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Industrial Processing Machines and Equipment Manufacturing, Custom Manufacture of Machines, Motion Control, Power & Control, Dipping and Dispensing, Pick and Place, Controlled Shaking, Controlled Rotation, Slitting and Cutting, Oiling, Surface Finishing, Painting, Coating, Controlled Grinding and Chopping, Automated Inspection, Special Purpose Machines Automation, One-Off Machines, Smart Factory Industrial Processing Machines and Equipment Manufacturing We supply our customers custom manufactured and off-shelf industrial processing machines and equipment. - Brand new custom manufactured industrial machine or equipment made to your needs and specifications. - Brand new off-shelf industrial machines and equipment - Refurbished, rebuilt or upgraded industrial machines and equipment Some types of machines and equipment we are experienced in include the following generic groups: - Robotic Machines, Robots - High Vacuum Equipment - Equipment for clean rooms and critical environments. - Thermal Processing Machines and Equipment - Continuous Process Machines and Equipment - Web Forming, Handling & Converting Some of the type of automation we can incorporate in your custom made equipment include: - Motion Control - Power & Control - Dipping and Dispensing - Pick and Place - Controlled Shaking - Controlled Rotation - Slitting and Cutting - Oiling, Surface Finishing, Painting, Coating - Controlled Grinding and Chopping - Automated Inspection - Special Purpose Machines Automation - One-Off Machines - Smart Factory - PLC Machines and equipment we build or supply include the following industrial sectors: - Food and Beverage - Heavy Industry - Biomedical - Pharmaceutical - Chemical Industry - Construction - Glass and Ceramics Industry - High-Tech Industries - Consumer Goods Industry - Textile Industry Some specific machines and equipment built, rebuilt or upgraded include: - Pipe bending machines - Press room equipment such as sheet metal bending and forming machines - Cable and wire winding machines, coil processing - Hydraulic and pneumatic lifting, turning systems - Single and double leg crushers - Labeling, printing, packaging machines - Metal forming machinery - Custom part handling machinery - Slitting, trimming, cutting machines - Shape correction and leveling machinery - Grinding machines - Chopping Machinery - Ovens, dryers, roasters - Food processing machines - Sizing and separation machines - Industrial filling machine solutions - Horizontal, incline, belt, bucket conveyors - Oiling, finishing, painting, coating machines - Surface treatment equipment - Pollution control equipment - Inspection and quality control equipment - 2D and 3D vision systems Download brochure for our CUSTOM MACHINE AND EQUIPMENT MANUFACTURING D owload brochure for our DESIGN PARTNERSHIP PROGRAM Below, you can click and download brochures of some high quality products we use in manufacturing and integration of your custom industrial machines and equipment . If you wish, you may also procure these products from us for below list-prices and build your own systems: Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) Barcode Scanners (We private label these with your brand name and logo if you wish) Brazing Machines (We private label these with your brand name and logo if you wish) Catalog for Vandal-Proof IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals Collaborative Robots Customized Agricultural Robots Customized Commercial Places Robots Customized Health Care and Hospital Robots Customized Warehousing Robots Customized Robots for a Variety of Applications Fixed Industrial Scanners (We private label these with your brand name and logo if you wish) Hikrobot Machine Vision Products Hikrobot Smart Machine Vision Products Hikrobot Machine Vision Standard Products Hikvision Logistic Vision Solutions Hose Crimping Machines (We private label these with your brand name and logo if you wish) Hose-Cut-Off-Skive-Machine (We private label these with your brand name and logo if you wish) Hose Endforming Machines (We private label these with your brand name and logo if you wish) Kiosk Systems (We private label these with your brand name and logo if you wish) Kiosk Systems Accessories Guide (We private label these with your brand name and logo if you wish) Mobile Computers for Enterprises (We private label these with your brand name and logo if you wish) Power Tools for Every Industry (We private label these with your brand name and logo if you wish) Printers for Barcode Scanners and Mobile Computers (We private label these with your brand name and logo if you wish) Process Automation Solutions (We private label these with your brand name and logo if you wish) RFID Readers - Scanners - Encoders - Printers (We private label these with your brand name and logo if you wish) Robot Palletizing Workstation Robotic Laser Welding Workstation Robotics Product Brochure Robotics Workstations Selection Guide of Industrial Robot Platforms Servo C-Frame Utility Press (We private label these with your brand name and logo if you wish) Tube Bending Machines (We private label these with your brand name and logo if you wish) Welding Robots Brochure You may also find our following page useful: Jigs, Fixtures, Tools, Workholding Solutions,Mold Components Manufacturing CLICK Product Finder-Locator Service PREVIOUS PAGE

Test Equipment for Cookware Testing, Cookware Tester, Cutlery Corrosion Resistance Tester, Strength Test Apparatus for Knives, Forks, Spatulas, Bending Strength Tester for Cookware Handles Test Equipment for Cookware Testing Specialized Test Equipment for Testing of Cookware are used for testing cookware products such as pots, pressure cookers....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for COOKWARE TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for COOKWARE TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of cookware are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of cookware can be downloaded from the colored links below: Haida Cookware Testing Machines Catalog For other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

General Sales Terms for Manufactured Parts & Products at AGS-TECH Inc.- a Flexible Global Custom Manufacturer, Fabricator, Consolidator, Engineering Integrator. General Sales Terms at AGS-TECH Inc Below you will find the GENERAL SALES TERMS AND CONDITIONS of AGS-TECH Inc. Seller AGS-TECH Inc. does submit a copy of these terms and conditions along with offers and quotes to its customers. These are general sales terms and conditions of seller AGS-TECH Inc. and should not be considered to be valid for every transaction. However please note that for any deviations or modifications to these general sales terms and conditions, buyers need to contact AGS-TECH Inc and obtain approval in writing. If no mutually agreed modified version of sales terms and conditions exist, these terms and conditions of AGS-TECH Inc. stated below shall apply. We also want to emphasize that the primary goal of AGS-TECH Inc. is to provide products and services that meet or exceed customers expectations, and make its customers globally competitive. Therefore the relationship of AGS-TECH Inc. will always be more of a long term sincere relationship and partnership with its customers and not one that is based on pure formality. 1. ACCEPTANCE. This proposal does not constitute an offer, but is an invitation to the Buyer to place an order which invitation shall be open for thirty (30) days. All orders are made subject to final written acceptance by AGS-TECH, INC. (hereinafter referred to as “seller”) The terms and conditions herein shall apply to and govern buyer’s order, and, in case of any inconsistency between these terms and conditions and buyer’s order, the terms and conditions herein shall prevail. Seller objects to the inclusion of any different or additional terms proposed by the buyer in its offer and if they are included in buyer’s acceptance, a contract for sale will result upon seller’s terms and conditions stated herein. 2. DELIVERY. The quoted delivery date is our best estimate based upon present scheduling requirements and may be deviated from without liability by a reasonably longer period at Seller’s discretion due to manufacturing contingencies. Seller shall not be liable for failure to deliver on any specific date or dates within any specific period of time in the event of hardships or causes beyond its control including, but not limited to, acts of God or the public enemy, governmental orders, restrictions or priorities, fires, floods, strikes, or other work stoppages, accidents, catastrophes, war conditions, riot or civil commotion, labor, material and/or transportation shortages, legal interferences or prohibitions, embargoes, defaults or delays of subcontractors and suppliers, or similar or different causes which render performance or timely delivery difficult or impossible; and, in any such event Seller shall not incur or be subject to any liability whatsoever. Buyer shall not by reason of any such cause, have any right of cancellation, nor any right to suspend, delay or otherwise prevent Seller from manufacturing, shipping or storing for Buyer’s account any material or other goods purchased hereunder, nor to withhold payment therefore. Buyer’s acceptance of delivery shall constitute a waiver of any claim for delay. If goods ready for shipment on or after the scheduled delivery date cannot be shipped because of Buyer’s request or for any other reason beyond Seller’s control, payment shall be made within thirty (30) days after Buyer has been notified that the same are ready for shipment, unless otherwise agreed in writing between Buyer and Seller. If at any time shipment is deferred or delayed, Buyer shall store the same at Buyer’s risk and expense and, if Buyer fails or refuses to store the same, Seller shall have the right to do so at Buyer’s risk and expense. 3. FREIGHT/RISK OF LOSS. Unless otherwise indicated, all shipments are made FOB, place of shipment and Buyer agrees to pay all charges for transportation, including insurance. Buyer assumes all risk of loss and damage from the time the goods are deposited with the carrier 4. INSPECTION/REJECTION. Buyer shall have ten (10) days after receipt of goods to inspect and either accept or reject. If goods are rejected, written notice of rejection and the specific reasons therefore must be sent to seller within such ten (10) day period after receipt. Failure to reject goods or to notify Seller of errors, shortages, or other non-compliance with the agreement within such ten (10) day period shall constitute irrevocable acceptance of goods and admission that they fully comply with the Agreement. 5. NON-RECURRING EXPENSE (NRE), DEFINITION/PAYMENT. Whenever used in the Seller’s quotation, acknowledgement or other communication, NRE is defined as a one-time Buyer borne cost for (a) the modification or adaptation of Seller owned tooling to allow manufacturing to Buyer’s exact requirements, or (b) the analysis and precise definition of the Buyer’s requirements. Buyer shall further pay for any necessary repairs or replacements to tools after tool life specified by Seller. At such time that Non-Recurring Expenses are specified by the Seller, Buyer shall pay 50% thereof with its Purchase Order and the balance thereof upon Buyer’s approval of the design, prototype or samples produced. 6. PRICES AND TAXES. Orders are accepted on the basis of prices listed. Any added expense incurred by the Seller because of delays in receipt of details, specifications, or other pertinent information, or because of changes requested by the Buyer shall be chargeable to the Buyer and payable upon invoice. The Buyer in addition to the purchase price shall assume and pay any and all sales, use, excise, license, property and/or other taxes and fees together with any interest and penalties thereon and expenses in connection therewith growing out of, relating to, affecting or pertaining to, the sale of property, service other subject matter of this order, and Buyer shall indemnify Seller and save and hold Seller harmless from and against any claim, demand or liability for and such tax or taxes, interest or 7. PAYMENT TERMS. Items ordered will be billed as shipments made and payment to Seller shall be net cash in United States funds, thirty (30) days from date of shipment by the Seller, unless otherwise specified in writing. No cash discount will be allowed. If Buyer delays manufacture or shipment, payment of the percentage of completion (based on the contract price) shall become immediately due. 8. LATE CHARGE. If invoices are not paid when due, Buyer agrees to pay late charges on the unpaid delinquent balance at the rate of 1 ½% thereof per month. 9. COST OF COLLECTION. Buyer agrees to pay any and all costs including but not limited to all attorney's fees, in the event Seller must refer Buyer’s account to an attorney for collection or enforcement of any of the terms and conditions of sale. 10. SECURITY INTEREST. Until payment is received in full, Seller shall retain a security interest in the goods hereunder and the Buyer authorizes Seller to execute on Buyer’s behalf a standard financing statement setting forth Seller’s security interest to be filed under the applicable filing provisions or any other document necessary to perfect Seller’s security interest in the goods in any state, country or jurisdiction. Upon Seller’s request, Buyer shall promptly execute any such documentation. 