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Electron Beam Machining, EBM, E-Beam Machining & Cutting & Boring, Custom Manufacturing of Parts - AGS-TECH Inc. - NM - USA I-EBM Machining & Electron Beam Machining In ELECTRON-BEAM MACHINING (EBM) sinama-electron esivinini esiphezulu agxilwe emsebenzini abe umhwamuko futhi agxilise ukushisa kube ucezu oluncane. Ngakho i-EBM iwuhlobo lwe HIGH-ENERGY-BEAM MACHINING technique. I-Electron-Beam Machining (EBM) ingasetshenziselwa ukusika okunembe kakhulu noma ukubhora kwezinhlobonhlobo zezinsimbi. Ukuqedwa okungaphezulu kungcono futhi ububanzi be-kerf buncane uma kuqhathaniswa nezinye izinqubo zokusika okushisayo. Ama-electron emishini ye-EBM-Machining akhiqizwa ngesibhamu se-electron beam. Izinhlelo zokusebenza ze-Electron-Beam Machining ziyefana nalezo ze-Laser-Beam Machining, ngaphandle kokuthi i-EBM idinga i-vacuum enhle. Ngakho lezi zinqubo ezimbili zihlukaniswa njengezinqubo ze-electro-optical-thermal. I-workpiece ezokwenziwa ngomshini ngenqubo ye-EBM itholakala ngaphansi kwe-electron beam futhi igcinwa ngaphansi kwe-vacuum. Izibhamu ze-electron beam emishinini yethu ye-EBM ziphinde zinikezwe amasistimu okukhanyisa kanye nezibonakude zokuqondanisa ugongolo nocezu lokusebenza. I-Workpiece ifakwe etafuleni le-CNC ukuze izimbobo zanoma yikuphi ukuma zifakwe ngomshini kusetshenziswa isilawuli se-CNC kanye nokusebenza kokuphambuka kwesibhamu kwesibhamu. Ukuze kuzuzwe ukuhwamuka okusheshayo kwezinto ezibonakalayo, ukuminyana kweplani yamandla kugongolo kumele kube phezulu ngangokunokwenzeka. Amanani afika ku-10exp7 W/mm2 angafinyelelwa endaweni yomthelela. Ama-electron adlulisela amandla awo e-kinetic ekushiseni endaweni encane kakhulu, futhi izinto ezithintwe ugongolo ziyahwamuka ngesikhathi esifushane kakhulu. Impahla encibilikisiwe phezulu ngaphambili, ixoshwa endaweni yokusika ngokucindezela okuphezulu komhwamuko ezingxenyeni ezingezansi. Imishini ye-EBM yakhiwe ngendlela efanayo nemishini yokushisela i-electron beam. Imishini ye-electron-beam ivamise ukusebenzisa ama-voltages ebangeni elingu-50 kuya ku-200 kV ukusheshisa ama-electron aye cishe ku-50 kuya ku-80% wejubane lokukhanya (200,000 km/s). Amalensi kazibuthe umsebenzi wawo osekelwe kumandla we-Lorentz asetshenziselwa ukugxilisa i-electron beam ebusweni bomsebenzi wokusebenza. Ngosizo lwekhompiyutha, uhlelo lokuphambuka kukagesi lubeka ugongolo njengoba kudingeka ukuze kubhojwe izimbobo zanoma yikuphi ukuma. Ngamanye amazwi, amalensi kazibuthe emishini ye-Electron-Beam-Machining alolonga ugongolo futhi anciphise ukuhlukana. Izimbobo ngakolunye uhlangothi zivumela kuphela ama-electron aguquguqukayo ukuthi adlule futhi athwebule ama-electron aphansi ahlukene asuka emiphethweni. Imbobo namalensi kazibuthe ku-EBM-Machines ngaleyo ndlela athuthukisa ikhwalithi ye-electron beam. Isibhamu ku-EBM sisetshenziswa kumodi ye-pulsed. Izimbobo zingabhobolwa emashidini amancane kusetshenziswa i-pulse eyodwa. Kodwa-ke, kumapuleti aminyene, ama-pulse amaningi azodingeka. Ukushintsha ubude bokushaya kwenhliziyo obuphansi obungama-microseconds angu-50 ukuya kuma-milliseconds angu-15 ngokuvamile kusetshenziswa. Ukunciphisa ukushayisana kwama-electron nama-molecule omoya okuholela ekuhlakazeni nasekugcineni ukungcola kube kuncane, i-vacuum isetshenziswa ku-EBM. I-vacuum inzima futhi iyabiza ukuyikhiqiza. Ikakhulukazi ukuthola i-vacuum enhle phakathi kwamavolumu amakhulu namakamelo kufuna kakhulu. Ngakho-ke i-EBM ifaneleka kakhulu izingxenye ezincane ezingena emakamelweni evacuum ahlangene anosayizi ofanele. Izinga le-vacuum ngaphakathi kwesibhamu se-EBM liku-oda lika-10EXP(-4) ukuya ku-10EXP(-6) Torr. Ukusebenzisana kwe-electron beam nesiqephu somsebenzi kukhiqiza ama-X-reyi ayingozi empilweni, ngakho-ke abasebenzi abaqeqeshwe kahle kufanele basebenzise imishini ye-EBM. Ngokuvamile, i-EBM-Machining isetshenziselwa ukusika izimbobo ezincane njengo-0.001 inch (0.025 millimeters) ububanzi kanye nezikhala ezincane njengo-0.001 inch ezintweni ezifika ku-0.250 inch (6.25 millimeters) ubukhulu. Ubude besici ubukhulu bobubanzi lapho ugongolo lusebenza khona. I-electron beam ku-EBM ingaba nobude besici obungamashumi ama-microns ukuya ku-mm kuye ngezinga lokugxila kwe-beam. Ngokuvamile, insimbi ye-electron egxile kumandla aphezulu yenziwa ukuthi ifake ucezu lomsebenzi ngosayizi wamabala wama-microns ayi-10 - 100. I-EBM inganikeza izimbobo zamadayamitha ebangeni lama-microns angu-100 kuya ku-2 mm ngokujula okungafika ku-15 mm, okungukuthi, ngokujula/ububanzi besilinganiso esingaba ngu-10. Esimeni semishayo yama-electron engagxilile, ukuminyana kwamandla kungakwehla kuze kube ngu-1. Watt/mm2. Nokho uma kunemishayo egxilile ukuminyana kwamandla kunganyuswa kube amashumi kW/mm2. Njengesiqhathaniso, imishayo ye-laser ingagxila kusayizi wendawo wama-microns ayi-10 - 100 anamandla afinyelela ku-1 MW/mm2. Ukukhishwa kukagesi ngokuvamile kunikeza ukuminyana kwamandla okuphezulu kakhulu ngamasayizi amabala amancane. I-Beam current ihlobene ngokuqondile nenani lama-electron atholakala ku-beam. I-Beam yamanje ku-Electron-Beam-Machining ingaba ngaphansi njenge-200 microamperes ukuya ku-1 ampere. Ukwenyusa ubude besikhathi se-EBM ye-beam kanye/noma noma ishayela kukhulisa ngokuqondile amandla ngokushaya ngakunye. Sisebenzisa ama-pulses anamandla angaphezu kuka-100 J/pulse ukuze sishicilele izimbobo ezinkulu kumapuleti ashubile. Ngaphansi kwezimo ezijwayelekile, i-EBM-machining isinika inzuzo yemikhiqizo engena-burr. Amapharamitha wenqubo athinta ngqo izici zomshini ku-Electron-Beam-Machining yilezi: • I-voltage yokusheshisa • I-Beam yamanje • Ubude be-pulse • Amandla ngeshayela ngalinye • Amandla ngeshayela ngalinye • Ilensi yamanje • Usayizi wendawo • Ukuminyana kwamandla Ezinye izakhiwo zikanokusho zingatholakala kusetshenziswa i-Electron-Beam-Machining. Izimbobo kungenziwa tapered eduze ukujula noma umgqomo ezimise. Ngokugxila ugongolo ngaphansi kobuso, ama-tapers ahlanekezelwe angatholakala. Izinhlobonhlobo zezinto ezifana nensimbi, insimbi engagqwali, i-titanium ne-nickel super-alloys, i-aluminium, amapulasitiki, izitsha zobumba zingenziwa ngomshini kusetshenziswa i-e-beam-machining. Kungase kube khona umonakalo oshisayo ohambisana ne-EBM. Kodwa-ke, indawo ethinteke ukushisa inciphile ngenxa yobude besikhathi esifushane sokushaya kwenhliziyo ku-EBM. Izindawo ezithinteke ekushiseni ngokuvamile ziba phakathi kwama-microns angama-20 kuye kwangama-30. Ezinye izinto ezifana ne-aluminium ne-titanium alloys zisebenza kalula ngomshini uma ziqhathaniswa nensimbi. Ngaphezu kwalokho ukwenziwa kwe-EBM akubandakanyi ukusika amandla ezicucu zomsebenzi. Lokhu kuvumela ukwenziwa kwemishini yezinto ezintekenteke neziphukayo yi-EBM ngaphandle kokugoqa okubalulekile noma ukunamathisela njengoba kwenzeka kumasu okwenza imishini. Izimbobo zingabuye zibhojwe ema-engeli angashoni kakhulu njengama-degree angama-20 kuye kwangama-30. Izinzuzo ze-Electron-Beam-Machining: I-EBM inikeza amanani aphezulu kakhulu wokumba lapho kubholwa izimbobo ezincane ezine-aspect ratio ephezulu. I-EBM ingakwazi umshini cishe noma iyiphi impahla kungakhathalekile ukuthi iziphi izinto zayo eziwumshini. Awekho amandla okusika emishini ahilelekile, ngakho-ke ukubopha umsebenzi, ukubamba kanye nokulungisa izindleko azinakwa, futhi izinto ezintekenteke/eziphukayo zingacutshungulwa ngaphandle kwezinkinga. Izindawo ezithinteke ekushiseni ku-EBM zincane ngenxa yama-pulses amafushane. I-EBM iyakwazi ukunikeza noma yikuphi ukuma kwezimbobo ngokunemba ngokusebenzisa amakhoyili kagesi ukuchezukisa imishayo yama-electron kanye netafula le-CNC. Ububi be-Electron-Beam-Machining: Izisetshenziswa ziyabiza futhi ukusebenza nokugcina amasistimu we-vacuum kudinga ochwepheshe abakhethekile. I-EBM idinga izikhathi ezibalulekile zephampu ye-vacuum phansi ukuze kutholwe ingcindezi ephansi edingekayo. Noma indawo ethinteke ukushisa incane ku-EBM, ukwakheka kwesendlalelo sokuphindaphinda kwenzeka kaningi. Iminyaka yethu eminingi yokuhlangenwe nakho nolwazi kusisiza ukuba sisebenzise lesi sisetshenziswa esibalulekile endaweni yethu yokukhiqiza. CLICK Product Finder-Locator Service IKHASI ELIDLULE

Microelectronics Manufacturing, Semiconductor Fabrication - Foundry - FPGA - IC Assembly Packaging - AGS-TECH Inc. I-Microelectronics & Semiconductor Manufacturing and Fabrication Amasu ethu amaningi nama-nanomanufacturing, micromanufacturing kanye ne-mesomanufacturing kanye nezinqubo ezichazwe ngaphansi kwamanye amamenyu zingasetshenziselwa MICROELECTRONICS MANUFACTURING_cc781903-5153cde-bbc3b5-58-5cde-bbc-3195-53cde. Kodwa-ke ngenxa yokubaluleka kwe-microelectronics emikhiqizweni yethu, sizogxila esihlokweni esisetshenziswayo salezi zinqubo lapha. Izinqubo ezihlobene nama-Microelectronics nazo zibizwa kabanzi ngokuthi SEMICONDUCTOR FABRICATION processes. Idizayini yethu yobunjiniyela be-semiconductor kanye nezinsizakalo zokwenziwa zifaka: - FPGA ukwakhiwa kwebhodi, ukuthuthukiswa nokuhlela - Microelectronics Foundry amasevisi: Idizayini, prototyping nokukhiqiza, izinsizakalo zezinkampani zangaphandle - Semiconductor isilutshwana sokulungiselela: Ukudayela, ukubuyisela emuva, ukunciphisa, ukubekwa kwe-reticle, ukuhlela ukufa, ukukhetha nokubeka, ukuhlola - Microelectronic ukwakhiwa kwephakheji nokwenziwa: Kokubili ngaphandle kweshalofu nomklamo wangokwezifiso nokwenza - Semiconductor IC umhlangano & ukupakishwa & ukuhlolwa: Die, ngocingo kanye chip bonding, encapsulation, inhlangano, ukumaka kanye uphawu - Ozimele abaholayo bamadivayisi we-semiconductor: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza - Ukuklama nokwakhiwa kwamasinki okushisa ama-microelectronics: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza. - Sensor & i-actuator idizayini nokwenziwa: Kokubili ukwakheka okungaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza - Optoelectronic & photonic circuits umklamo nokwenza Ake sihlole ukwakhiwa kwe-microelectronics kanye ne-semiconductor kanye nobuchwepheshe bokuhlola kabanzi ukuze uqonde kangcono amasevisi nemikhiqizo esiyinikezayo. I-FPGA Board Design & Development and Programming: Ama-array amasango ahlelekayo (ama-FPGA) angama-silicon chips ahleleleka kabusha. Ngokuphambene namaphrosesa owathola kumakhompuyutha omuntu siqu, ukuhlela i-FPGA kuvuselela i-chip ngokwayo ukuze iqalise ukusebenza komsebenzisi kunokusebenzisa uhlelo lwesofthiwe. Kusetshenziswa amabhulokhi anengqondo akhiwe ngaphambili kanye nezinsiza zomzila ezihlelekayo, ama-chips e-FPGA angacushwa ukuze aqalise ukusebenza kwezingxenyekazi zekhompuyutha zangokwezifiso ngaphandle kokusebenzisa ibhodi lezinkwa nensimbi yokunamathisela. Imisebenzi yekhompyutha yedijithali yenziwa kusofthiwe futhi ihlanganiswe phansi kufayela lokumisa noma i-bitstream equkethe ulwazi lokuthi izingxenye kufanele zixhunywe kanjani ndawonye. Ama-FPGA angasetshenziswa ukwenza noma yimuphi umsebenzi onengqondo i-ASIC engayenza futhi ilungiseka kabusha ngokuphelele futhi inganikezwa “ubuntu” obuhluke ngokuphelele ngokubuyisela ukucushwa kwesekethe okuhlukile. Ama-FPGA ahlanganisa izingxenye ezinhle kakhulu zamasekethe ahlanganisiwe aqondene nohlelo lokusebenza (ama-ASIC) kanye nezinhlelo ezisuselwe kumaphrosesa. Lezi zinzuzo zihlanganisa okulandelayo: • Izikhathi zokuphendula ezisheshayo ze-I/O kanye nokusebenza okukhethekile • Ukweqa amandla ekhompuyutha wama-digital signal processors (DSPs) • Ukwenza i-prototyping ngokushesha nokuqinisekisa ngaphandle kwenqubo yokwenziwa kwe-ASIC yangokwezifiso • Ukuqaliswa kokusebenza ngokwezifiso ngokuthembeka kwehadiwe enqunyiwe ezinikele • Okungathuthukiswa endaweni okuqeda izindleko zokuklama kabusha nokugcinwa kwe-ASIC ngokwezifiso Ama-FPGA ahlinzeka ngesivinini nokuthembeka, ngaphandle kokudinga amanani aphezulu ukuze athethelele izindleko ezinkulu zangaphambili zomklamo we-ASIC wangokwezifiso. I-silicon ehlelwa kabusha iphinde ibe nokuguquguquka okufanayo kwesofthiwe esebenza kumasistimu asekelwe ku-processor, futhi ayinqunyelwe ngenani lama-cores okucubungula atholakalayo. Ngokungafani namaphrosesa, ama-FPGA ayahambisana ngempela ngokwemvelo, ngakho-ke ukucubungula okuhlukile akumele kuqhudelane ngezinsiza ezifanayo. Umsebenzi ngamunye wokucutshungulwa ozimele unikezwa ingxenye ezinikele ye-chip, futhi ingasebenza ngokuzenzakalelayo ngaphandle kwethonya elivela kwamanye amabhulokhi anengqondo. Njengomphumela, ukusebenza kwengxenye eyodwa yohlelo lokusebenza akuthikameki lapho ukucubungula okwengeziwe kwengezwa. Amanye ama-FPGA anezici ze-analog ngaphezu kwemisebenzi yedijithali. Ezinye izici ezivamile ze-analog izinga lokubulala elihlelekayo kanye namandla okushayela kuphinikhodi ngayinye yokukhiphayo, okuvumela unjiniyela ukuthi asethe amanani ahamba kancane kumaphini alayishwe kancane abengase akhale noma amangale ngendlela engamukeleki, futhi asethe amanani aqinile, asheshayo kumaphini alayishwe kakhulu ngesivinini esikhulu. iziteshi ebezizohamba kancane kakhulu. Esinye isici esivamile se-analog iziqhathanisi ezihlukanisayo kumaphinikhodi okufaka aklanyelwe ukuxhunywa eziteshini zokubonisa umehluko. Amanye ama-FPGA wesignali axubile ahlanganise iziguquli ze-analog-to-digital (ADCs) kanye neziguquli zedijithali-kuya-analogi (ama-DAC) anamabhulokhi wokulungisa isignali ye-analogi ezivumela ukuthi zisebenze njengesistimu-on-a-chip. Kafushane, izinzuzo eziphezulu ezi-5 zama-FPGA chips yilezi: 1. Ukusebenza Okuhle 2. Isikhathi Esifushane Sokuya Emakethe 3. Izindleko Eziphansi 4. Ukwethembeka okuphezulu 5. Amandla Okugcina Isikhathi Eside Ukusebenza Okuhle - Ngamandla awo okwamukela ukucubungula okufanayo, ama-FPGA anamandla ekhompuyutha angcono kunama-Digital signal processors (DSPs) futhi awadingi ukubulawa okulandelanayo njengama-DSP futhi angafeza okwengeziwe ngomjikelezo wewashi ngalinye. Ukulawula okokufaka nokuphumayo (I/O) kuleveli yezingxenyekazi zekhompuyutha kunikeza izikhathi zokuphendula ezisheshayo kanye nokusebenza okukhethekile ukuze kufane eduze nezidingo zohlelo lokusebenza. Isikhathi esifushane sokumaketha - ama-FPGA anikeza ukuguquguquka kanye nekhono lokukhiqiza ngokushesha futhi ngaleyo ndlela abe nesikhathi esifushane sokuya emakethe. Amakhasimende ethu angahlola umbono noma umqondo futhi awuqinisekise ku-hardware ngaphandle kokudlula kunqubo ende nebizayo yokwenziwa yomklamo wangokwezifiso we-ASIC. Singasebenzisa izinguquko ezikhulayo futhi siphindaphinde kumklamo we-FPGA phakathi namahora esikhundleni samaviki. Izingxenyekazi zekhompuyutha ezingaphandle kweshalofu zezentengiselwano nazo ziyatholakala ngezinhlobo ezahlukene ze-I/O esezivele zixhunywe ku-chip ye-FPGA ehlelwa umsebenzisi. Ukutholakala okukhulayo kwamathuluzi esoftware yezinga eliphezulu kunikeza ama-IP cores abalulekile (imisebenzi eyakhiwe kusengaphambili) yokulawula okuthuthukile nokucubungula isignali. Izindleko Eziphansi—Izindleko zobunjiniyela ezingabuyeli (NRE) zemiklamo ye-ASIC yangokwezifiso zidlula ezezixazululo zehadiwe ezisekelwe ku-FPGA. Ukutshalwa kwezimali okukhulu kokuqala kuma-ASIC kungathethelelwa ukuthi ama-OEM akhiqize ama-chips amaningi ngonyaka, kodwa abasebenzisi abaningi bokugcina badinga ukusebenza kwehadiwe yangokwezifiso kumasistimu amaningi asathuthuka. I-silicon FPGA yethu ehlelekayo ikunikeza okuthile ngaphandle kwezindleko zokwenziwa noma izikhathi zokuhola ezinde zokuhlanganisa. Izidingo zesistimu zivame ukushintsha ngokuhamba kwesikhathi, futhi izindleko zokwenza izinguquko ezikhulayo kumiklamo ye-FPGA azinakwa uma ziqhathaniswa nezindleko ezinkulu zokuphinda usebenzise i-ASIC. Ukuthembeka Okuphezulu - Amathuluzi esofthiwe ahlinzeka ngendawo yokuhlela futhi ukujikeleza kwe-FPGA kuwukuqaliswa kweqiniso kokwenziwa kohlelo. Amasistimu asekelwe kumaphrosesa ngokuvamile abandakanya izendlalelo eziningi zokungafinyeleli ukusiza ukuhlela umsebenzi nokwabelana ngezinsiza phakathi kwezinqubo eziningi. Isendlalelo somshayeli silawula izinsiza zehadiwe futhi i-OS ilawula inkumbulo kanye nomkhawulokudonsa wephrosesa. Kunoma yimuphi umgogodla wephrosesa onikeziwe, umyalelo owodwa kuphela ongawusebenzisa ngesikhathi, futhi amasistimu asuselwa kuphrosesa ahlala esengozini yemisebenzi ebaluleke kakhulu yesikhathi elandelanayo. Ama-FPGA, awasebenzisi ama-OS, abeka ukukhathazeka kokuthembeka okuncane ngokusebenza kwawo kwangempela okuhambisanayo kanye nezingxenyekazi zekhompuyutha ezinqumayo ezinikezelwe kuwo wonke umsebenzi. Amandla Okugcina Isikhathi Eside - Ama-chips e-FPGA ayathuthukiswa futhi awadingi isikhathi nezindleko ezihilelekile ekuklameni kabusha i-ASIC. Izimiso zokuxhumana zedijithali, isibonelo, zinezincazelo ezingashintsha ngokuhamba kwesikhathi, futhi ukuxhumana okusekelwe ku-ASIC kungase kubangele izinselele zokulondoloza nokuhambisana phambili. Ngokuphambene, ama-FPGA chips angalungiseka kabusha angahambisana nezinguquko ezingase zidingekile zesikhathi esizayo. Njengoba imikhiqizo nezinhlelo zivuthwa, amakhasimende ethu angenza izithuthukisi zokusebenza ngaphandle kokuchitha isikhathi edizayina kabusha izingxenyekazi zekhompuyutha futhi elungisa izakhiwo zebhodi. Izinsizakalo Zokutholwa Kwe-Microelectronics: Izinsizakalo zethu zokusungula i-microelectronics zifaka ukuklama, ukwenza i-prototyping kanye nokukhiqiza, izinsizakalo zezinkampani zangaphandle. Sihlinzeka amakhasimende ethu ngosizo kuwo wonke umjikelezo wokuthuthukiswa komkhiqizo - kusukela ekusekelweni kwedizayini kuye ekwenzeni i-prototyping kanye nokwesekwa kokukhiqiza kwama-semiconductor chips. Inhloso yethu ezinsizeni zosekelo zedizayini ukunika amandla indlela elungile yokuqala ngqa yedizayini yedijithali, ye-analog, kanye nengxubevange yesiginali yamadivayisi we-semiconductor. Isibonelo, amathuluzi okulingisa athile we-MEMS ayatholakala. Izindwangu ezikwazi ukuphatha amawafa angu-6 namayintshi angu-8 we-CMOS ehlanganisiwe ne-MEMS asenkonzweni yakho. Sinikeza amakhasimende ethu ukwesekwa kwedizayini yazo zonke izinkundla