. Dowel pins can be used to hold laminated sections together, they can fasten machine parts with high alignment accuracy, lock components on shafts. Taper pins – Standard pins with 1:48 taper on the diameter. Taper pins are suitable for light-duty service of wheels and levers to shafts. Clevis pins - We have standardized nominal diameters between 5 to 25 mm available and can machine custom sized clevis pins. Clevis pins can be used on mating yokes, forks and eye members in knuckle joints. Cotter pins – Standardized nominal diameters of cotter pins range from 1 to 20 mm. Cotter pins are locking devices for other fasteners and are generally used with a castle or slotted nuts on bolts, screws, or studs. Cotter pins enable low-cost and convenient locknut assemblies. Two basic pin forms are offered as Radial Locking Pins, solid pins with grooved surfaces and hollow spring pins which are either slotted or come with spiral-wrapped configuration. We offer the following radial locking pins: Grooved straight pins – Locking is enabled by parallel, longitudinal grooves uniformly spaced around the pin surface. Hollow spring pins – These pins are compressed when driven into holes and pins exert spring pressure against the hole walls along their entire engaged length to produce locking fits Quick-release pins: Available types vary widely in head styles, types of locking and release mechanisms, and range of pin lengths. Quick-release pins have applications such as clevis-shackle pin, draw-bar hitch pin, rigid coupling pin, tubing lock pin, adjustment pin, swivel hinge pin. Our quick release pins can be grouped into one of two basic types: Push-pull pins – These pins are made with either a solid or hollow shank containing a detent assembly in the form of a locking lug, button or ball, backed up by some sort of plug, spring or resilient core. The detent member projects from the pins surface until sufficient force is applied in assembly or removal to overcome the spring action and to release the pins. Positive-locking pins - For some quick-release pins, the locking action is independent of insertion and removal forces. Positive-locking pins are suited for shear-load applications as well as for moderate tension loads. CLICK Product Finder-Locator Service PREVIOUS PAGE

We supply wire and wire mesh, galvanized wires, metal wire, black annealed wire, wire mesh filters, wire cloth, perforated metal mesh, wire mesh fence and panels, conveyor belt mesh, wire mesh containers and customized wire mesh products to your specifications. Mesh & Wire We supply wire and mesh products, including galvanized iron wires, PVC coated iron binding wires, wire mesh, wire net, fencing wires, conveyor belt mesh, perforated metal mesh. Besides our off-the-shelf wire mesh products we do custom manufacture mesh and metal wire products according to your specifications and needs. We cut to desired size, label and package according to customer requirements. Please click on submenus below to read more about a specific wire & mesh product. Galvanized Wires & Metal Wires These wires are used in numerous applications throughout industry. For example galvanized iron wires are frequently used for binding and attachment purposes, as ropes of considerable tensile strength. These metal wires can be hot dip galvanized and have metallic appearance or they can be PVC coated and be colored. Barbed wires have various razor types and are used for keeping intruders outside of restricted areas. Various wire gauges are available from stock. Long wires come in coils. If quantities justify, we may be able to manufacture them at your desired lengths and coil dimensions. Custom labeling and packaging of our Galvanized Wires, Metal Wires, Barbed Wire is possible. Download brochures: - Metal Wires - Galvanized - Black Annealed Wire Mesh Filters These are mostly made of thin stainless steel wire mesh and widely used in industry as filters for filtering liquids, dusts, powders...etc. Wire mesh filters have thicknesses in the few milimeters range. AGS-TECH has achieved manufacturing wire mesh with wire diameters less than 1 mm for electromagnetic shielding of military naval illumination systems. We manufacture wire mesh filters with dimensions according to customer specifications. Square, round and oval are commonly used geometries. Wire diameters and mesh count of our filters can be chosen by you. We cut them to size and frame the edges so the filter mesh does not get distorted or damaged. Our wire mesh filters possess high strainability, long lifespan, strong and reliable edges. Some usage areas of our wire mesh filters are chemical industry, pharmaceutical industry, brewage, beverage, electromagnetic shielding, automotive industry, mechanical applications, etc. - Wire Mesh and Cloth Brochure (includes wire mesh filters) Perforated Metal Mesh Our perforated metal mesh sheets are produced from galvanized steel, low carbon steel, stainless steel, copper plates, nickel plates or as requested by you, the customer. Various hole shapes and patterns can be stamped as you wish. Our perforated metal mesh offers smoothness, perfect surface flatness, strength and durability and is suitable for many applications. By supplying perforated metal mesh we have fulfilled the needs of many industries and applications including indoor sound insulation, silencer manufacturing, mining, medicine, food processing, ventilation, agricultural storage, mechanical protection and more. Call us today. We will happily