I-Laser Machining & Cutting & LBM

I-Laser cutting_cc781905-5cde-3194-BB3B-136Bad5cf58d_is a_cc7819-BB3BB-13644-BB3BB89-BB3B8D_TECHNOLOGY_CCEDE In LASER BEAM MACHINING (LBM), umthombo we-laser ugxilisa amandla okubona phezu kwendawo yokusebenza. Ukusika i-laser kuqondisa ukuphuma okugxile kakhulu kanye nokuminyana okuphezulu kwe-laser enamandla amakhulu, ngekhompyutha, ezintweni ezizosikwa. Izinto eziqondiwe zizobe sezincibilika, zishise, zihwamuke, noma zishaywe umoya yindiza yegesi, ngendlela elawulwayo eshiya unqenqema olunomphetho wekhwalithi ephezulu. Abasiki bethu be-laser basezimbonini bafanele ukusika izinto ezinamashidi ayisicaba kanye nezakhiwo namapayipi, izinto zokusebenza eziyinsimbi nezingezona ezensimbi. Ngokuvamile akukho vacuum edingekayo ku-laser beam machining kanye nezinqubo zokusika. Kunezinhlobo eziningana zama-lasers asetshenziswa ekusikeni nasekukhiqizeni i-laser. Igagasi elishayayo noma eliqhubekayo CO2 LASER ifanele ukusika, ukubhora, nokuqopha. The NEODYMIUM (Nd) and neodymium yttrium-aluminum-garnet (Nd-YAG) LASERS are identical ngesitayela futhi ziyehluka ngokusetshenziswa kuphela. I-neodymium Nd isetshenziselwa isicefe nalapho amandla aphezulu kodwa ukuphindaphinda okuphansi kuyadingeka. I-laser ye-Nd-YAG ngakolunye uhlangothi isetshenziswa lapho kudingeka khona amandla aphezulu kakhulu kanye nokubhora nokuqopha. Kokubili amalaser e-CO2 kanye ne-Nd/ Nd-YAG angasetshenziselwa LASER WELDING. Amanye amalaser esiwasebenzisa ekukhiqizeni ahlanganisa Nd:GLASS, RUBY kanye ne-EXCIMER. Ku-Laser Beam Machining (LBM), amapharamitha alandelayo abalulekile: I-reflection kanye ne-thermal conductivity yendawo yokusebenza kanye nokushisa kwayo okuqondile nokushisa okucashile kokuncibilika nokuhwamuka. Ukusebenza kahle kwenqubo ye-Laser Beam Machining (LBM) kuyanda ngokuncipha kwala mapharamitha. Ukujula kokusika kungavezwa kanje:

 

t ~ P / (vxd)

 

Lokhu kusho ukuthi, ukujula kokusika “t” kuhambisana nokokufaka kwamandla P futhi kuhambisana ngokuphambene nesivinini sokusika v kanye nobubanzi bendawo ye-laser-beam d. Ingaphezulu elikhiqizwe nge-LBM livamise ukuba lukhuni futhi linendawo ethinteke ukushisa.

 

 

 

I-CARBONDIOXIDE (CO2) LASER CUTTING AND MACHINING: Amalaser e-DC-ejabulile e-CO2 ampontshwa ngokudlula i-current kumxube wegesi kanti ama-laser e-CO2 anesasasa le-RF asebenzisa amandla efrikhwensi yomsakazo ukuze ajabule. Indlela ye-RF yintsha uma kuqhathaniswa futhi isidume kakhulu. Imiklamo ye-DC idinga ama-electrode ngaphakathi komgodi, ngakho-ke ingaba nokuguguleka kwe-electrode nokucwecwa kwezinto ze-electrode kuma-optics. Ngokuphambene nalokho, ama-resonator e-RF anama-electrode angaphandle ngakho-ke awathambekele kulezo zinkinga. Sisebenzisa amalaser e-CO2 ekusikeni kwezimboni izinto eziningi ezifana nensimbi emnene, i-aluminium, insimbi engagqwali, i-titanium namapulasitiki.