11. WARRANTY. Seller warrants that the component goods sold will meet the specifications set forth in writing by Seller. If Buyer’s order is for a complete optical system, from image to object, and Buyer provides all information to its requirements and use, Seller also warrants performance of the system, within the characteristics set forth in writing by Seller. Seller makes no warranty of fitness or merchantability and no warranty oral or written, express or implied, except as specifically set forth herein. The provisions and specifications attached hereto are descriptive only and are not to be understood as warranties. Seller’s warranty shall not apply if persons other than the seller have without written consent of seller performed any work or made any alteration in the goods supplied by the seller. Seller shall under no circumstances be liable for any loss of profits or other economic loss, or any special, indirect consequential damages arising from the loss of production or other damages or losses owing to the failure of seller’s goods or the supply by the seller of defective goods, or by reason of any other breach of this contract by seller. Buyer hereby waives any right to damages in the events it rescinds this contract for breach of warranty. This warranty extends only to the original buyer. No subsequent buyer or user is covered. 12. INDEMNIFICATION. Buyer agrees to indemnify Seller and save it harmless from and against any claim, demand or liability arising out of or in connection with the sale of the goods by Seller or the use of the goods by Buyer and this includes but is not limited to damage to property or persons. Buyer agrees to defend at its expense any suit against Seller respecting infringement (including contributory infringement) of any United States or other patent covering all or parts of the goods furnished under an order, its manufacture and/or its use and will pay costs, fees and/or damages awarded against Seller for such infringement by any final court decision; provided Seller notifies Buyer promptly of any charge of or suit for such infringement and tenders Buyer the defense of such suit; Seller having the right to be represented in such defense at Seller’s expense. 13. PROPRIETARY DATA. All specifications and technical material submitted by Seller and all inventions and discoveries made by Seller in carrying out any transaction based thereon are the property of Seller and are confidential and shall not be disclosed to or discussed with others. All such specifications and technical material submitted with this order or in carrying out any transaction based hereon shall be returned to Seller on demand. Descriptive matter furnished with this order is not binding as to detail unless certified correct by Seller in acknowledging an order relating thereto. 14. AGREEMENT MODIFICATIONS. The terms and conditions contained herein and any other terms and conditions stated in Seller’s proposal or specifications attached hereto, if any, shall constitute the complete agreement between Seller and Buyer and shall supersede all prior oral or written statements or understandings of any kind whatsoever made by the parties or their representatives. No statement subsequent to the acceptance of this order purporting to modify the said terms and conditions shall be binding unless consented to in writing by a duly authorized officer or manager of Seller. 15. CANCELLATION AND BREACH. This order shall not be countermanded, cancelled or altered by the Buyer, nor shall the Buyer otherwise cause the work or shipment to be delayed, except with the written consent and upon the terms and conditions approved by the Seller in writing. Such consent will be granted if at all, only upon the condition that Buyer shall pay Seller reasonable cancellation charges, which shall include compensation for the costs incurred, overhead, and lost profits. In event that the Buyer cancels this contract without Seller’s written consent or breaches this contract by failing to adhere to Seller for breach of contract and shall pay Sellers damages resulting from such breach including, but not limited to, lost profits, direct and indirect damages, costs incurred and attorneys’ fees. If Buyer is in default under this or any other contract with the Seller, or if Seller at any time shall not be satisfied with Buyer’s financial responsibility, Seller shall have the right, without prejudice to any other legal remedy, to suspend deliveries hereunder until such default or condition is remedied. 16. PLACE OF CONTRACT. Any contract arising out of the placing of any orders and the acceptance thereof by Seller, shall be a New Mexico contract and shall be interpreted and administered for all purposes under the laws of State of New Mexico. The Bernalillo County, NM is hereby designated as the place of trial for any action or proceeding arising out of or in connection with this Agreement. 17. LIMITATION OF ACTION. Any action by the Buyer against the Seller for the breach of this contract or the warranty described herein will be barred unless commenced within one year after the date of delivery or invoice, whichever is earlier. PREVIOUS PAGE

Camera Systems - Components - Optic Scanner - Optical Readers - Imaging System - CCD - Optomechanical Systems - IR Cameras Customized Camera Systems Manufacturing & Assembly AGS-TECH offers: • Camera systems, camera components and custom camera assemblies • Custom designed and manufactured optical scanners, readers, optical security product assemblies. • Precision optical, opto-mechanical and electro-optical assemblies integrating imaging and nonimaging optics, LED lighting, fiber optics and CCD cameras • Among the products our optical engineers have developed are: - Omni-directional periscope and camera for surveillance and security applications. 360 x 60º field of view high resolution image, no stitching required. - Inner cavity wide angle video camera - Super slim 0.6 mm diameter flexible video endoscope. All medical video couplers fit over standard endoscope eyepieces and are completely sealed and soakable. For our medical endoscope and camera systems, please visit: http://www.agsmedical.com - Video camera and coupler for semi-rigid endoscope - Eye-Q Videoprobe. Non-contact zoom videoprobe for coordinate measuring machines. - Optical spectrograph & IR imaging system (OSIRIS) for ODIN satellite. Our engineers worked on the flight unit assembly, alignment, integration and test. - Wind imaging interferometer (WINDII) for NASA upper atmosphere research satellite (UARS). Our engineers worked on consulting on assembly, integration and test. WINDII performance and operational lifetime far exceeded the design goals and requirements. Depending on your application, we will determine what dimensions, pixel count, resolution, wavelength sensitivity your camera application requires. We can build systems for you suitable for infrared, visible and other wavelengths. Contact us today to find out more. Dowload brochure for our DESIGN PARTNERSHIP PROGRAM Developing a customized camera system can take relatively longer lead times and cost more as compared to ready-to-use systems. Therefore please click on the blue links below to check whether any of our ready-to-use products fit your application: Barcode and Fixed Mount Scanners - RFID Products - Mobile Computers - Micro Kiosks OEM Technology (We private label these with your brand name and logo if you wish) Barcode Scanners (We private label these with your brand name and logo if you wish) Fixed Industrial Scanners (We private label these with your brand name and logo if you wish) Hikrobot Machine Vision Products Hikrobot Smart Machine Vision Products Hikrobot Machine Vision Standard Products Hikvision Logistic Vision Solutions Private Label Medical Endoscopes and Visualization Systems (We can put your company name and logo on these) Also make sure to download our comprehensive electric & electronic components catalog for off-shelf products by CLICKING HERE. CLICK Product Finder-Locator Service PREVIOUS PAGE

Electronic Testers - Electrical Test Equipment - Electrical Properties Testing - Oscilloscope - Signal Generator - Function Generator - Pulse Generator - Frequency Synthesizer - Multimeter Electrical & Electronic Test Equipment With the term ELECTRONIC TESTER we refer to test equipment that is used primarily for testing, inspection and analysis of electrical and electronic components and systems. We offer the most popular ones in the industry: POWER SUPPLIES & SIGNAL GENERATING DEVICES: POWER SUPPLY, SIGNAL GENERATOR, FREQUENCY SYNTHESIZER, FUNCTION GENERATOR, DIGITAL PATTERN GENERATOR, PULSE GENERATOR, SIGNAL INJECTOR METERS: DIGITAL MULTIMETERS, LCR METER, EMF METER, CAPACITANCE METER, BRIDGE INSTRUMENT, CLAMP METER, GAUSSMETER / TESLAMETER/ MAGNETOMETER, GROUND RESISTANCE METER ANALYZERS: OSCILLOSCOPES, LOGIC ANALYZER, SPECTRUM ANALYZER, PROTOCOL ANALYZER, VECTOR SIGNAL ANALYZER, TIME-DOMAIN REFLECTOMETER, SEMICONDUCTOR CURVE TRACER, NETWORK ANALYZER, PHASE ROTATION TESTER, FREQUENCY COUNTER You can purchase brand new, refurbished or used test equipment from us at the most competitive discounted prices. Simply choose the product from the downloadable catalogs and let us know the product name, product code and relevant information and we will send you our quote. Download by clicking on highlighted text: ANRITSU Electronic Measuring Instruments FLUKE Test Tools Catalog KEYSIGHT Basic Automotive Test Products KEYSIGHT Basic Instruments KEYSIGHT Bench and Power Products KEYSIGHT Network Analyzer Products KEYSIGHT Signal Generation Solutions KEYSIGHT Smart Bench Essentials Series Products KEYSIGHT High-Volume Traffic Generator Products KEYSIGHT Layer 4-7 Network Test Products KEYSIGHT Layer 2-3 Network Test Products KEYSIGHT Distribution Products Catalog MEGGER Low Voltage Test Tools Catalog MICROWAVE Flexible Cable Assembly MICROWAVE and MILIMETER WAVE Test Accessories Brochure (Cable assemblies, VNA Test Assemblies, Mechanical Calibration Kits, RF Coaxial Adapters, Test Port Adapters, DC Blocks, NMD Connectors....etc.) Private Label Hand Tools for Every Industry (This catalog contains a few electrical & electronic test instruments. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers.) ROHDE SCHWARZ Benchtop Power Supplies Ideal for labs and system racks, galvanic isolation, floating channels, constant voltage or current modes, protection functions, parallel and serial operation, low ripple/noise, remote sensing option ROHDE SCHWARZ Test Equipment Catalog (Oscilloscopes, Power Supplies, Signal Generators, Handheld Analyzers, Spectrum Analyzers, Vector Network Analyzers, Meters & Counters) TEKTRONIX Product Catalog for Test and Measurement Solutions VANDAL-PROOF IP65/IP67/IP68 Keyboards, Keypads, Pointing Devices, ATM Pinpads, Medical & Military Keyboards and other similar Rugged Computer Peripherals For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com Let us briefly go over some of these equipment in everyday use throughout the industry: The electrical power supplies we supply for metrology purposes are discrete, benchtop and stand-alone devices. The ADJUSTABLE REGULATED ELECTRICAL POWER SUPPLIES are some of the most popular ones, because their output values can be adjusted and their output voltage or current is maintained constant even if there are variations in input voltage or load current. ISOLATED POWER SUPPLIES have power outputs that are electrically independent of their power inputs. Depending on their power conversion method, there are LINEAR and SWITCHING POWER SUPPLIES. The linear power supplies process the input power directly with all their active power conversion components working in the linear regions, whereas the switching power supplies have components working predominantly in non-linear modes (such as transistors) and convert power to AC or DC pulses before processing. Switching power supplies are generally more efficient than linear supplies because they lose less power due to shorter times their components spend in the linear operating regions. Depending on application, a DC or AC power is used. Other popular devices are PROGRAMMABLE POWER SUPPLIES, where voltage, current or frequency can be remotely controlled through an analog input or digital interface such as an RS232 or GPIB. Many of them have an integral microcomputer to monitor and control the operations. Such instruments are essential for automated testing purposes. Some electronic power supplies use current limiting instead of cutting off power when overloaded. Electronic limiting is commonly used on lab bench type instruments. SIGNAL GENERATORS are another widely used instruments in lab and industry, generating repeating or non-repeating analog or digital signals. Alternatively they are also called FUNCTION GENERATORS, DIGITAL PATTERN GENERATORS or FREQUENCY GENERATORS. Function generators generate simple repetitive waveforms such as sine waves, step pulses, square & triangular and arbitrary waveforms. With Arbitrary waveform generators the user can generate arbitrary waveforms, within published limits of frequency range, accuracy, and output level. Unlike function generators, which are limited to a simple set of waveforms, an arbitrary waveform generator allows the user to specify a source waveform in a variety of different ways. RF and MICROWAVE SIGNAL GENERATORS are used for testing components, receivers and systems in applications such as cellular communications, WiFi, GPS, broadcasting, satellite communications and radars. RF signal generators generally work between a few kHz to 6 GHz, while microwave signal generators operate within a much wider frequency range, from less than 1 MHz to at least 20 GHz and even up to hundreds of GHz ranges using special hardware. RF and microwave signal generators can be classified further as analog or vector signal generators. AUDIO-FREQUENCY SIGNAL GENERATORS generate signals in the audio-frequency range and above. They have electronic lab applications checking of the frequency