cut, stamp, bend, fabricate your perforated metal mesh according to your specifications and needs. - Wire Mesh and Cloth Brochure (includes perforated metal mesh) Wire Mesh Fence & Panels & Reinforcement Wire mesh is widely used in construction, landscaping, home improvement, gardening, road building...etc., with popular applications of wire mesh as fence and reinforcement panels in construction. See our downloadable brochures below to choose your preferred model of mesh opening, wire gauge, color and finish. All of our wire mesh fence & panels and reinforcement products are compliant with international industry standards. A variety of wire mesh fence structures are available from stock. - Wire Mesh and Cloth Brochure (includes information on our fence & panels and reinforcement) Conveyor Belt Mesh Our Conveyor Belt Mesh are generally made of reinforced mesh stainless steel wire, stainless iron wire, nichrome wire, bullet wire. Applications of conveyor belt mesh are as filter and as conveyer belt for use in chemical industry, petroleum, metallurgy, food industry, pharmaceuticals, glass industry, delivery of parts within a plant or facility..., etc. Weave Style of most conveyor belt mesh is pre-bending to spring and then insertion of wire. Wire diameters are generally: 0.8-2.5mm Wire thicknesses are generally: 5-13.2mm Common colors are generally: Silver Generally width is between 0.4m-3m and lengths are between 0.5 - 100 m Conveyor belt mesh is heat resistant Chain type, width and length of conveyor belt mesh are among the customizable parameters. - Wire Mesh and Cloth Brochure (includes general information on our capabilities) Customized Wire Mesh Products (such as Cable Trays, Stirrup....etc.) From wire mesh and perforated metal mesh we can manufacture a variety of custom products such as cable trays, stirrers, Faraday cages & EM shielding structures, wire baskets and trays, architectural objects, objects of art, steel wire mesh gloves used in the meat industry for protection against injuries...etc. Our customized wire mesh, perforated metals, and expanded metals can be cut to size and flattened for your desired application. Flattened wire mesh is commonly used as machine guards, ventilation screens, burner screens, security screens, liquid drainage screens, ceiling panels and many other applications. We can create customized perforated metals with hole shapes and sizes to meet your project and product requirements. Perforated metals are versatile in their use. We can also provide coated wire mesh. Coatings can improve durability of your customized wire mesh products and also provide a rust resistant barrier. Custom wire mesh coatings available include Powder Coating, Electro-Polishing, Hot-Dipped Galvanizing, Nylon, Painting, Aluminizing, Electro-Galvanizing, PVC, Kevlar,...etc. Whether woven from wire as customized wire mesh, or stamped & punched and flattened from sheet metal as perforated sheets, contact AGS-TECH for your customized product requirements. - Wire Mesh and Cloth Brochure (includes plenty of information on our customized wire mesh production capabilities) - Wire Mesh Cable Trays and Baskets Brochure (besides the products in this brochure you can get customized cable trays according to your specifications) - Wire Mesh Container Quote Design Form (please click to download, fill out and email us) PREVIOUS PAGE

Electronic Testers - Electrical Test Equipment - Electrical Properties Testing - Oscilloscope - Signal Generator - Function Generator - Pulse Generator - Frequency Synthesizer - Multimeter Electrical & Electronic Test Equipment With the term ELECTRONIC TESTER we refer to test equipment that is used primarily for testing, inspection and analysis of electrical and electronic components and systems. We offer the most popular ones in the industry: POWER SUPPLIES & SIGNAL GENERATING DEVICES: POWER SUPPLY, SIGNAL GENERATOR, FREQUENCY SYNTHESIZER, FUNCTION GENERATOR, DIGITAL PATTERN GENERATOR, PULSE GENERATOR, SIGNAL INJECTOR METERS: DIGITAL MULTIMETERS, LCR METER, EMF METER, CAPACITANCE METER, BRIDGE INSTRUMENT, CLAMP METER, GAUSSMETER / TESLAMETER/ MAGNETOMETER, GROUND RESISTANCE METER ANALYZERS: OSCILLOSCOPES, LOGIC ANALYZER, SPECTRUM ANALYZER, PROTOCOL ANALYZER, VECTOR SIGNAL ANALYZER, TIME-DOMAIN REFLECTOMETER, SEMICONDUCTOR CURVE TRACER, NETWORK ANALYZER, PHASE ROTATION TESTER, FREQUENCY COUNTER You can purchase brand new, refurbished or used test equipment from us at the most competitive discounted prices. Simply choose the product from the downloadable catalogs and let us know the product name, product code and relevant information and we will send you our quote. Download by clicking on highlighted text: ANRITSU Electronic Measuring Instruments FLUKE Test Tools Catalog KEYSIGHT Basic Automotive Test Products KEYSIGHT Basic Instruments KEYSIGHT Bench and Power Products KEYSIGHT Network Analyzer Products KEYSIGHT Signal Generation Solutions KEYSIGHT Smart Bench Essentials Series Products KEYSIGHT High-Volume Traffic Generator Products KEYSIGHT Layer 4-7 Network Test Products KEYSIGHT Layer 2-3 Network Test Products KEYSIGHT Distribution Products Catalog MEGGER Low Voltage Test Tools Catalog MICROWAVE Flexible Cable Assembly MICROWAVE and MILIMETER WAVE Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Private Label Hand Tools for Every Industry (This catalog contains a few electrical & electronic test instruments. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers.) ROHDE SCHWARZ Benchtop Power Supplies Ideal for labs and system racks, galvanic isolation, floating channels, constant voltage or current modes, protection functions, parallel and serial operation, low ripple/noise, remote sensing option ROHDE SCHWARZ Test Equipment Catalog (Oscilloscopes, Power Supplies, Signal Generators, Handheld Analyzers, Spectrum Analyzers, Vector Network Analyzers, Meters & Counters) TEKTRONIX Product Catalog for Test and Measurement Solutions VANDAL-PROOF IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com Let us briefly go over some of these equipment in everyday use throughout the industry: The electrical power supplies we supply for metrology purposes are discrete, benchtop and stand-alone devices. The ADJUSTABLE REGULATED ELECTRICAL POWER SUPPLIES are some of the most popular ones, because their output values can be adjusted and their output voltage or current is maintained constant even if there are variations in input voltage or load current. ISOLATED POWER SUPPLIES have power outputs that are electrically independent of their power inputs. Depending on their power conversion method, there are LINEAR and SWITCHING POWER SUPPLIES. The linear power supplies process the input power directly with all their active power conversion components working in the linear regions, whereas the switching power supplies have components working predominantly in non-linear modes (such as transistors) and convert power to AC or DC pulses before processing. Switching power supplies are generally more efficient than linear supplies because they lose less power due to shorter times their components spend in the linear operating regions. Depending on application, a DC or AC power is used. Other popular devices are PROGRAMMABLE POWER SUPPLIES, where voltage, current or frequency can be remotely controlled through an analog input or digital interface such as an RS232 or GPIB. Many of them have an integral microcomputer to monitor and control the operations. Such instruments are essential for automated testing purposes. Some electronic power supplies use current limiting instead of cutting off power when overloaded. Electronic limiting is commonly used on lab bench type instruments. SIGNAL GENERATORS are another widely used instruments in lab and industry, generating repeating or non-repeating analog or digital signals. Alternatively they are also called FUNCTION GENERATORS, DIGITAL PATTERN GENERATORS or FREQUENCY GENERATORS. Function generators generate simple repetitive waveforms such as sine waves, step pulses, square & triangular and arbitrary waveforms. With Arbitrary waveform generators the user can generate arbitrary waveforms, within published limits of frequency range, accuracy, and output level. Unlike function generators, which are limited to a simple set of waveforms, an arbitrary waveform generator allows the user to specify a source waveform in a variety of different ways. RF and MICROWAVE SIGNAL GENERATORS are used for testing components, receivers and systems in applications such as cellular communications, WiFi, GPS, broadcasting, satellite communications and radars. RF signal generators generally work between a few kHz to 6 GHz, while microwave signal generators operate within a much wider frequency range, from less than 1 MHz to at least 20 GHz and even up to hundreds of GHz ranges using special hardware. RF and microwave signal generators can be classified further as analog or vector signal generators. AUDIO-FREQUENCY SIGNAL GENERATORS generate signals in the audio-frequency range and above. They have electronic lab applications checking of the frequency response of audio equipment. VECTOR SIGNAL GENERATORS, sometimes also referred to as DIGITAL SIGNAL GENERATORS are capable of generating digitally-modulated radio signals. Vector signal generators can generate signals based on industry standards such as GSM, W-CDMA (UMTS) and Wi-Fi (IEEE 802.11). LOGIC SIGNAL GENERATORS are also called DIGITAL PATTERN GENERATOR. These generators produce logic types of signals, that is logic 1s and 0s in the form of conventional voltage levels. Logic signal generators are used as stimulus sources for functional validation & testing of digital integrated circuits and embedded systems. The devices mentioned above are for general-purpose use. There are however many other signal generators designed for custom specific applications. A SIGNAL INJECTOR is a very useful and quick troubleshooting tool for signal tracing in a circuit. Technicians can determine the faulty stage of a device such as a radio receiver very quickly. The signal injector can be applied to the speaker output, and if the signal is audible one can move to the preceding stage of the circuit. In this case an audio amplifier, and if the injected signal is heard again one can move the signal injection up the stages of the circuit until the signal is no longer audible. This will serve the purpose of locating the location of the problem. A MULTIMETER is an electronic measuring instrument combining several measurement functions in one unit. Generally, multimeters measure voltage, current, and resistance. Both digital and analog version are available. We offer portable hand-held multimeter units as well as laboratory-grade models with certified calibration. Modern multimeters can measure many parameters such as: Voltage (both AC / DC), in volts, Current (both AC / DC), in amperes, Resistance in ohms. Additionally, some multimeters measure: Capacitance in