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How to Become a Supplier for Engineering Integrator and Custom Manufacturer AGS-TECH Inc. of Albuquerque - NM - USA Become a Supplier for Engineering Integrator and Custom Manufacturer AGS-TECH Inc. Want to become a global supplier for engineering integrator and custom manufacturer AGS-TECH Inc. ? To become a potential supplier for us: 1.) Please click here to visit our supplier platform: https://www.agsoutsourcing.com/online-supplier-application-platfor 2.) On this form, please fill out as much detail as possible. Once your data is entered into our system it is filtered, screened and evaluated. Depending on keywords and input content, it is categorized, rated and evaluated for further processing. If your company is found appropriate and suitable for our needs, we will then send you RFQs (Request for Quote) and RFPs (Request for Proposal). Since we are a custom manufacturer and engineering integrator, of particular value to us are global manufacturers in areas where the most shortage of skill is present. If you are a supplier for the following, we encourage you to register your company to our database via the above link: -Custom manufacturer of low to medium volume plastic moulds (100 to 500 pieces per order). -Custom manufacturer of low to medium volume metal castings and CNC machined parts (100 to 500 pieces per order). -Engineering integrator and custom manufacturer that has the capability to be a supplier of both metal and polymer parts and that can accept parts assembly as part of a contract. -Small to intermediate volume custom manufacturer of electric cable assemblies and wire harness (100 to 500 pieces per order). -Engineering integrator with capability to integrate custom hardware with new software. -Supplier of test and metrology equipment that is new to us and not to be found in our brochures. -Engineering integrator and custom manufacturer who can complement or contribute to our product lines in unique ways. -Engineering integrator and custom manufacturer of micromanufactured and mesomanufactured products such as miniature custom sensors and actuators, miniature electronic and optoelectronic devices. -Supplier of smaller quantity custom coatings. As an engineering integrator and custom manufacturer we bring together parts, subassemblies and products from the best plants and assemble them together, package and label them according to requirements and ship to our customers. Integration is the process of bringing together the components into one system and ensuring that the subsystems function together as a system. To keep our spot as a distinguished engineering integrator and custom manufacturer, we have to keep working with the finest suppliers and assure that they do have valid and up-to-date quality related certifications obtained from well established certification bodies. An ISO9001, TS16949, QS9000, AS9001, ISO13485 are among the first requirements for any custom manufacturer of products and/or provider of engineering services to us. In addition to one of these certifications, any custom manufacturer or engineering services provider will need to present further evidence of being capable to contribute successfully to our engineering and integration efforts by showing examples of products for which a CE or UL mark was obtained, evidence of having successfully sold products meeting international standards such as IEEE, IEC, ASTM, DIN, MIL-SPEC…etc. to customers in the US, Canadian, Australian, EU and Japanese markets. If you are an engineering integrator and custom manufacturer, you are especially important for us because of your ability to integrate at least some of the components at your facility before shipping them to us. Being a globally recognized engineering integrator and custom manufacturer, logistics is a key element in our business. We must keep being able to ship fast, damage-free and economically. Therefore having presence in one of the logistically key locations is very important for every engineering integrator and custom manufacturer willing to collaborate and partner with us. Logistics is a complex issue we constantly work on and keep improving. As an example, sometimes the best option is to ship a product as individual components and parts from one or several plants to an assembly plant that is in the vicinity of our customer. This saves on shipping cost because the final product may be large and bulky and the final assembly plant being close to customer will keep shipping prices to a minimum and at the same time be a safer option where the most value is put into the product that is shipped only a short distance to its final destination. PREVIOUS PAGE

Microfluidic Devices - Microfluidics - Micropumps - Microvalves - Lab-on-a-Chip Systems - Microhydraulic - Micropneumatic - AGS-TECH Inc.- New Mexico - USA Microfluidic Devices Manufacturing Our MICROFLUIDIC DEVICES MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. We have the capability to design microfluidic devices for you and offer prototyping & micromanufacturing custom tailored for your applications. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In MICROFLUIDICS we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. Some major applications of microfluidic devices and systems are: - Laboratories on a chip - Drug screening - Glucose tests - Chemical microreactor - Microprocessor cooling - Micro fuel cells - Protein crystallization - Rapid drugs change, manipulation of single cells - Single cell studies - Tunable optofluidic microlens arrays - Microhydraulic & micropneumatic systems (liquid pumps, gas valves, mixing systems…etc) - Biochip early warning systems - Detection of chemical species - Bioanalytical applications - On-chip DNA and protein analysis - Nozzle spray devices - Quartz flow cells for detection of bacteria - Dual or multiple droplet generation chips Our design engineers have many years of experience in modeling, designing and testing of microfluidic devices for a range of applications. Our design expertise in the area of microfluidics includes: • Low temperature thermal bonding process for microfluidics • Wet etching of microchannels with etch depths of nm to mm deep in glass and borosilicate. • Grinding and polishing for a wide range of substrate thicknesses from as thin as 100 microns to over 40 mm. • Ability to fuse multiple layers to create complex microfluidic devices. • Drilling, dicing and ultrasonic machining techniques suitable for microfluidic devices • Innovative dicing techniques with precise edge connection for interconnectibility of microfluidic devices • Accurate alignment • Variety of deposited coatings, microfluidic chips can be sputtered with metals such as platinum, gold, copper and titanium to create a wide range of features, such as embedded RTDs, sensors, mirrors and electrodes. Besides our custom fabrication capabilities we have hundreds of off-the-shelf standard microfluidic chip designs available with hydrophobic, hydrophilic or fluorinated coatings and a wide range of channel sizes (100 nanometers to 1mm), inputs, outputs, different geometries such as circular cross, pillar arrays and micromixer. Our microfluidic devices offer excellent chemical resistance and optical transparency, high temperature stability up to 500 Centigrade, high pressure range up to 300 Bar. Some popular microfluidic off-shelf chips are: MICROFLUIDIC DROPLET CHIPS: Glass Droplet Chips with different junction geometries, channel sizes and surface properties are available. Microfluidic droplet chips have excellent optical transparency for clear imaging. Advanced hydrophobic coating treatments enable water-in-oil droplets to be generated as well as oil-in-water droplets formed in the untreated chips. MICROFLUIDIC MIXER CHIPS: Enabling mixing of two fluid streams within miliseconds, the micromixer chips benefit a wide range of applications including reaction kinetics, sample dilution, rapid crystallisation and nanoparticle synthesis. SINGLE MICROFLUIDIC CHANNEL CHIPS: AGS-TECH Inc. offers single channel microfluidic chips with one inlet and one outlet for several applications. Two different chip dimensions are available off-the-shelf (66x33mm and 45x15mm). We also stock compatible chip holders. CROSS MICROFLUIDIC CHANNEL CHIPS: We also offer microfluidic chips with two simple channels crossing each other. Ideal for droplet generation and flow focusing applications. Standard chip dimensions are 45x15mm and we have a compatible chip holder. T-JUNCTION CHIPS: The T-Junction is a basic geometry used in microfluidics for liquid contacting and droplet formation. These microfluidic chips are available in a number of forms including thin layer, quartz, platinum coated, hydrophobic and hydrophilic versions. Y-JUNCTION CHIPS: These are glass microfluidic devices designed for a wide range of applications including liquid-liquid contacting and diffusion studies. These microfluidic devices feature two connected Y-Junctions and two straight channels for observation of microchannel flow. MICROFLUIDIC REACTOR CHIPS: Microreactor chips are compact glass microfluidic devices designed for rapid mixing and reaction of two or three liquid reagent streams. WELLPLATE CHIPS: This is a tool for analytical research and clinical diagnostic laboratories. Wellplate chips are for holding small droplets of reagents or groups of cells in nano-litre wells. MEMBRANE DEVICES: These membrane devices are designed to be used for liquid-liquid separation, contacting or extraction, cross-flow filtration and surface chemistry reactions. These devices benefit from a low dead volume and a disposable membrane. MICROFLUIDIC RESEALABLE CHIPS: Designed for microfluidic chips that can be opened and resealed, the resealable chips enable up to eight fluidic and eight electrical connections and deposition of reagents, sensors or cells onto the channel surface. Some applications are cell culture and analysis, impedance detection and biosensor testing. POROUS MEDIA CHIPS: This is a glass microfluidic device designed for statistical modeling of a complex porous sandstone rock structure. Among the applications of this microfluidic chip are research in earth science & engineering, petrochemical industry, environmental testing, groundwater analysis. CAPILLARY ELECTROPHORESIS CHIP (CE chip): We offer capillary electrophoresis chips with and without integrated electrodes for DNA analysis and separation of biomolecules. Capillary electrophoresis chips are compatible with encapsulates of dimensions 45x15mm. We have CE chips one with classical crossing and one with T-crossing. All needed accessories such as chip holders, connectors are available. Besides microfluidic chips, AGS-TECH offers a wide range of pumps, tubing, microfluidic systems, connectors and accessories. Some off-shelf microfluidic systems are: MICROFLUIDIC DROPLET STARTER SYSTEMS: Syringe-based droplet starter system provides a complete solution for the generation of monodispersed droplets that range from 10 to 250 micron diameter. Operating over wide flow ranges between 0.1 microliters/min to 10 microliters/min, the chemically resistant microfluidics system is ideal for initial concept work and experimentation. The pressure-based droplet starter system on the other hand is a tool for preliminary work in microfluidics. The system provides a complete solution containing all needed pumps, connectors and microfluidic chips enabling the production of highly monodispersed droplets ranging from 10 to 150 microns. Operating over a wide pressure range between 0 to 10 bars, this system is chemically resistant and its modular design makes it easily expandable for future applications. By providing a stable liquid flow, this modular toolkit eliminates dead volume and sample waste to effectively reduce associated reagent costs. This microfluidic system offers the ability to provide a quick liquid changeover. A lockable pressure chamber and an innovative 3-way chamber lid allow simultaneous pumping of up to three liquids. ADVANCED MICROFLUIDIC DROPLET SYSTEM: A modular microfluidic system that enables production of extremely consistent sized droplets, particles, emulsions, and bubbles. The advanced microfluidic droplet system uses flow focusing technology in a microfluidic chip with a pulseless liquid flow to produce monodispersed droplets between nanometers and hundreds of microns size. Well suited for encapsulation of cells, producing beads, controlling nanoparticle formation etc. Droplet size, flow rates, temperatures, mixing junctions, surface properties and order of additions can be quickly varied for process optimization. The microfluidic system contains all the parts required including pumps, flow sensors, chips, connectors and automation components. Accessories are also available, including optical systems, larger reservoirs and reagent kits. Some microfluidics applications for this system are encapsulation of cells, DNA and magnetic beads for research and analysis, drug delivery via polymer particles and drug formulation, precision manufacturing of emulsions and foams for food and cosmetics, production of paints and polymer particles, microfluidics research on droplets, emulsions, bubbles and particles. MICROFLUIDIC SMALL DROPLET SYSTEM: An ideal system for producing and analyzing microemulsions that offer increased stability, a higher interfacial area and the capacity to solubilize both aqueous and oil-soluble compounds. Small droplet microfluidic chips allow the generation of highly monodispersed micro-droplets ranging from 5 to 30 microns. MICROFLUIDIC PARALLEL DROPLET SYSTEM: A high throughput system for the production of up to 30,000 monodispersed microdroplets per