ezinkulu ze-electronic design automation (EDA), sihlinzeka ngamamodeli alungile, amakhithi okuklama amaprosesa (i-PDK), imitapo yolwazi ye-analog neyedijithali, nokusekelwa kwedizayini yokukhiqiza (DFM). Sinikeza izinketho ezimbili ze-prototyping zabo bonke ubuchwepheshe: isevisi ye-Multi Product Wafer (MPW), lapho amadivaysi amaningana acutshungulwa ngokuhambisana ku-wafer eyodwa, kanye nesevisi ye-Multi Level Mask (MLM) enamaleveli amamaski amane adwetshwe ku-reticle efanayo. Lezi zonga kakhulu kunesethi yemaski egcwele. Isevisi ye-MLM iguquguquka kakhulu uma iqhathaniswa nezinsuku ezimisiwe zesevisi ye-MPW. Izinkampani zingase zikhethe ukukhipha imikhiqizo ye-semiconductor endaweni yokutholwa kwama-microelectronics ngenxa yezizathu eziningi ezihlanganisa isidingo somthombo wesibili, zisebenzisa izinsiza zangaphakathi zeminye imikhiqizo namasevisi, ukuzimisela ukuhamba ngendlela engelona iqiniso futhi yehlise ubungozi kanye nomthwalo wokusebenzisa indwangu ye-semiconductor...njll. I-AGS-TECH inikeza izinqubo zokwenziwa kwe-open-platform microelectronics ezingancishiswa kuma-wafer run amancane kanye nokukhiqizwa ngobuningi. Ngaphansi kwezimo ezithile, amathuluzi akho akhona e-microelectronics noma okwenziwa kwe-MEMS noma amasethi amathuluzi aphelele angadluliselwa njengamathuluzi athunyelwe noma athengiswe amathuluzi asuka kundwangu yakho aye kusayithi lethu lendwangu, noma imikhiqizo yakho ekhona ye-microelectronics kanye ne-MEMS ingaklanywa kabusha kusetshenziswa ubuchwepheshe benkundla evulekile futhi ithunyelwe ku- inqubo etholakala ku-fab yethu. Lokhu kuyashesha futhi konga kakhulu kunokudlulisa ubuchwepheshe bangokwezifiso. Uma uthanda kodwa izinqubo zokwenziwa zekhasimende ezikhona ze-microelectronics / MEMS zingadluliswa. Ukulungiselela I-Semiconductor Wafer: Uma efunwa amakhasimende ngemva kokuba ama-wafer enziwe ngendwangu encane, senza ukudayela, ukubuyisela emuva, ukuphungula, ukubeka i-reticle, ukuhlela amafa, ukukhetha nokubeka, imisebenzi yokuhlola ku-semiconductor. Ukucutshungulwa kwe-wafer ye-semiconductor kubandakanya i-metrology phakathi kwezinyathelo zokucubungula ezahlukahlukene. Isibonelo, izindlela zokuhlola ifilimu emincane esekelwe ku-ellipsometry noma i-reflectometry, zisetshenziselwa ukulawula ngokuqinile ukushuba kwesango le-oxide, kanye nogqinsi, inkomba ye-refractive kanye ne-coefficient yokuqothula ye-photoresist nezinye izigqoko. Sisebenzisa okokusebenza kokuhlola kwe-wafer ye-semiconductor ukuze siqinisekise ukuthi ama-wafer awalimalanga izinyathelo zangaphambilini zokucubungula kuze kufike ekuhlolweni. Uma izinqubo zangaphambili seziqediwe, amadivaysi e-semiconductor microelectronic angaphansi kokuhlolwa okuhlukahlukene kagesi ukuze kutholwe ukuthi asebenza kahle yini. Sibhekisela engxenyeni yamadivayisi e-microelectronics ku-wafer etholwe isebenza kahle ngokuthi "isivuno". Ukuhlolwa kwama-microelectronics chips ku-wafer kwenziwa ngesihloli se-electronic esicindezela ama-probe amancane ngokumelene ne-semiconductor chip. Umshini ozishintshayo umaka i-microelectronics chip ngayinye embi ngethonsi likadayi. Idatha yokuhlola i-wafer ifakwe kusizindalwazi sekhompuyutha emaphakathi futhi ama-semiconductor chips ahlelwa abe imigqomo ebonakalayo ngokuya ngemikhawulo yokuhlola enqunywe kusengaphambili. Idatha ewumphumela yokubopha ingafakwa kugrafu, noma ifakwe kumephu ye-wafer ukuze kulandelelwe amaphutha okukhiqiza nokumaka ama-chips amabi. Le mephu ingasetshenziswa futhi ngesikhathi sokuhlanganiswa kwe-wafer kanye nokupakishwa. Ekuhlolweni kokugcina, ama-microelectronic chips ayahlolwa futhi ngemva kokupakishwa, ngenxa yokuthi izintambo zebhondi kungenzeka zishoda, noma ukusebenza kwe-analog kungase kushintshwe iphakheji. Ngemuva kokuthi iwafa ye-semiconductor isihloliwe, ivamise ukuncishiswa ngogqinsi ngaphambi kokuthi iwafa ifakwe amaphuzu bese igqekezwa ishone ngayinye. Le nqubo ibizwa ngokuthi i-semiconductor wafer dicing. Sisebenzisa imishini yokukhetha nendawo ezenzakalelayo ekhiqizwe ngokukhethekile imboni ye-microelectronics ukuze silungise ukufa kwe-semiconductor okuhle nokubi. Ama-chips we-semiconductor amahle kuphela, ahlanganisiwe. Okulandelayo, kupulasitiki ye-microelectronics noma inqubo yokupakisha ye-ceramic sikhweza i-semiconductor die, sixhume amaphedi okufa kumaphini ephaketheni, bese sivala idayizi. Izintambo zegolide ezincane zisetshenziselwa ukuxhuma amaphedi nezikhonkwane kusetshenziswa imishini ezenzakalelayo. I-Chip scale package (CSP) ingobunye ubuchwepheshe bokupakisha be-microelectronics. Iphakethe lepulasitiki elikabili emgqeni (i-DIP), njengamaphakheji amaningi, likhulu ngokuphindwe kaningi kunefa le-semiconductor langempela elifakwe ngaphakathi, kanti ama-CSP chips acishe alingane nama-microelectronics afayo; futhi i-CSP ingakhiwa endaweni ngayinye ngaphambi kokuthi iwafa ye-semiconductor idayiwe. Ama-microelectronic chips apakishiwe aphinde ahlolwe ukuze kuqinisekiswe ukuthi awonakele ngesikhathi sokupakishwa nokuthi inqubo yokuxhumanisa i-die-to-pin iqedwe ngendlela efanele. Sisebenzisa ama-lasers siqopha amagama nezinombolo ze-chip ephaketheni. I-Microelectronic Package Design and Fabrication: Sinikeza kokubili i-off-shelf kanye nomklamo wangokwezifiso kanye nokwakhiwa kwamaphakheji we-microelectronic. Njengengxenye yale sevisi, ukumodela kanye nokulingiswa kwamaphakheji we-microelectronic nakho kwenziwa. Ukumodela nokulingisa kuqinisekisa i-virtual Design of Experiments (DoE) ukuze kuzuzwe isisombululo esifanele, kunokuhlola amaphakheji enkundleni. Lokhu kunciphisa izindleko nesikhathi sokukhiqiza, ikakhulukazi ukuthuthukiswa komkhiqizo omusha kuma-microelectronics. Lo msebenzi futhi usinika ithuba lokuchaza amakhasimende ethu ukuthi ukuhlanganisa, ukwethembeka nokuhlola kuzoba nomthelela kanjani emikhiqizweni yawo ye-microelectronic. Inhloso eyinhloko yokupakishwa kwe-microelectronic iwukuklama isistimu ye-elekthronikhi ezokwanelisa izimfuneko zohlelo oluthile ngezindleko ezifanele. Ngenxa yezinketho eziningi ezitholakalayo zokuxhuma nokufaka isistimu ye-microelectronics, ukukhetha kobuchwepheshe bokupakisha kuhlelo olunikeziwe kudinga ukuhlolwa kochwepheshe. Imibandela yokukhetha yamaphakeji e-microelectronics ingase ihlanganise okunye kokushayela kobuchwepheshe okulandelayo: -Ukusebenziseka kalula -Veza -Izindleko -Izakhiwo zokukhipha ukushisa -Ukusebenza kwe-electromagnetic shielding -Ukuqina komshini -Ukwethembeka Lokhu kucatshangelwa kwedizayini yamaphakheji we-microelectronics kuthinta isivinini, ukusebenza, amazinga okushisa okuhlangana, ivolumu, isisindo nokunye. Umgomo oyinhloko ukukhetha ubuchwepheshe bokuxhumanisa obungabizi kakhulu kodwa obuthembekile. Sisebenzisa izindlela zokuhlaziya eziyinkimbinkimbi nesofthiwe ukuze sidizayine amaphakheji e-microelectronics. Ukupakishwa kwe-Microelectronics kuphathelene nokuklanywa kwezindlela zokwenziwa kwamasistimu amancane kagesi axhumene kanye nokuthembeka kwalawo masistimu. Ngokukhethekile, ukupakishwa kwama-microelectronics kuhlanganisa umzila wamasignali ngenkathi kugcinwa ubuqotho besignali, ukusabalalisa umhlabathi namandla kumasekethe ahlanganisiwe we-semiconductor, ukusabalalisa ukushisa okuhlakaziwe ngenkathi kugcinwa ubuqotho besakhiwo kanye nempahla, nokuvikela isifunda ezingozini zemvelo. Ngokuvamile, izindlela zokupakisha ama-microelectronics IC zifaka ukusetshenziswa kwe-PWB enezixhumi ezihlinzeka ngama-I/O omhlaba wangempela kusekethe kagesi. Izindlela zokupakisha zendabuko ze-microelectronics zibandakanya ukusetshenziswa kwephakheji elilodwa. Inzuzo eyinhloko yephakheji ye-chip eyodwa yikhono lokuhlola ngokugcwele i-microelectronics IC ngaphambi kokuyixhuma ku-substrate engaphansi. Amadivayisi anjalo apakishiwe e-semiconductor afakwe ngembobo noma abekwe phezulu ku-PWB. Amaphakheji e-microelectronics afakwe phezulu awadingi ukuthi adlule ngezimbobo ebhodini lonke. Esikhundleni salokho, izingxenye zama-microelectronics abekwe phezulu zingadayiswa kuzo zombili izinhlangothi ze-PWB, okuvumela ukuminyana kwesekethe okuphezulu. Le ndlela ibizwa ngokuthi i-surface-mount technology (SMT). Ukwengezwa kwamaphakheji esitayela sendawo efana ne-ball-grid arrays (BGAs) kanye namaphakheji esikali se-chip (CSPs) kwenza i-SMT iqhudelane nobuchwepheshe bokupakisha be-semiconductor microelectronics obuphezulu kakhulu. Ubuchwepheshe obusha bokupakisha bubandakanya ukunamathiselwa kwedivayisi ye-semiconductor engaphezu kweyodwa ku-substrate exhumanisayo ephezulu, ebese ifakwa kuphakheji enkulu, ehlinzeka kokubili izikhonkwane ze-I/O nokuvikelwa kwemvelo. Lobu buchwepheshe bemojula ye-multichip (MCM) bubonakala futhi ngobuchwepheshe be-substrate obusetshenziswa ukuxhuma ama-IC anamathiselwe. I-MCM-D imele ifilimu elincanyana elifakwe insimbi kanye nama-dielectric multilayers. Ama-substrates e-MCM-D anokuminyana kwezintambo okuphezulu kakhulu kwabo bonke ubuchwepheshe be-MCM ngenxa yobuchwepheshe obuyindida bokucubungula i-semiconductor. I-MCM-C ibhekisela kuma-substrates "oceramic" anezendlalelo eziningi, axoshwe ezendlaleloni ezishintshanayo zoyinki wensimbi abahloliwe kanye namashidi e-ceramic angashiswanga. Ngokusebenzisa i-MCM-C sithola umthamo wezintambo eziminyene ngokumaphakathi. I-MCM-L ibhekisela kuma-substrates ezendlalelo eziningi enziwe “ngamalayini” e-PWB estakiwe, enziwe ngensimbi, anephethini ngayinye bese enziwe laminated. Bekukade kuwubuchwepheshe bokuxhumanisa obunokuminyana okuphansi, nokho manje i-MCM-L isondela ngokushesha ekuminyaneni kobuchwepheshe bokupakisha be-MCM-C kanye ne-MCM-D microelectronics. I-Direct chip attach (DCA) noma ubuchwepheshe bokupakisha be-chip-on-board (COB) microelectronics buhlanganisa ukukhweza ama-microelectronics ICs ngqo ku-PWB. I-encapsulant yepulasitiki, "egubungele" phezu kwe-IC engenalutho bese yelapheka, inikeza ukuvikelwa kwemvelo. I-Microelectronics ICs ingaxhunywa ku-substrate kusetshenziswa i-flip-chip, noma izindlela zokubopha izintambo. Ubuchwepheshe be-DCA bonga kakhulu kumasistimu akhawulelwe kuma-IC we-semiconductor angu-10 noma ngaphansi, njengoba izinombolo ezinkulu zama-chips zingathinta ukukhiqizwa kwesistimu futhi ukuhlanganisa kwe-DCA kungase kube nzima ukuphinda kusebenze. Inzuzo evamile kuzo zombili izinketho zokupakisha ze-DCA ne-MCM ukuqedwa kwezinga lokuxhuma lephakeji ye-IC semiconductor, okuvumela ukusondelana (ukubambezeleka kokudlulisa isignali okufushane) kanye nokuncishiswa kokungena komthofu. Ububi obuyinhloko ngazo zombili izindlela ubunzima bokuthenga ama-IC ahlolwe ngokugcwele ama-microelectronics. Okunye okubi kobuchwepheshe be-DCA kanye ne-MCM-L kufaka phakathi ukuphathwa okushisayo kokushisa okuphansi ngenxa yokungabi khona kokusebenza okushisayo kwama-laminates e-PWB kanye ne-coefficient empofu yomdlalo wokunwebeka oshisayo phakathi kwe-semiconductor die kanye ne-substrate. Ukuxazulula inkinga yokungezwani kokwanda okushisayo kudinga i-interposer substrate efana ne-molybdenum ye-wire bonded die kanye ne-epoxy engagcwali ye-flip-chip die. I-multichip carrier module (MCCM) ihlanganisa zonke izici ezinhle ze-DCA nobuchwepheshe be-MCM. I-MCCM imane iyi-MCM encane esiphathini sensimbi esincanyana esingaboshelwa noma sinamathiselwe ngomshini ku-PWB. Iphansi lensimbi lisebenza njengento ekhipha ukushisa kanye ne-interposer yengcindezi ye-MCM substrate. I-MCCM inomkhondo ojikelezayo wokubopha intambo, ukusoda, noma ukubopha ithebhu ku-PWB. Ama-IC we-semiconductor avikelekile avikelwe kusetshenziswa i-glob-top material. Uma usithinta, sizoxoxa ngesicelo sakho kanye nezidingo zokukukhethela inketho yokupakisha ye-microelectronics engcono kakhulu. I-Semiconductor IC Assembly & Packaging & Test: Njengengxenye yezinsizakalo zethu zokwenziwa kwe-microelectronics sinikeza i-die, intambo ne-chip bonding, i-encapsulation, ukuhlanganisa, ukumaka nokufaka uphawu, ukuhlola. Ukuze i-chip ye-semiconductor noma isekethe ye-microelectronics ehlanganisiwe isebenze, idinga ukuxhunywa kusistimu ezoyilawula noma inikeze imiyalelo kuyo. I-Microelectronics IC assembly ihlinzeka ngoxhumano lwamandla nolwazi lokudlulisa phakathi kwe-chip nohlelo. Lokhu kufezwa ngokuxhuma i-chip ye-microelectronics kuphakheji noma ukuyixhuma ngokuqondile ku-PCB yale misebenzi. Ukuxhumana phakathi kwe-chip nephakheji noma ibhodi lesekethe eliphrintiwe (PCB) kwenziwa nge-wire bonding, i-thru-hole noma i-flip chip assembly. Singumholi wemboni ekutholeni izixazululo zokupakisha ze-microelectronics IC ukuze sihlangabezane nezidingo eziyinkimbinkimbi zezimakethe ezingenantambo neze-inthanethi. Sinikeza izinkulungwane zamafomethi wephakheji nosayizi abahlukene, kusukela kumaphakheji we-IC we-leadframe microelectronics ye-thru-hole ne-surface mount, kuya ku-chip scale yakamuva (CSP) kanye nezixazululo ze-ball grid array (BGA) ezidingekayo ekubalweni kwamaphinikhodi aphezulu kanye nezinhlelo zokusebenza zokuminyana okuphezulu. . Amaphakheji anhlobonhlobo ayatholakala esitokweni ahlanganisa i-CABGA (Chip Array BGA), CQFP, CTBGA (Chip Array Thin Core BGA), CVBGA (Very Thin Chip Array BGA), Flip Chip, LCC, LGA, MQFP, PBGA, PDIP, I-PLCC, i-PoP - Iphakheji Kuphakheji, i-PoP TMV - Ngesikhunta Via, SOIC / SOJ, SSOP, TQFP, TSOP, WLP (Iphakheji Yezinga Le-Wafer)…..etc. Ukubopha ngocingo kusetshenziswa ithusi, isiliva noma igolide kuphakathi kwezinto ezidumile kuma-microelectronics. Intambo yethusi (Cu) ibiyindlela yokuxhuma i-silicon semiconductor ifa kumatheminali ephakheji ye-microelectronics. Ngokukhuphuka kwakamuva kwezindleko zezintambo zegolide (Au), intambo yethusi (Cu) iyindlela ekhangayo yokuphatha izindleko zephakheji ku-microelectronics. Iphinde ifane nocingo lwegolide (Au) ngenxa yezakhiwo zayo zikagesi ezifanayo. I-self-inductance ne-self capacitance icishe ifane ngentambo yegolide (Au) neyethusi (Cu) enentambo yethusi (Cu) enokumelana okuphansi. Kuzinhlelo zokusebenza ze-microelectronics lapho ukumelana ngenxa yentambo yebhondi kungase kube nomthelela omubi ekusebenzeni kwesekethe, kusetshenziswa intambo yethusi (Cu) inganikeza ukuthuthuka. Izintambo zengxubevange yethusi, iPalladium Coated Copper (PCC) kanye neSilver (Ag) sezivele njengezinye izindlela kunezintambo zegolide zamabhondi ngenxa yezindleko. Izintambo ezenziwe ngethusi azibizi futhi zine-resistivity kagesi ephansi. Kodwa-ke, ukuqina kwethusi kwenza kube nzima ukusebenzisa izinhlelo eziningi ezifana nalezo ezinezakhiwo ezibuthakathaka zebhondi. Kulezi zinhlelo zokusebenza, i-Ag-Alloy inikezela ngezakhiwo ezifanayo nalezo zegolide kuyilapho izindleko zayo zifana nalezo ze-PCC. Intambo ye-Ag-Alloy ithambile kune-PCC okuholela emazingeni aphansi e-Al-Splash kanye nengozi ephansi yokulimala kwephedi yebhondi. I-Ag-Alloy wire iwukushintsha okungcono kakhulu kwezindleko eziphansi zezinhlelo zokusebenza ezidinga i-die-to-die bonding, i-waterfall bonding, i-ultra-fine bond pad pitch kanye nokuvuleka kwephedi yebhondi encane, ukuphakama kwelophu ephansi kakhulu. Sihlinzeka ngohlu oluphelele lwezinsizakalo zokuhlola i-semiconductor okuhlanganisa ukuhlolwa kwe-wafer, izinhlobo ezahlukene zokuhlola kokugcina, ukuhlolwa kwezinga lesistimu, ukuhlolwa kwemichilo kanye nezinsizakalo eziphelele zokuphela komugqa. Sihlola izinhlobo ezahlukene zedivayisi ye-semiconductor kuyo yonke imindeni yethu yamaphakeji okuhlanganisa imvamisa yomsakazo, i-analog nesiginali exubile, idijithali, ukuphathwa kwamandla, inkumbulo nezinhlanganisela ezihlukahlukene ezifana ne-ASIC, amamojula e-multi chip, i-System-in-Package (SiP), kanye ukupakishwa kwe-3D estakiwe, izinzwa namadivayisi we-MEMS afana nama-accelerometer nezinzwa zokucindezela. I-Hardware yethu yokuhlola kanye nemishini yokuxhumana ifanele usayizi wephakheji wangokwezifiso i-SiP, izixazululo zokuxhumana ezikabili zePhakheji kuPhakheji (i-PoP), i-TMV PoP, amasokhethi e-FusionQuad, i-MicroLeadFrame enemigqa eminingi, I-Fine-Pitch Copper Pillar. Imishini yokuhlola nezitezi zokuhlola kuhlanganiswe namathuluzi e-CIM/CAM, ukuhlaziya isivuno nokuqapha ukusebenza ukuze kulethe isivuno esihle kakhulu okokuqala ngqa. Sinikezela ngezinqubo eziningi zokuhlola i-microelectronics kumakhasimende ethu futhi sinikezela ngokugeleza kokuhlola okusabalalisiwe kwe-SiP nokunye ukugeleza komhlangano oyinkimbinkimbi. I-AGS-TECH ihlinzeka ngobubanzi obugcwele bokubonisana, ukuthuthukiswa kanye nezinsizakalo zobunjiniyela kuwo wonke umjikelezo wakho wokuphila womkhiqizo we-semiconductor kanye ne-microelectronics. Siyaziqonda izimakethe ezihlukile kanye nezidingo zokuhlola ze-SiP, izimoto, inethiwekhi, amageyimu, ihluzo, ikhompuyutha, i-RF / wireless. Izinqubo zokukhiqiza ama-semiconductor zidinga izixazululo zokumaka ezisheshayo nezilawulwa ngokunembile. Izivinini zokumaka ezingaphezu kwezinhlamvu eziyi-1000/ngesekhondi kanye nokujula kokungena kokubalulekile okungaphansi kwama-microns angu-25 kuvamile embonini ye-semiconductor microelectronics kusetshenziswa ama-laser athuthukile. Siyakwazi ukumaka izinhlanganisela zesikhunta, amawafa, izitsha zobumba nokunye okuningi ngokufakwa kokushisa okuncane nokuphindaphinda kahle. Sisebenzisa ama-laser ngokunemba okuphezulu ukumaka ngisho nezingxenye ezincane ngaphandle kokulimala. Amafreyimu aholayo Amadivayisi e-Semiconductor: Kokubili i-off-shelf kanye nedizayini yangokwezifiso nokwenziwa kuyenzeka. Amafreyimu omthofu asetshenziswa ezinqubweni zokuhlanganisa idivayisi ye-semiconductor, futhi empeleni ayizendlalelo ezincane zensimbi ezixhuma izintambo ezisuka kumatheminali amancane kagesi endaweni ye-semiconductor microelectronics kuya kumjikelezo omkhulu kumadivayisi kagesi nama-PCB. Amafreyimu omthofu asetshenziswa cishe kuwo wonke amaphakheji we-semiconductor microelectronics. Amaphakheji amaningi e-IC ye-microelectronics enziwa ngokubeka i-silicon chip ye-semiconductor ohlakeni oluholayo, bese kuba intambo ebopha i-chip emithonjeni yensimbi yalolo hlaka lomthofu, bese imboza chip ye-microelectronics ngekhava yepulasitiki. Le phakheji elula futhi