farads, Conductance in siemens, Decibels, Duty cycle as a percentage, Frequency in hertz, Inductance in henries, Temperature in degrees Celsius or Fahrenheit, using a temperature test probe. Some multimeters also include: Continuity tester; sounds when a circuit conducts, Diodes (measuring forward drop of diode junctions), Transistors (measuring current gain and other parameters), battery checking function, light level measuring function, acidity & Alkalinity (pH) measuring function and relative humidity measuring function. Modern multimeters are often digital. Modern digital multimeters often have an embedded computer to make them very powerful tools in metrology and testing. They include features such as:: •Auto-ranging, which selects the correct range for the quantity under test so that the most significant digits are shown. •Auto-polarity for direct-current readings, shows if the applied voltage is positive or negative. •Sample and hold, which will latch the most recent reading for examination after the instrument is removed from the circuit under test. •Current-limited tests for voltage drop across semiconductor junctions. Even though not a replacement for a transistor tester, this feature of digital multimeters facilitates testing diodes and transistors. •A bar graph representation of the quantity under test for better visualization of fast changes in measured values. •A low-bandwidth oscilloscope. •Automotive circuit testers with tests for automotive timing and dwell signals. •Data acquisition feature to record maximum and minimum readings over a given period, and to take a number of samples at fixed intervals. •A combined LCR meter. Some multimeters can be interfaced with computers, while some can store measurements and upload them to a computer. Yet another very useful tool, an LCR METER is a metrology instrument for measuring the inductance (L), capacitance (C), and resistance (R) of a component. The impedance is measured internally and converted for display to the corresponding capacitance or inductance value. Readings will be reasonably accurate if the capacitor or inductor under test does not have a significant resistive component of impedance. Advanced LCR meters measure true inductance and capacitance, and also the equivalent series resistance of capacitors and the Q factor of inductive components. The device under test is subjected to an AC voltage source and the meter measures the voltage across and the current through the tested device. From the ratio of voltage to current the meter can determine the impedance. The phase angle between the voltage and current is also measured in some instruments. In combination with the impedance, the equivalent capacitance or inductance, and resistance, of the device tested can be calculated and displayed. LCR meters have selectable test frequencies of 100 Hz, 120 Hz, 1 kHz, 10 kHz, and 100 kHz. Benchtop LCR meters typically have selectable test frequencies of more than 100 kHz. They often include possibilities to superimpose a DC voltage or current on the AC measuring signal. While some meters offer the possibility to externally supply these DC voltages or currents other devices supply them internally. An EMF METER is a test & metrology instrument for measuring electromagnetic fields (EMF). Majority of them measure the electromagnetic radiation flux density (DC fields) or the change in an electromagnetic field over time (AC fields). There are single axis and tri-axis instrument versions. Single axis meters cost less than tri-axis meters, but take longer to complete a test because the meter only measures one dimension of the field. Single axis EMF meters have to be tilted and turned on all three axes to complete a measurement. On the other hand, tri-axis meters measure all three axes simultaneously, but are more expensive. An EMF meter can measure AC electromagnetic fields, which emanate from sources such as electrical wiring, while GAUSSMETERS / TESLAMETERS or MAGNETOMETERS measure DC fields emitted from sources where direct current is present. The majority of EMF meters are calibrated to measure 50 and 60 Hz alternating fields corresponding to the frequency of US and European mains electricity. There are other meters which can measure fields alternating at as low as 20 Hz. EMF measurements can be broadband across a wide range of frequencies or frequency selective monitoring only the frequency range of interest. A CAPACITANCE METER is a test equipment used to measure capacitance of mostly discrete capacitors. Some meters display the capacitance only, whereas others also display leakage, equivalent series resistance, and inductance. Higher end test instruments use techniques such as inserting the capacitor-under-test into a bridge circuit. By varying the values of the other legs in the bridge so as to bring the bridge into balance, the value of the unknown capacitor is determined. This method ensures greater precision. The bridge may also be capable to measure series resistance and inductance. Capacitors over a range from picofarads to farads may be measured. Bridge circuits do not measure leakage current, but a DC bias voltage can be applied and the leakage measured directly. Many BRIDGE INSTRUMENTS can be connected to computers and data exchange be made to download readings or to control the bridge externally. Such bridge instruments aso offer go / no go testing for automation of tests in a fast paced production & quality control environment. Yet, another test