 

 

 

YAG LASER CUTTING and MACHINI: Sisebenzisa amalaser e-YAG ukusika nokubhala izinsimbi nezinsimbi zobumba. Ijeneretha ye-laser nama-optics angaphandle adinga ukupholisa. Ukushisa kwemfucuza kukhiqizwa futhi kudluliselwe ngesipholisi noma ngokuqondile emoyeni. Amanzi ayisipholisi esivamile, ngokuvamile asakazwa nge-chiller noma isistimu yokudlulisa ukushisa.

 

 

 

I-EXCIMER LASER CUTTING AND MACHINING: I-excimer laser iwuhlobo lwe-laser enamaza obude endaweni ye-ultraviolet. Ubude begagasi obuqondile buncike kuma-molecule asetshenzisiwe. Isibonelo amaza amaza alandelayo ahlotshaniswa nama-molecule aboniswe kuma-parantheses: 193 nm (ArF), 248 nm (KrF), 308 nm (XeCl), 353 nm (XeF). Amanye ama-laser e-excimer ayakwazi ukushutheka. Ama-laser e-Excimer anendawo ekhangayo angasusa izingqimba ezinhle kakhulu zezinto ezingaphezulu ngokucishe kungabikho ukushisisa noma uguquko kokusele kwento. Ngakho-ke ama-laser e-excimer afaneleka kahle ukunemba kwe-micromachining yezinto eziphilayo njengama-polymers namapulasitiki.

 

 

 

UKUSIKWA ILASER OKUSIZWA NGEGASI: Kwesinye isikhathi sisebenzisa imishayo ye-laser sihlanganiswe nomfudlana wegesi, njengomoya-mpilo, i-nitrogen noma i-argon ukusika izinto zeshidi elincanyana. Lokhu kwenziwa kusetshenziswa i-a LASER-BEAM TORCH. Ngensimbi engagqwali ne-aluminium sisebenzisa ukusika kwe-laser okunomfutho ophezulu we-inert-gas sisebenzisa i-nitrogen. Lokhu kuphumela emaphethelweni angenayo i-oxide ukuthuthukisa ukushisela. Le mifudlana yegesi iphinde ikhiphe izinto ezincibilikisiwe nezishisiwe ezindaweni zokusebenza.

 

 

 

Ku-a LASER MICROJET CUTTING sinelaser eqondiswa yijethi yamanzi lapho i-pured water jet ibe yi-laser ecindezelwe ephansi. Siyisebenzisela ukusika i-laser ngenkathi sisebenzisa indiza yamanzi ukuze siqondise i-laser beam, efana ne-optical fiber. Izinzuzo ze-laser microjet ukuthi amanzi aphinde asuse udoti futhi apholise impahla, ayashesha ukwedlula ukusika kwe-laser kwendabuko ''yomile'' ngesivinini sokudayela esiphezulu, i-parallel kerf kanye nekhono lokusika i-omnidirectional.

 

 

 

Sisebenzisa izindlela ezahlukahlukene zokusika sisebenzisa ama-laser. Ezinye zezindlela zifaka umhwamuko, ukuncibilika nokushaywa, ukuncibilika nokusha, ukuqhekeka kokucindezeleka okushisayo, ukubhala, ukusika nokushiswa okubandayo, ukusika kwe-laser okuzinzile.

 

- Ukusika kwe-vaporization: I-beam egxilile ishisa ingaphezulu lezinto ezibonakalayo endaweni yayo yokubila futhi idale imbobo. Umgodi uholela ekwandeni okungazelelwe kokumuncwa futhi ujule ngokushesha umgodi. Njengoba imbobo ijula futhi izinto zibila, umhwamuko okhiqiziwe uguguleka izindonga ezincibilikisiwe eziphephetha izinto bese ukhulisa imbobo. Izinto ezingancibiliki ezifana nokhuni, ikhabhoni kanye namapulasitiki e-thermoset ngokuvamile asikwa ngale ndlela.