ephansi kakhulu ye-microelectronics iseyisixazululo esingcono kakhulu sezinhlelo zokusebenza eziningi. Amafreyimu omthofu akhiqizwa ngamapheshana amade, okuwavumela ukuthi acutshungulwe ngokushesha emishinini yokuhlanganisa ezenzakalelayo, futhi ngokuvamile kusetshenziswa izinqubo ezimbili zokukhiqiza: ukufakwa kwezithombe kohlobo oluthile nokugxiviza. Ku-microelectronics idizayini yohlaka oluholayo ngokuvamile idinga ukucaciswa nezici ezingokwezifiso, imiklamo ethuthukisa izakhiwo zikagesi nezishisayo, kanye nezidingo zesikhathi somjikelezo othile. Sinolwazi olujulile lokwenziwa kohlaka oluholayo lwe-microelectronics lwamakhasimende amaningi ahlukene asebenzisa ukushumeka izithombe nokugxivizwa nge-laser. Idizayini nokwenziwa kwamasinki okushisa ama-microelectronics: Kokubili ngaphandle kweshalofu kanye nokwakheka ngokwezifiso nokwenza. Ngokukhula kokukhishwa kokushisa okuvela kumadivayisi e-microelectronics kanye nokuncipha kwezici zefomu jikelele, ukuphathwa kwe-thermal kuba into ebaluleke kakhulu yokwakhiwa komkhiqizo we-elekthronikhi. Ukungaguquguquki ekusebenzeni kanye neminyaka yokuphila kwemishini kagesi kuhlobene ngokuphambene nezinga lokushisa lengxenye yezinto zokusebenza. Ubudlelwano phakathi kokuthembeka nezinga lokushisa lokusebenza kwedivayisi evamile ye-silicon semiconductor libonisa ukuthi ukuncipha kwezinga lokushisa kuhambisana nokwenyuka komchazi kokuthembeka neminyaka yokuphila kwedivayisi. Ngakho-ke, impilo ende nokusebenza okuthembekile kwengxenye ye-semiconductor microelectronics kungase kuzuzwe ngokulawula ngempumelelo izinga lokushisa ledivayisi ngaphakathi kwemikhawulo ebekwe abaklami. Osinki bokushisa bangamadivayisi athuthukisa ukunqanyulwa kokushisa endaweni eshisayo, ngokuvamile ikesi yangaphandle yengxenye ekhiqiza ukushisa, ukuya endaweni epholile efana nomoya. Ezingxoxweni ezilandelayo, umoya uthathwa njengoketshezi olupholisayo. Ezimweni eziningi, ukudluliswa kokushisa kuyo yonke indawo phakathi kwendawo eqinile nomoya opholile kungasebenzi kahle kakhulu ngaphakathi kwesistimu, futhi isixhumi esibonakalayo somoya oqinile simelela umgoqo omkhulu kakhulu wokukhipha ukushisa. Isitha sokushisa sehlisa lesi sivimbelo ngokuyinhloko ngokukhulisa indawo engaphezulu ethintana ngqo nesipholile. Lokhu kuvumela ukushisa okwengeziwe ukuthi kuhlakazwe futhi/noma kwehlise izinga lokushisa lokusebenza kwedivayisi ye-semiconductor. Injongo eyinhloko yosinki wokushisa iwukugcina izinga lokushisa ledivayisi ye-microelectronics lingaphansi kwezinga eliphezulu lokushisa elivumelekile elicaciswe umkhiqizi wedivayisi ye-semiconductor. Singakwazi ukuhlukanisa amasinki okushisa ngokwezindlela zokukhiqiza kanye nokuma kwawo. Izinhlobo ezivame kakhulu zamasinki okushisa apholile zifaka: - Izitembu: Izinsimbi ze-Copper noma i-aluminium zigxivizwa zibe yizimo ezifunwayo. zisetshenziswa ekupholiseni komoya kwendabuko kwezingxenye ze-elekthronikhi futhi zinikeza isixazululo esinomnotho ezinkingeni ezishisayo zokuminyana okuphansi. Zifanele ukukhiqizwa kwevolumu ephezulu. - I-Extrusion: Lawa masinki okushisa avumela ukwakheka komumo obanzi onezinhlangothi ezimbili okwazi ukuqeda imithwalo yokushisa emikhulu. Angase asikwe, enziwe ngomshini, futhi angezwe izinketho. I-cross-cutting izokhiqiza amasinki okushisa e-omnidirectional, amaphinikhodi angama-rectangular, futhi okuhlanganisa amaphiko amisekile kuthuthukisa ukusebenza cishe ngo-10 ukuya ku-20%, kodwa ngesilinganiso esinensayo sokukhipha. Imikhawulo ye-Extrusion, efana nogqinsi lwe-fin height-to-gap fin, ngokuvamile ilawula ukuguquguquka kwezinketho zedizayini. Isici esijwayelekile se-fin height-to-gap esifinyelela ku-6 kanye nobuncane be-fin ukujiya obungu-1.3mm, singafinyeleleka ngamasu ajwayelekile okukhipha. I-aspect ratio engu-10 kuye ku-1 kanye nogqinsi luka-0.8″ lungatholwa ngezici ezikhethekile zedizayini ye-die. Kodwa-ke, njengoba i-aspect ratio ikhula, ukubekezelelana kwe-extrusion kuba sengozini. - Izinqamuleli Ezihlanganisiwe/Ezakhiwe: Amasinki amaningi okushisa apholile anomkhawulo wokuguquguquka, futhi ukusebenza okushisayo kukonke kwesinki wokushisa opholile kungase kuthuthukiswe kakhulu uma indawo engaphezulu ingavezwa emoyeni. Lawa masinki okushisa asebenza kahle asebenzisa i-epoxy egcwele i-aluminium esebenza ngokufudumeza ukuhlanganisa amaphiko epulaneti epuleti lesisekelo se-extrusion eligobile. Le nqubo ivumela isilinganiso esikhulu kakhulu se-fin height-to-gap sika-20 kuya ku-40, okwandisa kakhulu umthamo wokupholisa ngaphandle kokwandisa isidingo sevolumu. - Ukusakaza: Isihlabathi, i-wax elahlekile kanye nezinqubo zokuphonsa ze-aluminium noma zethusi / zethusi ziyatholakala ngosizo lwe-vacuum noma ngaphandle. Sisebenzisa lobu buchwepheshe ekwenzeni amasinki okushisa amaphinikhodi aqinile ahlinzeka ngokusebenza okuphezulu uma kusetshenziswa ukupholisa kwe-impingement. - Izinhlamvu ezigoqiwe: Ishidi likathayela lensimbi elivela ku-aluminium noma ithusi linyusa indawo engaphezulu kanye nokusebenza kwevolumu. Usinki wokushisa ube usunamathiselwa ku-base plate noma ngokuqondile endaweni yokushisisa nge-epoxy noma i-brazing. Ayiwafanele amasinki okushisa ephrofayili ephezulu ngenxa yokutholakala nokusebenza kahle kwe-fin. Ngakho-ke, ivumela amasinki okushisa asebenza kahle ukuthi enziwe. Ekukhetheni isinki sokushisa esifanelekile esihlangabezana nemibandela yokushisa edingekayo yezinhlelo zakho zokusebenza ze-microelectronics, sidinga ukuhlola amapharamitha ahlukahlukene angathinti kuphela ukusebenza kweziko lokushisa ngokwalo, kodwa nokusebenza kwesistimu kukonke. Ukukhethwa kohlobo oluthile losinki wokushisa kuma-microelectronic kuncike kakhulu kusabelomali esishisayo esivunyelwe kusinki sokushisa nezimo zangaphandle ezizungeze usinki wokushisa. Alikho inani elilodwa lokumelana nokushisa elinikezwe kusinki okushisa esinikeziwe, njengoba ukumelana nokushisa kuyahlukahluka nezimo zokupholisa zangaphandle. I-Sensor & Actuator Design and Fabrication: Kokubili i-off-shelf kanye nomklamo wangokwezifiso nokwenziwa kuyatholakala. Sinikeza izixazululo ezinezinqubo ezilungele ukusetshenziswa zezinzwa ze-inertial, izinzwa zengcindezi nezihlobene kanye namadivayisi enzwa ye-IR. Ngokusebenzisa amabhlogo ethu e-IP ama-accelerometer, i-IR nezinzwa zokucindezela noma ukusebenzisa idizayini yakho ngokuvumelana nezicaciso ezitholakalayo nemithetho yokuklama, singalethwa izinzwa ezisekelwe ku-MEMS zilethwe kuwe phakathi namaviki. Ngaphandle kwe-MEMS, ezinye izinhlobo zenzwa kanye nezinhlaka ze-actuator zingakhiwa. Idizayini nokwakhiwa kwamasekhethi e-Optoelectronic & photonic: Isekethe ehlanganisiwe yesithombe noma i-optical (PIC) iyidivayisi ehlanganisa imisebenzi eminingi yezithombe. Ingase ifane namasekethe ahlanganisiwe we-elekthronikhi kuma-microelectronics. Umehluko omkhulu phakathi kwalokhu okubili ukuthi isifunda esihlanganisiwe se-photonic sinikeza ukusebenza kwamasignali olwazi abekwe kumaza wamaza okukhanya ku-spectrum ebonakalayo noma eduze kwe-infrared 850 nm-1650 nm. Amasu okwakha ayafana nalawo asetshenziswa kumasekhethi ahlanganisiwe e-microelectronics lapho i-photolithography isetshenziselwa ukwenza iphethini yamawafa okunamathisela kanye nokubeka izinto ezibonakalayo. Ngokungafani ne-semiconductor microelectronics lapho idivayisi eyinhloko kuyi-transistor, alikho idivayisi eyodwa elawulayo ku-optoelectronics. Ama-Photonic chips afaka phakathi ama-waveguide e-interconnect okulahlekelwa okuphansi, izihlukanisi zamandla, izikhulisa-zwi ezibonakalayo, ama-optical modulators, izihlungi, ama-lasers kanye nezitholi. Lawa madivaysi adinga izinhlobonhlobo zezinto ezihlukene kanye namasu okwenza izinto ngakho-ke kunzima ukuzibona zonke ku-chip eyodwa. Izicelo zethu zamasekethe ahlanganisiwe ezithombe ikakhulukazi zisezindaweni zokuxhumana nge-fiber-optic, biomedical kanye ne-photonic computing. Ezinye zezibonelo zemikhiqizo ye-optoelectronic esingakuklama futhi sikwakhele yona ama-LED (I-Light Emitting Diode), amalaser e-diode, izamukeli ze-optoelectronic, ama-photodiode, amamojula webanga le-laser, amamojula e-laser enziwe ngokwezifiso nokunye. CLICK Product Finder-Locator Service IKHASI ELIDLULE

We supply custom manufactured and off-shelf jigs, fixtures and workholding tools for industrial applications, manufacturing lines, production lines, test and inspection lines, machine shops, R&D labs.......etc. Jigs, Fixtures, Tools, Workholding Solutions, Mold Components Manufacturing We offer custom manufactured and off-shelf jigs, fixtures and toolings for your workshop, factory, plant lab or other facility. The types of jigs you can purchase from us are: - Template Jig - Plate Jig - Angle-Plate Jig - Channel Jig - Diameter Jig - Leaf Jig - Ring Jig - Box Jig The types of fixtures we can supply you are: - Turning Fixtures - Milling Fixtures - Broaching Fixtures - Grinding Fixtures - Boring Fixtures - Tapping Fixtures - Duplex Fixtures - Welding Fixtures - Assembly Fixtures - Drilling Fixtures - Indexing Fixtures Some categories of industrial machine tools we manufacture and ship include: - Press tools and dies, shears - Extrusion dies - Molds, molding and casting tools - Forming tools - Shaping tools - Drilling, cutting, broaching, hobbing tools - Grinding tools - Machining, milling, turning tools - Holding and clamping tools CLICK ON BLUE TEXT BELOW TO DOWNLOAD CATALOGS & BROCHURES: EDM Tooling - Workholding Catalog Includes EDM Tooling System and Elements, EROWA Link, 3R-Link, UniClamp, Square Clamp, RefTool Holder, PIN Holder System, Clamping Elements, Swivel Block and Vises, CentroClamp, EDM Spare Parts....etc. Hose Crimping Machines and Tools We private label these with your brand name and logo if you wish. Crimp development team can assist you with the design and development of tooling for all of your crimping requirements. Hose Endforming Machines and Tools We private label these with your brand name and logo if you wish. Tool development team can assist you with the design and development of tooling for all of your end-forming tool requirements. Plastic Mold Components Catalog Here you will find off-shelf components, products that you can order and use in manufacturing your molds. These products are ideal for mold makers. Example products you can find here are ejector pins, slide units, pressure plugs, guide pins, sprue bushings, slide holding devices, wear plates, ejector sleeves.....etc. Private Label Auto Glass Repair and Replacement Systems We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools for Every Industry We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Hand Tools - Hand Tool Cabinets We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Private Label Power Tools for Every Industry We can private label these hand tools if you wish. In other words, we can put your company name, brand and label on them. This way you can promote your brand by reselling these to your customers. Wire EDM Tooling - Workholding Catalog Includes Wire EDM Clamping Systems & Sets, Corner Sets, Ruler & Spanner, EDM Clamping Block, 3D Swivel Head, Vise Set, WEDM Vises and Magnetic Tables, Multiclamp, Wire EDM Pendulum Holder, V-Block, ICS Adapter, Beams, Beam IF, Z-Flex, Turn and Index Table, Collet Chuck Holder, EDM Link and Adapter, 3 Jaw Scroll Chuck ....etc. Workholding Tools Catalog - 1 Check this catalog for our 100% EROWA and 3R compatible workholding tools. We accept OEM work, you can send us a drawing for evaluation. Workholding Tools Catalog - 2 Check this catalog for our Workholding Devices, Die and Mold Clamps, Clamping Elements, Clamping Kits, Fixture Clamps, Toggle Clamps, Milling & MC Vices, Pneumatic & Hydraulic Clamps, Milling & Grinding Accessories, Wire Cut EDM Workholders...etc. We accept OEM work, you can send us a drawing for evaluation. You may also find our following page link useful: Industrial Machines and Equipment Manufacturing CLICK Product Finder-Locator Service PREVIOUS PAGE

AGS-TECH Inc. News and Announcements - Employment Opportunities - New Product Launch - Corporate News - News about Advancements in Manufacturing and Technology Izindaba nezimemezelo ezivela kwa-AGS-TECH Inc Novemba 5 - 2021: I-AGS-TECH, Inc. isiphenduke umthengisi onenani elingeziwe we-QualityLine production Technologies, Ltd., inkampani yobuchwepheshe obuphezulu esithuthukise i-an Isixazululo sesofthiwe esisekelwe ku-Artificial Intelligence esihlanganisa ngokuzenzakalelayo nedatha yakho yokukhiqiza emhlabeni wonke futhi sikwakhele izibalo zokuxilonga ezithuthukile. Leli thuluzi lihluke ngempela kunanoma yiliphi elinye emakethe, ngoba lingasetshenziswa ngokushesha futhi kalula, futhi lizosebenza nanoma yiluphi uhlobo lwemishini nedatha, idatha kunoma iyiphi ifomethi evela kuzinzwa zakho, imithombo yedatha yokukhiqiza egciniwe, iziteshi zokuhlola, ukungena ngesandla .....njll. Asikho isidingo sokushintsha noma yiziphi izisetshenziswa zakho ezikhona ukuze usebenzise leli thuluzi lesofthiwe. Ngaphandle kokuqapha kwesikhathi sangempela kwemingcele yokusebenza okubalulekile, le software ye-AI ikunikeza izibalo zembangela yezimpande, inikeza izexwayiso zangaphambi kwesikhathi nezexwayiso. Asikho isixazululo esinjengalesi emakethe. Leli thuluzi lisindise abakhiqizi imali eningi yokunciphisa ukwenqatshwa, ukubuyiselwa, ukusetshenzwa kabusha, isikhathi sokuphumula kanye nokuthola umusa wamakhasimende. Kulula futhi kuyashesha ! Ukuhlela Ucingo Lokuthola nathi futhi uthole okwengeziwe mayelana naleli thuluzi elinamandla lokuhlaziya elisekelwe kubuhlakani bobuciko: - Sicela ugcwalise okulandekayo Uhlu lwemibuzo lwe-QL kusukela kusixhumanisi esiluhlaza kwesokunxele bese ubuyela kithi nge-imeyili ku-sales@agstech.net . - Bheka izixhumanisi zezincwajana ezilandekayo ezinombala oluhlaza ukuze uthole umbono mayelana naleli thuluzi elinamandla.QualityLine One Page Isifinyezo futhi Ibhukwana le-QualityLine Summary - Nansi futhi ividiyo emfushane efika iphuzu: Ividiyo ye-QUALITYLINE MANUFACTURING AN ITHULUSI LE-ALYTICS Septhemba 18 - 2021: I-AGS-TECH, Inc. isiphenduke I-ATOP Industrial-Networking and Computing Distribution Partner. Manje usungakwazi uku-oda inethiwekhi yezimboni ye-ATOP futhi ushintshe imikhiqizo kithi. Sinikeza ibhizinisi lakho kokubili ngaphandle kweshalofu kanye nezixazululo ezenziwe ngokwezifiso. Sicela uhlole amakhasi ethu ewebhu futhi ulande izincwajana ezifanele ukuze zikusize ukhethe isixazululo esingcono kakhulu. Landa incwajana yethu yemikhiqizo ehlangene ye-ATOP TECHNOLOGIES (Landa umkhiqizo we-ATOP Technologies List 2021) Februwari 4 - 2020: Ngenxa yokuqubuka kwe-coronavirus, sithanda ukwazisa amakhasimende ethu ukuthi eminye imikhiqizo yethu eyenzeka eChina izoqala kabusha ngomhlaka-10 kuFebhuwari ngenxa yezinyathelo zokuphepha zikahulumeni nezindlela zokumisa ukusabalala. Siyaxolisa ngokubambezeleka okubangelwe yilo mcimbi ongemuhle. Julayi 19-2018: I-AGS-TECH, Inc. yethule iwebhusayithi yayo evuselelwe yomhlaba wonke yokuthengwa kwempahla. Abahlinzeki abangaba abahlinzeki bemikhiqizo namasevisi sicela uvakashele isayithi lethu lokuthenga nokuthenga http://www.agsoutsourcing.com Sikukhuthaza ukuthi ugcwalise ifomu lesicelo somphakeli eku-inthanethi ngokuchofoza lapha: https://www.agsoutsourcing.com/online-supplier-application-platfor Ukugcwalisa leli fomu kuzosenza sikwazi ukukuhlola njengomuntu ongase ube umphakeli. Lena indlela ekhethwa kakhulu yokuba umhlinzeki we-AGS-TECH, Inc., amagatsha ayo kanye nezinkampani ezisebenzisana nazo. Kungakhathaliseki ukuthi ungumkhiqizi wangokwezifiso wezingxenye zesikhangiso, isihlanganisi sobunjiniyela, umeluleki wobunjiniyela noma umhlinzeki wezinsizakalo, nanoma yini enye ongase ucabange ukuthi izozuzisa thina, leli yifomu okufanele uligcwalise. Januwari 31 - 2018: I-AGS-TECH Inc. yethule iwebhusayithi yayo entsha. Sithemba ukuthi amakhasimende ethu akhona kanye namakhasimende amasha azojabulela iwebhusayithi yethu entsha futhi avame ukusivakashela ku-inthanethi. Januwari 23 - 2017: Incwajana yethu entsha ye-Free Space Optical Components isiyatholakala ukuze ilandwe ngaphansi kwemenyu ye-Optical / Fiber Optic Products noma ngokuqondile kusuka kusixhumanisi esilandelayo - INCWADI YAMAHHALA YEZINXIKO ZOKUBONA Sithemba ukuthi uzokuthola kulula ukupheqa ibhukwana lethu lomkhiqizo omusha. Ephreli 27-2015: I-AGS-TECH Inc. njengamanje inezikhundla ezivulekile ezilandelayo ezitholakalayo. Ulwazi olwengeziwe mayelana nalezi zimbobo lungatholakala kuDkt. Zach Miller. Abafakizicelo abanentshisekelo, sicela uthumele intshisekelo yakho nge-imeyili kanye nokuqala kabusha ku-info@agstech.net (ebekwe njengesihloko esithi Amathuba Emisebenzi) - Umxhumanisi Wephrojekthi (Okungenani i-BS yezobunjiniyela, iFiziksi noma Isayensi Yezinto ezibonakalayo iyadingeka. Umuntu ofanelekayo kufanele abe nolwazi olujulile kanye nolwazi olujulile emshinini we-CNC, i-aluminium die casting, ukubumba insimbi, ukuhlanganisa kanye nezinqubo zokuhlanganisa ezifana nokushisela, i-soldering , ukubraziza, ukuqiniswa, ukulawula ikhwalithi, amasu okuhlola kanye nokulinganisa asetshenziswa kwezensimbi Okungenani iminyaka emi-5 yokuhlangenwe nakho kwasembonini e-US noma e-Canada kanye nokufunda kahle isiNgisi, isiShayina, isi-Mandarin kuyadingeka. Kumele ube yisakhamuzi sase-US noma sase-Canada. - Umxhumanisi Wephrojekthi (Okungenani i-BS kwezobunjiniyela, i-Physics noma Isayensi Yezinto ezibonakalayo. Umuntu ofanelekayo kufanele abe nolwazi olujulile nolwazi mayelana nezingxenye ze-fiber optic passive, i-DWDM, ama-beamsplitters, ama-optical fiber amplifiers, ukuhlanganisa izingxenye ze-fiber optic, ukulawula ikhwalithi, ukuhlolwa nezindlela zokulinganisa ezifana nokuqapha amandla, i-OTDR, amathuluzi okuhlanganisa, abahlaziyi be-spectrum abasetshenziswa ku-fiber optics Okungenani ulwazi lwezimboni lweminyaka emi-5 e-US noma e-Canada kanye nokufunda kahle isiNgisi, isiShayina, isi-Mandarin kuyadingeka. Kumele ube yisakhamuzi sase-US noma sase-Canada. Ephreli 24-2015: Iwebhusayithi ye-AGS-TECH Inc. iyabuyekezwa njengamanje. Sicela ubekezele uma kwenzeka amanye amakhasi engafinyeleleki noma abe nezinkinga. Siyaxolisa ngokuphazamiseka kwesikhashana lokhu okungase kubangele phakathi nokuvakasha kwakho. Mashi 2014: I-AGS-TECH Inc. njengamanje inezikhundla ezivulekile ezilandelayo ezitholakalayo. Ulwazi olwengeziwe mayelana nalezi zimbobo lungatholakala kuDkt. Zach Miller. Abafakizicelo abanentshisekelo, sicela uthumele intshisekelo yakho nge-imeyili kanye nokuqala kabusha ku-info@agstech.net (ebekwe njengesihloko esithi Amathuba Emisebenzi) - Umxhumanisi Wephrojekthi (Okungenani i-BS ku-Engineering, Physics noma Isayensi Yezinto ezibonakalayo iyadingeka. Umuntu ofanelekayo kufanele azi ngomshini, ukusakaza, ukuhlanganisa ngokunemba, ukulawula ikhwalithi, amasu okuhlola nokulinganisa asetshenziswa ku-metallurgy. Ukushelela kwesiNgisi, isiShayina, isiMandarin kanye / noma Isi-Vietnamese siyadingeka) - Umxhumanisi Wephrojekthi (Okungenani i-BS ku-Engineering, Physics noma Materials Science iyadingeka. Umuntu ofanelekayo kufanele azi ngokusebenza kwemishini, ukulingisa, ukuhlanganisa ngokunemba, ukulawulwa kwekhwalithi, amasu okuhlola nokulinganisa asetshenziswa ku-metallurgy. Kumelwe akhulume isiJalimane nesiNgisi kahle. Abafundi abamile futhi ukuhlala eJalimane kuyakhethwa) - Unjiniyela Omkhulu Wezinhlelo (Okungenani kudingeka i-BS kwezobunjiniyela, iFiziksi noma Isayensi Yezinto Ezibalulekile, okungenani iminyaka engu-5 yokuhlangenwe nakho kwasembonini ezinhlelweni zokuxhumana ze-fiber optic ezikhethwayo, ukukhuluma kahle isiNgisi, isiShayina, isiMandarin kuyadingeka) • Novemba 2013: I-AGS-TECH Inc. iyaqasha. Abafakizicelo abanentshisekelo, sicela uthumele intshisekelo yakho nge-imeyili kanye nokuqala kabusha ku-info@agstech.net Izikhundla ezivuliwe zikhona zokuthi: - Unjiniyela Womklamo Omkhulu (Amasistimu Okuxhumana Okungenantambo) - Unjiniyela Omkhulu Wezinhlelo (Amasistimu Okuxhumana Okungenantambo) - Izinto zokwakha noma unjiniyela wamakhemikhali (i-Nanofabrication) - Umxhumanisi Wephrojekthi (kumele akhulume isiShayina nesiNgisi kahle) - Umxhumanisi Wephrojekthi (kumele akhulume isiJalimane nesiNgisi kahle. Abafundi abamisiwe nabahlala eJalimane bayakhethwa) IKHASI ELIDLULE