instrument, a CLAMP METER is an electrical tester combining a voltmeter with a clamp type current meter. Most modern versions of clamp meters are digital. Modern clamp meters have most of the basic functions of a Digital Multimeter, but with the added feature of a current transformer built into the product. When you clamp the instrument’s “jaws” around a conductor carrying a large ac current, that current is coupled through the jaws, similar to the iron core of a power transformer, and into a secondary winding which is connected across the shunt of the meter’s input, the principle of operation resembling much that of a transformer. A much smaller current is delivered to the meter’s input due to the ratio of the number of secondary windings to the number of primary windings wrapped around the core. The primary is represented by the one conductor around which the jaws are clamped. If the secondary has 1000 windings, then the secondary current is 1/1000 the current flowing in the primary, or in this case the conductor being measured. Thus, 1 amp of current in the conductor being measured would produce 0.001 amps of current at the input of the meter. With clamp meters much larger currents can be easily measured by increasing the number of turns in the secondary winding. As with most of our test equipment, advanced clamp meters offer logging capability. GROUND RESISTANCE TESTERS are used for testing the earth electrodes and the soil resistivity. The instrument requirements depend on the range of applications. Modern clamp-on ground testing instruments simplify ground loop testing and enable non-intrusive leakage current measurements. Among the ANALYZERS we sell are OSCILLOSCOPES without doubt one of the most widely used equipment. An oscilloscope, also called an OSCILLOGRAPH, is a type of electronic test instrument that allows observation of constantly varying signal voltages as a two-dimensional plot of one or more signals as a function of time. Non-electrical signals like sound and vibration can also be converted to voltages and displayed on oscilloscopes. Oscilloscopes are used to observe the change of an electrical signal over time, the voltage and time describe a shape which is continuously graphed against a calibrated scale. Observation and analysis of the waveform reveals us properties such as amplitude, frequency, time interval, rise time, and distortion. Oscilloscopes can be adjusted so that repetitive signals can be observed as a continuous shape on the screen. Many oscilloscopes have storage function that allows single events to be captured by the instrument and displayed for a relatively long time. This allows us to observe events too fast to be directly perceptible. Modern oscilloscopes are lightweight, compact and portable instruments. There are also miniature battery-powered instruments for field service applications. Laboratory grade oscilloscopes are generally bench-top devices. There is a vast variety of probes and input cables for use with oscilloscopes. Please contact us in case you need advice about which one to use in your application. Oscilloscopes with two vertical inputs are called dual-trace oscilloscopes. Using a single-beam CRT, they multiplex the inputs, usually switching between them fast enough to display two traces apparently at once. There are also oscilloscopes with more traces; four inputs are common among these. Some multi-trace oscilloscopes use the external trigger input as an optional vertical input, and some have third and fourth channels with only minimal controls. Modern oscilloscopes have several inputs for voltages, and thus can be used to plot one varying voltage versus another. This is used for example for graphing I-V curves (current versus voltage characteristics) for components such as diodes. For high frequencies and with fast digital signals the bandwidth of the vertical amplifiers and sampling rate must be high enough. For-general purpose use a bandwidth of at least 100 MHz is usually sufficient. A much lower bandwidth is sufficient for audio-frequency applications only. Useful range of sweeping is from one second to 100 nanoseconds, with appropriate triggering and sweep delay. A well-designed, stable, trigger circuit is required for a steady display. The quality of the trigger circuit is key for good oscilloscopes. Another key selection criteria is the sample memory depth and sample rate. Basic level modern DSOs now have 1MB or more of sample memory per channel. Often this sample memory is shared between channels, and can sometimes only be fully available at lower sample rates. At the highest sample rates the memory may be limited to a few 10's of KB. Any modern ''real-time'' sample rate DSO will have typically 5-10 times the input bandwidth in sample rate. So a 100 MHz bandwidth DSO would have 500 Ms/s - 1 Gs/s sample rate. Greatly increased sample rates have largely eliminated the display of incorrect signals that was sometimes present in the first generation of digital scopes. Most modern oscilloscopes provide one or more external interfaces or buses such as GPIB, Ethernet, serial port, and USB to allow remote instrument control by external software. Here is a list of different oscilloscope types: CATHODE RAY OSCILLOSCOPE DUAL-BEAM OSCILLOSCOPE ANALOG STORAGE OSCILLOSCOPE DIGITAL OSCILLOSCOPES MIXED-SIGNAL OSCILLOSCOPES HANDHELD OSCILLOSCOPES PC-BASED OSCILLOSCOPES A LOGIC ANALYZER is an instrument that captures and displays multiple signals from a digital system or