 

- Ukuncibilikisa nokusika: Sisebenzisa igesi enomfutho ophezulu ukufutha izinto ezincibilikisiwe endaweni yokusika, sinciphisa amandla adingekayo. Impahla ishiselwa ifike endaweni yayo yokuncibilika bese ijethi yegesi iphephetha incibilikisiwe iphume ku-kerf. Lokhu kuqeda isidingo sokukhuphula izinga lokushisa lezinto ngokuqhubekayo. Sisika izinsimbi ngale nqubo.

 

- Ukuqhekeka kokucindezeleka okushisayo: Izinto ezinqamulayo ziyazwela ekuqhekekeni okushisayo. I-beam igxile endaweni ebangela ukushisa kwendawo kanye nokwanda kokushisa. Lokhu kubangela ukuqhekeka okungabe sekuholwa ngokuhambisa ugongolo. Sisebenzisa le nqubo ekusikeni ingilazi.

 

- Ukudayela okuyimfihlo kwama-silicon wafers: Ukuhlukaniswa kwama-microelectronic chips kuma-silicon wafers kwenziwa inqubo yokudayela eyimfihlo, kusetshenziswa i-pulsed Nd:YAG laser, ubude begagasi obungu-1064 nm bumukelwa kahle kugebe le-electronic band ye-silicon (1.11 eV noma i-eV noma i-silicon) 1117 nm). Lokhu kudumile ekwenziweni kwedivayisi ye-semiconductor.

 

- Ukusika okusebenzayo: Okuphinde kubizwe ngokuthi ukusika kwe-flame, le nqubo ingase ifane nokusika ithoshi ye-oxygen kodwa nge-laser beam njengomthombo wokuthungela. Sisebenzisa lokhu ukusika insimbi ye-carbon ngogqinsi olungaphezu kuka-1 mm ngisho namapuleti ensimbi awugqinsi ngamandla anamandla amancane e-laser.

 

 

 

I-PULSED LASERS isinikeze ukuqhuma kwamandla aphezulu isikhathi esifushane futhi iphumelela kakhulu kwezinye izinqubo zokusika i-laser, njengokubhoboza, noma lapho kudingeka izimbobo ezincane kakhulu noma isivinini esiphansi kakhulu sokusika. Uma esikhundleni salokho kusetshenziswa i-laser beam engashintshi, ukushisa kwakungase kufinyelele eqophelweni lokuncibilikisa lonke ucezu okwenziwa ngomshini. Ama-laser ethu anekhono lokushaya noma lokusika i-CW (Igagasi Eliqhubekayo) ngaphansi kokulawulwa kohlelo lwe-NC (ukulawula izinombolo). Sisebenzisa DOUBLE PULSE LASERS emitting uchungechunge lwamapulse pair ukuthuthukisa izinga lokususwa kwempahla kanye nembobo. I-pulse yokuqala isusa okokusebenza phezulu bese kuthi ishayela lesibili livimbele into ekhishiwe ekufundeni iye eceleni kwembobo noma ukusikwa.

 

 

 

Ukubekezelela nokuqedwa kwe-surface ekusikeni kwe-laser nokwenza imishini kuvelele. Abasiki bethu besimanje be-laser banokunemba kokuma endaweni engama-micrometer ayi-10 nokuphindaphinda ama-micrometer angu-5. Ama-roughnesses ajwayelekile Rz akhuphuka ngogqinsi lweshidi, kodwa ancipha ngamandla e-laser nesivinini sokusika. Ukusika kwe-laser kanye nezinqubo zomshini ziyakwazi ukuzuza ukubekezelelana okuseduze, ngokuvamile ukuya phakathi kwe-intshi engu-0.001 (0.025 mm) Ingxenye yejometri kanye nezici zemishini zemishini yethu ziyathuthukiswa ukuze kuzuzwe amandla okubekezelela angcono kakhulu. Ukuqedwa okungaphezulu esingakuthola ekusikeni kwe-laser beam kungase kube phakathi kuka-0.003 mm kuya ku-0.006 mm. Ngokuvamile sifinyelela kalula izimbobo ezinobubanzi obungu-0.025 mm, futhi izimbobo ezincane njengo-0.005 mm kanye nezilinganiso zokujula komgodi ukuya kububanzi obungu-50 kuya ku-1 ziye zakhiqizwa ngezinto ezihlukahlukene. Abasiki be-laser bethu abalula nabajwayelekile bazosika insimbi yensimbi ye-carbon isuka ku-0.020–0.5 intshi (0.51–13 mm) ngogqinsi futhi ingashesha ngokuphindwe izikhathi ezingamashumi amathathu kunokusaha okujwayelekile.