System Components Pneumatics Hydraulics Vacuum, Booster Regulators, Sensors Gauges, Pneumatic Cylinder Controls, Silencers, Exhaust Cleaners, Feedthroughs Izingxenye Zesistimu ze-Pneumatics & Hydraulics kanye ne-Vacuum Siphinde sinikeze ezinye izingxenye zesistimu ye-pneumatic, hydraulic kanye ne-vacuum ezingashiwongo kwenye indawo lapha ngaphansi kwanoma yiliphi ikhasi lemenyu. Lezi izi: AMA-BOOSTER REGULATORS: Onga imali namandla ngokwandisa ukucindezela komugqa oyinhloko izikhathi eziningi kuyilapho futhi evikela amasistimu aphansi komfula ekuguquguqukeni kwengcindezi. Isilawuli se-pneumatic booster, uma sixhunywe kulayini wokuphakelwa komoya, siphindaphinda ingcindezi futhi ingcindezi enkulu yokuphakelwa komoya ingase isethwe ibe phansi. Ingcindezi efiselekayo iyanda kanye nezingcindezi zokuphuma zingalungiswa kalula. Izilawuli ze-pneumatic booster zikhulisa ukucindezela komugqa wendawo ngaphandle kokudinga amandla engeziwe izikhathi ezingu-2 kuya kwezi-4. Ukusetshenziswa kwama-booster okucindezelayo kunconywa ikakhulukazi uma ingcindezi ohlelweni idinga ukunyuswa ngokukhetha. Isistimu noma izingxenye zayo akudingekile ukuthi zinikezwe ingcindezi ephezulu kakhulu, ngoba lokhu kungaholela ezindlekweni zokusebenza eziphakeme kakhulu. Ama-pressure booster nawo angasetshenziselwa ama-mobile pneumatics. Ingcindezi yokuqala ephansi ingakhiqizwa kusetshenziswa ama-compressor amancane, bese iqiniswa ngosizo lwe-booster. Khumbula nokho ukuthi ama-pressure booster awathathi indawo yama-compressor. Amanye ama-booster ethu okucindezela awadingi omunye umthombo ngaphandle komoya ocindezelwe. Ama-pressure booster ahlukaniswa njengama-twin-piston pressure booster futhi ahloselwe ukucindezela umoya. Okuhlukile okuyisisekelo kwe-booster kuqukethe isistimu ye-piston ephindwe kabili kanye ne-valve yokuqondisa eqondisayo yokusebenza okuqhubekayo. Lawa ma-booster aphinda kabili ingcindezi yokufaka ngokuzenzakalelayo. Akwenzeki ukulungisa ingcindezi ibe ngamavelu aphansi. Izithuthukisi zokucindezela nazo ezinesilawuli sokucindezela zingakhuphula izingcindezi zibe ngaphansi kokuphindwe kabili kwevelu emisiwe. Kulesi simo umlawuli wokucindezela unciphisa ukucindezela emakamelweni angaphandle. Izithuthukisi zokucindezela azikwazi ukuzikhiphela ngokwazo, umoya ungageleza ohlangothini olulodwa kuphela. Ngakho-ke ama-booster okucindezela ngeke asetshenziswe kulayini wokusebenza phakathi kwama-valve namasilinda. AMA-SENSOR NE-GAUGES (ingcindezi, vacuum….njll): Ingcindezi yakho, i-vacuum range, izinga lokushisa lebanga lokugeleza kwamanzi….etc. izonquma ukuthi iyiphi insimbi okufanele uyikhethe. Sinezinhlobonhlobo zezinzwa ezisezingeni elingekho eshalofini kanye namageji e-pneumatics, ama-hydraulics kanye ne-vacuum. Ama-Capacitance Manometers, Izinzwa Zokucindezela, Ukushintsha Ukucindezela, Amasistimu Angaphansi Okulawula Ingcindezi, Ama-Vacuum & Pressure Gauges, Ama-Vacuum & Pressure Transducer, Ama-Indirect Vacuum Gauge Transducers namamojula kanye nama-Vacuum & Pressure Gauge Controllers ngeminye yemikhiqizo edumile. Ukuze ukhethe inzwa yokucindezela efanele yohlelo oluthile, ngaphandle kobubanzi bengcindezi, uhlobo lokulinganisa ingcindezi kufanele lucatshangelwe. Izinzwa zokucindezela zikala ingcindezi ethile uma ziqhathaniswa nengcindezi yereferensi futhi zingahlukaniswa zibe ngu-1.) Absolute 2.) igeji kanye no-3.) amathuluzi wokuhlukanisa. Izinzwa zokucindezela kwe-piezoresistive eziphelele zikala ingcindezi ehlobene nereferensi ye-vacuum ephezulu evalwe ngemuva kwe-diaphragm yayo yokuzwa (in practice ebizwa ngokuthi Absolute Pressure). I-vacuum ayinalutho uma iqhathaniswa nengcindezi okufanele ilinganiswe. I-Gage Pressure ikalwa ngokuqhathaniswa nomfutho womoya osemkhathini. Izinguquko kumfutho womkhathi ngenxa yezimo zezulu noma ukuphakama kuthonya okukhiphayo kwenzwa yokucindezela kwegeji. Ingcindezi yegeji ephakeme kunengcindezi ye-ambient ibizwa ngokuthi ingcindezi eyakhayo. Uma ingcindezi yegeji ingaphansi kwengcindezi yasemkhathini, ibizwa nge-negative noma i-vacuum gage pressure. Ngokwekhwalithi yayo, i-vacuum ingahlukaniswa ngezigaba ezihlukene ezifana ne-vacuum ephansi, ephezulu kanye ne-ultra high. Izinzwa zokucindezela kwegeji zinikeza imbobo yokucindezela eyodwa kuphela. Umfutho womoya osendaweni uqondiswa ngembobo yokukhipha umoya noma ngeshubhu lokungenisa umoya ukuya ohlangothini olungemuva lwesici senzwa bese kunxeshezelwa. Ingcindezi ehlukile ingumehluko phakathi kwanoma yiziphi izingcindezi zenqubo ezimbili p1 kanye ne-p2. Ngenxa yalokhu, izinzwa zokucindezela okuhlukile kufanele zinikeze izimbobo zokucindezela ezimbili ezihlukene ezinoxhumo. Izinzwa zethu ze-amplified pressure ziyakwazi ukukala umehluko wengcindezi enhle nengalungile, ehambisana ne-p1>p2 kanye ne-p1<p2. Lezi zinzwa zibizwa ngokuthi izinzwa ze-bidirectional differential pressure. Ngokuphambene, izinzwa zengcindezi ehlukanisiwe ezingaqondile zisebenza kuphela ebangeni eliphozithivu (p1>p2) futhi ukucindezela okuphezulu kufanele kusetshenziswe kumbobo yokucindezela echazwa ngokuthi ''imbobo yokucindezela okukhulu''. Elinye ikilasi lamageji atholakalayo ama-Flow Meters. Amasistimu adinga ukuqapha okuqhubekayo kokusetshenziswa kokugeleza kuzinzwa ezijwayelekile zokugeleza zikagesi kunamamitha okugeleza, angadingi amandla. Izinzwa zokugeleza kwe-elekthronikhi zingasebenzisa izakhi zokuzwa ezihlukahlukene ukuze zikhiqize isignali ye-elekthronikhi ngokulingana nokugeleza. Isiginali ibe isithunyelwa kuphaneli yesibonisi se-elekthronikhi noma isifunda sokulawula. Kodwa-ke, izinzwa zokugeleza azikhiqizi inkomba ebonakalayo yokugeleza ngokwazo, futhi zidinga umthombo wamandla angaphandle ukuze zidlulisele isignali kusibonisi se-analog noma sedijithali. Amamitha okugeleza azimele, ngakolunye uhlangothi, athembele ku-dynamics of flow ukuze anikeze inkomba ebonakalayo yakho. Amamitha okugeleza asebenza ngomgomo wokucindezela okuguquguqukayo. Ngenxa yokuthi ukugeleza okukaliwe kuncike ekuguquguqukeni koketshezi, izinguquko ezibonakalayo zoketshezi zingathinta ukufundwa kokugeleza. Lokhu kungenxa yokuthi imitha yokugeleza ilinganiswa oketshezini olunamandla adonsela phansi athile phakathi kohlu lwama-viscosities. Ukwehluka okubanzi kwamazinga okushisa kungashintsha amandla adonsela phansi akhethekile kanye ne-viscosity ye-hydraulic fluid. Ngakho-ke uma i-flow meter isetshenziswa lapho uketshezi kushisa kakhulu noma kubanda kakhulu, ukufundwa kokugeleza kwamanzi kungase kungahambisani nezicaciso zabakhiqizi. Eminye imikhiqizo ihlanganisa Izinzwa Zezinga lokushisa kanye nama-Gauges. IZILAWULI ZAMA-PNEUMATIC CYLINDER: Izilawuli zethu zesivinini zakhele ekufakweni kokuthinta okukodwa zinciphisa isikhathi sokufaka, zehlise ukuphakama kokukhweza futhi zinike amandla ukwakheka komshini ohlangene. Izilawuli zethu zesivinini zivumela umzimba ukuthi ujikelezwe ukuze kube lula ukufaka okulula. Kutholakala ngosayizi wochungechunge kukho kokubili intshi ne-metric, enosayizi bamashubhu abahlukahlukene, enendololwane ozikhethela yona kanye nesitayela somhlaba wonke sokuguquguquka okuthuthukisiwe, izilawuli zethu zesivinini ziklanyelwe ukuhlangabezana nezinhlelo zokusebenza eziningi. Kunezindlela eziningana zokulawula isivinini esinwebekayo nesihlehlayo samasilinda womoya. Sinikeza Izilawuli Zokugeleza, Izinqamuleli Zokulawula Isivinini, Amavalvu Okukhipha Okusheshayo okulawula isivinini. Amasilinda asebenza kabili angaba nokulawulwa kokuphuma kanye nokushaywa unhlangothi, futhi ungaba nezindlela eziningana zokulawula ezihlukene embobeni ngayinye. AMA-CYLINDER POSITION SENSOR: Lezi zinzwa zisetshenziselwa ukutholwa kwamapiston afakwe uzibuthe ku-pneumatic nezinye izinhlobo zamasilinda. Indawo kazibuthe kazibuthe eshumekwe kupiston itholwa inzwa ngodonga lwezindlu lwesilinda. Lezi zinzwa ezingathinteki zinquma indawo ye-cylinder piston ngaphandle kokunciphisa ubuqotho besilinda ngokwayo. Lezi zinzwa zokuma zisebenza ngaphandle kokugxambukela kusilinda, zigcine uhlelo luqinile. AMA-SILENCERS / EHAUST CLEANERS: Izithulisi zethu zisebenza kahle kakhulu ekwehliseni umsindo wokukhipha umoya ovela kumaphampu namanye amadivaysi omoya. Izithulisi zethu zehlisa amazinga omsindo aze afike ku-30dB kuyilapho zivumela amazinga okugeleza aphezulu anengcindezi encane yangemuva. Sinezihlungi ezivumela ukuphuma komoya okuqondile egumbini elihlanzekile. Umoya ungaphela ngokuqondile ekamelweni elihlanzekile kuphela ngokukhweza lezi zicoci zokukhipha umoya emishinini yomoya egumbini elihlanzekile. Asikho isidingo samapayipi okukhipha umoya nokukhulula umoya. Umkhiqizo unciphisa umsebenzi wokufaka amapayipi nendawo. I-FEEDTHROUGHS: Lawa ngokuvamile amakhondatha kagesi noma imicu yokubona esetshenziselwa ukuthwala isignali endaweni ebiyelwe, ikamelo, umkhumbi noma isixhumi esibonakalayo. I-feedthrough ingahlukaniswa ngezigaba zamandla nezinsimbi. Iziphequluli zamandla zithwala amazanyana aphezulu noma ama-voltage aphezulu. Ngakolunye uhlangothi ama-Instrumentation feedthrough asetshenziselwa ukuphatha amasignali kagesi, njengama-thermocouples, ngokuvamile awamanje aphansi noma i-voltage. Okokugcina, ama-RF-feedthrough aklanyelwe ukuthwala amasiginali kagesi we-RF noma ama-microwave aphezulu kakhulu. Ukuxhumeka kukagesi okuphakelayo kungase kudingeke kumelane nomehluko omkhulu wengcindezi kubo bonke ubude bawo. Amasistimu asebenza ngaphansi kwe-vacuum ephezulu, njengama-vacuum chamber adinga ukuxhunywa kukagesi ngomkhumbi. Izimoto ezingaphansi kwamanzi nazo zidinga ukuxhumana phakathi kwamathuluzi angaphandle namadivayisi kanye nezilawuli ezingaphakathi kwendawo yokucindezela imoto. Okuphakelayo okuvalwe nge-Hermetically kuvame ukusetshenziselwa ukwenza izinsimbi, i-amperage ephezulu kanye ne-voltage, i-coaxial, i-thermocouple kanye ne-fiber optic application. I-fiber optic feedthroughs idlulisa amasignali e-fiber optical ngokusebenzisa ukuxhumana. Ukudluliswa kwemishini kudlulisa ukunyakaza komshini ukusuka kolunye uhlangothi lwesixhumi esibonakalayo (isibonelo ukusuka ngaphandle kwegumbi lokucindezela) ukuya kolunye uhlangothi (ngaphakathi kwegumbi lokucindezela). Okuphakelayo kwethu kufaka i-ceramic, ingilazi, izingxenye ze-alloy zensimbi / zensimbi, ama-metal coatings kumafayibha ukuze athengiseke kanye nama-silicone akhethekile nama-epoxies, konke okukhethwe ngokucophelela ngokuya ngohlelo lokusebenza. Yonke imihlangano yethu yokuphakelayo iphumelele izivivinyo ezinzima ezihlanganisa nokuhlolwa kwamabhayisikili emvelo kanye namazinga ezimboni ahlobene. AMA-VACUUM REGULATORS: Lawa madivaysi aqinisekisa ukuthi inqubo ye-vacuum ihlala izinzile ngisho nangokuhlukahluka okubanzi kwezinga lokugeleza kanye nezingcindezi zokuhlinzeka. Izilawuli ze-vacuum zilawula ngokuqondile izingcindezi ze-vacuum ngokushintsha ukugeleza kusuka kusistimu kuya empompini ye-vacuum. Ukusebenzisa izilawuli zethu ze-vacuum ezinembayo kulula. Uvele uxhume iphampu yakho yevacuum noma i-vacuum utililty embobeni ye-Outlet. Uxhuma inqubo ofuna ukuyilawula embobeni yokungenayo. Ngokulungisa i-vacuum knob ufinyelela izinga le-vacuum oyifunayo. Sicela uchofoze umbhalo ogqanyisiwe ngezansi ukuze ulande izincwajana zomkhiqizo wethu zezingxenye zohlelo lwe-pneumatic & hydraulic & vacuum: - Amasilinda womoya - YC Series Hydraulic Cyclinder - Accumulators from AGS-TECH Inc - Ulwazi ngesikhungo sethu esikhiqiza i-ceramic kuya kokufakwa kwensimbi, ukuvalwa kwe-hermetic, i-vacuum feedthroughs, i-vacuum ephezulu nephezulu kanye nezingxenye zokulawula uketshezi ingatholakala lapha: Ibhukwana le-Fluid Control Factory CLICK Product Finder-Locator Service IKHASI ELIDLULE

Micro-Optics, Micro-Optical, Microoptical, Wafer Level Optics, Gratings, Fresnel Lenses, Lens Array, Micromirrors, Micro Reflectors, Collimators, Aspheres, LED Ukukhiqiza I-Micro-Optics Enye yezinkambu ku-microfabrication esibandakanyeka kuyo is MICRO-OPTICS MANUFACTURING. I-Micro-optics ivumela ukukhohliswa kokukhanya kanye nokuphathwa kwama-photons nge-micron kanye ne-sub-micron scale scale structures and components. Ezinye izinhlelo zokusebenza ze MICRO-OPTICAL COMPONENTS kanye ne-SUBSYSTEMS are: Ubuchwepheshe bolwazi: Kuma-micro-display, ama-micro-projectors, isitoreji sedatha yokubona, amakhamera amancane, izikena, amaphrinta, amakhophi...njll. I-Biomedicine: Ukuxilongwa okuncane kokuhlasela/iphuzu lokunakekelwa, ukuqapha ukwelashwa, izinzwa ze-micro-imaging, izimila ze-retina, ama-micro-endoscopes. Ukukhanyisa: Amasistimu asekelwe kuma-LED neminye imithombo yokukhanya esebenzayo Amasistimu Wokuphepha Nokuphepha: Izinhlelo zokubona ebusuku kwe-infrared zezinhlelo zezimoto, izinzwa zeminwe yokubona, izikena ze-retina. I-Optical Communication & Telecommunication: Kumaswishi e-photonic, i-passive fiber optic components, ama-amplifiers optical, i-mainframe kanye nezinhlelo zokuxhuma zekhompyutha yomuntu siqu. Izakhiwo ezihlakaniphile: Kuzinhlelo zokuzwa ezisekelwe ku-fiber optical nokunye okuningi Izinhlobo zezingxenye ze-micro-optical kanye namasistimu angaphansi esiwakhayo nesiwahlinzekayo yilezi: - I-Wafer Level Optics - I-Refractive Optics - I-Diffractive Optics - Izihlungi - Izigcawu - Ama-Hologram Akhiwe Ngekhompyutha - Izingxenye ze-Hybrid Microoptical - I-Infrared Micro-Optics - I-Polymer Micro-Optics - I-Optical MEMS - I-Monolithically kanye Nezimfihlo Ezididiyelwe I-Micro-Optic Systems Eminye yemikhiqizo yethu esetshenziswa kakhulu yi-micro-optical yile: - I-Bi-convex kanye ne-plano-convex lens - Amalensi e-Achromat - Amalensi ebhola - Amalensi e-Vortex - Amalensi weFresnel - Multifocal Lens - Ama-Cylindrical Lens - Amalensi e-Index (GRIN) Amazinga - Ama-Micro-Optical Prisms - Ama-Aspheres - Ama-Arrays of Aspheres - Ama-Collimators - I-Micro-Lens Arrays - I-Diffraction Gratings - I-Wire-Grid Polarizers - Izihlungi ze-Micro-Optic Digital - I-Pulse Compression Gratings - Amamojula we-LED - Beam Shapers - Isampula ye-Beam - Ring Generator - Micro-Optical Homogenizers / Diffusers - Multispot Beam Splitters - Ama-Dual Wavelength Beam Combiners - I-Micro-Optical Interconnects - Intelligent Micro-Optics Systems - Ukufanekisa ama-Microlense - Micromirrors - Micro Reflectors - I-Micro-Optical Windows - I-Dielectric Mask - Iris diaphragm Ake sikunikeze ulwazi oluyisisekelo mayelana nale mikhiqizo ye-micro-optical kanye nezinhlelo zokusebenza zayo: AMALENSI EBHOLA: Amalensi ebhola amalensi amancane ayindilinga ayindilinga avame ukusetshenziselwa ukuhlanganisa ukukhanya nokuphuma kumafayibha. Sinikezela ngezinhlobonhlobo zamalensi amabhola esitokwe se-micro-optic futhi singawenza ngokwezicaciso zakho. Amalensi amabhola esitoko asuka ku-quartz anokudlulisa okuhle kakhulu kwe-UV kanye ne-IR phakathi kuka-185nm kuya ku->2000nm, futhi amalensi ethu esafire anenkomba ecwebezelayo ephakeme, evumela ubude obufushane kakhulu bokugxila bokuhlangana okuhle kakhulu kwefayibha. Ama-lens amabhola ama-Micro-optical avela kwezinye izinto nama-diameter ayatholakala. Ngaphandle kwezicelo zokuhlanganisa i-fiber, amalensi ebhola e-micro-optical asetshenziswa njengamalensi ahlosiwe ku-endoscopy, izinhlelo zokulinganisa i-laser nokuskena ibhakhodi. Ngakolunye uhlangothi, amalensi e-micro-optic half ball anikezela ngokuhlakazeka okufanayo kokukhanya futhi asetshenziswa kakhulu kuzibonisi ze-LED namarobhothi. I-MICRO-OPTICAL ASPHERES AND ARRAYS: Izindawo ezingaphansi kwe-aspheric zinephrofayili engeyona i-spherical. Ukusetshenziswa kwama-aspheres kunganciphisa inani lama-optical adingekayo ukuze kufinyelelwe ekusebenzeni okufiswayo kokubona. Izinhlelo zokusebenza ezidumile zamalensi ama-micro-optical arrays ane-spherical or aspherical curvature