response of audio equipment. VECTOR SIGNAL GENERATORS, sometimes also referred to as DIGITAL SIGNAL GENERATORS are capable of generating digitally-modulated radio signals. Vector signal generators can generate signals based on industry standards such as GSM, W-CDMA (UMTS) and Wi-Fi (IEEE 802.11). LOGIC SIGNAL GENERATORS are also called DIGITAL PATTERN GENERATOR. These generators produce logic types of signals, that is logic 1s and 0s in the form of conventional voltage levels. Logic signal generators are used as stimulus sources for functional validation & testing of digital integrated circuits and embedded systems. The devices mentioned above are for general-purpose use. There are however many other signal generators designed for custom specific applications. A SIGNAL INJECTOR is a very useful and quick troubleshooting tool for signal tracing in a circuit. Technicians can determine the faulty stage of a device such as a radio receiver very quickly. The signal injector can be applied to the speaker output, and if the signal is audible one can move to the preceding stage of the circuit. In this case an audio amplifier, and if the injected signal is heard again one can move the signal injection up the stages of the circuit until the signal is no longer audible. This will serve the purpose of locating the location of the problem. A MULTIMETER is an electronic measuring instrument combining several measurement functions in one unit. Generally, multimeters measure voltage, current, and resistance. Both digital and analog version are available. We offer portable hand-held multimeter units as well as laboratory-grade models with certified calibration. Modern multimeters can measure many parameters such as: Voltage (both AC / DC), in volts, Current (both AC / DC), in amperes, Resistance in ohms. Additionally, some multimeters measure: Capacitance in farads, Conductance in siemens, Decibels, Duty cycle as a percentage, Frequency in hertz, Inductance in henries, Temperature in degrees Celsius or Fahrenheit, using a temperature test probe. Some multimeters also include: Continuity tester; sounds when a circuit conducts, Diodes (measuring forward drop of diode junctions), Transistors (measuring current gain and other parameters), battery checking function, light level measuring function, acidity & Alkalinity (pH) measuring function and relative humidity measuring function. Modern multimeters are often digital. Modern digital multimeters often have an embedded computer to make them very powerful tools in metrology and testing. They include features such as:: •Auto-ranging, which selects the correct range for the quantity under test so that the most significant digits are shown. •Auto-polarity for direct-current readings, shows if the applied voltage is positive or negative. •Sample and hold, which will latch the most recent reading for examination after the instrument is removed from the circuit under test. •Current-limited tests for voltage drop across semiconductor junctions. Even though not a replacement for a transistor tester, this feature of digital multimeters facilitates testing diodes and transistors. •A bar graph representation of the quantity under test for better visualization of fast changes in measured values. •A low-bandwidth oscilloscope. •Automotive circuit testers with tests for automotive timing and dwell signals. •Data acquisition feature to record maximum and minimum readings over a given period, and to take a number of samples at fixed intervals. •A combined LCR meter. Some multimeters can be interfaced with computers, while some can store measurements and upload them to a computer. Yet another very useful tool, an LCR METER is a metrology instrument for measuring the inductance (L), capacitance (C), and resistance (R) of a component. The impedance is measured internally and converted for display to the corresponding capacitance or inductance value. Readings will be reasonably accurate if the capacitor or inductor under test does not have a significant resistive component of impedance. Advanced LCR meters measure true inductance and capacitance, and also the equivalent series resistance of capacitors and the Q factor of inductive components. The device under test is subjected to an AC voltage source and the meter measures the voltage across and the current through the tested device. From the ratio of voltage to current the meter can determine the impedance. The phase angle between the voltage and current is also measured in some instruments. In combination with the impedance, the equivalent capacitance or inductance, and resistance, of the device tested can be calculated and displayed. LCR meters have selectable test frequencies of 100 Hz, 120 Hz, 1 kHz, 10 kHz, and 100 kHz. Benchtop LCR meters typically have selectable test frequencies of more than 100 kHz. They often include possibilities to superimpose a DC voltage or current on the AC measuring signal. While some meters offer the possibility to externally supply these DC voltages or currents other devices supply them internally. An EMF METER is a test & metrology instrument for measuring electromagnetic fields (EMF). Majority of them measure the electromagnetic radiation flux density (DC fields) or the change in an electromagnetic field over time (AC fields). There are single axis and tri-axis instrument versions. Single axis meters cost less than tri-axis meters, but take longer to complete a test because the meter only measures one dimension of the field. Single axis EMF meters have to be tilted and turned on all three axes to complete a measurement. On the other hand, tri-axis meters measure all three axes simultaneously, but are more expensive. An EMF meter can measure AC electromagnetic fields, which emanate from sources such as electrical wiring, while GAUSSMETERS / TESLAMETERS or MAGNETOMETERS measure DC fields emitted from sources where direct current is present. The majority of EMF meters are calibrated to measure 50 and 60 Hz alternating fields corresponding to the frequency of US and European mains electricity. There are other meters which can measure fields alternating at as low as 20 Hz. EMF measurements can be broadband across a wide range of frequencies or frequency selective monitoring only the frequency range of interest. A CAPACITANCE METER is a test equipment used to measure capacitance of mostly discrete capacitors. Some meters display the capacitance only, whereas others also display leakage, equivalent series resistance, and inductance. Higher end test instruments use techniques such as inserting the capacitor-under-test into a bridge circuit. By varying the values of the other legs in the bridge so as to bring the bridge into balance, the value of the unknown capacitor is determined. This method ensures greater precision. The bridge may also be capable to measure series resistance and inductance. Capacitors over a range from picofarads to farads may be measured. Bridge circuits do not measure leakage current, but a DC bias voltage can be applied and the leakage measured directly. Many BRIDGE INSTRUMENTS can be connected to computers and data exchange be made to download readings or to control the bridge externally. Such bridge instruments aso offer go / no go testing for automation of tests in a fast paced production & quality control environment. Yet, another test instrument, a CLAMP METER is an electrical tester combining a voltmeter with a clamp type current meter. Most modern versions of clamp meters are digital. Modern clamp meters have most of the basic functions of a Digital Multimeter, but with the added feature of a current transformer built into the product. When you clamp the instrument’s “jaws” around a conductor carrying a large ac current, that current is coupled through the jaws, similar to the iron core of a power transformer, and into a secondary winding which is connected across the shunt of the meter’s input, the principle of operation resembling much that of a transformer. A much smaller current is delivered to the meter’s input due to the ratio of the number of secondary windings to the number of primary windings wrapped around the core. The primary is represented by the one conductor around which the jaws are clamped. If the secondary has 1000 windings, then the secondary current is 1/1000 the current flowing in the primary, or in this case the conductor being measured. Thus, 1 amp of current in the conductor being measured would produce 0.001 amps of current at the input of the meter. With clamp meters much larger currents can be easily measured by increasing the number of turns in the secondary winding. As with most of our test equipment, advanced clamp meters offer logging capability. GROUND RESISTANCE TESTERS are used for testing the earth electrodes and the soil resistivity. The instrument requirements depend on the range of applications. Modern clamp-on ground testing instruments simplify ground loop testing and enable non-intrusive leakage current measurements. Among the ANALYZERS we sell are OSCILLOSCOPES without doubt one of the most widely used equipment. An oscilloscope, also called an OSCILLOGRAPH, is a type of electronic test instrument that allows observation of constantly varying signal voltages as a two-dimensional plot of one or more signals as a function of time. Non-electrical signals like sound and vibration can also be converted to voltages and displayed on oscilloscopes. Oscilloscopes are used to observe the change of an electrical signal over time, the voltage and time describe a shape which is continuously graphed against a calibrated scale. Observation and analysis of the waveform reveals us properties such as amplitude, frequency, time interval, rise time, and distortion. Oscilloscopes can be adjusted so that repetitive signals can be observed as a continuous shape on the screen. Many oscilloscopes have storage function that allows single events to be captured by the instrument and displayed for a relatively long time. This allows us to observe events too fast to be directly perceptible. Modern oscilloscopes are lightweight, compact and portable instruments. There are also miniature battery-powered instruments for field service applications. Laboratory grade oscilloscopes are generally bench-top devices. There is a vast variety of probes and input cables for use with oscilloscopes. Please contact us in case you need advice about which one to use in your application. Oscilloscopes with two vertical inputs are called dual-trace oscilloscopes. Using a single-beam CRT, they multiplex the inputs, usually switching between them fast enough to display two traces apparently at once. There are also oscilloscopes with more traces; four inputs are common among these. Some multi-trace oscilloscopes use the external trigger input as an optional vertical input, and some have third and fourth channels with only minimal controls. Modern oscilloscopes have several inputs for voltages, and thus can be used to plot one varying voltage versus another. This is used for example for graphing I-V curves (current versus voltage characteristics) for components such as diodes. For high frequencies and with fast digital signals the bandwidth of the vertical amplifiers and sampling rate must be high enough. For-general purpose use a bandwidth of at least 100 MHz is usually sufficient. A much lower bandwidth is sufficient for audio-frequency applications only. Useful range of sweeping is from one second to 100 nanoseconds, with appropriate triggering and sweep delay. A well-designed, stable, trigger circuit is required for a steady display. The quality of the trigger circuit is key for good oscilloscopes. Another key selection criteria is the sample memory depth and sample rate. Basic level modern DSOs now have 1MB or more of sample memory per channel. Often this sample memory is shared between channels, and can sometimes only be fully available at lower sample rates. At the highest sample rates the memory may be limited to a few 10's of KB. Any modern ''real-time'' sample rate DSO will have typically 5-10 times the input bandwidth in sample rate. So a 100 MHz bandwidth DSO would have 500 Ms/s - 1 Gs/s sample rate. Greatly increased sample rates have largely eliminated the display of incorrect signals that was sometimes present in the first generation of digital scopes. Most modern oscilloscopes provide one or more external interfaces or buses such as GPIB, Ethernet, serial port, and USB to allow remote instrument control by external software. Here is a list of different oscilloscope types: CATHODE RAY OSCILLOSCOPE DUAL-BEAM OSCILLOSCOPE ANALOG STORAGE OSCILLOSCOPE DIGITAL OSCILLOSCOPES MIXED-SIGNAL OSCILLOSCOPES HANDHELD OSCILLOSCOPES PC-BASED OSCILLOSCOPES A LOGIC ANALYZER is an instrument that captures and displays multiple signals from a digital system or digital circuit. A logic analyzer may convert the captured data into timing diagrams, protocol decodes, state machine traces, assembly language. Logic Analyzers have advanced triggering capabilities, and are useful when the user needs to see the timing relationships between many signals in a digital system. MODULAR LOGIC ANALYZERS consist of both a chassis or mainframe and logic analyzer modules. The chassis or mainframe contains the display, controls, control computer, and multiple slots into which the data-capturing hardware is installed. Each module has a specific number of channels, and multiple modules can be combined to obtain a very high channel count. The ability to combine multiple modules to obtain a high channel count and the generally higher performance of modular logic analyzers makes them more expensive. For the very high end modular logic analyzers, the users may need to provide their own host PC or purchase an embedded controller