second ranging from 20 to 60 microns. The microfluidic parallel droplet system allows users to create stable water-in-oil or oil-in-water droplets facilitating a broad range of applications in drug and food production. MICROFLUIDIC DROPLET COLLECTION SYSTEM: This system is well suited for the generation, collection and analysis of monodispersed emulsions. The microfluidic droplet collection system features the droplet collection module that allows emulsions to be collected without flow disruption or droplet coalescence. The microfluidic droplet size can be accurately adjusted and quickly changed enabling full control over emulsion characteristics. MICROFLUIDIC MICROMIXER SYSTEM: This system is made of a microfluidic device, precision pumping, microfluidic elements and software to obtain excellent mixing. A lamination-based compact micromixer glass microfluidic device allows rapid mixing of two or three fluid streams in each of the two independent mixing geometries. Perfect mixing can be achieved with this microfluidic device at both high and low flow rate ratios. The microfluidic device, and its surrounding components offer excellent chemical stability, high visibility for optics, and good optical transmission. The micromixer system performs exceptionally fast, works in continuous flow mode and can completely mix two or three fluid streams within milliseconds. Some applications of this microfluidic mixing device are reaction kinetics, sample dilution, improved reaction selectivity, rapid crystallization and nanoparticle synthesis, cell activation, enzyme reactions and DNA hybridization. MICROFLUIDIC DROPLET-ON-DEMAND SYSTEM: This is a compact and portable droplet-on-demand microfluidic system to generate droplets of up to 24 different samples and store up to 1000 droplets with sizes down to 25 nanoliters. The microfluidic system offers excellent control of droplet size and frequency as well as allowing the use of multiple reagents to create complex assays quickly and easily. Microfluidic droplets can be stored, thermally cycled, merged or split from nanoliter to picoliter droplets. Some applications are, generation of screening libraries, cell encapsulation, encapsulation of organisms, automation of ELISA tests, preparation of concentration gradients, combinatorial chemistry, cell assays. NANOPARTICLE SYNTHESIS SYSTEM: Nanoparticles are smaller than 100nm and benefit a range of applications such as the synthesis of silicon based fluorescent nanoparticles (quantum dots) to label biomolecules for diagnostic purposes, drug delivery, and cellular imaging. Microfluidics technology is ideal for nanoparticle synthesis. Reducing reagent consumption, it allows tighter particle size distributions, improved control over reaction times and temperatures, as well as better mixing efficiency. MICROFLUIDIC DROPLET MANUFACTURE SYSTEM: High-throughput microfluidic system that facilitates production of up to a tonne of highly monodispersed droplets, particles or emulsion a month. This modular, scalable and highly flexible microfluidic system allows up to 10 modules to be assembled in parallel, enabling identical conditions for up to 70 microfluidic chip droplet junctions. Mass-production of highly monodispersed microfluidic droplets ranging between 20 microns and 150 microns is possible that can be flowed directly off the chips, or into tubes. Applications include particle production - PLGA, gelatine, alginate, polystyrene, agarose, drug delivery in creams, aerosols, bulk precision manufacturing of emulsions and foams in food, cosmetics, paint industries, nanoparticle synthesis, parallel micromixing and micro-reactions. PRESSURE-DRIVEN MICROFLUIDIC FLOW CONTROL SYSTEM: The closed-loop smart flow control provides control of flow rates from nanoliters/min to mililiters/min, at pressures from 10 bar down to vacuum. A flow rate sensor connected in-line between the pump and the microfluidic device facilitates users to enter a flow rate target directly on the pump without the need for a PC. Users will get smoothness of pressure and repeatability of volumetric flow in their microfluidic devices. Systems can be extended to multiple pumps, which will all control flow rate independently. To operate in flow control mode, the flow rate sensor needs to be connected to the pump using either the sensor display or sensor interface. CLICK Product Finder-Locator Service PREVIOUS PAGE

Micro-Optics, Micro-Optical, Microoptical, Wafer Level Optics, Gratings, Fresnel Lenses, Lens Array, Micromirrors, Micro Reflectors, Collimators, Aspheres, LED Micro-Optics Manufacturing One of the fields in microfabrication we are involved in is MICRO-OPTICS MANUFACTURING. Micro-optics allows the manipulation of light and the management of photons with micron and sub-micron scale structures and components. Some applications of MICRO-OPTICAL COMPONENTS and SUBSYSTEMS are: Information technology: In micro-displays, micro-projectors, optical data storage, micro-cameras, scanners, printers, copiers…etc. Biomedicine: Minimally-invasive/point of care diagnostics, treatment monitoring, micro-imaging sensors, retinal implants, micro-endoscopes. Lighting: Systems based on LEDs and other efficient light sources Safety and Security Systems: Infrared night vision systems for automotive applications, optical fingerprint sensors, retinal scanners. Optical Communication & Telecommunication: In photonic switches, passive fiber optic components, optical amplifiers, mainframe and personal computer interconnect systems Smart structures: In optical fiber-based sensing systems and much more The types of micro-optical components and subsystems we manufacture and supply are: - Wafer Level Optics - Refractive Optics - Diffractive Optics - Filters - Gratings - Computer Generated Holograms - Hybrid Microoptical Components - Infrared Micro-Optics - Polymer Micro-Optics - Optical MEMS - Monolithically and Discretely Integrated Micro-Optic Systems Some of our most widely used micro-optical products are: - Bi-convex and plano-convex lenses - Achromat lenses - Ball lenses - Vortex Lenses - Fresnel Lenses - Multifocal Lens - Cylindrical Lenses - Graded Index (GRIN) Lenses - Micro-Optical Prisms - Aspheres - Arrays of Aspheres - Collimators - Micro-Lens Arrays - Diffraction Gratings - Wire-Grid Polarizers - Micro-Optic Digital Filters - Pulse Compression Gratings - LED Modules - Beam Shapers - Beam Sampler - Ring Generator - Micro-Optical Homogenizers / Diffusers - Multispot Beam Splitters - Dual Wavelength Beam Combiners - Micro-Optical Interconnects - Intelligent Micro-Optics Systems - Imaging Microlenses - Micromirrors - Micro Reflectors - Micro-Optical Windows - Dielectric Mask - Iris Diaphragms Let us provide you some basic information about these micro-optical products and their applications: BALL LENSES: Ball lenses are completely spherical micro-optic lenses most commonly used to couple light in and out of fibers. We supply a range of micro-optic stock ball lenses and can manufacture also to your own specifications. Our stock ball lenses from quartz have excellent UV and IR transmission between 185nm to >2000nm, and our sapphire lenses have a higher refractive index, allowing a very short focal length for excellent fiber coupling. Micro-optical ball lenses from other materials and diameters are available. Besides fiber coupling applications, micro-optical ball lenses are used as objective lenses in endoscopy, laser measurement systems and bar-code scanning. On the other hand, micro-optic half ball lenses offer uniform dispersion of light and are widely used in LED displays and traffic lights. MICRO-OPTICAL ASPHERES and ARRAYS: Aspheric surfaces have a non-spherical profile. Use of aspheres can reduce the number of optics required to reach a desired optical performance. Popular applications for micro-optical lens arrays with spherical or aspherical curvature are imaging and illumination and the effective collimation of laser light. Substitution of a single aspheric microlens array for a complex multilens system results not only in smaller size, lighter weight, compact geometry, and lower cost of an optical system, but also in significant improvement of its optical performance such as better imaging quality. However, the fabrication of aspheric microlenses and microlens arrays is challenging, because conventional technologies used for macro-sized aspheres like single-point diamond milling and thermal reflow are not capable of defining a complicated micro-optic lens profile in an area as small as several to tens of micrometers. We possess the know-how of producing such micro-optical structures using advanced techniques such as femtosecond lasers. MICRO-OPTICAL ACHROMAT LENSES: These lenses are ideal for applications requiring color correction, while aspheric lenses are designed to correct spherical aberration. An achromatic lens or achromat is a lens that is designed to limit the effects of chromatic and spherical aberration. Micro-optical achromatic lenses make corrections to bring two wavelengths (such as red and blue colors) into focus on the same plane. CYLINDRICAL LENSES: These lenses focus light into a line instead of a point, as a spherical lens would. The curved face or faces of a cylindrical lens are sections of a cylinder, and focus the image passing through it into a line parallel to the intersection of the surface of the lens and a plane tangent to it. The cylindrical lens compresses the image in the direction perpendicular to this line, and leaves it unaltered in the direction parallel to it (in the tangent plane). Tiny micro-optical versions are available which are suitable for use in micro optical environments, requiring compact-size fiber optical components, laser systems, and micro-optical devices. MICRO-OPTICAL WINDOWS and FLATS: Milimetric micro-optical windows meeting tight tolerance requirements are available. We can custom manufacture them to your specifications from any of the optical grade glasses. We offer a variety of micro-optical windows made of different materials such as fused silica, BK7, sapphire, zinc sulphide….etc. with transmission from UV to middle IR range. IMAGING MICROLENSES: Microlenses are small lenses, generally with a diameter less than a millimetre (mm) and as small as 10 micrometres. Imaging Lenses are used to view objects in imaging systems. Imaging Lenses are used in imaging systems to focus an image of an examined object onto a camera sensor. Depending on the lens, imaging lenses can be used to remove parallax or perspective error. They can also offer adjustable magnifications, field of views, and focal lengths. These lenses allow an object to be viewed in several ways to illustrate certain features or characteristics that may be desirable in certain applications. MICROMIRRORS: Micromirror devices are based on microscopically small mirrors. The mirrors are Microelectromechanical systems (MEMS). The states of these micro-optical devices are controlled by applying a voltage between the two electrodes around the mirror arrays. Digital micromirror devices are used in video projectors and optics and micromirror devices are used for light deflection and control. MICRO-OPTIC COLLIMATORS & COLLIMATOR ARRAYS: A variety of micro-optical collimators are available off-the-shelf. Micro-optical small beam collimators for demanding applications are produced using laser fusion technology. The fiber end is directly fused to the optical center of the lens, thereby eliminated epoxy within the optical path. The micro-optic collimator lens surface is then laser polished to within a millionth of an inch of the ideal shape. Small Beam collimators produce collimated beams with beam waists under a millimeter. Micro-optical small beam collimators are typically used at 1064, 1310 or 1550 nm wavelengths. GRIN lens based micro-optic collimators are also available as well as collimator array and collimator fiber array assemblies. MICRO-OPTICAL FRESNEL LENSES: A Fresnel lens is a type of compact lens designed to allow the construction of lenses of large aperture and short focal length without the mass and volume of material that would be required by a lens of conventional design. A Fresnel lens can be made much thinner than a comparable conventional lens, sometimes taking the form of a flat sheet. A Fresnel lens can capture more oblique light from a light source, thus allowing the light to be visible over greater distances. The Fresnel lens reduces the amount of material required compared to a conventional lens by dividing the lens into a set of concentric annular sections. In each section, the overall thickness is decreased compared to an equivalent simple lens. This can be viewed as dividing the continuous surface of a standard lens into a set of surfaces of the same curvature, with stepwise discontinuities between them. Micro-optic Fresnel lenses focus light by refraction in a set of concentric curved surfaces. These lenses can be made very thin and lightweight. Micro-optical Fresnel lenses offer opportunities in optics for highresolution Xray applications, throughwafer optical interconnection capabilities. We have a number of fabrication methods including micromolding and micromachining to manufacture micro-optical Fresnel lenses and arrays specifically for your applications. We can design a positive Fresnel lens as a collimator, collector or with two finite conjugates. Micro-Optical Fresnel lenses are usually corrected for spherical aberrations. Micro-optic positive lenses can be metalized for use as a second surface reflector and negative lenses can be metalized for use as a first surface reflector. MICRO-OPTICAL PRISMS: Our line of precision micro-optics includes standard coated and uncoated