ziwumfanekiso kanye nokukhanya kanye nokungqubuzana okusebenzayo kokukhanya kwe-laser. Ukufakwa esikhundleni kwe-aspheric microlens array yesistimu ye-multilens eyinkimbinkimbi akuphumeleli nje kuphela kusayizi omncane, isisindo esilula, i-compact geometry, nezindleko eziphansi zesistimu yokubona, kodwa futhi nasekuthuthukisweni okuphawulekayo kokusebenza kwayo okubonakalayo njengekhwalithi engcono yokucabanga. Kodwa-ke, ukwakhiwa kwama-aspheric microlens kanye nama-microlens arrays kuyinselele, ngoba ubuchwepheshe obujwayelekile obusetshenziselwa ama-macro-size aspheres njengokugaya idayimane lephuzu elilodwa kanye nokugeleza kabusha kwe-thermal abukwazi ukuchaza iphrofayili eyinkimbinkimbi yelensi ye-micro-optic endaweni encane njengamanye. kumashumi ama-micrometer. Sinolwazi lokukhiqiza izakhiwo ezinjalo ze-micro-optical sisebenzisa amasu athuthukile njengamalaser e-femtosecond. AMALENSI E-MICRO-OPTICAL ACHROMAT: Lawa ma-lens alungele izinhlelo zokusebenza ezidinga ukulungiswa kombala, kuyilapho amalensi e-aspheric aklanyelwe ukulungisa ukuphuma okuyindilinga. Ilensi ye-achromatic noma i-achromat ilensi edizayinelwe ukukhawulela imiphumela ye-chromatic ne-spherical aberration. Amalensi achromatic ama-Micro-optical enza izilungiso ukuze alethe ubude begagasi obubili (njengemibala ebomvu neluhlaza okwesibhakabhaka) ekugxileni endizeni efanayo. AMALENSI angu-CYLINDRICAL: Lawa ma-lens agxila ekukhanyeni emugqeni esikhundleni sephoyinti, njengoba i-lens eyindilinga ingenza. Ubuso obugobile noma ubuso belensi eyisilinda yizigaba zesilinda, futhi zigxilisa isithombe esidlula kuso sibe umugqa ohambisana nokuphambana kobuso belensi kanye nendiza ebheke kuwo. Ilensi eyisilinda icindezela isithombe siye ngakulo mugqa, futhi isishiya singaguquki sibheke ngakuso (endizeni ye-tangent). Izinguqulo ezincane ze-micro-optical ziyatholakala ezilungele ukusetshenziswa ezindaweni ezikhanyayo ezincane, ezidinga izingxenye ze-fiber optical ezinosayizi ohlangene, amasistimu we-laser, namadivayisi abona nge-micro-optical. AMICRO-OPTICAL WINDOWS AND FLATS: Amawindi e-Milimetric micro-optical ahlangabezana nezidingo eziqinile zokubekezelela ayatholakala. Singazikhiqiza ngendlela oyifisayo ngokwezicaciso zakho kusukela kunoma yiziphi izibuko zebanga lokubona. Sinikezela ngezinhlobonhlobo zamafasitela amancane abonakalayo enziwe ngezinto ezihlukene njenge-silica ehlanganisiwe, i-BK7, isafire, i-zinc sulphide….etc. ngokudlulisela kusuka ku-UV kuya kububanzi obuphakathi be-IR. AMAMICROLENSI ABANGABONAKALISAYO: Amalensi amancane amalensi amancane, ngokuvamile anobubanzi obungaphansi kwemilimitha (mm) futhi mancane njengama-micrometres ayi-10. Ama-Imaging Lens asetshenziselwa ukubuka izinto ezinhlelweni zezithombe. Ama-Imaging Lens asetshenziswa ezinhlelweni zokuthwebula izithombe ukuze kugxiliswe isithombe sento ehloliwe kwinzwa yekhamera. Kuye nge-lens, ama-imaging lens angasetshenziswa ukususa i-parallax noma iphutha lokubuka. Bangaphinda banikeze ngokukhuliswa okulungisekayo, inkambu yokubuka, nobude bokugxila. Lawa ma-lens avumela into ukuthi ibukwe ngezindlela ezimbalwa ukukhombisa izici ezithile noma izici ezingafiseleka ezinhlelweni ezithile. I-MICROMIRRORS: Imishini ye-Micromirror isekelwe ezibukweni ezincane ezingabonakali. Izibuko yiMicroelectromechanical systems (MEMS). Izimo zalawa madivaysi e-micro-optical alawulwa ngokufaka i-voltage phakathi kwama-electrode amabili azungeze ama-array wesibuko. Amadivayisi e-micromirror edijithali asetshenziswa kumaprojektha evidiyo futhi okokubona kanye namadivayisi we-micromirror asetshenziselwa ukuchezuka nokulawula ukukhanya. I-MICRO-OPTIC COLLIMATORS NE-COLLIMATOR ARRAYS: Izinhlobonhlobo zama-micro-optical collimator ziyatholakala ngaphandle kweshalofu. Ama-collimator ama-Micro-optical ama-beam amancane ohlelo olufunayo akhiqizwa kusetshenziswa ubuchwepheshe be-laser fusion. Ukuphela kwe-fiber kuhlanganiswe ngokuqondile esikhungweni se-optical se-lens, ngaleyo ndlela kuqedwe i-epoxy ngaphakathi kwendlela yokubona. Indawo yelensi ye-micro-optic collimator bese ipholishwa nge-laser ibe phakathi kwesigidi samayintshi womumo ofanele. Ama-collimator amancane e-Beam akhiqiza imishayo ehlanganisiwe enezingqimba ezingaphansi kwemilimitha. Ama-collimator amancane we-Micro-optical asetshenziswa ku-1064, 1310 noma 1550 nm wavelengths. I-GRIN lens based micro-optic collimator nayo iyatholakala kanye ne-collimator array kanye ne-collimator fiber array assemblies. AMALENSI E-MICRO-OPTICAL FRESNEL: Ilensi yeFresnel iwuhlobo lwamalensi ahlangene aklanyelwe ukuvumela ukwakhiwa kwamalensi omgodi omkhulu nobude bokugxila obufushane ngaphandle kwesisindo nomthamo wezinto ezingadingwa ilensi yomklamo ovamile. Ilensi yeFresnel ingenziwa ibe mncane kakhulu kunelensi evamile eqhathanisekayo, kwesinye isikhathi ithathe isimo seshidi eliyisicaba. Ilensi yeFresnel ingathwebula ukukhanya okutshekile okwengeziwe okuvela emthonjeni wokukhanya, ngaleyo ndlela ivumele ukukhanya ukuthi kubonakale ebangeni elikhulu. Ilensi yeFresnel yehlisa inani lezinto ezidingekayo uma kuqhathaniswa nelensi evamile ngokuhlukanisa ilensi ibe isethi yezigaba ezigxilile zonyaka. Esigabeni ngasinye, ukujiya okuphelele kuyehla uma kuqhathaniswa nelensi elula efanayo. Lokhu kungabukwa njengokuhlukanisa indawo eqhubekayo yelensi evamile ibe isethi yendawo egobile efanayo, nokungaqhubeki okuhamba ngesinyathelo phakathi kwakho. Amalensi e-Micro-optic Fresnel agxila ekukhanyeni ngokuphinda amelane nesethi yendawo egobile egxilile. Lawa ma-lens angenziwa abe mncane kakhulu futhi angasindi. Amalensi e-Micro-optical Fresnel anikezela ngamathuba ku-optics yezinhlelo zokusebenza ze-Xray ezine-resolution, amandla okuxhumana ngewafer optical. Sinezindlela eziningi zokwenza okuhlanganisa i-micromolding kanye ne-micromachining ukuze sikhiqize amalensi ama-Fresnel abonakalayo kanye nezinhlu eziqondene ngqo nezinhlelo zakho zokusebenza. Singaklama ilensi yeFresnel enhle njenge-collimator, iqoqo noma ngama-conjugate amabili anomkhawulo. Amalensi e-Micro-Optical Fresnel avamise ukulungiswa ngenxa yokuphambuka okuyindilinga. Amalensi e-Micro-optic positive angenziwa ngensimbi ukuze asetshenziswe njengesibonisi sendawo yesibili futhi amalensi anegethivu angenziwa ngensimbi ukuze asetshenziswe njengesibonisi sokuqala esingaphezulu. I-MICRO-OPTICAL PRISMS: Ulayini wethu we-micro-optics onembile uhlanganisa ama-prism amancane amboziwe nangamboziwe. Zilungele ukusetshenziswa nemithombo ye-laser nezinhlelo zokusebenza ze-imaging. Amaprism ethu ama-micro-optical anobukhulu be-submilimeter. Amaprism ethu ahlanganiswe ne-micro-optical angasetshenziswa njengezibonisi zesibuko ngokuphathelene nokukhanya okungenayo. Ama-prism angamboziwe asebenza njengezibuko zesigameko esilula kolunye lwezinhlangothi ezifushane njengoba ukukhanya kwesigameko kubonakala ngaphakathi ngokuphelele ku-hypotenuse. Izibonelo zamakhono wethu we-Micro-optical prism zihlanganisa ama-engeli angakwesokudla ama-prism, ama-beamsplitter cube assemblies, ama-Amici prism, ama-K-prism, ama-Dove prism, ama-Roof prism, ama-Cornercube, ama-Pentaprism, ama-Rhomboid prism, ama-Bauernfeind prism, ama-Disperms prism, ama-Disperms prism. Siphinde sinikeze ama-micro-prism akhanyayo aqondisayo kanye nama-de-glaring optical enziwe nge-acrylic, i-polycarbonate nezinye izinto zepulasitiki ngenqubo yokukhiqiza embossing eshisayo yokufakwa kwezibani nezibani, ama-LED. Asebenza kahle kakhulu, anokukhanya okuqinile aqondisa izindawo eziqondile zeprism, izibani ezisekela ukufeza imithetho yehhovisi yokususa ukucwebezela. Izakhiwo ezengeziwe ze-prism ezenziwe ngezifiso zingenzeka. Ama-Microprism kanye ne-microprism arrays ezingeni le-wafer nakho kungenzeka kusetshenziswa amasu okwenziwa nge-microfabrication. I-DIFFRACTION GRATINGS: Sinikeza ukuklama nokwenza izinto ze-diffractive micro-optical element (DOEs). I-diffraction grating iyingxenye ye-optical enesakhiwo sezikhathi ezithile, esihlukanisa futhi sihlukanise ukukhanya kube yimishayo eminingana ehamba ngezindlela ezihlukene. Izikhombisi-ndlela zale misebe zincike esikhaleni sokugawula kanye nobude begagasi bokukhanya ukuze igridi isebenze njengesici esihlakazayo. Lokhu kwenza ukugaya kube into efanelekile ukuthi isetshenziswe kuma-monochromators nama-spectrometer. Sisebenzisa i-wafer-based lithography, sikhiqiza ama-elementi e-micro-optical e-diffractive anezici ezihlukile zokusebenza kwe-thermal, mechanical kanye ne-optical. Ukucutshungulwa kwezinga le-wafer kwe-micro-optics kunikeza ukuphindaphindeka okuhle kakhulu kokukhiqiza kanye nomphumela wezomnotho. Ezinye zezinto ezitholakalayo ze-diffractive micro-optical elements yi-crystal-quartz, fused-silica, glass, silicon kanye nama-synthetic substrates. I-Diffraction gratings iwusizo ezinhlelweni ezifana nokuhlaziywa kwe-spectral / spectroscopy, i-MUX/DEMUX/DWDM, ukulawulwa kokunyakaza okunembayo okufana nakuma-optical encoder. Izindlela ze-Lithography zenza ukwakhiwa kokunemba kwe-micro-optical gratings enezikhala ezilawulwa ngokuqinile ze-groove zenzeke. I-AGS-TECH inikeza kokubili imiklamo yangokwezifiso neyesitoko. AMALENSI E-VORTEX: Kuzinhlelo zokusebenza ze-laser kunesidingo sokuguqula i-Gaussian beam ibe indandatho yamandla emise okwe-donut. Lokhu kufinyelelwa kusetshenziswa amalensi e-Vortex. Ezinye izinhlelo zokusebenza ziku-lithography kanye ne-high-resolution microscopy. Amapuleti esigaba se-Polymer engilazini i-Vortex nawo ayatholakala. I-MICRO-OPTICAL HOMOGENIZERS / DIFFUSERS: Kusetshenziswa ubuchwepheshe obuhlukahlukene ukwenza ama-homogenizer nama-diffuser wethu we-micro-optical, okuhlanganisa i-embossing, amafilimu e-diffuser akhiwe, ama-diffuser afakiwe, izihlukanisi ze-HiLAM. I-Laser Speckle isenzakalo esibonakalayo esibangelwa ukuphazamiseka okungahleliwe kokukhanya okuhlangene. Lesi senzo sisetshenziselwa ukukala Umsebenzi Wokudluliswa Kwemodyuli (MTF) weqoqo lomtshina. Ama-Microlens diffuser aboniswa njengamadivayisi asebenza kahle e-micro-optic okukhiqiza amachashaza. AMA-BEAM SHAPERS: I-micro-optic beam shaper iyi-optic noma isethi ye-optics eguqula kokubili ukusabalalisa kokuqina kanye nokuma kwendawo kwe-laser beam kube into efiseleka kakhulu ohlelweni olunikeziwe. Imvamisa, i-laser efana ne-Gaussian noma engafanani ne-laser iguqulwa ibe yi-flat top top. I-Beam shaper micro-optics isetshenziselwa ukubumba nokukhohlisa imodi eyodwa kanye nemishayo ye-laser enemodi eminingi. I-beam shaper micro-optics yethu ihlinzeka ngomumo oyindilinga, oyisikwele, we-rectilinear, oyi-hexagonal noma womugqa, futhi yenza i-homogenize ugongolo (ingaphezulu eliyisicaba) noma inikeze iphethini yokuqina yangokwezifiso ngokuya ngezidingo zohlelo lokusebenza. Ama-elementi e-refractive, diffractive kanye ne-refletive micro-optical ye-laser beam shape kanye ne-homogenizing seyenziwe. Izinto ezisebenza kaningi ze-micro-optical zisetshenziselwa ukubumba amaphrofayili e-laser beam ehlukahlukene abe amajiyometri ahlukahlukene afana, i-homogeneous spot array noma iphethini yomugqa, ishidi lokukhanya le-laser noma amaphrofayili okuqina okuphezulu phezulu. Izibonelo ezinhle zesicelo se-beam ukusika kanye nokushisela kwe-keyhole. Izibonelo zokusetshenziswa kwe-broad beam i-conduction welding, i-brazing, i-soldering, ukwelashwa kokushisa, ukukhipha ifilimu elincanyana, ukuchama nge-laser. I-PULSE COMPRESSITION GRATINGS: Pulse compression iyindlela ewusizo esebenzisa ubudlelwano phakathi kobude be-pulse kanye nobubanzi be-spectral bokushaya kwenhliziyo. Lokhu kuvumela ukukhuliswa kwama-laser pulses ngaphezu kwemikhawulo evamile yomonakalo ebekwe yizingxenye zokubona ohlelweni lwe-laser. Kunezindlela eziqondile nezingaqondile zokunciphisa ubude be-optical pulses. Kunezindlela ezihlukahlukene zokucindezela okwesikhashana / ukufinyeza ama-optical pulses, okungukuthi, ukunciphisa ubude be-pulse. Lezi zindlela ngokuvamile ziqala esifundeni se-picosecond noma i-femtosecond, okungukuthi kakade kuhulumeni wama-ultrashort pulses. I-MULTISPOT BEAM SPLITTERS: Ukuhlukaniswa kwe-beam kusetshenziswa izakhi ezihlukanisiwe kuyafiseleka uma i-elementi eyodwa idingeka ukuze kukhiqizwe imishayo eminingana noma uma kudingeka ukuhlukaniswa kwamandla okukhanya okunembile impela. Ukuma okunembayo nakho kungafinyelelwa, isibonelo, ukwakha izimbobo emabangeni achazwe ngokucacile nanembile. Sine-Multi-Spot Elements, i-Beam Sampler Element, i-Multi-Focus Element. Ngokusebenzisa isici esihlukanisayo, imishayo yesigameko ehlanganisiwe ihlukaniswa ibe imishayo eminingana. Le mishayo ye-optical inokuqina okulinganayo kanye ne-engeli elinganayo kwenye. Sinazo zombili izici ezinohlangothi olulodwa kanye nezinhlangothi ezimbili. Izakhi ze-1D zihlukanisa imishayo ngomugqa oqondile kuyilapho ama-elementi e-2D akhiqiza imishayo ehlelwe nge-matrix, isibonelo, amachashazi angu-2 x 2 noma angu-3 x 3 nezici ezinamachashaza ahlelwe ngama-hexagonal. Izinguqulo ze-Micro-optical ziyatholakala. IZINTO ZE-BEAM SAMPLER: Lawa ma-elementi ama-grating asetshenziselwa ukuqapha okusemgqeni kwama-laser amandla aphezulu. I-oda yokuqala ye-diffraction ingasetshenziselwa izilinganiso ze-beam. Ubukhulu bawo buphansi kakhulu kunalolo lwe-beam eyinhloko futhi lungaklanywa ngokwezifiso. Ama-diffraction ama-oda aphezulu angaphinda asetshenziselwe ukulinganisa ngamandla aphansi. Ukwehluka kokuqina kanye nezinguquko kuphrofayela ye-beam yama-laser anamandla aphezulu kungagadwa ngokuthembekile emgqeni kusetshenziswa le ndlela. IZIMPAWU ZOKUGXILA KANINGI: Ngale elementi ehlukanisayo amaphoyinti okugxila ambalwa angadalwa eduze kwe-eksisi yokubona. Lezi zakhi ezibonakalayo zisetshenziselwa izinzwa, i-ophthalmology, ukucubungula impahla. Izinguqulo ze-Micro-optical ziyatholakala. IZIXHUMANO ZAMA-MICRO-OPTICAL: Izixhumi ezibonakalayo bezilokhu zishintsha izintambo zikagesi zethusi emazingeni ahlukene kuhlelo lwe-interconnect hierarchy. Enye yamathuba okuletha izinzuzo zokuxhumana nge-micro-optics ku-backplane yekhompiyutha, ibhodi lesekethe eliphrintiwe, izinga le-inter-chip kanye ne-on-chip interconnect level, ukusebenzisa amamojula wokuxhumanisa ama-micro-optical interconnect enziwe ngepulasitiki. Lawa mamojula ayakwazi ukuthwala umkhawulokudonsa wokuxhumana ophezulu ohlanganisa izinkulungwane zezixhumanisi ezibonakalayo zephoyinti ukuya ephuzwini endaweni yesentimitha yesikwele. Xhumana nathi ukuze uthole i-off-shelf kanye nokuxhumanisa okuklanywe ngokwezifiso kwe-micro-optical kwendiza yangemuva yekhompyutha, ibhodi lesekethe eliphrintiwe, amazinga e-inter-chip kanye ne-on-chip interconnect. IZIHLELO ZE-MICRO-OPTICS EZIHLAKANIPHILE: Amamojula ahlakaniphile okukhanya kwe-micro-optic asetshenziswa kumafoni ahlakaniphile nakumadivaysi ahlakaniphile ezinhlelo zokusebenza ze-flash ye-LED, ekuxhumaneni optical ukuthutha idatha ngamakhompiyutha amakhulu kanye nemishini yezokuxhumana, njengezixazululo ezincane zokubunjwa kwe-infrared eduze kwe-infrared, ukutholwa emdlalweni. izinhlelo zokusebenza kanye nokweseka ukulawula ukuthinta ekusebenzelaneni komsebenzisi okungokwemvelo. Amamojula wokuzwa we-opto-electronic asetshenziselwa inani lezinhlelo zokusebenza zomkhiqizo ezifana nezinzwa ze-ambient nezinzwa eziseduze kumafoni ahlakaniphile. Amasistimu e-imaging micro-optic ahlakaniphile asetshenziselwa amakhamera ayisisekelo nangaphambili. Sinikeza futhi amasistimu enziwe ngezifiso ama-micro-optical asebenza ngendlela ephezulu kanye nokwenza kube lula. AMAMODULE E-LED: Ungathola ama-chips e-LED, ama-dies and modules ekhasini lethu Ukukhiqiza Izingxenye Zokukhanyisa Nokukhanyisa ngokuchofoza lapha. AMA-POLARIZER WE-WIRE-GRID: Lezi zihlanganisa izintambo ezivamile zensimbi ezicolekileyo ezihambisanayo, ezibekwe endizeni eqondana nomugqa wesigameko. I-polarization direction is perpendicular to the wires. Ama-polarizer anephethini anezinhlelo zokusebenza ku-polarimetry, i-interferometry, izibonisi ze-3D, nokugcinwa kwedatha yokubona. Ama-polarizer wegridi yocingo asetshenziswa kakhulu ezinhlelweni ze-infrared. Ngakolunye uhlangothi ama-polarizers ane-micropatterned wire-grid anokulungiswa kwendawo okulinganiselwe kanye nokusebenza kabi kumaza wamaza abonakalayo, angenwa kalula amaphutha futhi awakwazi ukunwetshwa kalula kuma-polarizations angewona umugqa. Ama-polarizer anamaphikiseli asebenzisa amagridi e-nanowire anephethini emincane. Ama-polarizers ama-pixelated micro-optical angaqondaniswa namakhamera, izindiza zezindiza, ama-interferometers, nama-microbolometers ngaphandle kwesidingo sokushintshwa kwemishini ye-polarizer. Izithombe ezigqamile ezihlukanisa phakathi kwama-polarizations amaningi kuwo wonke amaza amaza abonakalayo kanye ne-IR zingathwetshulwa kanyekanye ngesikhathi sangempela esivumela izithombe ezisheshayo, ezinokucaca okuphezulu. I-Pixelated micro-optical polarizers iphinda inike amandla izithombe ezicacile ze-2D ne-3D ngisho nasezimeni zokukhanya okuphansi. Sinikeza ama-polarizer anephethini emishini yokuthwebula yezifunda ezimbili, ezintathu nezine. Izinguqulo ze-Micro-optical ziyatholakala. AMALENSI ESIQINISEKISO (I-GRIN): Ukuhluka kancane kancane kwenkomba ye-refractive (n) yento engasetshenziswa ukuze kukhiqizwe amalensi anezindawo eziyisicaba, noma amalensi angenakho ukuphambana okuvamise ukubonwa ngamalensi ayisiyingi endabuko. Amalensi e-Gradient-index (GRIN) angase abe ne-refraction gradient eyi-spherical, axial, noma radial. Izinguqulo ezincane kakhulu ze-micro-optical ziyatholakala. IZIHLUNGI EZIZIHLUNGI EZIYI-MICRO-OPTIC DIGITAL: Izihlungi zeDigital neutral density zisetshenziselwa ukulawula amaphrofayili wokuqina wezinhlelo zokukhanyisa kanye ne-projection. Lezi zihlungi ze-micro-optic ziqukethe izakhi ezincane zokumunca insimbi ezisatshalaliswa ngokungahleliwe ku-substrate ye-silica ehlanganisiwe. Izici zalezi zingxenye ze-Micro-optical ukunemba okuphezulu, indawo enkulu ecacile, umkhawulo womonakalo omkhulu, ukuncishiswa kwe-broadband ye-DUV ukuya kumaza wamaza we-IR, achazwe kahle iphrofayili yokudlulisela enohlangothi olulodwa noma amabili. Ezinye izinhlelo zokusebenza ziyizimbobo zonqenqema ezithambile, ukulungiswa okunembile kwamaphrofayili wokuqina ezinhlelweni zokukhanyisa noma zokuqagela, izihlungi eziguquguqukayo zokuthibaza zamalambu anamandla amakhulu kanye nemishayo ye-laser eyandisiwe. Singakwazi ukwenza ngokwezifiso ukuminyana nobukhulu bezakhiwo ukuze kuhlangatshezwane ngokuqondile namaphrofayili okudlulisela adingwa uhlelo lokusebenza. I-MULTI-WAVELENGTH BEAM COMBINERS: Izihlanganisi ze-Multi-Wavelength beam zihlanganisa ama-collimator amabili e-LED anobude obuhlukahlukene be-wavelengths ibe i-beam eyodwa ehlanganisiwe. Izihlanganisi eziningi zingancishiswa ukuze kuhlanganiswe imithombo ye-collimator ye-LED engaphezu kwemibili. Izihlanganisi ze-beam zenziwe ngezihlukanisi ze-dichroic ze-dichroic eziphezulu ezihlanganisa ubude be-wavelength kanye> nokusebenza kahle kwe-95%. Izinguqulo ezincane kakhulu ze-micro-optic ziyatholakala. CLICK Product Finder-Locator Service IKHASI ELIDLULE