compatible with the system. PORTABLE LOGIC ANALYZERS integrate everything into a single package, with options installed at the factory. They generally have lower performance than modular ones, but are economical metrology tools for general purpose debugging. In PC-BASED LOGIC ANALYZERS, the hardware connects to a computer through a USB or Ethernet connection and relays the captured signals to the software on the computer. These devices are generally much smaller and less expensive because they make use of a personal computer’s existing keyboard, display and CPU. Logic analyzers can be triggered on a complicated sequence of digital events, then capture large amounts of digital data from the systems under test. Today specialized connectors are in use. The evolution of logic analyzer probes has led to a common footprint that multiple vendors support, which provides added freedom to end users: Connectorless technology offered as several vendor-specific trade names such as Compression Probing; Soft Touch; D-Max is being used. These probes provide a durable, reliable mechanical and electrical connection between the probe and the circuit board. A SPECTRUM ANALYZER measures the magnitude of an input signal versus frequency within the full frequency range of the instrument. The primary use is to measure the power of the spectrum of signals. There are optical and acoustical spectrum analyzers as well, but here we will discuss only electronic analyzers that measure and analyze electrical input signals. The spectra obtained from electrical signals provides us information about frequency, power, harmonics, bandwidth…etc. The frequency is displayed on the horizonal axis and the signal amplitude on the vertical. Spectrum analyzers are widely used in the electronics industry for the analyses of the frequency spectrum of radio frequency, RF and audio signals. Looking at the spectrum of a signal we are able to reveal elements of the signal, and the performance of the circuit producing them. Spectrum analyzers are able to make a large variety of measurements. Looking at the methods used to obtain the spectrum of a signal we can categorize the spectrum analyzer types. - A SWEPT-TUNED SPECTRUM ANALYZER uses a superheterodyne receiver to down-convert a portion of the input signal spectrum (using a voltage-controlled oscillator and a mixer) to the center frequency of a band-pass filter. With a superheterodyne architecture, the voltage-controlled oscillator is swept through a range of frequencies, taking advantage of the full frequency range of the instrument. Swept-tuned spectrum analyzers are descended from radio receivers. Therefore swept-tuned analyzers are either tuned-filter analyzers (analogous to a TRF radio) or superheterodyne analyzers. In fact, in their simplest form, you could think of a swept-tuned spectrum analyzer as a frequency-selective voltmeter with a frequency range that is tuned (swept) automatically. It is essentially a frequency-selective, peak-responding voltmeter calibrated to display the rms value of a sine wave. The spectrum analyzer can show the individual frequency components that make up a complex signal. However it does not provide phase information, only magnitude information. Modern swept-tuned analyzers (superheterodyne analyzers, in particular) are precision devices that can make a wide variety of measurements. However, they are primarily used to measure steady-state, or repetitive, signals because they can't evaluate all frequencies in a given span simultaneously. The ability to evaluate all frequencies simultaneously is possible with only the real-time analyzers. - REAL-TIME SPECTRUM ANALYZERS: A FFT SPECTRUM ANALYZER computes the discrete Fourier transform (DFT), a mathematical process that transforms a waveform into the components of its frequency spectrum, of the input signal. The Fourier or FFT spectrum analyzer is another real-time spectrum analyzer implementation. The Fourier analyzer uses digital signal processing to sample the input signal and convert it to the frequency domain. This conversion is done using the Fast Fourier Transform (FFT). The FFT is an implementation of the Discrete Fourier Transform, the math algorithm used for transforming data from the time domain to the frequency domain. Another type of real-time spectrum analyzers, namely the PARALLEL FILTER ANALYZERS combine several bandpass filters, each with a different bandpass frequency. Each filter remains connected to the input at all times. After an initial settling time, the parallel-filter analyzer can instantaneously detect and display all signals within the analyzer's measurement range. Therefore, the parallel-filter analyzer provides real-time signal analysis. Parallel-filter analyzer is fast, it measures transient and time-variant signals. However, the frequency resolution of a parallel-filter analyzer is much lower than most swept-tuned analyzers, because the resolution is determined by the width of the bandpass filters. To get fine resolution over a large frequency range, you would need many many individual filters, making it costly and complex. This is why most parallel-filter analyzers, except the simplest ones in the market are expensive. - VECTOR SIGNAL ANALYSIS (VSA) : In the past, swept-tuned and superheterodyne spectrum analyzers covered wide frequency ranges from audio, thru microwave, to millimeter frequencies. In addition, digital signal processing (DSP) intensive fast Fourier transform (FFT) analyzers provided high-resolution spectrum and network analysis, but were limited to low frequencies due to the limits of analog-to-digital conversion and signal processing technologies. Today's wide-bandwidth, vector-modulated, time-varying signals benefit greatly from the capabilities of FFT analysis and other DSP techniques. Vector signal analyzers combine superheterodyne technology with high speed ADC's and other DSP technologies to offer fast high-resolution spectrum measurements, demodulation, and advanced time-domain analysis. The VSA is especially useful for characterizing complex signals such as burst, transient, or modulated signals used in communications, video, broadcast, sonar and ultrasound imaging applications. According to form factors, spectrum analyzers are grouped as benchtop, portable, handheld and networked. Benchtop models are useful for applications where the spectrum analyzer can be plugged into AC power,such as in a lab environment or manufacturing area. Bench top spectrum analyzers generally offer better performance and specifications than the portable or handheld versions. However they are generally heavier and have several fans for cooling. Some BENCHTOP SPECTRUM ANALYZERS offer optional battery packs, allowing them to be used away from a mains outlet. Those are referred to as a PORTABLE SPECTRUM ANALYZERS. Portable models are useful for applications where the spectrum analyzer needs to be taken outside to make measurements or carried while in use. A good portable spectrum analyzer is expected to offer optional battery-powered operation to allow the user to work in places without power outlets, a clearly viewable display to allow the screen to be read in bright sunlight, darkness or dusty conditions, light weight. HANDHELD SPECTRUM ANALYZERS are useful for applications where the spectrum analyzer needs to be very light and small. Handheld analyzers offer a limited capability as compared to larger systems. Advantages of handheld spectrum analyzers are however their very low power consumption, battery-powered operation while in the field to allow the user to move freely outside, very small size & light weight. Finally, NETWORKED SPECTRUM ANALYZERS do not include a display and they are designed to enable a new class of geographically-distributed spectrum monitoring and analysis applications. The key attribute is the ability to connect the analyzer to a network and monitor such devices across a network. While many spectrum analyzers have an Ethernet port for control, they typically lack efficient data transfer mechanisms and are too bulky and/or expensive to be deployed in such a distributed manner. The distributed nature of such devices enable geo-location of transmitters, spectrum monitoring for dynamic spectrum access and many other such applications. These devices are able to synchronize data captures across a network of analyzers and enable Network-efficient data transfer for a low cost. A PROTOCOL ANALYZER is a tool incorporating hardware and/or software used to capture and analyze signals and data traffic over a communication channel. Protocol analyzers are mostly used for measuring performance and troubleshooting. They connect to the network to calculate key performance indicators to monitor the network and speed-up troubleshooting activities. A NETWORK PROTOCOL ANALYZER is a vital part of a network administrator's toolkit. Network protocol analysis is used to monitor the health of network communications. To find out why a network device is functioning in a certain way, administrators use a protocol analyzer to sniff the traffic and expose the data and protocols that pass along the wire. Network protocol analyzers are used to - Troubleshoot hard-to-solve problems - Detect and identify malicious software / malware. Work with an Intrusion Detection System or a honeypot. - Gather information, such as baseline traffic patterns and network-utilization metrics - Identify unused protocols so that you can remove them from the network - Generate traffic for penetration testing - Eavesdrop on traffic (e.g., locate unauthorized Instant Messaging traffic or wireless Access Points) A TIME-DOMAIN REFLECTOMETER (TDR) is an instrument that uses time-domain reflectometry to characterize and locate faults in metallic cables such as twisted pair wires and coaxial cables, connectors, printed circuit boards,….etc. Time-Domain Reflectometers measure reflections along a conductor. In order to measure them, the TDR transmits an incident signal onto the conductor and looks at its reflections. If the conductor is of a uniform impedance and is properly terminated, then there will be no reflections and the remaining incident signal will be absorbed at the far end by the termination. However, if there is an impedance variation somewhere, then some of the incident signal will be reflected back to the source. The reflections will have the same shape as the incident signal, but their sign and magnitude depend on the change in impedance level. If there is a step increase in the impedance, then the reflection will have the same sign as the incident signal and if there is a step decrease in impedance, the reflection will have the opposite sign. The reflections are measured at the output/input of the Time-Domain Reflectometer and displayed as a function of time. Alternatively, the display can show the transmission and reflections as a function of cable length because the speed of signal propagation is almost constant for a given transmission medium. TDRs can be used to analyze cable impedances and lengths, connector and splice losses and locations. TDR impedance measurements provide designers the opportunity to perform signal integrity analysis of system interconnects and accurately predict the digital system performance. TDR measurements are widely used in board characterization work. A circuit board designer can determine the characteristic impedances of board traces, compute accurate models for board components, and predict board performance more accurately. There are many other areas of application for time-domain reflectometers. A SEMICONDUCTOR CURVE TRACER is a test equipment used to analyze the characteristics of discrete semiconductor devices such as diodes, transistors, and thyristors. The instrument is based on oscilloscope, but contains also voltage and current sources that can be used to stimulate the device under test. A swept voltage is applied to two terminals of the device under test, and the amount of current that the device permits to flow at each voltage is measured. A graph called V-I (voltage versus current) is displayed on the oscilloscope screen. Configuration includes the maximum voltage applied, the polarity of the voltage applied (including the automatic application of both positive and negative polarities), and the resistance inserted in series with the device. For two terminal devices like diodes, this is sufficient to fully characterize the device. The curve tracer can display all of the interesting parameters such as the diode's forward voltage, reverse leakage current, reverse breakdown voltage,…etc. Three-terminal devices such as transistors and FETs also use a connection to the control terminal of the device being tested such as the Base or Gate terminal. For transistors and other current based devices, the base or other control terminal current is stepped. For field effect transistors (FETs), a stepped voltage is used instead of a stepped current. By sweeping the voltage through the configured range of main terminal voltages, for each voltage step of the control signal, a group of V-I curves is generated automatically. This group of curves makes it very easy to determine the gain of a transistor, or the trigger voltage of a thyristor or TRIAC. Modern semiconductor curve tracers offer many attractive features such as intuitive Windows based user interfaces, I-V, C-V and pulse generation, and pulse I-V, application libraries included for every technology…etc. PHASE ROTATION TESTER / INDICATOR: These are compact and rugged test instruments to identify phase sequence on three-phase systems and open/de-energized phases. They are ideal for installing rotating machinery, motors and for checking generator output. Among the applications are the identification of proper phase