micro prisms. They are suitable for use with laser sources and imaging applications. Our micro-optical prisms have submilimeter dimensions. Our coated micro-optical prisms can also be used as mirror reflectors with respect to incoming light. Uncoated prisms act as mirrors for light incident on one of the short sides since incident light is totally internally reflected at the hypotenuse. Examples of our micro-optical prism capabilities include right angle prisms, beamsplitter cube assemblies, Amici prisms, K-prisms, Dove prisms, Roof prisms, Cornercubes, Pentaprisms, Rhomboid prisms, Bauernfeind prisms, Dispersing prisms, Reflecting prisms. We also offer light guiding and de-glaring optical micro-prisms made from acrylic, polycarbonate and other plastic materials by hot embossing manufacturing process for applications in lamps and luminaries, LEDs. They are highly efficient, strong light guiding precise prism surfaces, support luminaries to fulfill office regulations for de-glaring. Additional customized prism structures are possible. Microprisms and microprism arrays on wafer level are also possible using microfabrication techniques. DIFFRACTION GRATINGS: We offer design and manufacture of diffractive micro-optical elements (DOEs). A diffraction grating is an optical component with a periodic structure, which splits and diffracts light into several beams travelling in different directions. The directions of these beams depend on the spacing of the grating and the wavelength of the light so that the grating acts as the dispersive element. This makes grating a suitable element to be used in monochromators and spectrometers. Using wafer-based lithography, we produce diffractive micro-optical elements with exceptional thermal, mechanical and optical performance characteristics. Wafer-level processing of micro-optics provides excellent manufacturing repeatability and economic output. Some of the available materials for diffractive micro-optical elements are crystal-quartz, fused-silica, glass, silicon and synthetic substrates. Diffraction gratings are useful in applications such as spectral analysis / spectroscopy, MUX/DEMUX/DWDM, precision motion control such as in optical encoders. Lithography techniques make the fabrication of precision micro-optical gratings with tightly-controlled groove spacings possible. AGS-TECH offers both custom and stock designs. VORTEX LENSES: In laser applications there is a need to convert a Gaussian beam to a donut-shaped energy ring. This is achieved using Vortex lenses. Some applications are in lithography and high-resolution microscopy. Polymer on glass Vortex phase plates are also available. MICRO-OPTICAL HOMOGENIZERS / DIFFUSERS: A variety of technologies are used to fabricate our micro-optical homogenizers and diffusers, including embossing, engineered diffuser films, etched diffusers, HiLAM diffusers. Laser Speckle is the optical phenomena resulting from the random interference of coherent light. This phenomenon is utilized to measure the Modulation Transfer Function (MTF) of detector arrays. Microlens diffusers are shown to be efficient micro-optic devices for speckle generation. BEAM SHAPERS: A micro-optic beam shaper is an optic or a set of optics that transforms both the intensity distribution and the spatial shape of a laser beam to something more desirable for a given application. Frequently, a Gaussian-like or non-uniform laser beam is transformed to a flat top beam. Beam shaper micro-optics are used to shape and manipulate single mode and multi-mode laser beams. Our beam shaper micro-optics provide circular, square, rectilinear, hexagonal or line shapes, and homogenize the beam (flat top) or provide a custom intensity pattern according to the requirements of the application. Refractive, diffractive and reflective micro-optical elements for laser beam shaping and homogenizing have been manufactured. Multifunctional micro-optical elements are used for shaping arbitrary laser beam profiles into a variety of geometries like, a homogeneous spot array or line pattern, a laser light sheet or flat-top intensity profiles. Fine beam application examples are cutting and keyhole welding. Broad beam application examples are conduction welding, brazing, soldering, heat treatment, thin film ablation, laser peening. PULSE COMPRESSION GRATINGS: Pulse compression is a useful technique that takes advantage of the relationship between pulse duration and spectral width of a pulse. This enables the amplification of laser pulses above the normal damage threshold limits imposed by the optical components in the laser system. There are linear and nonlinear techniques for reducing the durations of optical pulses. There is variety of methods for temporally compressing / shortening optical pulses, i.e., reducing the pulse duration. These methods generally start in the picosecond or femtosecond region, i.e. already in the regime of ultrashort pulses. MULTISPOT BEAM SPLITTERS: Beam splitting by means of diffractive elements is desirable when one element is required to produce several beams or when very exact optical power separation is required. Precise positioning can also be achieved, for example, to create holes at clearly defined and accurate distances. We have Multi-Spot Elements, Beam Sampler Elements, Multi-Focus Element. Using a diffractive element, collimated incident beams are split into several beams. These optical beams have equal intensity and equal angle to one another. We have both one-dimensional and two-dimensional elements. 1D elements split beams along a straight line whereas 2D elements produce beams arranged in a matrix of, for example, 2 x 2 or 3 x 3 spots and elements with spots that are arranged hexagonally. Micro-optical versions are available. BEAM SAMPLER ELEMENTS: These elements are gratings that are used for inline monitoring of high power lasers. The ± first diffraction order can be used for beam measurements. Their intensity is significantly lower than that of the main beam and can be custom designed. Higher diffraction orders can also be used for measurement with even lower intensity. Variations in intensity and changes in the beam profile of high power lasers can be reliably monitored inline using this method. MULTI-FOCUS ELEMENTS: With this diffractive element several focal points can be created along the optical axis. These optical elements are used in sensors, ophthalmology, material processing. Micro-optical versions are available. MICRO-OPTICAL INTERCONNECTS: Optical interconnects have been replacing electrical copper wires at the different levels in the interconnect hierarchy. One of the possibilities to bring the advantages of micro-optics telecommunications to the computer backplane, the printed circuit board, the inter-chip and on-chip interconnect level, is to use free-space micro-optical interconnect modules made of plastic. These modules are capable of carrying high aggregate communication bandwidth through thousands of point-to-point optical links on a footprint of a square centimeter. Contact us for off-shelf as well as custom tailored micro-optical interconnects for computer backplane, the printed circuit board, the inter-chip and on-chip interconnect levels. INTELLIGENT MICRO-OPTICS SYSTEMS: Intelligent micro-optic light modules are used in smart phones and smart devices for LED flash applications, in optical interconnects for transporting data in supercomputers and telecommunications equipment, as miniaturized solutions for near-infrared beam shaping, detection in gaming applications and for supporting gesture control in natural user interfaces. Sensing opto-electronic modules are used for a number of product applications such as ambient light and proximity sensors in smart phones. Intelligent imaging micro-optic systems are used for primary and front-facing cameras. We offer also customized intelligent micro-optical systems with high performance and manufacturability. LED MODULES: You can find our LED chips, dies and modules on our page Lighting & Illumination Components Manufacturing by clicking here. WIRE-GRID POLARIZERS: These consist of a regular array of fine parallel metallic wires, placed in a plane perpendicular to the incident beam. The polarization direction is perpendicular to the wires. Patterned polarizers have applications in polarimetry, interferometry, 3D displays, and optical data storage. Wire-grid polarizers are extensively used in infrared applications. On the other hand micropatterned wire-grid polarizers have limited spatial resolution and poor performance at visible wavelengths, are susceptible to defects and cannot be easily extended to non-linear polarizations. Pixelated polarizers use an array of micro-patterned nanowire grids. The pixelated micro-optical polarizers can be aligned with cameras, plane arrays, interferometers, and microbolometers without the need for mechanical polarizer switches. Vibrant images distinguishing between multiple polarizations across the visible and IR wavelengths can be captured simultaneously in real-time enabling fast, high resolution images. Pixelated micro-optical polarizers also enable clear 2D and 3D images even in low-light conditions. We offer patterned polarizers for two, three and four-state imaging devices. Micro-optical versions are available. GRADED INDEX (GRIN) LENSES: Gradual variation of the refractive index (n) of a material can be used to produce lenses with flat surfaces, or lenses that do not have the aberrations typically observed with traditional spherical lenses. Gradient-index (GRIN) lenses may have a refraction gradient that is spherical, axial, or radial. Very small micro-optical versions are available. MICRO-OPTIC DIGITAL FILTERS: Digital neutral density filters are used to control the intensity profiles of illumination and projection systems. These micro-optic filters contain well-defined metal absorber micro-structures that are randomly distributed on a fused silica substrate. Properties of these micro-optical components are high accuracy, large clear aperture, high damage threshold, broadband attenuation for DUV to IR wavelengths, well defined one or two dimensional transmission profiles. Some applications are soft edge apertures, precise correction of intensity profiles in illumination or projection systems, variable attenuation filters for high-power lamps and expanded laser beams. We can customize the density and size of the structures to meet precisely the transmission profiles required by the application. MULTI-WAVELENGTH BEAM COMBINERS: Multi-Wavelength beam combiners combine two LED collimators of different wavelengths into a single collimated beam. Multiple combiners can be cascaded to combine more than two LED collimator sources. Beam combiners are made of high-performance dichroic beam splitters that combine two wavelengths with >95% efficiency. Very small micro-optic versions are available. CLICK Product Finder-Locator Service PREVIOUS PAGE

Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. Microelectronics & Semiconductor Manufacturing and Fabrication Many of our nanomanufacturing, micromanufacturing and mesomanufacturing techniques and processes explained under the other menus can be used for MICROELECTRONICS MANUFACTURING too. However due to the importance of microelectronics in our products, we will concentrate on the subject specific applications of these processes here. Microelectronics related processes are also widely referred to as SEMICONDUCTOR FABRICATION processes. Our semiconductor engineering design and fabrication services include: - FPGA board design, development and programming - Microelectronics foundry services: Design, prototyping and manufacturing, third-party services - Semiconductor wafer preparation: Dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection - Microelectronic package design and fabrication: Both off-shelf and custom design and fabrication - Semiconductor IC assembly & packaging & test: Die, wire and chip bonding, encapsulation, assembly, marking and branding - Lead frames for semiconductor devices: Both off-shelf and custom design and fabrication - Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication - Sensor & actuator design and fabrication: Both off-shelf and custom design and fabrication - Optoelectronic & photonic circuits design and fabrication Let us examine the microelectronics and semiconductor fabrication and test technologies in more detail so you can better understand the services and products we are offering. FPGA Board Design & Development and Programming: Field-programmable gate arrays (FPGAs) are reprogrammable silicon chips. Contrary to processors that you find in personal computers, programming an FPGA rewires the chip itself to implement user’s functionality rather than running a software application. Using prebuilt logic blocks and programmable routing resources, FPGA chips can be configured to implement custom hardware functionality without using a breadboard and soldering iron. Digital computing tasks are carried out in software and compiled down to a configuration file or bitstream that contains information on how the components should be wired together. FPGAs can be used to implement any logical function that an ASIC could perform and are completely reconfigurable and can be given a completely different “personality” by recompiling a different circuit configuration. FPGAs combine the best parts of application-specific integrated circuits (ASICs) and processor-based systems. These benefits include the following: • Faster I/O response times and specialized functionality • Exceeding the computing power of digital signal processors (DSPs) • Rapid prototyping and verification without the fabrication