digital circuit. A logic analyzer may convert the captured data into timing diagrams, protocol decodes, state machine traces, assembly language. Logic Analyzers have advanced triggering capabilities, and are useful when the user needs to see the timing relationships between many signals in a digital system. MODULAR LOGIC ANALYZERS consist of both a chassis or mainframe and logic analyzer modules. The chassis or mainframe contains the display, controls, control computer, and multiple slots into which the data-capturing hardware is installed. Each module has a specific number of channels, and multiple modules can be combined to obtain a very high channel count. The ability to combine multiple modules to obtain a high channel count and the generally higher performance of modular logic analyzers makes them more expensive. For the very high end modular logic analyzers, the users may need to provide their own host PC or purchase an embedded controller compatible with the system. PORTABLE LOGIC ANALYZERS integrate everything into a single package, with options installed at the factory. They generally have lower performance than modular ones, but are economical metrology tools for general purpose debugging. In PC-BASED LOGIC ANALYZERS, the hardware connects to a computer through a USB or Ethernet connection and relays the captured signals to the software on the computer. These devices are generally much smaller and less expensive because they make use of a personal computer’s existing keyboard, display and CPU. Logic analyzers can be triggered on a complicated sequence of digital events, then capture large amounts of digital data from the systems under test. Today specialized connectors are in use. The evolution of logic analyzer probes has led to a common footprint that multiple vendors support, which provides added freedom to end users: Connectorless technology offered as several vendor-specific trade names such as Compression Probing; Soft Touch; D-Max is being used. These probes provide a durable, reliable mechanical and electrical connection between the probe and the circuit board. A SPECTRUM ANALYZER measures the magnitude of an input signal versus frequency within the full frequency range of the instrument. The primary use is to measure the power of the spectrum of signals. There are optical and acoustical spectrum analyzers as well, but here we will discuss only electronic analyzers that measure and analyze electrical input signals. The spectra obtained from electrical signals provides us information about frequency, power, harmonics, bandwidth…etc. The frequency is displayed on the horizonal axis and the signal amplitude on the vertical. Spectrum analyzers are widely used in the electronics industry for the analyses of the frequency spectrum of radio frequency, RF and audio signals. Looking at the spectrum of a signal we are able to reveal elements of the signal, and the performance of the circuit producing them. Spectrum analyzers are able to make a large variety of measurements. Looking at the methods used to obtain the spectrum of a signal we can categorize the spectrum analyzer types. - A SWEPT-TUNED SPECTRUM ANALYZER uses a superheterodyne receiver to down-convert a portion of the input signal spectrum (using a voltage-controlled oscillator and a mixer) to the center frequency of a band-pass filter. With a superheterodyne architecture, the voltage-controlled oscillator is swept through a range of frequencies, taking advantage of the full frequency range of the instrument. Swept-tuned spectrum analyzers are descended from radio receivers. Therefore swept-tuned analyzers are either tuned-filter analyzers (analogous to a TRF radio) or superheterodyne analyzers. In fact, in their simplest form, you could think of a swept-tuned spectrum analyzer as a frequency-selective voltmeter with a frequency range that is tuned (swept) automatically. It is essentially a frequency-selective, peak-responding voltmeter calibrated to display the rms value of a sine wave. The spectrum analyzer can show the individual frequency components that make up a complex signal. However it does not provide phase information, only magnitude information. Modern swept-tuned analyzers (superheterodyne analyzers, in particular) are precision devices that can make a wide variety of measurements. However, they are primarily used to measure steady-state, or repetitive, signals because they can't evaluate all frequencies in a given span simultaneously. The ability to evaluate all frequencies simultaneously is possible with only the real-time analyzers. - REAL-TIME SPECTRUM ANALYZERS: A FFT SPECTRUM ANALYZER computes the discrete Fourier transform (DFT), a mathematical process that transforms a waveform into the components of its frequency spectrum, of the input signal. The Fourier or FFT spectrum analyzer is another real-time spectrum analyzer implementation. The Fourier analyzer uses digital signal processing to sample the input signal and convert it to the frequency domain. This conversion is done using the Fast Fourier Transform (FFT). The FFT is an implementation of the Discrete Fourier Transform, the math algorithm used for transforming data from the time domain to the frequency domain. Another type of real-time spectrum analyzers, namely the PARALLEL FILTER ANALYZERS combine several bandpass filters, each with a different bandpass frequency. Each filter remains connected to the input at all times. After an initial settling time, the parallel-filter