sequences, detection of missing wire phases, determination of proper connections for rotating machinery, detection of live circuits. A FREQUENCY COUNTER is a test instrument that is used for measuring frequency. Frequency counters generally use a counter which accumulates the number of events occurring within a specific period of time. If the event to be counted is in electronic form, simple interfacing to the instrument is all that is needed. Signals of higher complexity may need some conditioning to make them suitable for counting. Most frequency counters have some form of amplifier, filtering and shaping circuitry at the input. Digital signal processing, sensitivity control and hysteresis are other techniques to improve performance. Other types of periodic events that are not inherently electronic in nature will need to be converted using transducers. RF frequency counters operate on the same principles as lower frequency counters. They have more range before overflow. For very high microwave frequencies, many designs use a high-speed prescaler to bring the signal frequency down to a point where normal digital circuitry can operate. Microwave frequency counters can measure frequencies up to almost 100 GHz. Above these high frequencies the signal to be measured is combined in a mixer with the signal from a local oscillator, producing a signal at the difference frequency, which is low enough for direct measurement. Popular interfaces on frequency counters are RS232, USB, GPIB and Ethernet similar to other modern instruments. In addition to sending measurement results, a counter can notify the user when user-defined measurement limits are exceeded. For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Electromagnetic Components Manufacturing and Assembly, Selenoid, Electromagnet, Transformer, Electric Motor, Generator, Meters, Indicators, Scales,Electric Fans Solenoids and Electromagnetic Components & Assemblies As a custom manufacturer and engineering integrator, AGS-TECH can provide you the following ELECTROMAGNETIC COMPONENTS AND ASSEMBLIES: • Selenoid, electromagnet, transformer, electric motor and generator assemblies • Electromagnetic meters, indicators, scales specifically manufactured to suit your measuring device. • Electromagnetic sensor and actuator assemblies • Electric fans and coolers of various size for electronic devices and industrial applications • Other complex electromagnetic systems assembly Click here to download brochure of our Panel Meters - OICASCHINT Soft Ferrites - Cores - Toroids - EMI Suppression Products - RFID Transponders and Accessories Brochure Dowload brochure for our DESIGN PARTNERSHIP PROGRAM If you are mostly interested in our engineering and research & development capabilities instead of manufacturing capabilities, then we invite you to visit our engineering site http://www.ags-engineering.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Mechanical Testing Instruments - Tension Tester - Torsion Test Machine - Bending Tester - Impact Test Device - Concrete Tester - Compression Testing Machine - H Mechanical Test Instruments Among the large number of MECHANICAL TEST INSTRUMENTS we focus our attention to the most essential and popular ones: IMPACT TESTERS, CONCRETE TESTERS / SCHMIDT HAMMER, TENSION TESTERS, COMPRESSION TESTING MACHINES, TORSION TEST EQUIPMENT, FATIGUE TEST MACHINE, THREE & FOUR POINT BENDING TESTERS, COEFFICIENT OF FRICTION TESTERS, HARDNESS & THICKNESS TESTERS, SURFACE ROUGHNESS TESTERS, VIBRATION METERS, TACHOMETERS, PRECISION ANALYTICAL BALANCE. We offer our customers quality brands such as ELCOMETER, SADT, SINOAGE for under list prices. Please choose from the downloadable catalogs below the brand name and model number of the equipment you need and tell us whether you want a brand new or refurbished / used equipment: AMETEK-LLOYD Instruments Materials Testing (Versatile Materials Testing Equipment, Universal Test Machines, Tensile Strength, Compressibility, Hardness, Elasticity, Peeling, Adhesion...etc.) ELCOMETER Inspection Equipment Catalog ( Physical Test Equipment , Concrete Inspection Equipment, Concrete Test Hammers, Fineness Of Grind/Dispersion , Density & Specific Gravity , Viscosity & Flow Measurement , Film Application & Test Charts , Drying Time & Permeability , Washability & Abrasion , Hardness & Scratch Resistance , Elasticity, Bend & Impact Testers , Flash Point ) HAIDA Adhesive Tape Peel Test Machine HAIDA Computerized Universal Test Machine with Extensometer HAIDA Computerized Universal Test Machine with Large Capacity (Double Column) HAIDA Computer Servo Tensile Test Machine HAIDA Desktop Tensile Test Machine HAIDA Double-Column Universal Testing Machine HAIDA Electro-Hydraulic Universal Testing Machine HAIDA Extra - Height Tensile Test Machine HAIDA Tensile Test Machines HAIDA Universal Testing Machine HAIDA Universal Test Machine HAIDA Universal Test Machine with Temperature Chamber INSTRON Compression and Tension Test Instruments SADT-SINOAGE Brand Metrology and Test Equipment, please CLICK HERE. Here you will find some of these testing equipment such as concrete testers and surface roughness tester. Let us examine these test devices in some detail: SCHMIDT HAMMER / CONCRETE TESTER : This test instrument, also sometimes called a SWISS HAMMER or a REBOUND HAMMER, is a device to measure the elastic properties or strength of concrete or rock, mainly surface hardness and penetration resistance. The hammer measures the rebound of a spring-loaded mass impacting against the surface of the sample. The test hammer will hit the concrete with a predetermined energy. The hammer’s rebound depends on the hardness of the concrete and is measured by the test equipment. Taking a conversion chart as a reference, the rebound value can be used to determine the compressive strength. The Schmidt hammer is an arbitrary scale ranging from 10 to 100. Schmidt hammers come with several different energy ranges. Their energy ranges are: (i) Type L-0.735 Nm impact energy, (ii) Type N-2.207 Nm impact energy; and (iii) Type M-29.43 Nm impact energy. Local variation in the sample. To minimize local variation in the samples it is recommended to take a selection of readings and take their average value. Prior to testing, the Schmidt hammer needs to be calibrated using a calibration test anvil supplied by the manufacturer. 12 readings should be taken, dropping the highest and lowest, and then taking the average of the ten remaining readings. This method is considered an indirect measurement of the strength of the material. It provides an indication based on surface properties for comparison between samples. This test method for testing concrete is governed by ASTM C805. On the other hand, the ASTM D5873 standard describes the procedure for testing of rock. Inside of our SADT brand catalog you will find the following products: DIGITAL CONCRETE TEST HAMMER SADT Models HT-225D/HT-75D/HT-20D - The SADT Model HT-225D is an integrated digital concrete test hammer combining data processor and test hammer into a single unit. It is widely used for non destructive quality testing of concrete and building materials. From its rebound value, the compressive strength of concrete can be calculated out automatically. All test data can be stored in memory and transferred to PC by USB cable or wirelessly by Bluetooth. The models HT-225D and HT-75D have measuring range of 10 – 70N/mm2, whereas the model HT-20D has only 1 – 25N/mm2. The impact energy of HT-225D is 0.225 Kgm and is suitable for testing ordinary building and bridge construction, the impact energy of HT-75D is 0.075 Kgm and is suitable for testing small and impact-sensitive parts of concrete and artificial brick, and finally the impact energy of HT-20D is 0.020Kgm and suitable for testing mortar or clay products. IMPACT TESTERS: In many manufacturing operations and during their service lives, many components need to be subjected to impact loading. In the impact test, the notched specimen is placed in an impact tester and broken with a swinging pendulum. There are two major types of this test: The CHARPY TEST and the IZOD TEST. For the Charpy test the specimen are supported at both ends, whereas for the Izod test they are supported only at one end like a cantilever beam. From the amount of swing of the pendulum, the energy dissipated in breaking the specimen is obtained, this energy is the impact toughness of the material. Using the impact tests, we can determine the ductile-brittle transition temperatures of materials. Materials with high impact resistance generally have high strength and ductility. These tests also reveal the sensitivity of a material’s impact toughness to surface defects, because the notch in the specimen can be considered a surface defect. TENSION TESTER : The strength-deformation characteristics of materials are determined using this test. Test specimen are prepared according to ASTM standards. Typically, solid and round specimens are tested, but flat sheets and tubular samples may also be tested using tension test. The original length of a specimen is the distance between gage marks on it and is typically 50 mm long. It is denoted as lo. Longer or shorter lengths can be used depending on the specimens and products. The original cross-sectional area is denoted as Ao. The engineering stress or also called nominal stress is then given as: Sigma = P / Ao And the engineering strain is given as: e = (l – lo) / lo In the linear elastic region, the specimen elongates proportionately to the load up to the proportional limit. Beyond this limit, even though not linearly, the specimen will continue to deform elastically up to the yield point Y. In this elastic region, the material will return to its original length if we remove the load. Hooke’s Law applies in this region and gives us the Young’s Modulus: E = Sigma / e If we increase the load and move beyond the yield point Y, the material begins to yield. In other words, the specimen begins to undergo plastic deformation. Plastic deformation means permanent deformation. The cross-sectional area of the specimen decreases permanently and uniformly. If specimen is unloaded at this point, the curve follows a straight line downward and parallel to the original line in the elastic region. If the load is further increased, the curve reaches a maximum and begins to decrease. The maximum stress point is called the tensile strength or ultimate tensile strength and is denoted as UTS. The UTS can be interpreted as the overall strength of materials. When load is greater than the UTS, necking occurs on the specimen and the elongation between gage marks is no longer uniform. In other words, the specimen becomes really thin at the location where necking occurs. During necking, the elastic stress drops. If the test is continued, the engineering stress drops further and the specimen fractures at the necking region. The stress level at fracture is the fracture stress. The strain at point of fracture is an indicator of ductility. The strain up to the UTS is referred to as uniform strain, and the elongation at fracture is referred to as total elongation. Elongation = ((lf – lo) / lo) x 100 Reduction of Area = ((Ao – Af) / Ao) x 100 Elongation and reduction of area are good indicators of ductility. COMPRESSION TESTING MACHINE ( COMPRESSION TESTER ) : In this test, the specimen is subjected to a compressive load contrary to the tensile test where the load is tensile. Generally, a solid cylindrical specimen is placed between two flat plates and compressed. Using lubricants at the contact surfaces, a phenomenon known as barreling is prevented. Engineering strain rate in compression is given by: de / dt = - v / ho, where v is die speed, ho original specimen height. True strain rate on the other hand is: de = dt = - v/ h, with h being the instantaneous specimen height. To keep the true strain rate constant during the test, a cam plastometer thru a cam action reduces the magnitude of v proportionally as the specimen height h decreases during the test. Using the compression test ductilities of materials are determined by observing cracks formed on barreled cylindrical surfaces. Another test with some differences in the die and workpiece geometries is the PLANE-STRAIN COMPRESSION TEST, which gives us the yield stress of the material in plane strain denoted widely as Y’. Yield stress of materials in plane strain can be estimated as: Y’ = 1.15 Y TORSION TEST MACHINES (TORSIONAL TESTERS) : The TORSION TEST is another widely used method for determining material properties. A tubular specimen with a reduced mid-section is used in this test. Shear stress, T is given by: T = T / 2 (Pi) (square of r) t Here, T is the applied torque, r is the mean radius and t is the thickness of the reduced section in the middle of the tube. Shear strain on the other hand is given by: ß = r Ø / l Here l is the length of the reduced section and Ø is the twist angle in radians. Within the elastic range, the shear modulus (modulus of rigidity) is expressed as: G = T / ß The relation between shear modulus and the modulus of elasticity is: G = E / 2( 1 + V ) The torsion test is applied to solid round bars at elevated temperatures to estimate the forgeability of metals. The more twists the material can withstand prior to failure, the more forgeable it is. THREE & FOUR POINT BENDING TESTERS : For brittle materials, the BEND TEST (also called FLEXURE TEST) is suitable. A rectangularly shaped specimen is supported at both ends and a load is applied vertically. The vertical force is applied at either one point as in the case of three point bending tester, or at two points as in the case of a four point test machine. The stress at fracture in bending is referred to as the modulus of rupture or transverse rupture strength. It