process of custom ASIC • Implementation of custom functionality with the reliability of dedicated deterministic hardware • Field-upgradable eliminating the expense of custom ASIC re-design and maintenance FPGAs provide speed and reliability, without requiring high volumes to justify the large upfront expense of custom ASIC design. Reprogrammable silicon also has the same flexibility of software running on processor-based systems, and it is not limited by the number of processing cores available. Unlike processors, FPGAs are truly parallel in nature, so different processing operations do not have to compete for the same resources. Each independent processing task is assigned to a dedicated section of the chip, and can function autonomously without any influence from other logic blocks. As a result, the performance of one part of the application is not affected when more processing is added on. Some FPGAs have analog features in addition to digital functions. Some common analog features are programmable slew rate and drive strength on each output pin, allowing the engineer to set slow rates on lightly loaded pins that would otherwise ring or couple unacceptably, and to set stronger, faster rates on heavily loaded pins on high-speed channels that would otherwise run too slowly. Another relatively common analog feature is differential comparators on input pins designed to be connected to differential signaling channels. Some mixed signal FPGAs have integrated peripheral analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) with analog signal conditioning blocks that allow them to operate as a system-on-a-chip. Briefly, the top 5 benefits of FPGA chips are: 1. Good Performance 2. Short Time to Market 3. Low Cost 4. High Reliability 5. Long-Term Maintenance Capability Good Performance – With their capability of accommodating parallel processing, FPGAs have better computing power than digital signal processors (DSPs) and do not require sequential execution as DSPs and can accomplish more per clock cycles. Controlling inputs and outputs (I/O) at the hardware level provides faster response times and specialized functionality to closely match application requirements. Short Time to market - FPGAs offer flexibility and rapid prototyping capabilities and thus shorter time-to-market. Our customers can test an idea or concept and verify it in hardware without going through the long and expensive fabrication process of custom ASIC design. We can implement incremental changes and iterate on an FPGA design within hours instead of weeks. Commercial off-the-shelf hardware is also available with different types of I/O already connected to a user-programmable FPGA chip. The growing availability of high-level software tools offer valuable IP cores (prebuilt functions) for advanced control and signal processing. Low Cost—The nonrecurring engineering (NRE) expenses of custom ASIC designs exceed that of FPGA-based hardware solutions. The large initial investment in ASICs can be justified for OEMs producing many chips per year, however many end users need custom hardware functionality for the many systems in development. Our programmable silicon FPGA offers you something with no fabrication costs or long lead times for assembly. System requirements frequently change over time, and the cost of making incremental changes to FPGA designs is negligible when compared to the large expense of respinning an ASIC. High Reliability - Software tools provide the programming environment and FPGA circuitry is a true implementation of program execution. Processor-based systems generally involve multiple layers of abstraction to help task scheduling and share resources among multiple processes. The driver layer controls hardware resources and the OS manages memory and processor bandwidth. For any given processor core, only one instruction can execute at a time, and processor-based systems are continually at risk of time-critical tasks preempting one another. FPGAs, do not use OSs, pose minimum reliability concerns with their true parallel execution and deterministic hardware dedicated to every task. Long-term Maintenance Capability - FPGA chips are field-upgradable and do not require the time and cost involved with redesigning ASIC. Digital communication protocols, for example, have specifications that can change over time, and ASIC-based interfaces may cause maintenance and forward-compatibility challenges. To the contrary, reconfigurable FPGA chips can keep up with potentially necessary future modifications. As products and systems mature, our customers can make functional enhancements without spending time redesigning hardware and modifying the board layouts. Microelectronics Foundry Services: Our microelectronics foundry services include design, prototyping and manufacturing, third-party services. We provide our customers with assistance throughout the entire product development cycle - from design support to prototyping and manufacturing support of semiconductor chips. Our objective in design support services is to enable a first-time right approach for digital, analog, and mixed-signal designs of semiconductor devices. For example, MEMS specific simulation tools are available. Fabs that can handle 6 and 8 inch wafers for integrated CMOS and MEMS are at your service. We offer our clients design support for all major electronic design automation (EDA) platforms, supplying correct models, process design kits (PDK), analog and digital libraries, and design for manufacturing (DFM) support. We offer two prototyping options for all technologies: the Multi Product Wafer (MPW) service, where several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. These are more economical than the full mask set. The MLM service is highly flexible compared to the fixed dates of the MPW service. Companies may prefer outsourcing semiconductor products to a microelectronics foundry for a number of reasons including the need for a second source, using internal resources for other products and services, willingness to go fabless and decrease risk and burden of running a semiconductor fab…etc. AGS-TECH offers open-platform microelectronics fabrication processes that can be scaled down for small wafer runs as well as mass manufacturing. Under certain circumstances, your existing microelectronics or MEMS fabrication tools or complete tool sets can be transferred as consigned tools or sold tools from your fab into our fab site, or your existing microelectronics and MEMS products can be redesigned using open platform process technologies and ported to a process available at our fab. This is faster and more economical than a custom technology transfer. If desired however customer’s existing microelectronics / MEMS fabrication processes may be transferred. Semiconductor Wafer Preparation: If desired by customers after wafers are microfabricated, we carry out dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection operations on semiconductor wafers. Semiconductor wafer processing involves metrology in between the various processing steps. For example, thin film test methods based on ellipsometry or reflectometry, are used to tightly control the thickness of gate oxide, as well as the thickness, refractive index and extinction coefficient of photoresist and other coatings. We use semiconductor wafer test equipment to verify that the wafers haven't been damaged by previous processing steps up until testing. Once the front-end processes have been completed, the semiconductor microelectronic devices are subjected to a variety of electrical tests to determine if they function properly. We refer to the proportion of microelectronics devices on the wafer found to perform properly as the “yield”. Testing of microelectronics chips on the wafer are carried out with an electronic tester that presses tiny probes against the semiconductor chip. The automated machine marks each bad microelectronics chip with a drop of dye. Wafer test data is logged into a central computer database and semiconductor chips are sorted into virtual bins according to predetermined test limits. The resulting binning data can be graphed, or logged, on a wafer map to trace manufacturing defects and mark bad chips. This map can also be used during wafer assembly and packaging. In final testing, microelectronics chips are tested again after packaging, because bond wires may be missing, or analog performance may be altered by the package. After a semiconductor wafer is tested, it is typically reduced in thickness before the wafer is scored and then broken into individual dies. This process is called semiconductor wafer dicing. We use automated pick-and-place machines specially manufactured for microelectronics industry to sort out the good and bad semiconductor dies. Only the good, unmarked semiconductor chips are packaged. Next, in the microelectronics plastic or ceramic packaging process we mount the semiconductor die, connect the die pads to the pins on the package, and seal the die. Tiny gold wires are used to connect the pads to the pins using automated machines. Chip scale package (CSP) is another microelectronics packaging technology. A plastic dual in-line package (DIP), like most packages, is multiple times larger than the actual semiconductor die placed inside, whereas CSP chips are nearly the size of the microelectronics die; and a CSP can be constructed for each die before the semiconductor wafer is diced. The packaged microelectronics chips are re-tested to make sure that they are not damaged during packaging and that the die-to-pin interconnect process was completed correctly. Using lasers we then etch the chip names and numbers on the package. Microelectronic Package Design and Fabrication: We offer both off-shelf and custom design and fabrication of microelectronic packages. As part of this service, modeling and simulation of microelectronic packages is also carried out. Modeling and simulation ensures virtual Design of Experiments (DoE) to achieve the optimal solution, rather than testing packages on the field. This reduces the cost and production time, especially for new product development in microelectronics. This work also gives us the opportunity to explain our customers how the assembly, reliability and testing will impact their microelectronic products. The primary objective of microelectronic packaging is to design an electronic system that will satisfy the requirements for a particular application at a reasonable cost. Because of the many options available to interconnect and house a microelectronics system, the choice of a packaging technology for a given application needs expert evaluation. Selection criteria for microelectronics packages may include some of the following technology drivers: -Wireability -Yield -Cost -Heat dissipation properties -Electromagnetic shielding performance -Mechanical toughness -Reliability These design considerations for microelectronics packages affect speed, functionality, junction temperatures, volume, weight and more. The primary goal is to select the most cost-effective yet reliable interconnection technology. We use sophisticated analysis methods and software to design microelectronics packages. Microelectronics packaging deals with the design of methods for the fabrication of interconnected miniature electronic systems and the reliability of those systems. Specifically, microelectronics packaging involves routing of signals while maintaining signal integrity, distributing ground and power to semiconductor integrated circuits, dispersing dissipated heat while maintaining structural and material integrity, and protecting the circuit from environmental hazards. Generally, methods for packaging microelectronics ICs involve the use of a PWB with connectors that provide the real-world I/Os to an electronic circuit. Traditional microelectronics packaging approaches involve the use of single packages. The main advantage of a single-chip package is the ability to fully test the microelectronics IC before interconnecting it to the underlying substrate. Such packaged semiconductor devices are either through-hole mounted or surface mounted to the PWB. Surface-mounted microelectronics packages do not require via holes to go through the entire board. Instead, surface-mounted microelectronics components can be soldered to both sides of the PWB, enabling higher circuit density. This approach is called surface-mount technology (SMT). The addition of area-array–style packages such as ball-grid arrays (BGAs) and chip-scale packages (CSPs) is making SMT competitive with the highest-density semiconductor microelectronics packaging technologies. A newer packaging technology involves the attachment of more than one semiconductor device onto a high-density interconnection substrate, which is then mounted in a large package, providing both I/O pins and environmental protection. This multichip module (MCM) technology is further characterized by the substrate technologies used to interconnect the attached ICs. MCM-D represents deposited thin film metal and dielectric multilayers. MCM-D substrates have the highest wiring densities of all MCM technologies thanks to the sophisticated semiconductor processing technologies. MCM-C refers to multilayered “ceramic” substrates, fired from stacked alternating layers of screened metal inks and unfired ceramic sheets. Using MCM-C we obtain a moderately dense wiring capacity. MCM-L refers to multilayer substrates made from stacked, metallized PWB “laminates,” that are individually patterned and then laminated. It used to be a low-density interconnect technology, however now MCM-L is quickly approaching the density of MCM-C and MCM-D microelectronics packaging