 

 

 

Imishini ye-laser-beam isetshenziswa kabanzi ukubhola nokusika izinsimbi, izinto ezingezona ezensimbi nezinto eziyinhlanganisela. Izinzuzo zokusika nge-laser ngaphezu kokusika ngomshini zihlanganisa ukubamba okulula kokusebenza, ukuhlanzeka kanye nokuncipha kokungcoliswa kwengcezu yokusebenza (njengoba kungekho onqenqemeni lokusika njengasekugayweni kwendabuko noma ukuphenduka okungangcoliswa yimpahla noma kungcolise impahla, okungukuthi i-bue build-up). Imvelo yokuhuzuka kwezinto eziyinhlanganisela ingase ikwenze kube nzima ukumshini ngezindlela ezivamile kodwa kube lula ngomshini we-laser. Ngenxa yokuthi i-laser beam ayigqoki ngesikhathi senqubo, ukunemba okutholiwe kungase kube ngcono. Ngenxa yokuthi amasistimu e-laser anendawo encane ethinteke ekushiseni, kuphinde kube nethuba elincane lokusonta okokusebenza okusikwayo. Kwezinye izinto zokusika laser kungaba ukuphela kwendlela. Izinqubo zokusika i-laser-beam ziyavumelana nezimo, futhi ukulethwa kwe-fiber optic beam, ukulungiswa okulula, izikhathi zokusetha ezifushane, ukutholakala kwezinhlelo ze-CNC ezinobukhulu obuthathu kwenza kube nokwenzeka ukusika kwe-laser nomshini ukuncintisana ngempumelelo nezinye izinqubo zokwenziwa kwensimbi yeshidi njengokubhoboza. Lokhu kushiwo, ubuchwepheshe be-laser kwesinye isikhathi bungahlanganiswa nobuchwepheshe bokwenza imishini ukuze kuthuthukiswe ukusebenza kahle okuphelele.

 

 

 

Ukusika i-laser yezinsimbi zeshidi kunezinzuzo ngaphezu kokusikwa kwe-plasma yokunemba kakhudlwana nokusebenzisa amandla amancane, nokho, amalaser amaningi ezimboni awakwazi ukunqamula ukushuba okukhulu kwensimbi okungatholakala yi-plasma. Amalaza asebenza ngamandla aphakeme njengama-Watts angu-6000 asondela emishinini ye-plasma ekwazini kwawo ukusika izinto eziwugqinsi. Kodwa-ke izindleko ezinkulu zalaba basiki be-laser abangama-6000 Watt ziphakeme kakhulu kunemishini yokusika i-plasma ekwazi ukusika izinto eziwugqinsi njengepuleti lensimbi.

 

 

 

Kukhona futhi nebubi ukusika laser kanye machining. Ukusika i-laser kuhilela ukusetshenziswa kwamandla aphezulu. Ukusebenza kahle kwe-laser yezimboni kungase kusuke ku-5% kuye ku-15%. Ukusetshenziswa kwamandla nokusebenza kahle kwanoma iyiphi i-laser kuzohluka kuye ngamandla okukhiphayo kanye nemingcele yokusebenza. Lokhu kuzoncika ohlotsheni lwe-laser nokuthi i-laser ifanelana kahle kanjani nomsebenzi okhona. Inani lamandla okusika nge-laser adingekayo emsebenzini othile lincike ohlotsheni lwempahla, ukujiya, inqubo (esebenzayo/inert) esetshenzisiwe kanye nezinga lokusika elifunekayo. Izinga eliphezulu lokukhiqiza ekusikeni kwe-laser kanye nokwenza imishini linqunyelwe izinto eziningi ezihlanganisa amandla e-laser, uhlobo lwenqubo (noma ngabe iyasebenza noma i-inert), izakhiwo zezinto ezibonakalayo nokuqina.