is given as: Sigma = M c / I Here, M is the bending moment, c is one-half of the specimen depth and I is the moment of inertia of the cross-section. The magnitude of stress is the same in both three and four-point bending when all other parameters are kept constant. The four-point test is likely to result in a lower modulus of rupture as compared to the three-point test. Another superiority of the four-point bending test over the three point bending test is that its results are more consistent with less statistical scattering of values. FATIGUE TEST MACHINE: In FATIGUE TESTING, a specimen is subjected repeatedly to various states of stress. The stresses are generally a combination of tension, compression and torsion. The test process can be resembled to bending a piece of wire alternately in one direction, then the other until it fractures. The stress amplitude can be varied and is denoted as “S”. The number of cycles to cause total failure of the specimen is recorded and is denoted as “N”. Stress amplitude is the maximum stress value in tension and compression to which the specimen is subjected. One variation of the fatigue test is performed on a rotating shaft with a constant downward load. The endurance limit (fatigue limit) is defined as the max. stress value the material can withstand without fatigue failure regardless of the number of cycles. Fatigue strength of metals is related to their ultimate tensile strength UTS. COEFFICIENT OF FRICTION TESTER : This test equipment measures the ease with which two surfaces in contact are able to slide past one another. There are two different values associated with the coefficient of friction, namely the static and kinetic coefficient of friction. Static friction applies to the force necessary to initialize motion between the two surfaces and kinetic friction is the resistance to sliding once the surfaces are in relative motion. Appropriate measures need to be taken prior to testing and during testing to ensure freedom from dirt, grease and other contaminants that could adversely affect test results. ASTM D1894 is the main coefficient of friction test standard and is used by many industries with different applications and products. We are here to offer you the most suitable test equipment. If you need a custom set-up specifically designed for your application, we can modify existing equipment accordingly in order to meet your requirements and needs. HARDNESS TESTERS : Please go to our related page by clicking here THICKNESS TESTERS : Please go to our related page by clicking here SURFACE ROUGHNESS TESTERS : Please go to our related page by clicking here VIBRATION METERS : Please go to our related page by clicking here TACHOMETERS : Please go to our related page by clicking here For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Test Equipment for Testing Paper & Packaging Products, Adhesive Tape Peel Test Machine, Carton Compressive Tester, Foam Compression Hardness Tester, Zero Drop Test Machine, Package Incline Impact Tester Test Equipment for Testing Paper & Packaging Products Specialized Test Equipment for Testing of Paper & Packaging Products are used for testing paper & packaging products such as cardboard boxes, carton materials, foam and cushioning materials and other types of packages....etc., for checking their quality, endurance, functionality, reliability, safety, compliance to domestic and international standards....etc. Our specialized test equipment can be either: - CUSTOM DESIGNED and MANUFACTURED SPECIALIZED TEST EQUIPMENT for PAPER & PACKAGING TESTING or - OFF-SHELF SPECIALIZED TEST EQUIPMENT for PAPER & PACKAGING TESTING Custom designed specialized testing equipment is designed and developed by us for our customers specific needs, taking into consideration our customers specific requirements, their markets, their legal responsibilities...etc. We work with you hand in hand to accomplish what you need and want. Our engineers design, prototype and get your approval prior to manufacturing your test machines. On the other hand, our off-shelf specialized test equipment for testing of Paper & Packaging Products are already designed and manufactured systems that can be purchased quickly from us and used. If you let us know what you need, we will be happy to guide you and propose you ready systems that can help achieve your goals. Our off-shelf specialized test equipment for testing of Paper & Packaging Products can be downloaded from the colored links below: HAIDA Adhesive Tape Peel Test Machine HAIDA Automatic Bursting Strength Test Machine HAIDA Bursting Strength Tester Series HAIDA Clamping Force Testing Machine HAIDA Computer Servo Carton Compressive Tester Series HAIDA Double-Column Drop Test Machine HAIDA Foam Compression Hardness Tester HAIDA Foam Pounding Fatigue Tester HAIDA Foam Rebound Test Machine HAIDA Foam Tear Resistance Tester HAIDA Four Point Bending Stiffness Tester HAIDA Microcomputer Carton Compressive Tester Series HAIDA Microcomputer Ring Crush & Edge HAIDA Package Incline Impact Tester HAIDA Paper Four Point Bending Resistance Tester HAIDA Ring Crush & Edge Crush Tester Series HAIDA Single Drop Test Machine HAIDA Universal Packaging Material Testing Machine HAIDA Zero Drop Test Machine For other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Micromanufacturing, Nanomanufacturing, Mesomanufacturing - Electronic & Magnetic Optical & Coatings, Thin Film, Nanotubes, MEMS, Microscale Fabrication Nanoscale & Microscale & Mesoscale Manufacturing Read More Our NANOMANUFACTURING, MICROMANUFACTURING and MESOMANUFACTURING processes can be categorized as: Surface Treatments and Modification Functional Coatings / Decorative Coatings / Thin Film / Thick Film Nanoscale Manufacturing / Nanomanufacturing Microscale Manufacturing / Micromanufacturing / Micromachining Mesoscale Manufacturing / Mesomanufacturing Microelectronics & Semiconductor Manufacturing and Fabrication Microfluidic Devices Manufacturing Micro-Optics Manufacturing Micro Assembly and Packaging Soft Lithography In every smart product designed today, one can consider an element that will increase efficiency, versatility, reduce power consumption, reduce waste, increase lifetime of the product and thus be environmentally friendly. For this purpose, AGS-TECH is focusing on a number of processes and products that can be incorporated into devices and equipment to achieve these goals. For example low-friction FUNCTIONAL COATINGS can reduce power consumption. Some other functional coating examples are scratch resistant coatings, anti-wetting SURFACE TREATMENTS and coatings (hydrophobic), wetness promoting (hydrophilic) surface treatment and coatings, anti-fungal coatings, diamond like carbon coatings for cutting and scribing tools, THIN FILMelectronic coatings, thin film magnetic coatings, multilayer optical coatings. In NANOMANUFACTURING or NANOSCALE MANUFACTURING, we produce parts at nanometer length scales. In practice it refers to manufacturing operations below micrometer scale. Nanomanufacturing is still in its infancy when compared to micromanufacturing, however the trend is in that direction and nanomanufacturing is definitely very important for the near future. Some applications of nanomanufacturing today are carbon nanotubes as reinforcing fibers for composite materials in bicycle frames, baseball bats and tennis racquets. Carbon nanotubes, depending on the orientation of the graphite in the nanotube, can act as semiconductors or conductors. Carbon nanotubes have very high current-carrying capability, 1000 times higher than silver or copper. Another application of nanomanufacturing is nanophase ceramics. By using nanoparticles in producing ceramic materials, we can simultaneously increase both the strength and ductility of the ceramic. Please click on the submenu for more information. MICROSCALE MANUFACTURING or MICROMANUFACTURING refers to our manufacturing and fabrication processes on a microscopic scale not visible to the naked eye. The terms micromanufacturing, microelectronics, microelectromechanical systems are not limited to such small length scales, but instead, suggest a material and manufacturing strategy. In our micromanufacturing operations some popular techniques we use are lithography, wet and dry etching, thin film coating. A wide variety of sensors & actuators, probes, magnetic hard-drive heads, microelectronic chips, MEMS devices such as accelerometers and pressure sensors among others are manufactured using such micromanufacturing methods. You will find more detailed information on these in the submenus. MESOSCALE MANUFACTURING or MESOMANUFACTURING refers to our processes for fabrication of miniature devices such as hearing aids, medical stents, medical valves, mechanical watches and extremely small motors. Mesoscale manufacturing overlaps both macro and micromanufacturing. Miniature lathes, with 1.5 Watt motor and dimensions of 32 x 25 x 30.5 mm and weights of 100 grams have been fabricated using mesoscale manufacturing methods. Using such lathes, brass has been machined to a diameter as small as 60 microns and surface roughnesses in the order of a micron or two. Other such miniature machine tools such as milling machines and presses have also been manufactured using mesomanufacturing. In MICROELECTRONICS MANUFACTURING we use the same techniques as in micromanufacturing. Our most popular substrates are silicon, and others like gallium arsenide, Indium Phosphide and Germanium are also used. Films/coatings of many types and especially conducting and insulating thin film coatings are used in the fabrication of microelectronic devices and circuits. These devices are usually obtained from multilayers. Insulating layers are generally obtained by oxidation such as SiO2. Dopants (both p and n) type are common and parts of the devices are doped in order to alter their electronic properties and obtain p and n type regions. Using lithography such as ultraviolet, deep or extreme ultraviolet photolithography, or X-ray, electron beam lithography we transfer geometric patterns defining the devices from a photomask/mask to the substrate surfaces. These lithography processes are applied several times in the micromanufacturing of microelectronic chips in order to achieve the required structures in the design. Also etching processes are carried out by which entire films or particular sections of films or substrate are removed. Briefly, by using various deposition, etching and multiple lithographic steps we obtain the multilayer structures on the supporting semiconductor substrates. After the wafers are processed and many circuits are microfabricated on them, the repetitive parts are cut and individual dies are obtained. Each die is thereafter wire bonded, packaged and tested and becomes a commercial microelectronic product. Some more details of microelectronics manufacturing can be found in our submenu, however the subject is very extensive and therefore we encourgae you to contact us in case you need product specific information or more details. Our MICROFLUIDICS MANUFACTURING operations are aimed at fabrication of devices and systems in which small volumes of fluids are handled. Examples of microfluidic devices are micro-propulsion devices, lab-on-a-chip systems, micro-thermal devices, inkjet printheads and more. In microfluidics we have to deal with the precise control and manipulation of fluids constrained to sub-milimeter regions. Fluids are moved, mixed, separated and processed. In microfluidic systems fluids are moved and controlled either actively using tiny micropumps and microvalves and the like or passively taking advantage of capillary forces. With lab-on-a-chip systems, processes which are normally carried out in a lab are miniaturized on a single chip in order to enhance efficiency and mobility as well as reduce sample and reagent volumes. We have the capability to design microfluidic devices for you and offer microfluidics prototyping & micromanufacturing custom tailored for your applications. Another promising field in microfabrication is MICRO-OPTICS MANUFACTURING. Micro-optics allows the manipulation of light and the management of photons with micron and sub-micron scale structures and components. Micro-optics allows us to interface the macroscopic world we live in with the microscopic world of opto- and nano-electronic data processing. Micro-optical components and subsystems find widespread applications in the following fields: Information technology: In micro-displays, micro-projectors, optical data storage, micro-cameras, scanners, printers, copiers…etc. Biomedicine: Minimally-invasive/point of care diagnostics, treatment monitoring, micro-imaging sensors, retinal implants. Lighting: Systems based on LEDs and other efficient light sources Safety and Security Systems: Infrared night vision systems for automotive applications, optical fingerprint sensors, retinal scanners. Optical Communication & Telecommunication: In photonic switches, passive fiber optic components, optical amplifiers, mainframe and personal computer interconnect systems Smart structures: In optical fiber-based sensing systems and much more As the most diverse engineering integration provider we pride ourselves with our capability to provide a solution for almost any consulting, engineering, reverse engineering, rapid prototyping, product development, manufacturing, fabrication and assembly needs. After micromanufacturing our components, very often we need to continue with MICRO ASSEMBLY & PACKAGING. This involves processes such as die attachment, wire bonding, connectorization, hermetic sealing of packages, probing, testing of packaged products for environmental reliability…etc. After micromanufacturing devices on a die, we attach the die to a more rugged foundation