technologies. Direct chip attach (DCA) or chip-on-board (COB) microelectronics packaging technology involves mounting the microelectronics ICs directly to the PWB. A plastic encapsulant, which is “globbed” over the bare IC and then cured, provides environmental protection. Microelectronics ICs can be interconnected to the substrate using either flip-chip, or wire bonding methods. DCA technology is particularly economical for systems that are limited to 10 or fewer semiconductor ICs, since larger numbers of chips can affect system yield and DCA assemblies can be difficult to rework. An advantage common to both the DCA and MCM packaging options is the elimination of the semiconductor IC package interconnection level, which allows closer proximity (shorter signal transmission delays) and reduced lead inductance. The primary disadvantage with both methods is the difficulty in purchasing fully tested microelectronics ICs. Other disadvantages of DCA and MCM-L technologies include poor thermal management thanks to the low thermal conductivity of PWB laminates and a poor coefficient of thermal expansion match between the semiconductor die and the substrate. Solving the thermal expansion mismatch problem requires an interposer substrate such as molybdenum for wire bonded die and an underfill epoxy for flip-chip die. The multichip carrier module (MCCM) combines all the positive aspects of DCA with MCM technology. The MCCM is simply a small MCM on a thin metal carrier that can be bonded or mechanically attached to a PWB. The metal bottom acts as both a heat dissipater and a stress interposer for the MCM substrate. The MCCM has peripheral leads for wire bonding, soldering, or tab bonding to a PWB. Bare semiconductor ICs are protected using a glob-top material. When you contact us, we will discuss your application and requirements to choose the best microelectronics packaging option for you. Semiconductor IC Assembly & Packaging & Test: As part of our microelectronics fabrication services we offer die, wire and chip bonding, encapsulation, assembly, marking and branding, testing. For a semiconductor chip or integrated microelectronics circuit to function, it needs to be connected to the system that it will control or provide instructions to. Microelectronics IC assembly does provide the connections for power and information transfer between the chip and the system. This is accomplished by connecting the microelectronics chip to a package or directly connecting it to the PCB for these functions. Connections between the chip and the package or printed circuit board (PCB) are via wire bonding, thru-hole or flip chip assembly. We are an industry leader in finding microelectronics IC packaging solutions to meet the complex requirements of the wireless and internet markets. We offer thousands of different package formats and sizes, ranging from traditional leadframe microelectronics IC packages for thru-hole and surface mount, to the latest chip scale (CSP) and ball grid array (BGA) solutions required in high pin count and high density applications. A wide variety of packages are available from stock including CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, PLCC, PoP - Package on Package, PoP TMV - Through Mold Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Wafer Level Package)…..etc. Wire bonding using copper, silver or gold are among the popular in microelectronics. Copper (Cu) wire has been a method of connecting silicon semiconductor dies to the microelectronics package terminals. With recent increase in gold (Au) wire cost, copper (Cu) wire is an attractive way to manage overall package cost in microelectronics. It also resembles gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are almost the same for gold (Au) and copper (Cu) wire with copper (Cu) wire having lower resistivity. In microelectronics applications where resistance due to bond wire can negatively impact circuit performance, using copper (Cu) wire can offer improvement. Copper, Palladium Coated Copper (PCC) and Silver (Ag) alloy wires have emerged as alternatives to gold bond wires due to cost. Copper-based wires are inexpensive and have low electrical resistivity. However, the hardness of copper makes it difficult to use in many applications such as those with fragile bond pad structures. For these applications, Ag-Alloy offers properties similar to those of gold while its cost is similar to that of PCC. Ag-Alloy wire is softer than PCC resulting in lower Al-Splash and lower risk of bond pad damage. Ag-Alloy wire is the best low cost replacement for applications that need die-to-die bonding, waterfall bonding, ultra-fine bond pad pitch and small bond pad openings, ultra low loop height. We provide a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and complete end-of-line services. We test a variety of semiconductor device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various combinations such as ASIC, multi chip modules, System-in-Package (SiP), and stacked 3D packaging, sensors and MEMS devices such as accelerometers and pressure sensors. Our test hardware and contacting equipment are suitable for custom package size SiP, dual-sided contacting solutions for Package on Package (PoP), TMV PoP, FusionQuad sockets, multiple-row MicroLeadFrame, Fine-Pitch Copper Pillar. Test equipment and test floors are integrated with CIM / CAM tools, yield analysis and performance monitoring to deliver very high efficiency yield the first time. We offer numerous adaptive microelectronics test processes for our customers and offer distributed test flows for SiP and other complex assembly flows. AGS-TECH provides a full range of test consultation, development and engineering services across your entire semiconductor and microelectronics product lifecycle. We understand the unique markets and testing requirements for SiP, automotive, networking, gaming, graphics, computing, RF / wireless. Semiconductor manufacturing processes require fast and precisely controlled marking solutions. Marking speeds over 1000 characters/second and material penetration depths less than 25 microns are common in semiconductor microelectronics industry using advanced lasers. We are capable of marking mold compounds, wafers, ceramics and more with minimal heat input and perfect repeatability. We use lasers with high accuracy to mark even the smallest parts without damage. Lead frames for Semiconductor Devices: Both off-shelf and custom design and fabrication are possible. Lead frames are utilized in the semiconductor device assembly processes, and are essentially thin layers of metal that connect the wiring from tiny electrical terminals on the semiconductor microelectronics surface to the large-scale circuitry on electrical devices and PCBs. Lead frames are used in almost all semiconductor microelectronics packages. Most microelectronics IC packages are made by placing the semiconductor silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and subsequently covering the microelectronics chip with plastic cover. This simple and relatively low cost microelectronics packaging is still the best solution for many applications. Lead frames are produced in long strips, which allows them to be quickly processed on automated assembly machines, and generally two manufacturing processes are used: photo etching of some sort and stamping. In microelectronics lead frame design often demand is for customized specifications and features, designs that enhance electrical and thermal properties, and specific cycle time requirements. We have in-depth experience of microelectronics lead frame manufacturing for an array of different customers using laser assisted photo etching and stamping. Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication. With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. The consistency in performance and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a semiconductor microelectronics component may be achieved by effectively controlling the device operating temperature within the limits set by the designers. Heat sinks are devices that enhance heat dissipation from a hot surface, usually the outer case of a heat generating component, to a cooler ambient such as air. For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation. A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant. This allows more heat to be dissipated and/or lowers the semiconductor device operating temperature. The primary purpose of a heat sink is to maintain the microelectronics device temperature below the maximum allowable temperature specified by the semiconductor device manufacturer. We can classify heat sinks in terms of manufacturing methods and their shapes. The most common types of air-cooled heat sinks include: - Stampings: Copper or aluminum sheet metals are stamped into desired shapes. they are used in traditional air cooling of electronic components and offer an economical solution to low density thermal problems. They are suitable for high volume production. - Extrusion: These heat sinks allow the formation of elaborate two-dimensional shapes capable of dissipating large heat loads. They may be cut, machined, and options added. A cross-cutting will produce omnidirectional, rectangular pin fin heat sinks, and incorporating serrated fins improves the performance by approximately 10 to 20%, but with a slower extrusion rate. Extrusion limits, such as the fin height-to-gap fin thickness, usually dictate the flexibility in design options. Typical fin height-to-gap aspect ratio of up to 6 and a minimum fin thickness of 1.3mm, are attainable with standard extrusion techniques. A 10 to 1 aspect ratio and a fin thickness of 0.8″can be obtained with special die design features. However, as the aspect ratio increases, the extrusion tolerance is compromised. - Bonded/Fabricated Fins: Most air cooled heat sinks are convection limited, and the overall thermal performance of an air cooled heat sink can often be improved significantly if more surface area can be exposed to the air stream. These high performance heat sinks utilize thermally conductive aluminum-filled epoxy to bond planar fins onto a grooved extrusion base plate. This process allows for a much greater fin height-to-gap aspect ratio of 20 to 40, significantly increasing the cooling capacity without increasing the need for volume. - Castings: Sand, lost wax and die casting processes for aluminum or copper / bronze are available with or without vacuum assistance. We use this technology for fabrication of high density pin fin heat sinks which provide maximum performance when using impingement cooling. - Folded Fins: Corrugated sheet metal from aluminum or copper increases surface area and the volumetric performance. The heat sink is then attached to either a base plate or directly to the heating surface via epoxy or brazing. It is not suitable for high profile heat sinks on account of the availability and fin efficiency. Hence, it allows high performance heat sinks to be fabricated. In selecting an appropriate heat sink meeting the required thermal criteria for your microelectronics applications, we need to examine various parameters that affect not only the heat sink performance itself, but also the overall performance of the system. The choice of a particular type of heat sink in microelectronics depends largely to the thermal budget allowed for the heat sink and external conditions surrounding the heat sink. There is never a single value of thermal resistance assigned to a given heat sink, since the thermal resistance varies with external cooling conditions. Sensor & Actuator Design and Fabrication: Both off-shelf and custom design and fabrication are available. We offer solutions with ready-to-use processes for inertial sensors, pressure and relative pressure sensors and IR temperature sensor devices. By using our IP blocks for accelerometers, IR and pressure sensors or applying your design according to available specifications and design rules, we can have MEMS based sensor devices delivered to you within weeks. Besides MEMS, other types of sensor and actuator structures can be fabricated. Optoelectronic & photonic circuits design and fabrication: A photonic or optical integrated circuit (PIC) is a device that integrates multiple photonic functions. It can be resembled to electronic integrated circuits in microelectronics. The major difference between the two is that a photonic integrated circuit provides functionality for information signals imposed on optical wavelengths in the visible spectrum or near infrared 850 nm-1650 nm. Fabrication techniques are similar to those used in microelectronics integrated circuits where photolithography is used to pattern wafers for etching and material deposition. Unlike semiconductor microelectronics where the primary device is the transistor, there is no single dominant device in optoelectronics. Photonic chips include low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and fabrication techniques and therefore it is difficult to realize all of them on a single chip. Our applications of photonic integrated circuits are mainly in the areas of fiber-optic communication, biomedical and photonic computing. Some example optoelectronic products we can design and fabricate for you are LEDs (Light Emitting Diodes), diode lasers, optoelectronic receivers, photodiodes, laser distance modules, customized laser modules and more. CLICK Product Finder-Locator Service PREVIOUS PAGE