Surface Treatment and Modification - Surface Engineering - Hardening - Plasma - Laser - Ion Implantation - Electron Beam Processing at AGS-TECH Ukwelapha Okuphezulu Nokuguqulwa Imibuso imboza yonke into. Ukukhanga kanye nokusebenza okubonakalayo okusihlinzekayo kubaluleke kakhulu. Therefore SURFACE TREATMENT and SURFACE MODIFICATION are among our everyday industrial operations. Ukwelashwa nokulungiswa kwendawo kuholela ekuthuthukisweni kwezakhiwo ezingaphezulu futhi kungenziwa njengokuqeda umsebenzi wokugcina noma ngaphambi kokumboza noma ukuhlanganisa ukusebenza. , lungisa ubuso bezinto nemikhiqizo ukuze: - Lawula ukungqubuzana nokuguga - Thuthukisa ukumelana nokugqwala - Thuthukisa ukunamathela kwezingubo ezilandelayo noma izingxenye ezihlanganisiwe - Shintsha i-conductivity yezakhiwo zomzimba, ukumelana nokuqina, amandla angaphezulu kanye nokuzindla - Shintsha izakhiwo zamakhemikhali zezindawo ngokwethula amaqembu asebenzayo - Shintsha ubukhulu - Shintsha indlela obukeka ngayo, isib, umbala, ukuhwalala... njll. - Hlanza futhi / noma bulala amagciwane endaweni Ngokusetshenziswa kokwelashwa okungaphezulu nokuguqulwa, imisebenzi kanye nezimpilo zesevisi yezinto zokwakha zingathuthukiswa. Izindlela zethu zokwelashwa ezivamile nezindlela zokuguqula zingahlukaniswa zibe izigaba ezimbili ezinkulu: Ukwelashwa Nokulungiswa Kwendawo Engaphansi: I-Organic Coatings: Izingubo zemvelo zisebenzisa upende, usimende, amalaminates, izimpushana ezihlanganisiwe kanye nezinto zokugcoba endaweni yezinto. I-Inorganic Coatings: Izigqoko zethu ezithandwayo ze-inorganic ziwukuba yi-electroplating, i-autocatalytic plating (i-electroless plating), okokuguqula, izifutho ezishisayo, ukucwiliswa okushisayo, ukufaka okuqinile, ukuhlanganisa isithando somlilo, okokuhlanganisa ifilimu emincane efana ne-SiO2, i-SiN kunsimbi, ingilazi, izitsha zobumba,….etc. Ngiyacela, ukwelashwa nokulungiswa kwendawo engaphezulu okuhlanganisa ama-coatings kuchazwe ngokuningiliziwe ngaphansi kwemenyu encane ehlobenechofoza lapha Izingubo Ezisebenzayo / Izingubo Zokuhlobisa / Ifilimu Encane / Ifilimu Eminyene Ukwelashwa Okuphezulu Nokulungiswa Okushintsha Indawo: Lapha kuleli khasi sizogxila kulokhu. Akuwona wonke amasu okwelapha okungaphezulu kanye nokuguqula esiwachaza ngezansi asezingeni elincane noma le-nano-scale, kodwa nokho sizosho ngawo kafushane njengoba izinhloso nezindlela eziyisisekelo zifana nezinga elibalulekile kulezo ezisesikalini sokukhiqiza okuncane. Ukuqina: Ukuqina kwendawo ekhethiwe nge-laser, ilangabi, induction kanye ne-electron beam. Ukwelapha Amandla Aphezulu: Ezinye zezindlela zokwelapha zethu ezinamandla aphezulu zihlanganisa ukufakwa kwe-ion, i-laser glazing & fusion, nokwelashwa kwe-electron beam. Ukwelashwa Kokusabalalisa Okuncane: Izinqubo zokusabalalisa ezincane zifaka i-ferritic-nitrocarburizing, i-boronizing, ezinye izinqubo zokusabela kwezinga lokushisa eliphezulu njenge-TiC, VC. Ukwelashwa Kokusabalalisa Okusindayo: Izinqubo zethu zokusabalalisa ezinzima zifaka i-carburizing, i-nitriding, ne-carbonitriding. Ukwelashwa Okukhethekile Kwendawo: Ukwelashwa okukhethekile okufana nokwelashwa kwe-cryogenic, kazibuthe, kanye ne-sonic kuthinta kokubili indawo engaphezulu nezinto eziningi. Izinqubo zokuqina ezikhethiwe zingenziwa ngelangabi, induction, i-electron beam, i-laser beam. Ama-substrates amakhulu aqiniswa ngokujulile kusetshenziswa ukuqina komlilo. Ukuqina kwe-induction ngakolunye uhlangothi kusetshenziselwa izingxenye ezincane. Ukuqina kwe-laser kanye ne-electron beam ngezinye izikhathi akuhlukanisiwe kulezo ezifakwe ku-hardfacing noma ukwelashwa okunamandla amakhulu. Lezi zinqubo zokwelashwa nokulungiswa kwendawo zisebenza kuphela ezinsimbi ezinekhabhoni eyanele nengxube yengxubevange ukuvumela ukuqina. Ama-cast irons, izinsimbi ze-carbon, izinsimbi zamathuluzi, nezinsimbi ze-alloy zifanele lokhu kwelashwa kwendawo kanye nendlela yokulungisa. Ubukhulu bezingxenye abushintshiwe kakhulu yilokhu kwelashwa kwendawo eqinile. Ukujula kokuqina kungahluka ukusuka kuma-microns angu-250 kuye kububanzi besigaba sonke. Kodwa-ke, kulo lonke icala lesigaba, isigaba kufanele sibe mncane, sibe ngaphansi kuka-25 mm (1 in), noma sincane, ngoba izinqubo zokuqina zidinga ukupholisa okusheshayo kwezinto, ngezinye izikhathi ngaphakathi komzuzwana. Lokhu kunzima ukufeza kuma-workpieces amakhulu, ngakho-ke ezingxenyeni ezinkulu, izindawo ezingaphezulu kuphela ezingaqiniswa. Njengendlela yokwelapha yendawo edumile kanye nenqubo yokulungisa siqinisa iziphethu, izinsimbi zommese, nezinsimbi zokuhlinza phakathi kweminye imikhiqizo eminingi. Izinqubo zamandla aphezulu ziyindlela entsha yokwelashwa kwendawo kanye nezindlela zokuyilungisa. Izakhiwo zezindawo ezingaphezulu ziyashintshwa ngaphandle kokushintsha ubukhulu. Izinqubo zethu ezidumile zokwelapha indawo yamandla aphezulu ziwukwelashwa kwe-electron beam, ukufakwa kwe-ion, nokwelashwa kwe-laser beam. Ukwelashwa kwe-Electron Beam: Ukwelashwa kwe-electronic beam surface kushintsha izakhiwo ezingaphezulu ngokushisisa ngokushesha nokupholisa ngokushesha — ngokulandelana kwe-10Exp6 Centigrade/sec (10exp6 Fahrenheit/sec) endaweni engashoni kakhulu ezizungeze ama-microns angu-100 eduze nendawo ebonakalayo. Ukwelashwa kwe-electron beam nakho kungasetshenziswa ku-hardfacing ukukhiqiza ama-alloys angaphezulu. Ukufakwa kwe-Ion: Lokhu kwelashwa okungaphezulu kanye nendlela yokuguqula kusebenzisa i-electron beam noma i-plasma ukuguqula ama-athomu egesi abe ama-ion anamandla anele, futhi ifake/ifake ama-ion ku-athomu ye-athomu ye-substrate, esheshiswa amakhoyili kazibuthe egumbini le-vacuum. I-vacuum yenza kube lula ukuthi ama-ion ahambe ngokukhululeka ekamelweni. Ukungafani phakathi kwama-ion afakiwe kanye nengaphezulu lensimbi kudala ukukhubazeka kwe-athomu eyenza indawo engaphezulu ibe lukhuni. Ukwelashwa Kwe-Laser Beam: Njengokwelashwa kwe-electron beam surface kanye nokuguqulwa, ukwelashwa kwe-laser beam kushintsha izakhiwo ezingaphezulu ngokufudumeza ngokushesha nokupholisa ngokushesha endaweni engashoni kakhulu eduze kwendawo. Le ndlela yokwelapha nokuguqula ingaphezulu ingasetshenziswa futhi ku-hardfacing ukukhiqiza ama-alloys angaphezulu. Ulwazi Lwemithamo Yokufakelwa kanye nemingcele yokwelapha kwenza kube nokwenzeka ngathi ukuthi sisebenzise lezi zindlela zokwelapha ezingaphezulu kwamandla ezitshalweni zethu zokukhiqiza. Ukwelashwa Kwendawo Yokuhlukanisa Okuncane: I-Ferritic nitrocarburizing iyinqubo yokuqinisa ikesi esakaza i-nitrogen nekhabhoni zibe izinsimbi ezisansimbi emazingeni okushisa angebucayi kakhulu. Izinga lokushisa lokucubungula livamise ukuba ku-565 Centigrade (1049 Fahrenheit). Kulokhu izinga lokushisa ama-steels kanye namanye ama-alloys ayoni asesesigabeni se-ferritic, okuyinzuzo uma kuqhathaniswa nezinye izinqubo zokuqina kwecala ezenzeka esigabeni se-austenitic. Inqubo isetshenziselwa ukuthuthukisa: •ukumelana ne-scuffing •izimpawu zokukhathala •ukumelana nokugqwala Ukuhlanekezela okuncane kakhulu komumo kwenzeka ngesikhathi senqubo yokuqina ngenxa yamazinga okushisa aphansi okucubungula. I-Boronizing, inqubo lapho i-boron yethulwa khona ensimbi noma i-alloy. Kuwukuqina kobuso kanye nenqubo yokuguqulwa lapho ama-athomu e-boron asakazwa khona ebusweni bengxenye yensimbi. Ngenxa yalokho ingaphezulu liqukethe i-borides yensimbi, njenge-iron borides kanye ne-nickel borides. Esimeni sawo esimsulwa lawa ma-boride anobunzima obuphezulu kakhulu nokumelana nokugqoka. Izingxenye zensimbi eziboshiwe zimelana kakhulu nokuguga futhi ngokuvamile zizohlala isikhathi esiphindwe kahlanu kunezingxenye eziphathwa ngokwelashwa okujwayelekile kokushisa okufana nokwenza lukhuni, carburizing, nitriding, nitrocarburizing noma induction hardening. Ukwelashwa Nokulungiswa Kwendawo Enzima Yokuhlukanisa: Uma okuqukethwe kwekhabhoni kuphansi (ngokwesibonelo, ngaphansi kuka-0.25%) singase sikhulise okuqukethwe kwekhabhoni kwendawo ukuze kuqiniswe. Ingxenye ingaphathwa ngokushisa ngokucisha oketshezini noma ipholiswe emoyeni onganyakazi kuye ngezakhiwo ezifunwayo. Le ndlela izovumela kuphela ukuqina kwendawo ebusweni, kodwa hhayi phakathi. Lokhu ngezinye izikhathi kufiseleka kakhulu ngoba kuvumela indawo eqinile enezakhiwo ezinhle zokugqokwa njengakumagiya, kodwa inomongo oqinile wangaphakathi ozokwenza kahle ngaphansi kokulayishwa komthelela. Kwenye yezindlela zokwelapha ezingaphezulu nezindlela zokuguqula, okuyiCarburizing sifaka ikhabhoni phezulu. Sidalula ingxenye emkhathini ocebile weCarbon ezingeni lokushisa eliphezulu futhi sivumele ukusakazeka kudlulisele ama-athomu eKhabhoni ensimbi. Ukusabalalisa kuzokwenzeka kuphela uma insimbi inokuqukethwe kwekhabhoni ephansi, ngoba ukusabalalisa kusebenza kumehluko wesimiso sokugxila. I-Pack Carburizing: Izingxenye zipakishwa endaweni ephakeme ye-carbon medium efana ne-carbon powder futhi zishiswe esithandweni amahora angu-12 kuya kwangu-72 ku-900 Centigrade (1652 Fahrenheit). Kulawa mazinga okushisa kukhiqizwa i-CO gas okuyi-ejenti yokunciphisa enamandla. Ukusabela kokunciphisa kwenzeka ebusweni bensimbi ekhulula ikhabhoni. Ikhabhoni ibe isisakazwa ebusweni ngenxa yokushisa okuphezulu. Ikhabhoni engaphezulu ingu-0.7% kuya ku-1.2% kuye ngezimo zenqubo. Ukuqina okuzuziwe kungu-60 - 65 RC. Ukujula kwekesi le-carburized kusuka cishe ku-0.1 mm kuya ku-1.5 mm. Ukupakisha i-carburizing kudinga ukulawula okuhle kokufana kwezinga lokushisa kanye nokungaguquguquki ekushiseni. I-Gas Carburizing: Kulokhu okuhlukile kokwelashwa okungaphezulu, igesi ye-Carbon Monoxide (CO) inikezwa esithandweni esishisayo futhi ukusabela kokunciphisa ukufakwa kwekhabhoni kwenzeka phezu kwezingxenye. Le nqubo inqoba iningi lezinkinga ze-pack carburizing. Okunye okukhathazayo nokho ukutholakala okuphephile kwegesi ye-CO. I-Liquid Carburizing: Izingxenye zensimbi zicwiliswa kubhavu ocebile ngekhabhoni encibilikisiwe. I-Nitriding iwukwelashwa okungaphezulu kanye nenqubo yokuguqula ehilela ukusakazeka kweNitrojeni ebusweni bensimbi. I-nitrogen yakha ama-Nitrides anezici ezifana ne-Aluminium, i-Chromium, ne-Molybdenum. Izingxenye ziphathwa ngokushisa futhi zishiswe ngaphambi kwe-nitriding. Izingxenye zibe sezihlanzwa futhi zishiselwe esithandweni endaweni ye-ammonia ehlukanisiwe (equkethe u-N no-H) amahora angu-10 kuya kwangu-40 ku-500-625 Centigrade (932 - 1157 Fahrenheit). I-nitrogen isakazeka ensimbi futhi yakhe ama-nitride alloys. Lokhu kungena ekujuleni okungafika ku-0.65 mm. Icala linzima kakhulu futhi ukuhlanekezela kuphansi. Njengoba ikesi lincane, ukugaywa okungaphezulu akunconyiwe ngakho-ke ukwelashwa kwe-nitriding surface kungase kungabi inketho yezindawo ezinezidingo zokuqeda ezibushelelezi. Ukwelashwa kwe-Carbonitriding surface kanye nenqubo yokuguqulwa kulungele kakhulu izinsimbi eziphansi ze-carbon alloy. Enqubweni ye-carbonitriding, kokubili i-Carbon ne-Nitrogen zisakazwa phezulu. Izingxenye zishiselwa emkhathini we-hydrocarbon (njenge-methane noma i-propane) exutshwe ne-Ammonia (NH3). Kalula nje, inqubo iyingxube ye-Carburizing ne-Nitriding. Ukwelashwa kwe-Carbonitriding surface kwenziwa emazingeni okushisa angama-760 - 870 Centigrade (1400 - 1598 Fahrenheit), Bese kucinywa emoyeni wegesi yemvelo (i-Oxygen free). Inqubo ye-carbonitriding ayifanele izingxenye ezinemba okuphezulu ngenxa yokuhlanekezela okungokwemvelo. Ubulukhuni obuzuziwe bufana nokungcwaba (60 - 65 RC) kodwa hhayi phezulu njenge-Nitriding (70 RC). Ukujula kwekesi kuphakathi kuka-0.1 no-0.75 mm. Icala licebile ku-Nitrides kanye ne-Martensite. Ukuthukuthela okulandelayo kuyadingeka ukuze kuncishiswe ama-brittleness. Ukwelashwa okukhethekile kwendawo kanye nezinqubo zokuguqulwa kusezigabeni zokuqala zokukhula futhi ukusebenza kahle kwazo akukakafakazelwa. Kunjalo: I-Cryogenic Treatment: Ngokuvamile isetshenziswa ezinsimbini eziqinile, zipholisa kancane kancane i-substrate ibe cishe -166 Centigrade (-300 Fahrenheit) ukuze kwandiswe ukuminyana kwezinto futhi ngaleyo ndlela kwandise ukumelana nokuguga nokuzinza kobukhulu. Ukwelashwa Ngokudlidliza: Lokhu kuhloswe ukukhulula ingcindezi yokushisa eyakhelwe ekwelapheni ukushisa ngokudlidliza futhi kwandise impilo yokuguga. Ukwelashwa Ngozibuthe: Lokhu kuhloswe ukushintsha ukuhleleka kwama-athomu ezintweni ngozibuthe futhi ngethemba ukuthi kuthuthukise impilo yokuguga. Ukusebenza kwalokhu kwelashwa okukhethekile kwendawo kanye namasu okuguqula kusazofakazelwa. Futhi lezi zindlela ezintathu ezingenhla zithinta impahla eyinqwaba ngaphandle kwezindawo. CLICK Product Finder-Locator Service IKHASI ELIDLULE

Seals - Fittings - Connections - Adaptors - Flanges for Pneumatics Hydraulics and Vacuum - AGS-TECH Inc. Ama-Seals & Fittings & Clamp & Connections & Adapters & Flanges & Quick Couplings Izingxenye ezibalulekile ezinhlelweni ze-pneumatic, hydraulic kanye ne-vacuum YI-SEALS, FITTINGS, CONNECTIONS, ADAPERS, QUICK COUPLINGS, CLAMPS, FLANGES. Ngokuya ngendawo yesicelo, izidingo zezindinganiso, kanye nejometri yendawo yesicelo kunezinhlobonhlobo eziningi zale mikhiqizo etholakala kalula esitokweni sethu. Ngakolunye uhlangothi, kumakhasimende anezidingo ezikhethekile kanye nezidingo siyizigxivizo zokukhiqiza ngokwezifiso, okokufakwayo, ukuxhumana, ama-adaptha, ama-clamp nama-flange kuwo wonke ama-pneumatics, ama-hydraulic kanye ne-vacuum engenzeka. Uma izingxenye ezingaphakathi kwesistimu ye-hydraulic zingadingeki ukuthi zisuswe, singavele siqine noma sishise ukuxhumana. Kodwa-ke, akunakugwenywa ukuthi uxhumo kufanele lwephulwe ukuvumela ukuseviswa nokushintshwa, ngakho okokufakwayo okususwayo nokuxhumana kuyisidingo samasistimu asebenzisa amanzi, umoya kanye ne-vacuum. Ukufakwa kuqinisa uketshezi ngaphakathi kwezinhlelo ezisebenza ngogesi ngendlela eyodwa kwezimbili: IZINTO ZONKE-ZEMETAL zincike ekuthinteni kwensimbi kuya kwensimbi, kuyilapho i-O-RING TYPE FITTINGS incike ekucindezeleni uphawu lwe-elastomeric. Kuzo zombili izimo, ukuqinisa izintambo phakathi kwama-halves okukhwelana okulingana noma phakathi kokulingana kanye nengxenye kuphoqa izindawo ezimbili zokukhwelana zihlangane ukuze zakhe uphawu lokucindezela okukhulu. IZINTO ZONKE-ZEMETALI: Imicu ekufakweni kwamapayipi iyacishwa futhi incike ekucindezelweni okukhiqizwa ngokuphoqa imicu ecijile yengxenye yesilisa yokufaka engxenyeni yowesifazane. Imicu yamapayipi ijwayele ukuvuza ngoba izwela i-torque. Ukuqinisa kakhulu ukufakwa kwensimbi yonke kuhlanekezela izintambo kakhulu futhi kudala indlela yokuvuza ezungeze izintambo zokufakwa. Izintambo zamapayipi ezifakwe kuzo zonke insimbi nazo zijwayele ukuxega uma zichayeke ekudlidlizeni kanye noguquko olubanzi lwezinga lokushisa. Imicu yepayipi kokufakwayo iyacishwa, ngakho-ke ukuhlanganisa okuphindaphindiwe nokuhlakazwa kwezinto ezifakelwe kubhebhethekisa izinkinga zokuvuza ngokuhlanekezela izintambo. Ukufakwa kohlobo lwe-Flare kuphakeme kunokufakwa kwamapayipi futhi cishe kuzohlala kuwumklamo okhethwayo osetshenziswa ezinhlelweni ezisebenza ngamanzi. Ukuqiniswa kwentongomane kudonsela okokufakwa ekugcineni kweshubhu, okuholela ekuvaleni okuhle phakathi kobuso beshubhu elivuthayo kanye nomzimba owufanele. Ukufakwa kwe-flare engu-37 degree yakhelwe ukusetshenziswa ngodonga oluncane kuya kogqinsi olumaphakathi ezinhlelweni ezinomfutho wokusebenza ofika ku-3,000 psi kanye namazinga okushisa asuka ku- -65 kuya ku-400 F. Ngenxa yokuthi amashubhu anodonga oluwugqinsi kunzima ukwakha ukukhiqiza ukuvuleka, ayinconywa ukuthi isetshenziswe ngokufakwa kwe-flare. Iminyene kakhulu kunezinye izinto eziningi futhi ingashintshwa kalula ibe yi-metric tubing. Itholakala kalula futhi ingenye eyonga kakhulu. Ukufakwa okungenamlilo, kancane kancane kuthola ukwamukelwa okubanzi, ngoba kudinga ukulungiswa okuncane kweshubhu. Ukufakwa okungaqhumeki kusingatha ukucindezela okumaphakathi kokusebenza koketshezi kufika ku-3,000 psi futhi kubekezelela ukudlidliza kunezinye izinhlobo zokufakwa kwensimbi yonke. Ukuqinisa inadi lokulinganisa emzimbeni kudonsela i-ferrule emzimbeni. Lokhu kucindezela i-ferrule ezungeze ishubhu, okubangela ukuthi i-ferrule ithinte, bese ingena endaweni engaphandle ye-tube, idale uphawu oluhle. Izinto ezifakwayo ezingenamlilo zidinga ukusetshenziswa ngamashubhu aphakathi nendawo noma anodonga oluwugqinsi. IZILUNGISELELO ZOKUFAKELWA KOHLOBO LWE-O-RING: Ukufakwa kusetshenziswa izindandatho ze-O ekuxhumekeni okungavuziki kuyaqhubeka nokwamukelwa abaklami bemishini. Izinhlobo ezintathu eziyisisekelo ziyatholakala: Okufakwayo kwe-SAE straight-ring O-ring boss, face seal noma flat-face O-ring (OFFOR) nokufakwa kwe-O-ring flange. Ukukhetha phakathi komphathi we-O-ring kanye nokufakwa kwe-FFOR kuvame ukuncika ezintweni ezifana nendawo efanelekile, ukucaciswa kwe-wrench...njll. Izixhumanisi ze-Flange ngokuvamile zisetshenziswa namashubhu anobubanzi obungaphandle obukhulu kuno-7/8-intshi noma izinhlelo zokusebenza ezibandakanya izingcindezi eziphezulu kakhulu. Ukufakwa