to ensure reliability. Frequently we use special epoxy cements or eutectic alloys to bond the die to its package. After the chip or die is bonded to its substrate, we connect it electrically to the package leads using wire bonding. One method is to use very thin gold wires from the package leads to bonding pads located around the perimeter of the die. Lastly we need to do the final packaging of the connected circuit. Depending on the application and operating environment, a variety of standard and custom manufactured packages are available for micromanufactured electronic, electro-optic, and microelectromechanical devices. Another micromanufacturing technique we use is SOFT LITHOGRAPHY, a term used for a number of processes for pattern transfer. A master mold is needed in all cases and is microfabricated using standard lithography methods. Using the master mold, we produce an elastomeric pattern / stamp. One variation of soft lithography is “microcontact printing”. The elastomer stamp is coated with an ink and pressed against a surface. The pattern peaks contact the surface and a thin layer of about 1 monolayer of the ink is transfered. This thin film monolayer acts as the mask for selective wet etching. A second variation is “microtransfer molding”, in which the recesses of the elastomer mold are filled with liquid polymer precursor and pushed against a surface. Once the polymer cures, we peel off the mold, leaving behind the desired pattern. Lastly a third variation is “micromolding in capillaries”, where the elastomer stamp pattern consists of channels that use capillary forces to wick a liquid polymer into the stamp from its side. Basically, a small amount of the liquid polymer is placed adjacent to the capillary channels and the capillary forces pull the liquid into the channels. Excess liquid polymer is removed and polymer inside the channels is allowed to cure. The stamp mold is peeled off and the product is ready. You can find more details about our soft lithography micromanufacturing techniques by clicking on the related submenu on the side of this page. If you are mostly interested in our engineering and research & development capabilities instead of manufacturing capabilities, then we invite you to also visit our engineering website http://www.ags-engineering.com Read More Read More Read More Read More Read More Read More Read More Read More Read More CLICK Product Finder-Locator Service PREVIOUS PAGE

Machine Elements Manufacturing, Gears, Gear Drives, Bearings, Keys, Splines, Pins, Shafts, Seals, Fasteners, Clutch, Cams, Followers, Belts, Couplings, Shafts Machine Elements Manufacturing Read More Belts & Chains & Cable Drive Assembly Read More Gears & Gear Drive Assembly Read More Couplings & Bearings Manufacturing Read More Keys & Splines & Pins Manufacturing Read More Cams & Followers & Linkages & Ratchet Wheels Manufacturing Read More Shafts Manufacturing Read More Mechanical Seals Manufacturing Read More Clutch & Brake Assembly Read More Fasteners Manufacturing Read More Simple Machines Assembly MACHINE ELEMENTS are elementary components of a machine. These elements consist of three basic types: 1.) Structural components including frame members, bearings, axles, splines, fasteners, seals, and lubricants. 2.) Mechanisms controlling movement in various ways such as gear trains, belt or chain drives, linkages, cam and follower systems, brakes & clutches. 3.) Control components like buttons, switches, indicators, sensors, actuators and computer controllers. Most of the machine elements we offer you are standardized to common sizes, but custom made machine elements are also available for your specialized applications. Customization of machine elements can take place on existing designs that are in our downloadable catalogs or on brand new designs. Prototyping and manufacturing of machine elements can be carried forward once a design is approved by both parties. If new machine elements need to be designed & manufactured, our customers either email us their own blueprints and we review them for approval, or they ask us to design machine elements for their application. In the latter case we use all input from our customers and design the machine elements and send the finalized blueprints to our clients for approval. Once approved, we produce first articles and subsequently manufacture the machine elements according to the final design. At any stage of this work, in case a particular machine element design performs unsatisfactorily in the field (which is rare), we review the entire project and make alterations jointly with our clients as needed. It is our standard practice to sign nondisclosure agreements (NDA) with our customers for the design of machine elements or any other product whenever needed or required. Once machine elements for a particular customer are custom designed and manufactured, we assign a product code to it and only produce and sell them to our customer who owns the product. We reproduce the machine elements using the developed tools, molds and procedures as many times as needed and whenever our customer reorders them. In other words, once a custom machine element is designed and produced for you, the intellectual property as well as all tooling and molds are reserved and stocked indefinitely by us for you and the products reproduced as you wish. We also offer our clients engineering services by creatively combining machine elements into a component or assembly that serves an application and meets or exceeds our customers expectations. Plants fabricating our machine elements are qualified by either ISO9001, QS9000 or TS16949. In addition, most of our products do have CE or UL mark and meet internationally relevant standards such as ISO, SAE, ASME, DIN. Please click on submenus to obtain detailed information about our machine elements including: - Belts, Chains and Cable Drives - Gears and Gear Drives - Couplings & Bearings - Keys & Splines & pins - Cams & Linkages - Shafts - Mechanical Seals - Industrial Clutch & Brake - Fasteners - Simple Machines We have prepared a reference brochure for our customers, designers and developers of new products including machine elements. You can familiar yourself with some commonly used terms in machine components design: Download brochure for Common Mechanical Engineering Terms used by Designers and Engineers Our machine elements find applications in a variety of fields such as industrial machinery, automation systems, test and metrology equipment, transportation equipment, construction machines and practically anywhere you can think of. AGS-TECH develops and manufactures machine elements from various materials depending on application. Materials used for machine elements could range from molded plastics used for toys to case hardened and specially coated steel for industrial machinery. Our designers use state of the art professional software and design tools for developing machine elements, taking into consideration details such as angles in gear teeth, stresses involved, wear rates….etc. Please scroll through our submenus and download our product brochures and catalogs to see if you can locate off-the-shelf machine elements for your application. If you cannot find a good match for your application, please let us know and we will work with you to develop and manufacture machine elements that will fulfill your needs. If you are mostly interested in our engineering and research & development capabilities instead of manufacturing capabilities, then we invite you to visit our website http://www.ags-engineering.com where you can find more detailed information about our design, product development, process development, engineering consulting services and more CLICK Product Finder-Locator Service PREVIOUS PAGE

Glass and Ceramic Manufacturing, Hermetic Packages Seals and Bonding, Tempered Bulletproof Glass, Blow Moulding, Optical Grade Glass, Conductive Glass, Molding Glass & Ceramic Forming & Shaping The type of glass manufacturing we offer are container glass, glass blowing, glass fiber & tubing & rod, domestic and industrial glassware, lamp and bulb, precision glass moulding, optical components and assemblies, flat & sheet & float glass. We perform both hand forming as well as machine forming. Our popular technical ceramic manufacturing processes are die pressing, isostatic pressing, hot isostatic pressing, hot pressing, slip casting, tape casting, extrusion, injection moulding, green machining, sintering or firing, diamond grinding, hermetic assemblies. We recommend that you click here to DOWNLOAD our Schematic Illustrations of Glass Forming and Shaping Processes by AGS-TECH Inc. DOWNLOAD our Schematic Illustrations of Technical Ceramic Manufacturing Processes by AGS-TECH Inc. These downloadable files with photos and sketches will help you better understand the information we are providing you below. • CONTAINER GLASS MANUFACTURE: We have automated PRESS AND BLOW as well as BLOW AND BLOW lines for manufacturing. In the blow and blow process we drop a gob into blank mold and form the neck by applying a blow of compressed air from top. Immediately following this, compressed air is blown a second time from the other direction through the container neck to form the pre-form of the bottle. This pre-form is then transferred to the actual mold, reheated to soften and compressed air is applied to give the pre-form its final container shape. More explicitly, it is pressurized and pushed against the walls of the blow mold cavity to take its desired shape. Finally, the manufactured glass container is transfered into an annealing oven for subsequent reheating and removal of stresses produced during the molding and is cooled in a controlled fashion. In the press and blow method, molten gobs are put into a parison mold (blank mold) and pressed into the parison shape (blank shape). The blanks are then transfered to blow molds and blown similar to the process described above under “Blow and Blow Process”. Subsequent steps like annealing and stress relieve are similar or the same. • GLASS BLOWING : We have been manufacturing glass products using conventional hand blowing as well as using compressed air with automated equipment. For some orders conventional blowing is necessary, such as projects involving glass art work, or projects that require a smaller number of parts with loose tolerances, prototyping / demo projects….etc. Conventional glass blowing involves the dipping of a hollow metal pipe into a pot of molten glass and rotating the pipe for collecting some amount of the glass material. The glass collected on the tip of the pipe is rolled on flat iron, shaped as desired, elongated, re-heated and air blown. When ready, it is inserted into a mould and air is blown. The mould cavity is wet to avoid contact of the glass with metal. The water film acts like a cushion between them. Manual blowing is a labor intensive slow process and only suitable for prototyping or items of high value, not suitable for inexpensive per piece high volume orders. • MANUFACTURING OF DOMESTIC & INDUSTRIAL GLASSWARE : Using various types of glass material a large variety of glassware is being produced. Some glasses are heat resistant and suitable for laboratory glassware whereas some are good enough for withstanding dishwashers for many times and are fit for making domestic products. Using Westlake machines tens of thousands of pieces of drinking glasses are being produced per day. To simplify, molten glass is collected by vacuum and inserted into moulds to make the pre-forms. Then air is blown into the moulds, these are transfered to another mould and air is blown again and the glass takes its final shape. Like in hand blowing, these moulds are kept wet with water. Further stretching is part of the finishing operation where the neck is being formed. Excess glass is burnt off. Thereafter the controlled re-heating and cooling process described above follows. • GLASS TUBE & ROD FORMING : The main processes we use for manufacturing of glass tubes are the DANNER and VELLO processes. In the Danner Process, glass from a furnace flows and falls on an inclined sleeve made of refractory materials. The sleeve is carried on a rotating hollow shaft or blowpipe. The glass is then wrapped around the sleeve and forms a smooth layer flowing down the sleeve and over the tip of the shaft. In the case of tube forming, air is blown through a blowpipe with hollow tip, and in the case of rod forming we use solid tips on the shaft. The tubes or rods are then drawn over carrying rollers. The dimensions like wall thickness and diameter of the glass tubes are adjusted to desired values by setting the diameter of the sleeve and blowing air pressure to a desired value, adjusting the temperature, rate of flow of glass and speed of drawing. The Vello glass tube manufacturing process on the other hand involves glass that travels out a furnace and into a bowl with a hollow mandrel or bell. The glass then goes through the air space between the mandrel and the bowl and takes the shape of a tube. Thereafter it travels over rollers to a drawing machine and is cooled. At the end of the cooling line cutting and final processing takes place. The tube dimensions can be adjusted just like in the Danner process. When comparing the Danner to Vello process, we can say that Vello process is a better fit for large quantity production whereas the Danner process may be a better fit for precise smaller volume tube orders. • PROCESSING OF SHEET & FLAT & FLOAT GLASS : We have large quantities of flat glass in thicknesses ranging from submilimeter thicknesses to several centimeters. Our flat glasses are of almost optical perfection. We offer glass with special coatings such as optical coatings, where chemical vapor deposition technique is used to put coatings such as antireflection or mirror coating. Also transparent conductive coatings are common. Also available are hydrophobic or hydrophilic coatings on glass, and coating that makes glass self-cleaning. Tempered, bulletproof and laminated glasses are yet other popular items. We cut glass into desired shape with desired tolerances. Other secondary operations such as curving or bending flat glass are available. • PRECISION GLASS MOLDING : We use this technique mostly for manufacturing precision optical components without the need for more expensive and time consuming techniques like grinding, lapping and polishing. This technique is not always sufficient for making the best of the best optics, but in some cases like consumer products, digital cameras, medical optics it can be a less expensive good option for high volume manufacturing. Also it has an advantage over the other glass forming techniques where complex geometries are required, such as in the case of aspheres. The basic process involves loading of the lower side of our mold with the glass blank, evacuation of the process chamber for oxygen removal, near closing of the mold, fast and isothermal heating of die and glass with infrared light, further closing of the mould halves to press the softened glass slowly in a controlled fashion to the desired thickness, and finally cooling of the glass and filling the chamber with nitrogen and removal of the product. Precise temperature control, mould closure distance, mould closure force, matching the coefficients of expansion of the mold and glass material are key in this process. • MANUFACTURE OF GLASS OPTICAL COMPONENTS AND ASSEMBLIES : Besides precision glass molding, there are a number of valuable processes we use for making high quality optical components and assemblies for demanding applications. Grinding, lapping and polishing of optical grade glasses in fine special abrasive slurries is an art and science for making optical lenses, prisms, flats and more. Surface flatness, waviness, smoothness and defect free optical surfaces require lots of experience with such processes. Small changes in environment can result in out of specification products and bring the manufacturing line to a stop. There are cases where a single wipe on the optical surface with a clean cloth can make a product meet the specifications or fail the test. Some popular glass materials used are fused silica, quartz, BK7. Also the assembly of such components requires specialized niche experience. Sometimes special glues are being used. However, sometimes a technique called optical contacting is the best choice and involves no material in between attached optical glasses. It consists of physically contacting flat surfaces to attach to each other without glue. In some cases mechanical spacers, precision glass rods or balls, clamps or machined metal components are being used to assemble the optical components at certain distances and with certain geometric orientations to each other. Let us examine some of our popular techniques for manufacturing high end optics. GRINDING & LAPPING & POLISHING : The rough shape of the optical component is obtained with grinding a glass blank. Thereafter lapping and polishing are carried out by rotating and rubbing the rough surfaces of the optical components against tools with desired surface shapes. Slurries with tiny abrasive particles and fluid are being poured in between the optics and the shaping tools. The abrasive particle sizes in such slurries can be chosen according to the degree of flatness desired. The deviations of critical optical surfaces from desired shapes are expressed in terms of wavelengths of the light being used. Our high precision optics have tenth of a wavelength (Wavelength/10) tolerances or even tighter is possible. Besides surface profile, the critical surfaces are scanned and evaluated for other surface features and defects such as dimensions, scratches, chips, pits, specks...etc. The tight control of environmental conditions in the optical manufacturing floor and extensive metrology and testing requirements with state-of-the-art equipment make this a challenging branch of industry. • SECONDARY PROCESSES IN GLASS MANUFACTURING: Again, we are only limited with your imagination when it comes to secondary and finishing processes of glass. Here we list some of them: -Coatings on glass (optical, electrical, tribological, thermal, functional, mechanical...). As an example we can alter surface properties of glass making it for example reflect heat so that it keeps building interiors cool, or make one side infrared absorbing using nanotechnology. This helps keep the inside of buildings warm because the outermost surface layer of glass will absorb the infrared radiation inside the building and radiate it back to the inside. -Etching on glass -Applied Ceramic Labeling (ACL) -Engraving -Flame polishing -Chemical polishing -Staining MANUFACTURING OF TECHNICAL CERAMICS • DIE PRESSING : Consists of uniaxial compaction of granular powders confined in a die • HOT PRESSING : Similar to die pressing but with the addition of temperature to enhance densification. Powder or compacted preform is placed into graphite die and uniaxial pressure is applied while the die is kept at high temperatures such as 2000 C. Temperatures can be different depending on the type of ceramic powder being processed. For complicated shapes and geometries other subsequent processing such as diamond grinding may be needed. • ISOSTATIC PRESSING : Granular powder or die pressed compacts are placed in airtight containers and then into a closed pressure vessel with liquid inside. Thereafter they are compacted by increasing the pressure vessel’s pressure. The liquid inside the vessel transfers the pressure forces uniformly over the entire surface area of the airtight container. The material is thus compacted uniformly and takes the shape of its flexible container and its internal profile and features. • HOT ISOSTATIC PRESSING : Similar to isostatic pressing, but in addition to pressurized gas atmosphere, we sinter the compact at high temperature. Hot isostatic pressing results in additional densification and increased strength. • SLIP CASTING / DRAIN CASTING : We fill the mould with a suspension of micrometer sized ceramic particles and carrier liquid. This mixture is called “slip”. The mould has pores and therefore the liquid in the mixture is filtered into the mould. As a result, a cast is formed on the inner surfaces of the mould. After sintering, the parts can be taken out of the mould. • TAPE CASTING : We manufacture ceramic tapes by casting ceramic slurries onto flat moving carrier surfaces. The slurries contain ceramic powders mixed with other chemicals for binding and carrying purposes. As the solvents evaporate dense and flexible sheets of ceramic are left behind which can be cut or rolled as desired. • EXTRUSION FORMING : As in other extrusion processes, a soft mixture of ceramic powder with binders and other chemicals is passed through a die to acquire its cross-sectional shape and is then cut at desired lengths. The process is performed with cold or heated ceramic mixtures. • LOW PRESSURE INJECTION MOLDING : We prepare a mixture of ceramic powder with binders and solvents and heat it to a temperature where it can easily be pressed and forced into the tool cavity. Once the moulding cycle is complete, the part is ejected and the binding chemical is burned off. Using injection molding, we can obtain intricate parts at high volumes economically. Holes that are a tiny fraction of a milimeter on a 10mm thick wall are possible, threads are possible without forther machining, tolerances as tight as +/- 0.5% are possible and even lower when parts are machined, wall thicknesses in the order of 0.5mm to a length of 12.5 mm are possible as well as wall thicknesses of 6.5mm to a length of 150mm. • GREEN MACHINING : Using the same metal machining tools, we can machine pressed ceramic materials while they are still soft like chalk. Tolerances of +/- 1% are possible. For better tolerances we use diamond grinding. • SINTERING or FIRING : Sintering makes full densification possible. Significant shrinkage occurs on the green compact parts, but this is not a big problem since we take into account these dimensional changes when we design the part and tooling. Powder particles are bonded together and porosity induced by the compaction process is removed to great extent.. • DIAMOND GRINDING : The World’s hardest material “diamond” is being used to grind hard materials like ceramics and precision parts are obtained. Tolerances in the micrometer range and very smooth surfaces are being achieved. Due to its expense, we only consider this technique when we really need it. • HERMETIC ASSEMBLIES are those that practically speaking do not allow any exchange of matter, solids, liquids or gases between interfaces. Hermetic sealing is airtight. For example hermetic electronic enclosures are those that keep the sensitive interior contents of a packaged device unharmed by moisture, contaminants or gases. Nothing is 100% hermetic, but when we speak of hermeticity we mean that in practical terms, that there is hermeticity to the extent that the leak rate is so low that the devices are safe under normal environmental conditions for very long times. Our hermetic assemblies consist of metal, glass and ceramic components, metal-ceramic, ceramic-metal-ceramic, metal-ceramic-metal, metal to metal, metal-glass, metal-glass-metal, glass-metal-glass, glass-metal and glass to glass and all other combinations of metal-glass-ceramic bonding. We can for example metal coat the ceramic components so they can be strongly bonded to other components in the assembly and have excellent sealing capability. We have the know-how of coating optical fibers or feedthroughs with metal and soldering or brazing them to the enclosures, so no gases pass or leak into the enclosures. Therefore they are used for manufacturing electronic enclosures to encapsulate sensitive devices and protect them from the outer atmosphere. Besides their excellent sealing characteristics, other properties such as the thermal expansion coefficient, deformation resistance, non-outgassing nature, very long lifetime, nonconductive nature, thermal insulation properties, antistatic nature...etc. make glass and ceramic materials the choice for certain applications. Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum and fluid control components can be found here: Hermetic Components Factory Brochure CLICK Product Finder-Locator Service PREVIOUS PAGE

AGS-TECH, Inc. is a global manufacturer of fasteners and rigging hardware including shackles, eye bolt and nut, turnbuckles, wire rope clip, hooks, load binder, steel and synthetic plastic wires, cables and ropes, traditional ropes from manila, polyhemp, sisal, cotton, link chains, steel chain and more. Fasteners, Rigging Hardware Manufacturing For information on our manufacturing capabilities of fasteners, you may visit our dedicated page by clicking here: Go to Fasteners Page However, if you are looking for Rigging Hardware, then continue reading and scroll down this page please. Rigging Hardware Rigging hardware is an essential component in any hoisting, lifting, fastening system involving ropes, belts, chains...etc. The quality, strength, durability, lifetime and overall reliability of rigging hardware can be a bottleneck, a limiting factor if the right product of high quality is not chosen for your systems, no matter how good the other components are. You can think of it like a chain, where a single damaged chain link can potentially cause failure of the entire chain. Our rigging hardware products include many items such as cable gliders, clevises, fittings, hooks, shackles, snap hooks, connecting links, swivels, grab links, wire rope clips and much more. Prices of fasteners and rigging hardware components depend on product, model and quantity of your order. It also depends on whether you need an off-the-shelf product or need us to custom manufacture the fasteners and rigging hardware components to your specifications, drawings and needs. Since we carry a wide variety of fasteners and rigging hardware with different dimensions, applications, material grade and coating; in case you can't find a suitable product below in one of our catalogs, we encourage you to email or call us so we can determine which product is the best fit for you. When contacting us, please make sure to provide us some of the following key information: - Application for the fasteners or rigging hardware product - Material grade needed for your fasteners & rigging hardware components - Dimensions - Finish - Packaging requirements - Labeling requirements - Quantity per order / Yearly demand Please download our relevant product brochures by clicking on the colored links below: Standard Rigging Hardware - Shackles Standard Rigging Hardware - Eye Bolt and Nut Standard Rigging Hardware - Turnbuckles Standard Rigging Hardware - Wire Rope Clip Standard Rigging Hardware - Hooks Standard Rigging Hardware - Load Binder Standard Rigging Hardware - New Products Standard Rigging Hardware - Stainless Steel Standard Rigging Hardware - Steel Wires - Steel Wire Ropes and Cables Standard Rigging Hardware - Synthetic Plastic Ropes Standard Rigging Hardware - Traditional-Ropes-Manila-Polyhemp-Sisal-Cotton LINK CHAINS have torus shaped links. They are used in bicycle locks, as locking chains, sometimes as pulling & hoisting chains and similar applications. Here is our downloadable product brochure for off-the-shelf link chains: Link Chains - Steel Chains - International Chains - Stainless Steel Chains and Accessories CLICK Product Finder-Locator Service PREVIOUS PAGE