Industrial Chemicals, Industrial Consumables, Aerosols, Sprays, Industrial Chemical Agents Industrial Chemicals and Consumables There are many specialty chemicals that are use in the industry. Contact us if you would like to know how we can help you formulating and producing a specialty chemical product. We also offer some off-the-shelf chemical products that are used in various industrial applications such as the automotive and motor vehicle industries, electronic industry, optical industry, medical facilities, clean rooms, pharmaceutical plants.....etc. Please note that we engineer, design and manufacture products to your needs and specifications. We can either manufacture products according to your specifications or, If desired, we can help you in choosing the right materials and designing the product. You can click on the blue highlighted text below and download the industrial chemicals and consumables product brochures: - Filters & Filtration Products & Membranes - Private Label Aerosols and Sprays We can label these products with your name and logo if you wish - Private Label Cleanroom Consumables and Apparel We can label these products with your name and logo if you wish - Private Label Epoxy Solutions for Construction, Electrical, Industrial Assembly (We can put your name, label, logo on these epoxies if you wish) - Private Label Nano Surface Protection Car Care Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Industrial Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Marine Products We can label these products with your name and logo if you wish - Private Label Nano Surface Protection Products We can label these products with your name and logo if you wish - Private Label Tapes for Every Application We can label these products with your name and logo if you wish PREVIOUS PAGE

Electric Discharge Machining - EDM - Spark Machining - Die Sinking - Wire Erosion - Custom Manufacturing - AGS-TECH Inc. EDM Machining, Electrical-Discharge Milling and Grinding ELECTRICAL DISCHARGE MACHINING (EDM), also referred to as SPARK-EROSION or ELECTRODISCHARGE MACHINING, SPARK ERODING, DIE SINKING or WIRE EROSION, is a NON-CONVENTIONAL MANUFACTURING process where erosion of metals takes place and desired shape is obtained using electrical discharges in the form of sparks. We also offer some varieties of EDM, namely NO-WEAR EDM, WIRE EDM (WEDM), EDM GRINDING (EDG), DIE-SINKING EDM, ELECTRICAL-DISCHARGE MILLING, micro-EDM, m-EDM and ELECTROCHEMICAL-DISCHARGE GRINDING (ECDG). Our EDM systems consist of shaped tools/electrode and the workpiece connected to DC power supplies and inserted in a electrically nonconducting dielectric fluid. After 1940 electrical discharge machining has become one of the most important and popular production technologies in manufacturing industries. When the distance between the two electrodes is reduced, the intensity of the electric field in the volume between the electrodes becomes greater than the strength of the dielectric in some points, which breaks, eventually forming a bridge for current to flow between the two electrodes. An intense electrical arc is generated causing significant heating to melt a portion of the workpiece and some of the tooling material. As a result, material is removed from both the electrodes. At the same time, the dielectric fluid is heated rapidly, resulting in evaporation of the fluid in the arc gap. Once the current flow stops or it is stopped heat is removed from the gas bubble by the surrounding dielectric fluid and the bubble cavitates (collapses). The shock wave created by the bubble’s collapse and the flow of dielectric fluid flush debris from the workpiece surface and entrain any molten workpiece material into the dielectric fluid. The repetition rate for these discharges are between 50 to 500 kHz, voltages between 50 to 380 V and currents between 0.1 and 500 Amperes. New liquid dielectric such as mineral oils, kerosene or distilled & deionized water is usually conveyed into the inter-electrode volume carrying away the solid particles (in the form of debris) and the insulating proprieties of the dielectric is restored. After a current flow, the potential difference between the two electrodes is restored to what it was before the breakdown, so a new liquid dielectric breakdown can occur. Our modern electrical discharge machines (EDM) offer numerically controlled movements and are equipped with pumps and filtering systems for the dielectric fluids. Electrical discharge machining (EDM) is a machining method mainly used for hard metals or those that would be very difficult to machine with conventional techniques. EDM typically works with any materials that are electrical conductors, although methods for machining insulating ceramics with EDM have also been proposed. The melting point and latent heat of melting are properties that determine the volume of metal removed per discharge. The higher these values, the slower the material removal rate. Because the electrical discharge machining process does not involve any mechanical energy, the hardness, strength, and toughness of the workpiece do not affect the removal rate. Discharge frequency or energy per discharge, the voltage and current are varied to control material removal rates. Rate of material removal and surface roughness increase with increasing current density and decreasing spark frequency. We can cut intricate contours or cavities in pre-hardened steel using EDM without the need for heat treatment to soften and re-harden them. We can use this method with any metal or metal alloys like titanium, hastelloy, kovar, and inconel. Applications of the EDM process include shaping of polycrystalline diamond tools. EDM is considered a non-traditional or non-conventional machining method along with processes such as electrochemical machining (ECM), water jet cutting (WJ, AWJ), laser cutting. On the other hand the conventional machining methods include turning, milling, grinding, drilling and other process whose material removal mechanism is essentially based on mechanical forces. Electrodes for electrical-discharge machining (EDM) are made of graphite, brass, copper and copper-tungsten alloy. Electrode diameters down to 0.1mm are possible. Since tool wear is an undesired phenomenon adversely affecting dimensional accuracy in EDM, we take advantage of a process called NO-WEAR EDM, by reversing polarity and using copper tools to minimize tool wear. Ideally speaking, the electrical-discharge machining (EDM) can be considered a series of breakdown and restoration of the dielectric liquid between the electrodes. In reality however, the removal of the debris from the inter-electrode area is almost always partial. This causes the electrical proprieties of the dielectric in the inter-electrodes area to be different from their nominal values and vary with time. The inter-electrode distance, (spark-gap), is adjusted by the control algorithms of the specific machine used. The spark-gap in EDM can unfortunately sometimes be short-circuited by the debris. The control system of the electrode may fail to react quickly enough to prevent the two electrodes (tool and workpiece) from short circuiting. This unwanted short circuit contributes to material removal differently from the ideal case. We pay utmost importance to flushing action in order to restore the insulating properties of the dielectric so that the current always happens in the point of the inter-electrode area, thereby minimizing the possibility of unwanted change of shape (damage) of the tool-electrode and workpiece. To obtain a specific geometry, the EDM tool is guided along the desired path very close to the workpiece without touching it, We pay utmost attention to the performance of motion control in use. This way, a large number of current discharges / sparks take place, and each contributes to the removal of material from both tool and workpiece, where small craters are formed. The size of the craters is a function of the technological parameters set for the specific job at hand and dimensions may range from the nanoscale (such as in the case of micro-EDM operations) to some hundreds of micrometers in roughing conditions. These small craters on the tool cause gradual erosion of the electrode called “tool wear”. To counteract the detrimental effect of the wear on the geometry of the workpiece we continuously replace the tool-electrode during a machining operation. Sometimes we achieve this by using a continuously replaced wire as electrode ( this EDM process is also called WIRE EDM ). Sometimes we use the tool-electrode in such a way that only a small portion of it is actually engaged in the machining process and this portion is changed on a regular basis. This is, for instance, the case when using a rotating disk as a tool-electrode. This process is called EDM GRINDING. Yet another technique we deploy consists of using a set of electrodes with different sizes and shapes during the same EDM operation to compensate for wear. We call this multiple electrode technique, and is most commonly used when the tool electrode replicates in negative the desired shape and is advanced towards the blank along a single direction, usually the vertical direction (i.e. z-axis). This resembles the sink of the tool into the dielectric liquid in which the workpiece is immersed, and therefore it is referred to as DIE-SINKING EDM (sometimes called CONVENTIONAL EDM or RAM EDM). The machines for this operation are called SINKER EDM. The electrodes for this type of EDM have complex forms. If the final geometry is obtained using a usually simple-shaped electrode moved along several directions and is also subject to rotations, we call it EDM MILLING. The amount of wear is strictly dependent on the technological parameters used in the operation ( polarity, maximum current, open circuit voltage). For example, in micro-EDM, also known as m-EDM, these parameters are usually set at values which generates severe wear. Therefore, wear is a major problem in that area which we minimize using our accumulated know-how. For example to minimize wear to graphite electrodes, a digital generator, controllable within milliseconds, reverses polarity as electro-erosion takes place. This results in an effect similar to electroplating that continuously deposits the eroded graphite back on the electrode. In another method, a so-called ''Zero Wear'' circuit we minimize how often the discharge starts and stops, keeping it on for as long a time as possible. The material removal rate in electrical-discharge machining can be estimated from: MRR = 4 x 10 exp(4) x I x Tw exp (-1.23) Here MRR is in mm3/min, I is current in Amperes, Tw is workpiece melting point in K-273.15K. The exp stands for exponent. On the other hand, the wear rate Wt of the electrode can be obtained from: Wt = ( 1.1 x 10exp(11) ) x I x Ttexp(-2.38) Here Wt is in mm3/min and Tt is melting point of the electrode material in K-273.15K Finally, the wear ratio of the workpiece to electrode R can be obtained from: R = 2.25 x Trexp(-2.38) Here Tr is the ratio of melting points of workpiece to electrode. SINKER EDM : Sinker EDM, also referred to as CAVITY TYPE EDM or VOLUME EDM, consists of an electrode and workpiece submerged in an insulating liquid. The electrode and workpiece are connected to a power supply. The power supply generates an electrical potential between the two. As the electrode approaches the workpiece, dielectric breakdown occurs in the fluid, forming a plasma channel, and a small spark jumps. The sparks usually strike one at a time because it is highly unlikely that different locations in the inter-electrode space have identical local electrical characteristics which would enable a spark to occur in all such locations simultaneously. Hundreds of thousands of these sparks happen at random points between the electrode and the workpiece per second. As the base metal erodes, and the spark gap subsequently increases, the electrode is lowered automatically by our CNC machine so that the process can continue uninterrupted. Our equipment has controlling cycles known as ''on time'' and ''off time''. The on time setting determines the length or duration of the spark. A longer on time produces a deeper cavity for that spark and all subsequent sparks for that cycle, creating a rougher finish on the workpiece and vice versa. The off time is the period of time that one spark is replaced by another. A longer off time permits the dielectric fluid to flush through a nozzle to clean out the eroded debris, thereby avoiding a short circuit. These settings are adjusted in micro seconds. WIRE EDM : In WIRE ELECTRICAL DISCHARGE MACHINING (WEDM), also called WIRE-CUT EDM or WIRE CUTTING, we feed a thin single-strand metal wire of brass through the workpiece, which is submerged in a tank of dielectric fluid. Wire EDM is an important variation of EDM. We occasionally use wire-cut EDM to cut plates as thick as 300mm and to make punches, tools, and dies from hard metals that are difficult to machine with other manufacturing methods. In this process which resembles to contour cutting with a band saw, the wire, which is constantly fed from a spool, is held between upper and lower diamond guides. The CNC-controlled guides move in the x–y plane and the upper guide can also move independently in the z–u–v axis, giving rise to the ability to cut tapered and transitioning shapes (such as circle on the bottom and square at the top). The upper guide can control axis movements in x–y–u–v–i–j–k–l–. This allows the WEDM to cut very intricate and delicate shapes. The average cutting kerf of our equipment that achieves the best economic cost and machining time is 0.335 mm using Ø 0.25 brass, copper or tungsten wire. However the upper and lower diamond guides of our CNC equipment are accurate to about 0.004 mm, and can have a cutting path or kerf as small as 0.021 mm using Ø 0.02 mm wire. So really narrow cuts are possible. The