kwe-O-ring boss kubeka i-O-ring phakathi kwentambo namaflethi e-wrench azungeze ububanzi obungaphandle (OD) bengxenye yesilisa yesixhumi. Isivalo esiqinile esingavuzi sakhiwa ngokumelene nesihlalo esinomshini ethekwini labesifazane. Kunamaqembu amabili okufakwa komphathi we-O-ring: ukufakwa okulungisekayo nokungalungiseki. Ukufakwa kwe-O-ring boss okungalungiseki noma okungalawuleki kuhlanganisa amapulaki nezixhumi. Lezi zivele zijijwe embobeni, futhi akukho ukuqondanisa okudingekayo. Ukufakwa okulungisekayo ngakolunye uhlangothi, okufana nezindololwane nama tee, kudinga ukuqondiswa endaweni ethile. Umehluko oyisisekelo wokuklama phakathi kwezinhlobo ezimbili zokufakwa komphathi we-O-ring wukuthi amapulagi nezixhumi azinawo ama-locknuts futhi awadingi iwasha eyisipele ukuze kuvalwe kahle ukujoyina. Zincike endaweni yazo ene-annular evulekile ukuze zisunduze indandatho ye-O endaweni yotywino ecijile yechweba futhi zicindezele indandatho ye-O ukuze ivale uxhumano. Ngakolunye uhlangothi, ukufakwa okulungisekayo kugoqwa elungeni lokukhwelana, kuqondiswe lapho kudingekile, futhi kukhiyelwe endaweni lapho i-locknut iqiniswa. Ukuqinisa i-locknut kuphinde kuphoqe iwasha eyisipele esithunjiwe ukuthi ingene kuyi-O-ring, eyenza uphawu olungavuzi. Ukuhlangana kuhlala kubikezelwa, ochwepheshe badinga kuphela ukuqinisekisa ukuthi iwasha eyisipele ihlezi ngokuqinile endaweni yobuso bechweba lapho ukuhlanganisa kuqedwa nokuthi iqiniswe kahle. Ukufakwa kwe-FFOR kwakha uphawu phakathi kwendawo eyisicaba neqediwe engxenyeni yesifazane kanye nendandatho ye-O ebanjwe endaweni eyindilinga engxenyeni yesilisa. Ukuphendulela inadi elicushiwe elithunjiwe engxenyeni yesifazane kudonsa amahhafu amabili ndawonye ngenkathi kucindezela i-O-ring. Ukufakwa ngezimpawu ze-O-ring kunikeza izinzuzo ezithile ngaphezu kokufakwa kwensimbi kuya kwensimbi. Ukufakwa kwe-all-metal kulula kakhulu ukuvuza ngenxa yokuthi kufanele kuqiniswe phakathi kwebanga le-torque eliphakeme kakhulu, kodwa elincanyana. Lokhu kwenza kube lula ukuhlubula izintambo noma ukuqhekeka noma ukuhlanekezela izingxenye ezifayo, okuvimbela ukuvaleka okufanele. I-rubber-to-metal seal ekufakweni kwe-O-ring ayihlanekezeli noma yiziphi izingxenye zensimbi futhi inikeza ukuzwa eminweni yethu uma uxhumano luqinile. Ukufakwa kwensimbi yonke kuyaqina kancane kancane, ngakho ochwepheshe bangase bakuthole kunzima kakhulu ukuthola lapho uxhumo luqinile ngokwanele kodwa lungaqinile kakhulu. Okubi ukuthi ukufakwa kwe-O-ring kubiza kakhulu kunokufakwa kwensimbi yonke, futhi kufanele kuqashelwe ngesikhathi sokufakwa ukuze kuqinisekiswe ukuthi i-O-ring ayiwa noma yonakale lapho ama-assemblies exhunywa. Ngaphezu kwalokho, ama-O-ring awashintsheki kukho konke ukuhlanganisa. Ukukhetha i-O-ring engalungile noma ukusebenzisa kabusha elonakele noma elimele kungase kubangele ukuvuza kokufakwayo. Uma i-O-ring isisetshenzisiwe ekulinganisweni, ayiphinde isetshenziswe, nakuba ingase ibonakale ingenakho ukuhlanekezela. I-FLANGES: Sinikeza ama-flange ngawodwana noma njengesethi ephelele yezinhlelo zokusebenza eziningi ngebanga losayizi nezinhlobo. Amasheya agcinwa ama-Flanges, ama-Counter-flanges, ama-flange angama-90 degree, ama-Split flanges, ama-Flange anezintambo. Ukufakwa kwamashubhu amakhulu kuno-1-in. I-OD kufanele iqiniswe ngama-hexnuts amakhulu adinga isikrufu esikhulu ukuze kufakwe i-torque eyanele ukuze kuqiniswe okokufaka kahle. Ukuze kufakwe izinto ezinkulu ezinjalo, isikhala esidingekayo sidinga ukunikezwa izisebenzi zokushwiba ama-wrenches amakhulu. Amandla esisebenzi nokukhathala kungase kuthinte ukuhlangana okufanele. Izandiso ze-wrench zingadingeka ukuze abanye abasebenzi basebenzise inani elisebenzayo letorque. Ukufakwa kwe-Split-flange kuyatholakala ukuze banqobe lezi zinkinga. Ukufakwa kwe-split-flange kusebenzisa i-O-ring ukuvala ilunga futhi kuqukethe uketshezi olucindezelwe. I-Elastomeric O-ring ihlala esikhaleni ku-flange futhi ihlangana nendawo eyisicaba ethekwini - ilungiselelo elifana ne-FFOR fitting. I-O-ring flange inamathiselwe embobeni kusetshenziswa amabhawodi amane afakwayo aqinisa phansi kuma-clamp e-flange. Lokhu kuqeda isidingo sama-wrenches amakhulu lapho uxhuma izingxenye ezinobubanzi obukhulu. Uma ufaka ukuxhumana kwe-flange, kubalulekile ukufaka ngisho ne-torque kumabhawodi amane e-flange ukuze ugweme ukudala igebe lapho i-O-ring ingaphuma ngaphansi kwengcindezi ephezulu. Ukufakwa kwe-split-flange ngokuvamile kuhlanganisa izakhi ezine: ikhanda elivulekile elixhunywe unomphela (ngokuvamile elishiselwe noma elishiswe ngensimbi) eshubhuni, i-O-ring engena emgodini owenziwe ngomshini ekugcineni kwe-flange, kanye nama-halves amabili okubambana amabhawodi afanele ukuxhuma umhlangano we-split-flange endaweni yokukhwelana. Ama-halves okubamba awahlanganisi izindawo zokukhwelana. Umsebenzi obalulekile ngesikhathi sokuhlanganisa i-split-flange efanelana nendawo yayo yokukhwelana ukwenza isiqiniseko sokuthi amabhawodi amane okubopha aqiniswa kancane kancane futhi ngokulinganayo ephethinini ephambanayo. AMA-CLAMPS: Izinhlobonhlobo zezixazululo zokubopha zepayipi neshubhu ziyatholakala, ezinobuso obungaphakathi obunephrofayili noma obushelelezi ngebanga elibanzi losayizi. Zonke izingxenye ezidingekayo zingahlinzekwa ngokuya ngohlelo oluthile oluhlanganisa, imihlathi ye-Clamp, ama-Bolts, ama-stacking bolts, amapuleti we-Weld, amapuleti aphezulu, umzila wesitimela. Izinsimbi zethu ezisebenza nge-hydraulic kanye ne-pneumatic zinika amandla ukufakwa okusebenza kahle, okuholela ekuhlelweni kwamapayipi ahlanzekile, okudlidliza okusebenzayo kanye nokunciphisa umsindo. Imikhiqizo ye-AGS-TECH ye-hydraulic kanye ne-pneumatic clamping iqinisekisa ukuphindaphinda kokubopha kanye namandla okubamba angaguquki ukuze kugwenywe ukunyakaza kwengxenye nokuphuka kwamathuluzi. Sigcina izinhlobonhlobo zezingxenye zokubopha (intshi kanye nemethrikhi), ukunemba okungu-7 MPa (amabha angu-70) amasistimu okubamba amanzi angaphansi komhlaba kanye namadivayisi okubamba umoya wezinga lochwepheshe. Imikhiqizo yethu ye-hydraulic clamping ikalwe ngengcindezi yokusebenza ye-psi engu-5,000 engabamba ngokuvikelekile izingxenye ezinhlelweni eziningi ezisukela ezimotweni kuye ekushiseleni, futhi kusukela kubathengi kuya ezimakethe zezimboni. Ukukhetha kwethu amasistimu okubamba umoya we-pneumatic kuhlinzeka ngokubamba okuqhutshwa komoya ezindaweni zokukhiqiza okuphezulu kanye nezinhlelo zokusebenza ezidinga amandla okubamba angaguquki. Ama-clamp we-pneumatic asetshenziselwa ukubamba kanye nokulungiswa ekuhlanganiseni, ekukhiqizeni imishini, ekukhiqizeni amapulasitiki, e-automation kanye nezinhlelo zokushisela. Singakusiza ukuthi unqume izixazululo zokubamba umsebenzi ngokusekelwe kusayizi wengxenye yakho, inani lamandla okubamba adingekayo nezinye izici. Njengomkhiqizi wangokwezifiso ohluke kakhulu emhlabeni, uzakwethu okhipha umsebenzi kanye nesididiyeli sobunjiniyela, singakuklama futhi sikukhiqizele izinsimbi zomoya kanye ne-hydraulic. AMA-ADAPTERS: I-AGS-TECH inikeza ama-adaptha ahlinzeka ngezixazululo zamahhala ezivuzayo. Ama-adaptha afaka i-hydraulic, i-pneumatic & instrumentation. Ama-adaptha ethu akhiwe ukuze ahlangabezane noma adlule izimfuneko zezindinganiso zezimboni ze-SAE, ISO, DIN, DOT kanye ne-JIS. Izinhlobonhlobo zezitayela ze-adaptha ziyatholakala ezihlanganisa: Ama-adaptha e-Swivel, Ama-adaptha epayipi lensimbi ne-Stainless Steel kanye nokufakwa kwezimboni, ama-adaptha epayipi le-Brass, okokufaka kwe-Brass kanye ne-Plastiki yezimboni, ama-Adapter Okuhlanzeka Okuphezulu kanye Nezinqubo, Ama-Angled Flare Adapter. UKUXHUMANA OKUSHESHAYO: Sinikeza ukuxhuma okusheshayo / ukunqamula ama-couplings wezinhlelo zokusebenza ze-hydraulic, pneumatic kanye nezokwelapha. Ama-couplings anqamula ngokushesha asetshenziselwa ukuxhuma nokunqamula imigqa ye-hydraulic noma ye-pneumatic ngokushesha futhi kalula ngaphandle kokusebenzisa noma yimaphi amathuluzi. Amamodeli ahlukahlukene ayatholakala: Ama-couplings angachitheki futhi avale kabili, Xhuma ngaphansi kwengcindezi ama-couplings asheshayo, ama-Thermoplastic asheshayo ama-couplings, Ama-couplings asheshayo echweba lokuhlola, ama-coupling asheshayo ezolimo,….nokunye okwengeziwe. IZIMPAWU: Izigxivizo ze-hydraulic kanye ne-pneumatic ziklanyelwe ukunyakaza okuphindaphindayo okuvamile ekusetshenzisweni kwe-hydraulic kanye ne-pneumatic, njengamasilinda. Izimpawu ze-Hydraulic kanye ne-pneumatic zihlanganisa ama-Piston seal, ama-Rod seal, ama-U-cups, i-Vee, i-Cup, i-W, i-Piston, i-Flange packings. Ama-Hydraulic seals aklanyelwe izinhlelo zokusebenza eziguquguqukayo ezinomfutho ophezulu onjengamasilinda asebenza nge-hydraulic. Izigxivizo ze-pneumatic zisetshenziswa kumasilinda womoya kanye nama-valve futhi ngokuvamile zenzelwe ukucindezela okuphansi kokusebenza uma kuqhathaniswa nezimpawu ze-hydraulic. Izinhlelo zokusebenza ze-pneumatic zidinga isivinini esingaphezulu nokho sokusebenza okuphezulu kanye nezigxivizo eziphansi zokungqubuzana uma kuqhathaniswa nezinhlelo zokusebenza zamanzi. Izigxivizo zingasetshenziselwa ukunyakaza okujikelezayo nokuphindaphindayo. Amanye ama-hydraulic seal kanye ne-pneumatic seals ayinhlanganisela futhi anezingxenye ezimbili noma eziningi ezakhiwe njengeyunithi ebalulekile. Isigxivizo esijwayelekile esiyinhlanganisela siqukethe iringi ye-PTFE ebalulekile kanye neringi ye-elastomer, ehlinzeka ngezici zeringi ye-elastomeric enobuso obusebenzayo obuqinile, obuphansi (PTFE). Izimpawu zethu zingaba nezinhlobonhlobo zezigaba ezihlukene. Ukuma kokuvala okujwayelekile kanye nezikhombisi-ndlela ze-hydraulic kanye ne-pneumatic seal zihlanganisa 1.) Izinsimbi ze-Rod eziyi-radial seal. Isigxivizo sicindezelwa-singene kubhore yezindlu lapho udebe oluvalayo luthinta shaft. Futhi kubizwa ngokuthi i-shaft seal. 2.) Ama-piston seal angama-radial seal. Isigxivizo singena ku-shaft enodebe oluvalayo oluthinta ibhore lendlu. Izindandatho ze-V zibhekwa njengezimpawu zomlomo wangaphandle, i-3.) Izimpawu ze-Symmetric ziyi-symmetrical futhi zisebenza ngokulinganayo njengenduku noma uphawu lwe-piston, 4.) I-axial seal ivala i-axially ngokumelene nendlu noma ingxenye yomshini. Isiqondiso sokuvala sihambisana nezimpawu ze-hydraulic kanye ne-pneumatic ezisetshenziswa ezinhlelweni ezinokunyakaza kwe-axial, njengamasilinda namapiston. Isenzo singaba esisodwa noma kabili. Ama-Single acting, noma ama-unidirectional seal, anikeza uphawu olusebenzayo endaweni eyodwa ye-axial kuphela, kuyilapho ama-double acting, noma ama-bi-directional seal, asebenza kahle uma kuvalwa kuzo zombili izinkomba. Ukuze uvale kuzo zombili izinkomba zokunyakaza okuhambisanayo, kufanele kusetshenziswe uphawu olungaphezu kolulodwa. Izici zezimpawu ze-hydraulic kanye ne-pneumatic zifaka ukulayishwa kwentwasahlobo, i-wiper ebalulekile, ne-split seal. Ezinye izilinganiso ezibalulekile okufanele zicatshangelwe lapho ucacisa izimpawu ze-hydraulic kanye ne-pneumatic yilezi: • I-shaft diameter yangaphandle noma vala i-diameter yangaphakathi • I-diameter ye-bore yezindlu noma i-diameter yangaphandle • I-axial cross section noma ukujiya • I-radial cross section Imingcele yesevisi ebalulekile okufanele icatshangelwe lapho uthenga izigxivizo yilezi: • Isivinini esikhulu sokusebenza • Ingcindezi yokusebenza ephezulu • Isilinganiso se-vacuum • Izinga lokushisa lokusebenza Izinketho zezinto ezibonakalayo ezidumile zezinto zokuvala irabha zama-hydraulic kanye ne-pneumatics zihlanganisa: • I-Ethylene Acrylic • Irabha ye-EDPM • I-Fluoroelastomer ne-Fluorosilicone • I-Nitrile • Inayiloni noma iPolyamide • I-Polychloroprene • I-Polyoxymethylene • I-Polytetrafluoroethylene (PTFE) • I-polyurethane / Urethane • Irabha Yemvelo Ezinye izinketho ze-seal material yilezi: • I-Sintered Bronze • Insimbi engagqwali • Insimbi • Ngezwa • Isikhumba Amazinga ahlobene nezimpawu yilawa: I-BS 6241 - Ukucaciswa kobukhulu bezindlu zezimpawu ze-hydraulic ezihlanganisa izindandatho eziveza izinhlelo zokusebenza eziphindaphindayo I-ISO 7632 Izimoto zomgwaqo - Izimpawu ze-elastomeric I-GOST 14896 - Izimpawu ze-Rubber U-packing zamadivayisi we-hydraulic Ungadawuniloda izincwajana zomkhiqizo ezifanele kuzixhumanisi ezingezansi: I-Pneumatic Fittings I-Pneumatic Air Tubing Connectors Ama-adaptha Ama-Couplings Ama-Splitters Nezesekeli Ulwazi ngesikhungo sethu esikhiqiza i-ceramic kuya kokufakwa kwensimbi, ukuvalwa kwe-hermetic, i-vacuum feedthroughs, i-vacuum ephezulu nephezulu kanye nezingxenye zokulawula uketshezi ingatholakala lapha: Ibhukwana le-Fluid Control Factory CLICK Product Finder-Locator Service IKHASI ELIDLULE

Display - Touchscreen - Monitors - LED - OLED - LCD - PDP - HMD - VFD - ELD - SED - Flat Panel Displays - AGS-TECH Inc. Isibonisi & Isikrini esithintwayo & Gada Ukukhiqiza kanye Nokuhlanganisa Sinikeza: • Izibonisi ngokwezifiso ezihlanganisa i-LED, i-OLED, i-LCD, i-PDP, i-VFD, i-ELD, i-SED, i-HMD, i-Laser TV, isibonisi sephaneli eliyisicaba lobukhulu obudingekayo kanye nokucaciswa kwe-electro-optic. Sicela uchofoze umbhalo ogqanyisiwe ukuze ulande izincwajana ezihambisanayo zesibonisi sethu, isikrini esithintwayo, nokuqapha imikhiqizo. Amaphaneli wokubonisa we-LED Amamojula we-LCD Landa incwajana yethu ye-TRu Multi-Touch Monitors. Lo mugqa womkhiqizo wokuqapha uqukethe uhla lwedeskithophu, uhlaka oluvulekile, ulayini omncane kanye nefomethi enkulu yokuboniswa kokuthinta okuningi - ukusuka ku-15” ukuya ku-70''. Yakhelwe ikhwalithi, ukusabela, ukukhanga okubonakalayo, nokuqina, i-TRu Multi-Touch Monitors ihambisana nanoma yisiphi isisombululo esisebenzisanayo sokuthinta okuningi. Chofoza lapha ukuze uthole amanani Uma ungathanda ukuba namamojula e-LCD aklanywe ngokukhethekile futhi enziwe ngokwezidingo zakho, sicela ugcwalise futhi usithumele i-imeyili: Ifomu lokuklama ngokwezifiso lamamojula e-LCD Uma ungathanda ukuba namaphaneli e-LCD aklanywe ngokukhethekile futhi enziwe ngokwezidingo zakho, sicela ugcwalise futhi usithumele i-imeyili: Ifomu lokuklama ngokwezifiso lamaphaneli e-LCD • Isikrini esithintwayo ngokwezifiso (njenge-iPod) • Phakathi kwemikhiqizo eyenziwe ngonjiniyela bethu yile: - Isiteshi sokulinganisa okungafaniyo semibukiso ye-liquid crystal. - Isiteshi sekhompuyutha esigxilisa amalensi okubuka umabonakude Amaphaneli / Izibonisi izikrini ze-elekthronikhi ezisetshenziselwa ukubuka idatha kanye/noma ihluzo futhi zitholakala ngamasayizi nobuchwepheshe obahlukahlukene. Nazi izincazelo zamagama afushanisiwe ahlobene nesibonisi, isikrini esithintwayo kanye namadivayisi okuqapha: I-LED: I-Light Emitting Diode I-LCD: Isibonisi se-Liquid Crystal I-PDP: Iphaneli yokubonisa yePlasma I-VFD: Isibonisi se-Vacuum Fluorescent I-OLED: I-Organic Light Emitting Diode I-ELD: Isibonisi se-Electroluminescent I-SED: Isibonisi se-Surface-conduction Electron-emitter I-HMD: Isibonisi Esifakwe Ekhanda Inzuzo enkulu yesibonisi se-OLED phezu kwesibonisi se-liquid crystal (LCD) ukuthi i-OLED ayidingi ukukhanya kwangemuva ukuze isebenze. Ngakho-ke isibonisi se-OLED sidonsa amandla amancane kakhulu futhi, uma sinikwa amandla ebhethri, singasebenza isikhathi eside uma siqhathaniswa ne-LCD. Ngenxa yokuthi asikho isidingo se-backlight, isibonisi se-OLED singaba sincane kakhulu kunephaneli ye-LCD. Kodwa-ke, ukucekelwa phansi kwezinto ze-OLED kukhawulele ukusetshenziswa kwazo njengesibonisi, isikrini esithintwayo kanye nokuqapha. I-ELD isebenza ngama-athomu ajabulisayo ngokudlula amandla kagesi kuwo, futhi ibangele i-ELD ikhiphe ama-photon. Ngokushintsha izinto ezijatshuliswayo, umbala wokukhanya okhishiwe ungashintshwa. I-ELD yakhiwe kusetshenziswa imichilo ye-electrode eyisicaba, e-opaque egijima ngokuhambisana, embozwe ungqimba lwempahla ye-electroluminescent, ilandelwa olunye ungqimba lwama-electrode, olugijima ngokuhambisana nongqimba olungezansi. Isendlalelo esiphezulu kufanele sikhanye ukuze sivumele ukukhanya kudlule futhi kubaleke. Ezimpambanweni zomgwaqo ngamunye, izibani ezibonakalayo, ngaleyo ndlela zidale iphikseli. Ama-ELD kwesinye isikhathi asetshenziswa njengezibani zangemuva kuma-LCDs. Ziwusizo futhi ekudaleni ukukhanya okuzungezile okuthambile, kanye nezikrini ezinombala ophansi, ezihluke kakhulu. I-surface-conduction electron-emitter display (SED) ubuchwepheshe bokubonisa obuyisicaba obusebenzisa ama-electron conduction emitters angaphezulu kwephikseli ngayinye yokubonisa. I-surface conduction emitter ikhipha ama-electron ajabulisa ukunamathela kwe-phosphor kuphaneli yokubonisa, efana namathelevishini e-cathode ray tube (CRT). Ngamanye amazwi, ama-SED asebenzisa amashubhu emisebe ye-cathode engemuva kwephikseli ngalinye esikhundleni seshubhu elilodwa kuso sonke isibonisi, futhi angahlanganisa ifomu elincane lama-LCD nemibukiso ye-plasma nama-engeli wokubuka aphakeme, umehluko, amazinga amnyama, incazelo yombala namaphikseli. isikhathi sokuphendula sama-CRT. Kuyafunwa futhi ukuthi ama-SED asebenzisa amandla amancane kunezibonisi ze-LCD. Isibonisi esibekwe ekhanda noma isibonisi esifakwe ku-Helmet, kokubili esifushanisiwe 'i-HMD', iyithuluzi lokubonisa, eligqokwa ekhanda noma njengengxenye yesigqoko sokuzivikela, esinombono omncane wokubonisa phambi kweso elilodwa noma ngalinye. I-HMD evamile inesibonisi esisodwa noma ezimbili ezincane ezinamalensi nezibuko ezibonisa ngale ezishumekwe kusigqoko, izibuko zamehlo noma i-visor. Amayunithi esibonisi mancane futhi angafaka i-CRT, i-LCDs, i-Liquid Crystal ku-Silicon, noma i-OLED. Kwesinye isikhathi kusetshenziswa imibukiso emincane eminingi ukuze kukhuliswe ukucaca okuphelele kanye nenkundla yokubuka. Ama-HMD ayahluka ngokuthi angakwazi ukubonisa isithombe esenziwe ngekhompuyutha (CGI), abonise izithombe ezibukhoma ezivela emhlabeni wangempela noma inhlanganisela yakho kokubili. Ama-HMD amaningi abonisa kuphela isithombe esenziwe ngekhompuyutha, ngezinye izikhathi esibizwa ngokuthi isithombe esibonakalayo. Amanye ama-HMD avumela ukuphakamisa i-CGI ekubukeni komhlaba wangempela. Lokhu