analyzer can instantaneously detect and display all signals within the analyzer's measurement range. Therefore, the parallel-filter analyzer provides real-time signal analysis. Parallel-filter analyzer is fast, it measures transient and time-variant signals. However, the frequency resolution of a parallel-filter analyzer is much lower than most swept-tuned analyzers, because the resolution is determined by the width of the bandpass filters. To get fine resolution over a large frequency range, you would need many many individual filters, making it costly and complex. This is why most parallel-filter analyzers, except the simplest ones in the market are expensive. - VECTOR SIGNAL ANALYSIS (VSA) : In the past, swept-tuned and superheterodyne spectrum analyzers covered wide frequency ranges from audio, thru microwave, to millimeter frequencies. In addition, digital signal processing (DSP) intensive fast Fourier transform (FFT) analyzers provided high-resolution spectrum and network analysis, but were limited to low frequencies due to the limits of analog-to-digital conversion and signal processing technologies. Today's wide-bandwidth, vector-modulated, time-varying signals benefit greatly from the capabilities of FFT analysis and other DSP techniques. Vector signal analyzers combine superheterodyne technology with high speed ADC's and other DSP technologies to offer fast high-resolution spectrum measurements, demodulation, and advanced time-domain analysis. The VSA is especially useful for characterizing complex signals such as burst, transient, or modulated signals used in communications, video, broadcast, sonar and ultrasound imaging applications. According to form factors, spectrum analyzers are grouped as benchtop, portable, handheld and networked. Benchtop models are useful for applications where the spectrum analyzer can be plugged into AC power,such as in a lab environment or manufacturing area. Bench top spectrum analyzers generally offer better performance and specifications than the portable or handheld versions. However they are generally heavier and have several fans for cooling. Some BENCHTOP SPECTRUM ANALYZERS offer optional battery packs, allowing them to be used away from a mains outlet. Those are referred to as a PORTABLE SPECTRUM ANALYZERS. Portable models are useful for applications where the spectrum analyzer needs to be taken outside to make measurements or carried while in use. A good portable spectrum analyzer is expected to offer optional battery-powered operation to allow the user to work in places without power outlets, a clearly viewable display to allow the screen to be read in bright sunlight, darkness or dusty conditions, light weight. HANDHELD SPECTRUM ANALYZERS are useful for applications where the spectrum analyzer needs to be very light and small. Handheld analyzers offer a limited capability as compared to larger systems. Advantages of handheld spectrum analyzers are however their very low power consumption, battery-powered operation while in the field to allow the user to move freely outside, very small size & light weight. Finally, NETWORKED SPECTRUM ANALYZERS do not include a display and they are designed to enable a new class of geographically-distributed spectrum monitoring and analysis applications. The key attribute is the ability to connect the analyzer to a network and monitor such devices across a network. While many spectrum analyzers have an Ethernet port for control, they typically lack efficient data transfer mechanisms and are too bulky and/or expensive to be deployed in such a distributed manner. The distributed nature of such devices enable geo-location of transmitters, spectrum monitoring for dynamic spectrum access and many other such applications. These devices are able to synchronize data captures across a network of analyzers and enable Network-efficient data transfer for a low cost. A PROTOCOL ANALYZER is a tool incorporating hardware and/or software used to capture and analyze signals and data traffic over a communication channel. Protocol analyzers are mostly used for measuring performance and troubleshooting. They connect to the network to calculate key performance indicators to monitor the network and speed-up troubleshooting activities. A NETWORK PROTOCOL ANALYZER is a vital part of a network administrator's toolkit. Network protocol analysis is used to monitor the health of network communications. To find out why a network device is functioning in a certain way, administrators use a protocol analyzer to sniff the traffic and expose the data and protocols that pass along the wire. Network protocol analyzers are used to - Troubleshoot hard-to-solve problems - Detect and identify malicious software / malware. Work with an Intrusion Detection System or a honeypot. - Gather information, such as baseline traffic patterns and network-utilization metrics - Identify unused protocols so that you can remove them from the network - Generate traffic for penetration testing - Eavesdrop on traffic (e.g., locate unauthorized Instant Messaging traffic or wireless Access Points) A TIME-DOMAIN REFLECTOMETER (TDR) is an instrument that uses time-domain reflectometry to characterize and locate faults in metallic cables such as twisted pair wires and coaxial cables, connectors, printed circuit boards,….etc. Time-Domain Reflectometers measure reflections along a conductor. In order to measure them, the TDR transmits an incident signal onto the conductor and looks at its