cutting width is greater than the width of the wire because sparking occurs from the sides of the wire to the workpiece, causing erosion. This ''overcut'' is necessary, for many applications it is predictable and therefore can be compensated for ( in micro-EDM this is not often the case). The wire spools are long—an 8 kg spool of 0.25 mm wire is just over 19 kilometers in length. Wire diameter can be as small as 20 micrometres and the geometry precision is in the neighborhood of +/- 1 micrometer. We generally use the wire only once and recycle it because it is relatively inexpensive. It travels at a constant velocity of 0.15 to 9m/min and a constant kerf (slot) is maintained during a cut. In the wire-cut EDM process we use water as the dielectric fluid, controlling its resistivity and other electrical properties with filters and de-ionizer units. The water flushes the cut debris away from the cutting zone. Flushing is an important factor in determining the maximum feed rate for a given material thickness and therefore we keep it consistent. Cutting speed in wire EDM is stated in terms of the cross-sectional area cut per unit time, such as 18,000 mm2/hr for 50mm thick D2 tool steel. The linear cutting speed for this case would be 18,000/50 = 360mm/hr The material removal rate in wire EDM is: MRR = Vf x h x b Here MRR is in mm3/min, Vf is the feed rate of the wire into workpiece in mm/min, h is thickness or height in mm, and b is the kerf, which is: b = dw + 2s Here dw is wire diameter and s is gap between wire and workpiece in mm. Along with tighter tolerances, our modern multi axis EDM wire-cutting machining centers have added features such as multi heads for cutting two parts at the same time, controls for preventing wire breakage, automatic self-threading features in case of wire breakage, and programmed machining strategies to optimize the operation, straight and angular cutting capabilities. Wire-EDM offers us low residual stresses, because it does not require high cutting forces for removal of material. When the energy/power per pulse is relatively low (as in finishing operations), little change in the mechanical properties of a material is expected due to low residual stresses. ELECTRICAL-DISCHARGE GRINDING (EDG) : The grinding wheels do not contain abrasives, they are made of graphite or brass. Repetitive sparks between the rotating wheel and workpiece remove material from workpiece surfaces. The material removal rate is: MRR = K x I Here MRR is in mm3/min, I is current in Amperes, and K is workpiece material factor in mm3/A-min. We frequently use electrical-discharge grinding to saw narrow slits on components. We sometimes combine EDG (Electrical-Discharge Grinding) process with ECG (Electrochemical Grinding) process where material is removed by chemical action, the electrical discharges from the graphite wheel breaking up the oxide film and washed away by the electrolyte. The process is called ELECTROCHEMICAL-DISCHARGE GRINDING (ECDG). Even though the ECDG process consumes relatively more power, it is a faster process than the EDG. We mostly grind carbide tools using this technique. Applications of Electrical Discharge Machining: Prototype production: We use the EDM process in mold-making, tool and die manufacturing, as well as for making prototype and production parts, especially for the aerospace, automobile and electronics industries in which production quantities are relatively low. In Sinker EDM, a graphite, copper tungsten or pure copper electrode is machined into the desired (negative) shape and fed into the workpiece on the end of a vertical ram. Coinage die making: For the creation of dies for producing jewelry and badges by the coinage (stamping) process, the positive master may be made from sterling silver, since (with appropriate machine settings) the master is significantly eroded and is used only once. The resultant negative die is then hardened and used in a drop hammer to produce stamped flats from cutout sheet blanks of bronze, silver, or low proof gold alloy. For badges these flats may be further shaped to a curved surface by another die. This type of EDM is usually performed submerged in an oil-based dielectric. The finished object may be further refined by hard (glass) or soft (paint) enameling and/or electroplated with pure gold or nickel. Softer materials such as silver may be hand engraved as a refinement. Drilling of Small Holes: On our wire-cut EDM machines, we use small hole drilling EDM to make a through hole in a workpiece through which to thread the wire for the wire-cut EDM operation. Separate EDM heads specifically for small hole drilling are mounted on our wire-cut machines which allow large hardened plates to have finished parts eroded from them as needed and without pre-drilling. We also use small hole EDM to drill rows of holes into the edges of turbine blades used in jet engines. Gas flow through these small holes allows the engines to use higher temperatures than otherwise possible. The high-temperature, very hard, single crystal alloys these blades are made of makes conventional machining of these holes with high aspect ratio extremely difficult and even impossible. Other application areas for small hole EDM is to create microscopic orifices for fuel system components. Besides the integrated EDM heads, we deploy stand-alone small hole drilling EDM machines with x–y axes to machine blind or through holes. EDM drills bore holes with a long brass or copper tube electrode that rotates in a chuck with a constant flow of distilled or deionized water flowing through the electrode as a flushing agent and dielectric. Some small-hole drilling EDMs are able to drill through 100 mm of soft or even hardened steel in less than 10 seconds. Holes between 0.3 mm and 6.1 mm can be achieved in this drilling operation. Metal disintegration machining: We also have special EDM machines for the specific purpose of removing broken tools (drill bits or taps) from work pieces. This process is called ''metal disintegration machining''. Advantages and Disadvantages Electrical-Discharge Machining: Advantages of EDM include machining of: - Complex shapes that would otherwise be difficult to produce with conventional cutting tools - Extremely hard material to very close tolerances - Very small work pieces where conventional cutting tools may damage the part from excess cutting tool pressure. - There is no direct contact between tool and work piece. Therefore delicate sections and weak materials can be machined without any distortion. - A good surface finish can be obtained. - Very fine holes can be easily drilled. Disadvantages of EDM include: - The slow rate of material removal. - The additional time and cost used for creating electrodes for ram/sinker EDM. - Reproducing sharp corners on the workpiece is difficult due to electrode wear. - Power consumption is high. - ''Overcut'' is formed. - Excessive tool wear occurs during machining. - Electrically non-conductive materials can be machined only with specific set-up of the process. CLICK Product Finder-Locator Service PREVIOUS PAGE

Test Equipment for Furniture Testing, Sofa Durability Tester, Chair Base Static Tester, Chair Drop Impact Tester, Mattress Firmness Tester Test Equipment for Furniture Testing Specialized Test Equipment for Testing of Furniture are used for testing furniture products such as chairs, table, sofas, mattress....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for FURNITURE TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of furniture are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of furniture can be downloaded from the colored links below: HAIDA Bifma Furnitures Testing Machine HAIDA Chair Arm and Leg Tester HAIDA Chair Base Static Tester HAIDA Chair Caster Durability Tester HAIDA Chair Drop Impact Tester HAIDA Chair and Foam Testing Machine HAIDA Chair Seating and Back Durability HAIDA Chair Strength Tester HAIDA Chair Swivel Tester Catalog Download HAIDA Chair Universal Test Machine HAIDA Color Assessment Cabinet HAIDA Foam Pounding Fatigue Tester HAIDA Furniture Universal Test Machine HAIDA Mattress Cornell Tester HAIDA Mattress Firmness Tester HAIDA Mattress Rollator Durability Tester HAIDA Mattress Rollator Durability Tester-2 HAIDA Sofa Durability Tester HD-F769 HAIDA Sofa Durability Tester HD-F761 HAIDA Sofa Iron Frame Fatigue Tester HAIDA Universal Test Field for Tables Chairs For other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

AGS-TECH Inc. is a supplier of equipment to cut, drill and polish materials such as glass, semiconductors, wood, masonry...etc. Contact us for mini lathe, mini milling machine, ultrasonic drill, mini hobbing machine, desktop stamping press, desktop laser cutter, mini waterjet cutter, desktop plasma cutting machine... Equipment for Cutting, Drilling, Polishing Please click on the products of interest below to download related brochures. Equipment we supply to cut, drill and polish are generally tabletop, compact, small and economical, yet efficient, versatile, high return on investment type equipment suitable for prototype manufacturing, research & development and small scale industrial production. Our strength is also in customizing equipment to cut drill and polish. We are capable of building equipment for you which you may not be able to find readily in the market. - Hose-Cut-Off-Skive-Machine (We private label these with your brand name and logo if you wish) - Mini Lathe - Mini Milling Machine - Mini Hobbing Machine - Mini Stamping Press - Mini Laser Cutter - Mini Waterjet Cutter - Mini Plasma Cutter - Power Tools for Every Industry (We private label these with your brand name and logo if you wish) - Servo C-Frame Utility Press (We private label these with your brand name and logo if you wish) - Ultrasonic Drill Since we offer a wide variety of equipment for cutting, dicing, drilling, lapping, polishing, shaping; it is impossible to list them all here. From time to time we introduce also new equipment to the market. We encourage you to email or call us so we can jointly determine which product is the best fit for you. When you contact us, please make sure to inform us about: - Your application - Type and grade of material to be processed - Dimensions of material to be processed - Finish required after processing - Quantity / Number of units to be processed per hour or day. CLICK HERE to download our technical capabilities and reference guide for specialty cutting, drilling, grinding, forming, shaping, polishing tools used in medical, dental, precision instrumentation, metal stamping, die forming and other industrial applications. CLICK Product Finder-Locator Service Click Here to go to Cutting, Drilling, Grinding, Lapping, Polishing, Dicing and Shaping Tools Menu Ref. Code: oicaszhengzhouhongtuo, oicaslzqtool

We have high quality metal cutting & shaping tools such as solid carbide end mills, drills, HSS end mills, HSS step drill bits, HSS countersinks, HSS counterbores, twist drill bits, center drills, saw drills, tool bits, carbide rotary burs and more. Metal Cutting & Shaping Tools Here you will find tools, products and components used in cutting and shaping of metal. Tools for cutting and shaping of wood will be damaged and broken when used on metal. Metal and metal alloys need to be processed using metal cutting & shaping tools otherwise tool life will be severely shortened. Click on the highlighted metal cutting & shaping tools of interest below to download related brochure or catalog. We do have a wide spectrum of metal cutting & shaping tools suitable for almost any application. There is a wide variety of metal cutting & shaping tools with different dimensions, applications and material; it is impossible to present them all here. If you cannot find or if you are not sure which metal cutting and shaping tools will meet your expectations and requirements, email or call us so we can determine which product is the best fit for you. When contacting us, please try to provide us as much detail as possible such as your application, dimensions, material grade if you know, finishing requirements, packaging & labeling requirements and of course quantity of your planned order. Solid Carbide End mills Solid Carbide Drills HSS End mills HSS Step Drill Bits HSS Countersinks HSS Tube & Sheet Drills HSS Counterbores HSS Twist Drills HSS Center Drills HSS Saw Drills HSS Tool bits Carbide Brazed Tool bits Carbide Rotary Burs Taps & Dies Milling Cutters Saw Blades Screw Extractor Steel Files Private Label Abrasives (We can put your company name, logo, brand on these. In other words we offer you private label) Private Label Abrasives Ordering Instructions Guide Private Label Drill Bits (We can private label these drill bits with your company name and logo) Private Label Hand Tools for Every Industry This catalog contains some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tool Accessories This brochure includes some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry This catalog contains some metal cutting and shaping tools. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Taps - Cutting Tools (We can private label these drill bits with your company name and logo) CLICK HERE to download our technical capabilities and reference guide for specialty cutting, drilling, grinding, forming, shaping, polishing tools used in medical, dental, precision instrumentation, metal stamping, die forming and other industrial applications. CLICK Product Finder-Locator Service Click Here to go to Cutting, Drilling, Grinding, Lapping, Polishing, Dicing and Shaping Tools Menu Ref. Code: OICASOSTAR