 

 

 

In LASER ABLATION sisusa izinto endaweni eqinile ngokuyikhanyisa nge-laser beam. Ekuguquguqukeni kwe-laser ephansi, okokusebenza kushisiswa amandla e-laser amuncwa bese kuyahwamuka noma kunciphe. Lapho i-laser flux ephezulu, izinto ezibonakalayo ziguqulwa zibe i-plasma. Amalaser anamandla aphezulu ahlanza indawo enkulu nge-pulse eyodwa. Ama-laser amandla aphansi asebenzisa ama-pulse amancane amaningi angase askenwe endaweni yonke. Ku-laser ablation sisusa okokusebenza nge-laser pulsed noma nge-laser wave beam eqhubekayo uma ukuqina kwe-laser kuphezulu ngokwanele. Ama-laser ane-pulsed angabhoboza izimbobo ezincane kakhulu, ezijulile ngokusebenzisa izinto eziqinile kakhulu. Ama-laser pulse amafushane kakhulu asusa izinto ngokushesha kangangokuthi izinto ezizungezile zimunca ukushisa okuncane kakhulu, ngakho-ke ukubhola nge-laser kungenziwa ezintweni ezithambile noma ezingezwani nokushisa. Amandla e-laser angamuncwa ngokukhetha ama-coatings, ngakho-ke ama-laser e-CO2 kanye ne-Nd:YAG angasetshenziswa ukuhlanza izindawo, ukususa upende nokunamathisela, noma ukulungisa izindawo zokudweba ngaphandle kokulimaza indawo engaphansi.

 

 

 

We use LASER ENGRAVING and LASER MARKING to engrave or mark an object. Lezi zindlela ezimbili empeleni ziyizinhlelo zokusebenza ezisetshenziswa kakhulu. Awekho oyinki abasetshenziswayo, futhi akubandakanyi izingcezu zamathuluzi ezithinta indawo eqoshiwe futhi ziguge okuyinto enjalo nezindlela zomdabu zokuqopha nezindlela zokumaka. Izinto eziklanyelwe ngokukhethekile ukuqoshwa kwe-laser nokumaka zihlanganisa ama-polymer azwela nge-laser kanye nama-alloys ensimbi amasha akhethekile. Yize imishini yokumaka nokuqopha nge-laser ibiza kakhulu uma iqhathaniswa nezinye izindlela ezifana nezingqimba, izikhonkwane, isitayela, izitembu zokuqopha….njll., isidume kakhulu ngenxa yokunemba kwayo, ukuphindaphindeka kwayo, ukuguquguquka, ukusebenziseka kalula nokusetshenziswa kwe-inthanethi. ezindaweni ezehlukene zokukhiqiza.

 

 

 

Ekugcineni, sisebenzisa imishayo ye-laser kweminye imisebenzi eminingi yokukhiqiza:

 

- LASER WELDING

 

- LASER UKWELASHWA OKUSHISA: Ukuphathwa kokushisa okuncane kwezinsimbi nezinsimbi zobumba ukuze kulungiswe indawo yazo engaphezulu yemishini ne-tribological.

 

- LASER UKWELASHWA KWE-SURFACE / MODIFICATION: Ama-laser asetshenziselwa ukuhlanza izindawo, ukwethula amaqembu asebenzayo, ukuguqula izindawo ngomzamo wokuthuthukisa ukunamathela ngaphambi kokufakwa kokumboza noma izinqubo zokuhlanganisa.