ngezinye izikhathi kubizwa ngokuthi ngokoqobo ukungathandwa kwabathelisi esikubona noma iqiniso elixubile. Ukuhlanganisa ukubuka komhlaba wangempela ne-CGI kungenziwa ngokuveza i-CGI ngesibuko esibonisa ingxenye kanye nokubuka umhlaba wangempela ngokuqondile. Ukuze uthole izibuko ezibonisa kancane, hlola ikhasi lethu kokuthi I-Passive Optical Components. Le ndlela ivame ukubizwa nge-Optical See-Through. Ukuhlanganisa ukubuka komhlaba wangempela ne-CGI kungenziwa futhi nge-elekthronikhi ngokwamukela ividiyo evela kukhamera bese uyixuba nge-elektroniki ne-CGI. Le ndlela ivame ukubizwa nge-Video See-Through. Izinhlelo zokusebenza ezinkulu ze-HMD zifaka ezempi, zikahulumeni (umlilo, amaphoyisa, njll.) kanye nezomphakathi/ezohwebo (umuthi, imidlalo yevidiyo, ezemidlalo, njll.). Amasosha, amaphoyisa kanye nabacimi bomlilo basebenzisa ama-HMD ukuze babonise ulwazi lwamaqhinga olufana namamephu noma idatha yokuthwebula eshisayo ngenkathi bebuka isigameko sangempela. Ama-HMD adidiyelwe ezindlini zokusebenzela zezindiza ezinophephela emhlane nezindiza zokulwa. Ahlanganiswe ngokugcwele nesigqoko sokuzivikela endizayo somshayeli wendiza futhi angase ahlanganise ama-visors okuvikela, amathuluzi okubona ebusuku kanye nezibonisi zezinye izimpawu nolwazi. Onjiniyela nososayensi basebenzisa ama-HMD ukuze banikeze imibono eyi-stereoscopic yezinhlelo ze-CAD (Computer Aided Design). Lezi zinhlelo ziphinde zisetshenziswe ekunakekeleni izinhlelo eziyinkimbinkimbi, njengoba zinganikeza uchwepheshe ''umbono we-x ray'' ngempumelelo ngokuhlanganisa izithombe zekhompuyutha ezifana nemidwebo yesistimu nemifanekiso nombono wemvelo kachwepheshe. Kukhona futhi izinhlelo zokusebenza ekuhlinzeni, lapho inhlanganisela yedatha ye-radiographic (izikena ze-CAT ne-MRI imaging) ihlanganiswa nombono wemvelo kadokotela ohlinzayo wokuhlinza. Izibonelo zamadivayisi e-HMD abiza kancane angabonwa ngemidlalo ye-3D nezinhlelo zokusebenza zokuzijabulisa. Amasistimu anjalo avumela abaphikisi 'ababonakalayo' ukuthi balunguze kumafasitela wangempela njengoba umdlali ehambahamba. Okunye ukuthuthukiswa okuthokozisayo ekuboniseni, isikrini esithintwayo kanye nobuchwepheshe bokuqapha i-AGS-TECH inentshisekelo kukho: I-Laser TV: Ubuchwepheshe bokukhanyisa nge-laser buhlale bubiza kakhulu ukuthi bungasetshenziswa emikhiqizweni yabathengi ekwazi ukuhwebelana futhi buntekenteke kakhulu ekusebenzeni ukuze kushintshwe izibani ngaphandle kwamanye amaphrojektha asezingeni eliphezulu angajwayelekile. Muva nje, izinkampani zibonise umthombo wazo wokukhanya we-laser wezibonisi zokuqagela kanye ne-prototype ekhombisayo ngemuva ''i-laser TV''. I-TV yokuqala yezohwebo ye-Laser futhi kamuva eminye seyembuliwe. Izithameli zokuqala eziboniswe iziqeshana eziyisithenjwa ezivela kumamuvi adumile zibike ukuthi zishaywe umoya ngamandla e-Laser TV angakaze abonwe kuze kube manje okubonisa imibala. Abanye abantu baze bayichaze ngokuthi ishube kakhulu ize ibonakale ingeyokwenziwa. Obunye ubuchwepheshe bokubonisa obuzayo buzofaka phakathi ama-carbon nanotubes nezibonisi ze-nanocrystal zisebenzisa amachashazi e-quantum ukwenza izikrini ezinempilo neziguquguqukayo. Njengenjwayelo, uma usinikeza imininingwane yesidingo sakho nohlelo lokusebenza, singakuklama futhi senze ngendlela oyifisayo izibonisi, izikrini zokuthinta kanye neziqapha. Chofoza lapha ukuze ulande incwajana yethu ye-Panel Meters - OICASCHINT Dawuniloda incwajana yethu KALA UHLELO LOKUBAMBISANA Ulwazi olwengeziwe ngomsebenzi wethu wobunjiniyela lungatholakala ku-: http://www.ags-engineering.com CLICK Product Finder-Locator Service IKHASI ELIDLULE

AGS-TECH Inc., Molding, Casting, Machining, Forging, Sheet Metal Fabrication, Mechanical Electrical Electronic Optical Assembly, PCBA, Powder Metallurgy, CNC AGS-TECH Inc. AGS-TECH Inc. Custom Manufacturing, Domestic & Global Outsourcing, Engineering Integration, Consolidation AGS-TECH Inc. 1/2 I-AGS-TECH, Inc. ingeyakho: Umkhiqizi Wangokwezifiso Womhlaba Wonke, Umdidiyeli, Umdidiyeli, Uzakwethu Wokuhwebelana Kwemikhiqizo Namasevisi Ezinhlobonhlobo. Singumthombo wakho wokuma okukodwa wokukhiqiza, ukwakhiwa, ubunjiniyela, ukuhlanganiswa, ukukhishwa kwemikhiqizo eyenziwe ngokwezifiso kanye nengaphandle kweshalofu. SERVICES: Ukukhiqiza Ngokwezifiso Ukukhiqiza Kwezinkontileka Zasekhaya Nomhlaba Wonke Ukukhiqiza Kwangaphandle Ukuthengwa Kwempahla Yasekhaya Nomhlaba Wonke Consolidation Ukuhlanganiswa Kobunjiniyela MAYELANA ne-AGS-TECH, Inc. - Umkhiqizi Wakho Womhlaba Wonke, Umdidiyeli Wobunjiniyela, Umdidiyeli, Uzakwethu Wokuhwebelana I-AGS-TECH Inc. ingumkhiqizi, umdidiyeli wobunjiniyela, umphakeli womhlaba wonke wemikhiqizo yezimboni okuhlanganisa isikhunta, ipulasitiki ebunjiwe kanye nezingxenye zenjoloba, ukusakaza, ama-extrusions, ukwakhiwa kweshidi lensimbi, isitembu sensimbi & ukukha, imishini ye-CNC, izakhi zomshini, i-powder metallurgy,i-ceramic & ukwakhiwa kwengilazi, ucingo / ukwakhiwa kwentwasahlobo, ukuhlanganisa & ukuhlanganisa & izixhumi, ukwakhiwa okungajwayelekile, i-microfabrication, okokugcotshwa kwe-nanotechnology & ifilimu elincanyana,izinto zikagesi ezenziwe ngokwezifiso nezisetshenziswa zikagesi & ama-assemblies & PCB & PCBA & nentambo yokuhlanganisa, i-optical & fibre optic components & assembly ,imishini yokuhlola & ye-metrology efana nezihloli zokuqina, ama-microscopes ensimbi, izithonjana zephutha ze-ultrasonic, amakhompyutha ezimboni, amasistimu ashumekiwe, i-automation & panel ye-PC, amakhompyutha ebhodi elilodwa, okokusebenza kokulawula ikhwalithi. Ngaphandle kwemikhiqizo, enobunjiniyela bethu bomhlaba wonke, ubunjiniyela obuhlanekezelwe, ucwaningo nokuthuthukiswa, ukuthuthukiswa komkhiqizo, ukukhiqiza okungeziwe nokusheshayo, i-prototyping, amakhono okuphatha iphrojekthi sikunikeza ngosizo lwezobuchwepheshe, okokusebenza kanye nebhizinisi ukuze sikwenze uqhudelane futhi uphumelele ezimakethe zomhlaba. Umgomo wethu ulula: Ukwenza amakhasimende ethu aphumelele futhi akhule. Kanjani ? Ngokuhlinzeka 1.) Ikhwalithi Engcono 2.) Intengo Engcono 3.) Ukulethwa Okungcono........ konke okuvela enkampanini eyodwa kanye nomdidiyeli womhlaba wonke wobunjiniyela obuhlukahlukene kanye nomphakeli i-AGS-TECH Inc. Ungasinika amapulani akho futhi singakwazi ukubumba ngomshini, amafa namathuluzi okukhiqiza izingxenye zakho. Siwakhiqiza ngokuwabumba, ukubunjwa, ukukhishwa, ukubumba, ukwakhiwa kweshidi-insimbi, ukunyathela, i-powder metallurgy, i-CNC machining, ukwakha. Singakuthumelela izingxenye nezingxenye noma senze ukuhlanganisa, ukwakhiwa kanye nokusebenza okuphelele kokukhiqiza ezikhungweni zethu. Imisebenzi yethu yokuhlanganisa ihlanganisa imikhiqizo yemishini, i-optical, i-electronic, i-fiber optic. Senza imisebenzi yokujoyina sisebenzisa izinsimbi, i-welding, i-brazing, i-soldering, i-adhesive bonding nokunye. Izinqubo zethu zokubumba ezezinhlobonhlobo zepulasitiki, irabha, i-ceramic, ingilazi, i-powder metallurgy materials. Kanjalo nokusakazwa kwethu, ukusetshenzwa kwe-CNC, ukubumba, ukwakhiwa kweshidi lensimbi, ucingo kanye nezinqubo zokwenza intwasahlobo ezibandakanya izinsimbi, ama-alloys, ipulasitiki, i-ceramic. Sinikeza imisebenzi yokugcina yokuqedela efana nama-coatings & ifilimu elizacile neliwugqinsi, ukugaya, ukugoqa, ukupholisha nokunye. Amakhono ethu okukhiqiza adlulela ngale kokuhlanganiswa kwemishini. Senza izingxenye zikagesi ze-elekthronikhi & ama-assemblies & PCB & PCBA & izintambo zokubopha, i-optical & fibre optic components & ne-assembly ngokuya ngemidwebo yakho yobuchwepheshe, i-BOM, amafayela e-Gerber. Amasu ahlukahlukene wokukhiqiza we-PCB kanye ne-PCBA afaka i-reflow soldering ne-wave soldering ngaphandle kwamanye ayasetshenziswa. Singochwepheshe ekuxhumekeni okunembayo, ukuhlanganisa, ukuhlanganisa nokubeka uphawu kwamaphakheji nemikhiqizo ye-hermetic electronic kanye ne-fiber optical. Ngaphandle komhlangano wemishini ongenzi lutho futhi osebenzayo, sisebenzisa ngokunenzuzo izinto ezikhethekile zokubhuqa kanye ne-soldering namasu okukhiqiza imikhiqizo ethobela i-Telcordia namanye amazinga embonini. Asikhawulelwe ekukhiqizeni nasekukhiqizeni umthamo omkhulu. Cishe yonke iphrojekthi iqala ngesidingo sobunjiniyela, ubunjiniyela obuhlehlayo, ucwaningo nokuthuthukiswa, ukuthuthukiswa komkhiqizo, ukukhiqiza okungeziwe nokusheshayo, i-prototyping. Njengomkhiqizi ngokwezifiso womhlaba wonke ohluke kakhulu emhlabeni, umdidiyeli wobunjiniyela, umdidiyeli, uzakwethu okhipha imisebenzi ngaphandle, siyakwamukela ngisho noma unemibono kuphela. Sikuthatha lapho futhi sikusize kuzo zonke izigaba zomjikelezo oyimpumelelo wokuthuthukiswa komkhiqizo nowokukhiqiza. Kungakhathaliseki ukuthi ukwakhiwa kweshidi lensimbi okusheshayo, ukukhanda isikhunta ngokushesha nokubumba, ukusakaza okusheshayo, ukuhlanganiswa okusheshayo kwe-PCB ne-PCBA noma-ke noma iyiphi indlela yokwenza i-prototyping esheshayo isemsebenzini wakho. Sikunikeza ungekho eshalofini kanye nezinto zokusebenza ezenziwe ngokwezifiso ze-metrology njengezihloli zokuqina, ama-microscopes ensimbi, imitshina yephutha ye-ultrasonic; amakhompyutha ezimboni, amasistimu ashumekiwe, i-automation & panel PC, amakhompyutha ebhodi elilodwa kanye nemishini yokulawula ikhwalithi esetshenziswa kakhulu ezindaweni zokukhiqiza nezimboni. Ngokukunikeza okokusebenza kwesimanjemanje kwe-metrology kanye nezingxenye zekhompuyutha yezimboni sigcwalisa izidingo zakho njengomkhiqizi womthombo owodwa kanye nomphakeli lapho ungathola khona konke okudingayo. Ngaphandle kwenqwaba yezinsizakalo zobunjiniyela, ngeke sihluke kuneningi labanye abakhiqizi nabathengisi abanekhono elilinganiselwe lokukhiqiza ngokwezifiso kanye nokuhlanganisa abakhona emakethe. Ubude bezinsizakalo zethu zobunjiniyela buyasihlukanisa njengomkhiqizi wangokwezifiso ohluke kakhulu emhlabeni, umkhiqizi wenkontileka, umdidiyeli wobunjiniyela, umdidiyeli kanye nozakwethu okhipha umsebenzi. Izinsizakalo zobunjiniyela zinganikezwa njengezodwa noma njengengxenye yomkhiqizo omusha noma ukuthuthukiswa kwenqubo, noma njengengxenye yomkhiqizo okhona noma ukuthuthukiswa kwenqubo noma njenganoma yini enye efika engqondweni yakho. Siyavumelana nezimo futhi izinsiza zethu zobunjiniyela zingathatha ifomu elifanelana kangcono nezidingo zakho kanye nezidingo zakho. Okulethwayo nokuphumayo kwezinsizakalo zethu zobunjiniyela kunqunyelwe umcabango wakho kuphela futhi kungathatha noma iyiphi indlela evumelana nawe. Izinhlobo ezivame kakhulu zokuphuma ezinsizeni zethu zobunjiniyela yilezi: Imibiko yokubonisana, amaphepha okuhlola nemibiko, imibiko yokuhlola, amapulani, imidwebo yobunjiniyela, imidwebo ehlanganisayo, uhlu lwezinto ezibonakalayo, amashidi, okokulingisa, izinhlelo zesofthiwe, ihluzo namashadi, okukhishwayo okuvela kokhethekile. i-optical, thermal noma ezinye izinhlelo zesofthiwe, amasampula nama-prototypes, amamodeli, imiboniso…..etc. Izinsizakalo zethu zobunjiniyela zingalethwa ngesiginesha noma amasignesha ambalwa onjiniyela abangochwepheshe abaqinisekisiwe esifundeni sakho. Kwesinye isikhathi kungadingeka onjiniyela abaningi abavela emikhakheni eyahlukene ukuthi basayine umsebenzi. Ukukhipha izinsiza zobunjiniyela kithi kungakunikeza izinzuzo eziningi ezinjengokonga izindleko ngokuqasha unjiniyela noma onjiniyela besikhathi esigcwele, ukuthola ngokushesha unjiniyela onguchwepheshe ukuthi akunikeze isikhathi esibekiwe kanye nesabelomali sakho kunokuba ufune ukuqasha oyedwa, okukunikeza amandla okuyeka. iphrojekthi ngokushesha uma kwenzeka ubona ukuthi ayinakwenzeka (lokhu kubiza kakhulu uma kwenzeka uqasha futhi udiliza onjiniyela bakho), ngokushesha ukwazi ukushintsha onjiniyela abavela emikhakheni eyahlukene nezizinda ezikunikeza amandla okushintsha noma nini futhi isigaba samaphrojekthi akho…..njll. Ziningi ezinye izinzuzo zokukhipha izinsiza zobunjiniyela ngaphezu kokukhiqiza nokuhlanganisa ngokwezifiso. Kule ngosi sizogxila ekukhiqizeni ngokwezifiso, ukukhiqizwa kwezinkontileka, ukuhlanganisa, ukuhlanganiswa, ukuhlanganiswa kanye nokukhishwa kwemikhiqizo. Uma uhlangothi lobunjiniyela lwebhizinisi lethu lunentshisekelo enkulu kuwe, ungathola imininingwane enemininingwane mayelana nezinsiza zethu zobunjiniyela ngokuvakashela http://www.ags-engineering.com Siyi-AGS-TECH Inc., umthombo wakho wokuma okukodwa wokukhiqiza nokwakha nobunjiniyela nokukhishwa kwemisebenzi nokuhlanganisa. Singabadidiyeli bonjiniyela abahluke kakhulu emhlabeni esikunikeza ukwenziwa ngokwezifiso, i-subassembly, ukuhlanganiswa kwemikhiqizo kanye nezinsizakalo zobunjiniyela. Contact Us First Name Last Name Email Write a message Submit Thanks for submitting!

Electronic Components, Diodes, Transistors - Resistors, Thermoelectric Cooler, Heating Elements, Capacitors, Inductors, Driver, Device Sockets and Adapters Izingxenye zikagesi neze-elekthronikhi nama-Assemblies Njengomkhiqizi wangokwezifiso kanye nesihlanganisi sobunjiniyela, i-AGS-TECH ingakunikeza okulandelayo ELECTRONIC COMPONENTS kanye nama-ASSEMBLIES: • Izingxenye ze-elekthronikhi ezisebenzayo nezingenzi lutho, izisetshenziswa, ama-subassemblies kanye nemikhiqizo eqediwe. Singasebenzisa izingxenye ze-elekthronikhi kumakhathalogi nezincwajana zethu ezibalwe ngezansi noma sisebenzise izingxenye zabakhiqizi ozincamelayo ekuhlanganiseni kwakho imikhiqizo ye-elekthronikhi. Ezinye zezingxenye ze-elekthronikhi kanye nokuhlangana kungenziwa ngokwezifiso ngokwezidingo zakho kanye nezidingo zakho. Uma inani le-oda lakho lifaneleka, singaba nemboni yokukhiqiza ikhiqize ngokuya ngemininingwane yakho. Ungaskrolela phansi bese ulanda izincwajana zethu ozithakaselayo ngokuchofoza umbhalo ogqanyisiwe: Izingxenye ze-off-shelf interconnect kanye ne-hardware I-Terminal Blocks kanye Nezixhumi Ikhathalogi Ejwayelekile Yezibhulokhi Zetheminali Ikhathalogi Yezixhumi-Amandla Okungena-Izixhumi Ama-chip resistors Umugqa womkhiqizo we-chip resistors Ama-Varistors Uhlolojikelele lomkhiqizo we-Varistors Ama-Diodes nama-rectifiers Amadivayisi e-RF kanye nama-inductors amafrikhwensi aphezulu Ishadi Lokubukezwa Komkhiqizo we-RF Umugqa womkhiqizo wamadivayisi wemvamisa ephezulu 5G - LTE 4G - LPWA 3G - 2G - GPS - GNSS - WLAN - BT - Combo - ISM Antenna-Brochure Ikhathalogi ye-MLCC yama-Cramic capacitors amaningi Multilayer Ceramic capacitors MLCC umkhiqizo line Ikhathalogi ye-Disc capacitors I-Zeasset Model Electrolytic Capacitors I-Yaren Model MOSFET - SCR - FRD - Amadivayisi Okulawula Amandla Kagesi - Ama-Bipolar Transistors Ama-Soft Ferrites - Ama-Cores - Ama-Toroids - Imikhiqizo Yokucindezela kwe-EMI - Ibhukwana le-RFID Transponders kanye Nezesekeli • Ezinye izingxenye ze-elekthronikhi nokuhlanganisa ebesikunikeza izinzwa zokucindezela, izinzwa zokushisa, izinzwa ze-conductivity, izinzwa eziseduze, izinzwa zomswakama, inzwa yesivinini, inzwa yokushaqeka, inzwa yamakhemikhali, inzwa yokuthambekela, iseli yomthwalo, amageji e-strain. Ukulanda amakhathalogi ahlobene nezincwajana zalokhu, sicela uchofoze umbhalo onemibala: Izinzwa zokucindezela, izikali zokucindezela, ama-transducer nama-transmitters I-Thermal Resistor Temperature Transducer UTC1 (-50~+600 C) I-Thermal Resistor Temperature Transducer UTC2 (-40~+200 C) I-Explosive Temperature Transmitter ye-UTB4 I-Integrated Temperature Transmitter UTB8 I-Smart Temperature Transmitter UTB-101 I-Din Rail Mounted Temperature Transmitters UTB11 I-Temperature Pressure Integration Transmitter UTB5 I-Digital Temperature Transmitter UTI2 Intelligent Temperature Transmitter UTI5 I-Digital Temperature Transmitter UTI6 I-Wireless Digital Temperature Gauge UTI7 I-Electronic Temperature Switch UTS2 Ama-Transmitter Wokushisa Wokushisa Layisha amaseli, izinzwa zesisindo, amageji omthwalo, ama-transducer nama-transmitters Isistimu yokufaka ikhodi yamageji e-off-shelf strain Ama-Strain Gauges Okuhlaziya Ingcindezi Izinzwa eziseduze Amasokhethi kanye nezinsiza zezinzwa eziseduze • Amadivayisi asuselwa ku-Chip level micrometer scale ama-Microelectromechanical Systems (MEMS) afana nama-micropump, ama-micromirror, ama-micromotor, ama-microfluidic device. • Izifunda Ezihlanganisiwe (IC) • Ukushintsha ama-elementi, shintsha, i-relay, i-contactor, i-circuit breaker Inkinobho yokucisha namaswishi ajikelezayo namabhokisi okulawula I-Sub-Miniature Power Relay ene-UL ne-CE Certification JQC-3F100111-1153132 I-Miniature Power Relay ene-UL ne-CE Certification JQX-10F100111-1153432 I-Miniature Power Relay ene-UL kanye nezitifiketi ze-CE JQX-13F100111-1154072 Ama-Miniature Circuit Breakers ane-UL kanye ne-CE Certification NB1100111-1114242 I-Miniature Power Relay ene-UL kanye ne-CE Certification JTX100111-1155122 I-Miniature Power Relay ene-UL kanye ne-CE Certification MK100111-1155402 I-Miniature Power Relay ene-UL ne-CE Certification NJX-13FW100111-1152352 I-Electronic Overload Relay ene-UL kanye ne-CE Certification NRE8100111-1143132 I-Thermal Overload Relay ene-UL ne-CE Certification NR2100111-1144062 Oxhumana nabo abane-UL kanye ne-CE Certification NC1100111-1042532 Oxhumana nabo abane-UL kanye ne-CE Certification NC2100111-1044422 Oxhumana nabo abane-UL kanye ne-CE Certifications NC6100111-1040002 Inhloso Eqinisekile Yokuxhumana Nezitifiketi ze-UL kanye ne-CE NCK3100111-1052422 • Amafeni kagesi nama-coolers azofakwa kumishini kagesi neyezimboni • Izinto zokushisisa, ama-thermoelectric coolers (TEC) Amasinki okushisa ajwayelekile Amasinki okushisa angeziwe Amasinki okushisa Amandla Amandla Amandla aphezulu amasistimu kagesi anamandla aphakathi nendawo Amasinki okushisa aneSuper Fins I-Easy Click heat sinks Super cooling plate Amapuleti okupholisa angenamanzi • Sinikezela nge-Electronic Enclosures ukuze sivikele izingxenye zakho ze-elekthronikhi nokuhlanganisa. Ngaphandle kwalezi zindawo ezivalekile zikagesi ezingaphandle kweshalofu, senza isikhunta somjovo wangokwezifiso kanye nezibiyelo zikagesi ze-thermoform ezilingana nemidwebo yakho yobuchwepheshe. Sicela ulande kuzixhumanisi ezingezansi. 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