Motion Control, Positioning, Motorized Stage, Actuator, Gripper, Servo Amplifier, Hardware Software Interface Card, Translation Stages, Rotary Table,Servo Motor Automation & Robotic Systems Manufacturing and Assembly Being an engineering integrator, we can provide you AUTOMATION SYSTEMS including: • Motion control and positioning assemblies, motors, motion controller, servo amplifier, motorized stage, lift stage, goniometers, drives, actuators, grippers, direct drive air bearing spindles, hardware-software interface cards and software, custom built pick and place systems, custom built automated inspection systems assembled from translation/rotary stages and cameras, custom built robots, custom automation systems. We also supply manual positioner, manual tilt, rotary or linear stage for simpler applications. A large selection of linear and rotary tables/slides/stages that utilize brushless linear direct-drive servomotors, as well as ball screw models driven with brush or brushless rotary motors are available. Air bearing systems are also an option in automation. Depending on your automation requirements and application, we choose translation stages with suitable travel distance, speed, accuracy, resolution, repeatability, load capacity, in-position stability, reliability...etc. Again, depending on your automation application we can supply you either a purely linear or linear/rotary combination stage. We can manufacture special fixtures, tools and combine them with your motion control hardware to turn them into a complete turnkey automation solution for you. If you require also assistance with installing drivers, code writing for specially developed software with user friendly interface, we can send our experienced automation engineer to your site on a contract basis. Our engineer can directly communicate with you on a daily basis so that at the end you have a custom tailored automation system free of bugs and meeting your expectations. Goniometers: For high-accuracy angular alignment of optical components. The design utilizes direct-drive noncontact motor technology. When used with the multiplier, it provides a positioning speed of 150 degrees per second. So whether you are thinking of an automation system with a moving camera, taking snapshots of a product and analyzing the images acquired to determine a product defect, or whether you are trying to reduce manufacturing leadtimes by integrating a pick and place robot to your automated manufacturing, call us, contact us and you will be glad with the solutions we can provide you. ROBOTS and COBOTS Here are brochures of some off-shelf robots you can download. If you wish we can build you customized robots and cobots that will better fit your needs and applications. We can either redesign and modify existing robot platforms or make new designs for you. Click on blue colored text below to download catalogs: - Collaborative Robots - Customized Agricultural Robots - Customized Commercial Places Robots - Customized Health Care and Hospital Robots - Customized Warehousing Robots - Customized Robots for a Variety of Applications - Food and Beverage Delivery Robot-A302-A302D - Hospital Delivery Robot A801 - Indoor Delivery Robots A301-A301A - Indoor Delivery Robot A305 - Mobile Robot Platform A001 - Robotic Laser Welding Workstation - Robotics Product Brochure - Robotics Workstations - Robot Palletizing Workstation - Robotic Vending Machine A406 - Security Robot A602 - Selection Guide of Industrial Robot Platforms - Small Objects Transfer Robot A503 - Warehouse Logistics Robots A201-A201A - Welding Robots Brochure OTHER ALTERNATIVE ROBOTS and COBOTS No one design or product meets every customer's needs. Below are downloadable brochures for our other products. - Hikrobot Mobile Robots Catalog - Hikvision Logistic Vision Solutions AUTOMATION COMPONENTS AND SPARE PARTS Click on highlighted text to download brochures and catalogs of products you can use as accessories, spare components in building automation systems, robots and cobots: - Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) - Barcode Scanners (We private label these with your brand name and logo if you wish) - Fixed Industrial Scanners (We private label these with your brand name and logo if you wish) - Hikrobot Machine Vision Products - Hikrobot Smart Machine Vision Products - Hikrobot Machine Vision Standard Products - Kinco automation products, including HMI, stepper system, ED servo, CD servo, PLC, field bus. - Kiosk Systems (We private label these with your brand name and logo if you wish) - Kiosk Systems Accessories Guide (We private label these with your brand name and logo if you wish) - Linear Bearings, Die-Set Flange Mount Bearings, Pillow Blocks, Square Bearings and various Shafts & Slides for motion control - Mobile Computers for Enterprises (We private label these with your brand name and logo if you wish) - Motor Starter with UL and CE Certification NS2100111-1158052 - Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) - Process Automation Solutions (We private label these with your brand name and logo if you wish) - RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) - Vandal-Proof IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals Download brochure for our CUSTOM MACHINE AND EQUIPMENT MANUFACTURING Dowload brochure for our DESIGN PARTNERSHIP PROGRAM If you are looking for industrial computers, embedded computers, panel PC for your automation system, we invite you to visit our industrial computers store at http://www.agsindustrialcomputers.com If you would like to obtain more information about our engineering and research & development capabilities besides manufacturing capabilities, then we invite you to visit our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Wireless Components - Antenna - Radio Frequency Devices - RF Devices - Remote Sensing and Control - High Frequency RF and Wireless Devices Manufacturing & Assembly • Wireless components, devices and assemblies for remote sensing, remote control and communication. We can help you during the design, development, prototyping or mass production of various types of fixed, mobile, and portable two way radios, cellular telephones, GPS units, personal digital assistants (PDAs), smart and remote control equipment and wireless networking devices and instruments. We also have off-shelf wireless components and devices you can select from our brochures below. Antenna Brochure for 5G - LTE 4G - LPWA 3G - 2G - GPS - GNSS - WLAN - BT - Combo - ISM Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) Barcode Scanners (We private label these with your brand name and logo if you wish) High frequency devices product line (Band Pass Filters, Low Pass Filters, IPD, CPL, Balanced Filter, Diplexer, Balun, Chip Antenna...etc.) Microwave Flexible Cable Assembly Microwave and Milimeter Wave Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Precision RF Adapter s Catalog (Coax RF, Microwave, mmWave Adapters such as SMA, SSMA, SMP, BNC, Type-N, 3.5 mm.....etc) Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) RF Components Brochure for Coaxial Fixed Attenuators, Coaxial Terminations, DC Blocks, Coax Adapters, Waveguide Components, Power Dividers, RF Connectors, RF Tools. RF devices and high frequency inductors (Multilayer Ceramic Capacitors, Chip-Resistor, Disc Capacitors, RF & HF Inductor Varistors & SMD-Varistors, Chip Antenna, Filters, Coupler) RF and Microwave Components (Broadband 90/180 Degree Hybrid and Coupler, Broadband Power Divider, Filter, RF switch, Broadband Amplifier, Broadband Frequency Synthesizer) RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) RF Product Overview Chart (RF Antenna, Multilayer Ceramic Filter, Multilayer Ceramic Balun, Ceramic Diplexer) Soft Ferrites - Cores - Toroids - EMI Suppression Products - RFID Transponders and Accessories Brochure Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum components, BNC, SHV adapters and connectors, conductors and contact pins, connector terminals can be found here: Factory Brochure Dowload brochure for our DESIGN PARTNERSHIP PROGRAM We also participate in Third Party Resource Program and are a reseller of products offered by RF Digital ( Website: http://www.rfdigital.com ) , a company that manufactures an extensive line of fully integrated, low cost, high quality, high performance, configurable Wireless RF Transmitter, Receiver & Transceiver Modules, suitable for a wide range of applications. We participate in RF Digital's referral program as a Product Design and Development Company. Contact us to take advantage of our fully integrated, configurable Wireless RF Transmitter, Receiver & Transceiver Modules, High Frequency RF Devices, and most importantly of our consulting services regarding the implementation and application of these wireless components and devices and our engineering integration services. We can make you realize your new product development cycle by assisting you at every phase of the process, from concept to design to prototyping to first article manufacturing to mass production. • Some applications of wireless technology we can help you with are: - Wireless security systems - Remote control of consumer electronic devices or commercial equipment. - Cellular telephony (phones and modems): - WiFi - Wireless energy transfer - Radio communication devices - Short-range point-to-point communication devices such as wireless microphones, remote controls, IrDA, RFID (Radio Frequency Identification), Wireless USB, DSRC (Dedicated Short Range Communications), EnOcean, Near Field Communication, Wireless Sensor Networks : ZigBee, EnOcean; Personal area networks, Bluetooth, Ultra-wideband, wireless computer networks: Wireless Local Area Networks (WLAN), Wireless Metropolitan Area Networks (WMAN)...etc. More information on our engineering and research & development capabilities is available at our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Industrial Servers - Database Server - File Server - Mail Server - Print Server - Web Server - AGS-TECH Inc. - NM - USA Industrial Servers When referring to client-server architecture, a SERVER is a computer program that runs to serve the requests of other programs, also considered as the ''clients''. In other words the ''server'' performs computational tasks on behalf of its ''clients''. The clients may either run on the same computer or be connected through the network. In popular use however, a server is a physical computer dedicated to running as a host one or more of these services and to serve the needs of users of the other computers on the network. A server could be a DATABASE SERVER, FILE SERVER, MAIL SERVER, PRINT SERVER, WEB SERVER, or else depending on the computing service it offers. We offer the best quality industrial server brands available such as ATOP TECHNOLOGIES, KORENIX and JANZ TEC . Click on blue highlighted text below to download respective catalogs and brochures: - ATOP TECHNOLOGIES compact product brochure - ATOP Technologies Product List 2021) - ICP DAS brand industrial communication and networking products brochure - ICP DAS brand Tiny Device Server and Modbus Gateway brochure - JANZ TEC brand compact product brochure - KORENIX brand compact product brochure To choose a suitable Industrial Grade Server, please go to our industrial computer store by CLICKING HERE. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM DATABASE SERVER : This term is used to refer to the back-end system of a database application using client/server architecture. The back-end database server performs tasks such as data analysis, data storage, data manipulation, data archiving, and other non-user specific tasks. FILE SERVER : In the client/server model, this is a computer responsible for the central storage and management of data files so that other computers on the same network can access them. File servers allow users to share information over a network without physically transferring files by floppy disk or other external storage devices. In sophisticated and professional networks, a file server might be a dedicated network-attached storage (NAS) device that also serves as a remote hard disk drive for other computers. Thus anyone on the network can store files on it like to their own hard drive. MAIL SERVER : A mail server, also called an e-mail server is a computer within your network that works as your virtual post office. It consists of a storage area where e-mail is stored for local users, a set of user defined rules determining how the mail server should react to the destination of a specific message, a database of user accounts that the mail server will recognize and deal with locally, and communications modules which handle the transfer of messages to and from other email servers and clients. Mail servers are generally designed to operate with no manual intervention during normal operation. PRINT SERVER : Sometimes called a printer server, this is a device that connects printers to client computers over a network. Print servers accept print jobs from the computers and send the jobs to the appropriate printers. Print server queues jobs locally because work may arrive more quickly than the printer can actually handle it. WEB SERVER : These are computers that deliver and serve Web pages. All Web servers have IP addresses and generally domain names. When we enter the URL of a website in our browser, this sends a request to the Web server whose domain name is the website entered. The server then fetches the page named index.html and sends it to our browser. Any computer can be turned into a Web server by installing server software and connecting the machine to the Internet. There are many Web server software applications such as packages from Microsoft and Netscape. CLICK Product Finder-Locator Service PREVIOUS PAGE