reflections. If the conductor is of a uniform impedance and is properly terminated, then there will be no reflections and the remaining incident signal will be absorbed at the far end by the termination. However, if there is an impedance variation somewhere, then some of the incident signal will be reflected back to the source. The reflections will have the same shape as the incident signal, but their sign and magnitude depend on the change in impedance level. If there is a step increase in the impedance, then the reflection will have the same sign as the incident signal and if there is a step decrease in impedance, the reflection will have the opposite sign. The reflections are measured at the output/input of the Time-Domain Reflectometer and displayed as a function of time. Alternatively, the display can show the transmission and reflections as a function of cable length because the speed of signal propagation is almost constant for a given transmission medium. TDRs can be used to analyze cable impedances and lengths, connector and splice losses and locations. TDR impedance measurements provide designers the opportunity to perform signal integrity analysis of system interconnects and accurately predict the digital system performance. TDR measurements are widely used in board characterization work. A circuit board designer can determine the characteristic impedances of board traces, compute accurate models for board components, and predict board performance more accurately. There are many other areas of application for time-domain reflectometers. A SEMICONDUCTOR CURVE TRACER is a test equipment used to analyze the characteristics of discrete semiconductor devices such as diodes, transistors, and thyristors. The instrument is based on oscilloscope, but contains also voltage and current sources that can be used to stimulate the device under test. A swept voltage is applied to two terminals of the device under test, and the amount of current that the device permits to flow at each voltage is measured. A graph called V-I (voltage versus current) is displayed on the oscilloscope screen. Configuration includes the maximum voltage applied, the polarity of the voltage applied (including the automatic application of both positive and negative polarities), and the resistance inserted in series with the device. For two terminal devices like diodes, this is sufficient to fully characterize the device. The curve tracer can display all of the interesting parameters such as the diode's forward voltage, reverse leakage current, reverse breakdown voltage,…etc. Three-terminal devices such as transistors and FETs also use a connection to the control terminal of the device being tested such as the Base or Gate terminal. For transistors and other current based devices, the base or other control terminal current is stepped. For field effect transistors (FETs), a stepped voltage is used instead of a stepped current. By sweeping the voltage through the configured range of main terminal voltages, for each voltage step of the control signal, a group of V-I curves is generated automatically. This group of curves makes it very easy to determine the gain of a transistor, or the trigger voltage of a thyristor or TRIAC. Modern semiconductor curve tracers offer many attractive features such as intuitive Windows based user interfaces, I-V, C-V and pulse generation, and pulse I-V, application libraries included for every technology…etc. PHASE ROTATION TESTER / INDICATOR: These are compact and rugged test instruments to identify phase sequence on three-phase systems and open/de-energized phases. They are ideal for installing rotating machinery, motors and for checking generator output. Among the applications are the identification of proper phase sequences, detection of missing wire phases, determination of proper connections for rotating machinery, detection of live circuits. A FREQUENCY COUNTER is a test instrument that is used for measuring frequency. Frequency counters generally use a counter which accumulates the number of events occurring within a specific period of time. If the event to be counted is in electronic form, simple interfacing to the instrument is all that is needed. Signals of higher complexity may need some conditioning to make them suitable for counting. Most frequency counters have some form of amplifier, filtering and shaping circuitry at the input. Digital signal processing, sensitivity control and hysteresis are other techniques to improve performance. Other types of periodic events that are not inherently electronic in nature will need to be converted using transducers. RF frequency counters operate on the same principles as lower frequency counters. They have more range before overflow. For very high microwave frequencies, many designs use a high-speed prescaler to bring the signal frequency down to a point where normal digital circuitry can operate. Microwave frequency counters can measure frequencies up to almost 100 GHz. Above these high frequencies the signal to be measured is combined in a mixer with the signal from a local oscillator, producing a signal at the difference frequency, which is low enough for direct measurement. Popular interfaces on frequency counters are RS232, USB, GPIB and Ethernet similar to other modern instruments. In addition to sending measurement results, a counter can notify the user when user-defined measurement limits are exceeded. For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE