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Request for Private or White Label Product, Private Labeling, White Labeling, Private Label, White Label AGS-TECH, Inc. is your Private and White Label manufacturer and Supplier. You can procure products with your brand name, logo and label from us. Many of our ready & off-shelf products can be shipped to you with your brand name on them, so you can start selling and promoting your brand immediately. Request for Private or White Label Product We can PRIVATE LABEL or WHITE LABEL your products with your name, your brand name or any name you wish. Private labeling or white labeling means a product is manufactured by one company and sold under another company's brand name or some other name. Retailers often use private labeling to offer many items to their clients, expand their catalogs, and undercut competitor pricing. We have good news for you. We have a database of thousands of ready products that can be easily labeled with your company name, brand, logo....etc. and shipped to you. This means you will not need to pay for any design engineering or new molds, tooling....etc. All we need to do is take the product and put your name on it. So you can start selling and promoting your brand. On the other hand, we have the options of modifying one of our existing products for you, or adding different features, shape...etc. This can make the product fit your taste. Lastly, if you prefer, we can create a completely new product for you. We will do it however you want it. Please fill out the form below for any product you would like us to offer you with your PRIVATE LABEL or WHITE LABEL . If filling out the form below is not possible or too difficult, we do accept your request by email also. Simply write us at sales@agstech.net Get a Price Quote on a Private or White Label Product with your Brand & Logo First name Last name Email Phone Product Name Your Application for the Product Quantity Needed Do you have a price target ? If you do have, please let us know your expected price: Give us more details if you want: Do you accept offshore manufacturing ? YES NO If you have any, upload product relevant files by clicking at the below link. Don't worry, the link below will pop up a new window for uploading your files. You will not navigate away from this current window. After uploading your files, close ONLY the Dropbox Window, but not this page. Make sure to fill out all spaces and click the submit button below. Files that will help us quote a private or white label product are technical drawings, bill of materials, photos, sketches....etc. You can download more than one file. CLICK HERE TO UPLOAD FILES Request a Quote Thanks! We’ll send you a price quote shortly. We are AGS-TECH Inc., your one-stop source for manufacturing & fabrication & engineering & outsourcing & consolidation. We are the World's most diverse engineering integrator offering you custom manufacturing, subassembly, assembly of products and engineering services.

Pneumatic Hydraulic & Vacuum Tools, Air Tool, Hydraulic Powered Tools, Air Screwdrivers, Air Drills, Pneumatic Nail Guns, Air Die Grinders,Hydraulic Pipe Cutter Tools for Hydraulics & Pneumatics & Vacuum We also supply widely used industrial tools for pneumatic, hydraulic and vacuum systems. PNEUMATIC TOOLS (also called AIR TOOLS or AIR-POWERED TOOLS or PNEUMATIC-POWERED TOOLS are types of power tools driven by compressed air, supplied by air compressors. Pneumatic tools can also be driven by compressed carbon dioxide (CO2) stored in small cylinders allowing portability and use where no compressed air lines are available. Pneumatic tools are safer to run and easier to maintain than electric power tool equivalents. Pneumatic tools also have a higher power-to-weight ratio, allowing a smaller, lighter tool to accomplish the same task. General grade pneumatic tools with short life span are generally less expensive. Both disposable as well as industrial grade pneumatic tools with long life span are available. Generally speaking, pneumatic tools are cheaper than the equivalent electric-powered tools. Air tools are becoming more and more popular in the DIY (Do it yourself) market. HYDRAULIC-POWERED TOOLS on the other hand are generally more powerful tools used for applications that require higher pressures and forces. Liquids are much much less compressible than gases and that is the reason why hydraulic powered tools are able to supply such large forces. INDUSTRIAL VACUUM TOOLS offered are mostly manipulators, grippers, holders, lifters used in handling, moving, removing parts and components in industrial settings. Vacuum is also used in packaging to remove air from inside packages to extend the shelf life of products and protect them from moisture, air and early corrosion and decay. We supply both off-shelf and custom manufactured pneumatic, hydraulic and vacuum tools. Here is a list of some common tools: AIR SCREWDRIVERS, ROUTERS AIR RATCHET AIR & HYDRAULIC DRILLS PNEUMATIC NAIL GUN AIR & HYDRAULIC HAMMERS RIVETER & RIVETING HAMMER AIR GUNS and NOZZLES SANDBLASTER AIRBRUSH PAINT SPRAYER AIR CAULK GUNS AIR DIE GRINDERS AIR SANDER AIR BEVELERS AIR CUT-OFF TOOLS SWIVEL CONNECTORS AIR KNIVES PNEUMATIC SLIDES AIR CANNONS AIR AMPLIFIERS AIR CONVEYORS HYDRAULIC & PNEUMATIC TORQUE WRENCH HYDRAULIC PRESSES HYDRAULIC PIPE CUTTERS HYDRAULIC PULLER HYDRAULIC BOLTING TOOLS HYDRAULIC WORKHOLDING DEVICES VACUUM MANIPULATORS and GRIPPERS VACUUM LIFTERS VACUUM PACKAGING TOOLS CUSTOM SPECIALTY TOOLS Click links below to download our relevant brochures: - Air Tool Kits - Air Tools Accessories and Special Industrial Pneumatic Tools - Air Nailers and Staplers - Air Spray Guns - Air Brushes - Air Guns, Hoses, Connectors, Splitters and Accessories - DIY Air Tools - DIY Air Tools Assortment & Wet Air Tools - Oil-Less Mini Air Compressors - Private Label Pneumatic Air Blow Guns (We can put your company name, brand, logo, label on these if you wish) - Private Label Pneumatic Compressed Air Tools (We can put your company name, brand, logo, label on these if you wish) - Professional Air Tools Part-1 - Professional Air Tools Part-2 - Professional Air Tools Part-3 - Professional Air Tools Assortment CLICK Product Finder-Locator Service PREVIOUS PAGE

AGS-TECH Difference: World's Most Diverse Global Engineering Integrator, Custom Manufacturer, Contract Manufacturing Partner, Consolidator, Subcontractor AGS-TECH Difference: World's Most Diverse Custom Manufacturer, Consolidator, Engineering Integrator and Outsourcing Partner AGS-TECH Inc. is recognized globally as the World's Most Diverse Custom Manufacturer, Consolidator, Engineering Integrator and Outsourcing Partner. Our spectrum of custom manufacturing, engineering and integration capabilities is wider than any other company. When you contact us, you don’t have to worry about searching other suppliers for outsourcing your machined, molded, stamped, forged components, or suppliers who can assemble your electronic or optical products or else. When you contact AGS-TECH Inc., you have come to the right place to outsource all your custom manufactured components, subassemblies, assemblies and finished products. We can custom manufacture them from scratch all the way to a finished, packaged and labeled product. Neither do you have to worry about shipping and customs clearance, as we do it all for you, unless you prefer to do it yourself. Being the World's Most Diverse Custom Manufacturer, Consolidator, Engineering Integrator and Outsourcing Partner, AGS-TECH keeps working on many projects of different nature and projects of extraordinary complexity. Most outsourcing partners in the market have limited technological and logistical capability. They have an understanding of only a few areas of technology. A typical outsourcing partner may be capable of providing you custom castings and machined parts only, or they may be able to offer you custom casting, machining, forging and stamping. Other outsourcing partners may specialize in only custom manufactured electronics and offer you PCB, PCBA and cable assemblies. Working with such a typical custom manufacturer or outsourcing partner that supplies only PCBA and cable assembly, you would need to outsource the custom designed plastic housings of your products from a mold maker. This would inevitably make logistics more expensive and increase the risks in integration and consolidation. Components manufactured and supplied by a number of different sources have a high potential of mismatching and incompatibility. If any problem arises during the assembly of these custom manufactured components, each of the different manufacturers will be inclined to blame the other components manufacturers. You will be caught in the middle of a fire with no way out and finally your invested tooling and molding fees plus product payments would be lost and your project either delayed or cancelled due to economic losses and late delivery. You could even lose other repeat-orders that were previously well manufactured and shipped to your customers, because your overall quality rating with your customer’s QC Department will drop. On the other hand, when you work with AGS-TECH as a custom manufacturer, consolidator, engineering integrator and outsourcing partner, we take responsibility for the entire project. We make sure that all the custom designed interior electronics, optoelectronics, optics, mechanics of your product works in harmony and integrates well. Furthermore, we assure that the custom interior components fit well with the outer components and can sustain mechanical, thermal…etc. shocks and offer environmental reliability as a whole. As a manufacturing integrator and consolidator we can ship all the product parts unassembled, partially assembled or fully assembled. Besides compatibility, this offers a logistical advantage, because product components can be consolidated and shipped together as a single consignment. Being the World’s most diverse global custom manufacturer, consolidator, engineering , integrator and outsourcing partner with the widest spectrum of manufacturing capabilities, we are shareholders and partners of production facilities around the globe. To keep our top spot as a reliable outsourcing partner and custom manufacturer we constantly are on the outlook to buy manufacturing facilities globally or partner with them. Here is a link to download some basic Information on Global Custom Manufacturing, Integration, Consolidation and Outsourcing by AGS-TECH Inc. Even more important than being the most diverse global custom manufacturer and outsourcing partner is the outstanding quality of our team and their leadership skills. All our management team members have at least a B.S. or B.Eng. degree from globally recognized institutions and most have an. M.S., M.Eng or PhD degree in a technical field and MBA or ,instead of the MBA, many years of industrial experience with top technology companies. In other words, we are different that the standard typical entrepreneurs, business people or academicians with either limited technical or business background. We have the intellectual capacity to manage even the most sophisticated projects and guide the smartest clients. Working with us, you will definitely expand your knowledge and understanding of custom manufacturing and engineering integration processes. It would be completely correct to state AGS-TECH’s difference in words as: World's Most Diverse Custom Manufacturer, Consolidator, Engineering Integrator and Outsourcing Partner with some of the brightest and best people you can ever find. It is a privilege to work with us. Whether you choose to work with us or not, that is a decision you will make. Either case, we would be happy to share with you our Youtube video presentation on "How to Identify, Verify, Choose the Best Suppliers & Manufacturers for your Custom Tailored Products" . To watch it please click on the colored text. A Powerpoint presentation of the above video can be downloaded by clicking: "How to Identify, Verify, Choose the Best Suppliers & Manufacturers for your Custom Tailored Products" A nother video we would like to share with you is on "How You Can Receive Best Quotes from Custom Manufacturers" A Powerpoint presentation of the above video can be downloaded by clicking: "How You Can Receive Best Quotes from Custom Manufacturers" PREVIOUS PAGE

AGS-TECH Inc. is a supplier of equipment to cut, drill and polish materials such as glass, semiconductors, wood, masonry...etc. Contact us for mini lathe, mini milling machine, ultrasonic drill, mini hobbing machine, desktop stamping press, desktop laser cutter, mini waterjet cutter, desktop plasma cutting machine... Equipment for Cutting, Drilling, Polishing Please click on the products of interest below to download related brochures. Equipment we supply to cut, drill and polish are generally tabletop, compact, small and economical, yet efficient, versatile, high return on investment type equipment suitable for prototype manufacturing, research & development and small scale industrial production. Our strength is also in customizing equipment to cut drill and polish. We are capable of building equipment for you which you may not be able to find readily in the market. - Hose-Cut-Off-Skive-Machine (We private label these with your brand name and logo if you wish) - Mini Lathe - Mini Milling Machine - Mini Hobbing Machine - Mini Stamping Press - Mini Laser Cutter - Mini Waterjet Cutter - Mini Plasma Cutter - Power Tools for Every Industry (We private label these with your brand name and logo if you wish) - Servo C-Frame Utility Press (We private label these with your brand name and logo if you wish) - Ultrasonic Drill Since we offer a wide variety of equipment for cutting, dicing, drilling, lapping, polishing, shaping; it is impossible to list them all here. From time to time we introduce also new equipment to the market. We encourage you to email or call us so we can jointly determine which product is the best fit for you. When you contact us, please make sure to inform us about: - Your application - Type and grade of material to be processed - Dimensions of material to be processed - Finish required after processing - Quantity / Number of units to be processed per hour or day. CLICK HERE to download our technical capabilities and reference guide for specialty cutting, drilling, grinding, forming, shaping, polishing tools used in medical, dental, precision instrumentation, metal stamping, die forming and other industrial applications. CLICK Product Finder-Locator Service Click Here to go to Cutting, Drilling, Grinding, Lapping, Polishing, Dicing and Shaping Tools Menu Ref. Code: oicaszhengzhouhongtuo, oicaslzqtool

Thickness Gauges - Ultrasonic - Flaw Detector - Nondestructive Measurement of Thickness & Flaws from AGS-TECH Inc. - USA Thickness and Flaw Gauges & Detectors AGS-TECH Inc. offers ULTRASONIC FLAW DETECTORS and a number of different THICKNESS GAUGES with different principles of operation. One of the popular types are the ULTRASONIC THICKNESS GAUGES ( also referred to as UTM ) which are measuring instruments for the NON-DESTRUCTIVE TESTING & investigation of a material's thickness using ultrasonic waves. Another type is HALL EFFECT THICKNESS GAUGE ( also referred to as MAGNETIC BOTTLE THICKNESS GAUGE ). The Hall Effect thickness gauges offer the advantage of accuracy not being affected by the shape of samples. A third common type of NON-DESTRUCTIVE TESTING ( NDT ) instruments are EDDY CURRENT THICKNESS GAUGES. Eddy-current-type thickness gauges are electronic instruments that measure variations in impedance of an eddy-current inducing coil caused by coating thickness variations. They can only be used if the electrical conductivity of the coating differs significantly from that of the substrate. Yet a classical type of instruments are the DIGITAL THICKNESS GAUGES. They come in a variety of forms and capabilities. Most of them are relatively inexpensive instruments that rely on contacting two opposing surfaces of the specimen to measure thickness. Some of the brand name thickness gauges and ultrasonic flaw detectors we sell are SADT, SINOAGE and MITECH. ELCOMETER Inspection Equipment (material and corrosion thickness measurement, flaw detection instruments available) MITECH Multimode U ltrasonic T hickness G auges MT180 and MT190, please CLICK HERE MITECH P roduct C omparison T able for Flaw Detectors please click here. MITECH Ultrasonic F law D etector MODEL MFD620C please click here. Private Label Hand Tools for Every Industry (This catalog contains a few thickness gauges. We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers.) SADT-SINOAGE Ultrasonic Thickness Gauges, please CLICK HERE. SADT-SINOAGE Brand Metrology and Test Equipment, please CLICK HERE. ULTRASONIC THICKNESS GAUGES : What makes ultrasonic measurements so attractive is their ability to gauge thickness without a need for accessing both sides of the test specimen. Various versions of these instruments such as ultrasonic coating thickness gauge, paint thickness gauge and digital thickness gauge are commercially available. A variety of materials including metals, ceramics, glasses and plastics can be tested. The instrument measures the amount of time it takes sound waves to traverse from the transducer through the material to the back end of the part and then the time which the reflection takes to get back to the transducer. From the time measured, the instrument calculates the thickness based on the speed of sound through the specimen. The transducer sensors are generally piezoelectric or EMAT. Thickness gauges with both a predetermined frequency as well as some with tunable frequencies are available. The tunable ones allow inspection of a wider range of materials. Typical ultrasonic thickness gauge frequencies are 5 mHz. Our thickness gauges offer the capability to save data and to output it to data logging devices. Ultrasonic thickness gauges are non-destructive testers, they do not require access to both sides of the test specimens, some models can be used on coatings and linings, accuracies less than 0.1mm can be obtained, easy to use on the field and no need for lab environment. Some disadvantages are the requirement of calibration for each material, need for good contact with the material which sometimes requires special coupling gels or petroleum jelly to be used at the device/sample contact interface. Popular application areas of portable ultrasonic thickness gauges are shipbuilding, construction industries, pipelines and pipe manufacturing, container and tank manufacturing....etc. The technicians can easily remove dirt and corrosion from the surfaces and then apply the coupling gel and press the probe against the metal to measure thickness. Hall Effect gages measure total wall thicknesses only, while ultrasonic gages are capable to measure individual layers in multilayer plastic products. In HALL EFFECT THICKNESS GAUGES the measurement accuracy will not be affected by the shape of samples. These devices are based on the theory of Hall Effect. For testing, the steel ball is placed on one side of the sample and the probe on the other side. The Hall Effect sensor on the probe measures the distance from the probe tip to the steel ball. The calculator will display the real thickness readings. As you can imagine, this non-destructive test method offers quick measurement for spot thickness on area where accurate measurement of corners, small radii, or complex shapes are required. In nondestructive testing, Hall Effect gages employ a probe containing a strong permanent magnet and a Hall semiconductor connected to a voltage measurement circuit. If a ferromagnetic target such as a steel ball of known mass is placed in the magnetic field, it bends the field, and this changes the voltage across the Hall sensor. As the target is moved away from the magnet, the magnetic field and hence the Hall voltage, change in a predictable manner. Plotting these changes, an instrument can generate a calibration curve that compares the measured Hall voltage to the distance of the target from the probe. The information entered into the instrument during the calibration allows the gage to establish a lookup table, in effect plotting a curve of voltage changes. During measurements, the gage checks the measured values against the lookup table and displays thickness on a digital screen. Users only need to key in known values during calibration and let the gage do the comparing and calculating. The calibration process is automatic. Advanced equipment versions offer display of the real time thickness readings and automatically captures the minimum thickness. Hall Effect thickness gauges are widely used in plastic packaging industry with rapid measurement ability, up to 16 times per second and accuracies of about ±1%. They can store thousands of thickness readings in memory. Resolutions of 0.01 mm or 0.001 mm (equivalent to 0.001” or 0.0001”) are possible. EDDY CURRENT TYPE THICKNESS GAUGES are electronic instruments that measure variations in impedance of an eddy-current inducing coil caused by coating thickness variations. They can only be used if the electrical conductivity of the coating differs significantly from that of the substrate. Eddy current techniques can be used for a number of dimensional measurements. The ability to make rapid measurements without the need for couplant or, in some cases even without the need for surface contact, makes eddy current techniques very useful. The type of measurements that can be made include thickness of thin metal sheet and foil, and of metallic coatings on metallic and nonmetallic substrate, cross-sectional dimensions of cylindrical tubes and rods, thickness of nonmetallic coatings on metallic substrates. One application where the eddy current technique is commonly used to measure material thickness is in the detection and characterization of corrosion damage & thinning on the skins of aircraft. Eddy current testing can be used to do spot checks or scanners can be used to inspect small areas. Eddy current inspection has an advantage over ultrasound in this application because no mechanical coupling is required to get the energy into the structure. Therefore, in multi-layered areas of the structure like lap splices, eddy current can often determine if corrosion thinning is present in buried layers. Eddy current inspection has an advantage over radiography for this application because only single sided access is required to perform the inspection. To get a piece of radiographic film on the back side of the aircraft skin might require uninstalling interior furnishings, panels, and insulation which could be very costly and damaging. Eddy current techniques are also used to measure the thickness of hot sheet, strip and foil in rolling mills. An important application of tube-wall thickness measurement is the detection and assessment of external and internal corrosion. Internal probes must be used when the external surfaces are not accessible, such as when testing pipes that are buried or supported by brackets. Success has been achieved in measuring thickness variations in ferromagnetic metal pipes with the remote field technique. Dimensions of cylindrical tubes and rods can be measured with either outer diameter coils or internal axial coils, whichever is appropriate. The relationship between change in impedance and change in diameter is fairly constant, with the exception at very low frequencies. Eddy current techniques can determine thickness changes down to about three percent of the skin thickness. It is also possible to measure the thicknesses of thin layers of metal on metallic substrates, provided the two metals have widely differing electrical conductivities. A frequency must be selected such that there is complete eddy current penetration of the layer, but not of the substrate itself. The method has also been used successfully for measuring thickness of very thin protective coatings of ferromagnetic metals (such as chromium and nickel) on non-ferromagnetic metal bases. On the other hand, the thickness of nonmetallic coatings on metal substrates can be determined simply from the effect of liftoff on impedance. This method is used for measuring the thickness of paint and plastic coatings. The coating serves as a spacer between the probe and the conductive surface. As the distance between the probe and the conductive base metal increases, the eddy current field strength decreases because less of the probe's magnetic field can interact with the base metal. Thicknesses between 0.5 and 25 µm can be measured with an accuracy between 10% for lower values and 4% for higher values. DIGITAL THICKNESS GAUGES : They rely on contacting two opposing surfaces of the specimen to measure thickness. Most digital thickness gauges are switchable from metric reading to inch reading. They are limited in their capabilities because proper contacting is needed to make accurate measurements. They are also more prone to operator error due to variations from user to user’s specimen handling differences as well as the wide differences in specimen properties such as hardness, elasticity….etc. They may be however sufficient for some applications and their prices are lower compared to the other types of thickness testers. The MITUTOYO brand is well recognized for its digital thickness gauges. Our PORTABLE ULTRASONIC THICKNESS GAUGES from SADT are: SADT Models SA40 / SA40EZ / SA50 : SA40 / SA40EZ are the miniaturized ultrasonic thickness gauges that can measure wall thickness and velocity. These intelligent gauges are designed to measure the thickness of both metallic and nonmetallic materials such as steel, aluminum, copper, brass, silver and etc. These versatile models can easily be equipped with the low & high frequency probes, high temperature probe for demanding application environments. The SA50 ultrasonic thickness meter is micro-processor controlled and is based on the ultrasonic measurement principle. It is capable of measuring the thickness and acoustic speed of ultrasound transmitted through various materials. The SA50 is designed to measure the thickness of standard metal materials and metal materials covered with coating. Download our SADT product brochure from above link to see differences in measuring range, resolution, accuracy, memory capacity, ….etc between these three models. SADT Models ST5900 / ST5900+ : These instruments are the miniaturized ultrasonic thickness gauges that can measure wall thicknesses. The ST5900 has a fixed velocity of 5900 m/s, which is used only for measuring the wall thickness of steel. On the other hand, the model ST5900+ is capable to adjust velocity between 1000~9990m/s so that it can measure the thickness of both metallic and nonmetallic materials like steel, aluminum, brass, silver,…. etc. For details on various probes please download product brochure from the above link. Our PORTABLE ULTRASONIC THICKNESS GAUGES from MITECH are: Multi-Mode Ultrasonic Thickness Gauge MITECH MT180 / MT190 : These are multi-mode ultrasonic thickness gauges based on the same operating principles as SONAR. The instrument is capable of measuring the thickness of various materials with accuracies as high as 0.1/0.01 millimeters. The multi-mode feature of the gauge allows the user to toggle between pulse-echo mode (flaw and pit detection), and echo-echo mode (filtering paint or coating thickness). Multi-mode: Pulse-Echo mode and Echo-Echo mode. The MITECH MT180 / MT190 models are capable of performing measurements on a wide range of materials, including metals, plastic, ceramics, composites, epoxies, glass and other ultrasonic wave conducting materials. Various transducer models are available for special applications such as coarse grain materials and high temperature environments. The instruments offer Probe-Zero function, Sound-Velocity-Calibration function, Two-Point Calibration function, Single Point Mode and Scan Mode. The MITECH MT180 / MT190 models are capable of seven measurement readings per second in the single point mode, and sixteen per second in the scan mode. They have coupling status indicator, option for Metric/Imperial unit selection, battery information indicator for the remaining capacity of the battery, auto sleep and auto power off function to conserve battery life, optional software to process the memory data on the PC. For details on various probes and transducers please download product brochure from the above link. ULTRASONIC FLAW DETECTORS : Modern versions are small, portable, microprocessor-based instruments suitable for plant and field use. High frequency sound waves are used to detect hidden cracks, porosity, voids, flaws and discontinuities in solids such as ceramic, plastic, metal, alloys…etc. These ultrasonic waves reflect from or transmit through such flaws in the material or product in predictable ways and produce distinctive echo patterns. Ultrasonic flaw detectors are nondestructive test instruments (NDT testing). They are popular in testing of welded structures, structural materials, manufacturing materials. The majority of ultrasonic flaw detectors operate at frequencies between 500,000 and 10,000,000 cycles per second (500 KHz to 10 MHz), far beyond the audible frequencies our ears can detect. In ultrasonic flaw detection, generally the lower limit of detection for a small flaw is one-half wavelength and anything smaller than that will be invisible to the test instrument. The expression summarizing a sound wave is: Wavelength = Speed of Sound / Frequency Sound waves in solids exhibit various modes of propagation: - A longitudinal or compression wave is characterized by particle motion in the same direction as wave propagation. In other words the waves travel as a result of compressions and rarefactions in the medium. - A shear / transverse wave exhibits particle motion perpendicular to the direction of wave propagation. - A surface or Rayleigh wave has an elliptical particle motion and travels across the surface of a material, penetrating to a depth of approximately one wavelength. Seismic waves in earthquakes are also Rayleigh waves. - A plate or Lamb wave is a complex mode of vibration observed in thin plates where material thickness is less than one wavelength and the wave fills the entire cross-section of the medium. Sound waves may be converted from one form to another. When sound travels through a material and encounters a boundary of another material, a portion of the energy will be reflected back and a portion transmitted through. The amount of energy reflected, or reflection coefficient, is related to the relative acoustic impedance of the two materials. Acoustic impedance in turn is a material property defined as density multiplied by the speed of sound in a given material. For two materials, the reflection coefficient as a percentage of incident energy pressure is: R = (Z2 - Z1) / (Z2 + Z1) R = reflection coefficient (e.g. percentage of energy reflected) Z1 = acoustic impedance of first material Z2 = acoustic impedance of second material In ultrasonic flaw detection, the reflection coefficient approaches 100% for metal / air boundaries, which can be interpreted as all of the sound energy being reflected from a crack or discontinuity in the path of the wave. This makes ultrasonic flaw detection possible. When it comes to reflection and refraction of sound waves, the situation is similar to that of light waves. Sound energy at ultrasonic frequencies is highly directional and the sound beams used for flaw detection are well defined. When sound reflects off a boundary, the angle of reflection equals the angle of incidence. A sound beam that hits a surface at perpendicular incidence will reflect straight back. Sound waves that are transmitted from one material to another bend in accordance to Snell's Law of refraction. Sound waves hitting a boundary at an angle will be bent according to the formula: Sin Ø1/Sin Ø2 = V1/V2 Ø1 = Incident angle in first material Ø2= Refracted angle in second material V1 = Velocity of sound in the first material V2 = Velocity of sound in the second material Transducers of ultrasonic flaw detectors have an active element made of a piezoelectric material. When this element is vibrated by an incoming sound wave, it generates an electrical pulse. When it is excited by a high voltage electrical pulse, it vibrates across a specific spectrum of frequencies and generates sound waves. Because sound energy at ultrasonic frequencies does not travel efficiently through gasses, a thin layer of coupling gel is used between the transducer and the test piece. Ultrasonic transducers used in flaw detection applications are: - Contact Transducers: These are used in direct contact with the test piece. They send sound energy perpendicular to the surface and are typically used for locating voids, porosity, cracks, delaminations parallel to the outside surface of a part, as well as for measuring thickness. - Angle Beam Transducers: They are used in conjunction with plastic or epoxy wedges (angle beams) to introduce shear waves or longitudinal waves into a test piece at a designated angle with respect to the surface. They are popular in weld inspection. - Delay Line Transducers: These incorporate a short plastic waveguide or delay line between the active element and the test piece. They are used to improve near surface resolution. They are suitable for high temperature testing, where the delay line protects the active element from thermal damage. - Immersion Transducers: These are designed to couple sound energy into the test piece through a water column or water bath. They are used in automated scanning applications and also in situations where a sharply focused beam is needed for improved flaw resolution. - Dual Element Transducers: These utilize separate transmitter and receiver elements in a single assembly. They are often used in applications involving rough surfaces, coarse grained materials, detection of pitting or porosity. Ultrasonic flaw detectors generate and display an ultrasonic waveform interpreted with the aid of analysis software, to locate flaws in materials and finished products. Modern devices include an ultrasonic pulse emitter & receiver, hardware and software for signal capture and analysis, a waveform display, and a data logging module. Digital signal processing is used for stability and precision. The pulse emitter & receiver section provides an excitation pulse to drive the transducer, and amplification and filtering for the returning echoes. Pulse amplitude, shape, and damping can be controlled to optimize transducer performance, and receiver gain and bandwidth can be adjusted to optimize signal-to-noise ratios. Advanced version flaw detectors capture a waveform digitally and then perform various measurement and analysis on it. A clock or timer is used to synchronize transducer pulses and provide distance calibration. Signal processing generates a waveform display that shows signal amplitude versus time on a calibrated scale, digital processing algorithms incorporate distance & amplitude correction and trigonometric calculations for angled sound paths. Alarm gates monitor signal levels at selected points in the wave train and flag echoes from flaws. Screens with multicolor displays are calibrated in units of depth or distance. Internal data loggers record full waveform and setup information associated with each test, information like echo amplitude, depth or distance readings, presence or absence of alarm conditions. Ultrasonic flaw detection is basically a comparative technique. Using appropriate reference standards along with a knowledge of sound wave propagation and generally accepted test procedures, a trained operator identifies specific echo patterns corresponding to the echo response from good parts and from representative flaws. The echo pattern from a tested material or product may then be compared to the patterns from these calibration standards to determine its condition. An echo that precedes the backwall echo implies the presence of a laminar crack or void. Analysis of the reflected echo reveals the depth, size, and shape of the structure. In some cases testing is performed in a through transmission mode. In such a case the sound energy travels between two transducers placed on opposite sides of the test piece. If a large flaw is present in the sound path, the beam will be blocked and the sound will not reach the receiver. Cracks and flaws perpendicular to the surface of a test piece, or tilted with respect to that surface, are usually invisible with straight beam test techniques because of their orientation with respect to the sound beam. In such cases which are common in welded structures, angle beam techniques are used, employing either common angle beam transducer assemblies or immersion transducers aligned so as to direct sound energy into the test piece at a selected angle. As the angle of an incident longitudinal wave with respect to a surface increases, an increasing portion of the sound energy is converted to a shear wave in the second material. If the angle is high enough, all of the energy in the second material will be in the form of shear waves. The energy transfer is more efficient at the incident angles that generate shear waves in steel and similar materials. In addition, the minimum flaw size resolution is improved through the use of shear waves, since at a given frequency, the wavelength of a shear wave is approximately 60% the wavelength of a comparable longitudinal wave. The angled sound beam is highly sensitive to cracks perpendicular to the far surface of the test piece and, after bouncing off the far side it is highly sensitive to cracks perpendicular to the coupling surface. Our ultrasonic flaw detectors from SADT / SINOAGE are: Ultrasonic Flaw Detector SADT SUD10 and SUD20 : SUD10 is a portable, microprocessor-based instrument used widely in manufacturing plants and in the field. SADT SUD10, is a smart digital device with new EL display technology. SUD10 offers almost all functions of a professional nondestructive test instrument. The SADT SUD20 model has the same functions as SUD10, but is smaller and lighter. Here are some features of these devices: -High-speed capture and very low noise -DAC, AVG, B Scan -Solid metal housing (IP65) -Automated video of test process and play -High contrast viewing of the waveform at bright, direct sunlight as well as complete darkness. Easy reading from all angles. -Powerful PC software & data can be exported to Excel -Automated calibration of transducer Zero, Offset and/or Velocity -Automated gain, peak hold and peak memory functions -Automated display of precise flaw location (Depth d, level p, distance s, amplitude, sz dB, Ø) -Automated switch for three gauges (Depth d, level p, distance s) -Ten independent setup functions, any criteria can be input freely, can work in the field without test block -Big memory of 300 A graph and 30000 thickness values -A&B Scan -RS232/USB port, communication with PC is easy -The embedded software can be updated online -Li battery, continuous working time of up to 8 hours -Display freezing function -Automatic echo degree -Angles and K-value -Lock and unlock function of system parameters -Dormancy and screen savers -Electronic clock calendar -Two gates setting and alarm indication For details download our SADT / SINOAGE brochure from the link above. Some of our ultrasonic detectors from MITECH are: MFD620C Portable Ultrasonic Flaw Detector with hi-resolution color TFT LCD display. The background color and the wave color can be selectable according to the environment. LCD brightness can be manually set. Continue working for over 8 hours with high performance lithium-ion battery module (with large capacity lithium-ion battery option), easy to be dismantled and the battery module can be charged independently outside the device. It is light and portable, easily to be taken by one hand; easy operation; superior reliability guarantees long lifetime. Range: 0~6000mm (at steel velocity); range selectable in fixed steps or continuously variable. Pulser: Spike excitation with low, middle and high choices of the pulse energy. Pulse Repetition Rate: manually adjustable from 10 to 1000 Hz. Pulse width: Adjustable in a certain range to match different probes. Damping: 200, 300, 400, 500, 600 selectable to meet different resolution and sensitivity needs. Probe working mode: Single element, dual element and through transmission; Receiver: Real-time sampling at 160MHz high speed, enough to record the defect information. Rectification: Positive half wave, negative half wave, full wave, and RF : DB Step: 0dB, 0.1 dB, 2dB, 6dB step value as well as auto-gain mode Alarm: Alarm with sound and light Memory: Total 1000 configuration channels, all instrument operating parameters plus DAC/AVG curve can be stored; stored configuration data can be easily previewed and recalled for quick, repeatable instrument setup. Total 1000 datasets store all instrument operating parameters plus A-scan. All the configuration channels and datasets can be transferred to PC via USB port. Functions: Peak Hold: Automatically searches the peak wave inside the gate and holds it on the display. Equivalent diameter calculation: find out the peak echo and calculate its equivalent diameter. Continuous Record: Record the display continuously and save it to the memory inside the instrument. Defect Localization: Localize the defect position, including the distance, the depth and its plane projection distance. Defect Sizing: Calculate the defect size Defect Evaluation: Evaluate the defect by echo envelope. DAC: Distance Amplitude Correction AVG: Distance Gain Size curve function Crack measure: Measure and calculate the crack depth B-Scan: Display the cross-section of the test block. Real-Time Clock: Real time clock for tracking the time. Communication: USB2.0 high-speed communication port For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Vibration Meter - Tachometer - Accelerometer -Vibrometer- Nondestructive Testing - SADT-Mitech- AGS-TECH Inc. - NM - USA Vibration Meters, Tachometers VIBRATION METERS and NON-CONTACT TACHOMETERS are widely used in inspection, manufacturing, production, laboratory and R&D. Please download catalogs from colored links below and let us know the brand name and model number of the product of your choice. We can offer you brand new as well as refurbished / used vibration meters, tachometers at the most competitive prices: FLUKE Test Tools Catalog (includes vibration meters, vibration testers, laser shaft alignment tool) SADT-SINOAGE Brand Metrology and Test Equipment, please CLICK HERE. In this catalog you will find some high quality vibration meters and tachometers. The vibration meter is used to measure vibrations and oscillations in machines, installations, tools or components. Measurements of the vibration meter provides the following parameters: vibration acceleration, vibration velocity and vibration displacement. This way the vibration is recorded with great precision. They are mostly portable devices and the readings can be stored and retrieved for later use. Critical frequencies which can cause damage or disturbing noise level may be detected using a vibration meter. We sell and service a number of vibration meter and non-contact tachometer brands including SINOAGE, SADT. Modern versions of these test instruments are capable of simultaneously measuring and recording a variety of parameters such as temperature, humidity, pressure, 3-axis acceleration and light; their data logger record over millions of measured values, have optional microSD cards making the able to record even over a billion measured values. Many have selectable parameters, housings, external sensors, and USB-interfaces. WIRELESS VIBRATION METERS provide the comfort of transmitting data wirelessly from the tested machine to the receiver for inspection and analysis. VIBRATION TRANSMITTERS are perfect solutions for continuous monitoring. A vibration transmitter can be used for vibration monitoring of equipment in remote or hazardous locations. They are designed in rugged NEMA 4 rated cases. Programmable version are available. Other versions include the POCKET ACCELEROMETER to measure vibration velocity in machines and installations. MULTICHANNEL VIBRATION METERS to perform vibration measurements on multiple places at the same time. The vibration velocity, acceleration and expansion in a wide frequency range can be measured. The cables of the vibration sensors are long, so the vibration measuring device is able to record vibrations at different points of the component to be tested. Many vibration meters are used primarily to determine vibrations in machines and installations revealing vibration acceleration, vibration velocity and vibration displacement. With the help of these vibration meters, the technicians are able to quickly determine the current state of the machine and the causes of the vibrations, and make the necessary adjustments and assess new conditions afterwards. However some vibration meter models can be used in the same way, but they also have functions to analyze the FAST FOURIER TRANSFORM (FFT) and display if any specific frequencies are occurring within the vibrations. These are used preferably for investigation development of machines and installations or to take measurements over a period of time in a test environment. The Fast Fourier Transform (FFT) models can also determine and analyze the 'Harmonics' with ease and precision. Vibration meters are normally used for the control rotational axis of machinery so the technicians are able to determine and evaluate the development of an axis with accuracy. In cases of emergency, the axis may be modified and changed during a scheduled pause of the machine. Many factors can cause excessive vibration in rotating machinery such as worn out bearings and couplings, foundation damage, broken mounting bolts, misalignment and unbalance. A well scheduled vibration measurement procedure helps to detect and eliminate these failures early on before any serious machine problems occur. A TACHOMETER (also called a revolution-counter, RPM gauge) is an instrument that measures the rotation speed of a shaft or disk, as in a motor or machine. These devices display the revolutions per minute (RPM) on a calibrated analogue or digital dial or display. The term tachometer is usually restricted to mechanical or electrical instruments that indicate instantaneous values of speed in revolutions per minute, rather than devices that count the number of revolutions in a measured time interval and indicate only average values for the interval. There are CONTACT TACHOMETERS as well as NON-CONTACT TACHOMETERS (also referred to as a PHOTO TACHOMETER or LASER TACHOMETER or INFRARED TACHOMETER depending on the light source used). Yet some others are referred to as COMBINATION TACHOMETERS combining a contact and photo tachometer in one unit. Modern combination tachometers show reverse direction characters on display depending on contact or photo mode, use visible light to read several inches of distance from target, the memory/readings button holds the last reading and recalls min/max readings. Just as with vibration meters, there are many models of tachometers including multi-channel instruments for measuring speed at multiple locations simultaneously, wireless versions for providing information from remote locations….etc. RPM ranges for modern instruments vary from a few RPMs to hundred or hundreds of thousands of RPM values, they offer automatic range selection, auto-zero adjustment, values such as +/- 0.05% accuracy. Our vibration meters and non-contact tachometers from SADT are: Portable Vibration Meter SADT Model EMT220 : Integrated vibration transducer, annular shear type acceleration transducer (only for integrated type), separate, built-in electric charge amplifier, shear type acceleration transducer (only for separate type), temperature transducer, type K thermoelectric couple transducer (only for EMT220 with temperature measuring function). Device has root mean square detector, vibration measurement scale for displacement is 0.001~1.999 mm (peak to peak), for velocity is 0.01~19.99 cm/s (rms value), for acceleration is 0.1~199.9 m/s2 (peak value), for vibration acceleration is 199.9 m/s2 (peak value). Temperature measurement scale is -20~400°C (only for EMT220 with temperature-measuring function). Accuracy for vibration measurement: ±5% Measurement value ±2 Digits. Temperature measurement: ±1% Measurement value ±1 Digit, Vibration Frequency Range: 10~1 kHz (Normal type) 5~1 kHz (Low frequency type) 1~15 kHz (only at “HI” position for acceleration). Display is liquid crystal display (LCD), Sample period: 1 second, vibration measurement value readout: Displacement: Peak to peak value (r.m.s.×2squareroot2), Velocity: Root mean square (r.m.s.), Acceleration: Peak value (r.m.s.×squareroot 2), Readout-keeping function: Readout of vibration / temperature value can be remembered after releasing the Measure Key (Vibration / Temperature Switch), Output Signal: 2V AC (peak value) (load resistance above 10 k at full measuring scale), Power supply: 6F22 9V laminated cell, battery life about 30 hours for continuous use, Power on / off: Power up when pressing Measure Key (Vibration / Temperature Switch), power automatically shuts off after releasing the Measure Key for one minute, Operating conditions: Temperature: 0~50°C, Humidity: 90% RH , Dimensions:185mm×68mm×30mm, Net weight:200g Portable Optical Tachometer SADT Model EMT260 : Unique ergonomic design provides direct line-of-sight viewing of display and target, easily readable 5 digit LCD display, on-target and low battery indicator, maximum, minimum and last measurement of rotational speed, frequency, cycle, linear speed and counter. Speed Ranges: Rotational speed:1~99999r/min, Frequency: 0.0167~1666.6Hz, Cycle:0.6~60000ms, Counter:1~99999, Linear speed:0.1~3000.0m/min, 0.0017~16.666m/s, Accuracy:±0.005% of reading, Display:5 digit LCD display, Input signal:1-5VP-P Pulse Input, Output signal: TTL compatible Pulse Output, Power:2x1.5V batteries, Dimensions (LxWxH): 128mmx58mmx26mm, Net weight:90g For details and other similar equipment, please visit our equipment website: http://www.sourceindustrialsupply.com CLICK Product Finder-Locator Service PREVIOUS PAGE

Couplings, Bearings Manufacturing, Permanent Coupling, Clutch, Solid Flexible Universal Beamed Coupling, Bushing, Rubber Ball Type Couplings - AGS-TECH Inc.-USA Couplings & Bearings Manufacturing COUPLINGS are used to couple or join shafts. There are two types of couplings: Permanent Couplings and Clutches. Permanent couplings are normally not disconnected except for assembly or disassembly purposes, whereas clutches permit shafts to be connected or disconnected at will. BEARINGS on the other hand, permit smooth, low friction movement between two surfaces. The movement of bearings can be either rotary (i.e. a shaft rotating within a mount) or linear (i.e. one surface moving along another). Bearings can employ either a sliding or a rolling action. Bearings based on rolling action are called rolling-element bearings. Those based on sliding action are called plain bearings. PERMANENT COUPLINGS: - Solid Couplings, Flexible Couplings, Universal Couplings - Beamed Couplings - Rubber Ball Type Couplings - Steel - Spring Type Couplings - Sleeve and Flanged Type Coupling - Hook's Type Universal Joints (Single, Double) - Constant Velocity Universal Joint Our stocked couplings include famous brands including Timken, AGS-TECH as well as other quality brands. Below you can click and download catalogues of some of the most popular couplings. Please tell us the catalogue number/model number and the quantity you would like to order and we will offer you the best prices and lead times along with offers for alternative brands similar in quality. We can supply original brand name as well as generic brand name couplings. Please click on highlighted text below to download relevant brochure or catalog: - Flexible Couplings - FCL Model and FL Jaw Models - Timken Quick Flex Couplings Catalog Click on highlighted text to download our catalog for our NTN Model Constant Velocity Joints for Industrial Machines CLUTCHES: Even though these are considered nonpermanent couplings, we have a devoted page on clutches and you can be transfered there by clicking here . BEARINGS: The type of bearings we carry in stock are: - Plain Bearings / Sleeve Bearings / Journal Bearings / Thrust Bearings - Antifriction Bearings: Ball, Roller and Needle Bearings - Radial Load, Thrust Load, Combination Radial and Thrust Load Bearings - Hydrodynamic, Fluid-Film, Hydrostatic, Boundary Lubricated, Self Lubricated Bearings, Powdered-Metal Bearings, Sintered-Metal Bearings, Oil-Impregnated Bearings - Metal, Metal Alloy, Plastic and Ceramic Bearings - Ball Bearings: Radial, Thrust, Angular - Contact Type, Deep-Groove, Self - Aligning, Single - Row, Double - Row, Flat - Race, One - Directional and Two - Directional Grooved - Race Bearings - Roller Bearings: Cylindirical, Tapered, Spherical, Needle (loose and caged) Bearings - Premounted bearing units CLICK HERE to download our engineering guide for selection of bearings. Our stocked bearings include famous brands including Timken, NTN, NSK, Kaydon, KBC, KML, SKF, AGS-TECH as well as other quality brands. Below you can click and download catalogues of some of the most popular bearings. Please tell us the catalogue number/model number and the quantity you would like to order and we will offer you the best prices and lead times along with offers for alternative brands similar in quality. We can supply original brand name as well as generic brand name bearings. Click on highlighted text to download relevant product brochures: - Full Complement Cylindrical Roller Bearings - Rolling Mill Bearings - Spherical Plain Bearings and Rod Ends - Bearings for Material Handling Systems - Supporting Rollers - Needle Roller Bearings - Automobile Bearings (go to page 116) - Non-Standard Bearings (go to page 121) - Slewing Drive Bearings - Slewing Rings and Bearings - Linear Bearings, Plain and Ball, Thin Wall, Sleeve, Flange Mount, Die-Set Flange Mount Bearings, Pillow Blocks, Square Bearings and various Shafts & Slides - Timken Cylindirical Roller Bearing Catalog - Timken Spherical Roller Bearing Catalog - Timken Tapered Roller Bearing Catalog - Timken Ball Bearings Catalog - Timken Thrust and Plain Bearings Catalog - Timken All-Purpose Bearing Catalog - Timken Engineering Manual NTN BEARINGS NSK BEARINGS KAYDON BEARINGS KBC BEARINGS KML BEARINGS SKF BEARINGS We also manufacture our customers complicated shaft, bearing and housing assemblies, premounted bearings, bearings with seals for grease and oil lubrication. - Premounted Bearings: These consist of a bearing element and housing. Premounted bearings are generally assembled to permit convenient adaptation to a machinery frame. All components of premounted bearings are incorporated within a single unit to ensure proper protection, lubrication and operation. Premounted bearings are available for a wide range of shaft sizes and a variety of housing designs. Rigid as well as self-aligning premounted bearings are offered. The self-aligning bearings compensate for minor misalignment in mounting structures. Expansion and nonexpansion bearings are available. Expansion bearings permit axial shaft movement and have applications for expansion units in equipment in which shafts become heated and increase in length at a greater rate than the structure on which the bearings are mounted. Nonexpansion bearings on the other hand, restrict shaft movement relative to the mounting structure. - Grease and Oil Lubricated Sealed Bearings: For bearings to operate properly, they need to be protected against loss of lubricant and also entrance of dirt and dust on bearing surfaces. Housing seals for grease and oil lubrication include felt ring, grease grooves, leather or synthetic rubber cuff seals, labyrinth seals, oil grooves and flingers. More specific information on the various types of seals used in the broader spectrum of applications can be found on our page on mechanical seals by clicking here. - Shaft, Bearing and Housing Assemblies: For ball or roller bearings to function properly, both the fit between the inner ring and the shaft and the fit between the outer ring and the housing must be suitable for the application. We assure that desired fits are obtained by selecting the proper tolerances for the shaft diameter and the housing bore. Bearings are generally mounted on the shaft or on tapered adapter sleeves. To hold the bearing inner ring axially on the shaft, we sometimes use a lock-nut and lock-washer. Depending on axial forces and their potential to displace bearings on the shaft we decide what method to use. Sometimes this is achieved by incorporating a shoulder in the design against which the bearing taking the load is pressed. It is impractical to mount bearings on long standard shafts with an interference fit. Therefore, we usually apply them with tapered adapter sleeves. The sleeves outer surfaces are tapered and match the tapered bores of the bearings inner rings. This assures a tight fit between the bearing’s inner ring and the shaft. Contact us and we will help you choose the right match of bearings, shafts and housing assemblies. CLICK Product Finder-Locator Service PREVIOUS PAGE

Product Finder Locator for Partially Known Products AGS-TECH, Inc. is your Global Custom Manufacturer, Integrator, Consolidator, Outsourcing Partner. We are your one-stop source for manufacturing, fabrication, engineering, consolidation, outsourcing. Fill in your information if you DO NOT know exactly which product you are looking for but have only partial information: If filling out the form below is not possible or too difficult, we do accept your request by email also. Simply write us at sales@agstech.net Get a Price Quote on a partially known brand, model, part number....etc. First name Last name Email Phone Product Name if You Know: Product Make or Brand if You Know: Please Enter Manufacturer Part Number if Known: Please Enter SKU Code if You Know: Your Application for the Product: Quantity Needed: Do you have a price target ? If so, please let us know the price you expect: Give us more details if possible: Condition of Product Needed New Used Does Not Matter If you have any, upload product relevant files by clicking at the below link. Don't worry, the link below will pop up a new window for downloading your files. You will not navigate away from this current window. After uploading your files, close ONLY the Dropbox Window, but not this page. Make sure to fill out all spaces and click the submit button below. CLICK HERE TO UPLOAD FILES Request a Quote Thanks! We’ll send you a price quote shortly. PREVIOUS PAGE We are AGS-TECH Inc., your one-stop source for manufacturing & fabrication & engineering & outsourcing & consolidation. We are the World's most diverse engineering integrator offering you custom manufacturing, subassembly, assembly of products and engineering services.

Electron Beam Machining, EBM, E-Beam Machining & Cutting & Boring, Custom Manufacturing of Parts - AGS-TECH Inc. - NM - USA EBM Machining & Electron Beam Machining In ELECTRON-BEAM MACHINING (EBM) we have high-velocity electrons concentrated into a narrow beam which are directed toward the work piece, creating heat and vaporizing the material. Thus EBM is a kind of HIGH-ENERGY-BEAM MACHINING technique. Electron-Beam Machining (EBM) can be used for very accurate cutting or boring of a variety of metals. Surface finish is better and kerf width is narrower in comparison to other thermal-cutting processes. The electron beams in EBM-Machining equipment are generated in an electron beam gun. The applications of Electron-Beam Machining are similar to those of Laser-Beam Machining, except that EBM requires a good vacuum. Thus these two processes are classified as electro-optical-thermal processes. The workpiece to be machined with EBM process is located under the electron beam and is kept under vacuum. The electron beam guns in our EBM machines are also provided with illumination systems and telescopes for alignment of the beam with the workpiece. Workpiece is mounted on a CNC table so that holes of any shape can be machined using the CNC control and beam deflection functionality of the gun. To achieve the fast evaporation of the material, the planar density of the power in the beam must be as high as possible. Values up to 10exp7 W/mm2 can be achieved at the spot of impact. The electrons transfer their kinetic energy into heat in a very small area, and the material impacted by the beam is evaporated in a very short time. The molten material at the top of the front, is expelled from the cutting zone by the high vapor pressure at the lower parts. EBM equipment is built similarly to electron beam welding machines. Electron-beam machines usually utilize voltages in the range of 50 to 200 kV to accelerate electrons to about 50 to 80% of the speed of light (200,000 km/s). Magnetic lenses whose function is based on Lorentz forces are used to focus the electron beam to the surface of the workpiece. With the help of a computer, the electromagnetic deflection system positions the beam as needed so holes of any shape can be drilled. In other words, the magnetic lenses in Electron-Beam-Machining equipment shape the beam and reduce the divergence. Apertures on the other hand allow only the convergent electrons to pass and capture the divergent low energy electrons from the fringes. The aperture and the magnetic lenses in EBM-Machines thus improve the quality of the electron beam. The gun in EBM is used in pulsed mode. Holes can be drilled in thin sheets using a single pulse. However for thicker plates, multiple pulses would be needed. Switching pulse durations of as low as 50 microseconds to as long as 15 miliseconds are generally used. To minimize electron collisions with air molecules resulting in scattering and keep contamination to a minimum, vacuum is used in EBM. Vacuum is difficult and expensive to produce. Especially obtaining good vacuum within large volumes and chambers is very demanding. Therefore EBM is best suited for small parts that fit into reasonably sized compact vacuum chambers. The level of vacuum within the EBM’s gun is in the order of 10EXP(-4) to 10EXP(-6) Torr. The interaction of the electron beam with the work piece produces X-rays which pose health hazard, and therefore well trained personnel should operate EBM equipment. Generally speaking, EBM-Machining is used for cutting holes as small as 0.001 inch (0.025 millimetre) in diameter and slots as narrow as 0.001 inch in materials up to 0.250 inch (6.25 millimetres) thick. Characteristic length is the diameter over which the beam is active. Electron beam in EBM may have a characteristic length of tens of microns to mm depending on degree of focusing of the beam. Generally, the high-energy focused electron beam is made to impinge on the workpiece with a spot size of 10 – 100 microns. EBM can provide holes of diameters in the range of 100 microns to 2 mm with a depth up to 15 mm, i.e., with a depth/diameter ratio of around 10. In case of defocused electron beams, power densities would drop as low as 1 Watt/mm2. However in case of focused beams the power densities could be increased to tens of kW/mm2. As a comparison, laser beams can be focused over a spot size of 10 – 100 microns with a power density as high as 1 MW/mm2. Electrical discharge typically provides the highest power densities with smaller spot sizes. Beam current is directly related to the number of electrons available in the beam. Beam current in Electron-Beam-Machining can be as low as 200 microamperes to 1 ampere. Increasing the EBM’s beam current and/or pulse duration directly increases the energy per pulse. We use high-energy pulses in excess of 100 J/pulse to machine larger holes on thicker plates. Under normal conditions, EBM-machining offers us the advantage of burr-free products. The process parameters directly affecting the machining characteristics in Electron-Beam-Machining are: • Acceleration voltage • Beam current • Pulse duration • Energy per pulse • Power per pulse • Lens current • Spot size • Power density Some fancy structures can also be obtained using Electron-Beam-Machining. Holes can be tapered along the depth or barrel shaped. By focusing the beam below the surface, reverse tapers can be obtained. A wide range of materials like steel, stainless steel, titanium and nickel super-alloys, aluminum, plastics, ceramics can be machined using e-beam-machining. There could be thermal damages associated with EBM. However, the heat-affected zone is narrow due to short pulse durations in EBM. The heat-affected zones are generally around 20 to 30 microns. Some materials such as aluminum and titanium alloys are more readily machined compared to steel. Furthermore EBM-machining does not involve cutting forces on the work pieces. This enables machining of fragile and brittle materials by EBM without any significant clamping or attaching as is the case in mechanical machining techniques. Holes can also be drilled at very shallow angles like 20 to 30 degrees. The advantages of Electron-Beam-Machining: EBM provides very high drilling rates when small holes with high aspect ratio are drilled. EBM can machine almost any material regardless of its mechanical properties. No mechanical cutting forces are involved, thus work clamping, holding and fixturing costs are ignorable, and fragile/brittle materials can be processed without problems. Heat affected zones in EBM are small because of shorte pulses. EBM is able of providing any shape of holes with accuracy by using electromagnetic coils to deflect electron beams and the CNC table. The disadvantages of Electron-Beam-Machining: Equipment is expensive and operating and maintaining vacuum systems requires specialized technicians. EBM requires significant vacuum pump down periods for attaining required low pressures. Even though heat affected zone is small in EBM, the recast layer formation occurs frequently. Our many years of experience and know-how helps us to take advantage of this valuable equipment in our manufacturing environment. CLICK Product Finder-Locator Service PREVIOUS PAGE

We supply custom manufactured and off-shelf jigs, fixtures and workholding tools for industrial applications, manufacturing lines, production lines, test and inspection lines, machine shops, R&D labs.......etc. Jigs, Fixtures, Tools, Workholding Solutions, Mold Components Manufacturing We offer custom manufactured and off-shelf jigs, fixtures and toolings for your workshop, factory, plant lab or other facility. The types of jigs you can purchase from us are: - Template Jig - Plate Jig - Angle-Plate Jig - Channel Jig - Diameter Jig - Leaf Jig - Ring Jig - Box Jig The types of fixtures we can supply you are: - Turning Fixtures - Milling Fixtures - Broaching Fixtures - Grinding Fixtures - Boring Fixtures - Tapping Fixtures - Duplex Fixtures - Welding Fixtures - Assembly Fixtures - Drilling Fixtures - Indexing Fixtures Some categories of industrial machine tools we manufacture and ship include: - Press tools and dies, shears - Extrusion dies - Molds, molding and casting tools - Forming tools - Shaping tools - Drilling, cutting, broaching, hobbing tools - Grinding tools - Machining, milling, turning tools - Holding and clamping tools CLICK ON BLUE TEXT BELOW TO DOWNLOAD CATALOGS & BROCHURES: EDM Tooling - Workholding Catalog Includes EDM Tooling System and Elements, EROWA Link, 3R-Link, UniClamp, Square Clamp, RefTool Holder, PIN Holder System, Clamping Elements, Swivel Block and Vises, CentroClamp, EDM Spare Parts....etc. Hose Crimping Machines and Tools We private label these with your brand name and logo if you wish. Crimp development team can assist you with the design and development of tooling for all of your crimping requirements. Hose Endforming Machines and Tools We private label these with your brand name and logo if you wish. Tool development team can assist you with the design and development of tooling for all of your end-forming tool requirements. Plastic Mold Components Catalog Here you will find off-shelf components, products that you can order and use in manufacturing your molds. These products are ideal for mold makers. Example products you can find here are ejector pins, slide units, pressure plugs, guide pins, sprue bushings, slide holding devices, wear plates, ejector sleeves.....etc. Private Label Auto Glass Repair and Replacement Systems We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools for Every Industry We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools - Hand Tool Cabinets We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Wire EDM Tooling - Workholding Catalog Includes Wire EDM Clamping Systems & Sets, Corner Sets, Ruler & Spanner, EDM Clamping Block, 3D Swivel Head, Vise Set, WEDM Vises and Magnetic Tables, Multiclamp, Wire EDM Pendulum Holder, V-Block, ICS Adapter, Beams, Beam IF, Z-Flex, Turn and Index Table, Collet Chuck Holder, EDM Link and Adapter, 3 Jaw Scroll Chuck ....etc. Workholding Tools Catalog - 1 Check this catalog for our 100% EROWA and 3R compatible workholding tools. We accept OEM work, you can send us a drawing for evaluation. Workholding Tools Catalog - 2 Check this catalog for our Workholding Devices, Die and Mold Clamps, Clamping Elements, Clamping Kits, Fixture Clamps, Toggle Clamps, Milling & MC Vices, Pneumatic & Hydraulic Clamps, Milling & Grinding Accessories, Wire Cut EDM Workholders...etc. We accept OEM work, you can send us a drawing for evaluation. You may also find our following page link useful: Industrial Machines and Equipment Manufacturing CLICK Product Finder-Locator Service PREVIOUS PAGE

Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. Microelectronics & Semiconductor Manufacturing and Fabrication Many of our nanomanufacturing, micromanufacturing and mesomanufacturing techniques and processes explained under the other menus can be used for MICROELECTRONICS MANUFACTURING too. However due to the importance of microelectronics in our products, we will concentrate on the subject specific applications of these processes here. Microelectronics related processes are also widely referred to as SEMICONDUCTOR FABRICATION processes. Our semiconductor engineering design and fabrication services include: - FPGA board design, development and programming - Microelectronics foundry services: Design, prototyping and manufacturing, third-party services - Semiconductor wafer preparation: Dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection - Microelectronic package design and fabrication: Both off-shelf and custom design and fabrication - Semiconductor IC assembly & packaging & test: Die, wire and chip bonding, encapsulation, assembly, marking and branding - Lead frames for semiconductor devices: Both off-shelf and custom design and fabrication - Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication - Sensor & actuator design and fabrication: Both off-shelf and custom design and fabrication - Optoelectronic & photonic circuits design and fabrication Let us examine the microelectronics and semiconductor fabrication and test technologies in more detail so you can better understand the services and products we are offering. FPGA Board Design & Development and Programming: Field-programmable gate arrays (FPGAs) are reprogrammable silicon chips. Contrary to processors that you find in personal computers, programming an FPGA rewires the chip itself to implement user’s functionality rather than running a software application. Using prebuilt logic blocks and programmable routing resources, FPGA chips can be configured to implement custom hardware functionality without using a breadboard and soldering iron. Digital computing tasks are carried out in software and compiled down to a configuration file or bitstream that contains information on how the components should be wired together. FPGAs can be used to implement any logical function that an ASIC could perform and are completely reconfigurable and can be given a completely different “personality” by recompiling a different circuit configuration. FPGAs combine the best parts of application-specific integrated circuits (ASICs) and processor-based systems. These benefits include the following: • Faster I/O response times and specialized functionality • Exceeding the computing power of digital signal processors (DSPs) • Rapid prototyping and verification without the fabrication process of custom ASIC • Implementation of custom functionality with the reliability of dedicated deterministic hardware • Field-upgradable eliminating the expense of custom ASIC re-design and maintenance FPGAs provide speed and reliability, without requiring high volumes to justify the large upfront expense of custom ASIC design. Reprogrammable silicon also has the same flexibility of software running on processor-based systems, and it is not limited by the number of processing cores available. Unlike processors, FPGAs are truly parallel in nature, so different processing operations do not have to compete for the same resources. Each independent processing task is assigned to a dedicated section of the chip, and can function autonomously without any influence from other logic blocks. As a result, the performance of one part of the application is not affected when more processing is added on. Some FPGAs have analog features in addition to digital functions. Some common analog features are programmable slew rate and drive strength on each output pin, allowing the engineer to set slow rates on lightly loaded pins that would otherwise ring or couple unacceptably, and to set stronger, faster rates on heavily loaded pins on high-speed channels that would otherwise run too slowly. Another relatively common analog feature is differential comparators on input pins designed to be connected to differential signaling channels. Some mixed signal FPGAs have integrated peripheral analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) with analog signal conditioning blocks that allow them to operate as a system-on-a-chip. Briefly, the top 5 benefits of FPGA chips are: 1. Good Performance 2. Short Time to Market 3. Low Cost 4. High Reliability 5. Long-Term Maintenance Capability Good Performance – With their capability of accommodating parallel processing, FPGAs have better computing power than digital signal processors (DSPs) and do not require sequential execution as DSPs and can accomplish more per clock cycles. Controlling inputs and outputs (I/O) at the hardware level provides faster response times and specialized functionality to closely match application requirements. Short Time to market - FPGAs offer flexibility and rapid prototyping capabilities and thus shorter time-to-market. Our customers can test an idea or concept and verify it in hardware without going through the long and expensive fabrication process of custom ASIC design. We can implement incremental changes and iterate on an FPGA design within hours instead of weeks. Commercial off-the-shelf hardware is also available with different types of I/O already connected to a user-programmable FPGA chip. The growing availability of high-level software tools offer valuable IP cores (prebuilt functions) for advanced control and signal processing. Low Cost—The nonrecurring engineering (NRE) expenses of custom ASIC designs exceed that of FPGA-based hardware solutions. The large initial investment in ASICs can be justified for OEMs producing many chips per year, however many end users need custom hardware functionality for the many systems in development. Our programmable silicon FPGA offers you something with no fabrication costs or long lead times for assembly. System requirements frequently change over time, and the cost of making incremental changes to FPGA designs is negligible when compared to the large expense of respinning an ASIC. High Reliability - Software tools provide the programming environment and FPGA circuitry is a true implementation of program execution. Processor-based systems generally involve multiple layers of abstraction to help task scheduling and share resources among multiple processes. The driver layer controls hardware resources and the OS manages memory and processor bandwidth. For any given processor core, only one instruction can execute at a time, and processor-based systems are continually at risk of time-critical tasks preempting one another. FPGAs, do not use OSs, pose minimum reliability concerns with their true parallel execution and deterministic hardware dedicated to every task. Long-term Maintenance Capability - FPGA chips are field-upgradable and do not require the time and cost involved with redesigning ASIC. Digital communication protocols, for example, have specifications that can change over time, and ASIC-based interfaces may cause maintenance and forward-compatibility challenges. To the contrary, reconfigurable FPGA chips can keep up with potentially necessary future modifications. As products and systems mature, our customers can make functional enhancements without spending time redesigning hardware and modifying the board layouts. Microelectronics Foundry Services: Our microelectronics foundry services include design, prototyping and manufacturing, third-party services. We provide our customers with assistance throughout the entire product development cycle - from design support to prototyping and manufacturing support of semiconductor chips. Our objective in design support services is to enable a first-time right approach for digital, analog, and mixed-signal designs of semiconductor devices. For example, MEMS specific simulation tools are available. Fabs that can handle 6 and 8 inch wafers for integrated CMOS and MEMS are at your service. We offer our clients design support for all major electronic design automation (EDA) platforms, supplying correct models, process design kits (PDK), analog and digital libraries, and design for manufacturing (DFM) support. We offer two prototyping options for all technologies: the Multi Product Wafer (MPW) service, where several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. These are more economical than the full mask set. The MLM service is highly flexible compared to the fixed dates of the MPW service. Companies may prefer outsourcing semiconductor products to a microelectronics foundry for a number of reasons including the need for a second source, using internal resources for other products and services, willingness to go fabless and decrease risk and burden of running a semiconductor fab…etc. AGS-TECH offers open-platform microelectronics fabrication processes that can be scaled down for small wafer runs as well as mass manufacturing. Under certain circumstances, your existing microelectronics or MEMS fabrication tools or complete tool sets can be transferred as consigned tools or sold tools from your fab into our fab site, or your existing microelectronics and MEMS products can be redesigned using open platform process technologies and ported to a process available at our fab. This is faster and more economical than a custom technology transfer. If desired however customer’s existing microelectronics / MEMS fabrication processes may be transferred. Semiconductor Wafer Preparation: If desired by customers after wafers are microfabricated, we carry out dicing, backgrinding, thinning, reticle placement, die sorting, pick and place, inspection operations on semiconductor wafers. Semiconductor wafer processing involves metrology in between the various processing steps. For example, thin film test methods based on ellipsometry or reflectometry, are used to tightly control the thickness of gate oxide, as well as the thickness, refractive index and extinction coefficient of photoresist and other coatings. We use semiconductor wafer test equipment to verify that the wafers haven't been damaged by previous processing steps up until testing. Once the front-end processes have been completed, the semiconductor microelectronic devices are subjected to a variety of electrical tests to determine if they function properly. We refer to the proportion of microelectronics devices on the wafer found to perform properly as the “yield”. Testing of microelectronics chips on the wafer are carried out with an electronic tester that presses tiny probes against the semiconductor chip. The automated machine marks each bad microelectronics chip with a drop of dye. Wafer test data is logged into a central computer database and semiconductor chips are sorted into virtual bins according to predetermined test limits. The resulting binning data can be graphed, or logged, on a wafer map to trace manufacturing defects and mark bad chips. This map can also be used during wafer assembly and packaging. In final testing, microelectronics chips are tested again after packaging, because bond wires may be missing, or analog performance may be altered by the package. After a semiconductor wafer is tested, it is typically reduced in thickness before the wafer is scored and then broken into individual dies. This process is called semiconductor wafer dicing. We use automated pick-and-place machines specially manufactured for microelectronics industry to sort out the good and bad semiconductor dies. Only the good, unmarked semiconductor chips are packaged. Next, in the microelectronics plastic or ceramic packaging process we mount the semiconductor die, connect the die pads to the pins on the package, and seal the die. Tiny gold wires are used to connect the pads to the pins using automated machines. Chip scale package (CSP) is another microelectronics packaging technology. A plastic dual in-line package (DIP), like most packages, is multiple times larger than the actual semiconductor die placed inside, whereas CSP chips are nearly the size of the microelectronics die; and a CSP can be constructed for each die before the semiconductor wafer is diced. The packaged microelectronics chips are re-tested to make sure that they are not damaged during packaging and that the die-to-pin interconnect process was completed correctly. Using lasers we then etch the chip names and numbers on the package. Microelectronic Package Design and Fabrication: We offer both off-shelf and custom design and fabrication of microelectronic packages. As part of this service, modeling and simulation of microelectronic packages is also carried out. Modeling and simulation ensures virtual Design of Experiments (DoE) to achieve the optimal solution, rather than testing packages on the field. This reduces the cost and production time, especially for new product development in microelectronics. This work also gives us the opportunity to explain our customers how the assembly, reliability and testing will impact their microelectronic products. The primary objective of microelectronic packaging is to design an electronic system that will satisfy the requirements for a particular application at a reasonable cost. Because of the many options available to interconnect and house a microelectronics system, the choice of a packaging technology for a given application needs expert evaluation. Selection criteria for microelectronics packages may include some of the following technology drivers: -Wireability -Yield -Cost -Heat dissipation properties -Electromagnetic shielding performance -Mechanical toughness -Reliability These design considerations for microelectronics packages affect speed, functionality, junction temperatures, volume, weight and more. The primary goal is to select the most cost-effective yet reliable interconnection technology. We use sophisticated analysis methods and software to design microelectronics packages. Microelectronics packaging deals with the design of methods for the fabrication of interconnected miniature electronic systems and the reliability of those systems. Specifically, microelectronics packaging involves routing of signals while maintaining signal integrity, distributing ground and power to semiconductor integrated circuits, dispersing dissipated heat while maintaining structural and material integrity, and protecting the circuit from environmental hazards. Generally, methods for packaging microelectronics ICs involve the use of a PWB with connectors that provide the real-world I/Os to an electronic circuit. Traditional microelectronics packaging approaches involve the use of single packages. The main advantage of a single-chip package is the ability to fully test the microelectronics IC before interconnecting it to the underlying substrate. Such packaged semiconductor devices are either through-hole mounted or surface mounted to the PWB. Surface-mounted microelectronics packages do not require via holes to go through the entire board. Instead, surface-mounted microelectronics components can be soldered to both sides of the PWB, enabling higher circuit density. This approach is called surface-mount technology (SMT). The addition of area-array–style packages such as ball-grid arrays (BGAs) and chip-scale packages (CSPs) is making SMT competitive with the highest-density semiconductor microelectronics packaging technologies. A newer packaging technology involves the attachment of more than one semiconductor device onto a high-density interconnection substrate, which is then mounted in a large package, providing both I/O pins and environmental protection. This multichip module (MCM) technology is further characterized by the substrate technologies used to interconnect the attached ICs. MCM-D represents deposited thin film metal and dielectric multilayers. MCM-D substrates have the highest wiring densities of all MCM technologies thanks to the sophisticated semiconductor processing technologies. MCM-C refers to multilayered “ceramic” substrates, fired from stacked alternating layers of screened metal inks and unfired ceramic sheets. Using MCM-C we obtain a moderately dense wiring capacity. MCM-L refers to multilayer substrates made from stacked, metallized PWB “laminates,” that are individually patterned and then laminated. It used to be a low-density interconnect technology, however now MCM-L is quickly approaching the density of MCM-C and MCM-D microelectronics packaging technologies. Direct chip attach (DCA) or chip-on-board (COB) microelectronics packaging technology involves mounting the microelectronics ICs directly to the PWB. A plastic encapsulant, which is “globbed” over the bare IC and then cured, provides environmental protection. Microelectronics ICs can be interconnected to the substrate using either flip-chip, or wire bonding methods. DCA technology is particularly economical for systems that are limited to 10 or fewer semiconductor ICs, since larger numbers of chips can affect system yield and DCA assemblies can be difficult to rework. An advantage common to both the DCA and MCM packaging options is the elimination of the semiconductor IC package interconnection level, which allows closer proximity (shorter signal transmission delays) and reduced lead inductance. The primary disadvantage with both methods is the difficulty in purchasing fully tested microelectronics ICs. Other disadvantages of DCA and MCM-L technologies include poor thermal management thanks to the low thermal conductivity of PWB laminates and a poor coefficient of thermal expansion match between the semiconductor die and the substrate. Solving the thermal expansion mismatch problem requires an interposer substrate such as molybdenum for wire bonded die and an underfill epoxy for flip-chip die. The multichip carrier module (MCCM) combines all the positive aspects of DCA with MCM technology. The MCCM is simply a small MCM on a thin metal carrier that can be bonded or mechanically attached to a PWB. The metal bottom acts as both a heat dissipater and a stress interposer for the MCM substrate. The MCCM has peripheral leads for wire bonding, soldering, or tab bonding to a PWB. Bare semiconductor ICs are protected using a glob-top material. When you contact us, we will discuss your application and requirements to choose the best microelectronics packaging option for you. Semiconductor IC Assembly & Packaging & Test: As part of our microelectronics fabrication services we offer die, wire and chip bonding, encapsulation, assembly, marking and branding, testing. For a semiconductor chip or integrated microelectronics circuit to function, it needs to be connected to the system that it will control or provide instructions to. Microelectronics IC assembly does provide the connections for power and information transfer between the chip and the system. This is accomplished by connecting the microelectronics chip to a package or directly connecting it to the PCB for these functions. Connections between the chip and the package or printed circuit board (PCB) are via wire bonding, thru-hole or flip chip assembly. We are an industry leader in finding microelectronics IC packaging solutions to meet the complex requirements of the wireless and internet markets. We offer thousands of different package formats and sizes, ranging from traditional leadframe microelectronics IC packages for thru-hole and surface mount, to the latest chip scale (CSP) and ball grid array (BGA) solutions required in high pin count and high density applications. A wide variety of packages are available from stock including CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, PLCC, PoP - Package on Package, PoP TMV - Through Mold Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Wafer Level Package)…..etc. Wire bonding using copper, silver or gold are among the popular in microelectronics. Copper (Cu) wire has been a method of connecting silicon semiconductor dies to the microelectronics package terminals. With recent increase in gold (Au) wire cost, copper (Cu) wire is an attractive way to manage overall package cost in microelectronics. It also resembles gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are almost the same for gold (Au) and copper (Cu) wire with copper (Cu) wire having lower resistivity. In microelectronics applications where resistance due to bond wire can negatively impact circuit performance, using copper (Cu) wire can offer improvement. Copper, Palladium Coated Copper (PCC) and Silver (Ag) alloy wires have emerged as alternatives to gold bond wires due to cost. Copper-based wires are inexpensive and have low electrical resistivity. However, the hardness of copper makes it difficult to use in many applications such as those with fragile bond pad structures. For these applications, Ag-Alloy offers properties similar to those of gold while its cost is similar to that of PCC. Ag-Alloy wire is softer than PCC resulting in lower Al-Splash and lower risk of bond pad damage. Ag-Alloy wire is the best low cost replacement for applications that need die-to-die bonding, waterfall bonding, ultra-fine bond pad pitch and small bond pad openings, ultra low loop height. We provide a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and complete end-of-line services. We test a variety of semiconductor device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various combinations such as ASIC, multi chip modules, System-in-Package (SiP), and stacked 3D packaging, sensors and MEMS devices such as accelerometers and pressure sensors. Our test hardware and contacting equipment are suitable for custom package size SiP, dual-sided contacting solutions for Package on Package (PoP), TMV PoP, FusionQuad sockets, multiple-row MicroLeadFrame, Fine-Pitch Copper Pillar. Test equipment and test floors are integrated with CIM / CAM tools, yield analysis and performance monitoring to deliver very high efficiency yield the first time. We offer numerous adaptive microelectronics test processes for our customers and offer distributed test flows for SiP and other complex assembly flows. AGS-TECH provides a full range of test consultation, development and engineering services across your entire semiconductor and microelectronics product lifecycle. We understand the unique markets and testing requirements for SiP, automotive, networking, gaming, graphics, computing, RF / wireless. Semiconductor manufacturing processes require fast and precisely controlled marking solutions. Marking speeds over 1000 characters/second and material penetration depths less than 25 microns are common in semiconductor microelectronics industry using advanced lasers. We are capable of marking mold compounds, wafers, ceramics and more with minimal heat input and perfect repeatability. We use lasers with high accuracy to mark even the smallest parts without damage. Lead frames for Semiconductor Devices: Both off-shelf and custom design and fabrication are possible. Lead frames are utilized in the semiconductor device assembly processes, and are essentially thin layers of metal that connect the wiring from tiny electrical terminals on the semiconductor microelectronics surface to the large-scale circuitry on electrical devices and PCBs. Lead frames are used in almost all semiconductor microelectronics packages. Most microelectronics IC packages are made by placing the semiconductor silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and subsequently covering the microelectronics chip with plastic cover. This simple and relatively low cost microelectronics packaging is still the best solution for many applications. Lead frames are produced in long strips, which allows them to be quickly processed on automated assembly machines, and generally two manufacturing processes are used: photo etching of some sort and stamping. In microelectronics lead frame design often demand is for customized specifications and features, designs that enhance electrical and thermal properties, and specific cycle time requirements. We have in-depth experience of microelectronics lead frame manufacturing for an array of different customers using laser assisted photo etching and stamping. Design and fabrication of heat sinks for microelectronics: Both off-shelf and custom design and fabrication. With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. The consistency in performance and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a semiconductor microelectronics component may be achieved by effectively controlling the device operating temperature within the limits set by the designers. Heat sinks are devices that enhance heat dissipation from a hot surface, usually the outer case of a heat generating component, to a cooler ambient such as air. For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation. A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant. This allows more heat to be dissipated and/or lowers the semiconductor device operating temperature. The primary purpose of a heat sink is to maintain the microelectronics device temperature below the maximum allowable temperature specified by the semiconductor device manufacturer. We can classify heat sinks in terms of manufacturing methods and their shapes. The most common types of air-cooled heat sinks include: - Stampings: Copper or aluminum sheet metals are stamped into desired shapes. they are used in traditional air cooling of electronic components and offer an economical solution to low density thermal problems. They are suitable for high volume production. - Extrusion: These heat sinks allow the formation of elaborate two-dimensional shapes capable of dissipating large heat loads. They may be cut, machined, and options added. A cross-cutting will produce omnidirectional, rectangular pin fin heat sinks, and incorporating serrated fins improves the performance by approximately 10 to 20%, but with a slower extrusion rate. Extrusion limits, such as the fin height-to-gap fin thickness, usually dictate the flexibility in design options. Typical fin height-to-gap aspect ratio of up to 6 and a minimum fin thickness of 1.3mm, are attainable with standard extrusion techniques. A 10 to 1 aspect ratio and a fin thickness of 0.8″can be obtained with special die design features. However, as the aspect ratio increases, the extrusion tolerance is compromised. - Bonded/Fabricated Fins: Most air cooled heat sinks are convection limited, and the overall thermal performance of an air cooled heat sink can often be improved significantly if more surface area can be exposed to the air stream. These high performance heat sinks utilize thermally conductive aluminum-filled epoxy to bond planar fins onto a grooved extrusion base plate. This process allows for a much greater fin height-to-gap aspect ratio of 20 to 40, significantly increasing the cooling capacity without increasing the need for volume. - Castings: Sand, lost wax and die casting processes for aluminum or copper / bronze are available with or without vacuum assistance. We use this technology for fabrication of high density pin fin heat sinks which provide maximum performance when using impingement cooling. - Folded Fins: Corrugated sheet metal from aluminum or copper increases surface area and the volumetric performance. The heat sink is then attached to either a base plate or directly to the heating surface via epoxy or brazing. It is not suitable for high profile heat sinks on account of the availability and fin efficiency. Hence, it allows high performance heat sinks to be fabricated. In selecting an appropriate heat sink meeting the required thermal criteria for your microelectronics applications, we need to examine various parameters that affect not only the heat sink performance itself, but also the overall performance of the system. The choice of a particular type of heat sink in microelectronics depends largely to the thermal budget allowed for the heat sink and external conditions surrounding the heat sink. There is never a single value of thermal resistance assigned to a given heat sink, since the thermal resistance varies with external cooling conditions. Sensor & Actuator Design and Fabrication: Both off-shelf and custom design and fabrication are available. We offer solutions with ready-to-use processes for inertial sensors, pressure and relative pressure sensors and IR temperature sensor devices. By using our IP blocks for accelerometers, IR and pressure sensors or applying your design according to available specifications and design rules, we can have MEMS based sensor devices delivered to you within weeks. Besides MEMS, other types of sensor and actuator structures can be fabricated. Optoelectronic & photonic circuits design and fabrication: A photonic or optical integrated circuit (PIC) is a device that integrates multiple photonic functions. It can be resembled to electronic integrated circuits in microelectronics. The major difference between the two is that a photonic integrated circuit provides functionality for information signals imposed on optical wavelengths in the visible spectrum or near infrared 850 nm-1650 nm. Fabrication techniques are similar to those used in microelectronics integrated circuits where photolithography is used to pattern wafers for etching and material deposition. Unlike semiconductor microelectronics where the primary device is the transistor, there is no single dominant device in optoelectronics. Photonic chips include low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers and detectors. These devices require a variety of different materials and fabrication techniques and therefore it is difficult to realize all of them on a single chip. Our applications of photonic integrated circuits are mainly in the areas of fiber-optic communication, biomedical and photonic computing. Some example optoelectronic products we can design and fabricate for you are LEDs (Light Emitting Diodes), diode lasers, optoelectronic receivers, photodiodes, laser distance modules, customized laser modules and more. CLICK Product Finder-Locator Service PREVIOUS PAGE

System Components Pneumatics Hydraulics Vacuum, Booster Regulators, Sensors Gauges, Pneumatic Cylinder Controls, Silencers, Exhaust Cleaners, Feedthroughs System Components for Pneumatics & Hydraulics and Vacuum We also supply other pneumatic, hydraulic and vacuum system components not mentioned elsewhere here under any menu page. These are: BOOSTER REGULATORS: They save money and energy by increasing the main line pressure by multiple times while also protecting downstream systems from pressure fluctuations. The pneumatic booster regulator, when connected to an air supply line, multiplies pressure and the main air supply pressure may be set low. Desired pressure increases and output pressures can be easily adjusted. Pneumatic booster regulators boost local line pressures without requiring additional power by 2 to 4 times. The use of pressure boosters is particularly recommended when the pressure in a system needs to be selectively increased. A system or sections of it do not have to be supplied with excessively high pressure, because this would lead to substantially higher operating costs. Pressure boosters can also be used for mobile pneumatics. An initial low pressure can be generated using relatively small compressors, and then reinforced with the help of the booster. Keep in mind however that pressure boosters are not a replacement for compressors. Some of our pressure boosters require no other source than compressed air. Pressure boosters are classified as twin-piston pressure boosters and are intended for compressing air. The basic variant of the booster consists of a double piston system and a directional control valve for continuous operation. These boosters double the input pressure automatically. It is not possible to adjust the pressure to lower values. Pressure boosters which also have a pressure regulator can boost pressures to less than double the set value. In this case the pressure regulator reduces the pressure in the outside chambers. Pressure boosters cannot vent themselves, the air can only flow in one direction. Therefore pressure boosters cannot necessarily be used in a working line between valves and cylinders. SENSORS and GAUGES (pressure, vacuum….etc): Your pressure, vacuum range, fluid flow range temperature range….etc. will determine which instrument to select. We have a wide range of standard off-shelf sensors and gauges for pneumatics, hydraulics and vacuum. Capacitance Manometers, Pressure Sensors, Pressure Switches, Pressure Control Subsystems, Vacuum & Pressure Gauges, Vacuum & Pressure Transducers, Indirect Vacuum Gauge Transducers & Modules and Vacuum & Pressure Gauge Controllers are some of the popular products. To select the right pressure sensor for a specific application, besides the pressure range, the type of pressure measurement has to be considered. Pressure sensors measure a certain pressure in comparison to a reference pressure and can be categorized into 1.) Absolute 2.) gage and 3.) differential devices. Absolute piezoresistive pressure sensors measure the pressure relative to a high vacuum reference sealed behind its sensing diaphragm (in practice referred to as Absolute Pressure). The vacuum is negligible compared to the pressure to be measured. Gage Pressure is measured relative to the ambient atmospheric pressure. Changes in the atmospheric pressure due to weather conditions or altitude influence the output of a gage pressure sensor. A gage pressure higher than ambient pressure is referred to as positive pressure. If the gage pressure is below the atmospheric pressure, it is called negative or vacuum gage pressure. According to its quality, vacuum can be categorized into different ranges such as low, high and ultra high vacuum. Gage pressure sensors only offer one pressure port. The ambient air pressure is directed through a vent hole or a vent tube to the back side of the sensing element and thus compensated. Differential pressure is the difference between any two process pressures p1 and p2. Because of this, differential pressure sensors must offer two separate pressure ports with connections. Our amplified pressure sensors are able to measure positive and negative pressure differences, corresponding to p1>p2 and p1p2) and the higher pressure has to be applied to the pressure port defined as ''high pressure port''. Another class of gauges available are Flow Meters. Systems requiring continuous monitoring of flow use in general electronic flow sensors rather than flow meters, which require no power. Electronic flow sensors can use a variety of sensing elements to generate an electronic signal proportional to the flow. The signal is then sent to an electronic display panel or control circuit. However, flow sensors produce no visual indication of flow by themselves, and they need some source of external power to transmit a signal to an analog or digital display. Self-contained flow meters, on the other hand, rely on the dynamics of flow to provide a visual indication of it. Flow meters operate on the principle of dynamic pressure. Because measured flow depends on fluid dynamics, changes in a fluid's physical properties can affect flow readings. This is due to the fact that a flow meter is calibrated to a fluid having a certain specific gravity within a range of viscosities. Wide variations in temperatures can change a hydraulic fluid's specific gravity and viscosity. Therefore when a flow meter is used when the fluid is very hot or very cold, flow readings may not conform to manufacturers' specifications. Other products include Temperature Sensors and Gauges. PNEUMATIC CYLINDER CONTROLS: Our speed controls have built in one-touch fittings minimizing installation time, reducing mounting height and enabling compact machine design. Our speed controls allow the body to be rotated to facilitate simple installation. Available in thread sizes in both inch and metric, with varying tube sizes, with optional elbow and universal style for increased flexibility, our speed controls are designed to meet most applications. There are several methods to control the extending and retracting speed of pneumatic cylinders. We offer Flow Controls, Speed Control mufflers, Quick Exhaust Valves for speed control. Double-acting cylinders can have both the out and in stroke controlled, and you can have several different control methods on each port. CYLINDER POSITION SENSORS: These sensors are used for the detection of magnet-equipped pistons on pneumatic and other types of cylinders. The magnetic field of a magnet embedded in the piston is detected by the sensor through the cylinder housing wall. These non-contact sensors determine the position of the cylinder piston without diminishing the integrity of the cylinder itself. These position sensors operate without intruding upon the cylinder, keeping the system completely intact. SILENCERS / EXHAUST CLEANERS: Our silencers are extremely effective in reducing air exhaust noise originating from pumps and other pneumatic devices. Our silencers reduce noise levels by up to 30dB while allowing high flow rates with minimal back pressure. We have filters that enable direct exhaust of air in a clean room. Air can be directly exhausted in a clean room only by mounting these exhaust cleaners to the pneumatic equipment in the clean room. There is no need for piping for exhaust and relief air. Product reduces piping installation work and space. FEEDTHROUGHS: These are generally electrical conductors or optical fibers used to carry a signal through an enclosure, chamber, vessel or interface. Feedthroughs can be divided into power and instrumentation categories. Power feedthroughs carry either high currents or high voltages. Instrumentation feedthroughs on the other hand are used to carry electrical signals, such as thermocouples, which are generally low current or voltage. Lastly, RF-feedthroughs are designed to carry very high frequency RF or microwave electrical signals. A feedthrough electrical connection may have to withstand considerable pressure difference across its length. Systems that operate under high vacuum, like vacuum chambers require electrical connections through the vessel. Submersible vehicles also require feedthrough connections between exterior instruments and devices and the controls within the vehicle pressure hull. Hermetically sealed feedthroughs are frequently used for instrumentation, high amperage and voltage, coaxial, thermocouple and fiber optic applications. Fiber optic feedthroughs transmit fiber optical signals through the interfaces. Mechanical feedthroughs transmit mechanical motion from one side of the interface (for example from the outside of the pressure chamber) to the other side (to the inside of the pressure chamber). Our feedthroughs incorporate ceramic, glass, metal / metal alloy parts, metal coatings on fibers for solderability and specialty silicones and epoxies, all chosen carefully according to the application. All our feedthrough assemblies have passed rigorous tests including environmental cycling test and related industrial standards. VACUUM REGULATORS: These devices assure that the vacuum process remains stable even through wide variations in flow rate and supply pressures. Vacuum regulators directly control vacuum pressures by modulating the flow from the system to the vacuum pump. Using our precision vacuum regulators is relatively simple. You simply connect your vacuum pump or vacuum utililty to the Outlet port. You connect the process you want to control to the Inlet port. By adjusting the vacuum knob you achieve the desired vacuum level. Please click on highlighted text below to download our product brochures for pneumatic & hydraulic & vacuum system components: - Pneumatic Cylinders - Private Label Gauges, Filters, Regulators, Temperature Instruments (We private label these with your brand name and logo if you wish) - Private Label Pneumatic Compressed Air Hoses Fittings (We private label these with your brand name and logo if you wish) - Private Label Pneumatic Couplings, Plugs and Nipples (We private label these with your brand name and logo if you wish) - Process Automation Solutions (We private label these with your brand name and logo if you wish) - YC Series Hydraulic Cyclinder - Accumulators from AGS-TECH Inc - Information on our facility producing ceramic to metal fittings, hermetic sealing, vacuum feedthroughs, high and ultrahigh vacuum and fluid control components can be found here: Fluid Control Factory Brochure CLICK Product Finder-Locator Service PREVIOUS PAGE